JP5356769B2 - Mounting table - Google Patents

Description

  The present invention relates to a mounting table on which an object to be inspected is placed when inspecting an electrical property of the object to be inspected such as a wafer, and more specifically, for example, surrounded by an annular protrusion at an outer peripheral edge like a Tyco wafer. The present invention relates to a mounting table used for an object to be inspected having a recess.

  In general, an inspection apparatus includes a loader chamber for transferring an object to be inspected (for example, a wafer) and a prober chamber for inspecting electrical characteristics of the wafer transferred from the loader chamber. The prober chamber includes a movable mounting table for mounting a wafer, a probe card disposed above the mounting table, an alignment mechanism for aligning a plurality of electrode pads on the wafer and a plurality of probes on the probe card, The plurality of electrode pads and the plurality of probes on the aligned wafer are brought into electrical contact with each other, and a predetermined electrical characteristic inspection is performed based on an inspection signal from the tester.

  For example, as shown in FIG. 7A, the mounting table includes a top plate 1 on which a wafer (not shown) is mounted, and an insulator 2 integrated with the top plate 1. It can be moved up and down on an XY stage (not shown). Adsorption means is formed on the upper surface of the top plate 1, and the wafer is adsorbed and fixed to the upper surface of the top play via the adsorption means.

  When electrical characteristics inspection of a wafer is performed, after the wafer is sucked and fixed on the upper surface of the top plate 1 via the suction means, the mounting table moves in the horizontal direction via the XY stage and the top plate 1 is lifted and lowered. The plurality of electrode pads on the wafer and the plurality of probes on the probe card are in electrical contact with each other, and a predetermined electrical property inspection is performed.

  Thus, as shown in FIG. 7B, the top plate 1 is made of a ceramic sintered body 1A such as alumina and a conductive metal such as gold formed on the upper surface of the ceramic sintered body 1A. A conductor coating 1B. The conductor coating 1B is formed as an electrode by, for example, ion plating. The electrode 1B is connected to the tester side, and a predetermined inspection signal is applied from the tester side. The insulator 2 is formed of a ceramic sintered body such as zircon cordierite.

  In the conventional mounting table shown in FIG. 7, the electrode 1B is formed by ion plating on the upper surface of the ceramic sintered body 1A of the top plate 1 as described above. When the electrical characteristics are inspected by applying a high current, the metal component of the metal coating such as Ag applied to the lower surface of the wafer moves to the electrode 1B of the top plate 1 to discolor the electrode 1B, and its surface resistance As a result, there is a problem that the reliability of inspection is lowered. Therefore, conventionally, when the top plate 1 changes color, the mounting table is replaced with a new one.

  In terms of wafers, recent wafers are extremely thin and difficult to transport. Therefore, Tyco wafers are used in which annular protrusions are formed around the entire outer periphery of the lower surface of the wafer to prevent wafer deformation. Yes. In the case of this Tyco wafer, as in the case of other wafers, there is a problem that the electrode 1B of the top plate 1 of the mounting table changes color due to the metal component.

  In addition, this kind of mounting base is described in patent documents 1 and 2, for example. In the mounting table of Patent Document 1, the top plate is formed of an insulating material such as quartz or polytetrafluoroethylene, the conductor layer formed by gold vapor deposition or the like is formed on the top surface, and the shield member is disposed on the bottom surface. ing. Patent Document 2 describes a mounting table in which a conductor coating is formed only on the top surface of a top plate made of an insulating material.

JP 63-138745 A JP 62-291937 A

  However, in the case of the conventional mounting table, when the electrical property inspection using high voltage and high current is repeated, the surface of the top plate 1 is discolored due to the movement of the metal component from the wafer to the top plate 1, and the surface resistance is reduced. If the height is increased, components other than the top plate 1 that do not need to be replaced are also replaced. Therefore, there is a problem that the replacement cost is increased.

  The present invention has been made to solve the above-described problems, and even when the top plate (mounting body) is discolored and contaminated by electrical characteristic inspection using high voltage and high current, the mounting body of the mounting table. It is an object of the present invention to provide a mounting table that can reduce the replacement cost without replacing only the other components.

