JP5283410B2 - Electron beam drawing method, fine pattern drawing system, method of manufacturing concave / convex pattern carrier, and method of manufacturing magnetic disk medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To highly accurately perform drawing of a fine pattern to be formed on a magnetic disk medium at a high speed, to easily perform proximity effect correction and to perform writing at a fixed dose amount on the whole substrate. <P>SOLUTION: When drawing a shape of an element 13 of the fine pattern 12 by scanning a substrate 10 on which a resist 11 is applied with an electron beam EB, after a part for one round is drawn by ON-OFF control such that the electron beam is radiated by an ON-signal in a prescribed rotation position of the substrate 10 based on drawing data, drawing is performed in the rotation direction following rotation thereof and drawing is stopped by an OFF-signal, the beam radiation position is moved in the radial direction to repeat drawing by the ON-OFF control. According to dense and sparse degrees of element disposition, ON-time of the ON-OFF control in element drawing of a dense disposition part is set to be shorter than that in the same element drawing of a sparse disposition part to adjust the dose amount and thus the proximity effect correction is performed. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention provides an imprint mold for a high-density magnetic recording medium such as a discrete track medium or a bit pattern medium, a master carrier for magnetic transfer, and the like for drawing a fine pattern corresponding to a desired concavo-convex pattern. The present invention relates to an electron beam drawing method and a fine pattern drawing system.

  The present invention also provides a method for producing a concavo-convex pattern carrier including an imprint mold having a concavo-convex pattern surface or a master carrier for magnetic transfer, which is produced through a step of performing drawing using the electron beam drawing method, Relates to a method of manufacturing a magnetic disk medium having a concavo-convex pattern transferred using an imprint mold as the concavo-convex pattern carrier, and a method of manufacturing a magnetic disk medium having a magnetic pattern transferred using a magnetic transfer master carrier Is.

  In current magnetic disk media, information patterns such as servo patterns are generally formed. Discrete track media in which adjacent data tracks are separated by groove patterns (guard bands) consisting of grooves to reduce magnetic interference between adjacent tracks in response to a demand for higher recording density. (DTM) is drawing attention. In the bit pattern media (BPM) proposed to further increase the density, magnetic bodies (single domain fine particles) constituting a single magnetic domain are physically isolated and regularly arranged, and one fine particle is arranged. It is a medium for recording 1 bit.

  Conventionally, a fine pattern such as the servo pattern is formed on a magnetic disk medium by a concave-convex pattern or a magnetized pattern, and a predetermined fine pattern is formed on a master disk of a magnetic transfer master carrier for manufacturing a high-density magnetic disk medium. An electron beam writing method for patterning the substrate has been proposed. This electron beam drawing method performs pattern drawing by irradiating an electron beam corresponding to a pattern shape while rotating a substrate coated with a resist (see, for example, Patent Document 1 and Patent Document 2).

  In the electron beam drawing method of Patent Document 1, for example, when a rectangular or parallelogram element extending in the width direction of a track constituting a servo pattern is drawn, a resist-coated substrate is used as an on / off drawing method. While rotating, the electron beam is irradiated on and off in accordance with the pattern shape, and the substrate or the electron beam irradiation apparatus is moved in the radial direction by one beam width per rotation, or pattern drawing is performed. In this method, the beam is reciprocally deflected in the radial direction and the elements are drawn at once.

Further, the electron beam drawing method of Patent Document 2 irradiates an electron beam by on / off control according to pattern drawing data while rotating a substrate when drawing a recording pit of an optical disk or the like. Is reciprocally oscillated in the radial direction to draw a signal length extending in the rotation direction according to the irradiation time accompanying the rotation of the substrate.
JP 2000-207738 A Japanese Patent Laid-Open No. 2003-248981

  By the way, in the electron beam drawing method as described above, the resist pattern is actually exposed to the resist with respect to the pattern shape drawn on the substrate by scanning the electron beam due to the influence of the proximity effect according to the density of the fine pattern element arrangement. It is known that the proximity effect correction for changing the dose amount (irradiation dose) is necessary because the photosensitive shape becomes larger than the drawn shape in the densely arranged portion of the elements.

  The proximity effect in the electron beam drawing is a photosensitive influence on the proximity drawing region due to scattering of the irradiated electron beam, and the influence is different depending on the density of the element arrangement in the drawing pattern. That is, when the electron beam is incident on the resist, the beam spreads due to forward scattering as it advances from the resist toward the substrate. Furthermore, the back-scattering occurs when the beam incident on the substrate is scattered and rebounds with a larger scattering angle than the bottom. The proximity effect is caused by the resist being exposed to a wider area than the irradiation range by these scattered electrons.

  The fine pattern is composed of an assembly of elements corresponding to each recording signal. In a densely arranged portion where the elements are continuously arranged close to each other like the central portion in the set of element arrangements, the surrounding elements are drawn. The proximity effect increases due to the many scattered electrons involved, and the dose tends to be excessive. On the other hand, in a sparsely arranged portion where there are few elements drawn around like a contour portion in a set of element arrangements, there is a tendency that the effect of proximity is small and the proximity effect is small and the dose amount is insufficient. These phenomena become significant as the resist sensitivity increases.

  When the dose variation according to the density as described above occurs, when the resist after drawing exposure is developed, the drawing range is different from the photosensitive resist range to be removed, and an error occurs in the element shape, which is desired. This affects the accuracy of the formation of fine patterns.

  For example, as shown in FIG. 9A, six elements 3a to 3c having the same signal length (line width) per track are arranged in the element width direction (direction perpendicular to the radial direction of the substrate) by the electron beam EB. If the influence of scattering accompanying the drawing of one element reaches the range of two on both sides, the density of the element arrangement is as follows. It is a sparsely arranged part that is affected, the inner element 3b is an intermediate part with one outside and two inside parts, and the central element 3c is a densely arranged part with two on both sides.

  FIG. 9B schematically shows a pattern exposed as a result of the electron beam drawing in FIG. 9A as described above. When the sparsely arranged element 4a at both ends has a photosensitive shape corresponding to the drawing width of (A) due to the relationship between resist sensitivity and beam intensity, the photosensitive width of the element 4b of the intermediate arranged part is larger by a predetermined ratio. Therefore, in the densely arranged portion element 4c at the center, the element is further increased by a predetermined ratio, the element interval is narrowed, and unlike the design pattern of (A), the actually exposed pattern of (B) is the form of (A). Therefore, it is necessary to perform proximity effect correction that adjusts electron beam writing in each element.

  However, the proximity effect correction in actual electron beam drawing has a problem that its setting and drawing control are complicated and complicated.

