JP5344856B2 - Floor material and its joining structure and joining method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To completely prevent water from intruding from the tongue joint section between floor members 20 into the floor members in a flooring formed by joining, to each other, the floor members 20 in which a recessed groove 14 for a spline is formed in four peripheral end surfaces of a wooden formed plate 10 using a spline 15. <P>SOLUTION: The recessed groove 14 for a spline is formed in the four peripheral end surfaces of the wooden formed plate 10 in a trilaminar structure having a core layer section 11 of low density and a front surface layer section 12 and a rear surface section 13 higher in density than the core layer section in such a manner that the core layer section 11 is removed. The spline 15 used for tongue joint is formed of a material manufactured by a material excellent in water resistance than the core layer section 11 of the wooden formed plate 10. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a flooring material in which recessed grooves for hires are formed on the four peripheral end surfaces, and a joining structure and a joining method for joining the flooring materials using hires.

  It is known to use, as a flooring material, a wood piece molding plate obtained by adding an adhesive to a wood piece (chip), forming it, and heat-pressing it like a particle board. In addition, as one form of flooring material, there is also known one in which a hiring sag groove is formed on the four peripheral end surfaces. A plurality of sheets are spread on the floor base while being joined to each other by inserting hiring sane that is common to both sides, and the flooring is made.

  When using wood chipboards to produce flooring with grooving grooves on the four peripheral edges, the wood chipboard is weaker in strength than plywood and swellable due to moisture absorption. Compared to the floor material to be used, cracks and chips are likely to occur in the formed hire groove and its vicinity. In addition, when water enters from the end face of the flooring, swelling occurs, and swelling or expansion is likely to occur at the joint between the flooring.

  In a wooden building material that uses particle board, which is one of the wooden piece molding plates, as a core material, a hire groove is formed around the core material, and a sag material that is tougher than particle board is inserted into it. After that, a wooden building material has been proposed in which the tip of the sap material is exposed by cutting to form a male sap part (Patent Document 1). By doing so, it is possible to cut out and process a male sap part that is free from cracks and chips. Moreover, it can be expected that swelling due to water absorption at least in the male tan part can be suppressed.

  On the other hand, it is also known to apply waterproofing treatment by applying water-resistant resin, wax, paraffin, etc. to the floor of the floor material in order to prevent the floor material from flooding and to prevent swelling due to water absorption at the joint part of the floor material. (See, for example, Patent Document 2 and Patent Document 3).

JP 07-290411 A JP 2005-297262 A JP 2000-274054 A

  A wood piece molded plate obtained by adding an adhesive to a wood piece and heat-pressing like a particle board has a high density compared to the core layer portion which is a low density layer and the core layer portion according to a normal forming method. It has a three-layer structure of a surface layer portion and a back layer portion which are density layers. Also, there are cases in which a three-layered wood piece molding board is manufactured using wood pieces of different sizes. Usually, a rough piece of wood is used for the core layer portion, and a fine size is used for the surface layer portion and the back layer portion. A piece of wood is used. Therefore, in the case of a wood piece molded plate, the water absorption is different between the core layer portion and the surface layer portion and the back layer portion, the core layer portion exhibits high water absorption and the expansion amount is large, and the surface layer portion and the back layer portion In comparison, the water absorption is low and the amount of expansion is small.

  As described in Patent Document 1, a groove for hire sane is formed around the particle board, and when the sap material that is plywood is inserted therein to form the male sane portion as the hire sane, it is plywood. Water absorption from the male ridge is suppressed. However, since no special consideration is given to the three-layer structure of the particle board, for example, the groove for hiring sané is formed so as to leave a part of the core layer portion having a large water absorption, In case that the floor is made by inserting the sap material into the male sap part, when water is submerged from the sunk joint part of the floor materials, moisture enters the inside from the end face of the remaining core layer part, and the sap joint There is a risk of swelling or swelling in the part.

  On the other hand, as described in Patent Documents 2 and 3, the method of applying a waterproofing agent to the sap portion in advance to prevent water intrusion from the sap joining portion varies in the amount of the waterproofing agent applied due to differences in density and wood piece roughness. It is easy to occur and it is difficult to obtain a stable waterproof effect.

