JP5358718B2 - Electronics - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize structure having high heat radiating efficiency of a heating part while meeting demand of miniaturization and optimum arrangement. <P>SOLUTION: A base 48b is thermally coupled to a heating part. On the base 48b, a group of radiating fins 48a each extending in the Y direction is arranged with spacing in between in the X direction. An exhaust fan 58 and a barrier wall 56 are arranged in opposition to each other with the group of the radiating fins 48a sandwiched in the Y direction. A group of ends on the side of the barrier wall 56 of the group of the radiating fins 48a is most distant (a) from the wall surface 56 at least at one of the outermost positions (X=-4, 4) in the X direction and least distant (b) from the wall surface 56 at a specific position (X=0) different from the outermost positions, and between the specific position and the outermost positions, the closer to the latter, the more distant from the wall surface 56. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation mechanism for radiating heat from a heat-generating component, for example.

  A conventional mechanism of this type is disclosed in Patent Document 1. In this prior art, a radiation fin is fixed on a base attached to a heat-generating component, and air is allowed to flow from one of the radiation fins to the other. The heat radiation fins increase in height as they proceed from the inlet side for taking in air to the outlet side for discharging the air. Since the temperature of the air flowing along the heat radiating fins increases as it approaches the outlet, Patent Document 1 describes that the heat radiating fins are formed higher toward the outlet side, thereby obtaining good heat radiating efficiency.

Also, there is one disclosed in Patent Document 2. In this prior art, a plurality of radiating fins are arranged in series on a base attached to a heat-generating component. A wall surface is provided on the opposite side of the base across the plurality of heat radiation fins, and a wind tunnel is formed between the wall surface and the base. An exhaust fan is provided on the exit side of this wind tunnel, and the wind tunnel between the wall surface and the base becomes narrower as it goes to the exit side. Patent Document 2 states that by expanding the inlet side of the wind tunnel in this manner, air that has not been radiated by the radiating fin on the inlet side is supplied to the radiating fin on the outlet side, and the cooling performance of each radiating fin is made uniform. Have been described.
Japanese Patent Laid-Open No. 60-22398 JP 2004-186702 A

  By the way, in an electronic device such as a game machine, there is a case where it is desired to arrange some member (wall-like member, part, etc.) relatively close to a heat radiating fin or a heat-generating part due to a demand for miniaturization and optimal arrangement. In this case, it becomes a problem to realize a structure in consideration of the heat of the heat generating component.

  For example, there may be a case where a wall-like member (such as a wall surface or a part having a wall-like part) is desired to be disposed on the air inlet side of the radiating fin. In this case, the wall-shaped member may cause a relatively narrow air introduction path to the heat radiating fins. However, even in this case, it becomes a problem to increase the heat radiation efficiency of the heat-generating component.

  Further, for example, there is a case where it is desired to arrange other parts such as a disk drive relatively close to the heat generating parts. In this case, it becomes a problem to suppress the influence of heat from the heat generating component to other components.

  Patent Documents 1 and 2 do not disclose means for solving the above problems.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to realize a structure in consideration of the heat of a heat generating component while responding to the demand for miniaturization and optimal arrangement.

The electronic device according to the first invention includes the following: a heat generating component (38, 40); a base (48b) thermally coupled to the heat generating component; a heat radiating fin group (48a) arranged on the base ; (54) ; and a partition wall (56) between the other component and the radiating fin group and isolating the radiating fin group from the other component . The radiating fin group is arranged only in a partial region of the base, and at least a part of the other components is arranged above the region where the radiating fin group of the base does not exist.

In the first invention, the radiating fin group is arranged on a base provided at a position facing the heat generating component. There is a region where the radiating fin group is not arranged on the base, and at least a part of the other components is disposed above the region. There is a partition between the other parts and the radiating fin group, and the radiating fin group is isolated from the other parts by the partition.

