JP5375292B2 - Image sensor module and method of manufacturing image sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize an imaging element module by utilizing a region in the module. <P>SOLUTION: The imaging element module includes: a first wiring board equipped with a wiring pattern having a land on a first surface side wherein the land is disposed on the circumferential edge of the first surface; a solid-state imaging element chip which is provided on the first surface so that a functional surface is directed to the side opposite to the first wiring board side; a second wiring board which has a conductor portion on a first end surface out of substantially rectangular plate-like first and second end surfaces opposing to each other and other third and fourth end surfaces opposing to each other, and is erected near the circumferential edge of the first surface via an electrically connectable adhesive so as to allow the first end surface to be directed to the first surface side so that the conductor portion may be electrically and mechanically connected to the land; and a lens support portion which supports the position of a lens provided oppositely to the light receiving section of the solid-state imaging element chip, and has a recess for fitting the second wiring board following second, third and fourth end surfaces of the second wiring board in an upright portion like a wall from the vicinity of the circumferential edge of the first surface. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an image sensor module having a solid-state image sensor chip and a wiring board and a method for manufacturing the same, and more particularly to an image sensor module suitable for miniaturization and a method for manufacturing the same.

  In recent years, many portable electronic devices such as cellular phones and portable PCs include an imaging input unit. The imaging input unit mainly includes a wiring board on which a solid-state imaging device chip and its peripheral components are mounted, and a lens unit (hereinafter, the imaging input unit as a component is referred to as an “imaging device module”). In such an image sensor module of a portable electronic device, it is generally required that the image sensor module can be accommodated in a smaller space and can cope with imaging with a larger number of pixels. In recent years, solid-state image sensor chips having 5 million pixels or 8 million pixels have been put on the market. The wiring board is designed to be miniaturized by multilayering, high-density layout of patterns, built-in components, and the like.

  Japanese Patent Application Laid-Open No. 2004-120615 discloses an image sensor module technology. In this disclosure, a wiring board having peripheral components on the outer periphery of the solid-state imaging device chip is used. In such a configuration, if the chip size is increased by increasing the number of pixels of the solid-state imaging device chip, the overall size of the two-dimensional image inevitably increases. Further, since the wiring board bears all the peripheral circuit portions required as a module, the number of layers tends to increase, and as a result, the size of the module in the thickness direction does not decrease much.

JP 2004-120615 A

  The present invention has been made in consideration of the above circumstances, and in an imaging element module having a solid-state imaging element chip and a wiring board and a method for manufacturing the imaging element module, the area in the module can be utilized to contribute to miniaturization. An object of the present invention is to provide a possible image sensor module and a method for manufacturing the same.

  In order to solve the above-described problem, an imaging element module which is one embodiment of the present invention has a first surface and a second surface, and includes a wiring pattern having a first land and a second land. A functional surface including a first wiring board provided on a first surface side, wherein the first land is disposed near a periphery of the first surface, a light receiving portion, and a terminal pad; A solid-state imaging device chip provided on the first surface of the first wiring board with a functional surface facing away from the first wiring board, and a substantially rectangular plate shape The plate-shaped opposing end surfaces are respectively the first end surface, the second end surface, and the other opposing end surfaces are the third end surface and the fourth end surface, respectively, and a conductor portion is provided on the first end surface. The conductor portion is electrically and mechanically connected to the first land of the wiring pattern of the first wiring board. 1 through an adhesive that is electrically connected to the first surface of the first wiring board close to the periphery of the first surface with the end face side of the first wiring board facing the first surface side of the first wiring board. A second wiring board standing upright, a lens provided facing the light receiving portion of the solid-state image sensor chip, a position of the lens relative to the solid-state image sensor, and the first A rising portion that rises in the shape of a wall from the vicinity of the periphery of the first surface is provided along the periphery of the first surface of the wiring board, and the rising portions are the second and third portions of the second wiring board. , A lens support portion having a recess for fitting the second wiring board along the fourth end face, the terminal pads of the solid-state imaging device chip, and the wiring pattern of the first wiring board. And a bonding wire for electrically connecting the two lands.

  That is, in this imaging element module, the peripheral circuit portion required as a module is erected on the first wiring board located below the solid-state imaging element chip and on the vicinity of the periphery of the first wiring board. It can be shared with the two wiring boards. Therefore, it is possible to reduce the size of the first wiring board that controls the two-dimensional size as a module. Further, the circuit pattern configuration necessary for the first wiring board is also reduced, and the thickness of the first wiring board can be reduced by reducing the number of wiring layers.

  On the other hand, the second wiring board, which is introduced along with the simplification of the first wiring board and is erected on the vicinity of the periphery of the first wiring board, is provided so as to be fitted into the recessed portion of the rising portion of the lens support portion. Therefore, the light receiving function as a module is not harmed. Further, even if a concave portion is provided in the upright portion of the lens support portion and the second wiring board is fitted therein, the thickness does not increase as a module.

  Therefore, the imaging device module is realized by utilizing the area in the module to reduce the size.

  According to another aspect of the present invention, there is provided a method for manufacturing an imaging element module, comprising: a lens; a ceiling portion that supports a periphery of the lens; and an upright portion that rises downward from the periphery of the ceiling portion. A step of forming a downward tray-shaped lens unit having a rectangular concave portion, and a substantially rectangular plate shape, and the opposing end surfaces of the plate shape are respectively a first end surface, a second end surface, Separately facing end surfaces are a third end surface and a fourth end surface, respectively, and the second, third, and fourth end surfaces of the wiring board having a conductor portion on the first end surface and the lens unit are provided. A step of fitting the wiring board into the recess so that the end surface of the recess of the standing portion faces the surface, and fixing the second, third, and fourth end surfaces and the end surface of the recess with an adhesive; A wiring pattern having a first surface and a second surface and having a land. A solid-state imaging device chip that is provided on the first surface side, the land is disposed near the periphery of the first surface, and the functional surface is provided upward is provided substantially at the center of the first surface. Forming a separate wiring board, and electrically connecting the conductor portion of the first end of the wiring board fixed to the lens unit and the land of the wiring pattern of the separate wiring board. The lens unit is mechanically connected via an adhesive that can be electrically connected to the other wiring board with the end surface of the standing portion of the lens unit facing the other wiring board. And a fixing step.

