JP5365666B2 - Circuit connection material, circuit terminal connection structure and connection method - Google Patents

Description

  The present invention relates to a circuit connection material that is interposed between circuit electrodes facing each other, pressurizes the circuit electrodes facing each other, and electrically connects the electrodes in the pressurizing direction, and a circuit terminal connection structure and a connection method. .

Epoxy resin adhesives are widely used in various applications such as electricity, electronics, architecture, automobiles and airplanes because of their high adhesive strength and excellent water resistance and heat resistance.
Among them, the one-pack type epoxy resin adhesive is used in the form of a film, a paste, or a powder because it is not necessary to mix the main agent and the curing agent and is easy to use. In order to improve the adhesiveness of an epoxy resin adhesive, the addition of acrylic rubber is the mainstream as a means for imparting flexibility (for example, Patent Document 1).

  On the other hand, radically polymerizable adhesives are known as low-temperature fast-curing adhesives (for example, Patent Document 2). Epoxy resin adhesives and radical polymerization adhesives are usually used separately as different polymerization type adhesives.

WO98 / 3047 brochure WO98 / 44067 brochure

  An object of the present invention is to provide a circuit connecting material having flexibility without adding acrylic rubber. Among other things, it is to improve adhesion to COF (Chip On Flex) mounting, which is a kind of mounting method for liquid crystal displays, without using acrylic rubber. COF has a similar form to TCP (Tape Carrier Package) mounting, which is a mounting method that has been mainly used in the past. However, since the constituent materials of the adherend are different, adhesion between TCP and COF There is a difference in sex. As a rough configuration, TCP has a three-layer configuration of “copper foil- (epoxy) adhesive layer-polyimide”, whereas COF has a two-layer configuration of copper foil-polyimide. TCP has an adhesive layer exposed on the circuit space surface, which is advantageous for adhesion, while COF has a disadvantage in adhesion because polyimide is exposed in the circuit space. Therefore, acrylic rubber has been used in order to obtain high adhesion with COF. However, when acrylic rubber is used, there is a contradictory characteristic that the connection reliability with respect to TCP deteriorates when trying to obtain high adhesion to COF. Due to market demand for unifying materials, high adhesion and stable connection reliability are required for both COF and TCP.

As a result of diligent research in view of the above problems, the present inventors have imparted flexibility without adding acrylic rubber by hybrid curing combining an anion polymerizable epoxy resin adhesive and a radical polymerizable adhesive. We found what we could do and completed the present invention.
According to the present invention, the following circuit connection material is provided.
1. A circuit connecting material that is interposed between opposing circuit electrodes, pressurizes the opposing circuit electrodes, and electrically connects the electrodes in the pressurizing direction, and includes the following components (1) to (4): , Circuit connection material.
(1) Epoxy resin (2) Anion polymerization type curing agent (3) Radical polymerizable substance (4) Curing agent generating free radicals

  According to the present invention, a flexible circuit connecting material can be provided without adding acrylic rubber.

The epoxy resin used in the present invention is typically a bisphenol type epoxy resin derived from epichlorohydrin and bisphenol A, F, D or the like, and an epoxy novolac resin derived from epichlorohydrin and phenol novolac or cresol novolac, and other glycidylamines. Various epoxy compounds having two or more oxirane groups in one molecule such as glycidyl ester, alicyclic, and heterocyclic can be applied. These can be used alone or in admixture of two or more. For these epoxy resins, it is preferable to use a high-purity product in which impurity ions (Na ⁺ , Cl ^{− and the} like), hydrolyzable chlorine and the like are reduced to 300 ppm or less, in order to prevent electron migration.

  Among the above-mentioned epoxy resins, bisphenol type epoxy resins are preferable because grades having different molecular weights are widely available, and adhesiveness, reactivity, and the like can be arbitrarily set. Among them, the bisphenol F type epoxy resin is particularly preferable because it has a particularly low viscosity and can be set in a wide range of fluidity in combination with a phenoxy resin, or is liquid and easily obtains adhesiveness. A so-called polyfunctional epoxy resin having three or more oxirane groups in one molecule is also preferable because it improves the crosslink density of the composition and improves heat resistance, and occupies the composition in order to maintain repairability with a solvent. The ratio of the polyfunctional epoxy resin can be used as 30% or less.

