JP5374974B2 - Molding equipment - Google Patents

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JP5374974B2
JP5374974B2 JP2008225682A JP2008225682A JP5374974B2 JP 5374974 B2 JP5374974 B2 JP 5374974B2 JP 2008225682 A JP2008225682 A JP 2008225682A JP 2008225682 A JP2008225682 A JP 2008225682A JP 5374974 B2 JP5374974 B2 JP 5374974B2
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resin
molding
lower mold
mold
mold frame
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JP2010058362A (en
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とも子 三田
保男 戸田
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Toppan Inc
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Toppan Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide molding equipment of a diminutive setup, which is capable of containing resin excess and flash for conducting resin molding in a mold frame, reducing material cost and molding time, further solving problem of resin change during the time of molding. <P>SOLUTION: The molding equipment molds resin by heating and melting the resin, and pressing the molten resin, which has a mold frame having a peripheral wall for molding the resin, an upper mold moving independently from the mold frame along the inner wall of the peripheral wall of mold frame and a lower mold, wherein the mold frame and the lower mold are set up so that the mold frame and the lower mold may move up and down perpendicularly in relation to each other. Further, the molding equipment includes a heating means for melting the resin loaded on the lower mold and a cooling means for solidifying the resin after the heat molding. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、樹脂成形品の成形装置に関するものである。 The present invention relates to a molding apparatus for resin molded products.

従来から樹脂の成形方法として、型による上金型方式や射出成形方式が行われている。上金型方式によると、成形形状を施した上型、下型に溶融した樹脂を注入し、圧力をかけて成形した後冷却し、型を外すことで樹脂の成形を行っている。
特開2004−148546号公報 特開2004−322323号公報
Conventionally, an upper mold method or an injection molding method using a mold has been performed as a resin molding method. According to the upper mold method, the molten resin is injected into the upper mold and the lower mold that have been molded, molded by applying pressure, then cooled, and the resin is molded by removing the mold.
JP 2004-148546 A JP 2004-322323 A

図1は従来行われている成形方法を示したもので、32は上金型、33は下金型、34は上金型支持体、35は下金型支持体、36は加熱手段、37は冷却手段、38は溶融樹脂注入口で、加熱手段を備えた上下金型に予め溶融した樹脂を注入して成形を行っていた。この方法によると、上下金型を指定温度まで昇温させるための時間と、成形後の冷却に時間を要していた。また、前記予め溶融した樹脂を注入する際に上金型と下金型で作られる空間の空気を逃がすために、上金型と下金型との間に隙間を設ける必要から、該隙間の部分から溶融した樹脂がはみ出し、余剰樹脂となっていた。その結果、成形品にバリが発生しバリの処理が必要となり、バリ除去の工程と時間が必要であった(特許文献1)。   FIG. 1 shows a conventional molding method. 32 is an upper mold, 33 is a lower mold, 34 is an upper mold support, 35 is a lower mold support, 36 is a heating means, 37 Is a cooling means, and 38 is a molten resin injection port, which is molded by injecting a previously melted resin into upper and lower molds equipped with heating means. According to this method, it took time to raise the upper and lower molds to a specified temperature and to cool after molding. In addition, when injecting the previously melted resin, it is necessary to provide a gap between the upper mold and the lower mold in order to release air in the space formed by the upper mold and the lower mold. The molten resin protruded from the portion and became an excess resin. As a result, burrs were generated in the molded product, and burrs had to be processed, and a burring removal process and time were required (Patent Document 1).

更に、前記加熱手段36は樹脂を溶融させるものではなく、金型を予熱するものであり、樹脂は別に設けられた樹脂溶融部にて溶融されてから金型内に導入されるようになっていた。このため、樹脂が溶融されてから成形されるまでの樹脂の経時変化が問題となることがあった。   Further, the heating means 36 does not melt the resin but preheats the mold, and the resin is introduced into the mold after being melted in a separately provided resin melting portion. It was. For this reason, a change with time of the resin from when the resin is melted until it is molded sometimes becomes a problem.