  The present invention has been made in view of the circumstances as described above, and a concave groove for hire is formed on the four peripheral end surfaces of the wood piece molding plate, and a plurality of these are joined using hire so as to obtain a flooring. In such a case, the floor material and its floor can be more completely prevented from intruding into the floor material from the joints between the floor members, and the swelling and expansion of the joints can be avoided. It is an object to provide a bonding structure and a bonding method.

  The flooring according to the present invention is employed on the four peripheral end surfaces of a wood chip molding plate having a three-layer structure of a core layer portion that is a low-density layer and a surface layer portion and a back layer portion that are high-density layers compared to the core layer portion. A floor material in which a concave groove for sane is formed, wherein the concave groove for hire sane is formed so as to remove at least the core layer portion of the wooden piece molding plate.

  Further, the floor material joining structure according to the present invention is a floor material joining structure in which hired sane is fitted into the above-described recessed groove for hiring sage of the above-mentioned floor material and the facing floor materials are joined to each other. The hiring sane made of a material superior in water resistance to the core layer portion of the wood piece forming plate constituting the floor material is used.

  In the flooring according to the present invention, the recessed groove for hire used for fitting hire is formed so as to remove all the core layer portion which is the low density layer. Therefore, only the side surfaces of the surface layer portion and the back layer portion, which are higher-density layers, are exposed on the four peripheral end surfaces of the flooring. In the floor material joining structure according to the present invention, the employment sane made of a material superior in water resistance to the core layer portion of the wood chip forming plate constituting the flooring material is employed as the employment sane to be fitted into the recessed groove for employment sap. Is used.

  Accordingly, in the flooring with the flooring joining structure according to the present invention, that is, the flooring in which a plurality of flooring materials according to the present invention are hired and spread together by using sash, water may enter the sunk joints. However, the water does not enter the interior of the floor material, and it is possible to reliably avoid the occurrence of swelling and push-up due to water absorption at the sunk joint.

  In addition, in the flooring according to the present invention, it is necessary that the groove for hiring sane is formed so as to remove the core layer part of the wood chip forming plate, but in addition to the core layer part, the high density The concave portion may be formed in such a manner that a part of the surface layer portion and / or the back layer portion which is a layer is removed, and in this case, the same effect can be obtained.

  In a preferred embodiment of the flooring according to the present invention, the surface layer portion and the back layer portion are high density layers having an average density of 1.0 to 1.2. In the case of a wooden piece molded plate, the density of the core layer portion is about 0.4 to 0.7, and the density of the surface layer portion and the back layer portion is about 0.8 to 1.0. As described above, by making the surface layer portion and the back layer portion into a high-density layer having an average density of 1.0 to 1.2, the water resistance in the region can be further improved. It is possible to more reliably avoid the occurrence of swelling and push-up due to water absorption. In order to obtain such a high-density layer, the ratio of the adhesive added when the surface layer portion and the back layer portion are molded is increased, for example, the normal amount of 8 to 11 w% is increased by 5 to 10%. Or by increasing the moisture content of the forming mat before hot pressing by about 2 to 8%. In addition, the water content may be increased by about 2 to 8% by spraying water on the front and back surfaces of the forming mat before hot pressing.

  In the flooring according to the present invention, the particle board is most preferably used as the wood piece forming plate as a base material, but a wood piece forming board such as a strand board can also be used. Any material can be used as the material that constitutes the hire tandem as long as it is superior in water resistance and tougher than the region of the core layer portion of the wood piece molded plate as the base material. Examples include plywood, solid wood, and synthetic resin. Examples of the solid material include tamo, sakura, and cocoon. Examples of the synthetic resin include ABS resin, acrylic resin, and polystyrene resin.

  In the flooring according to the present invention, a decorative layer may be formed on the surface as necessary, and an appropriate buffer sheet material may be attached to the back surface. Examples of the decorative layer include a thin-striated veneer or a decorative sheet having a thickness of about 0.2 mm. Examples of the buffer sheet material include a foamed resin sheet, a foamed rubber sheet, and a nonwoven fabric sheet having a thickness of about 2 mm.