  In view of the above circumstances, the present invention allows a fine pattern to be formed on a magnetic disk medium to be drawn with high accuracy as prescribed over the entire surface of the substrate, and proximity effect correction can be easily performed with a constant dose over the entire substrate. It is an object of the present invention to provide an electron beam drawing method and a fine pattern drawing system for performing electron beam drawing which can be drawn at high speed and accurately.

  The present invention also provides a method for producing a concavo-convex pattern carrier, such as an imprint mold or a magnetic transfer master carrier, having a fine pattern drawn with high precision by an electron beam, and the concavo-convex pattern carrier It is an object of the present invention to provide a method of manufacturing a magnetic disk medium having a concavo-convex pattern or a magnetic pattern transferred thereon.

The electron beam drawing method of the present invention scans an electron beam with an electron beam drawing apparatus while rotating the rotary stage on a substrate coated with a resist and placed on the rotary stage, and based on the irradiation diameter of the electron beam. In an electron beam drawing method for drawing a fine pattern composed of large elements,
While rotating the substrate in one direction, with respect to the rotation of the substrate, an electron beam is irradiated with an ON signal at a predetermined rotation position of the substrate based on the drawing data of the fine pattern, and the rotation direction follows the rotation of the substrate. Then, drawing is performed for one turn by on / off control in which drawing is stopped by an off signal, and then the electron beam or the substrate is moved in the radial direction of the substrate to perform drawing by the on / off control. Is repeated to draw the element,
Depending on the density of the element arrangement, in the element drawing in the dense arrangement portion, the on time of the on / off control is set shorter than the on time in the same element drawing in the sparse arrangement portion to adjust the dose amount, It is characterized by effect correction.

  At that time, the rotation speed of the rotary stage is controlled so that the linear velocity is constant so that the rotation speed of the rotation stage is inversely proportional to the radius of the drawing position and the inner track drawing is faster and the outer track drawing is slower. The control signal is generated based on a drawing clock signal generated in association with the rotation of the rotary stage, and the drawing clock signal determines the number of clocks in one rotation of the rotary stage based on the radius of the drawing position. Preferably, each track is set to a constant value, and the proximity effect correction is performed by increasing / decreasing an integer number of clocks in the drawing clock signal.

  The fine pattern is drawn by rotating the substrate in one direction, reciprocatingly vibrating the electron beam in the radial direction of the substrate, and at a predetermined rotation position of the substrate by the on / off control. It is possible to draw the element by irradiating following the rotation.

  Further, the fine pattern is drawn by rotating the substrate in one direction, fixing the electron beam at a predetermined radial position, irradiating the predetermined rotation position of the substrate by the on / off control, and performing the next rotation of the substrate. Thus, it is possible to draw the element by moving the irradiation position of the electron beam in the radial direction and repeating the irradiation by the on / off control.

  A fine pattern drawing system of the present invention includes a signal sending device for sending a drawing data signal for realizing the electron beam drawing method and an electron beam drawing device for scanning an electron beam. .

  The electron beam drawing apparatus in the fine pattern drawing system includes a rotary stage that can move in a radial direction while rotating a substrate coated with a resist, an electron gun that emits an electron beam, and an electron beam that is emitted from the rotary stage. A deflection means for deflecting in a radial direction; a blanking means for performing on / off control that blocks irradiation of an electron beam except for a drawing portion; and a controller for controlling the operation of each means in an associated manner. A drawing data signal is sent to a controller of the electron beam drawing apparatus based on data corresponding to a form of a fine pattern to be drawn on the substrate, and the controller is configured to send a predetermined pattern of the substrate based on the drawing data of the fine pattern. Irradiate an electron beam with an ON signal at the rotation position, and draw in the rotation direction following the rotation of the substrate. After performing drawing for one round by on / off control for stopping drawing by an off signal, the electron beam or the substrate is moved in the radial direction of the substrate to repeat drawing by the on / off control, In addition to drawing an element, according to the density of the element arrangement, in the element drawing in the dense arrangement portion, the on time of the on / off control is set shorter than the on time in the same element drawing in the sparse arrangement portion. It is preferable that the control is performed based on the drawing signal prepared so as to adjust the amount and perform the proximity effect correction.

  The method for producing a concavo-convex pattern carrier of the present invention comprises a step of drawing a desired fine pattern on a resist-coated substrate by the electron beam drawing method and forming a concavo-convex pattern corresponding to the desired fine pattern. It is characterized by being manufactured after that. Here, the concavo-convex pattern carrier is a carrier having a desired concavo-convex pattern shape on the surface, an imprint mold for transferring the concavo-convex pattern shape to a magnetic disk medium, and a magnetized pattern corresponding to the concavo-convex pattern shape. For example, a magnetic transfer master carrier for transferring a magnetic disk to a magnetic disk medium.

  The method for producing a magnetic disk medium of the present invention includes a step of drawing a desired fine pattern on a substrate coated with a resist by the above-mentioned electron beam drawing method, and forming an uneven pattern corresponding to the desired fine pattern. Using the produced imprint mold, a concavo-convex pattern corresponding to the concavo-convex pattern provided on the surface of the mold is transferred.

  In another method of manufacturing a magnetic disk medium according to the present invention, a desired fine pattern is drawn on the resist-coated substrate by the electron beam drawing method, and a concavo-convex pattern corresponding to the desired fine pattern is formed. A magnetic transfer master carrier produced through the above steps is used, and a magnetic pattern corresponding to the concavo-convex pattern provided on the surface of the master carrier is magnetically transferred.

  According to the electron beam drawing method of the present invention, an electron beam is emitted by an ON signal at a predetermined rotation position of a substrate based on fine pattern drawing data while rotating a substrate coated with a resist and placed on a rotary stage in one direction. Irradiate, draw in the rotation direction following the rotation of the substrate, and after drawing for one turn by on / off control to stop drawing by an off signal, the electron beam or substrate is drawn in the radial direction of the substrate The pattern is drawn by repeating the on / off control and the fine pattern elements are drawn. Depending on the density of the element arrangement, in the element drawing in the densely arranged portion, the on / off control on time is set. This proximity effect compensation is performed by adjusting the dose amount by setting it shorter than the ON time for drawing the same element in the sparsely arranged portion and performing proximity effect correction. Exactly performed by simple control, to draw with high accuracy fine patterns as designed high speed over the entire surface of the substrate, which shortens the writing time by improving the drawing efficiency.