上記特許文献2に示される従来法においては、加熱された下金型及び樹脂をペルチェ素子にて冷却させていた。この方法によると、冷却のための時間は短くて済むものの、ペルチェ素子に付随する冷却板と直流電源を必要とすることから大掛かりで高価な装置になってしまう問題があった。   In the conventional method disclosed in Patent Document 2, the heated lower mold and resin are cooled by a Peltier element. According to this method, although the cooling time can be shortened, there is a problem that a cooling plate and a DC power source associated with the Peltier element are required, resulting in a large and expensive device.

本発明は上記の問題を鑑みてなされたもので、設備が大掛かりでなく、また、成形枠内で樹脂を成形するため余剰樹脂やバリを抑えることが出来、原料コストの削減、成形にかかる時間の短縮することが可能で、更に、成形されるまでの樹脂の経時変化の問題を解決することが出来る成形装置を提供することを課題とする。   The present invention has been made in view of the above problems, and the equipment is not large. In addition, since the resin is molded in the molding frame, excess resin and burrs can be suppressed, reducing raw material costs and molding time. It is another object of the present invention to provide a molding apparatus that can solve the problem of resin aging until molding.

本発明の請求項1に係る発明は、樹脂を加熱して溶融し、その溶融された樹脂をプレスすることで樹脂を成形する成形装置であって
樹脂を成形するための周壁を有する成形枠と
前記成形枠の周壁の内壁に沿って前記成形枠と独立して移動する上金型と
前記成形枠の下面と接するように配置される下金型と、
前記下金型上に置載された樹脂を溶融させるための加熱手段と
樹脂を加熱成形後に凝固させるための冷却手段と、を有し、
前記成形枠は、前記上金型と前記下金型が樹脂をプレスしている状態で、樹脂の外形高さ分だけ上昇可能であることを特徴とする成形装置である。
The invention according to claim 1 of the present invention is a molding apparatus for molding a resin by heating and melting the resin and pressing the molten resin ,
A molding frame having a peripheral wall for molding the resin ;
An upper mold that moves independently of the molding frame along the inner wall of the peripheral wall of the molding frame ;
A lower mold disposed so as to be in contact with the lower surface of the molding frame;
Heating means for melting the resin placed on the lower mold ,
Cooling means for solidifying the resin after thermoforming ,
The molding frame is a molding apparatus characterized in that it can be raised by the outer height of the resin while the upper mold and the lower mold are pressing the resin .

本発明の請求項2に係る発明は、前記加熱手段と前記冷却手段は共に移動可能な構造を有することを特徴とする請求項1記載の成形装置である。   The invention according to claim 2 of the present invention is the molding apparatus according to claim 1, characterized in that both the heating means and the cooling means are movable.

本発明の請求項3に係る発明は、前記下金型に微細パターンを有することを特徴とする請求項1または2記載の成形装置である。   The invention according to claim 3 of the present invention is the molding apparatus according to claim 1 or 2, wherein the lower mold has a fine pattern.

本発明によれば、溶融した樹脂を成形する時に樹脂のはみ出しやバリを発生させずに成形が可能で、また樹脂成形品の表面に微細パターンを形成する場合であっても容易に形成するすることが出来、更に原料コストの削減や成形時間の短縮が出来,更に溶融した樹脂が成形までの経時変化が問題となる樹脂を成形する場合であっても成形の経時変化を抑えた成形が可能となる。   According to the present invention, when molding a molten resin, molding can be performed without causing protrusion or burrs of the resin, and it can be easily formed even when a fine pattern is formed on the surface of a resin molded product. In addition, raw material costs can be reduced and molding time can be shortened, and even when the molten resin forms a resin that has a problem with the time change until molding, it is possible to perform molding while suppressing the time change of molding. It becomes.

以下、本発明の成形装置の一実施形態を図面を用いて詳細に説明する。   Hereinafter, an embodiment of a molding apparatus of the present invention will be described in detail with reference to the drawings.

図2は本発明の成形装置の構成を説明する概略図で、図2(a)は成形装置を正面から見た概略図、図2(b)は成形装置を側面から見た概略図であって、1、2、3、4はエアシリンダ、5は成形枠、6は上金型、7はヒーター、8は冷却ノズルである。   2A and 2B are schematic views for explaining the configuration of the molding apparatus of the present invention. FIG. 2A is a schematic view of the molding apparatus viewed from the front, and FIG. 2B is a schematic view of the molding apparatus viewed from the side. 1, 2, 3, 4 are air cylinders, 5 is a molding frame, 6 is an upper mold, 7 is a heater, and 8 is a cooling nozzle.

