JP5322509B2 - Thermal print head - Google Patents

Thermal print head Download PDF

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JP5322509B2
JP5322509B2 JP2008158610A JP2008158610A JP5322509B2 JP 5322509 B2 JP5322509 B2 JP 5322509B2 JP 2008158610 A JP2008158610 A JP 2008158610A JP 2008158610 A JP2008158610 A JP 2008158610A JP 5322509 B2 JP5322509 B2 JP 5322509B2
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glaze layer
convex glaze
convex
print head
thermal print
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JP2010000599A (en
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卓史 角尾
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東芝ホクト電子株式会社
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Description

  The present invention relates to a thermal print head for recording on a recording medium by a thermal transfer method, a thermal method, or the like, and more particularly to a thermal print head that facilitates stable image quality improvement in its operation.

  The thermal print head is an output device that forms an image made up of characters on a recording medium by using, for example, a thermal transfer method or a thermal recording method of an ink ribbon, using heat generated by a heat generating portion. It is widely used in recording devices such as barcode printers, weighing machines, digital plate-making machines, video printers, imagers, and seal printers. In general, a thermal print head includes a resistor substrate portion provided with a heat generating portion for image formation, a drive circuit substrate portion mounted with a drive IC for driving energization to the heat generating portion, etc. The structure is arranged on the main surface.

  There are two types of ink ribbons used in thermal transfer printers, the so-called hot release type and the cold release type. In the thermal release type, the ink is thermally transferred to the paper by the heating resistor of the heating part during image formation. Immediately after, it is necessary to peel the ink ribbon from the paper. Therefore, various structures for peeling the ink ribbon from the paper in a thermal print head or the like have been proposed (see, for example, Patent Document 1). Here, a conventional thermal print head in which the structure is formed on the thermal print head will be described with reference to FIG. FIG. 6 is a cross-sectional view of the main part showing the middle of image formation of the thermal print head.

  FIG. 6 is a transverse cross-sectional view in a direction (sub-scanning direction) in which a sheet as a so-called recording medium is conveyed. The thermal print head has a required direction along the direction (main scanning direction) orthogonal to the sub-scanning direction. Extends to length. Here, a partial cross section of the resistor substrate unit 100 is shown, and the illustration of the drive circuit substrate unit is omitted. In the resistor base portion 100, a heat insulating layer 102 having a substantially uniform film thickness is provided integrally with the main surface of the substrate 101 having the convex portions 101a made of an insulating material so as to extend in the main scanning direction of the head. . A plurality of heating resistors 103 arranged in a straight line are formed so as to cover the surface of the heat insulating layer 102 on the top surface of the convex portion 101a.

  In the substrate 101, a common electrode 104 is formed on the vicinity of the bottom end portion on one side of the convex portion 101a via a heat insulating layer 102, and a side wall 102a of the heat insulating layer 102 is protruded from the edge of the substrate 101. Yes. Further, an individual electrode 105 is formed on the other side of the convex portion 101a via a heat insulating layer 102. One end of each heating resistor 103 is connected to the common electrode 104 through the sub-wiring pattern 104a on the one side of the convex portion 101a, and the other end passes through the sub-wiring pattern 105a on the other side of the convex portion 101a. Connected to the individual electrode 105. These heating resistors 103 are arranged in a required number in the main scanning direction of the head, and become heating units that can be energized independently.

  Then, a hard protective layer 106 having excellent oxidation resistance and wear resistance is formed so as to cover and protect the heating resistor 103, the common electrode 104 including the sub wiring patterns 104a and 105a, and the individual electrode 105. The Here, the protective layer 106 has a head end 106a that covers the top surface of the side wall 102a. The head end 106a peels off the ink ribbon 107 from the paper 108 and peels off when heated.

