JP5343931B2 - Tile adhering structure, tile adhering method, and wall joint sealing joint repair method - Google Patents

Description

  The present invention relates to a tile adhering structure and a tile adhering method in the case of finishing a wall surface by adhering a tile to a surface of a wall base, and a sealing joint repair method for a wall base in which a tile is attached to a surface. More specifically, when forming a sealing joint at the corner of the wall base, or when forming a sealing joint in the gap between the sash frame or other ancillary equipment installed so as to protrude from the wall surface, The present invention relates to a tile adhering structure and a tile adhering method suitable for adhering tiles along the sealing joint, and a method for repairing a wall joint sealing joint.

  In the patent document 1, the present applicant proposes an outer wall structure in which a unitized base panel is built into a building frame to form an outer wall base, and an exterior tile is attached to the surface via an adhesive. Yes. An outline of the outer wall structure is shown in FIG.

  The outer wall base is constituted by a base panel 1 made of various sidings for external wall, various cement boards, concrete boards, etc., which are preliminarily molded to a predetermined size in a factory. An attachment frame 2 is attached to the back surface of the foundation panel 1, and the foundation panel 1 is attached to the building frame 3 of the building by hooking appropriate attachments to the attachment frame 2. Sealing joints are formed by filling the back-up material 4 and the sealing material 5 in the joints of the base panel 1 that has been built. An elastic adhesive 6 such as a one-component epoxy-modified silicone adhesive is applied to the entire surface of the base panel 1 including the sealing joint in a comb-like shape, and the tile 7 is adhered thereon. .

  The sealing joint of the base panel 1 is wider than the joint of the tile 7, and the sealing joint of the base panel 1 and the joint of the tile 7 are different in texture and gloss. When hidden, the joints of the tiles 7 continue without being divided by the joints of the base panel 1. As a result, a high-quality exterior wall design in which the texture of the tile 7 is sufficiently emphasized is obtained.

JP 2001-317181 A

  In the outer wall structure as described above, in the portion where the outer wall forms a corner, as shown in FIG. 9, of the two base panels 1 (1a, 1b) arranged in a substantially T shape in plan view The sealing joint 50 is constructed between the surface of one base panel 1a and the end surface of the other base panel 1b. In this case, when the tiles 7 (7a, 7b) adhered to the surfaces of the both base panels 1a, 1b are brought close to the corners of the corners, at least a base surface (base panel 1a) orthogonal to the joint width direction of the sealing joint 50 is provided. The end surface of the tile 7a pasted on the front surface of the sealing surface 50 covers the front surface (finding surface) of the sealing joint 50.

  Further, as shown in FIG. 10, when installing a sash frame and other auxiliary equipment 20 on the base panel 1c constituting the base of the outer wall, a part of the equipment 20 is on the outdoor side (lower side of the figure) than the surface of the base panel 1 Side). In this case, a sealing joint 50 is formed in the gap between the surface of the base panel 1 c and the equipment 20. In addition to the sash frame as shown in the figure, for example, a side panel, a shutter box, a ventilation hood, a balcony, a parapet headboard, and the like can be cited as examples of the incidental equipment 20 that protrudes to the outdoor side of the outer wall base. In such a case as well, when the tile 7c is attached in the vicinity of the sealing joint 50, the end face of the tile 7c covers the front surface of the sealing joint 50.

  By the way, when an external force such as an earthquake acts on the building, the shaking of the building frame deforms the sealing joint of the outer wall base, and the sealing joint is damaged. Even when not subjected to a large external force such as an earthquake, the sealing joints of the outer wall foundation deteriorate over time. Under such circumstances, it is necessary to repair the sealing joints of the outer wall base with a period of about 15 years.