According to the first invention, it is possible to suppress the influence of heat from the heat generating component to other components while responding to the demand for miniaturization and optimal arrangement .
An electronic device according to a second invention is dependent on the first invention, and the radiating fin groups extend in the first direction (Y) and are spaced apart in a second direction (X) intersecting the first direction. An air intake passage (QL, QR) is formed by the end wall group (T2) on the partition wall side of the radiating fin group and the partition wall.

  According to the present invention, it is possible to realize a structure in consideration of the heat of the heat-generating component while meeting the demand for miniaturization and optimal arrangement.

  The above object, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

It is the perspective view which looked at one Example of this invention from the front upper side. It is the perspective view which looked at FIG. 1 Example from the back upper side. It is the perspective view which looked at FIG. 1 Example from the front lower side. It is an illustration figure which shows the part hidden in the cover of the right side surface of FIG. 1 Example. It is an illustration figure which shows a part of assembly process of FIG. 1 Example. FIG. 6 is a perspective view showing a result of the step (before completion of the shield). FIG. 6 is an illustrative view showing a step that follows the step of FIG. 5. It is a perspective view which shows the result (after completion of a shield) of FIG. 7 process. FIG. 8 is an illustrative view showing a state in which a drive unit, a partition wall and an exhaust fan are further mounted after the step of FIG. 7; (A) is a top view which shows the structure of the thermal radiation member applied to FIG. 1 Example, (B) is a side view which shows the structure of the thermal radiation member, (C) shows the structure of the thermal radiation member It is a side view. (A)-(C) is an illustration figure which shows a part of manufacturing process of the thermal radiation member applied to FIG. 1 Example. It is an illustration figure which shows the flow of the air in the heat radiating member of FIG. 1 Example. It is an illustration figure which shows the flow of the air in the thermal radiation member of another Example. (A) is a top view which shows the heat radiating member of another Example, (B) is a top view which shows the heat radiating member of another Example, (C) shows the heat radiating member of another Example further. It is a top view. It is a top view which shows the heat radiating member of the other Example. It is a top view which shows the heat radiating member of the other Example. Furthermore, it is a top view which shows the heat radiating member of other Examples.

  The external appearance of the game apparatus 10 which is one Example of this invention is shown in FIGS. 1 is a perspective view of the game apparatus 10 as viewed from the upper front side, FIG. 2 is a perspective view of the game apparatus 10 as viewed from the upper rear side, and FIG. 3 is a perspective view of the game apparatus 10 as viewed from the lower front side. It is.

  As shown in FIGS. 1 to 3, the game apparatus 10 includes a substantially rectangular parallelepiped housing 12. The front surface 12f of the housing 12 is provided with a disk slot 14a, an SD card slot cover 14b, a power button 16a, a reset button 16b, a disk eject button 16c, and the like.

  A rubber foot 22 and an intake hole 24 are provided on the right side surface 12R of the housing 12. On the rear surface 12b, a USB connector 26, an exhaust hole 28, a peripheral device connector 30, an AV connector 32, a DC connector 34, and the like are provided. Rubber feet 15 and air intake holes 25 are provided on the bottom surface 12u. Covers 18a and 18b that can be opened and closed are provided on the left side surface 12L.

  The part hidden in the cover 18a, 18b of the left side surface 12L is shown in FIG. Referring to FIG. 4, the left side surface 12L is provided with connectors 20a for various controllers (not shown), a memory card slot 20b, an intake hole 27, and the like.

  FIG. 5 shows a part of the assembly process of the game apparatus 10, and FIG. 6 shows the result of the process of FIG. Referring to FIGS. 5 and 6, electronic parts such as CPU 38 and GPU 40 and the above-described connectors (20a, 20b, 30, 32, and 34) are mounted in housing 12 configured as described above. The substrate 36 is accommodated. The substrate 36 is fixed to a bottom plate 46 (corresponding to the bottom surface 12u of the housing 12) via a metal lower shield material 44B.