  In order to prevent floor squealing due to friction of the sunk joint in the flooring constructed using the flooring joint structure according to the present invention, a thermoplastic resin or viscoelastic rubber-based synthetic resin is applied to all or part of the surface of the sap, Or you may make it stick a raising sheet | seat. As an example of the floor material subjected to such treatment, there is a floor material described in JP-A-11-141109.

  The floor foundation for flooring is also arbitrary, but a mode in which a floor material is directly attached to a concrete slab may be used, or it may be spread on a particle board or plywood having a thickness of about 15 mm. When directly sticking to a concrete slab, it is recommended to use a flooring with a buffer sheet laminated on the back.

  The present invention further relates to a floor material joining method in which hire sene is inserted into the groove for hire sane of the floor material and the opposing floor materials are joined on a floor base, wherein the floor material is used as the hire sane. A hiring sap made of a material that is more water-resistant than the core layer part of the wood chip molding plate to be used is used, and a part of the hiring sane is placed in the recessed groove for hiring sap on one floor material arranged on the floor base. A floor joining method characterized by comprising at least a step of fitting and fixing together, and a step of fitting the remaining portion of the hires into the recessed groove for hire of the other floor facing Disclose.

  Moreover, it is a floor material joining method which inserts hire sane in the groove for hire sun of the above-mentioned floor material, and joins facing floor materials on a floor base, and is a piece of wood constituting the floor material as the hire sun A hiring sani made of a material that is more water-resistant than the core layer portion of the molded plate is used, and the step of attaching the hiring sane onto a floor base and the two facing the hiring sane attached to the floor base A floor material joining method is also disclosed, comprising at least a step of inserting a recess groove for each hire of each sheet of floor material.

  In the above-mentioned floor material joining method, the employment sane that has entered the recessed groove for employment sane formed on the flooring material may simply remain in a fitted state, and should be positively fixed by appropriate means. Also good. As means for positively fixing, a method of fixing by driving a nail or the like, a method of fixing using a double-sided adhesive tape, a method of fixing by both of them can be adopted.

  By adopting the flooring material and its joining structure and joining method according to the present invention, it is possible to more completely prevent water from entering the flooring material from the joining parts of the flooring materials, and the swelling and expansion of the joining parts It is possible to obtain a flooring that avoids the occurrence of the above.

  Hereinafter, the present invention will be described based on embodiments with reference to the drawings. FIG. 1 is a diagram for explaining an example of a flooring according to the present invention, FIG. 2 is a schematic diagram for explaining a first form of a flooring joining structure and joining method according to the present invention, and FIG. 3 is a flooring joining structure according to the present invention. The schematic diagram explaining the 2nd form of the joining method.

  The flooring 20 shown in FIG. 1 includes a wood piece molding plate 10 as a base material, a decorative layer 17 such as a thin-skinned veneer laminated on the surface thereof, and a cushioning sheet material 18 such as a foamed resin sheet laminated on the back surface. It is a laminated body. The wood piece molding plate 10 as the base material is a long member of about 30 cm × 90 cm, for example, and a particle board is used as an example. Further, as shown in the partial cross-sectional view of FIG. 1 (b), the wood piece molded plate 10 has a core layer portion 11 having a density of about 0.7, and preferably a surface layer portion 12 and a back surface having a density of about 1.1. The layer portion 13 has a three-layer structure.

