JP5387731B2 - Electronic component joining apparatus, electronic unit, and electronic apparatus - Google Patents

Description

  The present invention relates to an electronic component bonding apparatus, an electronic unit, and an electronic device that electrically bond an electronic component and a circuit board.

  Before shipping semiconductor components such as LSIs and ICs, a semiconductor test is performed in which power is supplied to the semiconductor components to extract signals and confirm the operation of the semiconductor components. In this semiconductor test, a test apparatus is generally used that includes a socket board in which a power supply board and a signal lead-out board are stacked, and a socket through which a plurality of probes pass through a resin housing. Is. In the semiconductor component and the socket board, a plurality of electrode pads for signal extraction (hereinafter referred to as signal pads) and a plurality of electrode pads for power supply (hereinafter referred to as power pads) are arranged, When a socket is mounted on the socket board and a semiconductor component is mounted on the socket, the semiconductor component and the electrode pads of the socket board are electrically connected to each other by the probe of the socket.

  By the way, in recent years, due to an increase in leakage current due to miniaturization of semiconductor components and an increase in power supply frequency accompanying an increase in speed of server devices and the like on which semiconductor components are mounted, the amount of current flowing through the semiconductor components during operation increases Conventionally, the power consumption, which has been about 50 [W] at the maximum, is now over 100 [W]. Furthermore, with the expansion of the data bus width of the server device, the ratio of the signal pad to the entire electrode pad has increased, and conversely, the ratio of the power pad has decreased, so that each of the semiconductor component and the socket board can be reduced. The amount of current flowing per power probe connecting the power pads is increasing rapidly. Since the probe is surrounded by a resin casing, it is difficult to dissipate heat. If the amount of heat generation increases as the amount of current increases, the pressure spring that presses the probe against the electrode pad may be damaged. There is.

  In this regard, it is widely practiced to efficiently dissipate heat generated by the probe by providing a blower fan or a heat sink in the socket. In addition, through holes are provided in the power supply board in which the signal lead lines are embedded, the inner wall is plated with gold, contact pins are inserted into the through holes, and pressed against the semiconductor component with an elastic material, thereby A technique for directly contacting a contact pin has also been proposed (see, for example, Patent Document 1). According to this technique, the current path between the power supply substrate and the contact pin can be shortened, and the resistance can be reduced to reduce the amount of heat generated.

Japanese Patent Laid-Open No. 2001-13208

  However, in the above-described technology, the signal lead-out line is embedded in the power supply substrate, and the circuit becomes complicated when an attempt is made to add the signal lead-out line. Therefore, it can be applied as a socket for high-temperature testing of semiconductor components, but it should be used as a normal socket that is actually mounted on a server device and used to connect semiconductor components and external components. There is a problem that is difficult.

  In view of the above circumstances, an electronic component joining device, an electronic unit, and an electronic device that can suppress circuit complication, reduce electric resistance, suppress heat generation, and efficiently dissipate heat are provided.

The basic form of an electronic component bonding apparatus that achieves the above-described object is an electronic component bonding portion that bonds an electronic component having a plurality of terminals,
A circuit board bonding portion for bonding to the circuit board and electrically bonding at least one terminal to the circuit board;
It has an outside other than the circuit board and a conductive portion that is electrically joined to at least one terminal.

  According to the basic form of the electronic component bonding apparatus, the circuit board bonding portion is bonded to a signal circuit board or the like, whereby the electronic component and the circuit board are electrically connected, and the conduction portion is bonded to the electronic component. By joining with a power supply device or the like, the electronic component and the external device are connected as a power source. Therefore, the current path between the electronic component and the external device can be shortened, the amount of heat generated can be suppressed and the device can be prevented from being damaged, and the number of signal lines can be increased while suppressing the complexity of the circuit.

Moreover, the basic form of the electronic unit that achieves the above object is as follows:
An electronic component joint for joining with an electronic component having a plurality of terminals;
A circuit board electrically joined to at least one of the terminals;
It has an outside other than the circuit board and a conductive portion that is electrically joined to at least one terminal.

