JP5356741B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus that performs laser processing of a workpiece while moving a processing position.

  A laser processing apparatus for drilling is to perform laser processing on a workpiece by condensing a pulsed laser beam emitted from a laser oscillator on the workpiece. In such a laser processing apparatus, a workpiece is placed on an XY table, and a drilling process is performed by moving a processing head to a desired position (processing position) on the workpiece. When moving the processing position, the laser processing apparatus drives the XY table and relatively moves the processing head to a position where laser processing is performed next. Thereafter, the entire region of the workpiece is laser processed by repeating this operation.

The laser beam irradiated from the laser oscillator is condensed at a processing point on the workpiece, and thereby, for example, thermal energy of about several tens (mJ / mm ² ) per unit area is applied to the processing point. As a result, at the processing point, the material instantly sublimes and the processing dust rises. As a material to be laser processed by a laser processing apparatus, an organic material such as a resin or an inorganic material such as ceramic is generally used. The laser processing apparatus may process a resin covered with a surface-treated copper foil. As described above, since the laser processing apparatus performs laser processing on various materials, the processing dust contains various components.

  In order to remove the processing dust, the conventional laser processing apparatus is provided with a processing gas injection mechanism for injecting a gas such as dry air and a dust collection duct for collecting the air in the processing chamber as a dust collection mechanism for the processing dust. . Then, by sandwiching the machining head between the machining gas injection mechanism and the dust collection duct and flowing the wind in one direction, machining dust generated from the workpiece is caused to flow toward the dust collection duct before reaching the machining head ( For example, see Patent Document 1).

  Further, if the processed lens is soiled, it may cause a processing failure. Therefore, it is necessary to protect the processed lens of the laser processing apparatus. For this reason, for example, the processing head is composed of an upper cylinder and a lower cylinder supported by the upper cylinder, and a condensing lens for condensing the laser beam on the workpiece is arranged in the upper cylinder. In addition, there is a processing head in which a window lens for protecting the condenser lens is disposed in the lower cylindrical body (see, for example, Patent Document 2).

International Publication No. WO2002 / 0776668 Pamphlet JP 2005-125339 A

  However, some processed dust reaches an optical element (protective window) for protecting the processed lens. Since this processed dust accumulates on the optical element, dirt is generated on the lower surface of the protective window as laser processing proceeds. When the amount of machining dust adhering to the optical element increases, the amount of the laser beam passing through the protective window decreases, so that the optical energy of the laser beam focused on the workpiece processing point decreases. If the reduction amount of the light energy is less than the processing margin, there may be a processing failure such that the hole diameter of the hole to be laser processed becomes smaller than the desired hole diameter. For this reason, the former and latter prior arts have a problem that the protective window must be frequently cleaned.

  In addition, when the amount of processing dust generated is large, it may be better to clean the protective window while processing one workpiece. In the former and the latter prior arts, in order to clean the protective window during the machining of a single workpiece, the machining of the workpiece must be stopped and the protective window must be cleaned, thus increasing the machining time of the workpiece. There was a problem to do.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus capable of suppressing the occurrence of processing defects without increasing the processing time of a workpiece.

In order to solve the above-described problems and achieve the object, the present invention includes a condensing lens that condenses a laser beam at a processing position on a workpiece, and a laser beam irradiation side that is the lower surface side of the condensing lens. In a laser processing apparatus for performing laser processing on a workpiece by irradiating the workpiece with the laser beam from the processing head. A laser processing unit for sequentially laser processing a plurality of processing areas set on the workpiece while moving a relative position between the processing head and the workpiece in a plane parallel to the main surface of the workpiece; A cleaning member that cleans the bottom surface of the protection member by moving while contacting the bottom surface of the protection member on the laser beam irradiation side; A control unit that controls the operation of the cleaning member, and when the time from the start of laser processing reaches a predetermined time, the control unit determines the number of processing holes after the start of laser processing. Laser processing of one processing area of the plurality of processing areas at any timing when the predetermined number is reached or when the number of workpieces processed after laser processing is started becomes a predetermined number during but which completed is moved a relative position between said and said machining head laser processing unit stops the radiation of the laser beam so that the machining head comes above the next processing area the workpiece, the A cleaning member is operated to cause the cleaning member to clean the protection member.

  According to the present invention, since the cleaning member cleans the protective member while stopping the irradiation of the laser beam and moving the relative position between the processing head and the workpiece, the processing time of the workpiece is increased. There is an effect that the occurrence of processing defects can be suppressed.

  Embodiments of a laser processing apparatus according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a laser processing apparatus according to Embodiment 1 of the present invention. The laser processing apparatus 100 is an apparatus for laser processing a workpiece W such as a multilayer printed circuit board or a ceramic plate (green sheet), and collects a pulsed laser beam L emitted from a laser oscillator (not shown) on the workpiece W. Light and drill the workpiece W.

  The laser processing apparatus 100 includes a processing head 1, an XY table 3, a gas injection mechanism 4, a dust collection duct 5, a wiping mechanism 7, and a control device 10. The processing head 1 includes a laser beam scanning device, a condensing lens, and a protective window (protective member) 2, and condenses the laser beam L from the laser oscillator and irradiates the workpiece W.