  In repairing the sealing joint, first, the old sealing material filled in the sealing joint is cut out using a cutter knife or the like. At this time, it is desirable to cut off the sealing material so that the cutting surface becomes smooth with the cutting edge of the cutter knife parallel to the surface of the outer wall base so that the watertightness of the newly-sealed sealing joint can be maintained. However, as shown in FIG. 9, when the tile 7a is covered on the front surface of the sealing joint 50, the cutting edge of the cutter knife 51 does not reach the sealing joint 50, or even if it reaches, the cutting edge is parallel to the surface of the outer wall base. I ca n’t. However, attaching the tile 7a away from the sealing joint 50 in advance is not preferable in view of the beauty because the joint width of the tile 7a becomes too wide.

  After all, in order to repair this kind of sealing joint, the tiles close to the sealing joint have to be peeled off from the outer wall base, but it is not easy to peel off the tile, and it is very difficult to repair the sealing joint. It will take time and effort.

  In view of this, the present invention forms a sealing joint in a corner between the outer wall base and a corner between the outer wall base and a sash frame or other ancillary equipment projecting from the outer wall to the outdoor side, and a tile is pasted to the sealing joint. In the above-described outer wall structure to be worn, when it becomes necessary to repair the sealing joint, the tile sticking structure and sticking method capable of performing repair work quickly and easily, and the sticking structure are used. It provides a method for repairing the sealing joint of the wall base.

  The present invention mainly assumes the exterior wall finishing with exterior tiles, but the type of exterior wall foundation is not limited to the foundation panel as described above, for example, a fixed volume such as a reinforced concrete frame. Even a continuous structure can be applied. In addition, any wall surface with tiles attached to the surface can be applied both indoors and outdoors, and can also be applied to non-vertical surfaces such as floor surfaces and inclined roof surfaces. Therefore, the present invention defines the application target as a “wall foundation” that is not limited to the outer wall.

  In addition, the “tile” in the present invention is a concept generically referring to a thin plate-like decorative material that is formed in a relatively small size and is attached to an appropriate lower ground. Therefore, the material is not necessarily limited to ceramics, for example, natural stone materials, artificial stone materials, wooden materials, synthetic resins, other organic materials, metal materials, or composite materials thereof, etc. Are also included in the “tile” of the present invention.

  In order to achieve the above-described object, in the tile adhering structure of the present invention, a sealing joint is formed in a gap formed at the corner of the wall base, and the tile is formed on the surface of the wall base in the vicinity of the sealing joint. In the tile adhering structure to be adhered, a thin strip having conductivity is adhered to the surface of the wall base adjacent to the sealing joint so as to continue along the sealing joint, and the thin strip Is applied to the surface of the wall base including the thin strip through the adhesive. It is characterized by having tiles attached.

  Alternatively, in the tile adhering structure of the present invention, a sealing joint is formed in a gap between a sash frame or other ancillary equipment attached to the wall base so that at least a part protrudes from the wall surface, and the ceiling In the tile adhering structure in which a tile is adhered to the surface of the wall base in the vicinity of a joint, a thin ribbon having conductivity is provided along the sealing joint on the surface of the wall base in the vicinity of the sealing joint. An adhesive that has adhesive workability at room temperature and reduces adhesive strength by heating is applied to the surface of the wall base including the ribbon, and the adhesive is applied through the adhesive. The tile is stuck on the surface of the wall base including the ribbon.

  As described later as a method for repairing a sealing joint for a wall base, the ribbon in these tile attachment structures is a member for raising the temperature of itself by using electromagnetic induction heating (high-frequency heating). Electromagnetic induction heating means that when an alternating current is passed through a coil, a change in magnetic field (magnetic flux density) occurs, an eddy current is generated in the conductive material placed in the magnetic field, and the conductive material itself generates heat due to its resistance. This is a heating method that uses the principle. This heating method is also used for an electromagnetic cooker (IH cooking heater), high-frequency welding, and the like. However, a technique for sticking a tile with a hot melt adhesive using this principle is also disclosed in, for example, Japanese Patent Application Laid-Open No. 8-73818. This is disclosed in Japanese Patent Laid-Open No. 2002-264241.