  At that time, the rotation speed of the rotary stage is controlled so that the linear velocity is constant so that the rotation speed of the rotary stage is inversely proportional to the radius of the drawing position and is fast in the inner track drawing and slow in the outer track drawing. The signal is generated based on a drawing clock signal generated in association with the rotation of the rotary stage, and the drawing clock signal indicates the number of clocks in one rotation of the rotary stage regardless of the radius of the drawing position. When the track effect is set to a constant value and proximity effect correction is performed by increasing or decreasing the number of clocks in the drawing clock signal, proximity effect correction can be easily performed with high accuracy, and control according to the radial position is performed. Can be easily performed with high accuracy.

  On the other hand, the fine pattern drawing system of the present invention includes a signal sending device for sending a drawing data signal for realizing an electron beam drawing method and an electron beam drawing device for scanning an electron beam, so that a desired fine pattern can be obtained. Drawing can be performed at high speed and with high accuracy, and drawing time can be shortened by improving drawing efficiency.

  In particular, the electron beam writing apparatus in the fine pattern drawing system includes a rotary stage that can move in a radial direction while rotating a substrate coated with a resist, an electron gun that emits an electron beam, and the electron beam that is used as the rotary stage. The signal transmission device comprises: deflection means for deflecting in the radial direction; blanking means for performing on / off control for blocking the irradiation of the electron beam except for the drawing portion; and a controller for controlling the operation of each means in association with each other. Is to send a drawing data signal to the controller of the electron beam drawing apparatus based on the data according to the form of the fine pattern to be drawn on the substrate, and the controller is based on the drawing data of the fine pattern. Irradiate an electron beam with an ON signal at a predetermined rotation position, and draw in the rotation direction following the rotation of the substrate Then, after performing drawing for one turn by on / off control to stop drawing by an off signal, the drawing by the on / off control is repeated by moving the electron beam or substrate in the radial direction of the substrate, In addition to drawing the element, depending on the density of the element arrangement, in the element drawing in the densely arranged portion, the on time of the on / off control is set shorter than the on time in the same element drawing in the sparsely arranged portion. A system can be suitably constructed by controlling the dose based on the drawing signal created so as to perform proximity effect correction.

  Furthermore, according to the method for manufacturing a concavo-convex pattern carrier of the present invention, a desired fine pattern is drawn on the resist-coated substrate by the electron beam drawing method, and the concavo-convex pattern corresponding to the desired fine pattern is formed. By manufacturing through the forming step, a carrier having a highly accurate uneven pattern shape on the surface can be easily obtained.

  Further, according to the method for manufacturing a magnetic disk medium of the present invention, a desired fine pattern is drawn on the resist-coated substrate by the electron beam drawing method, and a concavo-convex pattern corresponding to the desired fine pattern is formed. In the case of this imprint mold, an imprint technique is obtained by using an imprint mold manufactured through a process to transfer and producing a concavo-convex pattern corresponding to the concavo-convex pattern provided on the surface of the mold. Discrete track media with excellent characteristics by transferring the shape to the surface of the media at once by pressing the mold against the surface of the resin layer that is used as a mask in the process of forming the magnetic disc media. And magnetic disk media such as bit pattern media can be easily created.

  In addition, according to another method of manufacturing a magnetic disk medium of the present invention, a desired fine pattern is drawn on a resist-coated substrate by the above-described electron beam drawing method, and an uneven pattern corresponding to the desired fine pattern is obtained. This magnetic transfer master carrier is produced by magnetically transferring a magnetic pattern corresponding to the concavo-convex pattern provided on the surface of the master carrier using the magnetic transfer master carrier produced through the step of forming In this case, since the fine pattern of the magnetic layer is formed on the surface, the master carrier is superimposed on the magnetic disk medium, and a magnetic field is applied using a magnetic transfer technique, thereby forming a fine pattern of the magnetic layer on the magnetic disk medium. A corresponding magnetic pattern can be transferred and formed to easily produce a magnetic disk medium with excellent characteristics.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a plan view showing an example of a fine pattern of a magnetic disk medium drawn on a substrate by the electron beam drawing method of the present invention, FIG. 2 is an enlarged view of a part of the fine pattern, and FIG. 3 is a radius of a drawing position of the substrate. FIG. 4 is an enlarged schematic diagram (A) showing a first drawing method including proximity effect correction of elements constituting a fine pattern, and various signals (B) in the drawing method. ) To (F), and FIG. 5 is an enlarged schematic diagram (A) showing a second drawing method including proximity effect correction of elements constituting a fine pattern and various signals such as deflection signals in the drawing method. It is a figure which shows (B)-(E). FIG. 6 is a side view (A) and a partial plan view (B) of the main part of a fine pattern drawing system according to an embodiment for carrying out the electron beam drawing method of the present invention.

  As shown in FIGS. 1 and 2, a fine pattern for a magnetic disk medium having a fine concavo-convex shape is composed of servo patterns 12 formed in a plurality of servo areas, and a data area 15 is formed between the servo patterns 12. The disc-shaped substrate 10 (circular base) is formed in an annular region excluding the outer peripheral portion 10a and the inner peripheral portion 10b.

  The servo pattern 12 is formed in concentric tracks on the substrate 10 at equal intervals in each sector in a narrow area extending almost radially from the center. In the case of the servo pattern 12 in this example, the servo pattern 12 is formed in a curved radial shape continuous in the radial direction. As illustrated in FIG. 2 in which a part thereof is enlarged, rectangular fine servo elements 13 corresponding to, for example, a preamble, an address, and a burst signal are arranged on the concentric tracks T1 to T4. One servo element 13 has a track width that is larger than the irradiation diameter of the electron beam with one track width, and a part of the servo elements 13 of the burst signal are arranged so as to be shifted by a half track so as to straddle adjacent tracks. .

  In the case of the first drawing method shown in FIG. 4, the servo element 13 for one track is drawn by one rotation of the substrate 10, and the first track T1 or the third track T3 in FIG. When drawing is performed, the hatched elements 13 are drawn in order. The servo element 13 shifted by a half track across the adjacent track T2 or T3 is drawn at a time by shifting the drawing reference by a half track without being divided in half.

  In a discrete track medium that has been attracting attention in recent years, in addition to the servo pattern 12 as described above, adjacent tracks T1 to T4 are separated into grooves in a guard band portion between data tracks in the data area 15. A groove pattern extending in the track direction is formed concentrically, and this groove pattern is drawn by separate drawing control.

  Drawing of each servo element 13 of the servo pattern 12 is performed, for example, on an inner track while a substrate 10 having a resist 11 coated on the surface is placed on a rotating stage 41 (see FIG. 6) described below and rotated. The elements 13 are sequentially scanned and drawn by the electron beam EB one track at a time in order to the outer track or in the opposite direction, and the resist 11 is irradiated and exposed.