本発明の成形装置では、図2に示すように、成形枠5と上金型6の上方にエアシリンダ1及びエアシリンダ2を備え、成形枠5と上金型6が各々上下動できるようになっている。また、その下方には、エアシリンダ3によって加熱手段であるヒーター7が上下動できるよう設置され、さらにエアシリンダ4によってヒーター7が移動するのと同時に、冷却手段である冷却ノズル8が移動できるように配置されている。なお、本発明ではエアシリンダを駆動源として使用しているが、これに限らず例えばモーター駆動などを利用しても良い。   In the molding apparatus of the present invention, as shown in FIG. 2, the air cylinder 1 and the air cylinder 2 are provided above the molding frame 5 and the upper mold 6 so that the molding frame 5 and the upper mold 6 can move up and down, respectively. It has become. Below that, a heater 7 as a heating means can be moved up and down by the air cylinder 3, and at the same time as the heater 7 is moved by the air cylinder 4, the cooling nozzle 8 as a cooling means can be moved. Is arranged. In the present invention, an air cylinder is used as a drive source. However, the present invention is not limited to this. For example, a motor drive may be used.

図3(a)〜図3(e)は、本発明の成形に係る一連の流れを示した詳細図であって、9は下金型、10は樹脂。11は下金型9の支持体である。   FIG. 3A to FIG. 3E are detailed views showing a series of flows related to the molding of the present invention, wherein 9 is a lower mold and 10 is a resin. Reference numeral 11 denotes a support for the lower mold 9.

図3を用いて、樹脂の成形に係る流れを説明する。図3(a)では、下金型9上に溶融させる樹脂10を所定位置に置くものとする。樹脂10が置かれた後、樹脂を溶融温度に加熱するヒーター7がエアシリンダ3によって上昇し、下金型9の下部に接触することで樹脂10の溶融が始まる。   The flow relating to resin molding will be described with reference to FIG. In FIG. 3A, it is assumed that the resin 10 to be melted is placed on the lower mold 9 at a predetermined position. After the resin 10 is placed, the heater 7 that heats the resin to the melting temperature is raised by the air cylinder 3 and comes into contact with the lower part of the lower mold 9 to start melting the resin 10.

樹脂10が成形可能な状態に溶融したところで、次に図3(b)に示すように、成形枠5がエアシリンダ1により下金型9上に接触するように下方へ移動し、下金型9上で固定される。   When the resin 10 is melted into a moldable state, as shown in FIG. 3 (b), the molding frame 5 moves downward so as to contact the lower mold 9 by the air cylinder 1, and the lower mold 9 is fixed.

次に図3(c)に示すように、エアシリンダ2により上金型6が成形枠5の周壁の内壁に沿って移動し、十分に溶融した樹脂10を押し始め、樹脂10の成形が行われる。ここで、図3(c)での成形枠5の内壁部と上金型6の外壁部の隙間は出来るだけ小さいものとし、空気は上金型の外に逃げるが樹脂は上金型の外に漏れないように、樹脂の粘度から隙間の大きさが調整される。隙間を出来るだけ小さく調整し、更に、成形枠内で樹脂を成形することにより樹脂のはみ出しやバリを抑えることが出来る。   Next, as shown in FIG. 3C, the upper die 6 is moved along the inner wall of the peripheral wall of the molding frame 5 by the air cylinder 2 and starts to press the sufficiently melted resin 10, so that the resin 10 is molded. Is called. Here, the gap between the inner wall portion of the molding frame 5 and the outer wall portion of the upper mold 6 in FIG. 3C is assumed to be as small as possible, and air escapes outside the upper mold, but the resin is outside the upper mold. In order to prevent leakage, the size of the gap is adjusted from the viscosity of the resin. By adjusting the gap as small as possible and molding the resin in the molding frame, it is possible to prevent the resin from protruding or flashing.