  Of the constituent elements in the laser processing apparatus 100, the constituent elements that perform laser processing on the workpiece W by irradiating the workpiece W with the laser beam L correspond to the laser processing section described in the claims.

  The processing head 1 includes a processing lens (not shown) and has a substantially cylindrical shape. The laser beam L from the laser oscillator is incident from the substantially cylindrical upper surface side of the processing head 1 and is emitted from the lower surface side.

  A protective window 2 that is an optical component for protecting the lower surface side of the machining head 1 is provided on the lower surface of the machining head 1. The protective window 2 has a substantially disk shape, and is arranged so that one main surface (upper surface side) abuts the lower surface of the processing head 1. Therefore, the laser beam L emitted from the lower surface side of the machining head 1 passes through the protective window 2 from the upper surface side of the protective window 2 toward the lower surface side (Z-axis direction), and the lower surface (bottom surface) side of the protective window 2. It is emitted from. The machining head 1 and the protective window 2 are arranged in the laser machining apparatus 100 so that their main surfaces are parallel to the XY table 3.

  The XY table 3 places the workpiece W and moves on the XY plane. The XY table 3 fixes the work W on the XY table 3, for example, by sucking the work W from the lower surface side.

  The gas injection mechanism 4 and the dust collection duct 5 are devices for collecting the machining dust H generated from the workpiece W during laser processing. The gas injection mechanism 4 and the dust collection duct 5 are arranged so that the machining head 1 is sandwiched between the gas injection mechanism 4 and the dust collection duct 5.

  The gas injection mechanism 4 causes a wind to flow in one direction by injecting a gas such as dry air to the dust collection duct 5 side, and sends processing dust H generated from the workpiece W to the dust collection duct 5 side. The dust collection duct 5 collects the machining dust H generated from the workpiece W by sucking air in the machining chamber.

  The wiping mechanism 7 is one feature of the present embodiment, and cleans the protective window 2 by wiping off the processing dust H adhering to the protective window 2. The wiping mechanism 7 has a bar-like wiping device (cleaning member) 6, and the wiping device 6 moves on the lower surface of the protective window 2 in contact with the lower surface, thereby wiping the processing dust H of the protective window 2.

  The control device (control unit) 10 is connected to the wiping mechanism 7. The control device 10 controls the wiping mechanism 7 based on the operation of the XY table 3. The control device 10 according to the present embodiment cleans the protective window 2 by operating the wiping mechanism 7 while the XY table 3 is moving (while laser irradiation is not performed).

  In FIG. 1, a machining control unit 31 (to be described later) that performs control related to laser machining of the workpiece W is not shown. For example, the processing control unit 31 controls the XY table 3 and the laser oscillator in order to control the processing position and the emission control of the laser beam L. The processing control unit 31 is connected to the control device 10 and transmits information related to the movement of the XY table 3 to the control device 10.

  In the laser processing apparatus 100, the processing head 1 is positioned at a desired processing position on the workpiece W to perform drilling. The laser processing apparatus 100 performs a predetermined number of holes at one positioned processing position. FIG. 1 shows a case where nine holes P are drilled at one processing position.

  The number of holes P that can be machined at one machining position (in the machining area) is arbitrary, and is programmed in advance in the machining control unit 31 of the laser machining apparatus 100. A plurality of machining areas each having a predetermined area are set for the workpiece W. The laser processing apparatus 100 moves the XY table 3 to relatively move the processing head 1 so that the processing head 1 is positioned above the position where laser processing is performed next. When the laser processing in the processing area is completed, the laser processing apparatus 100 moves the processing head 1 to the next processing area and repeats the processing for performing laser processing at the next processing position. Thereafter, this operation is repeated until the laser processing of the entire surface of the workpiece W (all processing areas) is completed. The movement route of the XY table 3 is programmed in advance in the machining control unit 31 of the laser machining apparatus 100. FIG. 1 shows a case where the laser processing apparatus 100 performs laser processing on the processing area A1, and then moves the XY table 3 to perform laser processing on the processing area A2.

  Next, the configuration of the wiping mechanism 7 will be described. FIG. 2 is a diagram illustrating a configuration of the wiping mechanism. The wiping mechanism 7 includes a wiping device 6 and a wiping device driving mechanism. The wiping device driving mechanism includes a motor M, and the motor M drives the wiping device 6 in accordance with an instruction from the control device 10.

  The motor M is joined to a substantially rod-shaped support portion 21 and moves the support portion 21 in the XY plane. The wiping device 6 is joined to one end (the side opposite to the motor M) of the support portion 21, and the wiping device 6 moves in the XY plane together with the support portion 21. Two stoppers S and S are disposed near the other end (motor M side) of the support portion 21, and the support portion 21 reciprocates between the stoppers S and S.

  The wiping device 6 has a sharp side for cleaning the protective window 2. The wiping device 6 has, for example, a triangular prism shape, and one side in the height direction faces the lower surface of the protective window 2. In other words, in the wiping device 6, the column axis direction as the longitudinal direction is substantially parallel to the longitudinal direction of the support portion 21, and one side surface (lower portion) extending in the longitudinal direction faces the upper side of the support portion 21. So as to be joined to the support portion 21.