  According to the basic form of the electronic unit, the amount of heat generation can be suppressed, the circuit complexity can be suppressed, and the electronic unit can be preferably applied as a socket for connecting an electronic component and an external circuit.

In addition, the basic form of the electronic device that achieves the above object is as follows:
An electronic component having a plurality of terminals;
An electronic component joint to be joined to the electronic component;
A circuit board electrically joined to at least one terminal;
A power supply for supplying power to the electronic components and circuit board;
And a conductive portion that is disposed between the electronic component bonding portion and the circuit board and supplies power from the power supply portion to the electronic component.

  According to the basic form of the electronic device, it is possible to suppress the complexity of the circuit, reduce the electrical resistance, and suppress the heat generation amount.

  As described above, according to the basic configuration of the electronic component bonding apparatus, the electronic unit, and the electronic apparatus, it is possible to suppress the complexity of the circuit, reduce the electrical resistance, suppress the heat generation amount, and efficiently dissipate heat.

It is a schematic top view of a socket unit. It is a side view of the electronic device 1 containing a socket unit. It is a figure for demonstrating the connection of a plunger, VDD plate, and GND plate. FIG. 4 is a top view at each of position A to position J shown in FIG. 3. It is a figure which shows the flow of the heat | fever in an electronic device.

  Hereinafter, with reference to the drawings, specific embodiments for the basic mode and application mode described above will be described.

  FIG. 1 is a schematic top view of the socket unit 10.

  The socket unit 10 is for performing a semiconductor test in which an electronic device such as a semiconductor package is connected to a peripheral device or an external circuit, and a power supply voltage and a high-frequency signal are applied to the semiconductor package to confirm operation. As shown in FIG. 1, the socket unit 10 has a plurality of pins 21 penetrating from the upper surface of a circular socket housing 20, and a voltage for supplying power to the electronic device from the side of the socket housing 20. A side (VDD) plate 11 and a ground side (GND) plate 12 protrude.

  FIG. 2 is a side view of the electronic device 1 including the socket unit 10.

  The electronic device 1 shown in FIG. 2 includes a signal substrate 30 for signal extraction, a socket unit 10 mounted on the signal substrate 30, a semiconductor package 40 mounted on the socket unit 10, a VDD plate 11 and a GND plate. 12, a control circuit 60 connected to the signal board 30, a blower fan 71, 72, 73 attached to the upper side of the semiconductor package 40 and to the side of the VDD plate 11 and the GND plate 12. And a heat sink 80 for dissipating the heat in the electronic device 1. The semiconductor package 40 is an example of the electronic component described above, the signal board 30 is an example of the circuit board described above, and the combination of the voltage side (VDD) plate 11 and the ground side (GND) plate 12 is the above-described continuity. It corresponds to an example of a part.

  In the semiconductor package 40, an LSI 420 including a semiconductor element or the like is mounted on the upper surface of the multilayer substrate 410, and a plurality of electrode pads 430 to which the pins 21 of the socket unit 10 are connected are attached to the lower surface of the multilayer substrate 410. Yes. The plurality of electrode pads 430 include a VDD pad 441 connected to the VDD plate 11, a GND pad 442 connected to the GND plate 12, and a signal pad 443 connected to the signal substrate 30. ing. The electrode pad 430 of the semiconductor package 40 corresponds to an example of the plurality of terminals described above.

  The signal board 30 is provided with an electrode pad 31 electrically connected to the signal pad 443 at a position corresponding to the signal pad 443 of the semiconductor package 40 with the socket unit 10 interposed therebetween.

  The VDD plate 11 of the socket unit 10 is provided with through holes 11A, 11B, and 11C at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443 of the semiconductor package 40, respectively. 12, through holes 12A, 12B, and 12C are provided at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443, respectively. Further, through holes 20A, 20B, and 20C are provided on the upper surface of the socket housing 20 at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443, respectively. A through hole 20 </ b> D is provided on the lower surface at a position corresponding to the signal pad 443. Furthermore, pressure pins 91 and 92 are fixed to the lower surface of the socket housing 20 so as to protrude to the height at which the VDD plate 11 and the GND plate 12 are installed. Pressurizing springs 93 and 94 for biasing are attached. The pressure pins 91 and 92 are made of nonmetal such as resin, and the upper end side is rounded.

