JP5407819B2 - Organic electroluminescence display and manufacturing method thereof - Google Patents

Description

The present invention relates to an organic electroluminescence display (hereinafter abbreviated as an organic EL display) and a method for manufacturing the same.

An organic EL display, which is one of flat panel displays, is composed of an organic EL element having a structure in which a plurality of organic light emitting medium layers including an organic light emitting layer are sandwiched between an anode layer and a cathode layer. Occur. Examples of the organic light emitting medium layer include a hole transport layer, a hole injection layer, an electron injection layer, and an electron transport layer in addition to the organic light emitting layer. Since the organic EL element is a self-luminous type, it has the characteristics of high brightness, high viewing angle, and low voltage driving.

The cathode layer used in the organic EL element is formed of a metal or an alloy such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, Yb, MgAg, AlLi, or CuLi. Or the alloy is chemically unstable. When the cathode layer comes into contact with moisture and oxygen, it causes oxidation and corrosion. Oxidized and corroded places become non-light emitting parts called dark spots. This non-light-emitting portion grows quickly, so that the device life is shortened with a decrease in device brightness. The organic light emitting medium layer also tends to be altered by moisture and oxygen. Therefore, when putting an organic EL element into practical use, it is necessary to seal the entire organic EL element for the purpose of protecting the cathode layer and the organic light emitting medium layer from moisture and oxygen.

Conventionally, a sealing agent is used when sealing an organic EL element. Using a glass substrate, a metal can, a sealing member equipped with a desiccant, etc., UV curable or thermosetting resin is applied as a sealing agent to the outer periphery of these, and the organic EL element is a sealing agent. The organic EL element is sealed by positioning the glass substrate on which the organic EL laminate is formed and the sealing substrate so as to be sealed inside, and then curing the UV curable and thermosetting resin. To do. Patent Document 1 describes an organic EL element in which a desiccant-containing layer is formed on the inner surface of a sealing cap. However, when a desiccant is mounted on the inner surface of the sealing cap, the number of processes increases and the entire element becomes thick, which is not suitable for a top emission type organic EL element.

Therefore, in order to solve the problems of the conventional sealing method, it has been proposed to use frit glass as a sealant. Patent document 2 is an example. The frit glass is a low-melting glass, and the substrate of the organic EL element and the sealing member can be hermetically sealed by irradiating a laser beam from the surface of the glass substrate toward the frit glass and melt-bonding. it can.

However, when the organic EL element is sealed with frit glass, the width of the sealing layer is limited to the width of the laser beam, and generally the sealing strength of a sealing layer with a narrow laser beam width is insufficient. If the sealing strength is insufficient, there is little problem with a small organic EL display mounted on a mobile phone, a video camera, or the like. There is a problem that the impact resistance in the direction is weak, and a crack or peeling of the sealing layer is likely to occur due to an impact from the lateral direction during the production process.

JP 2001-35659 A JP 10-74583 A

Accordingly, in view of the above problems, the present invention is thin when sealing a substrate and a sealing substrate on which at least an anode layer, an organic light emitting medium layer including an organic light emitting layer, and a cathode layer are formed via frit glass, In addition, an object of the present invention is to provide a method for sealing an organic EL element having a good airtightness in which a sealing layer is hardly cracked and peeled off even when a large area substrate is subjected to an impact from the lateral direction.

As means for solving the above-mentioned problems, the invention according to claim 1 includes a substrate on which an organic EL element comprising at least an anode layer, an organic light emitting medium layer including an organic light emitting layer, and a cathode layer is formed, and a sealing substrate. An organic EL display having a thickness of a portion where the organic EL element is formed and a thickness provided at an outer edge portion of the substrate. A thin portion is provided, and a step is provided between the thick portion and the thin portion of the substrate , and the sealing substrate is fitted to correspond to the step of the substrate. The frit glass is formed in a portion where the thickness of the substrate is thin and a side where the step is in contact with the sealing substrate, and a portion where the thickness of the substrate is thick; In the portion where the sealing substrate comes into contact, a curable resin adhesive An organic EL display, wherein a Ranaru adhesive layer is formed.

The invention according to claim 2, organic EL according to claim 1, wherein the height of the step of the substrate is less than half the thickness of the thick portion of the above to the substrate 0.1mm It is a display.