The CPU 38 and the GPU 40 that are heat-generating electronic components have substantially the same thickness, and are disposed closer to the center of the substrate 36. A heat radiation member 48 made of metal (for example, aluminum) is disposed on the upper surfaces of the CPU 38 and the GPU 40. The heat dissipating member 48 includes a plurality of heat dissipating fins 48a and a base 48b that supports them. The base 48b has a rectangular shape and is large enough to cover the CPU 38 and the GPU 40 without excess or deficiency. At each of the four corners of the base 48b, a downward projection 48c having a cylindrical shape, and a screw hole 48d penetrating the base itself and the projection 48c are formed. The height of the protrusion 48c is slightly larger than the thickness of the CPU 38 and the GPU 40. That is, the protrusion 48 c is a leg for holding the heat dissipation member 48 at the upper surface position of the CPU 38 and the GPU 40.

  Here, the structure of the heat dissipation member 48 will be described in detail. As shown in FIG. 10A, the plurality of heat radiating fins 48a are arranged substantially at regular intervals in parallel with the short side of the base 48b. However, a wider space is secured only between the two heat dissipating fins sandwiching the screw hole 48d than the other in order to attach the screw 54.

  One (upper) end group T1 of the plurality of radiating fins 48a is arranged on one long side (upper side) L1 of the base 48b. The other (lower) end group T2 of the plurality of radiating fins 48a is closest to the center and farthest from the left and right ends of the other long side (lower side) L2 of the base 48b. Are arranged along the V-shaped line (C1). Of the lower end group T2, the one along the V-shaped left straight line is referred to as a lower left end group T2l, and the one along the V-shaped right straight line is referred to as a lower right end group T2r.

  For this reason, as shown in FIG. 10B, from the left side surface (or right side surface) of the heat radiating member 48, the entire lower right end group T2r (or lower left end group T2l) can be seen. In addition, as shown in FIG. 10C, the plurality of heat radiation fins 48a have the same height. Note that the plurality of heat radiation fins 48a may have different heights, or the height may be changed depending on the position within one heat radiation fin.

  Such a heat radiating member 48 is manufactured in the following procedure. First, a base member 48A (see FIG. 11A) having a base 48Ab and a plurality of heat dissipating fins 48Aa having the same length is extruded using an extrusion die (not shown). Next, the extruded original member 48A is subjected to press working in which a part of each of the plurality of radiating fins 48Aa is sequentially cut out by a press block (B1 and B2).

  In the press working, first, as shown in FIG. 11A, the holding member B2 is inserted between the first radiating fin F1 and the second radiating fin F2 from the left side, and the tip of the blade member B1 is moved. It arrange | positions in the left end position of the V-shaped line C1, and the radiation fin F1 is notched by both members B1 and B2.

  Next, as shown in FIG. 11B, the holding member B2 is inserted between the second radiation fin F2 and the third radiation fin F3 from the left side, and the blade member B1 is connected to the V-shaped line C1. Then, the heat dissipating fins F2 are moved to the position of the heat dissipating fins F2, and the heat dissipating fins F2 are cut away by the members B1 and B2. At this time, since the notch position of the radiating fin F2 is located below that of the radiating fin F1, the radiating fin F1 after the notch does not contact the blade member B1.

  Thereafter, similarly, the radiation fins F3, F4,... Are sequentially cut out along the V-shaped line C1. When the notch of the center radiating fin F5 is finished, as shown in FIG. 11C, the direction of the blade member B1 is reversed and this time, the ends of the radiating fins F9 to F6 are changed to the V-shaped line C1 from the right side. Cut out in order along. Thus, if the plurality of heat radiation fins 48Aa of the extruded original member 48A are cut out along the V-shaped line C1, the extrusion die having a simpler shape than the case where the heat radiation member 48 is directly die-cast molded. The manufacturing cost can be reduced.

  As described above, instead of first cutting the radiation fins F1 to F5 from the left side and then cutting the radiation fins F9 to F6 from the right side, the cut from the left side and the cut from the right side may be performed simultaneously. . That is, first cut F1 and F9, then F2 and F8, then F3 and F7, then F4 and F6, and F5. Thereby, manufacturing time can be shortened.