  According to a first aspect of the present invention, there is provided a mounting table for performing an electrical property inspection of an object to be inspected having a recessed portion surrounded by an annular protrusion formed over the entire outer peripheral edge of the lower surface. A mounting table for mounting an inspection body, comprising: a mounting body having a mounting surface for the object to be inspected; and an insulator to which the above-mentioned mounting body is detachably fixed. A mounting portion that is fitted to a recessed portion of the object to be inspected and the above-described mounting surface is in contact with the lower surface of the object to be inspected, and is formed outside the above-described mounting portion and receives the annular protrusion. And the mounting body is fixed to the insulator in the annular plane portion using a fastening member.

  A mounting table according to a second aspect of the present invention is the mounting table according to the first aspect, wherein a plurality of mounting bodies having mounting portions corresponding to the recessed portions of the plurality of test objects having different sizes are provided. It is characterized by having.

  The mounting table according to claim 3 of the present invention is characterized in that, in the invention according to claim 1 or 2, the mounting body has a conductor film formed on the mounting surface. To do.

  According to a fourth aspect of the present invention, there is provided a mounting table according to the third aspect, wherein the mounting body is replaced when the conductor film is contaminated.

  According to the present invention, even if the top plate (mounting body) is discolored and contaminated by electrical characteristic inspection using high voltage and high current, only the mounting body of the mounting table is replaced, and other components are replaced. There is no need for replacement, and a mounting table that can reduce replacement costs can be provided.

  Hereinafter, the present invention will be described based on the embodiment shown in FIGS. In each figure, FIG. 1 is a partially cutaway front view showing an example of an inspection apparatus to which an embodiment of the mounting table of the present invention is applied, and FIG. 2 is a cross-sectional view showing the mounting table shown in FIG. 3 is an exploded perspective view showing the mounting table shown in FIG. 2, FIG. 4 is a cross-sectional view showing another embodiment of the mounting table of the present invention, and FIG. 5 is an exploded view of the mounting table shown in FIG. FIGS. 6A and 6B are side views showing a part of a mounting body adapted to a wafer having a different size. FIG.

First Embodiment First, an inspection apparatus provided with a mounting table according to the present embodiment will be described with reference to FIGS. As shown in FIG. 1, for example, the inspection apparatus is an object to be inspected such as a Tyco wafer (Taiko wafer).
A prober chamber 10 for inspecting the electrical characteristics of the wafer W and a loader chamber (not shown) for transferring the Tyco wafer W to the prober chamber 10 are provided. For example, a plurality of power devices are formed on the Tyco wafer W used in the present embodiment. This Tyco wafer W has a recessed portion surrounded by an annular protrusion formed over the entire circumference of the outer peripheral edge of the lower surface, and has a structure that is easy to handle by preventing the bending of the extremely thin main body. Yes.

  As shown in FIG. 1, the prober chamber 10 includes a mounting table 20 on which a Tyco wafer W is mounted, an XY table 30 that moves the mounting table 20 in the X and Y directions, and a probe card disposed above the mounting table 20. 40, an alignment mechanism (not shown) for aligning a plurality of probes 41 of the probe card 40 and a plurality of electrode pads (not shown) of the Tyco wafer W on the mounting table 20, and a plurality of upper surfaces of the probe card 40 A test head 50 electrically connected to the terminal electrode, and after alignment of the plurality of electrode pads of the Tyco wafer W on the mounting table 20 and the plurality of probes 41 of the probe card 40 by the alignment mechanism, A high voltage, high voltage is applied to a power device formed on the Tyco wafer W by electrically contacting the plurality of probes 41 and the plurality of electrode pads. Inspecting electrical characteristics by applying the flow. As shown in FIG. 1, the mounting table 20 is moved up and down by a lifting body 20 </ b> A provided on the XY table 30.

  Further, the mounting table 20 is electrically connected to the test head 50 via the central conductor of the coaxial cable 51 as shown in FIG. Then, at the time of inspection, an inspection signal is applied from the probe 41 to the electrode pad of the semiconductor wafer W, and an inspection signal is applied from the test head 50 to the mounting body of the mounting table 20. Perform a predetermined capacity measurement.

