JP5374974B2 - Molding equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide molding equipment of a diminutive setup, which is capable of containing resin excess and flash for conducting resin molding in a mold frame, reducing material cost and molding time, further solving problem of resin change during the time of molding. <P>SOLUTION: The molding equipment molds resin by heating and melting the resin, and pressing the molten resin, which has a mold frame having a peripheral wall for molding the resin, an upper mold moving independently from the mold frame along the inner wall of the peripheral wall of mold frame and a lower mold, wherein the mold frame and the lower mold are set up so that the mold frame and the lower mold may move up and down perpendicularly in relation to each other. Further, the molding equipment includes a heating means for melting the resin loaded on the lower mold and a cooling means for solidifying the resin after the heat molding. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

The present invention relates to a molding apparatus for resin molded products.

Conventionally, an upper mold method or an injection molding method using a mold has been performed as a resin molding method. According to the upper mold method, the molten resin is injected into the upper mold and the lower mold that have been molded, molded by applying pressure, then cooled, and the resin is molded by removing the mold.
JP 2004-148546 A JP 2004-322323 A

  FIG. 1 shows a conventional molding method. 32 is an upper mold, 33 is a lower mold, 34 is an upper mold support, 35 is a lower mold support, 36 is a heating means, 37 Is a cooling means, and 38 is a molten resin injection port, which is molded by injecting a previously melted resin into upper and lower molds equipped with heating means. According to this method, it took time to raise the upper and lower molds to a specified temperature and to cool after molding. In addition, when injecting the previously melted resin, it is necessary to provide a gap between the upper mold and the lower mold in order to release air in the space formed by the upper mold and the lower mold. The molten resin protruded from the portion and became an excess resin. As a result, burrs were generated in the molded product, and burrs had to be processed, and a burring removal process and time were required (Patent Document 1).

  Further, the heating means 36 does not melt the resin but preheats the mold, and the resin is introduced into the mold after being melted in a separately provided resin melting portion. It was. For this reason, a change with time of the resin from when the resin is melted until it is molded sometimes becomes a problem.

  In the conventional method disclosed in Patent Document 2, the heated lower mold and resin are cooled by a Peltier element. According to this method, although the cooling time can be shortened, there is a problem that a cooling plate and a DC power source associated with the Peltier element are required, resulting in a large and expensive device.

  The present invention has been made in view of the above problems, and the equipment is not large. In addition, since the resin is molded in the molding frame, excess resin and burrs can be suppressed, reducing raw material costs and molding time. It is another object of the present invention to provide a molding apparatus that can solve the problem of resin aging until molding.

The invention according to claim 1 of the present invention is a molding apparatus for molding a resin by heating and melting the resin and pressing the molten resin ,
A molding frame having a peripheral wall for molding the resin ;
An upper mold that moves independently of the molding frame along the inner wall of the peripheral wall of the molding frame ;
A lower mold disposed so as to be in contact with the lower surface of the molding frame;
Heating means for melting the resin placed on the lower mold ,
Cooling means for solidifying the resin after thermoforming ,
The molding frame is a molding apparatus characterized in that it can be raised by the outer height of the resin while the upper mold and the lower mold are pressing the resin .

  The invention according to claim 2 of the present invention is the molding apparatus according to claim 1, characterized in that both the heating means and the cooling means are movable.

  The invention according to claim 3 of the present invention is the molding apparatus according to claim 1 or 2, wherein the lower mold has a fine pattern.

  According to the present invention, when molding a molten resin, molding can be performed without causing protrusion or burrs of the resin, and it can be easily formed even when a fine pattern is formed on the surface of a resin molded product. In addition, raw material costs can be reduced and molding time can be shortened, and even when the molten resin forms a resin that has a problem with the time change until molding, it is possible to perform molding while suppressing the time change of molding. It becomes.

  Hereinafter, an embodiment of a molding apparatus of the present invention will be described in detail with reference to the drawings.

  2A and 2B are schematic views for explaining the configuration of the molding apparatus of the present invention. FIG. 2A is a schematic view of the molding apparatus viewed from the front, and FIG. 2B is a schematic view of the molding apparatus viewed from the side. 1, 2, 3, 4 are air cylinders, 5 is a molding frame, 6 is an upper mold, 7 is a heater, and 8 is a cooling nozzle.

  In the molding apparatus of the present invention, as shown in FIG. 2, the air cylinder 1 and the air cylinder 2 are provided above the molding frame 5 and the upper mold 6 so that the molding frame 5 and the upper mold 6 can move up and down, respectively. It has become. Below that, a heater 7 as a heating means can be moved up and down by the air cylinder 3, and at the same time as the heater 7 is moved by the air cylinder 4, the cooling nozzle 8 as a cooling means can be moved. Is arranged. In the present invention, an air cylinder is used as a drive source. However, the present invention is not limited to this. For example, a motor drive may be used.

  FIG. 3A to FIG. 3E are detailed views showing a series of flows related to the molding of the present invention, wherein 9 is a lower mold and 10 is a resin. Reference numeral 11 denotes a support for the lower mold 9.

  The flow relating to resin molding will be described with reference to FIG. In FIG. 3A, it is assumed that the resin 10 to be melted is placed on the lower mold 9 at a predetermined position. After the resin 10 is placed, the heater 7 that heats the resin to the melting temperature is raised by the air cylinder 3 and comes into contact with the lower part of the lower mold 9 to start melting the resin 10.