The invention according to claim 3, wherein the curable resin adhesive is an organic EL display according to claim 1 or 2, characterized in that a thermosetting adhesive or an ultraviolet curable adhesive.

According to a fourth aspect of the present invention, a substrate on which an organic EL element composed of at least an anode layer, an organic light emitting medium layer including an organic light emitting layer, and a cathode layer is formed and a sealing substrate are sealed with frit glass. A step of forming a step on the outer periphery of the substrate, an anode layer, an organic light emitting medium layer including an organic light emitting layer, and a step of forming a cathode layer on the substrate, A step of forming a fitting portion to be fitted to the sealing substrate corresponding to the step of the substrate; and the frit at a portion where the sealing substrate is in contact with a portion where the thickness of the substrate is thin and a side surface of the step. A step of applying glass, a step of applying a curable resin adhesive to a portion where the sealing substrate is in contact with the thick portion of the substrate, and fitting the sealing substrate at the level difference of the substrate a step of, the curable resin adhesive A step of reduction is a method of manufacturing an organic EL display, characterized in that and a step of hot-melt adhesive and said sealing substrate and the substrate is irradiated with laser light to the frit glass.

According to the present invention, a step 61 is formed on the outer periphery of the substrate, the sealing substrate is fitted to the position of the step 61, and the organic EL display is sealed with frit glass, whereby the step of the substrate and the sealing substrate are sealed. Or the step of the substrate and the fitting portion of the sealing substrate are fitted, and the impact in the horizontal direction with respect to the screen acts on the substrate and the structure of the sealing substrate itself. Therefore, the impact acting on the sealing layer made of frit glass is reduced as compared with the conventional case, and sealing failure is less likely to occur, and a large area organic EL display can be sealed with frit glass.
Further, by providing the resin sealing layer inside the frit glass sealing layer, it is possible to provide a method for sealing an organic EL display having a large area, good confidentiality, and a long lifetime.
Further, by forming the sealing layer of frit glass at a step portion that is perpendicular to the screen, the impact resistance in the direction perpendicular to the screen can be increased.

It is a cross-sectional schematic diagram (a) and (b) which show one Example of the organic electroluminescent display of this invention. It is a cross-sectional schematic diagram (a) which shows the other Example of the organic EL display of this invention, (b). It is a cross-sectional schematic diagram (a) which shows the other Example of the organic EL display of this invention, (b). It is a cross-sectional schematic diagram (a) which shows the other Example of the organic EL display of this invention, (b). It is a cross-sectional schematic diagram which shows the board | substrate and sealing substrate which are used for the organic EL display of this invention. It is a cross-sectional schematic diagram which shows one form of the conventional organic EL display.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. The present invention is not limited to this.

The substrate and sealing substrate used in the organic EL display of the present invention are a combination of a substrate 11 having a step 61 and a sealing substrate 12 or a sealing substrate 13 having a step 66 as shown in FIG. Is formed by a combination of the substrate 14 having the end face and the sealing substrate 12 or the sealing substrate 13 having the fitting portion 66.
Although FIG. 5 shows only a cross-sectional view of the substrate and the sealing substrate, the step is formed along the outer periphery of the substrate and the sealing substrate. The substrate 11 having the step 61 or the substrate 14 having the joint portion at the end surface and the sealing substrate 13 having the sealing substrate 12 or the fitting portion 66 have the step 61 and the fitting portion 66 at the same height. , So as to be fitted to each other's joint or step.

By sealing with a combination of such a substrate and a sealing substrate, the step of the substrate and the sealing substrate, or the step of the substrate and the fitting portion of the sealing substrate fit, The impact in the horizontal direction acts on the substrate and the sealing substrate structure itself. Therefore, the impact acting on the sealing layer made of frit glass is reduced as compared with the conventional case, and sealing failure is less likely to occur.

In the organic EL display of the present invention, the substrate and the sealing substrate are bonded using a frit glass (low melting point glass) that is melted by heating, and the frit glass is formed at a portion where the substrate and the sealing substrate are joined. . Thereby, the space between the substrate and the sealing substrate becomes a sealed space surrounded by the frit glass, and the organic EL element can be sealed. As a heating method, if the entire substrate on which the organic EL element is formed is heated, the organic EL element may be deteriorated by heat. Therefore, a method of heating the portion where the frit glass is formed by irradiating a laser is preferable.