  Returning to FIG. 5 and FIG. 6, the heat conductive sheet 50 is preferably inserted between the heat dissipation member 48, the CPU 38 and the GPU 40. The heat conductive sheet 50 is formed of a material (silicone or the like) rich in flexibility and heat conductivity, and the upper surface thereof is in close contact with the lower surface of the heat dissipation member 48, and the lower surface thereof is in close contact with the upper surfaces of the CPU 38 and the GPU 40. The heat of the CPU 38 and the GPU 40 is efficiently transmitted to the heat radiating member 48 through the heat conductive sheet 50 and radiated from the heat radiating member 48. Thus, the heat dissipation effect of the heat dissipation member 48 is enhanced by providing the heat conductive sheet 50.

  Corresponding to the four screw holes 48d of the heat radiating member 48, four through holes 36a are formed in the substrate 36, four screw holes 44Ba are formed in the lower shield material 44B, and four screw receptacles are formed in the bottom plate 46. 46 a is formed, and four ferrite rings 52 are disposed between the heat dissipation member 48 and the substrate 36. The ferrite ring 52 forms an inductor in cooperation with the protrusion 48c of the heat radiating member 48 and the like, thereby preventing a pulsed charge from entering the shield 44 due to electrostatic discharge or the like.

  Four metal screws 54 for integrating the heat radiating member 48, the substrate 36, the lower shield material 44B, and the bottom plate 46 penetrate the ferrite ring 52, the through hole 36a, and the screw hole 44Ba from the corresponding screw holes 48d. It is connected to the screw receiver 46a. As a result, the heat radiating member 48 is fixed at a position in contact with or sufficiently close to the upper surfaces of the CPU 38 and the GPU 40 as shown in FIG.

  FIG. 7 shows the process following the process in FIG. 5, and FIG. 8 shows the result of the process in FIG. As shown in FIG. 7, after the integration process as described above, the upper shield material 44 </ b> A is attached from the upper surface side of the substrate 36 with a plurality of metal screws 56. As a result, as shown in FIG. 8, the shield 44 is constituted by the upper shield material 44A and the lower shield material 44B, and the inside thereof is electromagnetically shielded.

  A convex portion 44Aa is formed on the upper shield material 44A at a position corresponding to the heat radiating member 48. The convex portion 44Aa has a height corresponding to the base 48b of the heat radiating member 48, and slits 44Ab for the plurality of heat radiating fins 48a are formed on the upper surface thereof. The base 48b is in direct contact with the CPU 38 or the like within the shield (or via the heat conductive sheet 50), and the plurality of heat radiation fins 48a are exposed outside the shield through the slits 44Ab. For this reason, the heat generated by the CPU 38 and the like is efficiently transmitted to the base 48b and is radiated from the plurality of radiation fins 48a to the outside of the shield. That is, no heat is generated in the shield, and a high heat dissipation effect is obtained.

  As shown in FIG. 9, the drive unit 54 is disposed at a position (see FIG. 1) corresponding to the disk slot 14a on the front surface 12f of the housing, in front of the plurality of heat radiation fins 48a on the upper surface of the shield 44. A disk (not shown) inserted from the disk slot 14 a is stored and driven by the drive unit 54.

  Further, since the drive unit 54 is close to the plurality of heat radiation fins 48a, a partition wall 56 is provided between the drive unit 54 and the plurality of heat radiation fins 48a. The movement of the air heated by the plurality of radiating fins 48 a toward the drive unit 54 is prevented by the partition wall 56, thereby suppressing overheating of the drive unit 54.

Further, an exhaust fan 58 is provided between the USB connector 26 at the back of the shield 44 and the peripheral device connector 30, that is, at a position corresponding to the exhaust hole 28 of the housing back surface 12 b (see FIG. 2). The air heated by the heat radiating member 48 is exhausted from the exhaust hole 28 to the outside of the housing 12 by the exhaust fan 58. With this exhaust, the air pressure in the housing 12 decreases, and outside cold air is supplied into the housing 12 from each of the intake holes 24 on the right side surface 12R and the intake holes 25 on the bottom surface 12u. When the covers 18a and 18b on the left side surface 12L are opened, outside air is also taken in from the intake holes 27.