  In image formation on a recording medium using the thermal print head, the resistor substrate portion 100 of the head is pressed against the platen roller 110 rotating in the moving direction 109 with a pressing force P. The ink ribbon 107 and the paper 108 are sandwiched and supported between the protective layer 106 and a platen roller 110 made of a soft material such as rubber, and are conveyed at a predetermined speed in the sub-scanning direction. In this conveyance, a drive IC (not shown) of the drive circuit board unit arranged on the upstream side in the conveyance direction of the resistor substrate unit 100 energizes the individual electrode 105 based on a desired print signal. Then, the desired heating resistor 103 is caused to generate heat, the ink (not shown) of the ink ribbon 107 in the portion facing the heating resistor 103 is melted, and the ink is transferred to the paper 108 to transfer desired characters and A graphic or the like is printed.

  In the image formation, the head end portion 106a provided at the edge of the substrate 101 peels off the ink ribbon 107 from the paper 108, and has an appropriate effect of heat peeling. That is, the head end 106a peels the ink ribbon 107 from the paper 108 immediately after printing, and obtains high image quality with less blur in printing.

In addition, the structure for peeling the ink ribbon 107 from the paper 108 is formed as a peeling member at a location other than the thermal print head, for example, on the downstream side in the conveyance direction of the recording medium in a head mounting base on which the thermal print head is fixed. (For example, see Patent Document 2).
JP-A-10-250127 JP-A-2005-212130

  However, the above-described thermal print head has a limit in improving the image quality due to thermal peeling in its operation. This is because, in the above-described structure for peeling the ink ribbon from the paper in the prior art, higher accuracy of the height of the structure and higher accuracy of the separation distance from the heating resistor 103 are obtained than desired. Because it is not possible. For this reason, it is difficult to achieve a stable image quality especially when the operation speed of the thermal print head is increased.

  Further, although the detailed description of the problem relating to the peeling structure as described above is omitted, multicolor thermal paper is used as a recording medium, and the multicolor thermal paper is placed between the platen roller and a heat resistant film. This also occurs in a thermal print head that forms an image by pinching. In this case, it is essential for high-quality color recording that the heat-resistant film is peeled off from the multicolor thermal paper when heated. As described above, it has been difficult for the conventional thermal print head to achieve stable image quality improvement in the operation speed.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thermal print head that facilitates stable image quality improvement in the operation of the thermal print head.

To achieve the above object, a thermal print head according to the present invention is a thermal print head and a record medium and Lee Nkuribon or heat-resistant film in pressure contact with the platen roller to form an image on said recording medium A convex portion partially formed on the upper surface of the substrate, a first convex glaze layer extending in a main scanning direction of the head, and an upper surface of the substrate; A second convex glaze layer extending in the main scanning direction in parallel with the convex glaze layer, a plurality of heating portions formed on the top surface of the convex portion of the first convex glaze layer, has a current-carrying electrodes for energizing the heating unit, the heating unit, the current-carrying electrodes, and a protective layer covering the first convex glaze layer and the second convex glaze layer, wherein the The top and front of the first convex glaze layer The horizontal distance from the top of the second convex glaze layer is in the range of 1.5 mm to 3.0 mm, and the protruding height of the second convex glaze layer is in the range of 25 μm to 100 μm. Then, the second convex glaze layer peels off the ink ribbon or the heat-resistant film transported in the sub-scanning direction of the head from the recording medium after printing on the recording medium through the heat generating portion. It is configured to do.

  According to the configuration of the present invention, high resolution and fine color tone can be stably obtained in the operation of the thermal print head, and the image quality of the image can be easily improved.

  An embodiment of the present invention will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a sectional view showing an example of the thermal print head according to the present embodiment. FIG. 2 is a cross-sectional view showing the middle of image formation of the thermal print head according to the embodiment of the present invention. Hereinafter, parts that are the same or similar to each other are denoted by common reference numerals, and redundant description is partially omitted. However, the drawings are schematic and ratios of dimensions and the like are different from actual ones.

  As shown in FIG. 1, in the thermal print head 10, a resistor substrate portion 12 </ b> A and a drive circuit substrate portion 12 </ b> B are provided adjacent to each other on a heat dissipation substrate 11. In the resistor substrate portion 12 </ b> A, a support substrate 13 having good heat resistance and heat conductivity is stuck on the main surface of the heat dissipation substrate 11. Then, the first convex glaze layer 14 and the second convex glaze layer 15 are arranged on the support substrate 13 in parallel with the main scanning direction of the head. Here, the heating resistor layer 16 is formed by covering these glaze layers.