  The compounding amount of the epoxy resin is preferably 5 to 95 parts by weight, more preferably 20 to 80 parts by weight, and still more preferably 40 to 60 parts by weight with respect to 100 parts by weight of the sum of the epoxy resin and the radical polymerizable substance.

  Examples of the anionic curing agent used in the present invention include imidazole series, hydrazide series, trifluoroboron-amine complex, amine imide, polyamine salt, dicyandiamide, and the like, and these may be used alone or in combination of two or more. Can be used as a body.

  The compounding amount of the anionic curing agent is preferably 30 to 60 parts by weight, more preferably 40 to 50 parts by weight with respect to 100 parts by weight of the epoxy resin.

The radical polymerizable substance used in the present invention is a substance having a functional group that is polymerized by radicals, and examples thereof include acrylates, methacrylates, maleimide compounds, and the like. The radical polymerizable substance can be used in either a monomer or oligomer state, and the monomer and oligomer can be used in combination. Specific examples of the acrylate (methacrylate) include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3. -Diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl Examples include acrylate and tris (acryloyloxyethyl) isocyanurate. These can be used alone or in combination. If necessary, a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be appropriately used.
Moreover, when it has a dicyclopentenyl group and / or a tricyclodecanyl group and / or a triazine ring, since heat resistance improves, it is preferable.

  The maleimide compound contains at least two maleimide groups in the molecule. For example, 1-methyl-2,4-bismaleimidebenzene, N, N′-m-phenylenebismaleimide, N, N′— p-phenylene bismaleimide, N, N′-m-toluylene bismaleimide, N, N′-4,4-biphenylene bismaleimide, N, N′-4,4- (3,3′-dimethyl-biphenylene) Bismaleimide, N, N′-4,4- (3,3′-dimethyldiphenylmethane) bismaleimide, N, N′-4,4- (3,3′-diethyldiphenylmethane) bismaleimide, N, N′- 4,4-diphenylmethane bismaleimide, N, N′-4,4-diphenylpropane bismaleimide, N, N′-4,4-diphenyl ether bismaleimide N, N′-3,3′-diphenylsulfone bismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, 2,2-bis (3-s-butyl-4-8 (4 -Maleimidophenoxy) phenyl) propane, 1,1-bis (4- (4-maleimidophenoxy) phenyl) decane, 4,4'-cyclohexylidene-bis (1- (4maleimidophenoxy) -2-cyclohexylbenzene, Examples include 2,2-bis (4- (4-maleimidophenoxy) phenyl) hexafluoropropane, etc. These can be used alone or in combination.

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配合量は、ラジカル重合性物質１００重量部に対し０．１〜１０重量部用いるのが好ましく、０．５〜５重量部がより好ましい。
リン酸エステル構造を有するラジカル重合性物質は、無水リン酸と２−ヒドロキシエチル（メタ）アクリレートの反応物として得られる。具体的には、モノ（２−メタクリロイルオキシエチル）アッシドポスフェート、ジ（２−メタクリロイルオキシエチル）アッシドポスフェート等がある。これらは単独でもまた組み合わせても使用できる。 Further, when a radical polymerizable substance having a phosphate ester structure represented by the following formula is used in combination with the above radical polymerizable substance, the adhesive strength on the surface of an inorganic substance such as a metal is improved.

(Where n is an integer from 1 to 3)
The blending amount is preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of the radical polymerizable substance.
The radically polymerizable substance having a phosphoric ester structure is obtained as a reaction product of phosphoric anhydride and 2-hydroxyethyl (meth) acrylate. Specific examples include mono (2-methacryloyloxyethyl) acid phosphate and di (2-methacryloyloxyethyl) acid phosphate. These can be used alone or in combination.

  The blending amount of the radical polymerizable substance is preferably 5 to 95 parts by weight, more preferably 20 to 80 parts by weight, and still more preferably 40 to 60 parts by weight with respect to 100 parts by weight of the sum of the epoxy resin and the radical polymerizable substance. .