次に図3(d)に示すように、樹脂が要求された形状へと成形がなされたのを見計らい、ヒーター7がエアシリンダ3により下方へ下がり下金型9から離れる。ヒーター7が下方へ下がりきると、エアシリンダ4によりヒーター7が下金型9の下方から水平方向へ移動し、代わりに冷却手段である冷却ノズル8が下金型9の下方に配置されエアブローによる冷却を行う。このとき、ヒーター7と冷却ノズル8が入れ替わることでヒーター7の放射熱の影響を受けることなく、下金型9が冷え、樹脂10が凝固する。   Next, as shown in FIG. 3 (d), the heater 7 is lowered by the air cylinder 3 and separated from the lower mold 9 when the resin is molded into the required shape. When the heater 7 has been lowered downward, the air cylinder 4 causes the heater 7 to move from the lower side of the lower mold 9 in the horizontal direction. Instead, a cooling nozzle 8 serving as a cooling means is disposed below the lower mold 9 and is cooled by air blow. I do. At this time, the lower mold 9 is cooled and the resin 10 is solidified without being affected by the radiant heat of the heater 7 by switching the heater 7 and the cooling nozzle 8.

最後に図3(e)に示すように、樹脂10が凝固し、熱の影響により形状に変化が起こらなくなったら、成形枠5をエアシリンダ1で成形された樹脂の外形高さ分だけ上昇させ、樹脂10と成形枠5の接触面とを分離させる。分離を終えたら、エアシリンダ2にて上金型6を上昇させ、一連の成形が終わるものである。   Finally, as shown in FIG. 3E, when the resin 10 is solidified and the shape does not change due to heat, the molding frame 5 is raised by the height of the resin molded by the air cylinder 1. Then, the resin 10 and the contact surface of the molding frame 5 are separated. When the separation is completed, the upper mold 6 is raised by the air cylinder 2 to complete a series of molding.

上記本発明の実施形態では、成形枠を上下動させたが、これに限定されず、成形枠と下金型を相対的に上下動させても良い。   In the embodiment of the present invention, the forming frame is moved up and down, but the present invention is not limited to this, and the forming frame and the lower mold may be moved up and down relatively.

更に、図3(b)で示されるように成形枠5は下金型9の上面に接するように移動させたが、これに限定されず、下金型の周壁と成形枠の内壁が接するように移動させても良い。   Further, as shown in FIG. 3B, the molding frame 5 is moved so as to be in contact with the upper surface of the lower mold 9. However, the present invention is not limited to this, and the peripheral wall of the lower mold and the inner wall of the molding frame are in contact with each other. It may be moved to.

更に、上記本発明の実施形態では、加熱手段としてセラミックヒータを用い,冷却手段として冷却ノズルを用いたが、これに限定されず、例えば図3に示すようなコイル41、コイルに接続される電源42、冷却エアー注入口43、冷却エアー吹出口44を有した加熱冷却体40を、加熱時には下金型9に下方から接触させ、コイル41に電源42を接続することによって誘導加熱し、冷却時には前記加熱冷却体40を下金型9の下方に移動させて下金型9との間に隙間を保った後、冷却エアーを冷却エアー注入口43から注入し、冷却エアー吹出口44から吹出して冷却しても良い。また別の加熱手段として、下金型9上に載置された樹脂10を樹脂10の上方からレーザーを照射する方法あるいは温風を吹付けるといった方法も採用できる。   Furthermore, in the above-described embodiment of the present invention, the ceramic heater is used as the heating means and the cooling nozzle is used as the cooling means. However, the present invention is not limited to this. For example, a coil 41 as shown in FIG. 42, the heating / cooling body 40 having the cooling air inlet 43 and the cooling air outlet 44 is brought into contact with the lower mold 9 from below during heating, and induction heating is performed by connecting a power source 42 to the coil 41. After the heating and cooling body 40 is moved below the lower mold 9 to maintain a gap with the lower mold 9, cooling air is injected from the cooling air inlet 43 and blown from the cooling air outlet 44. It may be cooled. As another heating means, a method of irradiating the resin 10 placed on the lower mold 9 with a laser from above the resin 10 or a method of blowing warm air can be employed.

更に、本発明では、下金型9に微細パターンを形成しておくことができ、前記微細パターンは下金型に直接形成してもよく、あるいは、下金型の表面に凹部を設け、該凹部に微細パターンを形成した微細パターン転写体を設けても良い。   Furthermore, in the present invention, a fine pattern can be formed in the lower mold 9, and the fine pattern may be directly formed on the lower mold, or a recess is provided on the surface of the lower mold, You may provide the fine pattern transfer body which formed the fine pattern in the recessed part.