  Then, the common electrode 17 and the individual electrode 18 are arranged opposite to each other with the gap G interposed therebetween on the heating resistor layer 16 of the convex portion of the first convex glaze layer 14. The common electrode 17 and the individual electrode 18 are overlapped with and electrically connected to the heat generating resistor layer 16, and the heat generating resistor layer 16 exposed in the gap G becomes a heat generating portion 19. These individual electrodes 18 and the heat generating portion 19 form one heat generating element, and this heat generating element is arranged in a line as an array of a large number of heat generating elements in the main scanning direction of the thermal print head 10. Moreover, the protective layer 20 is formed so that these whole may be coat | covered. A second convex glaze layer 15 is provided at a predetermined distance away from the first convex glaze layer 14 on the downstream side in the conveyance direction of the recording medium. The second convex glaze layer 15 extends in the main scanning direction in parallel with the first convex glaze layer 14. The common electrode 17 is also formed by covering the second convex glaze layer 15 with the heating resistor layer 16 interposed therebetween.

  As shown in FIG. 1, the parallel two rows of glaze layers, that is, the first convex glaze layer 14 and the second convex glaze layer 15, have a thin glaze layer formed on the entire surface of the support substrate 13, The cross-sectional shape may be a convex structure projecting in a chevron shape, or it may be a structure projecting in a chevron shape on the surface of the support substrate 13 without a thin glaze layer. Here, these convex glaze layers are provided on the support substrate 13 so as to extend in a band shape having a width (projecting width) of, for example, 100 to 200 μm in the main scanning direction of the head. Note that these convex glaze layers may have a structure in which they are intermittently provided in the main scanning direction.

  As shown in FIG. 1, when the horizontal distance between the top of the projecting first convex glaze layer 14 and the top of the second convex glaze layer 15 is the separation distance L, the separation distance L is The thickness is preferably 1.5 mm or more, and more preferably in the range of 1.5 mm to 3.0 mm. The protrusion height H of the second convex glaze layer 15 is preferably 25 μm or more, and more preferably in the range of 25 μm to 100 μm. Here, the protrusion height H is the height at which the second convex glaze layer 15 protrudes from the surface of the thin glaze layer formed on the entire surface of the support substrate 13 or the support substrate 13 without the thin glaze layer. Become.

  The drive circuit board portion 12B has a drive circuit board 21 attached to the heat dissipation board 11, a circuit pattern or the like is formed on the surface of the board, and a drive IC 22 or the like is mounted. The driving IC 22 and the individual electrodes 18 and the circuit pattern are electrically connected by a bonding wire W, and the bonding wire W and the driving IC 22 are hermetically sealed by a sealing material 23 made of, for example, an epoxy resin.

In the thermal print head 10, the heat dissipation substrate 11 is made of, for example, Al (aluminum) metal, and the support substrate 13 is usually a support substrate made of an insulating material having heat resistance, and is made of Al 2 O 3 (alumina) ceramics. In addition, it is made of Si (silicon), quartz, silicon carbide or the like. And this support substrate 13 is affixed on the surface of the thermal radiation board | substrate 11 with resin adhesives, such as a double-sided tape with good heat conductivity, and silicone.

The first convex glaze layer 14 is an insulating thin film made of an insulating material having an appropriate heat storage and heat dissipation action of heat generated by the heat generating portion 19 and having surface smoothness. The second convex glaze layer 15 is also made of the same insulating thin film as the first convex glaze layer 14. Examples of such a glaze layer include a SiO 2 film (silicon oxide film), a SiON film (silicon oxynitride film), and a SiN film (silicon nitride film).