  Thus, as shown in FIGS. 2 and 3, the mounting table 20 of the present embodiment includes a mounting body 21 (which corresponds to a conventional top plate) 21 on which the Tyco wafer W is mounted and a mounting body 21 that is detachable. The mounting body 21 is fastened and fixed to the insulator 22 via a plurality of (for example, four) fastening members (for example, screw members) 23. . As shown in FIG. 2, an insulating ring 24 is interposed between the mounting body 21 and the insulator 22, and the mounting body 21 and the insulator 22 are fastened by four screw members 23 with the insulating ring 24 interposed. Has been.

  The mounting body 21 will be further described. On the top surface of the mounting body 21, a mounting portion 21 </ b> A that fits into the recessed portion of the Tyco wafer W is formed to protrude as shown in FIGS. 2 and 3. An annular flat surface portion 21B is formed on the outer surface of the mounting portion 21A on the upper surface of the wafer. The annular flat portion 21B is formed to have substantially the same width as the annular protrusion. Therefore, when the Tyco wafer W is placed on the upper surface of the placement body 21, the placement portion 21A is fitted into the recessed portion of the Tyco wafer W so that the lower surface of the Tyco wafer W comes into contact with the placement surface of the placement portion 21A and the annular protrusions are formed. The lower surface is in contact with the annular flat surface portion 21B in the entire region. In addition, as shown in FIGS. 2 and 3, the annular flat surface portion 21 </ b> B of the mounting body 21 is formed with notches 21 </ b> C into which, for example, the heads of four screw members 23 are fitted at equal intervals in the circumferential direction. A hole through which the screw member 23 passes is formed on the bottom surface of each cutout portion 21C. The annular protrusion of the Tyco wafer W may have a structure that does not contact the annular flat surface portion 21B of the mounting body 21.

  Further, as shown in FIGS. 2 and 3, a plurality of suction holes 21D that are radially distributed are formed on the mounting surface of the mounting body 21 (only a part thereof is shown in FIG. 2). As shown in FIG. 2, it leads to a shallow groove 21E formed in a predetermined pattern on the lower surface of the mounting body 21. These grooves 21 </ b> E communicate with each other and are sealed by a cover 25 joined to the lower surface of the mounting body 21. As shown in FIG. 2, the cover 25 is joined to the lower surface of the mounting body 21 by a fastening member (for example, a screw member) 26. An exhaust device (not shown) is connected to the space formed by the groove 21E and the cover 25, and the exhaust device exhausts the space. Accordingly, when the Tyco wafer W is placed on the placement body 21 and the air in the suction holes 21D and the space is exhausted by the exhaust device, the Tyco wafer W is attracted and fixed to the placement portion 21A.

  An annular protrusion 22A that protrudes upward is formed on the entire circumference of the outer peripheral edge of the insulator 22, and screw holes 22B corresponding to the four through holes of the mounting body 21 are formed on the upper surface of the annular protrusion 22A. . An insulating ring 24 is disposed between the annular protrusion 22A and the lower surface of the outer peripheral edge of the mounting body 21, and through holes corresponding to the four through holes of the mounting body 21 are also formed in the insulating ring 24. Yes. The insulator 22 is formed of an insulating material made of a ceramic sintered body such as zircon cordierite, for example, as in the conventional case.

Therefore, when mounting the mounting body 21 on the insulator 22, the cover 25 is first joined to the lower surface of the mounting body 21 via the screw member 26 to seal the groove 21E. Next, the through hole of the insulating ring 24 is aligned with the screw hole 22B of the annular protrusion 22A of the insulator 22 and the through hole of the cutout portion 21C of the mounting body 21 is aligned with the through hole of the insulating ring 24. 21 is placed. Thereafter, the mounting body 21 and the insulating ring 24 can be fastened and fixed to the insulating body 22 using the screw member 23 to form the mounting table 20.

