JP5280117B2 - Wafer holding jig and wafer processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a wafer from being damaged when holding the wafer. <P>SOLUTION: A wafer holding jig 3 includes a plurality of wafer holders 12, 11 with which wafer holding grooves 13, 11 which partially hold the outer circumference of a wafer W are formed, and a holder line in which a plurality of wafer holders 12 are connected. In the wafer holding jig, a plurality of wafer holders 12 (12a, 12b) in the holder line are bent to a side where the wafer W is held with respect to the neighboring wafer holder 12 (12b, 12c), so that the outer circumference of the wafer W is held in portions of wider range than the half of the circumference. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a wafer holding jig for holding a wafer and a wafer processing apparatus including the same.

  A silicon wafer is produced from an ingot through processes such as slicing, chamfering, lapping or double-head grinding, etching, mirror polishing, and cleaning. In each of these steps or between the steps, a wafer to be processed is held by a wafer holding jig and is subjected to predetermined processing, conveyance, and the like. Further, between these processes and after the process, inspection such as appearance inspection may be performed by holding the wafer with a wafer holding jig.

  As a wafer holding jig, for example, a tool for holding a wafer in contact with the front or back surface of the wafer is known. According to such a wafer holding jig, since it comes into contact with the front surface or the back surface of the wafer, there is a possibility that scratches may be generated on the front surface or the back surface, or dirt may be attached.

  On the other hand, there is known a wafer holder capable of preventing generation of scratches on the front surface or the back surface of the wafer by holding the outer periphery of the wafer (for example, Patent Document 1).

JP 2000-61936 A

  According to the wafer holder described in Patent Document 1, it is possible to prevent generation of scratches on the front surface or the back surface of the wafer. However, it is necessary to move the holding body for holding the wafer in an arc shape. In this case, the holding body rubs over a wide area on the outer periphery of the wafer, which may damage the wafer. Further, when the holding body rubs the outer periphery of the wafer, a part of the wafer may be peeled off and adhere to the plane of the wafer.

  The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of suppressing the occurrence of damage to a wafer when holding the wafer.

  To achieve the above object, the wafer holding jig according to the first aspect of the present invention is a wafer holding jig for holding a wafer, and a wafer holding groove capable of holding a part of the outer periphery of the wafer is formed. There are a plurality of wafer holders, a plurality of wafer holders connected to each other, and a plurality of first wafer holders in the holder row with respect to a second wafer holder adjacent thereto. By bending to the side that holds the wafer, the outer periphery of the wafer can be held in a wider range than the half circumference. According to the wafer holding jig, the wafer holder can be held by bending the wafer holder to the side holding the wafer with respect to the adjacent wafer holder. Rubbing can be prevented.

  In the wafer holding jig, at least a part of the first planes of the at least one first wafer holder and the second wafer holder are in plane contact with each other, whereby the first wafer holder is obtained. And the bent state of the second wafer holder may be defined. According to such a wafer holding jig, the bent state of the wafer holder can be properly defined by bringing the first planes into plane contact with each other, and generation of useless force on the wafer can be reduced.

  In the wafer holding jig, the first wafer holding body and the second wafer holding body may be rotatably connected. According to such a wafer holding jig, the wafer holders can be directly connected to each other, and the wafer holders can be appropriately rotated.

  Further, in the wafer holding jig, the first or first of the at least one first wafer holder and the second wafer holder may be in contact with each other so that at least a part of the first planes are in plane contact with each other. A first tensile member for pulling one of the two wafer holders to the other may be further included. According to such a configuration, the wafer holding bodies can be bent with respect to the adjacent wafer holding bodies by pulling the wafer holding bodies with the first tension member.