  The heating resistor layer 16 is made of, for example, a TaSiO, NbSiO, TaSiNO, or TiSiCO based electric resistor material. The common electrode 17 and the individual electrode 18 that serve as electrodes for energizing the heat generating portion 19 are preferably as low as possible. For example, a metal such as Al, Cu (copper), or AlCu alloy is used as a main material.

The protective layer 20 is made of a hard and dense insulating material such as a SiO 2 film, a SiN film, a SiON film, or a SiC film (silicon carbide film). Here, when at least Si and carbon (C) are contained in the outermost surface of the protective layer 20, the thermal conductivity becomes high, which is preferable. This protective layer 20 has a function of covering the energization electrodes of the heat generating element array and the heat generating portion 19 and protecting them from wear due to pressure contact or sliding contact of the recording medium, and corrosion due to contact with moisture contained in the atmosphere. .

Next, a method for manufacturing the thermal print head 10 will be described. First, an elongated support substrate 13 made of alumina and having a width of about several mm in the sub-scanning direction and a thickness of 0.5 mm to 1 mm is prepared. Then, a thin glaze layer is formed by depositing an insulator thin film such as a SiO 2 film, a SiON film or a SiN film having a film thickness of, for example, about 1 to 5 μm on the entire surface of the support substrate 13 by a sputtering apparatus or other film forming apparatus. To do. And the 1st convex glaze layer 14 and the 2nd convex glaze layer 15 which protrude on this thin glaze layer are formed, respectively. In forming these glaze layers, a glass paste obtained by adding and mixing a suitable organic solvent and solvent to the SiO 2 glass powder is applied and formed by a well-known screen printing method. And the glaze layer used as required convex part thickness is formed by baking at predetermined temperature.

Alternatively, a glass paste obtained by adding and mixing an appropriate organic solvent or solvent to, for example, SiO 2 glass powder is applied and formed on the entire surface of the support substrate 13. Then, by the so-called photo-engraving process, the coated and formed glass paste is etched into, for example, a belt-like pattern as described above to form the first convex glaze layer 14 and the second convex glaze layer 15. . And it is set as the convex glaze layer of required convex part thickness by baking at predetermined temperature.

Next, TaSiO 2 having a thickness of about 0.05 μm is formed on the surface of the first convex glaze layer 14, the second convex glaze layer 15, and the thin glaze layer or the support substrate 13 by, for example, sputtering. A film is formed, and subsequently, the TaSiO 2 film is coated by a sputtering method to form an electrode film such as an Al film or an AlCu alloy film having a film thickness of about 0.5 μm, for example. Then, the common electrode 17 and the individual electrode 18 and the heating resistor layer 16 of the heating element array are patterned by a photoengraving process. Further, the electrode film is etched by a photo-engraving process to form a gap G and a heat generating portion 19 is formed. In this way, the heat generating portion 19 of each heat generating element is formed on the convex portion of the first convex glaze layer 14.

  Thereafter, a protective layer 20 that covers the entire surface is formed by sputtering. Here, the protective layer 20 is deposited to a thickness of about 2 μm to 5 μm, for example.

  Next, the resistor substrate portion 12A and a drive circuit substrate portion 12B in which, for example, a bare chip drive IC 22 is incorporated in advance are placed and fixed on the heat dissipation substrate 11 made of an aluminum plate or the like via an adhesive. Then, all energization electrodes of the heating element array are electrically connected to bonding pads on the output side of the driving IC 22 by bonding wires W made of, for example, Al wires or Au wires. Further, the bonding pad on the input side of the driving IC 22 is electrically connected to the circuit pattern of the driving circuit board 21 by the bonding wire W. Finally, the driving IC 22 and the bonding wire W are hermetically sealed with the sealing material 23 by a known mounting technique. Thus, the thermal print head 10 of this embodiment is completed.

  Next, image formation on a recording medium using the thermal print head 10 will be described with reference to FIG. FIG. 2 is shown in a state where a cover body 24 that covers the upper side of the drive circuit board portion 12B of the thermal print head 10 is attached. The cover body 24 is made of, for example, a metal plate such as stainless steel, and protects the drive IC 22 and the like from electrostatic breakdown due to external mechanical force or static electricity.