  Here, the operation of the wiping device 6 will be described. 3 and 4 are diagrams for explaining the operation of the wiping device 6. FIG. FIG. 3 shows a cross-sectional view of the machining head 1 when the machining head 1 is viewed from the Y-axis direction (a view when the machining head 1 is cut along the XZ plane). FIG. 4 is a bottom view of the machining head 1 when the machining head 1 is viewed from the Z-axis direction.

  As shown in FIG. 3, a protective window 2 is provided at the lower part of the machining head 1, and the wiping device 6 is arranged so that the lower side (bottom surface) of the protective window 2 and the wiping device 6 are in contact with each other. Then, the wiping device 6 cleans the bottom surface of the protective window 2 as the wiping device 6 moves in the XY plane.

  As shown in FIG. 4, the longitudinal direction of the wiping device 6 is configured to be larger than the diameter of the protective window 2. Then, as the support portion 21 moves between the stoppers S and S around the position of the motor M, the wiping device 6 rotates to draw a fan shape by a predetermined angle in the XY plane. The stoppers S and S stop the wiping device 6 by coming into contact with the wiping device 6 and restrict the operation of the wiping device 6 so that the wiping device 6 does not move out of a predetermined range.

  When the protective window 2 is cleaned, the wiping device 6 moves while contacting the protective window 2, and the protective window 2 is not in contact with the protective window 2 while the protective window 2 is not cleaned (while the laser is irradiated). Wait outside of 2.

  The wiping device drive mechanism is not limited to motor drive by the motor M, and the support portion 21 may be moved by air drive. Moreover, although the case where the wiping apparatus 6 is a triangular prism shape was demonstrated here, the shape of the wiping apparatus 6 is not restricted to a triangular prism shape, Any shape may be sufficient.

  The wiping mechanism 7 of the present embodiment protects using the time during which the XY table 3 is driven (for example, about 0.3 to 1 second for moving the position of the processing head 1 on the workpiece W relative). The processing dust H adhering to the window 2 is cleaned. Specifically, in the laser processing apparatus 100, the wiping device 6 is driven while moving the XY table 3. For example, after the machining area A1 is machined and before the machining head 1 moves from the machining area A1 to the machining area A2, the wiping device 6 is driven to clean the machining dust H adhering to the protective window 2. . At this time, the wiping device 6 reciprocates on the lower surface of the protective window 2 by the number of times corresponding to the time during which the XY table 3 is moving, for example.

  Next, a detailed configuration of the control device 10 will be described. FIG. 5 is a block diagram illustrating a configuration of the control device according to the first embodiment. The control device 10 is a device such as a PC (Personal Computer), and includes a table operation information input unit 11, an operation command unit 12, and a motor control unit 13.

  The table operation information input unit 11 inputs information related to the operation of the XY table 3 (signal used when the XY table 3 moves) (hereinafter referred to as table operation information) from the processing control unit 31. The table operation information is, for example, a signal (instruction information) that is transmitted to a drive unit (such as a motor) of the XY table 3 when the processing control unit 31 controls the drive of the XY table 3. When the laser processing of one processing area is completed and the processing position is moved to the next processing area, the processing control unit 31 transmits a signal for driving the XY table 3 to the XY table 3 side. Therefore, table operation information is input to the table operation information input unit 11 from the processing control unit 31 when the laser processing of one processing area is completed and the processing position is moved to the next processing area. The table motion information input unit 11 sends table motion information from the machining control unit 31 to the motion command unit 12.

  The operation command unit 12 detects the movement of the XY table 3 based on the table operation information. When the movement command unit 12 detects the movement of the XY table 3, the movement command unit 12 sends an operation instruction to the motor control unit 13 only in accordance with the time during which the movement of the XY table 3 is detected. When the movement detection of the XY table 3 ends, the operation command unit 12 sends an operation instruction to the motor M so that the wiping device 6 moves to a position where it does not contact the protective window 2. When the movement of the XY table 3 is detected, the operation command unit 12 issues an operation instruction for moving the wiping device 6 for a predetermined time (number of times) (for example, an operation instruction for reciprocating the wiping device 6 once). You may send to the motor control part 13. The motor control unit 13 drives and controls the motor M in accordance with an operation instruction from the operation command unit 12.

  Next, an operation procedure of the laser processing apparatus 100 will be described. FIG. 6 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment. The flowchart shown on the left side of FIG. 6 is a processing procedure for processing control related to the processing of the workpiece W, and the flowchart shown on the right side of FIG. 6 is a processing procedure for cleaning control related to cleaning of the protective window 2.

  The laser processing apparatus 100 irradiates the workpiece W with the laser beam L, and laser-processes the processing area An (n-th processing area) (n is a natural number) of the workpiece W (step S11). When the laser processing of the processing area An is completed, the processing control unit 31 of the laser processing apparatus 100 stops the irradiation of the laser beam L onto the workpiece W and moves the XY table 3. Thereby, the laser processing apparatus 100 moves the processing head 1 to the next processing position (step S12). At this time, table operation information is input from the processing control unit 31 to the table operation information input unit 11 (step S21). The table motion information input unit 11 sends table motion information from the machining control unit 31 to the motion command unit 12.