  This manufacturing method is one method for manufacturing the above-described imaging element module. In this method, first, the wiring board is fixed by being fitted into the concave portion of the lens unit, and then the lens unit is fixed on another wiring board provided with the solid-state imaging device. According to this, since the wiring board can be erected on another wiring board at the same time as the lens unit is attached to another wiring board, there is an advantage that it is efficient. In addition, it is possible to provide a method for manufacturing an image sensor module that can contribute to downsizing by utilizing the area in the module.

  According to the present invention, an imaging device module having a solid-state imaging device chip and a wiring board and a method for manufacturing the imaging device module and a method for manufacturing the imaging device module that can contribute to downsizing by utilizing an area in the module. Can be provided.

1A and 1B are a longitudinal sectional view and a side view schematically showing a configuration of an image sensor module according to an embodiment of the present invention. Process drawing which shows typically the main processes which manufacture the image pick-up element module shown in FIG. FIG. 3 is a continuation diagram of FIG. 2, and is a process diagram schematically showing a process of manufacturing the image sensor module shown in FIG. 1. Sectional drawing which shows typically the example of a specific structure of the wiring board 10 shown in FIG. Sectional drawing which shows typically the example of a specific structure of the wiring board 20 shown in FIG. Sectional drawing which shows typically another example of the specific structure of the wiring board 20 shown in FIG. Sectional drawing which shows typically another example of the specific structure of the wiring board 20 shown in FIG.

  As an embodiment of the present invention, an adhesive is interposed between the second, third, and fourth end surfaces of the second wiring board and the end surface of the recessed portion of the standing portion of the lens holding portion. It can be said. According to such a configuration, the second wiring board has a surface covered with any member without exposing all of the first, second, third, and fourth end faces to the air. Is possible. On these end faces, dust may be generated due to dicing during manufacture, and the dust generation may be an optical contamination source for the light receiving surface of the solid-state image sensor chip. Therefore, according to this configuration, it is preferable that all end surfaces as a contamination source can be sealed.

  Further, as an embodiment, the lens support portion includes an actuator that adjusts the position of the lens, and the actuator provided on an end surface of the recess facing the second end surface of the second wiring board. An electrical end electrically connected, and the second wiring board includes a second conductor portion on the second end face, and the electrical end of the concave portion of the lens support portion and the second end It can be assumed that an electrically connectable adhesive is interposed between the second conductor portion on the second end face of the wiring board. According to such a configuration, the electrical connection from (to) the actuator of the lens can be made via the second (first) wiring board and the first (second) wiring board. Therefore, a compact unit is realized as a whole.

  Further, as an embodiment, the first wiring board has a substantially rectangular plate shape, and the second wiring board is disposed on each of two or more sides of the rectangle of the first wiring board. It can be assumed that a plurality exist along the same line. If the second wiring board is provided in this way, the total area of the second wiring board is increased, and the use of the region in the module can be further promoted.

  Further, as an embodiment, the adhesive that erects the second wiring board on the first surface of the first wiring board is derived from an anisotropic conductive film or an anisotropic conductive paste. And can be. The anisotropic conductive film or anisotropic conductive paste can be electrically connected and at the same time mechanically connected by its resin component, and is suitable for such adhesion and fixation.

  As an embodiment, the adhesive interposed between the electrical end of the concave portion of the lens support portion and the second conductor portion on the second end surface of the second wiring board is provided. , Derived from an anisotropic conductive paste or an anisotropic conductive film. Similarly to the above, the anisotropic conductive paste or anisotropic conductive film can be electrically connected and at the same time mechanically connected by the resin component, and is suitable for such adhesion and fixing. ing.

  As an embodiment, the second wiring board may be a wiring board on which a component is mounted by being embedded on the main surface of the second wiring board. By mounting components on the second wiring board, it is possible to reduce the burden of component mounting on the first wiring board. Thereby, the further miniaturization of the 1st wiring board which controls the two-dimensional magnitude | size as a module is possible.

  As an embodiment, the first wiring board may include a second wiring pattern having a third land for external connection on the second surface of the first wiring board. . By providing the external connection lands on the back surface of the first wiring board in this manner, for example, a separate substrate or a lead frame is unnecessary as a member for external connection, which is preferable for downsizing of the module.

  As an embodiment, the first wiring board or the second wiring board may include a vertical electrical connection path having a conductive composition. The vertical electrical connection path having the conductive composition can be formed in a smaller area than the vertical electrical connection path by the plating layer using the through hole, and can contribute to miniaturization as a module. It is also suitable for more complex pattern design.

  Further, as an embodiment, there is provided a through-hole conductor in which the conductor portion on the first end face of the second wiring board is formed on the second wiring board and has a plating layer on an inner wall surface. It may have a cross section that appears by cutting vertically. This is one configuration for providing a conductor portion on the first end face of the second wiring board. In this case, the configuration is simple including the manufacturing process. The same applies to the second conductor portion on the second end face of the second wiring board.

  Further, as an embodiment, a plating layer is formed on an inner wall surface formed by embedding the conductor portion on the first end face of the second wiring board within the thickness of the second wiring board. The through-hole conductor provided may have a cross section that appears by cutting vertically. This is another configuration for providing a conductor portion on the first end face of the second wiring board. When the second wiring board is, for example, a multilayer wiring board, such a configuration can be used. The same applies to the second conductor portion on the second end face of the second wiring board.

  Further, as an embodiment, the conductor portion on the first end face of the second wiring board is formed by vertically extending a through-hole conductor filled with a conductive composition formed on the second wiring board. It may have a cross section that appears after cutting. This is still another configuration for providing a conductor portion on the first end face of the second wiring board. In this case, the cross-sectional area of the conductor portion on the first end face can be ensured larger and more reliably, and the reliability of electrical connection with the film-like wiring board can be improved. The same applies to the second conductor portion on the second end face of the second wiring board.