  In the wafer holding jig, the first and second wafer holders are formed by extending wafer holding grooves in a straight line, and include at least one or more first wafer holders and a second wafer. It may be possible to define that both of the wafer holding grooves are aligned in a straight line when at least a part of the second flat surfaces with the holding body are in plane contact with each other. According to such a wafer holding jig, the wafer holding grooves of the wafer holder can be arranged in a straight line by bringing the second planes into plane contact with each other. For this reason, for example, before bending a wafer holder, a wafer can be easily arranged at a predetermined position where it should be located.

  Further, in the wafer holding jig, the first or second first plane or the second wafer holder may be in contact with each other so that at least a part of the second planes are in plane contact with each other. A second tension member for pulling one of the two wafer holders to the other may be further included. According to this configuration, the wafer holding bodies can be easily aligned in a straight line by pulling the wafer holding bodies together by the second tension member.

  In the wafer holding jig, the plurality of wafer holders on one end side of the holder row and the plurality of wafer holders on the other end side are formed by extending wafer holding grooves in a straight line. The plurality of wafer holders on the side and the plurality of wafer holders on the other end side can be defined so that the wafer holding grooves are parallel to each other with an interval of approximately the same width as the diameter of the wafer. It may be. According to such a wafer holding jig, the wafer to be held can be easily arranged at a position sandwiched between the wafer holders at both ends, and then the wafer can be appropriately held.

  In the wafer holding jig, the wafer holder may be formed such that the outermost surface on the side holding the wafer is concave with respect to the center of the wafer when the wafer is held. According to such a wafer holding jig, the outermost surface on the side of holding the wafer of the wafer holder is concave with respect to the center of the wafer when the wafer is held. Can be widened.

  In order to achieve the above object, a wafer processing apparatus according to a second aspect of the present invention is a wafer processing apparatus that includes a wafer holding jig for holding a wafer and that performs a predetermined process on the wafer held by the wafer holding jig. The wafer holding jig further includes a drive unit for moving the wafer holding jig, and the wafer holding jig includes a plurality of wafer holding bodies in which wafer holding grooves capable of holding a part of the outer periphery of the wafer are formed, and the wafer holding body A plurality of first wafer holders in the holder row are bent toward the side holding the wafer with respect to the second wafer holder adjacent thereto, thereby the wafer It becomes a state which can hold | maintain the outer periphery of this in a part wider than a half periphery.

  Embodiments of the present invention will be described with reference to the drawings. The embodiments described below do not limit the invention according to the claims, and all the elements and combinations described in the embodiments are essential for the solution of the invention. Is not limited.

  First, a wafer processing apparatus according to an embodiment of the present invention will be described.

  FIG. 1 is a configuration diagram of a wafer processing apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration diagram of a connected wafer holder according to an embodiment of the present invention. FIG. 1 is a schematic top view of a wafer processing apparatus, FIG. 2A is a perspective view of a part of a connected wafer holder in a state where the wafer is opened (open state), and FIG. It is a transverse cross section in the approximate center of a body.

  The wafer processing apparatus 1 is used, for example, to change the posture of the wafer W in the process of observing the wafer W. The wafer processing apparatus 1 includes a wafer holding jig 3 that holds the wafer W and a drive control unit 2 that holds and controls the wafer holding jig 3. The drive control unit 2 controls the holding operation and the opening operation of the wafer W by the wafer holding jig 3. Specifically, the drive control unit 2 controls the wire adjusting unit 22 to wind and pull out the wires 20 and 21. Further, the drive control unit 2 performs linear movement of the wafer holding jig 3, rotational movement in a plane parallel to the plane of the wafer W, rotational movement about an axis on a plane parallel to the plane of the wafer W, and the like. Control. The wafer holding jig 3 includes a base wafer holder 10 (an example of a wafer holder) connected to the drive control unit 2 and a plurality of connected wafer holders 12 (wafer holders) connected to the base wafer holder 10. The holding wire 20 and the opening wire 21 for rotating and connecting the connected wafer holder 12 and winding or pulling out the holding wire 20 and the opening wire 21. And a wire adjustment unit 22.