  At this time, an air flow as shown in FIG. 12 occurs in the vicinity of the plurality of radiation fins 48a. Referring to FIG. 12, the plurality of heat dissipating fins 48a are arranged so that the longest heat dissipating fins F5 overlap with the rotation shaft of the exhaust fan 58. It is arrange | positioned in the position which only the predetermined distance b left | separated from the lower end part.

  The positional relationship between the plurality of radiating fins 48a and the exhaust fan 58 is not limited to that shown in FIG. 12, but can be changed as appropriate in consideration of the arrangement of other components.

  Here, when the Y axis is defined upward along the rotation axis of the exhaust fan 58 and the X axis is defined rightward along the partition wall 56, the height of the lower end portion of the longest radiation fin F5 is “Y = b”. The height of the lower end portion of the shortest radiating fin F1 (or F9) is described as “Y = a”. Further, the horizontal positions of the radiation fins F1 to F9 can be expressed as X = -4, X = -3,..., X = 0,.

  Between the plurality of radiating fins 48a and the partition wall 56, the lower left end group T2l and the partition wall 56 form an intake path QL along the X axis, and the lower right end group T2r and the partition wall 56 define X An intake passage QR along the axis is formed. These two intake paths QL and QR form a single M-shaped path. On the other hand, the radiation fins F1 to F9 form eight radiation paths P1 to P8 along the Y axis.

  The outside air enters the heat radiating member 48 from two places, between the heat radiating fins F1 and the partition walls 56 (left opening) and between the heat radiating fins F9 and the partition walls 56 (right opening). Air entering from the left opening travels rightward (X direction) through the intake passage QL, and air entering from the right opening travels leftward (−X direction) through the intake passage QR.

  Since the width of the intake passage QL becomes narrower toward the right, the amount of air flowing through each position (X = −4, −3,. This means that the air that has entered through the left opening flows almost uniformly into the heat radiation paths P1 to P4. Similarly, since the width of the intake passage QR becomes narrower as it goes to the left, the amount of air flowing through each position (X = 4, 3,..., 0) of the intake passage QR decreases as it moves to the left. This means that the air that has entered from the right opening flows almost uniformly into the heat radiation paths P8 to P5.

  As is clear from the above, in the heat radiating member 48 of this embodiment, since the lower end portions of the plurality of heat radiating fins 48a (F1 to F9) are cut out along the V-shaped line C1, a plurality of heat radiating fins 48a and M-shaped paths (intake paths QL and QR) are formed between the partition walls 56 and a large amount of air can be taken in from large left and right openings. Further, the left half of the M-shaped path (intake path QL) becomes narrower as it goes to the right, and the right half (intake path QR) becomes narrower as it goes to the left. It spreads evenly over the entire heat radiation fin 48a (heat radiation paths P1 to P8). For this reason, a high heat dissipation effect is obtained.

  In the heat radiation member 48 of this embodiment, the lower ends (T2) of the plurality of heat radiation fins 48a are cut out along the V-shaped line C1 as shown in FIG. 12, but as shown in FIG. It may be cut out along a single straight line C2 inclined with respect to 56. Also in this case, a large amount of air is taken into the intake passage QL mainly from the large opening on the left side (between the heat radiation fins F1 and the partition wall 56), and is distributed throughout the heat radiation fins 48a (heat radiation paths P1 to P8). Can be made.

  Compared with the case of FIG. 12, although the total area of the openings is small, the steps of the lower end portions of the plurality of radiating fins 48a are small, so the air flow in the intake passage QL is smooth (that is, the ventilation resistance is small). . For this reason, there is no discoloration in the supply amount of air, and a high heat dissipation effect is obtained.