  FIG. 3 shows the relationship between the substrate rotation speed N and the radius r in the drawing of the inner track and the outer track in the pattern drawing of the substrate 10, and the basic characteristic indicated by the chain line is that of the innermost track (radius r1). The rotation is controlled so that the rotation speed N2 of the outermost track (radius r2) becomes slower in inverse proportion to the radius with respect to the rotation speed N1. Actually, the rotational speed N is not changed and adjusted for each track, but a plurality of tracks (for example, 8 tracks) are drawn corresponding to the radial deflectable range of the electron beam EB as shown by the solid line. Later, when the rotary stage 41 is mechanically moved in the radial direction, control is performed to change the rotational speed of the rotary stage 41 in a stepwise manner in conjunction with this.

  As described above, the movement of the drawing portion in the radial direction in the drawing region of the substrate 10, that is, the track movement is performed so that the linear velocity is the same in all the drawing regions in the outer peripheral side portion and the inner peripheral portion of the substrate 10. The rotation speed N of the rotary stage 41 is adjusted so as to be slow when drawing the outer circumference track and faster when drawing the inner circumference track. This is advantageous in that an equivalent dose including proximity effect correction in the drawing of the electron beam EB is obtained and that the drawing position accuracy is ensured.

  FIG. 4 is a diagram showing a first drawing method of the electron beam drawing method according to the present invention. In this embodiment, drawing is performed by servos straddling adjacent tracks following the servo elements 13a and 13b in the track in the servo pattern 12. FIG. The elements 13c and 13d are sequentially drawn in one rotation (one turn) of the substrate 10 (rotation stage 41), including proximity effect correction described later. In other words, while rotating the substrate 10 in one direction A, the servo elements 13a to 13d are continuously once at predetermined phase positions of concentric tracks (track width: W) extending linearly when viewed microscopically. Then, the image is drawn by scanning with the electron beam EB having a small diameter so as to fill the shape.

  When FIG. 4 shows the drawing of the inner track, the length of the servo elements 13a to 13d in the track direction is small. On the other hand, in the drawing of the outer track, the track width W is the same. As the size increases, the length of the servo elements 13a to 13d in the track direction increases. In both cases, the signals read from the corresponding servo elements 13a to 13d are the same when rotated as the final magnetic disk medium.

  The servo pattern 12 is recorded by a CAV (constant angular velocity) method. As the sector length changes at the inner and outer circumferences, the drawing length of the element 13 in the track direction becomes longer at the outer circumference track. , The inner track is short.

  The scanning of the electron beam EB is performed by intermittently irradiating the electron beam EB having a beam diameter smaller than the minimum track direction length of the servo elements 13a to 13d by on / off control corresponding to the drawing portion of the blanking means 24 described later. According to the rotation linear velocity of the substrate 10 (the rotation stage 41), as shown in FIG. . Subsequent to the drawing of the servo elements 13a and 13b in the track, the electron beam EB is deflected in the radial direction Y, the drawing reference in the radial direction Y is shifted by a half track, and the servo elements 13c and 13d straddling adjacent tracks. Draw in the same way.

  The proximity effect correction in the drawing method of FIG. 4 is that the elements 13a and 13d on both sides of the four elements 13a to 13d shown in the drawing are of the sparsely arranged portion and the central elements 13b and 13c are of the densely arranged portion. Yes, a blanking signal is set based on a drawing clock signal to be described later so that the drawing on time of the densely arranged portion elements 13b and 13c is shorter than the drawing on time of the sparsely arranged portion elements 13a and 13d. It is done by setting.

  4A shows the drawing operation of the electron beam EB in the radial direction Y (outer peripheral direction) and the rotation direction A of the electron beam EB, and FIG. 4B shows the deflection signal Def (Y) in the radial direction Y and (C ) Shows the on / off control of the blanking signal BLK, (D) shows the drawing clock signal, (E) shows the invariant basic clock signal, and (F) shows the vibration signal Mod (Y) in the radial direction Y. ing. The horizontal axis of (A) indicates the phase of the substrate 10, and the horizontal axes of (B) to (F) indicate time.

  The basic clock signal (E) is a constant clock signal that does not change depending on the situation, and is generated in the controller 50 described later. The drawing clock signal (D) is based on the basic clock signal, and as shown in FIG. 3, the rotational speed N of the rotary stage 41 changes between the inner track drawing and the outer track drawing. Also, the clock width (clock length) is adjusted in accordance with the change in the rotation speed N so that the number of clocks in one rotation (one round) is the same.

  That is, the clock width is changed according to the radius r so as to be narrow at the inner track and wide at the outer track for each predetermined track. Then, the dimensional and temporal width in the circumferential direction (rotation direction A) is defined by the number of clocks of the drawing clock signal, and the servo patterns 13a to 13d are drawn with the same number of drawing clocks on the inner track and the outer track. Basic. Thereby, the number of drawing clocks at the same angle (phase) is the same on the inner peripheral side and the outer peripheral side, so that a similar pattern can be drawn easily. Unlike the above, when the same clock width is used for the inner and outer circumferences, the element width may not be an integer multiple of the clock width in the middle track, whereas in the present invention, it is always an integer multiple. Therefore, it is possible to easily draw a servo element whose pattern width changes minutely.

  The integer number of clocks is increased / decreased in accordance with the proximity effect correction. In the illustrated case, the dense arrangement section elements 13b and 13c start to be turned on with respect to the drawing on time of the sparse arrangement section elements 13a and 13d. In addition to delaying the timing, the ON end timing is advanced to correct the drawing ON time.

  The first drawing example will be specifically described with reference to FIG. First, the electron beam EB is irradiated by turning on the blanking signal BLK of (C) at point a, and drawing of the sparsely arranged portion servo element 13a is started. The electron beam EB at the drawing start position is changed to (F). The drawing position is sent in the circumferential direction (track direction) by moving the irradiation position of the electron beam EB accompanying the rotation of the substrate 10 in the A direction while reciprocally vibrating in the radial direction Y by the vibration signal Mod (Y) of Scanning is performed so as to fill the rectangular servo element 13a, the irradiation of the electron beam EB is stopped by turning off the blanking signal BLK at the point b, and drawing of the servo element 13a is ended.