As the curing agent that generates free radicals used in the present invention, those that generate free radicals by heat or light, such as peroxide compounds and azo compounds, can be used. Of these, organic peroxides are preferred.
The curing agent is appropriately selected depending on the intended connection temperature, connection time, pot life, etc. From the viewpoint of high reactivity and pot life, the temperature of the half-life of 10 hours is 40 ° C. or more and the half-life is 1 minute. An organic peroxide having a temperature of 180 ° C. or lower is preferable, and an organic peroxide having a half-life of 10 hours having a temperature of 60 ° C. or higher and a half-life of 1 minute being 170 ° C. or lower is more preferable.

The curing agent can be selected from diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, and the like. Further, in order to suppress corrosion of the connection terminals of the circuit member, the chlorine ions and organic acids contained in the curing agent are preferably 5000 ppm or less, and more preferably less organic acids generated after the thermal decomposition. .
Specifically, it is more preferably selected from peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and peroxyesters that provide high reactivity.

  Peroxyesters include cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxynoedecanoate, and t-hexyl. Peroxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (2- Ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, L-hexylperoxy-2-ethylhexanoate, L-butylperoxy-2-ethylhexanoate Nate, t-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, -Hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di (m-toluoyl par Oxy) hexane, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, t-butyl peroxyacetate and the like can be used.

Dialkyl peroxides include α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, and t-butyl. Cumyl peroxide can be used.
As the hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide and the like can be used.

  Diacyl peroxide includes isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoyl Peroxytoluene, benzoyl peroxide, etc. can be used.

  Examples of peroxydicarbonate include di-n-bromoperoxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di- (2-Ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, di (3-methyl-3-methoxybutylperoxy) dicarbonate and the like can be used.

  Peroxyketals include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t- Butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (t-butylperoxy) decane and the like can be used.

  Examples of silyl peroxides include t-butyltrimethylsilyl peroxide, bis (t-butyl) dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide, bis (t-butyl) divinylsilyl peroxide, and tris (t-butyl) vinyl. Silyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, tris (t-butyl) allylsilyl peroxide, and the like can be used.

These curing agents that generate free radicals can be used alone or in combination, and a decomposition accelerator, an inhibitor, or the like may be used in combination.
The compounding amount of the curing agent is preferably 0.05 to 10 parts by weight, more preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of the radical polymerizable substance.
In addition, those encapsulating these curing agents with polyurethane-based or polyester-based polymeric substances and the like and microencapsulated are preferable because the pot life is extended.

As the thermoplastic resin used in the present invention, polyvinyl butyral resin, polyvinyl formal resin, polyamide resin, polyester resin, phenol resin, epoxy resin, phenoxy resin, polystyrene resin, xylene resin, polyurethane resin and the like can be used.
The molecular weight of these polymers is preferably 10,000 or more, but if it is 1,000,000 or more, the mixing property tends to deteriorate.

As the hydroxyl group-containing resin, a hydroxyl group-containing resin having a Tg (glass transition temperature) of 40 ° C. or more and a molecular weight of 10,000 or more is preferably used. For example, a phenoxy resin can be used. The hydroxyl group-containing resin may be modified with a carboxyl group-containing elastomer, an epoxy group-containing elastomer, or a radical polymerizable functional group. Those modified with a radically polymerizable functional group are preferred because the heat resistance is improved.
The phenoxy resin can be obtained by reacting a bifunctional phenol and epihalohydrin to a high molecular weight or by polyaddition reaction of a bifunctional epoxy resin and a bifunctional phenol.

Further, the carboxyl group-containing elastomer and the epoxy group-containing elastomer may be any elastomer as long as it is an elastomer having a carboxyl group or an epoxy group in the molecular terminal or molecular chain, such as a butadiene-based polymer and an acrylic polymer. , Polyether urethane rubber, polyester urethane rubber, polyamide urethane rubber, silicone rubber and the like, and butadiene polymers are preferred. Examples of the butadiene polymer include a butadiene polymer, a butadiene-styrene copolymer, and a butadiene-acrylonitrile copolymer. Of these, butadiene-acrylonitrile copolymers are particularly preferred.
The weight average molecular weight of the carboxyl group-containing elastomer is preferably in the range of 500 to 1,000,000, more preferably 1000 to 800,000, and still more preferably 1000 to 10,000.