  However, the present invention intends to reduce the adhesive strength of the adhesive by using electromagnetic induction heating at the time of peeling, not at the time of sticking the tile. Therefore, the adhesive used in the present invention has an appropriate bonding workability (fluidity and initial adhesive force) at room temperature rather than a hot-melt adhesive that is solid at room temperature, and is heated after curing. A thermoplastic adhesive that softens due to heat, a heat-peelable adhesive that peels the adhesive surface by heating, and the like are preferred. When attaching the tile, this type of adhesive is applied to the surface of the wall base with a brush, scissors, roller, or the like at room temperature, and the tile is attached before the adhesive is cured.

  On the other hand, as a ribbon, it is preferable to use aluminum tape (film), stainless steel tape, etc. suitably in terms of having appropriate strength and conductivity, and being excellent in workability and economical. it can. If such a ribbon is pasted in a certain width region along the sealing joint, the ribbon can be attached from the surface side of the tile using an appropriate electromagnetic induction heating device even after the tile is stuck. The tile can be easily peeled off by reducing the adhesive force of the adhesive applied on the ribbon.

  The electromagnetic induction heating device used for heating the ribbon is not particularly limited, but a high frequency type is preferable in terms of heating efficiency. From the viewpoint of workability, it is preferable that the induction coil and the power supply control unit are separate because they are compact. The shape and the like of the induction coil may be appropriately designed in consideration of the device specifications, workability, and the like.

  If such consideration is given to the vicinity of the sealing joint of the wall foundation from the stage of construction of the wall, when it becomes necessary to repair the sealing joint later, the repair work can be carried out efficiently.

In addition, the tile adhering method of the present invention specifies a rational construction procedure of the above-described tile adhering structure,
A: A sealing material is filled in the gap between the wall base and a gap formed in the corner of the wall base, or a sash frame or other ancillary equipment attached to the wall base so that at least part of the wall base protrudes from the wall surface. And forming a sealing joint,
B: a step of sticking a conductive ribbon to the surface of the wall base adjacent to the sealing joint so as to be continuous along the sealing joint;
C: covering the sealing joint with a masking tape;
D: Adhering to the surface of the wall base including the ribbon and the masking tape following the steps A to C with an adhesive workability at room temperature and reducing the adhesive force by heating. Applying step;
E: following the step D, stripping the masking tape from the wall substrate;
F: Subsequent to the step E, a step of attaching a tile to the surface of the wall base including the thin strip in the vicinity of the sealing joint via the adhesive;
It is characterized by comprising.

  Once sealing is applied to the gap in the wall base, the sealing joint is cured with masking tape, the adhesive is applied to the surface of the wall base, the masking tape is peeled off, and the tile is applied. Thus, it is possible to avoid the adhesive layer remaining on the sealing joint. As a result, the tiles adjacent to the sealing joint can be easily peeled off, and the sealing joint can be repaired efficiently.

  In addition, the process of AC in this tile sticking method is not necessarily limited only to the procedure of [A-> B-> C], and [B-> A-> C] or [ It is also possible to change the order in the order of A → C → B].

  In the tile adhering structure and the tile adhering method, another ribbon having the same conductivity as described above may be adhered to the back surface of the tile that is adhered in the immediate vicinity of the sealing joint. Alternatively, a conductor layer may be provided on the back surface of the tile by applying (coating) or evaporating a metallic material in a thin film shape. According to these configurations, the tile itself close to the sealing joint can be more easily peeled off from the adhesive layer in contact with the back surface by raising the temperature of the back surface.