  When the resin 10 is melted into a moldable state, as shown in FIG. 3 (b), the molding frame 5 moves downward so as to contact the lower mold 9 by the air cylinder 1, and the lower mold 9 is fixed.

  Next, as shown in FIG. 3C, the upper die 6 is moved along the inner wall of the peripheral wall of the molding frame 5 by the air cylinder 2 and starts to press the sufficiently melted resin 10, so that the resin 10 is molded. Is called. Here, the gap between the inner wall portion of the molding frame 5 and the outer wall portion of the upper mold 6 in FIG. 3C is assumed to be as small as possible, and air escapes outside the upper mold, but the resin is outside the upper mold. In order to prevent leakage, the size of the gap is adjusted from the viscosity of the resin. By adjusting the gap as small as possible and molding the resin in the molding frame, it is possible to prevent the resin from protruding or flashing.

  Next, as shown in FIG. 3 (d), the heater 7 is lowered by the air cylinder 3 and separated from the lower mold 9 when the resin is molded into the required shape. When the heater 7 has been lowered downward, the air cylinder 4 causes the heater 7 to move from the lower side of the lower mold 9 in the horizontal direction. Instead, a cooling nozzle 8 serving as a cooling means is disposed below the lower mold 9 and is cooled by air blow. I do. At this time, the lower mold 9 is cooled and the resin 10 is solidified without being affected by the radiant heat of the heater 7 by switching the heater 7 and the cooling nozzle 8.

  Finally, as shown in FIG. 3E, when the resin 10 is solidified and the shape does not change due to heat, the molding frame 5 is raised by the height of the resin molded by the air cylinder 1. Then, the resin 10 and the contact surface of the molding frame 5 are separated. When the separation is completed, the upper mold 6 is raised by the air cylinder 2 to complete a series of molding.

  In the embodiment of the present invention, the forming frame is moved up and down, but the present invention is not limited to this, and the forming frame and the lower mold may be moved up and down relatively.

  Further, as shown in FIG. 3B, the molding frame 5 is moved so as to be in contact with the upper surface of the lower mold 9. However, the present invention is not limited to this, and the peripheral wall of the lower mold and the inner wall of the molding frame are in contact with each other. It may be moved to.

  Furthermore, in the above-described embodiment of the present invention, the ceramic heater is used as the heating means and the cooling nozzle is used as the cooling means. However, the present invention is not limited to this. For example, a coil 41 as shown in FIG. 42, the heating / cooling body 40 having the cooling air inlet 43 and the cooling air outlet 44 is brought into contact with the lower mold 9 from below during heating, and induction heating is performed by connecting a power source 42 to the coil 41. After the heating and cooling body 40 is moved below the lower mold 9 to maintain a gap with the lower mold 9, cooling air is injected from the cooling air inlet 43 and blown from the cooling air outlet 44. It may be cooled. As another heating means, a method of irradiating the resin 10 placed on the lower mold 9 with a laser from above the resin 10 or a method of blowing warm air can be employed.

  Furthermore, in the present invention, a fine pattern can be formed in the lower mold 9, and the fine pattern may be directly formed on the lower mold, or a recess is provided on the surface of the lower mold, You may provide the fine pattern transfer body which formed the fine pattern in the recessed part.

  According to the present invention, when a molten resin is molded, the resin can be molded without causing protrusion or burrs of the resin, and easily formed even when a fine pattern is formed on the surface of the resin molded product. In addition, the raw material cost can be reduced and the molding time can be shortened, and further, the problem of the aging of the resin until molding can be solved.

Diagram for explaining a conventional molding method Schematic explaining the structure of the shaping | molding apparatus which concerns on this invention.

      (A) is a front view of a shaping | molding apparatus.

(B) is a side view of the molding apparatus.
The figure which showed the series of flows which concern on shaping | molding of this invention. Explanatory drawing of another heating and cooling means which concerns on this invention.

Explanation of symbols

1 ... Air cylinder 1
2 ... Air cylinder 2
3 ... Air cylinder 3
4 ... Air cylinder 4
5 ... Mold 6 ... Upper mold 7 ... Heater 8 ... Cooling nozzle 9 ... Lower mold 10 ... Resin 11 ... Lower mold support 32 ... On Mold 33 ... Lower mold 34 ... Upper mold support 35 ... Lower mold support 36 ... Heating means 37 ... Cooling means 38 ... Injection port 40 ... Heating Cooling body 41 ... Coil 42 ... Power source 43 ... Cooling air inlet 44 ... Cooling air outlet

Claims (3)

A molding apparatus that heats and melts a resin and molds the resin by pressing the molten resin ,
A molding frame having a peripheral wall for molding the resin ;
An upper mold that moves independently of the molding frame along the inner wall of the peripheral wall of the molding frame ;
A lower mold disposed so as to be in contact with the lower surface of the molding frame;
Heating means for melting the resin placed on the lower mold ,
Cooling means for solidifying the resin after thermoforming ,
The molding frame can be raised by the outer height of the resin in a state where the upper mold and the lower mold are pressing the resin .   The molding apparatus according to claim 1, wherein both of the heating unit and the cooling unit have a movable structure.   The molding apparatus according to claim 1, wherein the lower mold has a fine pattern.

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