JP5381585B2 - Manufacturing method of lead frame for LED light emitting device and manufacturing method of LED package - Google Patents

Description

The present invention relates to a method for manufacturing a lead frame for an LED light emitting element on which an LED (Light Emitting Diode) is mounted , and a method for manufacturing an LED package .

  In general, a lead frame for mounting an electronic element such as a semiconductor integrated circuit or an LED light emitting element is a metal for a lead frame made of a plate-shaped alloy thin plate such as iron-nickel or the like, or an alloy thin plate such as copper-nickel-tin or the like. The material is manufactured by photoetching from one or both sides using an etchant such as ferric chloride. The lead frame manufactured in this way has a pad part (island part) for mounting a semiconductor integrated circuit and an LED element, and an inner part electrically insulated from the pad part and electrically connected to the electronic element. It is set as the structure provided with the lead part and the outer lead part.

  A mounting portion (mounting surface) for mounting an electronic element is provided on the surface side of the pad portion of the lead frame. And on the back surface side, there is provided a heat radiating part (heat radiating surface) for dissipating driving heat generated from the electronic element body such as LED light emitting element and environmental conditions around the electronic element. Thus, heat is dissipated so that heat is not accumulated on the electronic element side. In addition, the heat dissipation technique in the lead frame is described in Patent Documents 1 to 4.

  The LED package is manufactured using the lead frame or the like designed as described above. This LED package is a light-emitting device using a light-emitting diode as a light source, and the most common one is an integrated heat sink, lead frame, and case. The heat sink is required for heat diffusion, the lead frame is required for electrical conduction, and the case is required for insulation and heat dissipation. An LED chip is mounted on a substrate formed of these, and resin-molded with a sealing resin such as epoxy resin or silicone resin, and packaged is called an LED package.

  In recent years, this LED package has been widely used for various electronic parts including lighting. Therefore, it is required to efficiently extract the light emitted from the LED chip, and not only the light emitted directly from the light emitting element but also the reflection by providing a reflector so that more light is emitted to the outside. A package with high brightness is being studied. Patent Documents 5 to 7 describe descriptions for efficiently extracting light from the LED chip.

JP 2003-8071 A JP 2003-347600 A JP 2004-172160 A JP 2007-220925 A JP 2005-285899 A JP 2006-13144 A JP 2006-245032 A

  By the way, in many cases, the reflector is manufactured by bonding a base substrate provided with a plurality of chip mounting portions and a substrate in which a plurality of reflection holes as reflectors are provided on a resin plate made of an insulating material.

  Most of the reflectors are manufactured by performing Cu plating on a resin plate grown by a plating method or a vapor deposition method, and further stacking a metal thin film having a high light reflectance. For this reason, the manufacturing method is complicated and the number of processes is large. In addition, the reflector itself may be peeled off, and there is a disadvantage that durability is poor.

  This invention is made | formed in view of such a subject, Comprising: The lead frame for LED light emitting elements which has high reflectance and durability, and can be produced simply and cheaply, LED package, and these manufacturing methods The purpose is to provide.

  In order to solve the above problems, the present invention provides the following means.

  The method for manufacturing a lead frame for an LED light emitting device according to the present invention includes a pad portion having a mounting surface on which an LED chip is mounted, and a connection that is disposed substantially parallel to the mounting surface and is electrically connected to the LED chip. A lead portion having a surface, and a filling resin that resin-molds the pad portion and the lead portion with the mounting surface and the connection surface exposed upward, and the filling resin includes the mounting surface and the connection. A method of manufacturing a lead frame for an LED light-emitting element having a reflector portion that surrounds a surface in an annular shape and inclines so as to increase in diameter upward, and forms the pad portion and the lead portion on the first surface of a metal plate. A step of applying a resist to a place to be formed, and an etching process on the first surface using the resist as a mask, and the place where the reflector portion is to be formed A step of etching deeper than the part, a step of filling and curing the filling resin from the first surface, and an etching process from the second surface located on the opposite side of the first surface, thereby mounting the mounting surface And a step of exposing a reflector portion by the connecting surface and the filling resin.

  In the method for manufacturing a lead frame for an LED light emitting device having such characteristics, a reflector made of a filling resin can be easily and easily etched by deeply etching a portion where a reflector portion is to be formed in comparison with other portions. The part can be molded. In addition, since the filling resin itself plays a role as a reflector in this way, it is not necessary to provide a separate member and the optical gain can be improved at a low cost, and since the filling resin and the reflector portion are integrated, durability is improved. Can be improved.