  The signal pad 443 of the semiconductor package 40 and the electrode pad 31 of the signal substrate 30 are poco pins that penetrate through the through holes 11C, 12C, 20C, and 20D provided in the VDD plate 11, the GND plate 12, and the socket housing 20, respectively. 95 is connected. A spring is mounted inside the poco pin 95, and the front end and the rear end are pressed against the signal pad 443 of the semiconductor package 40 and the electrode pad 31 of the signal substrate 30. Further, the through holes 11C and 12C of the VDD plate 11 and the GND plate 12 through which the poco pin 95 passes are formed larger than the outer shape of the poco pin 95, and the poco pin 95, the VDD plate 11 and the GND plate 12 are not in contact with each other and insulated. Has been. The poco pin 95 corresponds to an example of the circuit board bonding portion described above.

  Plungers 96 and 97 supported by pressure pins 91 and 92 are connected to the VDD pad 441 and the GND pad 442 of the semiconductor package 40 from below.

  Here, the description of FIG. 2 is temporarily interrupted, and the connection between the plungers 96 and 97 and the VDD plate 11 and the GND plate 12 will be described in detail.

  FIG. 3 is a view for explaining the connection between the plungers 96 and 97 and the VDD plate 11 and the GND plate 12, and FIG. 4 is a top view from the position A to the position J shown in FIG.

  As shown in FIG. 3A, the pressure pin 91 fixed at a position corresponding to the VDD pad 441 of the semiconductor package 40 protrudes to the height of the VDD plate 11 and is not in contact with the plunger 96. In the state, the pressurizing spring 93 is extended.

  The socket unit 10 is mounted on the signal board 30, and resin guide plates 23 </ b> A, 23 </ b> B for supporting the plungers 96, 97 and the pressure pins 91, 92 are provided inside the socket housing 20. 23C, 23D and a VDD plate 11 and a GND plate 12 sandwiched between the guide plates 23A, 23B, 23C, 23D are arranged. As shown in FIG. 4A, the upper surface of the socket housing 20 has through holes 20A, 20B, and 20C at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443, respectively (FIG. 4). In FIG. 4 (B), the socket housing 20 has a hollow cylindrical shape. Further, as shown in FIGS. 4C, 4E, 4G, 1H, and 1I, the guide plates 23A, 3B, 23C, 23D, and 23E accommodated in the socket housing 20 have The through holes 102 are provided at positions corresponding to the through holes 20A, 20B, and 20C on the upper surface of the socket housing 20, and as shown in FIGS. 4D and 4F, the VDD plate 11 and the GND plate 12, through holes 11A, 11B, 11C, 12A, 12B, and 12C (collectively shown as through holes 103 and 104 in FIG. 4) at positions corresponding to the through holes 20A, 20B, and 20C on the upper surface of the socket housing 20, respectively. Is provided). As will be described later, the through holes 11A, 11B, 11C, 12A, 12B, and 12C provided in the VDD plate 11 and the GND plate 12 have different sizes depending on positions. Furthermore, a through hole 20 </ b> D is provided on the lower surface of the socket housing 20 only at a position corresponding to the signal pad 443.

  As shown in FIG. 3B, when the plunger 96 is inserted into the socket housing 20, the pressure spring 93 contracts to urge the pressure pin 91 upward, and the plunger 96 Is pressed against the VDD pad 441 of the semiconductor package 40. At a position corresponding to the VDD pad 441, the through hole 11A of the VDD plate 11 is smaller in diameter than the through hole 12A provided in the GND plate 12, and the plunger 96 is formed on the inner wall of the through hole 11A of the VDD plate 11. By contact, it is directly connected to the VDD plate 11. In addition, since the upper end of the pressure pin 91 is formed in a round shape and the lower end of the plunger 96 is formed obliquely, the plunger 96 slides obliquely by the pressure pin 91 and is wide with the VDD plate 11. It is possible to make a reliable connection by contacting the surface.