  The operation command unit 12 detects the movement of the XY table 3 based on the table operation information and sends an operation instruction to the motor control unit 13. The motor control unit 13 drives and controls the motor M according to the operation instruction from the operation command unit 12, and the motor M operates the wiping device 6. Thereby, the processing dust H adhering on the protection window 2 is removed as a cleaning process of the protection window 2 (step S22). In other words, the laser processing apparatus 100 simultaneously performs the process of step S12 (movement of the XY table 3) and the processes of steps S21 and S22 (cleaning of the protective window 2).

  When the XY table 3 moves and the machining head 1 moves onto the machining area A (n + 1), which is the next machining position, the laser machining apparatus 100 irradiates the workpiece W with a laser beam to produce the machining area A (n + 1). ) Is laser processed (step S13). At this time, when the machining head 1 moves onto the machining area A (n + 1) and the movement of the XY table 3 stops, the operation command unit 12 detects the stop of the XY table 3 based on the table operation information, and the motor A stop instruction is sent to the control unit 13. The motor control unit 13 stops the motor M and stops the wiping device 6 according to the stop instruction from the operation command unit 12. The wiping device 6 is moved to the outside of the protective window 2 so as not to interfere with the laser beam L applied to the workpiece W from the processing head 1. In the laser processing apparatus 100, the processes in steps S11 to S13 and the processes in steps S21 and S22 are repeated.

  As described above, since the laser processing apparatus 100 automatically cleans the protective window 2 during laser processing, the protective window 2 can always be kept in a normal state, and the occurrence of processing defects can be prevented while suppressing a significant increase in processing tact. Can be suppressed. Further, since the protective window 2 is cleaned immediately after the processing dust H adheres, the processing dust H can be easily removed.

  Further, since the protective window 2 can be cleaned simply by controlling the operation of the wiping device 6 without causing the machining head 1 to perform a special operation, the protective window 2 can be easily cleaned. Further, since the protective window 2 is cleaned by the wiping device 6, the protective window 2 can be easily cleaned with a simple configuration.

  As described above, according to the first embodiment, since the protective window 2 is cleaned while the XY table 3 is moving, it is possible to suppress the occurrence of processing defects without increasing the processing time of the workpiece W. it can.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, every time the laser processing progresses to a predetermined timing set in advance, the wiping device 6 is made to clean the protective window 2. For example, the laser processing apparatus 100 cleans the protective window 2 after the XY table 3 has moved a predetermined number of times (after processing a predetermined number of processing areas). In other words, the laser processing apparatus 100 does not operate the wiping device 6 every time the XY table 3 moves, but operates the wiping device 6 when the XY table 3 reaches a preset number of movements.

  FIG. 7 is a block diagram illustrating a configuration of the control device according to the second embodiment. Among the constituent elements in FIG. 7, constituent elements that achieve the same functions as those of the control device 10 of the first embodiment shown in FIG. 5 are given the same numbers, and redundant descriptions are omitted.

  The control device 10 includes a set number counter processing unit 14 in addition to the table operation information input unit 11, the operation command unit 12, and the motor control unit 13. The set number counter processing unit 14 stores the number of times set in advance by the user (the number of times the XY table 3 is moved before cleaning). The set number counter processing unit 14 uses the information about the movement of the XY table 3 (notification indicating that the XY table 3 has been moved) sent from the operation command unit 12 to XY after cleaning the protective window 2 last time. The number of times the table 3 has been moved (cumulative number of movements after cleaning) is counted. The set number counter processing unit 14 determines whether or not it is the cleaning timing of the protective window 2 by comparing the preset number with the counted number. When the set number counter processing unit 14 counts that the XY table 3 has moved a predetermined number of times after cleaning the protective window 2, it notifies the operation command unit 12 that it is the cleaning timing of the protective window 2.

  In other words, the set number counter processing unit 14 reads a preset number of times, counts the number of movements of the XY table 3, and issues an operation command for the wiping device 6 to the operation command unit 12 at a predetermined timing. The operation command unit 12 of the present embodiment sends an operation instruction to the motor control unit 13 to operate the wiping device 6 when there is an operation command for the wiping device 6 from the set number counter processing unit 14.

  Next, an operation procedure of the laser processing apparatus 100 will be described. FIG. 8 is a flowchart showing an operation procedure of the laser processing apparatus according to the second embodiment. The flowchart shown on the left side of FIG. 8 is a processing procedure for processing control related to the processing of the workpiece W, and the flowchart shown on the right side of FIG. 8 is a processing procedure for cleaning control related to cleaning of the protective window 2. Of the operation procedures of the laser processing apparatus 100 according to the second embodiment, the description of the procedure for performing the same operation as that of the laser processing apparatus 100 according to the first embodiment is omitted.

  The laser processing apparatus 100 irradiates the workpiece W with the laser beam L and laser-processes the processing area An of the workpiece W (step S31). When the laser processing of the processing area An is completed, the processing control unit 31 of the laser processing apparatus 100 stops the irradiation of the laser beam L onto the workpiece W and moves the XY table 3 to move the processing head 1 to the next processing position. Move upward (step S32). At this time, table operation information is input from the processing control unit 31 to the table operation information input unit 11 (step S41). The table motion information input unit 11 sends table motion information from the machining control unit 31 to the motion command unit 12.