  In image formation by thermal transfer onto the paper 26 using the ink ribbon 25, the thermal print head 10 is pressed against the platen roller 28 that rotates in the moving direction 27. As described in the prior art, the ink ribbon 25 and the paper 26 are sandwiched and supported between the protective layer 20 and the platen roller 28 made of a soft material such as rubber, and are predetermined in the sub-scanning direction. It is conveyed at a speed of. In this conveyance, the drive IC 22 of the drive circuit board unit 12B energizes the individual electrodes 18 based on a desired print signal. Then, a desired heat generating portion 19 is heated in the main scanning direction of the head, the ink of the ink ribbon 25 of the portion opposed to the heat generating portion 19 is melted and transferred to the paper 26, and desired characters and figures are printed. Thus, the ink ribbon 25 and the paper 26 are transported downstream in the transport direction.

  Then, the second convex glaze layer 15 disposed on the downstream side in the transport direction with respect to the first convex glaze layer 14 in which the heat generating portion 19 is formed peels the ink ribbon 25 from the paper 26. That is, the ink ribbon 25 that has been thermally transferred to the paper 26 is disposed on the protective layer 20 of the convex portion of the second glaze layer 15 that is disposed at a high accuracy position from the heat generating portion 19 of the first convex glaze layer 14. It will be peeled off when heated.

  In this embodiment, the thermal print head 10 includes a first convex glaze layer 14 in which the heat generating portion 19 of the heat generating element is formed, and a second convex glaze layer 15 from which the ink ribbon 25 is peeled off when heated. The structure is such that they are arranged with high positional accuracy and height accuracy on the support substrate 13 of the head. With such a structure, the thermal peeling in the image forming operation of the thermal print head 10 is much more stable and more accurate than in the prior art. Then, the cut of the printing point is improved, the blur in the image quality in the sub-scanning direction is eliminated, and a high resolution is obtained in the printing. In addition, a fine color tone can be stably obtained in color image formation, and the hue saturation can be easily improved. As described above, it is possible to achieve a stable image quality when the operation speed of the thermal print head is increased. The ink ribbon includes an ink sheet and an ink film, and includes a sublimation ink ribbon.

  The above effect is also achieved in a non-transfer type, for example, a thermal print head that uses multi-color thermal paper as a recording medium and forms an image by sandwiching the multi-color thermal paper with a platen roller via a heat-resistant film. .

  Next, the effects of the present invention will be specifically described by way of examples, but the present invention is not limited to the following examples.

Example 1
In Example 1, the first convex glaze layer 14 and the second convex glaze layer 15 are formed by applying a glass paste of SiO 2 on a support substrate 13 made of alumina, and performing a glass paste by a photo-engraving process. Was etched into a belt-like pattern and subsequently fired at a high temperature to form a convex glaze layer. Here, the protruding height H of the first convex glaze layer 14 and the second convex glaze layer 15 was the same 25 μm, and the protruding widths were both approximately 100 μm. Then, a plurality of thermal print heads were manufactured by changing the separation distance L between the first convex glaze layer 14 and the second convex glaze layer 15 thus formed.

  The resistor substrate portions 12A of the plurality of thermal print heads were manufactured by the same method described in the method for manufacturing the thermal print head except for the separation distance L of the convex glaze layer. The common electrode 17 and the individual electrode 18 are made of an Al film.

  Then, thermal transfer printing was performed with the produced thermal print head, and the so-called tailing amount of the print and the rate of occurrence of blurring of the print were measured. Here, the trailing amount is the amount of protrusion of the print from the specified print end point in the print. Further, the blur of the print was judged by measuring the density of the specified print with a density measuring device. These results are shown in FIG. FIG. 4 shows numerical values of changes in the amount of tailing and the occurrence of blurring when the separation distance L of the convex glaze layer is changed. From this result, the distance L between the first convex glaze layer 14 and the second convex glaze layer 15 is preferably 1.5 mm or more, and particularly preferably in the range of 1.5 mm to 3.0 mm. confirmed.