In the method for manufacturing a lead frame for an LED light emitting device according to the present invention, a light reflective additive is added to the filling resin.
Thereby, it becomes possible to raise the reflection efficiency of the reflector part in the filling resin surface, and to improve the optical gain of an LED chip.

Furthermore, the method for manufacturing a lead frame for an LED light emitting element according to the present invention is characterized by comprising a step of providing a reflective film covering the reflector part after the reflector part is exposed.
Thereby, the light gain of the LED chip can be further improved by adopting a configuration in which the reflection film provided on the reflector part reflects light.

  The LED package manufacturing method according to the present invention includes a step of mounting an LED chip on the mounting surface of the LED light-emitting element lead frame manufactured by the LED light-emitting element lead frame according to any one of the above, and the filling resin. A sealing resin is laminated inside the reflector portion, and the LED chip, the mounting surface, and the connection surface are sealed.

  According to the manufacturing method of the LED package having such a feature, since the reflector part is integrally formed with the filling resin, a high light gain can be obtained by reflecting the light from the LED chip in the reflector part. it can. Moreover, since a reflector can be comprised without using an additional member, durability can be improved and it can manufacture easily at low cost.

According to the LED light emitting element lead frame, the LED package, and the manufacturing methods thereof according to the present invention, the reflector portion provided so as to surround the mounting surface of the pad portion on which the LED chip is mounted is formed integrally with the filling resin. Therefore, the reflector portion can be produced in a lump with the filling resin without using a separate member.
Usually, in order to produce a reflector, a separate member is required, and many members are required. However, in the present invention, the reflector portion is formed by the filling member as described above, so that the high reflectance is obtained. In addition, it is possible to provide a lead frame for an LED light emitting element, an LED package, and a manufacturing method thereof that are durable and inexpensive and can be easily manufactured.

It is a top view of the lead frame for LED light emitting elements which concerns on embodiment. It is a bottom view of the lead frame for LED light emitting elements which concerns on embodiment. It is X1-X1 sectional drawing of FIG. 1 carrying an LED chip. It is X2-X2 sectional drawing of FIG. It is YY sectional drawing which shows the state after mounting an LED chip in the lead frame for LED light emitting elements which concerns on embodiment, and wire bonding. It is a figure corresponding to X1-X1 sectional drawing of FIG. 1 in the LED package which concerns on embodiment. It is a figure explaining the optical path of the light radiated | emitted from the LED chip in the LED package which concerns on embodiment. It is a figure explaining the manufacturing method of the lead frame for LED light emitting elements which concerns on embodiment. It is a top view of the multi-sided lead frame formed by connecting the LED light emitting element lead frame according to the embodiment by a tie bar and a suspension bar. It is sectional drawing explaining an example of the resin mold using a metal mold | die.

Hereinafter, embodiments of an LED light-emitting element lead frame and an LED package according to embodiments will be described in detail with reference to the drawings.
1 is a top view of an LED light-emitting element lead frame according to the embodiment, FIG. 2 is a bottom view of the LED light-emitting element lead frame according to the embodiment, and FIG. 3 is an X1-X1 cross-sectional view of FIG. 4 is a cross-sectional view taken along the line X2-X2 of FIG. 1, and is a cross-sectional view taken along the line Y-Y showing a state after the LED chip is mounted on the lead frame for an LED light emitting device according to the embodiment and wire-bonded.

  As shown in FIGS. 1 to 4, an LED light-emitting element lead frame (hereinafter simply referred to as a lead frame) 80 includes a lead frame body 1 and a filling resin 4 in which the lead frame body 1 is resin-molded. A reflector portion 70 is integrally formed with the filling resin 4.

  The lead frame main body 1 is a member formed by photoetching a plate-like base material made of a metal alloy, and supplies power to the pad portion 2 on which the LED chip 10 described later is mounted and the LED chip 10. A pair of lead portions 3 is provided.

  As shown in FIGS. 1, 3, and 5, the pad portion 2 has a front surface (upper surface) as a mounting surface A for mounting the LED chip 10, and a back surface (lower surface) opposite to the mounting surface A. ) Is the pad heat radiation surface B. The pad heat radiating surface B functions as a heat radiating part that dissipates heat from driving heat generated from the LED chip 10 and ambient environmental conditions of the LED chip 10.