When heating with a laser, since the laser heats the frit glass through the substrate or the sealing substrate, at least one of the substrate or the sealing substrate needs to be transparent, and the frit glass has a position where the laser is irradiated. Need to be formed.

When sealing elements using frit glass, the hermeticity of sealing is excellent, but frit glass is prone to cracks due to residual stress at the sealing interface and variations in the thickness of the frit glass layer. There is a risk of sealing failure in sealing. In addition, an organic solvent for applying the frit glass or the like may generate gas or droplets due to heating to melt the frit glass, which may affect the organic EL element.

In the organic EL display of the present invention, a sealing portion made of an adhesive may be formed inside a sealing portion made of frit glass. By providing the sealing with the adhesive inside the sealing portion of the frit glass, the sealed state of the organic display can be maintained even if the sealing failure of the frit glass as described above occurs. Since the adhesive is made of an organic material, it is desirable to form the adhesive at a position away from the frit glass in order to avoid the influence of heating of the frit glass. The frit glass and the adhesive used for bonding the substrate and the sealing substrate may be formed on either the substrate or the sealing substrate.

Next, other embodiments of the organic EL display of the present invention showing the combination of the substrate and the sealing substrate and the position where the frit glass is formed are shown in FIGS. The present invention is not limited to this.

Fig.1 (a) is a cross-sectional schematic diagram which shows the organic electroluminescent display 100 which is one Embodiment of this invention. In the organic EL display 100 of the present invention, an organic EL element 31 including an anode layer 21, an organic light emitting medium layer 23, and a cathode layer 22 is formed on a substrate 11 having a step 61 on the outer periphery. It has the structure sealed through.
Moreover, FIG.1 (b) is a cross-sectional schematic diagram which shows the organic electroluminescent display 101 of this invention. In the organic EL display 101 of the present invention, the organic EL element 31 is formed on the substrate 11 having the step 61 on the outer periphery, and the frit glass and the adhesive are applied by the sealing substrate 13 having the fitting portion 66 at the bonding portion with the substrate. It has the structure sealed through.

In the embodiment of FIG. 1, since the sealing portion of the frit glass is on the same plane of the substrate and the sealing substrate, it is easy to form the frit glass by a printing method or the like. In the case of FIG. 1, since the substrate side is transparent, the laser is irradiated from the substrate side.

FIG. 2A is a schematic cross-sectional view showing the organic EL display 200 of the present invention. The organic EL display 100 of the present invention has a structure in which an organic EL element 31 is formed on a substrate 11 having a step 61 on the outer periphery and is sealed by a sealing substrate 12 via frit glass.
FIG. 2B is a schematic sectional view showing the organic EL display 201 of the present invention. In the organic EL display 201 of the present invention, the organic EL element 31 is formed on the substrate 11 having the step 61 on the outer periphery, and the frit glass and the adhesive are applied by the sealing substrate 13 having the fitting portion 66 at the bonding portion with the substrate. It has the structure sealed through.

In FIG. 2, since the sealing layer of frit glass is formed in the direction perpendicular to the screen, the impact resistance in the direction perpendicular to the screen is higher than in the embodiment of FIG. In this case, since the laser is irradiated from the sealing substrate side, a transparent material is used for the sealing substrate.

FIG. 3A is a schematic cross-sectional view showing the organic EL display 300 of the present invention. The organic EL display 100 of the present invention has a structure in which an organic EL element 31 is formed on a substrate 11 having a step 61 on the outer periphery and is sealed by a sealing substrate 12 via frit glass.
FIG. 3B is a schematic cross-sectional view showing the organic EL display 301 of the present invention. In the organic EL display 201 of the present invention, the organic EL element 31 is formed on the substrate 11 having the step 61 on the outer periphery, and the frit glass and the adhesive are applied by the sealing substrate 13 having the fitting portion 66 at the bonding portion with the substrate. It has the structure sealed through.