  The wood chip molding plate 10 is manufactured by applying a material for the lower layer portion 13 in which an adhesive is applied to a wood piece (chip) to a required thickness on a forming belt, and then using the wood piece used for the material for the lower layer portion thereon. A material for the core layer portion 11 in which an adhesive is applied to a large-sized piece of wood is applied to a required thickness, and the same material as that for the lower layer portion is applied to the required thickness for the upper layer portion 12 to form three layers. A forming mat is used as the structure. By heat-pressing it, a wooden piece molded board 10 (particle board) 10 having a three-layer structure is obtained. This manufacturing method is conventionally known. Preferably, the amount of adhesive added to the material for the upper layer portion 12 and the lower layer portion 13 is increased by 5 to 10% than usual. Further, the moisture content of the material for the upper layer portion 12 and the lower layer portion 13 at the time of lamination is set higher than usual. Thereby, as described above, it is possible to easily manufacture the wood piece molding plate (particle board) 10 in which the density of the surface layer portion 12 and the back layer portion 13 is increased to about 1.1.

  As shown in FIG. 1 (a), at the four peripheral end surfaces of the wood chip molded board 10 manufactured in this way, at least all of the core layer portion 11 is removed, and the concave groove for hire is directed inward. 14 is formed. In this example, as shown in FIG. 1 (b), the upper end surface of the recessed groove 14 for hires is in a position that enters the surface layer portion 12 side of the boundary region between the surface layer portion 12 and the core layer portion 11, The lower end surface of the hire ditch groove 14 is located at a position closer to the back layer portion 13 than the boundary region between the back layer portion 13 and the core layer portion 11.

  One mode of joining the above flooring materials 20 will be described with reference to FIG. First, the hiring sash 15 is fitted into one of the hiring sunk concave grooves 14 formed in the longitudinal direction of the one floor material 20a. The hiring sash 15 is made of a material (for example, tamo material, ABS resin, etc.) that is superior in water resistance to the core layer portion 11 and is strong in strength. The thickness of the hiring sash 15 is substantially the same as the vertical width of the hire grooving groove 14, and the length is the same as the length in the longitudinal direction of the wood chip molding plate 10. Further, the lateral width is substantially the same as the total lateral width formed by the two hire ditch grooves 14 and 14 when the flooring materials 20a and 20b are arranged to face each other. Accordingly, a portion 15p of the hired sash 15 fitted in the hire grooving groove 14 of one flooring 20a extends outward from the end face of the wooden piece molding plate 10, and that portion is adjacent to the other adjacent one. It enters into the hire sag groove 14 formed on the wood piece molding plate 10 in the floor material 20b and forms a sap joint between the two floor materials 20a and 20b. Although not shown, if necessary, a similar sane junction is formed.

  Fixing of the hiring sash 15 to the hiring sunk groove 14 in the flooring 20a may be done by nailing, using an adhesive, or by using a double-sided adhesive tape 16 as shown in the figure. Further, it is desirable to fix the part 15p of the hiring hood 15 and the flooring 20b using the double-sided adhesive tape 16 as shown in the figure. A plurality of flooring materials 20 are spread on an appropriate floor foundation 30 to form a flooring while forming a sane bonding structure as described above. In order to fix the floor material 20 to the floor base 30, when the floor base 30 is a plywood or a particle board, the nails 21 may be driven as shown in FIG. 2, or an adhesive or double-sided tape may be used. When the floor foundation 30 is a concrete slab, an adhesive or a double-sided tape is used.

  As described above, in the steel joint part in the floor joint structure according to the present invention, the side surface 12a of the surface layer part 12, which is a higher density layer than the wood chip molded board 10, the side surface 13a of the back layer part 13, and the core layer part Only a part of the surface of the hired sap 15 made of a material superior in water resistance to 11 is exposed, and the core layer part 11 which is a low density layer and has high water absorption is exposed at the sunk joint. Absent. Therefore, even if water may enter the sunk joint in the flooring in which a plurality of flooring materials 20 according to the present invention are sunk together and spread, the water does not enter the flooring 20, It is surely avoided that the swelled joint is swollen or pushed up due to water absorption.