  Further, as shown in FIG. 3C, the pressure pin 92 fixed at a position corresponding to the GND pad 442 of the semiconductor package 40 protrudes to the height of the GND plate 12, and the plunger 97 is inserted. Then, the pressure spring 94 is contracted to urge the pressure pin 92 upward, and the plunger 97 is pressed against the GND pad 442 of the semiconductor package 40. Further, at a position corresponding to the GND pad 442, the through hole 12B provided in the GND plate 12 is smaller in diameter than the through hole 11B of the VDD plate 11, and the plunger 97 is formed in the through hole 11B of the VDD plate 11. Are in contact with the inner wall of the through-hole 11B of the GND plate 12 without contact. That is, the plunger 97 is insulated from the VDD plate 11 and is directly connected to the GND plate 12.

  Returning to FIG.

  When a semiconductor test is performed, when power is supplied from the power supply device 50, a current flows from the VDD plate 11 through the plunger 96 to the semiconductor package 40 and further from the plunger 97 to the GND plate 12. In addition, a signal drawn from the semiconductor package 40 is given to the signal board 30 through the poco pins 95 and transmitted to the control circuit 60. Here, in the electronic device 1 shown in FIG. 2, since the current flows only to the plungers 96 and 97 without being transmitted to the resin-made pressure pins 91 and 92, the VDD plate 11 and the GND plate 12 and the semiconductor package 40 The current path between them is shortened, the resistance can be reduced and the amount of heat generated can be suppressed, and the pressurizing springs 93 and 94 can be prevented from being damaged.

  Further, when the semiconductor package 40 is mounted on the socket unit 10, the plungers 96 and 97 are pressed downward toward the pressure pins 91 and 92, and the pressure pins 91 and 92 are pressed against the pressure springs 93 and 92. 94, and the lower ends of the plungers 96 and 97 slide in an oblique direction along the round shape of the pressure pins 91 and 92, and the plungers 96 and 97 are through holes in the VDD plate 11 and the GND plate 12. The inner walls of 11A and 12B are contacted on a wide surface. For this reason, the resistance between the plungers 96 and 97 and the VDD plate 11 and the GND plate 12 is reduced, and the amount of generated heat can be suppressed.

  Further, in the electronic device 1, the VDD plate 11, the GND plate 12, and the signal board 30 are arranged side by side in the height direction, and are connected to any of the VDD plate 11, the GND plate 12, and the signal board 30. The lengths of the plungers 96 and 97, the Pokopin 95, and the pressure pins 91 and 92 that support the plungers 96 and 97 are adjusted according to the length of the circuit. It can be increased and can be applied not only as a socket for high-frequency testing but also as a normal socket for connecting the semiconductor package 40 and an external circuit.

  FIG. 5 is a diagram illustrating a heat flow in the electronic apparatus 1.

  Since the VDD plate 11 and the GND plate 12 are plates for supplying electric power, they are made of conductive metal or the like. As shown in FIG. 2, the VDD plate 11 and the GND plate 12 are directly connected to plungers 96 and 97 that are heat sources. The heat generated by the plungers 96 and 97 is transferred by the VDD plate 11 and the GND plate 12 having good thermal conductivity, and the heat sinks by the blower fans 11 and 12 provided on the side of the VDD plate 11 and the GND plate 12. Heat is radiated from 80. Further, the plungers 96 and 97 are in contact with one of the VDD plate 11 and the GND plate 12, but a gap is provided between the other, so that an air layer is formed. . The heat of the plungers 96 and 97 is also radiated by this air layer.