  Further, as an embodiment, the conductive composition on the first end face of the second wiring board is vertically cut through the conductive composition formed through a part of the second wiring board in the plate thickness direction. And having a cross section that appears. In this case, the conductive composition can be formed in a region smaller than the vertical electrical connection path by the plating layer using the through hole, which is suitable for downsizing the second wiring board and more complicated pattern design. Yes. Moreover, the cross-sectional area of the conductor part on a 1st end surface can be ensured more reliably, and the reliability of electrical connection with a film-form wiring board can be improved. The same applies to the second conductor portion on the second end face of the second wiring board.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view and a side view schematically showing a configuration of an image sensor module according to an embodiment of the present invention. FIG. 1B shows a side surface viewed from the position A-Aa in FIG. As shown in FIG. 1, the imaging element module includes a wiring board 10, a wiring board 20, a solid-state imaging element chip 30, a bonding wire 41, an anisotropic conductive film 51, an adhesive 52, and an anisotropic conductive paste 53. The lens unit 60 is included.

  The wiring board 10 includes at least a wiring pattern on the front surface including the lands 11 and 12 and a wiring pattern on the back surface including the lands 13 and has a substantially rectangular plate shape. These wiring patterns are electrically connectable. The wiring board 20 has a wiring pattern on the front surface (and the back surface), and has a component (surface mounted passive element component) 21 mounted on the surface of the wiring pattern. The solid-state imaging device chip 30 includes a light receiving unit 31, and a terminal pad 32 is positioned near the surface end of the surface on which the light receiving unit 31 is provided.

  Between the wiring board 10 and the solid-state image sensor chip 30, an adhesive layer (not shown) is disposed and fixed therebetween. The wiring board 20 has a substantially rectangular plate shape, and one side of the opposing end face faces the wiring board 10 and stands near the periphery of the wiring board 10. In the present embodiment, in particular, the two wiring boards 20 are erected along the two opposing sides of the rectangle of the wiring board 10.

  Between the lower end face of the wiring board 20 and the wiring board 10, there is a layer of an anisotropic conductive film 51, and a conductor (not shown) provided on the lower end face of the wiring board 20 and the wiring board 10. Are electrically and mechanically connected to the lands 12 provided on the ground. Further, with respect to the wiring board 20 on the right side of FIG. 1A, anisotropic conduction is provided between the upper end face of the wiring board 20 and the back end face of the recess for fitting the wiring board 20 provided in the lens unit 60. There is a layer of conductive paste 53, and an electrical and mechanical gap is formed between a conductor (not shown) provided on the upper end face of the wiring board 20 and an electric end 63 provided on the rear end face of the concave portion of the lens unit 60. Connected to.

  There are solder resist layers (not shown) on the front and back surfaces of the wiring board 10 and the wiring board 20, respectively. This solder resist layer is a protective film formed on the entire surface except on lands to which conductive materials such as solder, bonding wires, and anisotropic conductive films can be connected. A more specific example of the configuration of the wiring board 10 and the wiring board 20 will be described later (FIGS. 4 to 7).

  The wiring board 10 functions as a substrate on which the solid-state image sensor chip 30 is placed and held at substantially the center of the surface, and electrically connects the land 11 from the terminal pad 32 of the solid-state image sensor chip 30 via the bonding wires 41. It is an intermediary board that mediates the route to the land 13 after passing through. The land 13 becomes a terminal for external connection as the image sensor module. If the terminals for external connection are provided on the wiring board 10 in this way, the module can be made compact. Lands 11 and 12 are provided around the solid-state imaging device chip 30 of the wiring board 10 and near the periphery of the wiring board 10, respectively.

  The wiring board 20 is a component mounting board erected on the vicinity of the periphery of the wiring board 10 via an anisotropic conductive film 51. The wiring board 20 is electrically connected to the land 11 on the wiring board 10 via the anisotropic conductive film 51. Therefore, a conductor portion (not shown) is disposed on the lower end surface of the wiring board 20. The form of component mounting on the wiring board 20 is not limited to the form in which the component 21 is mounted on the surface thereof, and may be provided in the board (embedded). In addition, the wiring board 20 may be provided with a conductor portion (not shown) on the upper end surface thereof. In that case, the back of the concave portion of the lens unit 60 is interposed via the anisotropic conductive paste 53. It is electrically connected to an electrical end 63 provided on the side end face. For this reason, a conductor portion (not shown) may be disposed on the upper end surface of the wiring board 20.

  In addition, the wiring board 20 has an end face when the conductor portion is not provided on the upper end face, and the left and right end faces shown in FIG. 1B for fitting the wiring board 20 provided in the lens unit 60. It is bonded to the end surface of the recess with an adhesive 52. Therefore, all four end surfaces of the wiring board 20 are not exposed to the air and are covered with a member having an adhesive component. If all the end surfaces are covered in this way, when dust is generated on the end surface of the wiring board 20, the effect of eliminating the cause of scattering the dust on the light receiving unit 31 is enhanced.

  Dust generation on the end face of the wiring board 20 may occur depending on the manufacturing process. The wiring board 20 has a plate-like size of, for example, about 10 mm × 3 to 4 mm, and is separated into pieces by dicing in a process near the end of manufacture in consideration of productivity. When dicing is used, small pieces of cured resin remain on the cut surface. Even if it is stable at first, it may become dust after assembly as an image sensor module, and may float over time. If it adheres to the light receiving portion 31 of the solid-state image sensor chip 30, an optical defect will occur. Can be a source. In particular, in recent years, the size of the photoelectric conversion element formed in the light receiving unit 31 is very small, and dust can be a relatively large defect source as an imaging element module.