  Next, when the substrate 10 is rotated to point c, drawing of the next densely arranged portion servo element 13b is started in the same manner, drawing is similarly performed based on the same on / off control, and this servo is performed at the point d. The drawing of the element 13b is finished. As described above, the points c and d are changed by the proximity effect correction, and the ON time of the densely arranged portion servo element 13b is corrected to be short. As a result, the drawing length (line) in the rotation direction A (circumferential direction) Width) is shorter than the drawing length of the sparsely arranged portion servo element 13a. The final photosensitive width of the densely arranged portion servo element 13b is set to be equal to that of the sparsely arranged portion servo element 13a due to the proximity effect.

  Subsequently, the reference position is moved in the radial direction (-Y) by the half track of the deflection signal Def (Y) of (B) at the point e, and the electron beam EB is (F) from the reference position in the same manner as described above. The rectangular densely arranged portion servo element 13c is filled by sending the drawing position in the circumferential direction along with the rotation of the substrate 10 in the A direction while reciprocally vibrating in the radial direction Y by the vibration signal Mod (Y). The irradiation of the electron beam EB is stopped by turning off the blanking signal BLK at the point f, and the drawing of the servo element 13c is finished. The setting of the e point and the f point is corrected for the proximity effect similarly to the c point and the d point.

  Next, when the substrate 10 is rotated to point g, drawing of the next sparsely arranged portion servo element 13d is started in the same manner, drawing is similarly performed based on the same on / off control, and this servo is performed at the point h. The drawing of the element 13d is finished.

  As described above, the drawing control signals (B) to (C) are created based on the drawing clock signal (D), and the ON / OFF control of the blanking signal (C) is controlled by the drawing clock signal. Proximity effect correction, which is performed in accordance with the signal generation timing and adjusts the ON time, increases or decreases the integer number of clocks.

  When the servo element 13 is drawn, accurate positioning is performed based on the encoder pulse signal at a drawing start point, that is, a plurality of points such as point a in FIG. The accuracy of the formation position is increased.

  After one track is drawn, the next track is moved and drawn in the same manner, and a desired fine pattern 12 is drawn in the entire area of the substrate 10. The track movement of the electron beam EB is performed by linearly moving a rotary stage 41 (described later) in the radial direction Y. As described above, the movement may be performed for each drawing of a plurality of tracks or for each drawing of one track according to the deflectable range of the electron beam EB in the radial direction Y.

  Assuming that FIG. 4 shows an inner track drawing, the signals (B) and (C) are set so that the length in the track direction is increased by a predetermined magnification at the outer track drawing. The oscillation signal (F) is set to have the same amplitude H and the same frequency, and the drawing width corresponding to the track width W in the radial direction Y of the servo element 13 is set by the amplitude H of the reciprocating vibration in the radial direction of the electron beam EB. It prescribes. On the other hand, the basic clock signal (E) is generated at regular intervals at the same time, and based on this, the clock width is adjusted so that the drawing clock signal (D) has the same number of clocks in one round according to the radius. Is done. That is, the clock width is increased at the same magnification as the magnifications (B) to (C). Then, the number of signals of the drawing clock signal is counted to set the on / off timing and signal shape of various control signals. For example, the number of drawing clocks for drawing the servo elements 13 of the servo pattern 12 is preferably about 10 to 30 clocks. Note that when the drawing area of the servo element 13 is increased, the influence of the proximity effect tends to be reduced, and thus the proximity effect correction coefficient is different from that of the inner peripheral side drawing.

  As described above, the drawing clock signal (D) has a clock width that is wide at the outer track and narrower at the inner track, and the rotational speed N of the rotary stage 41 is slower at the outer track and faster at the inner track, as described above. Both are synchronized and changed at the same time. At the same rotation speed N, even if the drawing track position, that is, the radial position r is slightly changed, the number of clocks in one round is the same. Can draw. At that time, the relative movement speed of the resist 11 with respect to the electron beam EB differs depending on the radial position and slightly increases on the outer periphery, and the dose amount of the unit area changes. However, since the signal length of the drawn element depends on the rotational linear velocity of the substrate 10, it is substantially the same. Without changing the rotation speed N and the drawing clock signal width, slight fluctuations in the drawing track position are caused by the sensitivity of the resist, It is compensated by the signal accuracy and can be used as actual recording information without any problem. It is not necessary to change the number of rotations and the drawing clock width every movement of one track. adjust.

  The beam intensity of the electron beam EB is set such that the resist 11 can be sufficiently exposed by the high-speed vibration drawing of the servo element 13.

  Next, an embodiment of the second drawing method of the present invention will be described based on FIG. FIG. 5A shows the drawing operation of the electron beam EB in the radial direction Y (outer peripheral direction) and the rotation direction A of the electron beam EB, FIG. 5B shows the deflection signal Def (Y) in the radial direction Y, and FIG. (B) ON / OFF control of the blanking signal BLK, (D) a drawing clock signal set so that the number of clocks in one rotation is the same as above, and (E) an invariant basic clock signal. Show. The horizontal axis of (A) indicates the phase of the substrate 10, and the horizontal axes of (B) to (E) indicate time.

  This second drawing method does not perform reciprocal vibration in the radial direction Y in the first drawing method, and sends the electron beam EB in the radial direction Y by one beam width by one rotation of the substrate 10. This is a drawing method by OFF control. Others are the same as the first drawing method.

  That is, according to the position (phase) of the servo element 13, the irradiation of the electron beam EB is controlled to be turned on / off in synchronization with the rotation of the substrate 10. The element 13 is drawn. Next, in the next rotation of the substrate 10, the irradiation position in the radial direction Y of the electron beam EB is sent by one pitch by one beam width by the deflection operation of the electron beam EB, and the electron beam EB is controlled by the same on / off control. Irradiation drawing is repeated, and this is repeated. By using this together with the radial movement of the rotary stage 41, drawing is performed sequentially from the inner periphery to the outer periphery or from the outer periphery to the inner periphery, and the entire surface is drawn.

  In the case of FIG. 5, a drawing mode for two continuous rotations at the time of R1 rotation and R2 rotation of the substrate 10 is shown. First, during the R1 rotation, the deflection signal Def (Y) in the radial direction Y in (B) is fixed by the deflection signal (R1) having a constant voltage corresponding to the drawing radius position, and accompanying the rotation of the substrate 10 in the A direction. Then, irradiation with the electron beam EB is intermittently performed by ON / OFF control of the blanking signal BLK in (C), and exposure drawing is performed.

  The on / off timing in the on / off control of the blanking signal BLK in (C) is similar to the case in FIG. 4, and the drawing on time of the densely arranged portion elements 13b and 13c is the sparsely arranged portion element 13a. , 13d, the proximity effect correction is set so as to be shorter than the drawing on time.