  The base wafer holder 10 has a wafer holding groove 11 having a substantially V-shaped cross section in a plane passing through the center Wo of the wafer W to be held. The wafer holding groove 11 is formed in an arc shape having a center angle of 180 degrees or less with the wafer center Wo as the center along the outer periphery of the wafer W. Further, two sets (for example, three) of connected wafer holders 12 are connected to the base wafer holder 10, and two sets of the connected wafer holders 12 and the base wafer holder 10 are combined. A holding body row is formed. Further, in the base wafer holder 10, a path of the holding wire 20 and the open wire 21 between the connected wafer holder 12 and the wire adjusting unit 22 is formed.

  The connected wafer holder 12 has a shape extending in a predetermined longitudinal direction, and a substantially V-shaped wafer holding groove 13 is formed on the side holding the wafer W as shown in FIG. 2B. As shown in FIG. 2A, the wafer holding groove 13 extends linearly in the longitudinal direction. A base side surface 18, which is a plane substantially perpendicular to the longitudinal direction, is formed on the base wafer holder 10 side (referred to as the base side) of the connected wafer holder 12. On the other hand, a bent defining surface 16 and an open defining surface 17 are formed on the distal end side of the coupled wafer holder 12. In addition, in the two connected wafer holders 12a that are the most distal portions of the holder row, the cutting edge connected wafer holders 12 (12a) are connected to each other in place of the bending regulation surface 16 and the opening regulation surface 17. However, the most advanced side surface 19 (see FIG. 1) that can be brought into plane contact when the wafer is held is formed.

  The bending regulation surface 16 is formed as a flat surface inclined toward the wafer W holding side (wafer holding side). The inclination of the regulation surface 16 at the time of bending is such that when the regulation surface 16 at the time of bending is in plane contact with the base side surface 18 of the connected wafer holder 12 to be connected next, the wafer holding groove 13 of the adjacent connected wafer holder 12 is. A part of the wafer W is formed so as to come into contact with the outer periphery of the wafer W to be held. The opening defining surface 17 is formed on a plane substantially perpendicular to the longitudinal direction of the connected wafer holder 12. According to the opening regulation surface 17, the wafer holding groove between the connected wafer holding body 12 and the adjacent connected wafer holding body 12 when in plane contact with the base side surface 18 of the connected wafer holding body 12 connected adjacently. 13 are arranged in a substantially straight line.

  In the present embodiment, the wafer holding grooves 13 of a plurality of (for example, three) connected wafer holders 12 on each tip side (the right tip side and the left tip side in FIG. 1) are arranged in a substantially straight line. In addition, the wafer holding grooves 13 on the front end side are arranged in parallel with each other with a width of a substantially diameter of the wafer W. Two sets of through-holes 14 extending in the longitudinal direction are formed on the wafer holding side inside the connected wafer holder 12, and two sets of through-holes 15 extending in the longitudinal direction are also formed inside away from the wafer holding side. Is formed. The through hole 14 is formed at a position that penetrates the regulation surface 16 when bent, and the through hole 15 is formed at a position that penetrates the regulation surface 17 when opened.

  The holding wire 20 is passed through the through hole 14, and the opening wire 21 is passed through the through hole 15. In the present embodiment, the holding wire 20 passes through the base wafer holder 10 from the wire adjustment unit 22 for each pair of the left and right wafer holders, and sequentially reaches one of the connected wafer holders 12 on the base side. The most advanced connected wafer holder 12 (12a) passes through the through hole 14 to the most advanced, and further through the other through hole 14 of the most advanced connected wafer holder 12, the most advanced connected object. In order from the wafer holder 12, the other through-hole 14, the base wafer holder 10, and the wire adjuster 22 are reached.