  The solid-state imaging device chip 30 has a light receiving portion 31 in which photoelectric conversion elements are integrated and formed in an array on the functional surface, and a circuit for controlling and driving the elements of the light receiving portion 31 is further integrated on the functional surface. A formed region (hereinafter, sometimes referred to as a non-light receiving portion) is also secured. The light receiving part 31 is located at the approximate center of the functional surface, and the non-light receiving part is located in a frame shape surrounding the light receiving part 31 when seen in a plan view. A terminal pad 32 that is a terminal of the solid-state imaging device chip 30 is formed in the vicinity of the outer end portion of the non-light receiving portion.

  The bonding wire 41 is a member that electrically connects the terminal pad 32 of the solid-state imaging device chip 30 and the land 11 of the wiring board 10. The bonding wire 41 is made of, for example, gold (Au), and a known gold bonding technique can be used for connection to the terminal pad 32 and the land 11.

  The anisotropic conductive film 51 electrically conducts the land 12 provided on the wiring board 10 and the conductor portion (not shown) provided on the lower end face of the wiring board 20. Further, mechanically, the wiring board 10 and the lower end face of the wiring board 20 are fixed by the adhesive resin component contained therein. The anisotropic conductive film 51 also functions as a member that mechanically fixes the lower end surface of the lens unit 60 facing the wiring board 10 and the wiring board 10. The anisotropic conductive film 51 can be replaced with an anisotropic conductive paste having a similar function. Furthermore, it is also possible to connect the land 12 and the conductor part provided in the lower end surface of the wiring board 20 using solder, for example. When an anisotropic conductive film or an anisotropic conductive paste is used, it is more effective as a measure against dust generation on the end face of the wiring board 20 as described above.

  The adhesive 52 is used to fit the wiring board 20 provided on the lens unit 60 and the upper and lower end faces when the conductor portion is not provided on the left and right end faces of the wiring board 20 and the upper end face of the wiring board 20. It fixes between each end surface of a recessed part.

  The anisotropic conductive paste 53 electrically conducts an electrical end 63 provided on the lens unit 60 and a conductor portion (not shown) provided on the upper end surface of the wiring board 20. Further, mechanically, the inner side end face of the recess for fitting the wiring board 20 provided in the lens unit 60 and the upper end face of the wiring board 20 are fixed to each other by the contained adhesive resin component. The anisotropic conductive paste 53 can be replaced with an anisotropic conductive film having a similar function. Furthermore, it is also possible to connect the electrical end 63 and the conductor portion provided on the upper end surface of the wiring board 20 using, for example, solder. When an anisotropic conductive film or an anisotropic conductive paste is used, it is more effective as a measure against dust generation on the end face of the wiring board 20 as described above.

  The lens unit 60 includes a lens 61, an actuator 62, an electrical end 63, and a lens holding portion that is a supporting member of these lenses. The lens holding part has a ceiling part (for example, made of resin) that supports the periphery of the lens 61 and an upright part (for example, made of resin) that stands downward from the periphery of the ceiling part. Holds the position of the lens 61 such that the position of the lens 61 is a desired distance from the light receiving unit 31 of the solid-state imaging device chip 30. Further, the standing portion of the lens holding portion can be regarded as a member that rises in a wall shape from the vicinity of the periphery along the periphery of the wiring board 10 as a module.

  A recessed portion for fitting the wiring board 20 is provided along the three end faces of the wiring board 20 in the standing part of the lens holding part. Thus, by the lens unit 60 having the tray-shaped lens holding portion and the wiring board 20 fitted therein, the space to which the light receiving portion 31 of the solid-state imaging device 30 is exposed becomes a space blocked from the outside world. The effect of protecting the portion 31 from dust and the like can be enhanced.

  The lens 61 is positioned by the lens holding unit so that the optical axis thereof is orthogonal to the surface of the light receiving unit 31 of the solid-state imaging device chip 30 and guides light from the side opposite to the side where the solid-state imaging device chip 30 is provided. Thus, an image is formed on the light receiving unit 31. Actually, it is not a single-lens configuration as shown, but a configuration in which a plurality of lenses are superimposed. The actuator 62 of the lens unit 60 is a drive element such as a piezo element or a voice coil motor for adjusting the mechanical position of the lens 61 (a part of the lenses). The position of the lens 61 (a part of the lenses) can be adjusted by the actuator 62 to realize, for example, an autofocus or zoom function.

  In order to send a control electric signal to the actuator 62 and to take out a position information signal of the lens 61 whose position is adjusted by the actuator 62 in some cases, the actuator 62 has a rear end surface of the concave portion for fitting the wiring board 20 in the lens holding portion. Is electrically connected to an electrical end 63 provided in the. The electrical end 63 is electrically connected to the wiring board 20 via the anisotropic conductive paste 53, and further electrically connected to the wiring board 10 via the anisotropic conductive film 51 via the wiring board 20. Connected. A circuit for controlling the actuator 62 can also be provided on the wiring board 20, thereby realizing a compact and high function module.

  In the imaging element module described above, a part of the functions that the wiring board 10 located under the solid-state imaging element chip 30 should bear is transferred to the wiring board 20. That is, the peripheral circuit portion of the solid-state image sensor chip 30 necessary as a module is provided on the wiring board 20. Therefore, the wiring board 10 can be made smaller. Since the wiring board 10 dominates the planar area of the module as can be seen in the figure, the effect of miniaturizing the module by providing the wiring board 20 is great.

  In addition, the pattern design of the wiring board 10 can be made simpler. For this reason, use of a wiring board with many wiring layers can be avoided. Thereby, the wiring board 10 can be made thin, and it can contribute also to thickness reduction (low profile) as a module. The wiring board 20 is provided by forming a recess in the standing part which is a part of the lens holding part and fitting into the recess. Since it is arranged in a space that can be said to be a conventional dead space, it does not cause any increase in size as a module.

  As described above, the size of the image pickup device module is reduced both in plan and in the thickness direction.

  In addition, as shown in FIG. 1, various aspects can be considered besides providing two wiring boards 20 at positions facing the periphery of the wiring board 10. For example, an aspect in which only one sheet is provided, an aspect in which four sheets are provided along the peripheral edges of the four sides of the wiring board 10, an aspect in which three sheets excluding any one of these four sheets are provided, and among the three sheets An example of providing two sheets excluding any one of the above can be illustrated. It can be determined according to the required component mounting scale.