  The operation command unit 12 detects the movement of the XY table 3 based on the table operation information. When the movement command unit 12 detects the movement of the XY table 3, the operation command unit 12 notifies the set number counter processing unit 14 that the XY table 3 has moved.

  The set number counter processing unit 14 counts the number of times the XY table 3 has been moved by counting the notification that the XY table 3 has moved. The set number counter processing unit 14 determines whether or not the protective window 2 needs to be cleaned by comparing the preset number with the counted number (steps S42 and S43).

  The set number counter processing unit 14 determines that it is the cleaning timing of the protective window 2 when it counts that the XY table 3 has moved a preset number of times after cleaning of the protective window 2 (Yes in step S43) and operates. An operation command for the wiping device 6 is sent to the command unit 12. When the set number counter processing unit 14 sends an operation command of the wiping device 6 to the operation command unit 12, the counter value of the counter is reset.

  When the operation command unit 12 receives an operation command for the wiping device 6 from the set number counter processing unit 14, the operation command unit 12 sends an operation instruction to the motor control unit 13. The motor control unit 13 controls driving of the motor M, and the motor M operates the wiping device 6. Thereby, the processing dust H adhering on the protection window 2 is removed as a cleaning process of the protection window 2 (step S44). In other words, the laser processing apparatus 100 performs the process of step S32 and the processes of steps S41 to S44 simultaneously.

  On the other hand, the set number counter processing unit 14 determines that it is not the cleaning timing of the protective window 2 until it counts that the XY table 3 has moved a preset number of times (No in step S43), and the operation command unit. The operation command of the wiping device 6 is not sent to 12. Therefore, the operation command unit 12 waits for the next table operation information without sending an operation instruction to the motor control unit 13 until the XY table 3 moves a preset number of times.

  Thereafter, laser processing apparatus 100 performs laser processing on processing area A (n + 1), similarly to laser processing apparatus 100 of the first embodiment (step S33). In the laser processing apparatus 100, the processes in steps S31 to S33 and the processes in steps S41 to S44 are repeated.

  In this embodiment, the case where it is determined whether or not the protective window 2 is to be cleaned after the movement of the XY table 3 has been described has been described. However, the protective window 2 is cleaned before the movement of the XY table 3 is started. It may be determined whether or not to do so. For example, it may be determined whether or not the protective window 2 is to be cleaned after the processing of the processing area An is completed, and whether or not the protective window 2 is to be cleaned before the processing of the processing area An is completed. It may be determined. Further, it may be determined whether or not the protective window 2 is to be cleaned after the processing of the processing area A (n-1) is completed.

  When it is determined whether or not the protective window 2 is to be cleaned before the movement of the XY table 3 is started, and it is determined that the protective window 2 is to be cleaned when the XY table 3 moves next, the laser processing apparatus 100 cleans the protective window 2 during the next movement of the XY table 3.

  In the present embodiment, the protective window 2 is cleaned when the number of movements of the XY table 3 reaches a predetermined number. However, when the time after the start of laser processing reaches a predetermined time. The protective window 2 may be cleaned. In this case, the set number counter processing unit 14 stores a time set in advance by the user (time for performing laser processing before cleaning).

  Further, the protective window 2 may be cleaned when the number of processed holes after the start of laser processing reaches a predetermined number. In this case, the set number counter processing unit 14 stores the number set in advance by the user (the number of holes for laser processing before cleaning).

  Contamination of the protective window 2 due to laser processing may not occur only by processing one processing area. Depending on the contents of processing, the dirt may exceed the allowable amount in about one hour, or the wiping may not be required for about one day. For this reason, the processing time that can be processed before the protective window 2 is cleaned and the number of workpieces W are set in the set number counter processing unit 14. This eliminates the need for cleaning each time the processing area is moved, so that the protective window 2 can be efficiently cleaned.

  As described above, according to the second embodiment, since the protective window 2 is cleaned after the XY table 3 has moved a predetermined number of times, the protective window 2 is efficiently cleaned at an appropriate timing according to the content of the processing. It becomes possible.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to FIGS. When the processing time of the cleaning process of the protective window 2 is longer than the movement time of the XY table 3, the laser beam L may hit the wiping device 6. If the wiping device 6 is irradiated with the laser beam L, the laser beam L may not reach the workpiece W and cause processing defects. Therefore, in the third embodiment, the laser processing is controlled so that the laser processing is not started until the cleaning processing of the protective window 2 is completed.

  FIG. 9 is a block diagram illustrating a configuration of the control device according to the third embodiment. Among the constituent elements in FIG. 9, constituent elements that achieve the same functions as those of the control device 10 of the first embodiment shown in FIG. 5 are given the same numbers, and redundant descriptions are omitted.

  The control device 10 includes a cleaning completion determination unit 15 in addition to the table operation information input unit 11, the operation command unit 12, and the motor control unit 13. When the operation command unit 12 according to the present embodiment sends an operation instruction to the motor control unit 13, information indicating that the operation instruction is being sent to the motor control unit 13 (hereinafter referred to as motor operation information) is determined to be cleaned. It transmits to the part 15. The motor operation information may be, for example, the same signal as an operation instruction to the motor control unit 13.