  Specifically, when the blanking signal BLK of (C) is turned on at the point a, the electron beam EB is irradiated to start drawing of the sparsely arranged portion servo element 13a, and the substrate 10 is rotated in the A direction. The drawing position is sent in the circumferential direction (track direction) by the movement of the irradiation position of the electron beam EB, and the irradiation of the electron beam EB is stopped by turning off the blanking signal BLK at the point b. Finish drawing.

  Next, when the substrate 10 is rotated to point c, drawing of the next densely arranged portion servo element 13b is started in the same manner, drawing is similarly performed based on the same on / off control, and this servo is performed at the point d. Drawing of one beam width of the element 13b is completed. In this R1 rotation, drawing is not performed because there is no form of the subsequent servo elements 13c and 13d in the one beam width.

  Subsequently, in the next R2 rotation, the deflection signal Def (Y) of (B) is sent by one pitch by one beam width, and is fixed by the deflection signal (R2) having a constant voltage corresponding to the drawing radius position. As the substrate 10 rotates in the A direction, the electron beam EB is irradiated at the point a by turning on the blanking signal BLK of (C), and drawing for the next one beam width of the sparsely arranged portion servo element 13a is started. Then, the drawing position is sent by the rotation of the substrate 10 in the A direction, the irradiation of the electron beam EB is stopped by turning off the blanking signal BLK at the point b, and the servo element 13a is drawn with one beam width. Next, when the substrate 10 is rotated to point c, drawing of the next densely arranged portion servo element 13b is started in the same manner, drawing is similarly performed based on the same on / off control, and this servo is performed at the point d. Drawing of the next one beam width of the element 13b is finished.

  Subsequently, the electron beam EB is irradiated by turning on the blanking signal BLK of (C) at the point e, and drawing for the first one beam width of the densely arranged portion servo element 13c shifted by a half track is started. The drawing position is sent by rotating the substrate 10 to the point, and the irradiation of the electron beam EB is stopped by turning off the blanking signal BLK at the point f, and drawing of one beam width of the servo element 13c is finished. Next, when the substrate 10 is rotated to point g, similarly, drawing for the first one beam width of the next sparsely arranged portion servo element 13d is started, and drawing is similarly performed based on the same on / off control. Then, drawing of one beam width of the servo element 13d is completed at the point h.

  The points c, d, e, and f are changed by the proximity effect correction as described above, and the densely arranged portion elements 13b and 13c with respect to the drawing on time of the sparsely arranged portion elements 13a and 13d. Is an integer based on the number of clocks of the drawing clock signal in (D) so as to delay the on start timings of the c point and the e point, and to shorten the on end timings of the d point and the f point to shorten the drawing on time. The number is corrected.

  In the second drawing method, movement of the irradiation position of the electron beam EB in the radial direction in at least one track is performed by a deflection operation of the electron beam EB, and movement to the next track is performed by the electron beam EB. The deflection operation or the rotation stage 41 is linearly moved in the radial direction Y.

  In order to draw each element 13 of the servo pattern 12, the electron beam EB is scanned as described above, and a drawing data signal for performing scanning control of the electron beam EB is sent to a signal transmission device described later. 60 (see FIG. 6) is sent to the controller 50 of the electron beam drawing apparatus 40. The timing and phase of this transmission signal are controlled based on the encoder pulse generated according to the rotation of the rotary stage 41 and the drawing clock signal.

  In order to perform the above drawing, a fine pattern drawing system 20 as shown in FIG. 6 is used. The fine pattern drawing system 20 includes an electron beam drawing device 40 and a signal transmission device 60. The electron beam drawing apparatus 40 includes a rotary stage unit 45 including a rotary stage 41 that supports the substrate 10 and a spindle motor 44 having a motor shaft provided so as to coincide with the central axis 42 of the stage 41, and a rotary stage unit. A shaft 46 that penetrates a part of 45 and extends in the one radial direction Y of the rotary stage 41 and a linear moving means 49 for moving the rotary stage unit 45 along the shaft 46 are provided. A part of the rotary stage unit 45 is screwed with a precise threaded rod 47 arranged in parallel with the shaft 46 so that the rod 47 is rotated forward and backward by a pulse motor 48. The rod 47 and the pulse motor 48 constitute a linear moving means 49 of the rotary stage unit 45. In order to detect the rotation of the rotary stage 41, an encoder 53 is installed which generates encoder pulses at regular intervals with a predetermined rotational phase by reading the encoder slit, and this encoder pulse signal is sent to the controller 50. The controller 50 incorporates clock means (not shown) for generating a basic clock signal in timing control.

  Furthermore, the electron beam drawing apparatus 40 includes an electron gun 23 that emits an electron beam EB, and a deflecting unit 21 that deflects the electron beam EB in the radial direction Y and vibrates minutely in the radial direction Y with a constant amplitude. In the case of the drawing system, reciprocal vibration deflection is not required), and an aperture 25 and a blanking 26 (deflector) are provided as blanking means 24 for controlling on / off of the irradiation of the electron beam EB, and an electron gun 23 is provided. The electron beam EB emitted from the substrate 10 is irradiated onto the substrate 10 through the deflecting unit 21 and a lens (not shown).

  The aperture 25 in the blanking means 24 has a through-hole through which the electron beam EB passes in the center, and the blanking 26 has an aperture without deflecting the electron beam EB when the on signal is input in response to the input of the on / off signal. On the other hand, at the time of an off signal, the electron beam EB is deflected and blocked by the aperture 25 without passing through the aperture 25 so that the electron beam EB is not irradiated. Operate. When each element 13 is drawn, an ON signal is input to irradiate the electron beam EB, and when moving between the elements 13, an OFF signal is input to interrupt the electron beam EB, and drawing is performed. It is controlled not to do.

  Driving the spindle motor 44, that is, the rotational speed of the rotary stage 41, driving the pulse motor 48, that is, linear movement by the linear movement means 49, modulation of the electron beam EB, control of the deflection means 21, and turning on the blanking 26 of the blanking means 24. Off control or the like is performed based on a control signal sent from the controller 50 which is a control means.

  The signal sending device 60 stores drawing data of a fine pattern such as the servo pattern 12 described above and sends a drawing data signal to the controller 50. The controller 50 is based on the drawing data signal as described above. In this way, the servo pattern 12 having a fine pattern is drawn on the entire surface of the substrate 10 by the electron beam drawing apparatus 40.

  The proximity effect correction described above can be corrected when the corrected drawing data signal is transmitted from the signal transmission device 60 or when the controller 50 performs linkage control.