  Next, a process for manufacturing the image sensor module shown in FIG. 1 will be described with reference to FIGS. 2 and 3 are process diagrams schematically showing main processes for manufacturing the image pickup device module shown in FIG. 1, and the same components as those shown in FIG. is there. In addition, it is illustration from the side surface similar to FIG.1 (b).

  First, as shown in FIG. 2 (a), it has a lens (not shown in the figure), a ceiling part that supports the periphery of the lens, and an upright part that stands downward from the periphery of the ceiling part. This upright portion forms a downward tray-like lens unit 60 having a rectangular recess 64. The lens unit 60 is already provided with an actuator 62 and an electric end 63. When the material of the ceiling part and the standing part is made of resin, the lens unit 60 can be manufactured as a shape having the recess 64 by a mold. Alternatively, a downward tray-like lens unit having no concave portion may be formed, and the concave portion 64 may be provided by performing a deletion process.

  Next, as shown in FIG. 2B, the anisotropic conductive paste 53 </ b> A before curing is cured on the back end surface of the concave portion 64 of the lens unit 60, and cured on the side end surface of the concave portion 64. The previous adhesive 52A is applied using, for example, a dispenser. Subsequently, as shown in FIG. 2 (c), the wiring board 20 is inserted while being pressed in the depth direction of the concave portion 64, and the anisotropic conductive paste 53A and the adhesive 52A are cured by, for example, heat, and each is anisotropic. A layer of conductive paste 53 and adhesive 52 is formed.

  On the other hand, on the side of the wiring board 10, as shown in FIG. 3A, the solid-state imaging device chip 30 is fixed almost at the center on the wiring board 10, and the bonding wire 41 is provided in the state already described. And the anisotropic conductive film 51A before hardening is mounted in the position facing the end surface of the lens unit 60 and the wiring board 20 on the wiring board 10. FIG. In addition, about the peripheral part which does not oppose the end surface of the wiring board 20 among the peripheral edges of the wiring board 10, it replaces with the anisotropic conductive film 51A and you may use and apply a normal adhesive agent.

  Next, as shown in FIG. 3B, the lens unit 60 in which the wiring board 20 is fixed and fitted is pressed onto the wiring board 10 on which the anisotropic conductive film 51A is arranged. And as already shown in FIG. 1, the anisotropic conductive film 51 is hardened with heat, for example, and the layer of the anisotropic conductive film 51 is formed.

  The manufacturing method described above has an advantage that the electrical and mechanical connection steps between the wiring board 10 and the wiring board 20 can be easily performed. That is, for example, when only the wiring board 20 is mounted on the wiring board 10, it may be difficult to ensure the verticality. If the verticality is deviated, a positional deviation between the wiring board 20 and the concave portion 64 provided in the lens unit 60 occurs, and not only the appearance is deteriorated, but also the electrical connection between the upper end face of the wiring board 20 and the rear end face of the concave portion 64. Connections may be lost. According to the above-described process, such inconvenience does not occur.

  Next, FIG. 4 is a cross-sectional view schematically showing a specific configuration example of the wiring board 10 shown in FIG. 4, the same components as those shown in FIG. 1 are denoted by the same reference numerals. The wiring board 10 used in the image sensor module shown in FIG. 1 is not limited to the one shown in FIG. However, it will be described as an example. In FIG. 4, solder resists 17 and 18 that are not shown in FIG. 1 and the internal structure of the wiring board 10 are shown.

  The wiring board 10 includes a wiring pattern on the front surface including the lands 11 and 12, a wiring pattern on the back surface including the lands 13, the wiring layers 141 and 161 on the inner layer, the insulating layers 14 and 15, and the interlayer connector 14a. 15a, 16a, solder resist 17, and 18. Therefore, the wiring board 10 is a four-layer board having four wiring layers separated by the insulating layers 14, 15, and 16.

  The insulating layers 14, 15, and 16 are rigid layers made of, for example, glass epoxy resin. The wiring pattern on the front surface including the lands 11 and 12, the wiring pattern on the back surface including the lands 13, and the wiring layers 141 and 161 on the inner layer are obtained by, for example, patterning a copper foil as desired by a well-known photolithography technique. Layer. The interlayer connectors 14a, 15a, and 16a are conductive composition connectors that pass through the insulating layers 14, 15, and 16 and are sandwiched between wiring patterns, respectively. Functions as a road. The solder resists 17 and 18 are protective films formed entirely on the insulating layer 14 or the insulating layer 16 except on the lands to which solder or bonding wires can be connected.

  The manufacturing process will be briefly described. First, a wiring pattern including lands 13, a wiring layer 141, an insulating layer 14, a partial stacked body including an interlayer connection 14 a, a wiring pattern including lands 11 and 12, a wiring layer 161, and an insulating layer 16 and a partial laminated body having an interlayer connector 16a. In the former partial laminated body, first, a paste-like conductive composition (a fine silver particle, for example, is dispersed in a resin) to be the interlayer connector 14a on the copper foil to be the wiring layer 141. The composition is printed in the form of bumps.

  Subsequently, the conductive composition is dried and cured, and a prepreg to be the insulating layer 14 is laminated on the copper foil so as to penetrate the bumps of the conductive composition. Then, another copper foil to be a wiring pattern including the land 13 is laminated on the prepreg so as to cover the head of the penetrating bump. Further, in this state, the prepreg is cured by compressing and pressing in the laminating direction and heated to be integrated into a partial laminated body centered on the insulating layer 14. Thereafter, the copper foils on both sides of the partial laminate are patterned to form a wiring pattern including the land 13 and a wiring layer 141. A partial laminate having the wiring pattern including the lands 11 and 12, the wiring layer 161, the insulating layer 16, and the interlayer connector 16a can be formed in the same manner.