In FIG. 3, since the sealing layer of frit glass is formed in both the horizontal direction and the vertical direction with respect to the screen, the organic EL display has a higher sealing strength than the embodiment of FIGS.

FIG. 4A is a schematic cross-sectional view showing the organic EL display 400 of the present invention. The organic EL display 100 of the present invention has a structure in which an organic EL element 31 is formed on a substrate 14 having a bonding portion at an end surface, and the sealing substrate 12 is used to seal through a frit glass.
FIG. 4B is a schematic cross-sectional view showing the organic EL display 401 of the present invention. In the organic EL display 201 of the present invention, the organic EL element 31 is formed on the substrate 14 having the joint portion on the end face, and the frit glass and the adhesive are applied by the sealing substrate 13 having the fitting portion 66 in the adhesive portion with the substrate. It has the structure sealed through.

In FIG. 4, since the sealing layer of frit glass is formed in a direction perpendicular to the screen, the impact resistance in the direction perpendicular to the screen is higher than that in the embodiment of FIG. The process to form is unnecessary and it is excellent in productivity.

Hereinafter, a method for producing the organic EL element 31 of the present invention will be described by taking the embodiment based on FIG. 1A as an example. The present invention is not limited to this.

As the substrate 11 in the organic EL display of the present invention, a quartz substrate, a glass substrate, a plastic substrate, or the like can be used. When the bottom emission type organic EL element 31 is used, it is preferable to use a transparent one, particularly a frit. In the case of transmitting a laser for heating the glass, it is necessary to use a material that is transparent to the wavelength of the laser to be used.

First, a step 61 is formed on the outer periphery of the substrate by a general photolithography method. The height of the step 61 varies depending on the material used as the substrate, but is desirably less than or equal to half the thickness of the substrate where the organic EL element 31 is formed. Since stress concentrates at the portion where the step portion and the substrate are connected, if the height of the step 61 is greater than half the thickness of the substrate, the strength of the step portion is insufficient and the portion easily breaks. The height of the step 61 is desirably 0.1 mm or more. When the height of the step 61 is less than 0.1 mm, the sealing strength and sealing performance of the frit glass sealing layer are lowered, and sealing failure tends to occur.
Specifically, when the thickness of the substrate where the organic EL element 31 is formed is 1 mm, the height of the step 61 may be 0.1 mm or more and 0.5 mm or less.

Next, the anode layer 21 is formed on the substrate 11.

As the material of the anode in the present invention, transparent electrode materials such as ITO (indium tin composite oxide), indium zinc composite oxide, zinc aluminum composite oxide can be used. ITO is preferable from the viewpoints of low resistance, solvent resistance, and transparency.

The formation method of the anode layer 21 is roughly classified into a wet method, a physical method, and a chemical method. Examples of the wet method include a printing method and a coating method. Examples of physical methods include ion plating, sputtering, and vacuum deposition. Chemical methods include CVD and plasma CVD. In general, a sputtering method is employed when forming ITO. The thickness of the ITO film is in the range of 10 nm to 1000 nm. Preferable is 50 to 200 nm.

Next, the organic light emitting medium layer 23 is formed on the anode layer 21. The organic light emitting medium layer 23 has an organic light emitting layer, and layers such as a hole transport layer, a hole injection layer, an electron injection layer, and an electron transport layer are laminated as necessary. The organic medium layer can be formed by vacuum deposition in vacuum, sputtering, ion plating, magnetron sputtering, CVD, plasma CVD, spin coating in air, dip coating, spray coating. There are various printing methods such as coating methods, gravure printing methods, offset printing methods, flexographic printing methods, and inkjet printing methods. When forming an organic light emitting medium layer by various coating methods and various printing methods in the atmosphere, it is necessary to dissolve or stably disperse the organic light emitting material in a solvent.

In the case of forming the organic light emitting medium layer in a multilayer structure, examples of the organic light emitting medium layer include a two-layer structure including a hole transport layer and an organic light emitting layer from the anode side, an organic light emitting layer and an electron transport layer, and from the anode side. There are a three-layer structure including a hole transport layer, an organic light emitting layer, and an electron transport layer. Furthermore, it is possible to take a multilayer structure, and each layer may be formed on the anode layer sequentially. The film thickness of the organic light emitting medium layer is 500 nm or less, preferably 50 to 150 nm, even in a single layer configuration or a multilayer configuration.