  Moreover, in the tile adhering structure and the tile adhering method, it is preferable that the width of the ribbon is equal to or larger than the maximum width of the tile adhering to the immediate vicinity of the sealing joint. Thereby, the heating area as much as the maximum width of the tile can be provided in the immediate vicinity of the sealing joint. Then, the tile joints are torn joints (joint joints where the tiles are arranged so that the vertical joints in the upper and lower stages do not continue) or tile joints (two or more vertical joints in the upper and lower stages are continuous). In any case, the tiles that are close to the sealing joint will always fit in the heating area, so the tiles can be easily peeled off and close to the sealing joint. Can be exposed without difficulty. In addition, when the tiles to be attached to the wall base are jointed like a combination of wide and narrow tiles, the width of the strip shall be adjusted to the wide tile. .

Moreover, the sealing joint repair method for a wall foundation according to the present invention is a method for repairing a sealing joint for a wall foundation in which a tile is attached to the surface by the tile attachment structure described above,
S: a step of heating the thin strip attached along the sealing joint by electromagnetic induction heating from the surface side of the tile, and reducing the adhesive force of the adhesive applied to the surface of the thin strip;
T: Following the step of S, the step of stripping off the tile pasted in the immediate vicinity of the sealing joint from the thin strip, and exposing the sealing joint;
U: following the step T, repairing the sealing applied to the exposed sealing joint;
V: following the process of U, covering the repaired sealing joint with a masking tape;
W: following the step V, reapplying an adhesive to the exposed portion of the wall base including the ribbon and the masking tape;
X: following the step of W, stripping the masking tape from the sealing joint;
Y: Subsequent to the step X, a step of adhering a tile close to a sealing joint at an exposed portion of the wall base coated with the adhesive;
It is characterized by comprising.

  According to this method for repairing a sealing joint, when it becomes necessary to repair the sealing joint on a wall or the like where a tile is attached in the vicinity of the sealing joint of the wall base, only the tile that interferes with the repairing work is required. After performing necessary repairs such as peeling off and refilling the sealing, it is possible to efficiently perform the work of attaching the tile again in the vicinity of the sealing joint.

  In addition, in the process of W in this sealing joint repair method, the adhesive applied to re-attach the tile may be the same thermoplastic adhesive or heat-peelable adhesive as the original, of course, but future repair work If there is an adhesive or the like having better workability at that time, its use is not excluded.

  According to the tile sticking structure of the present invention, by heating the ribbon attached along the sealing joint of the wall base from the surface side of the tile using electromagnetic induction heating (high frequency heating), The tile can be easily peeled off by reducing the adhesive force of the adhesive applied on the ribbon. By providing such considerations in the vicinity of the sealing joint on the wall base from the construction stage of the wall, etc., if it becomes necessary to repair the sealing joint in the future, only the tiles in the range that interferes with the repair work are limited. Can be peeled off.

  Moreover, according to the tile sticking method of this invention, the said tile sticking structure can be constructed in a rational procedure. In particular, by interposing a step of curing the sealing joint with a masking tape, it is possible to avoid the adhesive layer from remaining on the sealing joint, so that the repair work of the sealing joint can be performed efficiently.

  And according to the sealing joint repair method for a wall foundation of the present invention, when it becomes necessary to repair the sealing joint in the wall foundation where the tile is attached in the vicinity of the sealing joint, it interferes with the repair work. It is possible to efficiently perform the work of removing only the tiles and performing necessary repairs such as refilling of the sealing material, and then re-attaching the tiles in the vicinity of the sealing joint.

It is a cross-sectional view which shows the process of AC in the tile sticking method of this invention. It is a cross-sectional view which shows the process of D (... E) in the tile sticking method of this invention. It is a cross section which shows the process of F in the tile sticking method of this invention. It is a cross section which shows the tile sticking structure of this invention. It is a cross-sectional view which shows the tile sticking structure which concerns on other embodiment of this invention. It is a cross-sectional view which shows the tile sticking structure which concerns on other embodiment of this invention. It is a principal part cross-sectional view explaining the sealing joint repair method of the base panel of this invention. It is a perspective view which shows the outline | summary of the conventional outer wall structure (tile sticking structure) disclosed by patent document 1. FIG. It is a cross-sectional view which shows the tile sticking structure of the entrance corner part in the conventional outer wall structure. It is a cross-sectional view which shows a tile sticking structure in case the sash frame other equipment protrudes from an outer wall surface in the conventional outer wall structure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIGS. 1-3 is a figure which shows the tile sticking method of this invention in the corner part of a wall foundation along the construction procedure, FIG. 4 is the tile sticking structure obtained by this tile sticking method FIG. In these drawings, members and parts common to the conventional outer wall structure shown in FIG.