  Further, the opening wire 21 passes through the base wafer holder 10 from the wire adjusting unit 22, passes through one through hole 15 in order from the connected wafer holder 12 on the base side, and reaches the most advanced connected wafer holder 12. (12a) to the most advanced, further through the other through-hole 15 of the most advanced connected wafer holder 12, through the other through-hole 15 in order from the most connected wafer holder 12 on the most advanced side, It passes through the base wafer holder 10 and reaches the wire adjustment unit 22. In this manner, since the holding wire 20 and the opening wire 21 are passed through each connected wafer holder 12, the connected wafer holders 12 are connected.

  With such a configuration, when both the (two) holding wires 20 of the connected wafer holder 12 are wound up in a state in which the opening wire 21 can be pulled out freely, the wire adjusting unit 22 can be Since the length of the holding wire 20 to the connected wafer holder 12 at the front end is shortened, the base side surface 18 of the connected wafer holder 12 at the front end and the bending time of the connected wafer holder 12 on the base side are specified. The surface 16 comes into surface contact, and the connected wafer holder 12 on the tip side is bent toward the wafer holding side with respect to the connected wafer holder 12 on the adjacent base side. Note that no further load is applied to the wafer W because no further bending occurs when the surface comes into contact.

  On the other hand, when both the (two) open wires 21 of the connected wafer holder 12 are wound in a state in which the holding wire 20 can be pulled out freely, the most advanced connected object is connected from the wire supply unit 22. Since the length of the opening wire 21 to the wafer holding body 12 is shortened, the base side surface 18 of the connected wafer holding body 12 on the distal end side and the opening regulation surface 17 of the connected wafer holding body 12 on the base side are formed. The contacted wafer holders 12 on the front end side are arranged in a straight line with respect to the connected wafer holders 12 on the adjacent base side.

  Next, processing by the wafer processing apparatus 1 will be described.

  First, the drive control unit 2 controls the wire adjusting unit 22 to open the plurality of connected wafer holders 12 in the left and right groups connected to the base wafer holder 10 as shown in FIG. State. That is, the drive control unit 2 winds the release wire 21 in a state where the holding wire 20 is released by the wire adjusting unit 22, thereby holding each set of the plurality of connected wafer holders 12 in the respective wafer holding units. The grooves 13 are arranged in a straight line, and the wafer holding grooves 13 of each set are parallel to each other with the same width as the diameter of the wafer W.

  Next, the drive control unit 2 moves the wafer holding jig 3 toward the holding target wafer W placed at a predetermined position with the open side (upper side in FIG. 1) of the wafer holding jig 3 facing substantially. Move linearly. As a result, the wafer W to be held is in contact with the wafer holding groove 11 of the base wafer holder 10 along the wafer holding groove 13 arranged on the straight line of the connected wafer holder 12 of the wafer holding jig 3. Will come. In this process, the wafer W is in contact with the wafer holding groove 13 only in a limited narrow range on the outer periphery of the wafer W (for example, a range in the vicinity of the right and left end portions of the wafer W in FIG. 1). Since there is no possibility of this, the generation of scratches on the wafer W can be reduced. For this reason, it can also reduce that the foreign material peeled off from the wafer W adheres to the wafer W.

  Next, the drive control unit 2 controls the wire adjusting unit 22 to place the plurality of connected wafer holders 12 in the holding state shown in FIG. That is, when the drive control unit 2 winds the holding wire 20 with the wire adjusting unit 22 free of the opening wire 21, the base side surface 18 of the connected wafer holder 12 on the tip side and the base The front-side connected wafer holder 12 is brought into surface contact with the specified surface 16 at the time of bending of the connected wafer holder 12 on the side, and the connected wafer holder 12 on the tip side is on the wafer holding side with respect to the adjacent connected wafer holder 12 on the base side. The wafer holding groove 13 of the wafer holder 12 is brought into contact with the outer periphery of the wafer W in a wide area of the wafer W to be held. Thereafter, the state in which the wafer W is held can be maintained by fixing the holding wire 20.