Examples of the hole transport material forming the hole transport layer include metal phthalocyanines such as copper phthalocyanine and tetra (t-butyl) copper phthalocyanine, and metal-free phthalocyanines, quinacridone compounds, 1,1-bis (4-di- p-tolylaminophenyl) cyclohexane, N, N′-diphenyl-N, N′-bis (3-methylphenyl) -1,1′-biphenyl-4,4′-diamine, N, N′-di (1 -Naphthyl) -N, N'-diphenyl-1,1'-biphenyl-4,4'-diamine and other aromatic amine-based low molecular hole injection and transport materials, poly (para-phenylene vinylene), polyaniline and other high It can be selected from molecular hole transport materials, polythiophene oligomer materials, and other existing hole transport materials.

Examples of the organic light-emitting material forming the organic light-emitting layer include 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, and tris (8-quinolinolato) aluminum complex. , Tris (4-methyl-8-quinolinolato) aluminum complex, bis (8-quinolinolato) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolinolato) aluminum complex, tris (4-methyl-5- Cyano-8-quinolinolato) aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8) -Quinolinolato) [4- (4-cyanophenyl) phenola To] aluminum complex, tris (8-quinolinolato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, pentaphenylcyclopentadiene, Poly-2,5-diheptyloxy-para-phenylene vinylene, coumarin phosphor, perylene phosphor, pyran phosphor, anthrone phosphor, porphyrin phosphor, quinacridone phosphor, N, N'- Examples include dialkyl-substituted quinacridone phosphors, naphthalimide-based phosphors, N, N′-diaryl-substituted pyrrolopyrrole phosphors, and these are used alone or mixed with other low-molecular materials or polymer materials. Can do.

Examples of the electron transport material forming the electron transport layer include 2- (4-bifinylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, 2,5-bis (1 -Naphthyl) -1,3,4-oxadiazole and oxadiazole derivatives synthesized by Hamada et al. (Journal of Chemical Society of Japan, 1540, 1991) and bis (10-hydroxybenzo [h] quinolinolato) beryllium complex, Examples thereof include triazole compounds described in JP-A-7-90260.

Next, the cathode layer 22 is formed on the substrate 11 on which the anode layer 21 and the organic light emitting medium layer 23 are formed.

As the material of the cathode layer 22, a substance having a high electron injection efficiency is used. Specifically, a single metal such as Mg, Al, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched by about 1 nm at the interface in contact with the organic layer, and highly stable and conductive Al or Cu is laminated. And use.

Alternatively, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, and Yb having a low work function and stable Ag, Al An alloy system with a metal element such as Cu is used. Specifically, alloys such as MgAg, AlLi, and CuLi can be used.

The cathode layer 22 can be formed by a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method depending on the material. The thickness of the cathode layer 22 is desirably about 10 nm to 1 μm.

Next, frit glass is applied to a portion of the substrate or the sealing substrate which is a bonding portion between the substrate and the sealing substrate. As a method for applying the frit glass, a known method can be used, and a discharge method using a discharge nozzle or a printing method such as screen printing can be used.

As the frit glass, a known material can be used, and when formed by a printing method, it is preferably a gel-like paste in which a solvent such as a binder resin or an organic solvent is added to a powder glass made of low-melting glass. . It is desirable to adjust the composition of the frit glass and the solvent so that the viscosity is suitable for conditions such as the application method and the application area.

As the sealing substrate, a quartz substrate, a glass substrate, a plastic substrate, or the like can be used. When using a top emission type organic EL element, it is preferable to use a transparent substrate. In addition, when transmitting a laser for heating the frit glass, it is necessary to use a material that is transparent to the wavelength of the laser used.
The sealing substrate is formed by a known photolithography method in the same manner as the substrate.

Finally, a sealing substrate coated with frit glass is fitted to the bonding portion 62 at the position of the step 61 of the substrate on which the anode layer, the organic light emitting medium layer, and the cathode layer are formed, and then the frit glass is irradiated with laser light. The organic EL display is sealed by melting and bonding the substrate and the sealing substrate.
The sealing step is preferably performed in an inert gas atmosphere that is sufficiently dried in order to prevent oxygen and moisture from being mixed, which deteriorates the organic EL element. When an inert gas is used, a rare gas such as argon can be used, but it is preferable to use nitrogen gas for economic reasons.