  As shown in FIGS. 1, 4, and 5, the lead portion 3 is arranged at a position spaced apart from the pad portion 2 in the horizontal direction by a predetermined distance. A pair is arrange | positioned so that it may pinch | interpose. The lead portion 3 has the same thickness as the pad portion 2, and the surface (upper surface) of the lead portion 3 is a connection surface C that is electrically connected to the LED chip 10. The back surface (lower surface) on the opposite side is a lead heat radiating surface D that functions as a heat radiating portion that radiates heat generated in the lead portion 3.

Since the mounting surface A of the pad portion 2 and the connection surface C of the lead portion 3 are formed from the same plate-like base material, their vertical positions coincide with each other unless special processing is performed. That is, in the present embodiment, the mounting surface A and the connection surface C are arranged on the same plane. Similarly, the pad heat dissipation surface B of the pad portion 2 and the lead heat dissipation surface D of the lead portion 3 are also arranged on the same plane.
In addition, the connection surface C of the lead portion 3 is connected to the LED chip 10 mounted on the mounting surface A of the pad portion 2 by wire bonding or chip bonding. They are electrically connected (see FIG. 5).

  Note that the plating on the connection surface C can be freely selected from silver plating, gold plating, palladium plating, and the like according to the intended use. Further, prior to plating the connection surface C in this manner, the connection surface C may be subjected to base plating such as nickel plating having excellent thermal diffusivity.

  As shown in FIGS. 1 to 5, the filling resin 4 is filled in layers between and around the pad portion 2 and the lead portion 3. More specifically, the filling resin 4 exposes the mounting surface A of the pad portion 2 and the connection surface C of the lead portion 3 upward, and the pad heat radiating surface B of the pad portion 2 and the lead heat radiating surface D of the lead portion 3. The pad portion 2 and the lead portion 3 are integrally resin-molded in a state in which is exposed downward. A portion flush with the mounting surface A and the connection surface C in the filling resin 4 is a filling resin upper surface 4a, and a portion flush with the pad heat radiation surface B and the lead heat radiation surface D in the filling resin 4 is a filling resin lower surface 4b. It is said that.

  In the present embodiment, the resin annular portion 4c that annularly surrounds the mounting surface A and the connection surface C extends upward from the filling resin upper surface 4a. The inner peripheral surface of the resin annular portion 4c is a tapered surface having a diameter that increases upward from the filling resin upper surface 4a. The tapered surface emits light emitted from the LED chip mounted on the mounting surface A. The reflector portion 70 reflects the light. In other words, in the lead frame 80, a concave portion is formed in the upper portion of the filling resin 4 with the filling resin upper surface 4a as a bottom portion and the reflector portion 70 as an inner peripheral surface. And the connection surface C are exposed.

  Thus, in this embodiment, the lead frame 80 is formed by resin molding the lead frame main body 1 with the filling resin 4, and the reflector portion 70 is integrally formed on the surface of the filling resin 4. That is, in the lead frame main body 1, the surface of the filling resin 4 itself is configured to function as a reflector portion 70 that reflects light.

Next, the LED package 100 according to the embodiment will be described with reference to FIG. 6 is a diagram corresponding to the X1-X1 cross-sectional view of FIG. 1 in the LED package according to the embodiment.
As shown in FIG. 6, the LED package 100 includes the lead frame 80 described above, the LED chip 10, and a transparent sealing resin (sealing resin) 5.

  As described above, the LED chip 10 is electrically connected to the connection surface C of the pair of lead portions 3, and is configured to emit light upon receiving power supply when the lead portions 3 are energized.

  The transparent sealing resin 5 is a resin layered in the inside of the reflector portion 70 formed by the filling resin 4, that is, in a recess having the reflector portion 70 as an inner peripheral surface and the filling resin upper surface 4 a as a bottom portion. Thus, the mounting surface A, the connection surface C, and the LED chip 10 are sealed.

In this embodiment, an epoxy resin, a modified epoxy resin, a silicone resin, an acrylic resin, a polycarbonate resin, a polyphthalamide, or the like can be used as the transparent sealing resin 5, and two or more of these can be used. A mixed system may be used.
In addition, since the said transparent sealing resin 5 is comprised from transparent resin, even if it seals LED chip 10, the light radiated | emitted from LED chip 10 can be guide | induced to the exterior. Further, the transparent sealing resin 5 is not limited to a layer shape, and may be a dome shape, for example.