  FIG. 1: shows the process of AC in the tile sticking method of this invention. Two base panels 1 (1a, 1b) arranged in a substantially T shape in plan view form a corner portion of the wall base, and the lower right side in the figure is the outdoor side. The illustrated base panel 1 (1a, 1b) is the same as that constituting the conventional outer wall structure, and is constructed through an appropriate mounting frame or mounting bracket (not shown) provided on the back surface thereof. It is built in the frame structure (not shown). However, in the present invention, the material and structure of the wall base are not particularly limited as long as they are suitable for attaching the tile 7.

  In step A, a sealing joint 50 is applied in the gap between the surface of the upper base panel 1a in the drawing and the end surface of the lower base panel 1b in the drawing. The sealing joint 50 is filled with a sealing material by performing a backing process using a backup material (not shown) as necessary. The type of the sealing material is not particularly limited. For example, a highly durable elastic sealing material such as urethane, silicone, or polysulfide is appropriately selected according to the material of the base panel 1 and used.

  In the process B, the thin ribbon body 8 (8a, 8b) having conductivity is attached to a position close to the sealing joint 50. In the upper base panel 1a shown in the figure in contact with the surface of the sealing joint 50, the edge of the ribbon 8a is at the surface of the sealing joint 50, and the lower base panel 1b in contact with the sealing joint 50 at the end face. In this case, it is preferable that the thin strips 8a and 8b are attached at positions where the edge of the thin strip 8b is aligned with the edge of the base panel 1b.

  For the ribbon 8, a metal sheet or tape having a thickness (approximately 0.3 mm or less) that does not affect the attachment of the tile 7 is used, and this is applied to the base panel 1 with an appropriate adhesive or the like. Adhere to the surface. Practically, an aluminum tape or stainless steel tape having a thickness of about 0.03 to 0.15 mm, which has been subjected to adhesive processing on the back surface, can be used particularly suitably. These tapes are wound up in rolls, are easy to handle, are inexpensive, and some are easily cut by hand. In the drawing, the thickness of the ribbon 8 is emphasized.

  The sticking range of the ribbon 8 is preferably equal to or larger than the maximum width of the tile 7. When a thin tape is used for the ribbon 8, the tapes may be stacked and pasted. The ribbon 8 is stuck along the sealing joint 50 so as not to be interrupted to both ends of the base panel 1. If the length is insufficient, it may be joined in the middle. Double-sided tape may be used for attaching the ribbon 8. The adhesive used for sticking the ribbon 8 is not a thermoplastic or heat-peelable adhesive as will be described later, but preferably has an adhesive property that does not decrease by heating. If the base panel 1 is soft, the ribbon 8 can be fastened together with a tucker or a thumbtack.

  Alternatively, instead of the tape-shaped ribbon 8 as illustrated, for example, a coating containing iron powder or other metallic materials is applied to the surface of the base panel, or aluminum or other metallic materials are appropriately used by known means. A conductive region having a certain width corresponding to the ribbon 8 may be formed by vapor-depositing a material on the surface of the base panel.

  In step C, an appropriate masking tape 9 is attached to the surface of the sealing joint 50 to cure the sealing joint 50. In the illustrated embodiment, the masking tape 9 is attached so that both side edges overlap with the ribbons 8a and 8b on both sides sandwiching the sealing joint 50, respectively.