  Next, the drive control unit 2 moves, rotates, etc. the wafer holding jig 3 so that predetermined processing such as appearance inspection of the wafer W can be executed. After the predetermined processing, the wafer holding jig 3 is transported to a predetermined position where the wafer W is to be placed, the plurality of connected wafer holders 12 are opened, and the wafer holding jig 3 is retracted. Thus, the wafer W can be placed at a predetermined position.

  Next, a first modification of the wafer processing apparatus will be described.

  FIG. 3 is a block diagram of a wafer processing apparatus according to a first modification of the present invention, and FIG. 4 is a block diagram of a connected wafer holder according to the first modification of the present invention.

  The wafer processing apparatus 1 according to the first modified example includes a wafer holding jig 31 instead of the wafer holding jig 3 of the wafer processing apparatus 1 shown in FIG. The wafer holder 12 is replaced with a connected wafer holder 32. The same functional parts as those of the connected wafer holder 12 are denoted by the same reference numerals, and here, the differences will be mainly described.

  There are three types of connected wafer holders 32: the most advanced connected wafer holder 32a, the most proximal connected wafer holder 32c, and the intermediate connected wafer holder 32b. The right set of connected wafer holders 31 and the left set of connected wafer holders 31 have a line-symmetric shape.

  The connected wafer holder 32b has two partial cylinders (cylinders having a central angle of 360 degrees or less) centered on the axis perpendicular to the plane of the wafer W (in the depth direction in FIG. 3). A base portion having a front end side connecting portion 33 and having a shape of a partial cylinder (a column having a central angle of 360 degrees or less) centered on an axis perpendicular to the plane of the wafer W (in the depth direction in FIG. 3) on the base side. A side connecting portion 35 is provided. Connection holes 34 and 36 for inserting pin members for connection are formed at substantially the centers of the distal end side connection portion 33 and the base portion side connection portion 35. Further, the connected wafer holder 32b is formed with a curved surface that rotatably contacts the base side connecting portion 35 of the adjacent connected wafer holder 32 between the two leading end side connecting portions 33 on the leading end side. And a connection corresponding portion 37 formed with a curved surface that rotatably contacts the two distal end side connection portions 33 of the adjacent connected wafer holders 32.

  When the two connected wafer holders 32 are connected, one plane of the two distal end side connecting portions 33 and two planes of the base side connecting portion 35 are in contact with each other at the connected portion. It has become. With such a configuration, the connected wafer holder 12 on the front end side is supported by the connected wafer holder 12 on the base side, and the connected wafer holder 12 on the front end side bends due to the weight of the wafer W or the like. This can be prevented appropriately. Further, a pin member is inserted into each of the connection holes 34 and 36, and the connected wafer holder 32 can be rotated around the pin member.

  The most advanced connected wafer holder 32a is similar to the connected wafer holder 12a on the front end side in the intermediate portion of the connected wafer holder 32b as shown in FIG. Further, the base-side connected wafer holder 32c is the same as the base-side connected wafer holder 12c shown in FIG. 1 in the intermediate-side connected wafer holder 32b.

  Next, a wafer processing apparatus 1 according to a second modification of the present invention will be described.

  FIG. 5 is a configuration diagram of a wafer processing apparatus according to a second modification of the present invention.

  The wafer processing apparatus 1 according to the second modification is provided with a wafer holding jig 41 in place of the wafer holding jig 3 of the wafer processing apparatus 1 shown in FIG. The wafer holder 12 is replaced with a connected wafer holder 42. The same functional parts as those of the connected wafer holder 12 are denoted by the same reference numerals, and here, the differences will be mainly described.