本発明によれば、溶融した樹脂を成形する時に樹脂のはみ出しやバリを発生させずに樹脂成形が可能で、また樹脂成形品の表面に微細パターンを形成する場合であっても容易に形成することが出来、更に原料コストの削減や成形時間の短縮が出来、更に、成形されるまでの樹脂の経時変化の問題を解決することが出来る。   According to the present invention, when a molten resin is molded, the resin can be molded without causing protrusion or burrs of the resin, and easily formed even when a fine pattern is formed on the surface of the resin molded product. In addition, the raw material cost can be reduced and the molding time can be shortened, and further, the problem of the aging of the resin until molding can be solved.

従来の成形方法を説明するための図Diagram for explaining a conventional molding method 本発明に係る成形装置の構成を説明する概略図。Schematic explaining the structure of the shaping | molding apparatus which concerns on this invention.

(a)は成形装置の正面図。       (A) is a front view of a shaping | molding apparatus.

(b)は成形装置の側面図。
本発明の成形に係る一連の流れを示した図。 本発明に係る別の加熱、冷却手段の説明図。
(B) is a side view of the molding apparatus.
The figure which showed the series of flows which concern on shaping | molding of this invention. Explanatory drawing of another heating and cooling means which concerns on this invention.

符号の説明Explanation of symbols

1・・・エアシリンダ1
2・・・エアシリンダ2
3・・・エアシリンダ3
4・・・エアシリンダ4
5・・・成形枠
6・・・上金型
7・・・ヒーター
8・・・冷却ノズル
9・・・下金型
10・・・樹脂
11・・・下金型支持体
32・・・上金型
33・・・下金型
34・・・上金型支持体
35・・・下金型支持体
36・・・加熱手段
37・・・冷却手段
38・・・注入口
40・・・加熱冷却体
41・・・コイル
42・・・電源
43・・・冷却エアー注入口
44・・・冷却エアー吹出口
1 ... Air cylinder 1
2 ... Air cylinder 2
3 ... Air cylinder 3
4 ... Air cylinder 4
5 ... Mold 6 ... Upper mold 7 ... Heater 8 ... Cooling nozzle 9 ... Lower mold 10 ... Resin 11 ... Lower mold support 32 ... On Mold 33 ... Lower mold 34 ... Upper mold support 35 ... Lower mold support 36 ... Heating means 37 ... Cooling means 38 ... Injection port 40 ... Heating Cooling body 41 ... Coil 42 ... Power source 43 ... Cooling air inlet 44 ... Cooling air outlet

Claims (3)

樹脂を加熱して溶融し、その溶融された樹脂をプレスすることで樹脂を成形する成形装置であって
樹脂を成形するための周壁を有する成形枠と
前記成形枠の周壁の内壁に沿って前記成形枠と独立して移動する上金型と
前記成形枠の下面と接するように配置される下金型と、
前記下金型上に置載された樹脂を溶融させるための加熱手段と
樹脂を加熱成形後に凝固させるための冷却手段と、を有し、
前記成形枠は、前記上金型と前記下金型が樹脂をプレスしている状態で、樹脂の外形高さ分だけ上昇可能であることを特徴とする成形装置。
A molding apparatus that heats and melts a resin and molds the resin by pressing the molten resin ,
A molding frame having a peripheral wall for molding the resin ;
An upper mold that moves independently of the molding frame along the inner wall of the peripheral wall of the molding frame ;
A lower mold disposed so as to be in contact with the lower surface of the molding frame;
Heating means for melting the resin placed on the lower mold ,
Cooling means for solidifying the resin after thermoforming ,
The molding frame can be raised by the outer height of the resin in a state where the upper mold and the lower mold are pressing the resin .
前記加熱手段と前記冷却手段は共に移動可能な構造を有することを特徴とする請求項1記載の成形装置。   The molding apparatus according to claim 1, wherein both of the heating unit and the cooling unit have a movable structure. 前記下金型に微細パターンを有することを特徴とする請求項1または2記載の成形装置。   The molding apparatus according to claim 1, wherein the lower mold has a fine pattern.
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JP5374974B2 true JP5374974B2 (en) 2013-12-25

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JPH0985758A (en) * 1995-09-22 1997-03-31 Tsukishima Kikai Co Ltd Molding machine for thermosetting resin composition
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