  In such an LED package 100, when the pair of lead portions 3 are energized to supply power to the LED chip 10 as shown in FIG. 7, the LED chip 10 emits light. Thereby, the light emitted from the LED chip 10 travels directly in the front direction (upward direction in FIG. 7), or travels in the front direction through reflection at the reflector unit 70.

  Moreover, in the lead frame 80 constituting the LED package 100, the surface of the filling resin 4 is the reflector part 70 that reflects the light emitted by the LED chip 10 as described above, that is, the filling resin 4 and the reflector part 70. Therefore, it is not necessary to configure a reflector for reflecting light using a separate member. Therefore, since the reflector itself is not peeled off, the durability can be improved, and the reflector part 70 can be made of the filling resin 4 itself, so that the production can be facilitated.

  Next, a method for manufacturing the lead frame 80 according to the embodiment will be described. FIG. 8 shows a process for manufacturing the lead frame 80. First, the lead frame body 1 that is a component of the lead frame 80 is manufactured.

  That is, a metal material for a lead frame made of an alloy thin film such as Fe—Ni or a metal alloy such as Cu—Ni—Sn is prepared (see FIG. 8A). Photoresist (photosensitive resin) is applied to the surface to form a resist layer, the pattern is exposed to the photoresist layer using a predetermined pattern exposure photomask, and then developed, and if necessary, a hardening process is performed. To do. As a result, as shown in FIG. 8B, the photoresist is developed and removed leaving the portions to be the pad portion 2 and the lead portion 3, and the portion forming the pad heat radiation surface B of the pad portion 2 and the lead portion 3. A resist pattern is formed at a portion where the lead heat radiation surface D is formed.

  At this time, the region where the reflector part 70 of the filling resin 4 is to be formed is arranged over a wide area where the resist pattern is not formed, and between the resist patterns in the parts which are to be the pad part 2 and the lead part 3. It is preferable that a resist pattern having a narrow range is appropriately disposed.

  Next, an etching process (half etching process) is performed on the first surface of the metal material on which the resist pattern is formed as described above using an etchant such as ferric chloride. Thus, an etching portion having a relatively small depth is formed by arranging a resist pattern having a narrow range between the portions to be the pad portion 2 and the lead portion 3. On the other hand, since the resist pattern is not formed over a wide area at the location where the reflector portion 70 is to be formed, an etched portion having a relatively large depth is formed. Thereby, as shown in FIG.8 (c), uneven | corrugated shape is formed in the 1st surface of a metal material.

  Next, as shown in FIG. 8D, the resist pattern formed on the first surface of the metal material is removed. And as shown in FIG.8 (e), it fills with the filling resin 4 or the liquid filling resin 4 which was heat-melted from the 1st surface of the metal material. When using the heated and melted filling resin 4, the following series of resin molding processes are performed.

  That is, first, the metal material after the etching processing is placed in the concave portion of the mold having the concave portion in which the metal material is accommodated. As shown in FIG. 8, the mold includes a plate-shaped upper mold 40 serving as a lid and a recess 43 capable of loading a metal material communicating with an injection port 42 for injecting molten filling resin 4. In general, the lower die 41 formed as a space has a two-piece structure, and after the metal material is loaded into the lower die 41 and the recess 43, the upper die 40 is covered with the lower die 41 and the die is clamped. Is.

  As shown in FIG. 8 (f), the uneven shape of the first surface of the metal material is filled with the filling resin by applying the filling resin 4 to the metal material in this way, and the first surface of the filling resin. The surface on the side is flush with the portions to be the pad portion 2 and the lead portion 3 in the metal material. At this time, since the depth at which the reflector portion 70 is to be formed is large by etching, a relatively large amount of the filling resin 4 is filled according to the depth.

  And after giving the process which hardens the filling resin 4, the film for corrosion prevention is apply | coated to the whole surface including the 1st surface of a metal material, and the 2nd surface located on the opposite side to the 1st surface of a metal material The metal material and the filling resin 4 are turned upside down so that is directed upward (see FIG. 8G).

  Subsequently, an etching process is performed on the second surface of the metal material using an etchant such as ferric chloride. Thereby, the metal material is dissolved from the second surface side, and the etching is continued until the filling resin 4 filling the space between the pad portion 2 and the portion to be the lead portion 3 is exposed. Thereby, the reflector part 70 of the filling resin 4 is exposed. That is, the etching forms a recess opening upward, and the mounting surface A of the pad portion 2 and the connection surface C of the lead portion 3 are exposed at the bottom of the recess, and the inner peripheral surface of the recess is upward. A lead frame 80 having a reflector portion 70 whose diameter increases toward the surface is formed.