  The cleaning completion determination unit 15 determines whether or not the cleaning process of the protective window 2 has been completed based on the motor operation information, and performs laser processing on the processing control unit 31 until the cleaning process of the protective window 2 is completed. Send an instruction (wait command) not to start.

  Next, an operation procedure of the laser processing apparatus 100 will be described. FIG. 10 is a flowchart showing an operation procedure of the laser processing apparatus according to the third embodiment. The flowchart shown on the left side of FIG. 10 is a processing procedure for processing control related to the processing of the workpiece W, and the flowchart shown on the right side of FIG. 10 is a processing procedure for cleaning control related to cleaning of the protective window 2. Note that, among the operation procedures of the laser processing apparatus 100 of the third embodiment, the description of the procedure for performing the same operation as the laser processing apparatus 100 of the first and second embodiments is omitted.

  The laser processing apparatus 100 irradiates the workpiece W with the laser beam L and laser-processes the processing area An of the workpiece W (step S51). When the laser processing of the processing area An is completed, the processing control unit 31 of the laser processing apparatus 100 stops the irradiation of the laser beam L onto the workpiece W and moves the XY table 3 to move the processing head 1 to the next processing position. Move upward (step S52). At this time, table operation information is input from the processing control unit 31 to the table operation information input unit 11 (step S61). The table motion information input unit 11 sends table motion information from the machining control unit 31 to the motion command unit 12.

  The operation command unit 12 detects the movement of the XY table 3 based on the table operation information and sends an operation instruction to the motor control unit 13. The motor control unit 13 drives and controls the motor M according to the operation instruction from the operation command unit 12, and the motor M operates the wiping device 6. Thereby, the processing dust H adhering on the protection window 2 is removed as a cleaning process of the protection window 2 (step S62).

  The operation command unit 12 transmits motor operation information to the cleaning completion determination unit 15 simultaneously with an operation instruction to the motor control unit 13. The cleaning completion determination unit 15 determines whether or not the cleaning process for the protective window 2 has been completed based on the motor operation information (step S63).

  While the operation command unit 12 sends an operation instruction to the motor control unit 13, the motor M and the wiping device 6 are operating. Further, while the operation command unit 12 sends an operation instruction to the motor control unit 13, information (motor operation information) indicating that the motor M and the wiping device 6 are operating is sent to the cleaning completion determination unit 15. . Therefore, the cleaning completion determination unit 15 determines that the cleaning process of the protective window 2 has not been completed while receiving the motor operation information from the operation command unit 12. If the cleaning process for the protective window 2 has not been completed (step S63, No), the laser processing apparatus 100 continues to clean the protective window 2. That is, the cleaning completion determination unit 15 repeats the processes of step S62 and step S63 until the cleaning process of the protective window 2 is completed. The cleaning completion determination unit 15 sends a wait command to the processing control unit 31 so as not to start laser processing until the cleaning process of the protective window 2 is completed.

  The cleaning completion determination unit 15 may determine whether or not the XY table 3 has been moved based on the table operation information. In this case, when the XY table 3 finishes moving while the wiping device 6 is operating (while the motor operation information is sent), the cleaning completion determination unit 15 causes the processing control unit 31 to perform the next laser processing. A wait command is issued so as not to start. Then, the cleaning completion determination unit 15 stops the weight command to the processing control unit 31 when the wiping device 6 stops.

  When the cleaning process of the protective window 2 is completed (step S63, Yes), the cleaning completion determination unit 15 notifies the processing control unit 31 of the cleaning completion (step S64). Thereafter, laser processing apparatus 100 performs laser processing on processing area A (n + 1), similarly to laser processing apparatus 100 of the first embodiment (step S53). In the laser processing apparatus 100, the process of step S51-S53 and the process of step S61-S64 are performed repeatedly.

  Here, the difference between the conventional laser processing timing and the laser processing timing of the present embodiment will be described. FIG. 11 is a diagram for explaining the laser processing timing of the present embodiment.

  Conventionally, as shown in (a), after starting the movement of the XY table 3 (t11), when the movement of the XY table 3 is completed (t12), laser processing is started. On the other hand, the laser processing apparatus 100 of this Embodiment starts the operation | movement of the wiping apparatus 6 (t22), when the movement of the XY table 3 is started as shown in (b) (t21). Then, even when the movement of the XY table 3 is completed (t23), laser processing is not started, and after the operation of the wiping device 6 is completed (t24), laser processing is started. Thereby, the start of laser processing is made to wait until the wiping device 6 finishes wiping the processing dust H of the protective window 2. Thus, since laser processing is not started until the cleaning process of the protective window 2 is completed, the laser processing apparatus 100 can perform the cleaning process only for a user's desired time (time set by the user). . For example, the wiping device 6 may be reciprocated once under the protective window 2 as a single cleaning process, or may be reciprocated a desired number of times.

  As described above, according to the third embodiment, since the laser processing is not started until the cleaning processing of the protective window 2 is completed, it is possible to perform the cleaning processing only for the time set by the user without causing processing failure. .

Embodiment 4 FIG.
Next, a fourth embodiment of the present invention will be described with reference to FIG. When the amount of machining dust H is small and the concern about machining defects is low, it may not be necessary to clean the protective window 2 during laser machining of the workpiece W. Therefore, in the fourth embodiment, the protective window 2 is cleaned after the laser beam machining of one workpiece W is completed.