  In the partial laminated body centering on the insulating layer 14, after patterning the copper foils on both sides, a paste-like conductive composition to be the interlayer connection body 15 a is formed in a bump shape at a predetermined position on the wiring layer 141. Printed on. Subsequently, the conductive composition is dried and cured, and a prepreg to be the insulating layer 15 is laminated on the partial laminate so as to penetrate the bumps of the conductive composition.

  And the latter partial laminated body mentioned above is laminated | stacked on the prepreg which should be used as the insulating layer 15, so that it may cover the head of the penetrated bump. Further, in this state, the prepreg that should be made into the insulating layer 15 is compressed and pressurized in the laminating direction and heated to be integrated to obtain a laminated body having three insulating layers. Thereafter, layers of solder resists 17 and 18 are formed on both sides of the laminate, and finished to a wiring board 10 as shown in FIG.

  In addition, about the wiring pattern of the surface containing the lands 11 and 12, and the wiring pattern of the back surface containing the land 13, the patterning can also be performed after the latter lamination | stacking (total lamination | stacking). Further, it is appropriate to perform Ni / Au plating on the lands 11, 12, and 13 so as to be suitable for connection with other conductors such as bonding connection.

  In such a wiring board 10, the electrical connection path in the vertical direction is derived from the conductive bump printed by the conductive composition printing. For example, the electrical connection in the vertical direction by a plating layer using a through hole. It can be formed in an area smaller than the path. Therefore, even when complicated wiring is required as the wiring board 10, the wiring board 10 can be made smaller.

  Next, FIG. 5 is a cross-sectional view schematically showing a specific configuration example of the wiring board 20 shown in FIG. In FIG. 5, the same components as those shown in FIG. The wiring board 20 used in the imaging element module shown in FIG. 1 is not limited to the one shown in FIG. However, it will be described as an example. 5, the solder resists 261 and 262, which are not shown in FIG. 1, the end face conductor portions 22 and 23, and the internal structure of the wiring board 20 are shown.

  In addition to the solder resists 261 and 262, the conductor portions 22 and 23 on the end face, the wiring board 20 has a wiring pattern 226 on the front surface, a wiring pattern 221 on the back surface, a wiring layer 222 on the inner layer, 223, 224, 225, and insulation 225. Layers 201, 202, 203, 204, 205, interlayer connectors 231, 232, 234, 235, and through-hole conductors 233 are provided. Further, it has a surface-mounted passive element component 241 that is embedded in the board and mounted on the wiring layer 222 via the solder 251, and the surface-mounted passive element component 21 also has the solder 21 a on the wiring pattern 226 on the surface. Has been implemented through. The wiring board 20 is a six-layer substrate having six wiring layers separated by insulating layers 201 to 205.

  Each of the insulating layers 201 to 205 is a rigid layer made of, for example, a glass epoxy resin. The front surface wiring pattern 226, the back surface wiring pattern 221, and the inner wiring layers 222 to 225 are layers obtained by, for example, performing a desired patterning process on a copper foil by a known photolithography technique. The interlayer connectors 231, 232, 234, and 235 are conductive composition connectors that pass through the insulating layers 201, 202, 204, and 205 and are sandwiched between the wiring patterns, respectively. It functions as an electrical connection path.

  Further, the solder resists 261 and 262 are protective films formed on the entire surface of the insulating layer 201 or the insulating layer 205 except on lands to which solder can be connected. The through-hole conductor 233 is a vertical electrical connection path formed as a copper plating layer on the inner wall surface of the through-hole that penetrates the insulating layer 203. The conductor portions 22 and 23 on the end faces are initially formed as copper plating layers on the inner wall surfaces of the through holes that penetrate the insulating layer 203, as with the through hole conductor 233. After being formed in this way, the cross sections appearing by cutting the copper plating layer vertically by dicing are conductor portions 22 and 23. The conductor portions 22 and 23 are accompanied by resin portions that are filled in the course of manufacturing, but are not shown.

  The conductor portions 22 and 23 are plated on the inner wall surface of the through-hole formed through the wiring board 20 in addition to being derived from the through-hole conductor embedded in the plate thickness as shown. Of course, it is also possible to use the cross-section that appears when the layer is grown and cut vertically. In this case, although it is primitive, the conductor portions 22 and 23 have a large area and are not accompanied by a resin portion, so that the conductive connection with the anisotropic conductive film 51 and the anisotropic conductive paste 53 is achieved. Is suitable.

  The manufacturing process of the wiring board 20 is similar to the wiring board 10 described above in that the interlayer connectors 231, 232, 234, and 235 made of a conductive composition are used. The main difference is the difference in the number of wiring layers and the incorporation of the component 241.

  First, a first partial stacked body including a wiring layer 226, a wiring layer 225, an insulating layer 205, and an interlayer connector 235, and a second portion including a wiring layer 221, a wiring layer 222, an insulating layer 201, and an interlayer connector 231. The laminated body and the third partial laminated body having the wiring layer 223, the wiring layer 224, the insulating layer 203, the through-hole conductor 233, and the conductor portions 22 and 23 are formed. About the 1st, 2nd partial laminated body, it can form in the way similar to description of the partial laminated body in FIG. For the third partial laminate, through holes are formed in a normal double-sided copper-clad substrate, and a copper plating layer is grown on the inner wall surface to form through-hole conductors 233 and conductor portions 22 and 23. Can do.

  On the first partial stacked body, an interlayer connector 234 and an insulating layer (prepreg stage) 204 are formed in the same manner as the interlayer connector 15a and the insulating layer 15 in FIG. Further, the interlayer connector 232 and the insulating layer (prepreg stage) 202 are also formed on the third partial stacked body in the same manner as the interlayer connector 15a and the insulating layer 15 in FIG. Thereafter, an opening is formed in the third partial laminate in accordance with the position of the component 241.

  On the second partial laminate, the component 241 is mounted at a predetermined position on the wiring layer 222 by using the solder 251. For this purpose, for example, the procedures of screen printing of cream solder to be the solder 251, placement of the component 241 by the mounter, and reflow of the cream solder can be adopted as in the case of normal component surface mounting.