  The substrate 10 placed on the rotary stage 41 is made of, for example, silicon, glass, or quartz, and a positive or negative electron beam drawing resist 11 is previously coated on the surface thereof. It is desirable to adjust the output of the electron beam EB and the beam diameter in consideration of the sensitivity of the electron beam drawing resist 11 and the shape of each element 13.

  Next, FIG. 7 shows a fine concavo-convex pattern using an imprint mold 70 (concave / convex pattern carrier) provided with a fine pattern drawn by the above-described electron beam drawing method by the fine pattern drawing system 20 as described above. FIG. 6 is a schematic cross-sectional view showing a process in which is transferred and formed on a magnetic disk medium.

  In the imprint mold 70, the above-described resist 11 (not shown in FIG. 7) is applied to the surface of a substrate 71 made of a translucent material, and the servo pattern 12 is drawn. Thereafter, development processing is performed to form a concavo-convex pattern with a resist on the substrate 71. The substrate 71 is etched using the patterned resist as a mask, and then the resist is removed to obtain an imprint mold 70 having a fine uneven pattern 72 formed on the surface. As an example, the fine uneven pattern 72 includes a servo pattern and a groove pattern for discrete track media.

  Using this imprint mold 70, a magnetic disk medium 80 is produced by an imprint method. The magnetic disk medium 80 includes a magnetic layer 82 on a substrate 81, and a resist resin layer 83 for forming a mask layer is coated thereon. Then, the fine uneven pattern 72 of the imprint mold 70 is pressed against the resist resin layer 83, the resist resin layer 83 is cured by ultraviolet irradiation, and the uneven shape of the fine pattern 72 is transferred and formed. Thereafter, the magnetic layer 82 is etched based on the concavo-convex shape of the resist resin layer 83 to produce a magnetic disk medium 80 for discrete track media in which a fine concavo-convex pattern is formed by the magnetic layer 82.

  In the above description, the manufacture of discrete track media has been described. However, bit pattern media can also be manufactured in the same process.

  FIG. 8 shows a magnetic transfer master carrier 90 (concave / convex pattern carrier) provided with a fine pattern drawn by the above-described electron beam drawing method by the fine pattern drawing system 20 as described above. FIG. 6 is a schematic cross-sectional view showing a process of magnetically transferring a magnetization pattern in order to manufacture a magnetic disk medium 85 by using it.

  The manufacturing process of the magnetic transfer master carrier 90 is almost the same as the manufacturing method of the imprint mold 70. The substrate 10 placed on the rotation stage 41 is coated with a positive or negative electron beam drawing resist 11 on the surface of a disk made of, for example, silicon, glass or quartz, and the electron beam is scanned on the resist 11. A desired pattern 12 is drawn. Thereafter, the resist 11 is developed to obtain a substrate 10 having a fine concavo-convex pattern of the resist. This becomes a master disk of the master carrier 90 for magnetic transfer.

  Next, a thin conductive layer is formed on the concavo-convex pattern surface of the master, and electroforming is performed thereon to obtain a substrate 91 having a concavo-convex pattern taking a metal mold. Thereafter, the substrate 91 having a predetermined thickness is peeled from the master. The uneven pattern on the surface of the substrate 91 is obtained by inverting the uneven shape of the master.

  After the back surface of the substrate 91 is polished, a magnetic layer 92 (soft magnetic layer) is coated on the uneven pattern to obtain a magnetic transfer master carrier 90. The convex or concave shape of the concave / convex pattern of the substrate 91 is a shape depending on the concave / convex pattern of the resist of the master.

  A magnetic transfer method using the magnetic transfer master carrier 90 manufactured as described above will be described. The magnetic disk medium 85 that is a transfer medium to which information is transferred is, for example, a hard disk, a flexible disk, or the like in which the magnetic recording layer 87 is formed on both surfaces or one surface of the substrate 86. Here, the magnetization of the magnetic recording layer 87 The perpendicular magnetic recording medium is formed so that the easy direction is perpendicular to the recording surface.

  As shown in FIG. 8A, an initial direct current magnetic field Hin is applied in advance to the magnetic disk medium 85 in one direction perpendicular to the track surface to cause the magnetic recording layer 87 to undergo initial direct current magnetization. Thereafter, as shown in FIG. 8B, the surface of the magnetic disk medium 85 on the recording layer 87 side and the surface of the magnetic layer 92 of the master carrier 90 are brought into close contact with each other, and the direction perpendicular to the track surface of the magnetic disk medium 85 is obtained. In addition, magnetic transfer is performed by applying a transfer magnetic field Hdu in the direction opposite to the initial DC magnetic field Hin. As a result, the magnetic field for transfer is sucked into the magnetic layer 92 of the master carrier 90, the magnetization of the magnetic layer 87 of the magnetic disk medium 85 corresponding to the convex portion is reversed, and the magnetization of the other portion is not reversed. Information (for example, servo signals) corresponding to the concavo-convex pattern of the master carrier 90 is magnetically transferred and recorded on the magnetic recording layer 87 of the disk medium 85. When magnetic transfer is also performed on the upper recording layer of the magnetic disk medium 85, an upper master carrier is brought into close contact with the upper recording layer, and magnetic transfer is performed simultaneously with the lower recording layer.

  In the case of magnetic transfer to the in-plane magnetic recording medium, a master carrier 90 substantially the same as that for the perpendicular magnetic recording medium is used. In the case of this in-plane recording, the magnetization of the magnetic disk medium is preliminarily magnetized in one direction along the track direction in advance, and is in close contact with the master carrier for transfer in a direction substantially opposite to the initial DC magnetization direction. Magnetic transfer is performed by applying a magnetic field, the magnetic field for transfer is sucked into the convex magnetic layer of the master carrier 90, and the magnetization of the magnetic layer of the magnetic disk medium corresponding to the convex part is not reversed, As a result of reversal of the magnetization of the other portions, a magnetization pattern corresponding to the concavo-convex pattern can be recorded on the magnetic disk medium.

  The above-described manufacturing method of the imprint mold and the magnetic transfer master carrier using the electron beam writing method of the present invention described above is an example, and a fine pattern is drawn using the electron beam writing method of the present invention. The manufacturing method is not limited to the above as long as it undergoes a step of forming a concavo-convex pattern.