  The control device 10 according to the fourth embodiment has the same configuration as that of the control device 10 described with reference to FIG. FIG. 12 is a flowchart showing an operation procedure of the laser processing apparatus according to the fourth embodiment. The flowchart shown on the left side of FIG. 12 is a processing procedure for machining control relating to machining of the workpiece W, and the flowchart shown on the right side of FIG. 12 is a procedure for cleaning control relating to cleaning of the protective window 2. Of the operational procedures of the laser processing apparatus 100 according to the fourth embodiment, the description of the procedures for performing the same operations as those of the laser processing apparatus 100 according to the first embodiment will be omitted.

  The laser processing apparatus 100 irradiates the workpiece W with the laser beam L and laser-processes the processing area An of the workpiece W (step S71). When the laser processing of the processing area An is completed, the processing control unit 31 of the laser processing apparatus 100 stops the irradiation of the laser beam L onto the workpiece W, moves the XY table 3, and moves the processing head 1 to the next processing position. (Step S72).

  When the XY table 3 moves and the machining head 1 moves onto the machining area A (n + 1), which is the next machining position, the laser machining apparatus 100 irradiates the workpiece W with the laser beam L, and the machining area A ( n + 1) is laser processed (step S73).

  The laser processing apparatus 100 performs laser processing on all processing areas in the workpiece W by repeating laser processing to the processing area and movement of the XY table 3 (step S74). Thereafter, the processing control unit 31 sends to the table motion information input unit 11 that the laser processing of the workpiece W has been completed (processing completion notification). The table operation information input unit 11 sends a processing completion notification from the processing control unit 31 to the operation command unit 12.

  The operation command unit 12 sends an operation instruction to the motor control unit 13 upon receiving the machining completion notification. The motor control unit 13 drives and controls the motor M according to the operation instruction from the operation command unit 12, and the motor M operates the wiping device 6. Thereby, the processing dust H adhering on the protection window 2 is removed as a cleaning process of the protection window 2 (step S81). When the laser processing apparatus 100 performs laser processing on a plurality of workpieces W, the processes in steps S71 to S73 and the process in step S81 are repeated.

  In addition, operation | movement of the control apparatus 10 of this Embodiment respond | corresponds to operation | movement of the workpiece | work unit cleaning control part as described in a claim. In other words, the control device 10 has a control function corresponding to the work unit cleaning control unit in addition to the control function described in the first embodiment.

  In the present embodiment, the case where the protection window 2 is cleaned after the laser processing of the workpiece W is completed has been described. However, the protection window 2 may be cleaned before the laser processing of the workpiece W is started. .

  As described above, according to the fourth embodiment, since the protective window 2 is cleaned after laser processing for one workpiece W is completed, simple control can be performed when laser processing with a small amount of processing dust H is performed. Laser processing and cleaning of the protective window 2 can be performed.

Embodiment 5 FIG.
Next, a fifth embodiment of the present invention will be described with reference to FIG. In the fifth embodiment, after the liquid such as water or alcohol is atomized and sprayed on the protective window 2, the protective window 2 is cleaned by the wiping device 6.

  FIG. 13 is a diagram illustrating a laser processing apparatus according to the fifth embodiment. Of the constituent elements shown in FIG. 13, constituent elements that achieve the same functions as those of the laser processing apparatus 100 of the first embodiment shown in FIG.

  The laser processing apparatus 100 includes a spraying device (liquid spraying unit) in addition to the processing head 1, the XY table 3, the gas injection mechanism (gas injection unit) 4, the dust collection duct (gas suction unit) 5, the wiping mechanism 7, and the control device 10. ) 8 and a liquid tank 9. In addition, in the laser processing apparatus 100 of FIG. 13, illustration of the XY table 3 is abbreviate | omitted.

  The spraying device 8 is a device that sprays a liquid such as water or alcohol on the lower surface of the protective window 2 in the form of a mist. The spraying device 8 is disposed on the lower surface side of the protective window 2 and sprays the liquid onto the protective window 2 from a spraying port for spraying the liquid. The liquid tank 9 is a tank for storing a liquid such as water or alcohol supplied to the spraying device 8.

  In the laser processing device 100, the spray device 8 sprays the liquid in the liquid tank 9 on the protective window 2 in the form of a mist. When the spraying device 8 sprays alcohol onto the protective window 2, the alcohol evaporates, but if it is drifting in the optical path, it may become a gas that lowers the processing energy. Therefore, in this embodiment, when the spraying device 8 sprays alcohol, the spraying device 8 sprays the alcohol by an amount that does not reduce the processing energy.

  Further, the spraying device 8 sprays the liquid onto the protective window 2 before the wiping device 6 wipes off the processing dust H of the protective window 2. In the present embodiment, after the wiping device 6 cleans the protective window 2, the spraying device 8 sprays the liquid by an amount that does not leave the liquid in the protective window 2. The amount of liquid sprayed by the spraying device 8 may be changed according to the cleaning processing time of the protective window 2 by the wiping device 6, the moving distance of the wiping device 6, and the like.