(Example 2)
In Example 2, the first convex glaze layer 14 and the second convex glaze layer 15 are formed by separately applying a glass paste of SiO 2 on a support substrate 13 made of alumina by a screen printing method. Firing was performed at a high temperature to form a convex glaze layer. Here, the protrusion height H of the first convex glaze layer 14 was made constant at 25 μm. Further, the separation distance L between the first convex glaze layer 14 and the second convex glaze layer 15 was made constant at 2 mm. A plurality of thermal print heads were manufactured by changing the protruding height H of the second convex glaze layer 15. The projecting widths of the first convex glaze layer 14 and the second convex glaze layer 15 were both set to about 100 μm. The resistor substrate portions 12A of the plurality of thermal print heads were the same as those in Example 1 except for the convex glaze layer.

  Then, thermal transfer printing was performed with the produced thermal print head, and the amount of tailing of the above-described print was measured. These results are shown in FIG. FIG. 5 shows, as numerical values, changes in the amount of tailing when the protrusion height H of the second convex glaze layer 15 is changed. From this result, it was confirmed that the protrusion height H of the second convex glaze layer 15 is preferably 25 μm or more, and particularly preferably in the range of 25 μm to 100 μm.

(Example 3)
In the third embodiment, the first convex glaze layer 14 and the second convex glaze layer 15 are formed by applying a glass paste of SiO 2 on the support substrate 13 in the same manner as in the first embodiment. The glass paste was etched into a strip pattern by a graving process, and then baked at a high temperature to form a convex glaze layer. Here, the protrusion height H of the second convex glaze layer 15 was changed by changing the film thickness of the glass paste. Further, the separation distance L between the first convex glaze layer 14 and the second convex glaze layer 15 was changed.

  As described above, a plurality of thermal print heads having different separation distances L and protrusion heights H in the production of the first convex glaze layer 14 and the second convex glaze layer 15 were produced. In this case, the protrusion height H of the first convex glaze layer 14 and the second convex glaze layer 15 is the same in each thermal print head. The resistor substrate portions 12A of the plurality of thermal print heads were manufactured by the same method described in the method for manufacturing the thermal print head except for the convex glaze layer.

  Then, thermal transfer printing was performed with the produced thermal print head, and the amount of tailing of the above-described print was measured. These results are shown in FIG. FIG. 6 shows a list of numerical values of changes in the trailing amount when the separation distance L and the protrusion height H are changed. In this result, the separation distance L and the protrusion height H between the first convex glaze layer 14 and the second convex glaze layer 15 are the range region surrounded by the broken line in the drawing, that is, the separation distance L is 1. A range of 0 mm to 3.0 mm and a protrusion height H of 25 μm to 100 μm was suitable. In consideration of the blur occurrence rate described in the first embodiment, the separation distance L is preferably in a range of 1.5 mm to 3.0 mm.

  Although the preferred embodiments of the present invention have been described above, the above-described embodiments do not limit the present invention. Those skilled in the art can make various modifications and changes in specific embodiments without departing from the technical idea and technical scope of the present invention.

  For example, the drive circuit board portion 12B may be formed on the same support substrate 13 as the resistor substrate portion 12A. In the above embodiment, the drive circuit board portion 12B may be arranged at a location different from the thermal print head 10. For example, it may be attached to the control device of the recording device, and for example, the output of the drive IC 22 may be transmitted to the resistor substrate portion 12A through the circuit wiring of the flexible wiring board.

  Further, in the thermal print head 10, the heating resistor layer 16 is partially provided as a heating part pattern on the convex part of the first convex glaze layer 14, and both ends of the heating part pattern are connected to the common electrode 17 and the individual electrodes. 18 may be configured to constitute the heat generating portion 19. In this case, the individual electrode 18, the heat generating portion 19 and the like form one heat generating element. The heating resistor layer 16 or the common electrode 17 may be structured not to cover the second convex glaze layer 15.

  In addition, the support substrate 13 and the drive circuit substrate 21 may be attached to the heat dissipation substrate using different adhesives. This is preferable for preventing breakage due to cracks when the support substrate 13 and the drive circuit substrate 21 have different thermal expansion coefficients.