  Next, the 2nd form of the flooring joining structure and joining method by this invention is demonstrated with reference to FIG. In this floor material 20S, the side surface 13a side of the back layer portion 13 of the wood piece molding plate 10 is removed to the inner side position than the position of the side surface 12a of the surface layer portion 12, and the hired sash 15T has a T-shape as a whole. This is different from the above-described embodiment. The other structure is the same as the aspect shown in FIG. 2, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  As shown in the figure, in this flooring 20S, the space into which the hiring sash 15T enters is the space corresponding to the hiring grooving groove 14 in the flooring 20 shown in FIG. 1, and the side surface 13a side of the back layer 13 to the inner position. It is comprised with the space 14a formed by removing. Accordingly, the hiring pan 15T has a leg portion 15b that fills the second space 14a integrally below the main body portion 15a, and the cross section in the short direction is generally T-shaped as a whole.

  When flooring is performed using the flooring material 20S and the hiring tool 15T having this shape, the hiring tool 15T is first fixedly attached to the hiring tool 15T by hitting, for example, a nail 22 on the floor base 30. After affixing the double-sided adhesive tape 16, the floor materials 20Sa and 20Sb are arranged on both sides thereof, and the main body portion 15a of the hired sash 15T is fitted into the respective hire grooving grooves 14 and 14 while sliding. Needless to say, when flooring construction is performed using the hired sash 15T, a construction method according to the aspect shown in FIG. 2 is also possible.

It is a figure explaining an example of the flooring by this invention, FIG. 1 (a) is a perspective view, FIG.1 (b) is an expanded fragmentary sectional view. The schematic diagram explaining the 1st form of the flooring joining structure and joining method by this invention. The schematic diagram explaining the 2nd form of the flooring joining structure and joining method by this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wood piece molded board as a base material, 11 ... Core layer part, 12 ... Surface layer part, 12a ... Side surface of surface layer part, 13 ... Back layer part, 13a ... Side surface of back layer part, 14 ... Groove for hire 14a: space formed by removing the side surface side of the back layer part to the inner position, 15, 15T ... hire sash, 15a ... main part of hire sap, 15b ... leg of hire sap, 16 ... double-sided adhesive tape, 17 ... decorative layer, 18 ... buffer sheet material, 20, 20S ... flooring material, 21, 22 ... nail, 30 ... floor foundation

Claims (4)

In comparison with the core layer portion which is the low density layer and the core layer portion, a groove for hiring is formed on the four peripheral end surfaces of the wooden piece molded plate which is a three-layer structure of the surface layer portion and the back layer portion which are the high density layer. Flooring,
The recessed groove for hiring sane is formed so as to remove at least the core layer portion of the wooden piece molding plate, and the upper end surface of the recessed groove for hiring sane is from a boundary region between the surface layer portion and the core layer portion. Is also a position that has entered the surface layer side, the lower end surface of the groove for employment hires is a position that has entered the back layer part side than the boundary region of the back layer part and the core layer part And
The flooring characterized by the ratio of the adhesive agent added to the said surface layer part and back layer part being adjusted so that the density of the said surface layer part and back layer part may become a density higher than a core layer part .   A floor material joining structure in which hired sene is inserted into the groove for hiring sane of the floor material according to claim 1 and the facing floor materials are joined to each other, and the floor material is configured as the hire sane. A floor material joining structure characterized by using hired sane made of a material superior in water resistance to the core layer portion of the wood piece molded board.   A floor material joining method for fitting hire sane in the groove for hire sash of the floor material according to claim 1 and joining opposing floor materials on a floor base, wherein the floor material is used as the hire sane. A hiring sap made of a material that is more water-resistant than the core layer part of the wood chip molding plate to be used is used, and a part of the hiring sane is placed in the recessed groove for hiring sap on one floor material arranged on the floor base. A floor material joining method characterized by comprising at least a step of fitting and fixing together, and a step of fitting the remaining portion of the hiring sane into a recessed groove for hiring sane of the other flooring material facing each other.   A floor material joining method for fitting hire sane in the groove for hire sash of the floor material according to claim 1 and joining opposing floor materials on a floor base, wherein the floor material is used as the hire sane. Using a hire sap made of a material that is more water-resistant than the core layer portion of the wood chip forming plate, and a step of attaching the hire sap on the floor base, and the hire sash attached to the floor base A floor material joining method characterized by comprising at least a step of inserting a concave groove for hire of each of two facing floor materials.

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