  When the wafer W is held by the connected wafer holder 12, the connected wafer holder 42 has a plane (surface or surface) of the wafer W from a predetermined wafer observation direction (the front side or the depth direction in FIG. 1). The portion covering the back surface, that is, the outermost part of the wafer holding side surface, is concave with respect to the center Wo of the wafer W as shown by the wafer holding side surface 43 (for example, the concentric shape of the wafer W when holding the wafer W). By forming in this way, the area of the portion blocking the plane of the wafer W from the wafer observation direction is reduced. Here, a region R in FIG. 5 shows a region in which a portion blocking the plane of the wafer W is reduced as compared with FIG. As a result, the plane of the wafer W can be observed in a wider range.

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not restricted to embodiment mentioned above, It can apply to other various aspects. For example, in the above-described embodiment, the two wires of the holding wire 20 and the opening wire 21 are provided. However, the present invention is not limited to this, and for example, only the holding wire 20 is provided. May be. In this case, a part of the holding wire 20 is fixed to the state-of-the-art connected wafer holder 12, the holding wire 20 is wound up when holding the wafer, and the holding wire 20 is pulled out when released. Thus, the connected wafer holder 12 may be rotated away from the wafer holding side. Here, as a wire, you may make it use the thing of a material which is hard to produce expansion-contraction and a bending.

  In the above embodiment, two sets of connected wafer holders are provided for the base wafer holder 10, but only one set of connected wafer holders may be provided. In the above embodiment, three connected wafer holders are provided in one set. However, the present invention is not limited to this, and the number of connected wafer holders in each group is an arbitrary number. It's okay. The number of connected wafer holders may be determined in consideration of the material of the connected wafer holder, the weight of the wafer to be held, and the like. For example, if the number of connected wafer holders is increased, the number of locations where the wafer is held can be increased, and the load on the wafer at each location can be suppressed. In this case, the number of connected wafer holders 12 may be increased.

  Further, in the above embodiment, in the open state, the wafer holding grooves 13 of the two sets of connected wafer holding units 12 connected to the base wafer holding unit 10 are parallel with the same width as the diameter of the wafer W. However, the present invention is not limited to this, and the wafer W is held in the wafer holding groove 11 of the base wafer holding unit 10 even if the widths of the wafer holding grooves 13 of each set are not parallel. I can do it. Further, in the above embodiment, the connected wafer holder 12 and the base wafer holder 10 are distributed and held over substantially the entire circumference of the wafer W, but the portion distributed over a wider range than the half circumference. In short, the outer periphery of the wafer may be held in a wider area than the half circumference.

  In the above embodiment, the tip portion is simply in contact, but for example, the most advanced portion of one set may be engaged with the most advanced portion of the other set. In this way, the wafer can be held more reliably. Further, in the above embodiment, each wire is folded back at the most advanced connected wafer holding part to reach the wire adjusting part 22, but the present invention is not limited to this, and the most advanced connected wafer holding body. In this case, the wire may be fixed. Further, the wafer holder is pulled by the wire, but is not limited to the wire, and may be a plate-like member. In short, any pulling member that can be pulled may be used.

It is a block diagram of the wafer processing apparatus which concerns on one Embodiment of this invention. It is a block diagram of the to-be-connected wafer holding body which concerns on one Embodiment of this invention. It is a block diagram of the wafer processing apparatus which concerns on the 1st modification of this invention. It is a block diagram of the to-be-connected wafer holding body which concerns on the 1st modification of this invention. It is a block diagram of the wafer processing apparatus which concerns on the 2nd modification of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, Wafer processing apparatus, 2 Drive control part, 3, 31, 41 Wafer holding jig, 10 Base wafer holder, 11 Wafer holding groove, 12, 32, 42 Connected wafer holder, 13 Wafer holding groove, 14, 15 through-holes, 16 defining surfaces when bent, 17 defining surfaces when opened, 18 base side surfaces, 19 cutting-edge side surfaces, 20 holding wires, 21 opening wires, 22 wire adjusting units, 32 connected wafer holding surfaces, 33 distal end sides Connection part, 34 Connection hole, 35 Base side connection part, 36 Connection hole, 37, 38 Connection corresponding part, 43 Wafer holding side surface, W wafer, We Wafer peripheral chamfering surface.