  In addition, the work procedure of the process of A (sealing), B (thin body sticking), and C (masking) is not necessarily limited to the above-described procedure [A → B → C]. A procedure [B → A → C] is also possible in which the ribbon 8 is attached to the base panel 1 first and then the sealing joint 50 is constructed and masked later. Alternatively, following the construction of the sealing joint 50, the masking tape 9 having the same width as the joint is attached to the surface of the sealing joint 50, and then the ribbon 8 is attached to the base panel 1 so as not to overlap the masking tape 9. A procedure of [A → C → B] for attaching to the sheet is also possible.

  FIG. 2 shows the process of D (-E) in the tile sticking method of this invention. In this step, an adhesive 60 for adhering the tile 7 is applied to the surface of the base panel 1 (1a, 1b) on which the ribbon 8 is adhered and the sealing joint 50 is masked.

  The adhesive 60 has moderate fluidity and initial adhesive strength at room temperature, is cured by natural drying, and is softened by melting, melted, peeled off the adhesive surface, etc. after curing. Use things. Specifically, an adhesive component based on an ethylene-vinyl acetate emulsion adhesive, a modified silicone adhesive, or a thermoplastic resin such as polyvinyl acetal, polystyrene, polyamide, polyurethane, and polyolefin is used as a water or solvent. A thermoplastic adhesive imparted with fluidity by dispersion or the like can be used. Alternatively, it is also possible to use an adhesive that has been provided with heat peelability by blending thermally expandable fine particles with a thermosetting epoxy resin adhesive or urethane resin adhesive. These adhesives 60 are applied to the surface of the base panel 1 with a brush, scissors, a roller or the like, and combed as necessary.

  After the application of the adhesive 60, as a step E, the masking tape 9 is peeled off from the sealing joint 50, and the adhesive 60 applied on the sealing joint 50 is removed. However, this process is not expressed in FIGS.

  In FIG. 2, it is expressed as if the adhesive 60 is applied to the two underlying panels 1a and 1b sandwiching the corner at once. However, in actual construction, the corner is sandwiched. The adhesive 60 is applied to each side of a certain area, and the tile 7 is attached in several stages according to the curing time of the adhesive 60.

  FIG. 3 shows the step F in the tile adhering method of the present invention. In the process F, the tile 7 is adhered to the surface of the base panel 1 including the ribbon 8 before the applied adhesive 60 is cured. This sticking operation is basically performed at room temperature. In principle, the tile 7 is pasted up to the immediate vicinity of the sealing joint 50, but the joint layout pattern of the tile 7 is not particularly limited.

  In the present invention, an accessory tile (not shown) having a substantially L-shape in plan view and straddling both sides of the entrance corner is attached to the entrance corner to completely cover the sealing joint 50. It is also possible to adopt such a fit.

  In this way, the tile sticking structure shown in FIG. 4 is obtained. In FIG. 4, W <b> 1 is the maximum width dimension of the tile 7 that is attached in the immediate vicinity of the sealing joint 50, and W <b> 2 is the attachment width of the ribbon 8. If W1 ≦ W2, the tile 7 of each stage 1 or 2 that interferes with the sealing joint 50 is sure to be used regardless of whether the joint of the tile 7 is a tear joint or a joint joint, or any other pattern. It will be within the sticking area of the ribbon 8.

  FIG. 5 shows another embodiment of the tile attachment structure. In the illustrated embodiment, the same ribbon 80 made of aluminum tape or the like is attached to the back surface of each row of tiles 7 (7a, 7b) close to the sealing joint 50. It is preferable that the ribbon 80 is attached to the back surface of the tile 7 in advance prior to the attachment of the tile 7. The ribbon 80 attached to the tile 7 side is overlaid on the surface side of the adhesive 60. According to this configuration, since the adhesive 60 is sandwiched between the ribbons 8 and 80 on both sides of the front and back, the adhesive 60 positioned on the back surface of the tile 7 is heated more efficiently by electromagnetic induction heating described later. can do.