  For example, if the dust collection mechanism (the gas injection mechanism 4 and the dust collection duct 5) of the processed dust H and the spray device 8 are operated simultaneously, the liquid sprayed from the spray device 8 may not fly in a desired direction. Therefore, while the spraying device 8 is spraying the liquid, the operation of either or both of the gas injection mechanism 4 and the dust collection duct (dust collector) 5 may be temporarily stopped.

  In order to stop the operation of the gas injection mechanism 4 and the dust collection duct 5, the flow of wind from the gas injection mechanism 4 to the dust collection duct 5 is shut out by, for example, a shutter. Further, in order to stop the operation of the gas injection mechanism 4 and the dust collection duct 5, the operation of the gas injection mechanism 4 and the dust collection duct 5 may be controlled to be off.

  As described above, according to the fifth embodiment, since the protective window 2 is cleaned by the wiping device 6 after the liquid is atomized and sprayed on the protective window 2, the wiping device 6 is processed dust H adhering to the protective window 2. Can be easily wiped off.

  In addition, you may combine the laser processing apparatus 100 demonstrated in Embodiment 1-5. For example, the laser processing apparatus 100 described in the first to fourth embodiments has a smaller number of cleaning processes in the order of the first to fourth embodiments. When performing laser processing on the workpiece W, any of the cleaning processes described in the first to fourth embodiments may be selected according to the type and processing status of laser processing. For example, the number of cleanings is increased for laser processing with a large amount of processing dust, such as when processing through the copper foil on the surface to the next layer of resin. On the other hand, the number of cleanings is reduced for laser processing with a small amount of processing dust, such as when laser processing is performed only on a resin that does not contain glass fiber or other materials. The frequency of the number of cleanings is set in the laser processing apparatus 100 in advance by the user.

  As described above, the laser processing apparatus according to the present invention is suitable for laser processing of a workpiece that generates processing dust.

1 is a diagram showing a laser processing apparatus according to Embodiment 1. FIG. It is a figure which shows the structure of a wiping off mechanism. It is sectional drawing of a processing head at the time of seeing a processing head from the Y-axis direction. It is a bottom view of a processing head when the processing head is viewed from the Z-axis direction. 2 is a block diagram illustrating a configuration of a control device according to Embodiment 1. FIG. 3 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment. 6 is a block diagram illustrating a configuration of a control device according to Embodiment 2. FIG. 6 is a flowchart showing an operation procedure of the laser processing apparatus according to the second embodiment. FIG. 10 is a block diagram illustrating a configuration of a control device according to a third embodiment. 10 is a flowchart showing an operation procedure of the laser processing apparatus according to the third embodiment. FIG. 10 is a diagram for explaining the laser processing timing of the laser processing apparatus according to the third embodiment. 10 is a flowchart showing an operation procedure of the laser processing apparatus according to the fourth embodiment. It is a figure which shows the laser processing apparatus which concerns on Embodiment 5. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing head 2 Protective window 3 XY table 4 Gas injection mechanism 5 Dust collection duct 6 Wiping device 7 Wiping mechanism 8 Spraying device 9 Liquid tank 10 Control device 11 Table operation information input unit 12 Operation command unit 13 Motor control unit 14 Set number counter Processing unit 15 Cleaning completion determination unit 21 Support unit 31 Processing control unit 100 Laser processing device H Processing dust W Work M Motor

Claims (4)

A condensing lens that condenses the laser beam at a processing position on the workpiece; and a protective member that is disposed on the laser beam irradiating side on the lower surface side of the condensing lens and protects the condensing lens. In a laser processing apparatus for performing laser processing on a workpiece by irradiating the workpiece with the laser beam from the processing head,
A laser processing unit for sequentially laser processing a plurality of processing areas set on the workpiece while moving a relative position between the processing head and the workpiece in a plane parallel to the main surface of the workpiece;
A cleaning member that cleans the bottom surface of the protection member by moving while contacting the bottom surface of the protection member on the side that irradiates the workpiece with a laser beam;
A control unit for controlling the operation of the cleaning member;
With
The controller is
When the time since the start of laser processing is a predetermined time, when the number of processed holes after the start of laser processing reaches a predetermined number, or the number of workpieces processed since the start of laser processing The laser beam so that the machining head is positioned above the next machining area after the laser machining of one machining area of the plurality of machining areas is completed. while the processing unit is a laser beam irradiation is moved the stop and the machining head relative position between the workpiece, that to perform cleaning of the protective member to the cleaning member to operate the said cleaning member A featured laser processing apparatus. The controller is
2. The laser processing apparatus according to claim 1, wherein the laser processing unit does not start laser beam irradiation until the cleaning member completes cleaning of the protection member.   The laser processing apparatus according to claim 1, further comprising a liquid spraying unit that sprays a mist-like liquid onto the protective member. A gas injection part for injecting gas to the processing head side;
A gas suction portion for sucking gas on the processing head side;
Further comprising
The gas injection part and the gas suction part are
While performing laser processing on the workpiece, gas flows from the gas injection unit to the gas suction unit to collect dust from the workpiece generated during laser processing, and the liquid spraying unit sprays the liquid. The laser processing apparatus according to claim 3, wherein at least one of gas injection by the gas injection unit and gas suction by the gas suction unit is stopped during the interval.

Images