  If the amount of the component having compatibility with the phenoxy resin contained in the elastomer skeleton is too large, it is preferably determined so that the phenoxy phase and the elastomer phase are phase-separated.

The circuit connection material of the present invention does not contain acrylic rubber. Such an acrylic rubber is a polymer or copolymer containing at least one of acrylic acid, acrylic acid ester, methacrylic acid ester or acrylonitrile as a monomer component, and a copolymer containing glycidyl acrylate or glycidyl methacrylate containing a glycidyl ether group. A polymeric acrylic rubber can be illustrated.
In this invention, even if it does not contain an acrylic rubber, a softness | flexibility can be provided by the hybrid hardening which combined the anion polymerizable epoxy resin adhesive and the radical polymerizable adhesive.

Furthermore, a filler, a softener, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a coupling agent, a phenol resin, a melamine resin, isocyanates, and the like can also be contained.
As a coupling agent, a vinyl group, an acrylic group, an amino group, an epoxy group, and an isocyanate group-containing material are preferable from the viewpoint of improving adhesiveness.

Even if the circuit connection material of the present invention does not have conductive particles, connection can be obtained by direct contact of circuit electrodes facing each other at the time of connection. However, when conductive particles are contained, more stable connection can be obtained.
The conductive particles include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon. In order to obtain a sufficient pot life, the surface layer is not a transition metal such as Ni or Cu, but Au, Ag. Platinum group noble metals are preferred, and Au is more preferred.
Further, the surface of a transition metal such as Ni may be coated with a noble metal such as Au. In addition, when the conductive layer described above is formed by coating or the like on non-conductive glass, ceramic, plastic, etc., and the outermost layer is precious metal plastic as the core, or in the case of hot melt metal particles, it is deformable by heating and pressing. Therefore, the contact area with the electrode is increased at the time of connection, and the reliability is improved.

  Although the compounding quantity of electroconductive particle is suitably set with a use, it is the range of 0.1-30 parts (volume) normally with respect to 100 parts (volume) of adhesive resin components. In order to prevent a short circuit of an adjacent circuit due to excessive conductive particles, the content is more preferably 0.1 to 10 parts (volume).

  Further, when the circuit connection material is divided into two or more layers and separated into a layer containing a curing agent and a layer containing conductive particles, an improvement in pot life can be obtained.

In the connection method of the present invention, a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged so that the first connection terminal and the second connection terminal are opposed to each other. The connection material (film adhesive) of the present invention is interposed between the first connection terminal and the second connection terminal that are arranged to face each other, and the facing arrangement is performed by heating and pressing and / or light irradiation. The first connection terminal and the second connection terminal are electrically connected.
As such a circuit member, a chip component such as a semiconductor chip, a resistor chip or a capacitor chip, a substrate such as a printed circuit board, or the like is used. The circuit member is usually provided with a large number of connection terminals (or a single connection terminal in some cases).

  In order to obtain better electrical connection, it is preferable that at least one surface of the circuit electrode (connection terminal) is made of a metal selected from gold, silver, tin, and a platinum group. The surface layer is selected from gold, silver, platinum group, or tin, and these may be used in combination. Moreover, it is good also as a multilayer structure combining several metals like copper / nickel / gold.

FIG. 1 is a cross-sectional view illustrating a circuit terminal connection method according to an embodiment of the present invention.
In FIG. 1A, 1 is a first substrate (first circuit member), 2 is a second substrate (second circuit member), and 1a is a first circuit electrode (first connection terminal). 2a is a second circuit electrode (second connection terminal), 3 is an adhesive, 4 is a conductive particle, and 5 is a heating and pressing head. The circuit connection material of the present invention is composed of the adhesive 3 and the conductive particles 4.

The substrates 1 and 2 are insulating substrates such as semiconductor chips such as silicone, gallium and arsenic, glass, ceramics, glass / epoxy composite, and plastic.
The circuit electrode 1a is provided with a copper foil on the surface of the substrate 1, and a gold surface layer is formed thereon. The circuit electrode 2a is provided on the surface of the substrate 2 with a copper foil, and a tin surface layer is formed thereon.
The substrate provided with the circuit electrodes is preferably pre-heated before the connection step using the circuit connection material in order to eliminate the influence on the connection due to the volatile component due to the heating at the time of connection.
As shown in FIG. 1B, after the temporary connection, the circuit electrode 1a of the substrate 1 and the circuit electrode 2a of the substrate 2 are aligned, and the heating and pressing head 5 is heated and pressed for a predetermined time from above the substrate 2. To complete this connection.