  In the embodiment shown in FIG. 5, instead of sticking the ribbon 80 on the back surface of the tile 7, a paint containing iron powder or other metallic material is applied or coated on the back surface of the tile 7. Alternatively, a conductive layer having the same function as that of the ribbon 80 may be formed on the back surface of the tile 7 by appropriately depositing aluminum or other metallic material on the back surface of the tile 7 by a known means.

  Alternatively, a conductive material such as a metal powder is kneaded in advance into the molding material of the tile 7 and fired to make the tile 7 itself a conductive substance, and the tile 7 is attached close to the sealing joint 50. It is also possible to adopt the configuration.

  FIG. 6 shows still another embodiment of the tile attachment structure. The illustrated form is a form in which a sash frame and other incidental facilities 20 are installed with a part projecting to the outdoor side (lower side in the drawing) from the wall surface, as in the outer wall structure shown in FIG. In this case, a sealing joint 50 is formed in the gap between the surface of the base panel 1 c constituting the outer wall base and the incidental equipment 20.

  And along this sealing joint 50, the thin ribbon 8 (8c) which has electroconductivity is stuck. The ribbon 8a is attached to the surface of the base panel 1c with a certain width so that the edge of the ribbon 8a is close to the sealing joint 50. That is, this form is substantially the same as the tile adhering structure on one side (specifically, the side where the surface of the base panel is in contact with the sealing joint 50) in the above-described embodiment shown in FIG. The configuration of the ribbon 8 itself is the same as that of the ribbon 8 (8a) described in the above embodiment.

  Next, a method for repairing the sealing joint 50 by peeling off the tile 7 from the above-described tile adhering structure shown in FIG. 4 will be described with reference to FIG. When the tile 7 is peeled off, the electromagnetic induction heating device 10 is applied to the surface of the tile 7 (7a, 7b) adjacent to the sealing joint 50, and a high frequency is irradiated for a predetermined time. The electromagnetic induction heating device 10 used in this method is not particularly limited in its configuration, but the high frequency generator having an induction coil and the power supply controller are formed separately and have the high frequency generator by hand. Those that are compacted to such an extent that they can be used are preferred. When the ribbon 8 (8a, 8b) is heated to a predetermined temperature by high-frequency irradiation, the adhesive 60 applied to the surface of the ribbon 8 is softened and the adhesive strength is reduced.

  When the adhesive can be peeled off, the tiles 7 for one or two steps that interfere with the sealing joint 50 are peeled off. In the case where the joints of the tiles 7 are torn joints, it is sufficient to peel off the tiles 7 for the width of one sheet and for the width of two sheets alternately at each stage. When the sealing joint 50 is exposed, the deteriorated old sealing material is removed, and a new sealing material is filled. The detailed process regarding the removal to refilling of the sealing material is not particularly limited in the present invention. When the repair of the sealing joint 50 is completed, the tile 7 is again attached to the surface of the base panel 1. The sticking procedure is the same as the steps C (masking) to F (tile sticking) in the tile sticking method described above.

  Even when the tile 7c is peeled off from the tile adhering structure shown in FIG. 6 to repair the sealing joint 50, the same procedure as described above can be used. According to the present invention, in this way, only the tile 7 in a range that interferes with the sealing joint 50 of the base panel 1 is peeled off, and after performing necessary repairs such as refilling of the sealing material, the sealing joint 50 is again formed. It is possible to efficiently carry out the work of re-attaching the tile 7 in the immediate vicinity.