Compared with the conventional frit glass sealing method, if a step is formed on the outer periphery of the substrate, the sealing substrate is fitted at the position of the step 61, and the device is sealed with frit glass, the lateral impact resistance of the device is improved. Can be improved. This sealing method is particularly suitable for large-area panels.

In the organic EL display of the present invention, a sealing portion made of an adhesive may be formed inside a sealing portion made of frit glass. By providing the sealing with the adhesive inside the sealing portion of the frit glass, the sealed state of the organic display can be maintained even if the sealing failure of the frit glass as described above occurs.
As such an example, an embodiment based on FIG. 1B will be described below as an example.

First, the sealing substrate 13 is completed by forming the fitting portion 66 and the bonding portions 64 and 65 in the bonding portions 62 and 63 of the sealing substrate 12 so as to be fitted to the step 61 of the substrate by photolithography.

Next, a frit glass is applied to the bonding portion 64 that is a bonding portion between the substrate and the sealing substrate on the substrate or the sealing substrate, and a resin adhesive is applied to the bonding portion 65. Apply frit glass. As a coating method, a known method can be used, and a discharge method using a discharge nozzle or a printing method such as screen printing can be used.

Examples of the resin adhesive include a thermosetting resin and a UV curable resin. Examples of the thermosetting resin include melamine type, acrylic type, 0-cresol novolac type, bisphenol type epoxy type, and urethane type. Examples of the UV curable resin include urethane diacrylate, epoxy diacrylate, and polyester diacrylate.

Next, the sealing substrate is fitted to the position of the step 61 of the substrate on which the organic EL element 31 is formed, and sealed in the same manner as in FIG.

As a method of curing the resin adhesive, when using a thermosetting resin, the adhesive is cured by heating, and when using a UV curable resin, the adhesive is cured by ultraviolet irradiation. Since organic EL elements are vulnerable to heat, it is particularly desirable to use a UV curable resin.

Finally, the organic EL element is sealed by irradiating the frit glass with laser light to melt and bond the substrate and the sealing substrate.

By providing a sealing layer made of a resin adhesive inside the frit glass sealing layer, it is possible to block a small amount of moisture and oxygen entering from the defects of the frit glass sealing layer, and at the same time, the frit glass is irradiated with laser. To provide a longer-life organic EL display by preventing gas and droplets generated from the surface from reaching the inside of the device when melted and further improving the lateral impact resistance of the device. Can do.

EXAMPLES Hereinafter, although an Example and a comparative example further demonstrate this invention, this invention is not restrict | limited to the following example.

First, a step 61 having a height of 0.3 mm was formed on the outer periphery of the substrate 11 having a thickness of 0.7 mm by photolithography.

Next, an ITO layer was formed as the anode layer 21 on the substrate 11 by sputtering. Further, in order to improve transparency and conductivity, heat treatment was performed in air to crystallize ITO.

Next, as the organic light emitting medium layer 23, copper phthalocyanine, N, N′-di (1-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine, tris (8-quinolinolate) ) Aluminum complexes were sequentially vacuum-deposited with film thicknesses of 20 nm, 60 nm and 70 nm.

Next, the organic EL element 31 was formed on the organic light emitting medium layer 23 by vacuum deposition while rotating Al as the cathode layer 22.

Next, an annular frit glass 41 was formed on the bonding portion 62 of the sealing substrate 12 by coating.

Finally, after the sealing substrate 12 is fitted to the position of the step 61 of the substrate 11, the frit glass 41 is irradiated from the substrate with the laser light 71, and the substrate 11 and the sealing substrate 12 are melt bonded. The organic EL display 100 was sealed (FIG. 1 (a)).

The process up to the step of forming the organic EL element 31 on the substrate is the same as that of the first embodiment.

Next, the sealing substrate 13 was completed by forming fitting portions 66 and bonding portions 64 and 65 in the bonding portions 62 and 63 of the sealing substrate 12 by photolithography so as to be fitted to the step 61 of the substrate. . The height of the fitting part 66 is 0.3 mm.