Next, a method for manufacturing the LED package 100 will be described. First, the LED chip 10 is mounted on the mounting surface A of the pad portion 2 in the lead frame 80 manufactured as described above, and the connection surface C of the LED chip 10 and the pair of lead portions 3 and the LED chip are connected using the wire W. Wire bonding.
Then, the transparent sealing resin 5 is laminated inside the reflector part 70, and the mounting surface A, the connection surface C, and the LED chip 10 are sealed. Thereby, the LED package 100 shown in FIG. 6 is completed.

  In the manufacturing method of the lead frame 80 according to the embodiment, the location where the reflector portion 70 is to be formed when performing the etching process is compared with other locations, that is, the location where the pad portion 2 and the lead portion 3 are to be formed. By performing deep etching in comparison, the reflector portion 70 made of the filling resin 4 can be easily and simply formed. In addition, since the filling resin 4 itself plays a role as a reflector, it is not necessary to provide a separate member and the optical gain can be improved at a low cost, and the filling resin 4 and the reflector unit 70 are integrated, A lead frame 80 with high durability can be manufactured.

  Further, according to the manufacturing method of the LED package 100 according to the embodiment, the lead frame 80 manufactured by the above manufacturing method is adopted, and therefore the light from the LED chip 10 is reflected in the reflector portion 70 formed by the filling resin 4. By reflecting the light, a high optical gain can be obtained. Moreover, since a reflector can be comprised without using an additional member, durability can be improved and it can manufacture easily at low cost.

  Here, in the LED package 100, since the LED chip 10 emits light in a state of being embedded in the transparent sealing resin 5, the light emitted from the LED chip 10 is efficiently taken out from the transparent sealing resin 5 to the outside. In this case, it is important to provide a high gain. Therefore, for example, as the transparent sealing resin 5, it is a matter of course to select a resin having good transparency such as a light-transmitting acrylic resin such as polymethyl acrylate resin. It is desirable to use a resin having high reflectivity at the interface with the stop resin 5.

  In the present embodiment, since the surface of the filling resin 4 becomes the reflector portion 70, it is desirable that the filling resin 4 itself has a high reflectance, but in addition, heat resistance, light resistance, thermal conductivity, high light diffusion are provided. It is also desirable to have sex. Therefore, as the filling resin 4, for example, epoxy resin, modified epoxy resin, silicone resin, acrylic resin, polycarbonate resin, aromatic polyester resin, unsaturated polyester resin, polyphthalamide (PPA), liquid crystal polymer (LCP), etc. An organic polymer material is desirable, and a gold image resin of one kind of resin or plural kinds of resins may be used.

  Note that setting the relationship between the optical refractive index n1 of the filling resin 4 and the refractive index n2 of the transparent sealing resin 5 to n1> n2 is high at the boundary surface between the filling resin 4 and the transparent sealing resin 5. It is suitable for obtaining the reflectance, and the larger the difference in the refractive index, the higher the reflection. However, the refractive index of the resin is approximately 2 or less, and it is difficult to increase the refractive index using only the resin. Therefore, the reflector part 70 is provided in order to obtain a high reflectance effectively in this embodiment.

  Thus, in order to increase the reflectance by the reflector part 70 formed on the surface of the filling resin 4, it is preferable that an additive having a high reflectance is mixed with the filling resin 4. Thereby, since the refractive index of the filling resin 4 can be 2 or more, a high reflectance at the boundary surface between the filling resin 4 and the transparent sealing resin 5 can be obtained. Examples of the additive include fine particles such as TiO 2, SiO 2, Al 2 O 3, zirconium oxide, ceramic material, or a mixture thereof, and the mixing ratio of the additive to the filling resin 4 is, for example, 1% to 20%. Can be set.