1 is a cross-sectional view showing an example of a thermal print head according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating the middle of image formation of the thermal print head according to the embodiment of the invention. 2 is a table showing the printing characteristics of a thermal print head in Example 1 of the present invention. 7 is a table showing the printing characteristics of a thermal print head in Example 2 of the present invention. 7 is a table showing printing characteristics of a thermal print head in Example 3 of the present invention. Sectional drawing which shows the principal part which showed the middle of the image formation of the thermal print head in a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Thermal print head, 11 ... Heat dissipation board, 12A ... Resistor board | substrate part, 12B ... Drive circuit board part, 13 ... Support substrate, 14 ... 1st convex glaze layer, 15 ... 2nd convex glaze layer, 16 ... heating resistor layer, 17 ... common electrode, 18 ... individual electrode, 19 ... heating part, 20 ... protective layer, 21 ... driving circuit board, 22 ... driving IC, 23 ... sealing material, 24 ... cover body, 25 ... Ink ribbon, 26 ... paper, 27 ... moving direction, 28 ... platen roller, G ... gap, W ... bonding wire

Claims (1)

  1. A recording medium and Lee Nkuribon or refractory fill arm pressed against between the platen roller thermal printhead for forming an image on said recording medium,
    A substrate,
    A first convex glaze layer in which convex portions partially formed on the upper surface of the substrate extend in the main scanning direction of the head;
    A second convex glaze layer formed on the upper surface of the substrate and extending in the main scanning direction in parallel with the first convex glaze layer;
    A plurality of heat generating parts formed on the upper surface of the convex part of the first convex glaze layer;
    An energizing electrode for energizing the heat generating part;
    A protective layer covering the heat generating portion, the energizing electrode, the first convex glaze layer, and the second convex glaze layer;
    The horizontal separation distance between the top of the first convex glaze layer and the top of the second convex glaze layer is in the range of 1.5 mm to 3.0 mm,
    The protrusion height of the second convex glaze layer is in the range of 25 μm to 100 μm,
    The second convex glaze layer peels off the ink ribbon or the heat-resistant film transported in the sub-scanning direction of the head from the recording medium after printing after printing on the recording medium through the heat generating portion. Thermal print head.
JP2008158610A 2008-06-18 2008-06-18 Thermal print head Active JP5322509B2 (en)

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Publication number Priority date Publication date Assignee Title
JP5854597B2 (en) * 2010-12-10 2016-02-09 サトーホールディングス株式会社 Thermal printer
JP2014069442A (en) * 2012-09-28 2014-04-21 Toshiba Hokuto Electronics Corp Thermal printing head, and thermal printer using the same
JP6033146B2 (en) * 2013-03-26 2016-11-30 東芝ホクト電子株式会社 Thermal print head and thermal printer using the same
TWI631022B (en) * 2016-12-26 2018-08-01 謙華科技股份有限公司 Method for manufacturing a thermal printer head module

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JPS6349449A (en) * 1986-08-19 1988-03-02 Canon Inc Thermal head
JPH0546916Y2 (en) * 1986-11-13 1993-12-09
JPH0544545U (en) * 1991-11-20 1993-06-15 セイコー電子工業株式会社 Thermal head for thermal transfer recording
JPH05220999A (en) * 1992-02-15 1993-08-31 Seiko Instr Inc Thermal head
JPH07329331A (en) * 1994-04-13 1995-12-19 Alps Electric Co Ltd Thermal head and manufacture thereof
JPH0858126A (en) * 1994-08-23 1996-03-05 Toshiba Corp Thermal printing head
JPH10250127A (en) * 1997-03-07 1998-09-22 Alps Electric Co Ltd Thermal head
JPH11277780A (en) * 1998-03-27 1999-10-12 Toshiba Corp Thermal head and manufacture thereof
JP2001180024A (en) * 1999-12-27 2001-07-03 Alps Electric Co Ltd Thermal printer and method of recording therefor

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