The top view which shows the example of the fine pattern drawn on a board | substrate with the electron beam drawing method of this invention Enlarged view of a part of a fine pattern Characteristic diagram showing the relationship between drawing radius position and substrate rotation speed The enlarged schematic diagram (A) which shows the 1st drawing system including the proximity effect correction of the element which comprises a fine pattern, and the figure which shows various signals (B)-(F), such as a deflection signal in the drawing system The enlarged schematic diagram (A) which shows the 2nd drawing system containing the proximity effect correction of the element which comprises a fine pattern, and the figure which shows various signals (B)-(E), such as a deflection signal, in the drawing system Side view (A) and partial plan view (B) of an essential part of a fine pattern drawing system of one embodiment for carrying out the electron beam writing method of the present invention Schematic sectional view showing a process of transferring and forming a fine pattern on a magnetic disk medium using an imprint mold having a fine pattern drawn by an electron beam drawing method Schematic cross-sectional view showing the process of transferring and forming a magnetic pattern on a magnetic disk medium using a magnetic transfer master having a fine pattern drawn by an electron beam drawing method Drawing pattern diagram by electron beam for explaining proximity effect (A) and resist photosensitive pattern diagram (B)

Explanation of symbols

10 Board
11 resist
12 Servo pattern
13 Servo element
EB Electron beam A Rotation direction Y Radial direction
20 Fine pattern drawing system
21 Deflection means
23 electron gun
24 Blanking means
25 Aperture
26 Blanking
40 Electron beam lithography system
41 Rotating stage
44 Spindle motor
45 Rotating stage unit
49 Linear movement means
50 controller
53 Encoder
60 Signal transmitter
70 Imprint mold
71 board
72 Fine uneven pattern
80 Magnetic disk media
81 board
82 Magnetic layer
83 Resist resin layer
85 Magnetic disk media
90 Master carrier for magnetic transfer
92 Magnetic layer

Claims (9)

A fine pattern composed of elements larger than the irradiation diameter of the electron beam is obtained by scanning the electron beam with an electron beam lithography apparatus while rotating the rotary stage on a substrate coated with a resist and rotating the rotary stage. In the electron beam drawing method for drawing,
While rotating the substrate in one direction, with respect to the rotation of the substrate, an electron beam is irradiated with an ON signal at a predetermined rotation position of the substrate based on the drawing data of the fine pattern, and the rotation direction follows the rotation of the substrate. Then, drawing is performed for one turn by on / off control in which drawing is stopped by an off signal, and then the electron beam or the substrate is moved in the radial direction of the substrate to perform drawing by the on / off control. To draw the fine pattern ,
Drawing the line width in the rotational direction for one element by a continuous one-on signal,
According to the density of the element arrangement, in the element drawing in the dense arrangement part, the on-time of the on / off control is set shorter than the on time in the same element drawing in the sparse arrangement part, electron beam drawing method elements drawing line width direction of rotation, said adjusted to be shorter than the element drawing line width of the rotational direction of the sparse arrangement area, and performs the proximity effect correction. The rotation speed of the rotary stage is controlled so that the linear velocity is constant so that the rotation speed of the rotation stage is inversely proportional to the radius of the drawing position and the inner track drawing is faster and the outer track drawing is slower.
The electron beam drawing control signal is generated based on a drawing clock signal generated in association with the rotation of the rotary stage, and the drawing clock signal is used to draw the number of clocks in one rotation of the rotary stage. Regardless of the radius of the position, it is a constant value for each track
The electron beam writing method according to claim 1, wherein the proximity effect correction is performed by increasing or decreasing an integer number of clocks in the drawing clock signal.   The fine pattern is drawn by rotating the substrate in one direction, reciprocatingly vibrating the electron beam in the radial direction of the substrate, and rotating the substrate to a predetermined rotational position of the substrate by the on / off control. The electron beam drawing method according to claim 1, wherein the element is drawn by following irradiation.   The fine pattern is drawn by rotating the substrate in one direction, fixing the electron beam at a predetermined radial position, irradiating the predetermined rotation position of the substrate by the on / off control, and performing electron on the next rotation of the substrate. 3. The electron beam drawing method according to claim 1, wherein the element is drawn by moving the irradiation position of the beam in the radial direction and repeating the irradiation by the on / off control.   5. A signal sending device for sending a drawing data signal and an electron beam drawing device for scanning an electron beam for realizing the electron beam drawing method according to claim 1. Fine pattern drawing system. The electron beam drawing apparatus includes a rotary stage that can move in a radial direction while rotating a substrate coated with a resist, an electron gun that emits an electron beam, and a deflection that deflects the electron beam in a radial direction of the rotary stage. Means, blanking means for performing on / off control for blocking the irradiation of the electron beam except for the drawing portion, and a controller for linking and controlling the operation by each means,
The signal sending device sends a drawing data signal to the controller of the electron beam drawing device based on data according to the form of a fine pattern to be drawn on the substrate,
The controller irradiates an electron beam with an ON signal at a predetermined rotation position of the substrate based on the fine pattern drawing data, draws in the rotation direction following the rotation of the substrate, and stops drawing with an OFF signal. After performing drawing for one round by control, the electron beam or the substrate is moved in the radial direction of the substrate and drawing by the on / off control is repeated, and the fine pattern is drawn,
The drawing for the line width in the rotation direction for one element is performed by a continuous ON signal, and in the element drawing in the densely arranged portion according to the density of the element arrangement, off control of the on-time, set shorter than the on-time of the same element rendering the sparse arrangement area, the direction of rotation of the element drawing line width in the dense arrangement area is, of the rotation direction of the sparse arrangement area element The fine pattern drawing system according to claim 5, wherein the fine pattern drawing system is controlled based on a drawing signal that is adjusted so as to be shorter than a drawing line width and performs proximity effect correction.   A step of drawing a desired fine pattern on the resist-coated substrate by the electron beam drawing method according to any one of claims 1 to 4 and forming an uneven pattern corresponding to the desired fine pattern. A method for producing a concavo-convex pattern carrier, characterized by being produced through a process.   A step of drawing a desired fine pattern on the resist-coated substrate by the electron beam drawing method according to any one of claims 1 to 4 and forming an uneven pattern corresponding to the desired fine pattern. A method for producing a magnetic disk medium, comprising: using an imprint mold produced through the transfer, and transferring a concavo-convex pattern corresponding to the concavo-convex pattern provided on the surface of the mold.   A step of drawing a desired fine pattern on the resist-coated substrate by the electron beam drawing method according to any one of claims 1 to 4 and forming an uneven pattern corresponding to the desired fine pattern. A method for producing a magnetic disk medium, comprising: using a magnetic transfer master carrier produced through the magnetic transfer, and magnetically transferring a magnetization pattern corresponding to the concavo-convex pattern provided on the surface of the master carrier.

Images