  Thereafter, the second (lower), third (middle), and first (upper) partial laminates are stacked and pressed and heated with a press. As a result, the prepreg to be the insulating layer 202 and the prepreg to be the insulating layer 204 are completely cured and integrated as a whole to obtain a laminate having five insulating layers. In this integration, due to the fluidity of each prepreg obtained by heating, in addition to the space around the part 241, each prepreg enters the space inside the through-hole conductor 233 and the conductor portions 22 and 23 and a gap is generated. do not do. The wiring layers 222 and 224 are electrically connected to the interlayer connectors 232 and 234, respectively.

  Thereafter, layers of solder resists 261 and 262 are formed on both sides of the laminate. Further, the component 21 is mounted by executing a normal surface mounting process, and further separated into pieces by dicing to finish the wiring board 20 as shown in FIG. Note that the patterning of the wiring pattern 226 on the front surface and the wiring pattern 221 on the back surface can be performed after the entire lamination.

  In such a wiring board 20, the electrical connection path in the vertical direction is derived from the conductive bumps printed by the conductive composition except for a part thereof, and can be formed in a small area. Therefore, even when complicated wiring is required as the wiring board 20, the wiring board 20 can be made smaller. Further, the mounting density of the components is improved by incorporating the components 241, and a large number of components can be mounted in a small area. Therefore, it is possible to further avoid a situation where components must be mounted on the wiring board 10 that controls the two-dimensional size as a module, and contribute to further miniaturization as a module.

  Next, FIG. 6 is a cross-sectional view schematically showing another example of the specific configuration of the wiring board 20 shown in FIG. In FIG. 6, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. The wiring board 20 is the same as that shown in FIG. 5 except for the configuration of the conductor portions 22A and 23A on the end faces.

  Like the through-hole conductor 233, each of the conductor portions 22A and 23A has a part formed as a copper plating layer on the inner wall surface of the through-hole that penetrates the insulating layer 203. After the copper plating layer is formed, the conductive composition is filled. After being formed as a through-hole conductor filled with a conductive composition, the copper plating layer and the conductive composition are vertically cut by dicing, and the cross sections appearing are conductor portions 22A and 23A. ing. In this case, the area of the conductor portions 22A and 23A increases, and the reliability of the conductive connection with the anisotropic conductive film 51 increases.

  Next, FIG. 7 is a cross-sectional view schematically showing still another example of the specific configuration of the wiring board 20 shown in FIG. In FIG. 7, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. The wiring board 20 is the same as that shown in FIGS. 5 and 6 except for the configuration of the conductor portions 22B and 23B on the end surfaces thereof.

  Initially, the conductor portions 22B and 23B are electrically connected in the vertical direction by the conductive composition formed between the wiring layer 224 and the wiring layer 225 through the insulating layer 204, like the interlayer connector 234. Road. After being formed as such, the conductive sections 22B and 23B are cross sections that appear by vertically cutting the conductive composition by dicing.

  In this case, since the conductive composition can be formed in a region smaller than the vertical electrical connection path by the plating layer using the through hole, when the wiring board 20 is downsized or a complicated pattern design is performed. The compatibility with the formation of the conductor portions 22B and 23B is good. Further, the cross-sectional areas of the conductor portions 22B and 23B on the end face can be ensured more reliably, and the reliability of the conductive connection with the anisotropic conductive film 51 and the anisotropic conductive paste 53 is improved. Can do.

  DESCRIPTION OF SYMBOLS 10 ... Wiring board (1st wiring board), 11 ... Land (2nd land), 12 ... Land (1st land), 13 ... Land (3rd land), 14 ... Insulating layer, 14a ... Interlayer Connection body (derived from conductive bump by conductive composition printing), 15 ... insulating layer, 15a ... interlayer connection body (derived from conductive bump by conductive composition printing), 16 ... insulating layer, 16a ... Interlayer connection body (derived from conductive bumps printed by conductive composition), 17 ... solder resist, 18 ... solder resist, 20 ... wiring board (second wiring board), 21 ... surface mounted passive element parts , 21a ... solder, 22 ... conductor part (derived from through-hole conductor), 22A ... conductor part (derived from through-hole conductor filled with conductive composition), 22B ... conductor part (penetration formation) Derived conductive composition , 23 ... second conductor part (derived from through-hole conductor), 23A ... second conductor part (derived from through-hole conductor filled with conductive composition), 23B ... first 2 conductor parts (derived from the conductive composition formed so as to penetrate), 30 ... solid-state imaging device chip, 31 ... light receiving part, 32 ... terminal pad, 41 ... bonding wire, 51 ... anisotropic conductive film, 51A ... anisotropic conductive film (before bonding), 52 ... adhesive, 52A ... adhesive (before curing), 53 ... anisotropic conductive paste, 53A ... anisotropic conductive paste (before curing), 60 ... Lens unit, 61 ... Lens, 62 ... Actuator, 63 ... Electrical end, 64 ... Recess for fitting the wiring board, 141 ... Wiring layer (wiring pattern), 161 ... Wiring layer (wiring pattern), 201 ... Insulating layer, 202 ... insulating layer, DESCRIPTION OF SYMBOLS 03 ... Insulating layer, 204 ... Insulating layer, 205 ... Insulating layer, 221 ... Wiring layer (wiring pattern), 222 ... Wiring layer (wiring pattern), 223 ... Wiring layer (wiring pattern), 224 ... Wiring layer (wiring pattern) 225 ... wiring layer (wiring pattern), 226 ... wiring layer (wiring pattern), 231 ... interlayer connector (derived from conductive bumps printed by conductive composition), 232 ... interlayer connector (conductive composition) 234... Through-hole conductor, 234... Interlayer connection (conductive bump by conductive composition printing), 235... Interlayer connection (conductive bump by conductive composition printing) 241 ... Surface mount type passive element components (substrate built-in components), 251 ... solder, 261 ... solder resist, 262 ... solder resist.