Next, an annular frit glass 41 is formed on the bonding portion 64 of the sealing substrate 13 and an annular resin adhesive 51 is formed on the bonding portion 65 by coating, and then the sealing substrate 13 is fitted at the position of the step 61 of the substrate 11. Combined.

Finally, after the resin adhesive 51 is cured by ultraviolet irradiation, the frit glass is irradiated from the substrate with the laser beam 71, and the substrate and the sealing substrate are melt-bonded, whereby the organic EL display 101 is double sealed. (FIG. 1B).

The process up to the step of forming the organic EL element 31 on the substrate is the same as that of the first embodiment.

Next, an annular frit glass 42 was formed on the bonding portion 63 of the sealing substrate 12 by coating.

Finally, after the sealing substrate 12 is fitted to the position of the step 61 of the substrate 11, the frit glass 42 is irradiated from the side surface of the sealing substrate 12 with the laser light 71 to melt the substrate 11 and the sealing substrate 12. The organic EL display 200 was sealed by bonding (FIG. 2A).

The process up to the step of forming the organic EL element 31 on the substrate is the same as that of the first embodiment.

Next, the sealing substrate 13 was completed by forming fitting portions 66 and bonding portions 64 and 65 in the bonding portions 62 and 63 of the sealing substrate 12 by photolithography so as to be fitted to the step 61 of the substrate. . The height of the fitting part 66 is 0.3 mm.

Next, an annular frit glass 42 is formed on the fitting portion 66 of the sealing substrate 13 and an annular resin adhesive 51 is applied on the bonding portion 65, and then the sealing substrate 13 is fitted on the step 61 of the substrate 11. Combined.

Finally, after the resin adhesive 51 is cured by ultraviolet irradiation, the frit glass 42 is irradiated from the side surface of the sealing substrate 13 with a laser beam 71, and the substrate 11 and the sealing substrate 13 are melt-bonded to form an organic material. The EL display 201 was double sealed (FIG. 2B).

The process up to the step of forming the organic EL element 31 on the substrate is the same as that of the first embodiment.

Next, an annular frit glass 43 was formed on the bonding portions 62 and 63 of the sealing substrate 12 by coating.

Finally, after the sealing substrate 12 is fitted to the position of the step 61 of the substrate 11, the frit glass 43 is irradiated from the side surfaces of the substrate 11 and the sealing substrate 12 with the laser beam 71, and the substrate 11 and the sealing substrate 13 are irradiated. And the organic EL display 300 was sealed (FIG. 3A).

The process up to the step of forming the organic EL element 31 on the substrate is the same as that of the first embodiment.

Next, the sealing substrate 13 was completed by forming fitting portions 66 and bonding portions 64 and 65 in the bonding portions 62 and 63 of the sealing substrate 12 by photolithography so as to be fitted to the step 61 of the substrate. . The height of the fitting part 66 is 0.3 mm.

Next, an annular frit glass 43 is applied to the adhesive portion 64 and the fitting portion 66 of the sealing substrate 13 and an annular resin adhesive 51 is applied to the adhesive portion 65, and then sealed at the level difference 61 of the substrate 11. The stop substrate 13 was fitted.

Finally, after the adhesive 51 is cured by ultraviolet irradiation, the frit glass 43 is irradiated from the side surfaces of the substrate 11 and the sealing substrate 13 with the laser beam 71, and the substrate 11 and the sealing substrate 13 are melt bonded. The organic EL display 301 was double sealed (FIG. 3B).

First, an ITO layer was formed as the anode layer 21 on the substrate 14 by sputtering. Further, in order to improve transparency and conductivity, heat treatment was performed in air to crystallize ITO.

Next, as the organic light emitting medium layer 23, copper phthalocyanine, N, N′-di (1-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine, tris (8-quinolinolate) ) Aluminum complexes were sequentially vacuum-deposited with film thicknesses of 20 nm, 60 nm and 70 nm.

Next, the organic EL element 31 was formed by vacuum deposition while rotating Al as the cathode layer 22.

Next, an annular frit glass 44 was formed on the bonding portion 63 of the sealing substrate 12 by coating.