  Furthermore, as shown in FIG. 5, since the socket housing 20 has a circular shape, the wind sent from the blower fan 73 flows to both sides along the edge of the socket housing 20, and the VDD plate 11 and It is transmitted to the upper surface of the GND plate 12. Thus, according to the electronic apparatus 1, while being able to suppress the emitted-heat amount, heat dissipation efficiency can also be improved. Actually, in the conventional socket, the pressure spring or the like has been damaged with a heat generation amount of about 20 [W] to 50 [W]. However, according to the socket unit 10 of this embodiment, one plunger Breakage could be prevented even with a calorific value of current 4 [A] flowing through 96, 97 × voltage 1.00 [V] × 100 = 400 [W].

  Here, the example in which the socket unit, which is a specific embodiment of the electronic component joining apparatus, is used as a socket for semiconductor testing has been described above. However, the socket unit described above connects a semiconductor component and an external circuit or the like. You may apply as a normal socket for doing.

DESCRIPTION OF SYMBOLS 10 Socket unit 11 VDD plate 12 GND plate 20 Socket housing | casing 30 Signal board 40 Semiconductor package 50 Power supply circuit 60 Control circuit 71,72,73 Blower fan 80 Heat sink

Claims (9)

An electronic component joint for joining with an electronic component having a plurality of terminals;
A circuit board bonding portion for bonding to a circuit board and electrically bonding at least one of the terminals and the circuit board;
A conductive portion provided with a through hole, which is electrically joined to the outside other than the circuit board and at least one of the terminals;
A plunger penetrating the through-hole of the conducting portion away from the inner wall of the through-hole and having one end facing at least one of the terminals;
The plunger has a tip facing the other end opposite to the one end, the other end of the plunger is pushed up by the tip, and the one end of the plunger is pressed against the terminal, and the plunger An electronic component joining apparatus, comprising: a pressure pin made of resin that electrically joins the outside and the terminal to the conducting portion by pressing the terminal against the inner wall of the through hole.   The electronic component joining apparatus according to claim 1, wherein the conduction unit supplies power to the electronic component for driving the electronic component.   The electronic component joining apparatus according to claim 1, wherein the conduction portion conducts heat generated by the electronic component to the outside.   4. The electronic component joining apparatus according to claim 1, wherein the conducting portion is electrically joined to the terminal in accordance with the joining of the electronic component joining portion and the electronic component. 5. . An electronic component joint for joining with an electronic component having a plurality of terminals;
A circuit board electrically joined to at least one of the terminals;
A conductive portion provided with a through hole, which is electrically joined to the outside other than the circuit board and at least one of the terminals;
A plunger penetrating the through-hole of the conducting portion away from the inner wall of the through-hole and having one end facing at least one of the terminals;
The plunger has a tip facing the other end opposite to the one end, the other end of the plunger is pushed up by the tip, and the one end of the plunger is pressed against the terminal, and the plunger An electronic unit comprising: a pressure pin made of resin for electrically connecting the outside and the terminal to the conducting portion by pressing the pin against the inner wall of the through hole.   The electronic unit according to claim 5, wherein the conduction unit supplies power to the electronic component for driving the electronic component.   The electronic unit according to claim 5, wherein the conduction part conducts heat generated by the electronic component to the outside.   An electronic component having a plurality of terminals;
  An electronic component bonding portion to be bonded to the electronic component;
  A circuit board electrically joined to at least one of the terminals;
  A power supply for supplying power to the electronic component and the circuit board;
  A conduction portion provided between the electronic component joint and the circuit board, which supplies the power from the power supply unit to the electronic component;
  A plunger penetrating the through-hole of the conducting portion away from the inner wall of the through-hole and having one end facing at least one of the terminals;
  The plunger has a tip facing the other end opposite to the one end, the other end of the plunger is pushed up by the tip, and the one end of the plunger is pressed against the terminal, and the plunger A pressure pin made of resin, which causes the conduction part to supply the power from the power supply part to the electronic component by pressing against the inner wall of the through-hole.
An electronic device.   The electronic device according to claim 8, wherein the conduction portion conducts heat generated by the electronic component.

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