Claims (19)

A wiring pattern having a first surface and a second surface and having a first land and a second land on the first surface side, wherein the first land is formed on the first surface; A first wiring board disposed near the periphery;
A functional surface having a light receiving portion and a terminal pad, the functional surface being directed to a side opposite to the side of the first wiring board and being on the first surface of the first wiring board; A provided solid-state imaging device chip;
The plate has a substantially rectangular plate shape, and the opposite end surfaces of the plate shape are a first end surface, a second end surface, and another opposite end surfaces are a third end surface and a fourth end surface, respectively. A conductor portion is provided on the end face, and the first end face side is the first end so that the conductor portion is electrically and mechanically connected to the first land of the wiring pattern of the first wiring board. A second standing up via an adhesive that can be electrically connected to the first surface of the first wiring board near the periphery of the first surface of the first wiring board. A wiring board,
A lens provided to face the light receiving portion of the solid-state image sensor chip;
An upright portion that supports the position of the lens with respect to the solid-state imaging device and rises in a wall shape from the vicinity of the periphery of the first surface along the periphery of the first surface of the first wiring board. The lens support portion having a recess for fitting the second wiring board along the second, third, and fourth end surfaces of the second wiring board;
An imaging element module comprising: a bonding wire that electrically connects the terminal pad of the solid-state imaging element chip and the second land of the wiring pattern of the first wiring board.   An adhesive is interposed between the second, third, and fourth end surfaces of the second wiring board and the end surface of the concave portion of the upright portion of the lens holding portion. Item 2. The imaging device module according to Item 1. The lens support portion is electrically connected to an actuator for adjusting the position of the lens and the actuator provided on an end surface of the recess facing the second end surface of the second wiring board. With an electrical end,
The second wiring board includes a second conductor portion on the second end face;
An electrically connectable adhesive is interposed between the electric end of the concave portion of the lens support portion and the second conductor portion on the second end face of the second wiring board. The imaging device module according to claim 1, wherein: The first wiring board has a substantially rectangular plate shape;
2. The image pickup device module according to claim 1, wherein a plurality of the second wiring boards exist along each of two or more sides of the rectangle of the first wiring board.   The adhesive for erecting the second wiring board on the first surface of the first wiring board is derived from an anisotropic conductive film or an anisotropic conductive paste. The image pickup device module according to claim 1.   The adhesive interposed between the electrical end of the concave portion of the lens support portion and the second conductor portion on the second end face of the second wiring board is anisotropically conductive. The imaging element module according to claim 3, wherein the imaging element module is derived from a paste or an anisotropic conductive film.   2. The imaging element module according to claim 1, wherein the second wiring board is a wiring board on which a component is mounted by being embedded on a main surface of the second wiring board.   The imaging device according to claim 1, wherein the first wiring board includes a second wiring pattern having a third land for external connection on the second surface of the first wiring board. module.   The image sensor module according to claim 1, wherein the first wiring board includes a vertical electrical connection path having a conductive composition.   The imaging device module according to claim 1, wherein the second wiring board includes a vertical electrical connection path having a conductive composition.   The conductor portion on the first end face of the second wiring board appears by cutting a through-hole conductor formed on the second wiring board and having a plating layer on the inner wall surface vertically. 2. The image pickup device module according to claim 1, wherein the image pickup device module has a cross section.   A through-hole conductor having a plating layer on an inner wall surface, wherein the conductor portion on the first end face of the second wiring board is embedded in the thickness of the second wiring board. The image pickup device module according to claim 1, wherein the image pickup device module has a cross-section that appears by cutting the surface vertically.   The conductor portion on the first end face of the second wiring board appeared by vertically cutting a through-hole conductor filled with a conductive composition formed on the second wiring board. The image sensor module according to claim 1, wherein the image sensor module has a cross section.   A cross section in which the conductor portion on the first end face of the second wiring board appears by cutting a conductive composition penetrating a part of the second wiring board in a thickness direction of the second wiring board. The image pickup device module according to claim 1, wherein the image pickup device module is provided.   The second conductor portion on the second end face of the second wiring board is vertically cut through the through-hole conductor formed on the second wiring board and having a plating layer on the inner wall surface. The image pickup device module according to claim 3, wherein the image pickup device module has a cross-section that appears as a result.   The second conductor portion on the second end face of the second wiring board is formed by being embedded in the plate thickness of the second wiring board, and is provided with a plated layer on the inner wall surface 4. The image pickup device module according to claim 3, wherein the image pickup device module has a cross section that appears by cutting the hole conductor vertically.   The second conductor portion on the second end face of the second wiring board cuts the through-hole conductor filled with the conductive composition formed in the second wiring board vertically. The image pickup device module according to claim 3, wherein the image pickup device module has a cross section that appears.   The second conductor portion on the second end face of the second wiring board appears by cutting a conductive composition penetrating and forming part of the second wiring board in the thickness direction of the second wiring board. The imaging device module according to claim 3, wherein the imaging device module has a cross section. A downward tray-like lens unit having a lens, a ceiling portion that supports the periphery of the lens, and an upright portion that rises downward from the periphery of the ceiling portion, the standing portion having a rectangular recess is formed. And a process of
It has a substantially rectangular plate shape, and the opposite end surfaces of the plate shape are a first end surface, a second end surface, and another opposite end surfaces are a third end surface and a fourth end surface, respectively. The wiring board is disposed in the recess so that the second, third, and fourth end faces of the wiring board having a conductor portion on the end face face each other and the end face of the recess of the standing part of the lens unit. Fitting, fixing the second, third, and fourth end faces and the end face of the recess with an adhesive; and
A wiring pattern having a first surface and a second surface and having a land is provided on the first surface side, the land is arranged near the periphery of the first surface, and the functional surface faces upward Forming a separate wiring board having a solid-state imaging device chip provided at a substantially center of the first surface;
The lens so that the conductor portion of the first end of the wiring board fixed to the lens unit and the land of the wiring pattern of the other wiring board are electrically and mechanically connected. Fixing the unit with an adhesive that can be electrically connected to the other wiring board with the end face of the upright portion of the lens unit facing the other wiring board. Manufacturing method of imaging element module.

Images