Example 1
44 parts by weight of an epoxy resin and an imidazole microcapsule mixed epoxy resin (HX-3941HP, manufactured by Asahi Kasei Chemicals Corporation) as an anionic polymerization type curing agent, and ethylene glycol diacrylate (A-600, Shin-Nakamura) as a radical polymerizable substance 16 parts by weight of Chemical Industry Co., Ltd. and 2,5-dimethyl-2,5-di (2-ethylhexanoyl) hexane (Perhexa 25O, manufactured by NOF Corporation) as a curing agent that generates free radicals 3 parts by weight (perhexa25O is a 50% solution, so the actual formulation is 6 parts by weight), 40% by weight phenoxy resin (PKHC, average) obtained by dissolving in a mixed solvent of toluene / ethyl acetate = 50/50 100 parts by weight (with a solid content of 45,000 molecular weight, manufactured by Inchem Corporation) as a film-forming component 40 parts by weight), and further, 4 parts by weight of a polystyrene spherical particle having an average particle diameter of 4 μm provided with a 0.1 μm Ni layer and an Au layer (hereinafter referred to as conductive particles), Further, 1 part by weight of γ-glycidoxypropyltrimethoxysilane (SH6040, manufactured by Toray Dow Corning Silicone Co., Ltd.) was blended as a silane coupling agent. This mixed solution was applied onto a PET film with an applicator and dried with hot air at 70 ° C. for 10 minutes to obtain a circuit connecting material having an adhesive layer thickness of 20 μm.

Comparative Example 1
44 parts of epoxy resin and an imidazole microcapsule mixed type epoxy resin (HX-3941HP, manufactured by Asahi Kasei Chemicals) as an anionic polymerization initiator, 40 parts of butyl acrylate, 30 parts of ethyl acrylate, 30 parts of acrylonitrile, 30 parts of glycidyl as acrylic rubber A 10% by weight acrylic rubber solution obtained by dissolving a copolymer of 3 parts of methacrylate (weight average molecular weight of about 850,000) (hereinafter referred to as acrylic rubber 1) in a mixed solvent of toluene / ethyl acetate = 50/50. 400 parts by weight (40 parts by weight as solids), 40 parts by weight (16 parts by weight as solids) of the above-described 40% by weight PKHC solution as a film-forming component, and the conductive particles and the like are the same as in Example 1 Thus, a circuit connection material was obtained.

Comparative Example 2
60 parts by weight of HX-3941HP as an epoxy resin and anionic polymerization initiator, 200 parts by weight (20 parts by weight as a solid content) of a 10% by weight solution of acrylic rubber 1 as an acrylic rubber, and 40 parts by weight of PKHC described above as a film forming component 50% by weight (20 parts by weight as a solid content) of the% solution was blended, and the conductive particles and below were obtained in the same manner as in Example 1 to obtain a circuit connecting material.

Comparative Example 3
60 parts by weight of HX-3941HP as an epoxy resin and an anionic polymerization initiator and 100 parts by weight (40 parts by weight as a solid content) of the above-mentioned 40% by weight solution of PKHC as a film-forming component are blended. In the same manner as above, a circuit connecting material was obtained.

Evaluation example (1) Circuit connection (COF)
A flexible circuit board (FPC-COF type) having a copper circuit with a line width of 25 μm, a pitch of 50 μm, and a thickness of 8 μm formed directly on a polyimide with a thickness of 38 μm using the above-described circuit connection material, and indium oxide (FPC-COF type) on the entire surface. A glass plate having a thickness of 0.7 mm having a thin layer of ITO was connected at 180 ° C.-3 MPa-15 seconds with a width of 2 mm. At this time, after pasting the adhesive surface of the circuit connection material on the ITO glass in advance, it is temporarily connected by heating and pressing at 80 ° C. and 1 MPa for 5 seconds, and then the PET film is peeled off to connect to the FPC-COF type. did.