Below, the effect by which the filling resin 4 has reflectivity is demonstrated. As shown in FIG. 7, the light emitted from the LED package 100 travels inside the transparent sealing resin 5 and is emitted to the outside. Alternatively, the light passes through the inside of the transparent sealing resin 5 through the reflection at the reflector portion 70 and is discharged to the outside. Here, a part of the light emitted from the LED chip 10 is reflected at the boundary of the transparent sealing resin 5 in contact with the outside (air). When the filling resin 4 has a high reflectance, the reflected light reflected at the boundary of the transparent sealing resin 5 can be re-reflected on the surface of the filling resin 4 to be emitted as re-reflected light. . On the other hand, when the filling resin 4 has no reflectance, the reflected light enters the filling resin as it is, and the light emitted from the LED chip 10 cannot be guided to the outside.
Thus, by making the filling resin 4 have a high reflectance, it is possible to efficiently emit light emitted from the LED chip 10 to the outside. Thereby, the optical gain of the LED chip 10 can be improved.

  In addition, when metal plating is performed on the mounting surface A in the pad portion 2 and the connection surface C in the lead portion 3, the reflected light can be re-reflected on the plating surface, so that the light emitted from the LED chip 10 can be further reduced. It can be used efficiently.

  It is also effective to improve the light utilization efficiency by coating the surface of the reflector portion 70 of the filling resin 4 with a ceramic ink or the like having excellent light reflectivity to form a reflective film.

  In addition, when manufacturing the said lead frame 80, you may manufacture using the multi-sided lead frame 50 as shown, for example in FIG. Hereinafter, the multi-sided lead frame 50 will be described.

  The multi-sided lead frame 50 is configured such that unit frames 60 each composed of one pad portion 2 and a pair of lead portions 3 are multi-sidedly arranged in a two-dimensional vertical and horizontal direction with respect to the tie bar 30.

As shown in FIG. 9, the tie bar 30 has a lattice-like frame shape, and the unit frames 60 are housed in openings of the tie bar 30, that is, through portions in the lattice. Each unit frame 60 is connected to the tie bar 30 via the suspension leads 31 formed on the pad portion 2 and the lead portion 3 of the unit frame 60.
Here, the unit frame 60 is connected to the tie bar 30 via the suspension lead 31, but the present invention is not limited to this, and the pad portion 2 and the lead portion 3 are directly connected to the tie bar 30. The unit frame 60 may be connected to the tie bar 30.

  When the pad portion 2 and the lead portion 3 are formed by etching, the tie bar 30 and the suspension lead 31 are connected to the tie bar 30 and the suspension lead 31 in the same manner as the method of forming the pad portion 2 and the lead portion 3. Molding is performed by forming a photoresist on the metal material to be formed. Then, the unit frame 60 is separated by cutting and cutting the tie bar 30 or the suspension lead 31.

  As shown in FIG. 10A, the thickness of the pad portion 2 and the lead portion 3 in each unit frame 60 is set to t1 which is the same as the thickness of the metal material forming the multi-faced lead frame 50. On the other hand, the thickness of the tie bar 30 and the suspension lead 31 is set to be smaller than the thickness t1 of the pad portion 2 and the lead portion 3.

  In order to form the tie bar 30 and the suspension lead 31 that are thinner than the pad portion 2 and the lead portion 3 in this way, the suspension lead is formed when the pad portion 2 and the lead portion 3 are formed by etching a metal material. 31 and a tie bar 30 are formed on one surface side (for example, the back surface side) of a metal material portion that can become a tie bar 30 and a tie bar 30 formation resist, and then a pad portion 2 and a lead portion 3 are formed. This can be realized by performing half-etching for both sides of the metal material.

  The multi-sided lead frame 50 molded by etching in this way is filled into a mold for resin molding, and then the filled resin 4 is injected into a recess (internal space) in the mold. Filled. As a result, a resin mold in which the mounting surface A and the connection surface C, and the pad heat dissipation surface B and the lead heat dissipation surface D are exposed from the filling resin 4 is applied.

  Thereafter, the multi-sided lead frame 50 is cut, and each unit frame 60 is separated from the tie bar 30. The cutting time of the unit frame 60 is not limited to after resin molding, and may be set as appropriate after mounting the LED chip 10 or after forming a transparent sealing resin.

  Here, when resin molding is applied to the multifaceted lead frame 50, the filling resin 4 is injected into a mold having a recess (internal space). When the filling resin 4 is injected, the filling resin 4 sequentially flows from the unit frame 60 in the vicinity of the injection port of the filling resin 4 to the unit frame 60 located at a part away from the injection port, and the whole is resin-molded. To go.