  In addition, the V-shaped line C1 when the lower end portions of the plurality of heat radiation fins 48a (F1 to F9) are cut out may be asymmetrical as shown in FIG. Further, the notch pattern is not limited to the V shape, and may be a U shape (or an arc shape) as shown in FIG. When a curve is used, the curvature may change depending on the position as shown in FIG.

  In general, if the lower ends of the plurality of heat dissipating fins 48a are cut out along a curve or straight line that decreases monotonously in the left section and monotonously increases in the right section, the left and / or Alternatively, a large amount of air is taken in from the large opening on the right and can be distributed evenly throughout the plurality of heat radiation fins 48a, so that a high heat radiation effect can be obtained.

  Further, in this embodiment, the interval between the plurality of heat radiation fins 48a (the width of each of the heat radiation paths P1 to P8) is constant, but this may be changed depending on the position in the X direction. An example is shown in FIG. Referring to FIG. 15, the widths d1 to d8 respectively corresponding to the heat radiation paths P1 to P8 are the widest in the heat radiation paths P4 and P5 adjacent to the longest heat radiation fin F5 and become narrower as the distance from the heat radiation fin F5 increases (that is, d1 <D2 <d3 <d4, d5> d6> d7> d8).

  In general, fluids such as air are less likely to flow as long as they have the same width. Therefore, it is considered that the air flow can be made more uniform by providing the heat radiation paths P1 to P8 with a width corresponding to the length thereof. However, if the width of the heat radiation path is widened, the heat radiation area is reduced, so that the heat radiation effect is not necessarily enhanced.

  Further, the base 48b of the heat radiating member 48 has a region where the heat radiating fin 48a is not disposed as a result of the notch, but such a blank region may be removed as shown in FIG. However, in this embodiment, the CPU 38 and the GPU 40 are also present immediately below the blank area, and the blank area also serves to transfer heat from the CPU 38 and the like to the plurality of heat radiation fins 48a. Further, a part of the drive unit 54 is above the blank area (see FIG. 10A), and the blank area functions to prevent heat from the CPU 38 and the like from being directly transmitted to the drive unit 54. In such a case, it is preferable not to remove the blank area.

  The function of the blank area as described above is irrelevant to the shape of the notch pattern (and thus the arrangement of the plurality of heat radiation fins 48a). Therefore, for example, as shown in FIG. 17, the lower end group of the plurality of heat radiation fins 48a may be simply cut away in parallel with the lower side L2 of the base 48b. Space saving is also realized by arranging some of the parts such as the drive unit 54 in the blank area.

  Further, in this embodiment, the end group T1 on the exhaust fan 58 side of the plurality of radiating fins 48a is arranged along a straight line (upper side L1 of the base 48b) perpendicular to the plurality of radiating fins 48a (see FIG. 10 (A)), and may be arranged along a straight line or a curved line inclined with respect to the plurality of radiating fins 48a.

DESCRIPTION OF SYMBOLS 10 ... Game device 11 ... Radiation mechanism 12 ... Housing 24, 25, 27 ... Intake hole 28 ... Exhaust hole 38 ... CPU
40 ... GPU
48 ... Radiating member 48a, F1-F9 ... Radiating fin 48b ... Base 54 ... Drive unit 56 ... Bulkhead 58 ... Exhaust fan P1-P8 ... Radiating path QL ... Left intake path QR ... Right intake path T1 ... Upper end group T2 ... Bottom Side end group Y ... Exhaust direction

Claims (2)

Heating parts,
A base provided at a position facing the heat generating component;
Arranged on the base a heat radiating fin group,
Other parts , and
Between the other component and the radiating fin group, a partition that isolates the radiating fin group from the other component ,
The radiating fin group is arranged only in a partial region of the base,
At least a part of the other component is an electronic device that is disposed above a region of the base where the radiating fin group does not exist. The heat dissipating fin groups are arranged on the base at intervals in a second direction that extends in the first direction and intersects the first direction,
The intake passage between the heat radiating fin group of the partition wall-side end group and the partition wall is formed, an electronic apparatus of claim 1, wherein.

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