Finally, after the sealing substrate 12 is fitted to the substrate 14, the frit glass 44 is irradiated from the side surface of the sealing substrate 12 with the laser light 71, and the substrate 14 and the sealing substrate 12 are melt bonded. The organic EL display 400 was sealed (FIG. 4A).

The process up to the step of forming the organic EL element 31 on the substrate 14 is the same as that of the seventh embodiment.

Next, the sealing substrate 13 was completed by forming the bonding portion 65 and the fitting portion 66 on the outer periphery of the sealing substrate by photolithography. The height of the fitting portion 66 is the same as the thickness of the substrate.

Next, an annular frit glass 44 was formed on the fitting portion 66 of the sealing substrate 13 and an annular resin adhesive 51 was formed on the bonding portion 65 by coating, and then the sealing substrate 13 was fitted on the substrate 14.

Finally, after the resin adhesive 51 is cured by ultraviolet irradiation, the frit glass 44 is irradiated from the side surface of the sealing substrate 13 with laser light 71, and the substrate 14 and the sealing substrate 13 are melt-bonded to form an organic material. The EL display 401 was double sealed (FIG. 4B).

DESCRIPTION OF SYMBOLS 11 ... Board | substrate 12 which has the level | step difference 61 ... Sealing board | substrate 13 ... Sealing board | substrate 14 which has the adhesion parts 64 and 65 and the fitting part 66 ... Board | substrate 21 ... Anode layer 22 ... Cathode layer 23 ... Organic light emitting medium layer 31 including organic light emitting layer ... Organic EL element 41 ... Frit glass 42 ... Frit glass 43 ... Frit glass 44 ... Frit glass 51 ... UV curable resin adhesive 61... Step 62 on the outer periphery of the substrate 11... Adhesive portion 63 of the sealing substrate 12... Adhesive portion 64 of the sealing substrate 12. 65 ... Adhesive part 66 of sealing substrate 13 ... Fitting part 71 of sealing substrate 13 ... Laser light 100 ... Organic EL display 101 of the present invention ... Organic EL display 200 of the present invention Organic EL display 201 of the present invention The organic EL display 300 ... organic EL display 500 · conventional organic EL display of the organic EL display 401 .. The present invention of an organic EL display 400 .. The present invention of an organic EL display 301 .. The present invention of the present invention the invention

Claims (4)

An organic EL display in which a substrate on which an organic EL element composed of at least an anode layer, an organic light emitting layer, and a cathode layer is formed and a sealing substrate are sealed with frit glass,
The substrate is provided with a portion where the thickness of the organic EL element is thick and a portion where the thickness is provided at the outer edge of the substrate, and the portion where the thickness of the substrate is thick and thin There is a step between the part,
The sealing substrate has a fitting portion that fits corresponding to the step of the substrate,
The frit glass is formed in a portion where the thickness of the substrate is thin and the side surface of the step and the sealing substrate are in contact with each other,
An organic EL display, wherein an adhesive layer made of a curable resin adhesive is formed on a portion where the thick substrate is in contact with the sealing substrate . 2. The organic EL display according to claim 1 , wherein a height of the step of the substrate is 0.1 mm or more to half or less of a thickness of a thick part of the substrate. 3. The organic EL display according to claim 1, wherein the curable resin adhesive is a thermosetting adhesive or an ultraviolet curable adhesive. A method for producing an organic EL display comprising sealing a substrate on which an organic EL element comprising at least an anode layer, an organic light emitting medium layer including an organic light emitting layer, and a cathode layer is formed, and a sealing substrate through frit glass. And
Forming a step on the outer periphery of the substrate;
Forming an anode layer, an organic light emitting medium layer including an organic light emitting layer, and a cathode layer on the substrate;
Forming a fitting portion to be fitted to the sealing substrate corresponding to the step of the substrate;
Applying the frit glass to the sealing substrate, a portion where the thickness of the substrate is thin, and a portion where the side surface of the step is in contact;
Applying a curable resin adhesive to a portion where the thick portion of the substrate is in contact with the sealing substrate; and
Fitting the sealing substrate into the position of the step of the substrate;
Curing the curable resin adhesive;
And a step of irradiating the frit glass with a laser beam to melt-bond the substrate and the sealing substrate.

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