JP5408564B2 - 非晶質基材 - Google Patents
非晶質基材 Download PDFInfo
- Publication number
- JP5408564B2 JP5408564B2 JP2008214300A JP2008214300A JP5408564B2 JP 5408564 B2 JP5408564 B2 JP 5408564B2 JP 2008214300 A JP2008214300 A JP 2008214300A JP 2008214300 A JP2008214300 A JP 2008214300A JP 5408564 B2 JP5408564 B2 JP 5408564B2
- Authority
- JP
- Japan
- Prior art keywords
- zinc oxide
- thin film
- zinc
- crystal
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 title claims description 44
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 226
- 239000011787 zinc oxide Substances 0.000 claims description 113
- 239000010409 thin film Substances 0.000 claims description 56
- 239000013078 crystal Substances 0.000 claims description 42
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 38
- 229910052725 zinc Inorganic materials 0.000 claims description 37
- 239000011701 zinc Substances 0.000 claims description 37
- 239000011521 glass Substances 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 8
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 238000001947 vapour-phase growth Methods 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 239000012808 vapor phase Substances 0.000 claims description 3
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 2
- 239000006104 solid solution Substances 0.000 description 16
- 239000004566 building material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000006911 nucleation Effects 0.000 description 6
- 238000010899 nucleation Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 239000000370 acceptor Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004549 pulsed laser deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000001420 photoelectron spectroscopy Methods 0.000 description 3
- 230000005469 synchrotron radiation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical group [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052798 chalcogen Inorganic materials 0.000 description 1
- 150000001787 chalcogens Chemical class 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001657 homoepitaxy Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000004969 ion scattering spectroscopy Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000000475 sunscreen effect Effects 0.000 description 1
- 239000000516 sunscreening agent Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Recrystallisation Techniques (AREA)
Description
なお、単結晶酸化亜鉛表面とアクセプターとなる窒素との反応性を調べた結果、より効率よく窒素を取り込ませるためには、酸素表面を有する結晶面である(000−1)面ではなく、亜鉛表面を有する(0001)面から取り込ませることが有効であることが、(非特許文献3)に示され知られていることから類推すると、本発明の有用性は容易に理解しえる。
ガラス基板の組成としては、下記するAl等の添加物が高濃度に析出する温度で溶融・反応しない組成であれば良い。以下の実施例では溶融石英基板とサファイヤ基板での結果を示したが、カルコゲンガラスや有機物系などは融点や反応性の点から適用が難しいと考えられるものを除いたものであれば、あえて排除する理由はない。なお、ケイ酸塩系がもっとも一般的なものである。
このような考察からすれば、酸化亜鉛にガリウムやインジウムを添加した場合にも同様な現象が発現され、自発的に亜鉛表面を持った酸化亜鉛の核生成が起こると推察される。
この無添加の酸化亜鉛による膜も、その表面が亜鉛極性の(0001)面であることは、光子エネルギーが6KeVの放射光を用いた硬X線光電子分光による解析により確認できる(図4)。この表面に、さらにショットキー電極と、(特許文献3)に示すようなインジウムオーミック電極を形成する。すると、図6の様な、透明電極層を下部電極として用いたショットキーダイオードが得られる。ここでは、パルスレーザー蒸着を用いた結晶成長を行うことで本発明を実施する例を示したが、この結晶成長手段をはじめ、本実施例の示すところは、あくまで例であって、本発明の適用範囲を限定するものではない。
〔比較例1〕
Claims (1)
- 不純物添加した酸化亜鉛基薄膜層を有する非晶質基材であって、
前記不純物添加した酸化亜鉛基薄膜層は、ガラス基板上にパルスレーザー蒸着法、分子線エピタキシー法又は気相から原料を供給する気相成長法により成長された酸化亜鉛に不純物が添加された薄膜層であり、
前記不純物が、アルミニウム、ガリウム又はインジウムのいずれかであり、
前記不純物添加した酸化亜鉛基薄膜層がウルツ鉱型の結晶構造を有し、かつ、
その表面が酸素面ではなく、亜鉛面となる亜鉛極性の(0001)面であることを特徴とする非晶質基材。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008214300A JP5408564B2 (ja) | 2008-08-22 | 2008-08-22 | 非晶質基材 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008214300A JP5408564B2 (ja) | 2008-08-22 | 2008-08-22 | 非晶質基材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010050342A JP2010050342A (ja) | 2010-03-04 |
| JP5408564B2 true JP5408564B2 (ja) | 2014-02-05 |
Family
ID=42067183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008214300A Expired - Fee Related JP5408564B2 (ja) | 2008-08-22 | 2008-08-22 | 非晶質基材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5408564B2 (ja) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09255491A (ja) * | 1995-12-30 | 1997-09-30 | Samsung Display Devices Co Ltd | 多結晶酸化薄膜の酸素最密充填面を用いたZnO薄膜電極構造体及びその製造方法 |
| JP4185797B2 (ja) * | 2003-03-25 | 2008-11-26 | シャープ株式会社 | 酸化物半導体発光素子およびその製造方法 |
| JP2005056940A (ja) * | 2003-08-07 | 2005-03-03 | Tdk Corp | 電子デバイス用基板、電子デバイスおよびそれらの製造方法 |
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2008
- 2008-08-22 JP JP2008214300A patent/JP5408564B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010050342A (ja) | 2010-03-04 |
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