1 (1a, 1b, 1c) Base panel 10 Electromagnetic induction heating device 50 Sealing joint 60 Adhesive 7 (7a, 7b, 7c) Tile 8 (8a, 8b, 8c) Thin strip 80 Thin strip 9 Masking tape

Claims (10)

In a tile attachment structure in which a sealing joint is formed in a gap formed in a corner portion of a wall base, and a tile is attached to the surface of the wall base in the vicinity of the sealing joint,
On the surface of the wall foundation adjacent to the sealing joint, a conductive ribbon is stuck so as to be continuous along the sealing joint,
The surface of the wall substrate including the ribbon is coated with an adhesive having adhesive workability at room temperature and reducing the adhesive force by heating,
A tile adhering structure, wherein a tile is adhered to a surface of a wall base including the thin strip through the adhesive. A sealing joint is formed in a gap between the wall base and a sash frame or other ancillary equipment that is attached to the wall base so that at least a part protrudes from the wall surface. In the tile attachment structure where is attached,
On the surface of the wall foundation adjacent to the sealing joint, a conductive ribbon is stuck so as to be continuous along the sealing joint,
The surface of the wall substrate including the ribbon is coated with an adhesive having adhesive workability at room temperature and reducing the adhesive force by heating,
A tile adhering structure, wherein a tile is adhered to a surface of a wall base including the thin strip through the adhesive. In the tile sticking structure according to claim 1 or 2,
A tile adhering structure characterized in that a thin ribbon having conductivity is adhered to the back surface of a tile adhering in the immediate vicinity of a sealing joint. In the tile sticking structure according to claim 1 or 2,
A tile adhering structure, characterized in that a conductive layer containing a metallic material is provided on the back surface of a tile adhering to the closest position of a sealing joint. In the tile sticking structure according to any one of claims 1 to 4,
A tile adhering structure, characterized in that the width of the ribbon is equal to or greater than the maximum width of the tile adhering to the immediate vicinity of the sealing joint. A: A sealing material is filled in the gap between the wall base and a gap formed in the corner of the wall base, or a sash frame or other ancillary equipment attached to the wall base so that at least part of the wall base protrudes from the wall surface. And forming a sealing joint,
B: a step of sticking a conductive ribbon to the surface of the wall base adjacent to the sealing joint so as to be continuous along the sealing joint;
C: covering the sealing joint with a masking tape;
D: Adhering to the surface of the wall base including the ribbon and the masking tape following the steps A to C with an adhesive workability at room temperature and reducing the adhesive force by heating. Applying step;
E: following the step D, stripping the masking tape from the wall substrate;
F: Subsequent to the step E, a step of attaching a tile to the surface of the wall base including the thin strip in the vicinity of the sealing joint via the adhesive;
The tile sticking method characterized by comprising. In the tile sticking method according to claim 6,
A tile adhering method characterized in that, when adhering a tile to the surface of a wall base, a thin ribbon having conductivity is adhered in advance to the back surface of the tile adhering in the immediate vicinity of the sealing joint. In the tile sticking method according to claim 6,
A tile adhering method characterized by providing a conductor layer containing a metallic material in advance on the back surface of a tile adhering in the immediate vicinity of a sealing joint when adhering a tile to the surface of a wall base. In the tile sticking method according to any one of claims 6 to 8,
A tile adhering method, characterized in that the width of the ribbon is equal to or greater than the maximum width of the tile adhering to the immediate vicinity of the sealing joint. A method for repairing a sealing joint of a wall base, wherein a tile is attached to the surface by the tile attachment structure according to claim 1,
S: a step of heating the thin strip attached along the sealing joint by electromagnetic induction heating from the surface side of the tile, and reducing the adhesive force of the adhesive applied to the surface of the thin strip;
T: Following the step of S, the step of stripping off the tile pasted in the immediate vicinity of the sealing joint from the thin strip, and exposing the sealing joint;
U: following the step T, repairing the sealing applied to the exposed sealing joint;
V: following the process of U, covering the repaired sealing joint with a masking tape;
W: following the step V, reapplying an adhesive to the exposed portion of the wall base including the ribbon and the masking tape;
X: following the step of W, stripping the masking tape from the sealing joint;
Y: Subsequent to the step X, a step of adhering a tile close to a sealing joint at an exposed portion of the wall base coated with the adhesive;
A method for repairing a sealing joint of a wall base, comprising:

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