(2) Circuit connection (TCP)
Other than using a flexible circuit board (FPC-TCP type) having a copper circuit with a line width of 25 μm, a pitch of 50 μm, and a thickness of 18 μm formed on a 75 μm-thick polyimide via an adhesive layer as a flexible circuit board, circuit connection Circuit connection was made in the same manner as (COF).

(3) Measurement of adhesive strength After connection of the circuit, the adhesive strength was measured at 90 ° peeling and a peeling speed of 50 mm / min. In the adhesive strength evaluation of the FPC-COF type, Example 1 and Comparative Example 1 showed an adhesive strength of 8 N / cm or more, Comparative Example 2 4 to 5 N / cm, and Comparative Example 3 2 to 3 N / cm. In the adhesive strength evaluation of the FPC-TCP type, high adhesive strength of 8 N / cm or more was shown in any case.

(4) Connection resistance measurement (connection reliability)
After connection of the circuit, the resistance value between adjacent circuits of both FPC-COF type and FPC-TCP type including the above-mentioned connection part is initially set, and then maintained in a high-temperature and high-humidity tank of 85 ° C./85% RH for 500 hours. Measured with a meter. The resistance value was x + 3σ of the resistance value of 150 points of the adjacent circuit. This value was a good level when the increase ratio after the high temperature and high humidity test with respect to the initial resistance was within 2 times. In the evaluation of the connection resistance of the FPC-COF type, good connection reliability was shown in any case. In addition, the initial connection resistance was low, and the increase in resistance after the high-temperature and high-humidity test was slight, indicating high durability. In the evaluation of the connection resistance of the FPC-TCP type, Example 1 and Comparative Examples 2 and 3 showed good connection reliability like the FPC-COF type. On the other hand, in Comparative Example 1, although the initial resistance value was low, it increased after the high temperature and high humidity test, and the connection reliability was poor.

  The circuit connection material of the present invention can be widely used as an isotropic and anisotropic adhesive for electric and electronic use.

It is sectional drawing which shows the connection method of the circuit terminal concerning one Embodiment of this invention.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 1a 1st circuit electrode 2 2nd board | substrate 2a 2nd circuit electrode 3 Adhesive 4 Conductive particle 5 Heating and pressing head

Claims (9)

A first connection terminal of the first circuit member having a first connecting terminal opposed, is interposed between the second connection terminal of the second circuit member having a second connecting terminal, heating A circuit connection material for electrically connecting the first connection terminal and the second connection terminal facing each other by pressure ,
One of the first circuit member and the second circuit member is COF, the other is a glass substrate,
A circuit connecting material which comprises the following components (1) to (4) as essential , does not contain acrylic rubber, and becomes a film by heating .
(1) Epoxy resin (2) Anion polymerization type curing agent (3) Radical polymerizable substance (4) Generates free radicals by heat , has a half-life of 10 hours or more and a half-life of 1 minute Organic peroxide below 180 ° C The circuit connection material according to claim 1, wherein the component (1) contains a bisphenol type epoxy resin. The circuit connection material according to claim 1 or 2, wherein the component (2) contains one or more of imidazole series, hydrazide series, trifluoroboron-amine complex, amine imide, polyamine salt, dicyandiamide, and modified products thereof. The circuit connection material in any one of Claims 1-3 in which the said component (3) contains one or more among an acrylate, a methacrylate, and a maleimide compound. The circuit connection material according to any one of claims 1 to 4, wherein the component (4) contains one or more of a peroxyester, a dialkyl peroxide, a hydroperoxide, and a silyl peroxide. The component (1) is 5 to 95 parts by weight with respect to 100 parts by weight of the sum of the components (1) and (3), and the component (2) is 30 to 60 parts by weight with respect to 100 parts by weight of the component (1). 5 to 95 parts by weight of the component (3) with respect to 100 parts by weight of the sum of the components (1) and (3), and the component (4) with respect to 100 parts by weight of the component (3). The circuit connection material according to claim 1, wherein 05 to 10 parts by weight are used. Furthermore, the circuit connection material in any one of Claims 1-6 containing a thermoplastic resin. Furthermore, the circuit connection material in any one of Claims 1-7 containing electroconductive particle. The connection structure manufactured using the circuit connection material in any one of Claims 1-8.

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