  Next, the operation will be described. When the mounting table 20 receives the pre-aligned Tyco wafer W from the loader chamber in the prober chamber 10, the recessed portion of the Tyco wafer W and the mounting portion 21A of the mounting body 21 are fitted. At this time, the lower surface of the Tyco wafer W is in contact with the placement surface of the placement portion 21A, and the annular protrusion of the Tyco wafer W is in contact with the entire area of the annular plane 21B. In this state, the exhaust device is driven to suck and fix the Tyco wafer W on the mounting surface of the mounting portion 21A. Next, the XY table 30 is operated to move the mounting table 20 in the X direction and the Y direction, so that the alignment between the Tyco wafer W and the probe 41 of the probe card 40 is performed via the alignment mechanism.

  Thereafter, the mounting table 20 is moved directly below the probe 41, the mounting table 20 is lifted through the lifting body 20A, the plurality of electrode pads of the Tyco wafer W and the plurality of probes 41 are in contact, and the mounting body is further moved. 21 is overdriven, and the electrode pad of the Tyco wafer W and the probe 41 are in electrical contact. In this state, a high voltage (for example, 5 kV) and high current (for example, 100 A) high-frequency signal is applied from the test head 50 to the Tyco wafer W via the probe 41, and an inspection signal is applied to the mounting body 21. A predetermined electrical property test is performed on the device.

  After completing the predetermined inspection for all the power devices on the Tyco wafer W, the mounting table 20 moves to the loader chamber side, delivers the inspected Tyco wafer to the loader chamber, receives the next Tyco wafer, and repeats the above inspection. If the inspection is repeated, Ag moves from the metal (for example, Ag) film on the lower surface of the Tyco wafer W to the conductor film of the mounting body 21, the conductor film is discolored by the metal, and the surface resistance of the conductor film is increased. There is a risk of reducing reliability. In this case, in this embodiment, the operator can easily replace only the mounting body 21. That is, the mounting body 21 can be separated from the insulator 22 and removed by removing the four screw members 23 of the mounting table 20. Next, the new mounting body 21 can be easily fastened and fixed to the insulator 22 by the screw member 23 through the insulating ring 24.

  As described above, according to the present embodiment, the mounting body 21 having the mounting surface of the Tyco wafer W and the insulator 22 to which the mounting body 21 is fixed are provided. A mounting portion 21A formed so as to be in contact with the lower surface of the Tyco wafer W, and an annular flat surface portion 21B formed outside the mounting portion 21A and receiving the annular protrusion of the Tyco wafer W. Since the mounting body 21 is fixed to the insulator in the annular plane portion 21B using the screw member 23, the electrical characteristics inspection is repeatedly performed by applying a high voltage and a high current to the power device. Even if the conductor coating of the material changes color due to the metal component of the Tyco wafer W and the surface resistance increases, only the mounting body 21 can be easily replaced via the screw member 23, and the insulator 22 and the insulating ring 24 are continued. Shi Can be used, it is possible to reduce the replacement cost of the mounting table 20.

Second Embodiment The mounting table 20 ′ of the present embodiment is basically configured according to the first embodiment except that the suction means for the Tyco wafer W is different. In the present embodiment, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals.

  That is, the mounting table 20 ′ of this embodiment includes a mounting body 21 and an insulator 22 as shown in FIGS. 4 and 5. On the upper surface of the mounting body 21, a mounting portion 21A and an annular flat surface portion 21B are formed as in the first embodiment. In this embodiment, unlike the first embodiment, the cover 25 is unnecessary, and the space for the screw member 26 protruding from the cover 25 toward the insulator 22 can be omitted. Therefore, the insulating ring 24 may not be provided.

  Therefore, the suction means for the Tyco wafer W of this embodiment has a structure for sucking the Tyco wafer W by the plurality of annular grooves 21F formed on the placement surface of the placement portion 21A. That is, the plurality of annular grooves 21F are formed concentrically around the center of the placement surface of the placement portion 21A as shown in FIGS. Each of the annular grooves 21F is formed so that one suction hole 21D is opened from a flow path (not shown) in the surface layer portion of the placement portion 21A. These suction holes 21D are arranged in a straight line in the radial direction as shown in FIG. 5, and communicate with each other via a flow path of the mounting portion 21A. A suction part 21G disposed inside the mounting part 21A communicates with the suction hole 21D on the radially outer side, and air is discharged from the plurality of annular grooves 21F via an exhaust device (not shown) connected to the suction part 21G. Is evacuated to attract and fix the Tyco wafer W to the mounting portion 21A.