Claims (10)

A wafer holding jig for holding a wafer,
A plurality of wafer holders formed with wafer holding grooves capable of holding a part of the outer periphery of the wafer;
A plurality of wafer holders connected to each other;
The plurality of first wafer holders in the holder row are bent toward the side holding the wafer with respect to the second wafer holder adjacent to the plurality of wafer holders, thereby making the outer circumference of the wafer wider than a half circumference. It becomes a state that can be held in the part,
At least a part of the first planes of the at least one first wafer holder and the second wafer holder are in plane contact with each other, so that the first wafer holder and the second wafer plane are in contact with each other. A wafer holding jig capable of defining a bent state with the wafer holder. The at least one of the first wafer holding body and the second wafer holding body are in contact with each other so that at least a part of the first planes are in plane contact with each other. The wafer holding jig according to claim 1, further comprising a first tension member for pulling one to the other. The wafer holding jig according to claim 2, wherein the first wafer holding body and the second wafer holding body are directly connected so as to be rotatable. The first and second wafer holders are formed such that the wafer holding grooves extend linearly,
At least a part of the second planes of the at least one first wafer holder and the second wafer holder are in plane contact with each other, so that both the wafer holding grooves are aligned. The wafer holding jig according to claim 1, wherein the wafer holding jig can be defined as follows. The at least one of the first wafer holding body and the second wafer holding body are in contact with each other so that at least some of the second planes are in plane contact with each other. The wafer holding jig according to claim 4, further comprising a second tension member for pulling one to the other. The plurality of wafer holders on one end side of the holder row and the plurality of wafer holders on the other end side are formed by extending the wafer holding grooves linearly,
The plurality of wafer holders on the one end side and the plurality of wafer holders on the other end side have intervals substantially the same as the diameter of the wafer, and the wafer holding grooves are parallel to each other. The wafer holding jig according to claim 4 or 5, which can be defined as follows. 7. The wafer holding body according to claim 1, wherein the outermost surface on the side holding the wafer is formed so as to be concave with respect to the center of the wafer when the wafer is held. The wafer holding jig according to one item. The plurality of first wafer holders in the holder row are bent toward the side holding the wafer with respect to the second wafer holder adjacent thereto, thereby enclosing the entire circumference of the wafer. The wafer holding jig according to any one of claims 1 to 7, wherein the wafer can be held. A wafer holding jig for holding a wafer,
A plurality of wafer holders formed with wafer holding grooves capable of holding a part of the outer periphery of the wafer;
A plurality of wafer holders connected to each other;
The plurality of first wafer holders in the holder row are bent toward the side holding the wafer with respect to the second wafer holder adjacent to the plurality of wafer holders, thereby making the outer circumference of the wafer wider than a half circumference. It becomes a state that can be held in the part,
The first and second wafer holders are formed such that the wafer holding grooves extend linearly,
At least a part of the second planes of the at least one first wafer holder and the second wafer holder are in plane contact with each other, so that both the wafer holding grooves are aligned. Wafer holding jig that can be specified as follows. A wafer processing apparatus comprising a wafer holding jig for holding a wafer, and performing a predetermined process on the wafer held by the wafer holding jig,
A drive unit for moving the wafer holding jig;
The wafer holding jig is
A plurality of wafer holders formed with wafer holding grooves capable of holding a part of the outer periphery of the wafer;
A plurality of wafer holders connected to each other;
The plurality of first wafer holders in the holder row are bent toward the side holding the wafer with respect to the second wafer holder adjacent to the plurality of wafer holders, thereby making the outer circumference of the wafer wider than a half circumference. It becomes a state that can be held in the part,
At least a part of the first planes of the at least one first wafer holder and the second wafer holder are in plane contact with each other, so that the first wafer holder and the second wafer plane are in contact with each other. Wafer processing apparatus capable of prescribing a bent state with a wafer holder.

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