  At this time, in the multi-sided lead frame 50 having the above-described configuration, the front surface (mounting surface A, connection surface C) and back surface (pad heat dissipation surface B, lead heat dissipation surface D) are respectively from the front surface or back surface of the filling resin 4. The exposed structure. Therefore, the depth of the concave portion of the mold (the thickness of the internal space) needs to be substantially the same as the thickness of the multi-sided lead frame 50 so that the filling resin 4 does not adhere to the front and back surfaces of the multi-sided lead frame 50. is there. That is, by making the depth of the concave portion of the mold substantially the same as the thickness of the multi-faced lead frame 50, when the lead frame is filled in the mold, the front and back surfaces of the multi-faced lead frame 50 are respectively placed on the upper metal. It can be in close contact with the mold and the lower mold. Thereby, when the multi-sided lead frame 50 is inserted into the concave portion of the mold, it is possible to prevent the filling resin from adhering to the front and back surfaces of the multi-sided lead frame 50.

  For this reason, for example, when the thickness of the suspension lead 31 and the tie bar 30 is the same as the thickness of the multi-faced lead frame 50, the suspension lead 31 and the tie bar 30 prevent or block the flow of the filling resin 4. It will be. As a result, the filled resin 4 does not spread over the entire multi-faced lead frame 50, and a portion that is not resin-molded is generated. Thus, the site | part which was not filled with the filling resin 4 turns into a site | part which has a bubble, and will lead to the quality as the LED package 100 falling.

  In this regard, in the above-described multi-faced lead frame 50, the thickness of the suspension lead 31 and the tie bar 30 is set to be approximately the same as the thickness of the lower structure portions 2b and 3b of the pad portion 2 and the lead portion 3, for example. Since the filler resin 4 is formed thin, the filler resin 4 is formed between the suspension lead 31 and the tie bar 30 and the mold when the filler resin 4 is injected, and flows through the gap. Therefore, the flow of the filling resin 4 is not hindered or blocked. As a result, the quality of the LED package 100 can be improved. Further, since there are no defective products, the manufacturing yield is increased, and as a result, the manufacturing cost of the LED package 100 can be reduced. Furthermore, there is a merit that the cutting can be easily performed by the amount that the thickness of the suspension lead 31 and the tie bar 30 is reduced.

  As mentioned above, although embodiment of this invention was described in detail, unless it deviates from the technical idea of this invention, it is not limited to these, A some design change etc. are possible.

1 Lead frame body
2 Pad part
3 Lead part
4 Filling resin
5 Transparent sealing resin
10 LED chip
30 tie bars
31 Hanging lead
40 Upper mold
41 Lower mold
42 Inlet
43 recess
50 Multi-faceted lead frame
60 unit frames
70 Reflector section
80 Lead frame for LED light-emitting elements (lead frame)
100 LED package
A Mounting surface
B Pad heat dissipation surface
C Connection surface
D Lead heat dissipation surface

Claims (4)

A pad portion having a mounting surface on which an LED chip is mounted; a lead portion having a connection surface disposed substantially parallel to the mounting surface and electrically connected to the LED chip; the mounting surface and the connection surface; A filling resin that resin-molds the pad portion and the lead portion in an exposed state, and the mounting surface and the connection surface are annularly surrounded on the surface of the filling resin so as to expand the diameter upward. A method for manufacturing a lead frame for an LED light-emitting element having a reflector portion inclined to the surface,
Applying a resist on the first surface of the metal plate where the pad portion and the lead portion are to be formed;
Etching the first surface using the resist as a mask, and etching the portion where the reflector portion is to be formed deeper than other locations;
Filling and curing a filling resin from the first surface;
And a step of exposing the mounting surface, the connecting surface, and the reflector portion made of the filling resin by performing an etching process from a second surface located on the opposite side of the first surface. Of manufacturing leadframes for use in a car. The method for manufacturing a lead frame for an LED light-emitting element according to claim 1 , wherein a light-reflective additive is added to the filling resin. After exposing the reflector portion, the manufacturing method of the LED light emitting element lead frame according to claim 1 or 2, characterized in that it comprises the step of providing a reflective film covering the reflector portion. A step of mounting an LED chip on the mounting surface of the LED light emitting element seed frame manufactured by the LED light emitting element lead frame according to any one of claims 1 to 3 ,
A method of manufacturing an LED package comprising: a step of laminating a sealing resin inside the reflector portion by the filling resin, and sealing the LED chip, the mounting surface, and the connection surface.

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