  As described above, according to the present embodiment, the suction means for the Tyco wafer W can be simplified, and also in the present embodiment, the same operational effects can be expected as in the first embodiment.

Third Embodiment A mounting table 20 ″ of the present embodiment is configured according to the first and second embodiments, except that a mounting body corresponding to a Tyco wafer W having a different size is provided. In this embodiment, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals.

  As shown in FIGS. 6A and 6B, the mounting table 20 ″ of the present embodiment includes a mounting body 21 corresponding to the size of the Tyco wafer W. The mounting shown in FIG. The mounting body 21 is used for, for example, a 200 mm diameter Tyco wafer W and has the same structure as the mounting body 21 of each of the mounting tables 20 and 20 ′ of the first and second embodiments. Is omitted.

  A mounting body 21 shown in FIG. 6B is used for a wafer W having a diameter of 150 mm. The outer diameter of the mounting body 21 is formed to be the same size as the outer diameter of the mounting body 21 shown in FIG. 6A, and the mounting portion 21A fits the wafer W having a diameter of 150 mm. Is formed. Therefore, the annular flat surface portion 21B surrounding the placement portion 21A is formed wider than that shown in FIG. And the notch part 21C which attaches four screw members along the outer peripheral part of the cyclic | annular plane part 21B is formed at equal intervals in the circumferential direction. A plurality of outer diameters of the mounting portion 21A are prepared according to the size of the Tyco wafer W.

  Accordingly, when the size of the Tyco wafer W is switched from 200 mm to 150 mm, the size of the Tyco wafer W can be simply changed by replacing the placement body 21 shown in FIG. 6A with the placement body 21 shown in FIG. Can respond to changes. As described above, the mounting table 20 ″ according to the present embodiment prepares the mounting body 21 corresponding to the sizes of a plurality of types of Tyco wafers W, so that one mounting table 20 corresponds to a plurality of Tyco wafers W having different sizes. be able to.

  In addition, this invention is not restrict | limited at all to the said embodiment, A design change can be suitably carried out as needed.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used for an inspection apparatus used for inspecting an electrical property of an object to be inspected having a recessed portion surrounded by an annular protrusion formed over the entire outer peripheral edge of the lower surface.

It is a front view partially broken and showing an example of an inspection device to which one embodiment of the mounting base of the present invention is applied. It is sectional drawing which takes out and shows the mounting base shown in FIG. It is a perspective view which decomposes | disassembles and shows the mounting base shown in FIG. It is sectional drawing which shows other embodiment of the mounting base of this invention. It is a perspective view which decomposes | disassembles and shows the mounting base shown in FIG. (A), (b) is a side view which fractures | ruptures and shows a part of mounting body which fits the Tyco wafer from which size differs, respectively. (A), (b) is a fragmentary figure which shows an example of the conventional mounting base, respectively, (a) is the side view, (b) is a part of cross section of the mounting body of the mounting base shown in (a). It is sectional drawing expanded and shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Mounting base 21 Mounting body 21A Mounting part 21B Annular plane part 22 Insulator 23 Screw member (fastening member)
W Tyco wafer (inspected object)

Claims (4)

  A mounting table for mounting the object to be inspected in order to perform an electrical characteristic inspection of the object to be inspected having a recessed portion surrounded by an annular protrusion formed over the entire outer peripheral edge of the lower surface, A mounting body having a mounting surface for the object to be inspected, and an insulator on which the above-mentioned mounting body is detachably fixed; the above-mentioned mounting body fits into a recessed portion of the above-mentioned object to be inspected; A mounting portion formed so that the mounting surface is in contact with the lower surface of the object to be inspected, and an annular flat surface portion that is formed outside the mounting portion and receives the annular protrusion, and using a fastening member The mounting table is fixed to the insulator at the annular plane portion.   2. The mounting table according to claim 1, comprising a plurality of mounting bodies each having a mounting portion corresponding to the recessed portions of the plurality of test objects having different sizes.   The mounting table according to claim 1, wherein a conductor film is formed on the mounting surface.   The mounting table according to claim 3, wherein the mounting body is replaced when the conductor film is contaminated.

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