JP5279750B2 - Temperature profile estimation method, temperature profile estimation device, and reflow device - Google Patents

Description

  The present invention relates to a temperature profile estimation method for estimating a temperature profile of a substrate transported in a reflow apparatus.

  A reflow device that heats a substrate on which a component such as an electronic component is mounted heats the substrate to meet predetermined constraints, thereby avoiding damage to the component due to heat and soldering the component to the substrate. Can be attached.

  For example, the reflow apparatus pre-heats the substrate so that the substrate temperature is maintained in a predetermined temperature range below the melting point of the solder for a predetermined time, and then the substrate temperature is predetermined within a predetermined temperature range equal to or higher than the melting point of the solder. The substrate is reflow-heated so as to be held only for a time. By adapting the temperature profile of the board to the constraint that the board temperature is kept within a given temperature range for a given time in this way, the reflow device can solder the part to the board while avoiding damage due to the heat of the part. can do.

  Therefore, a method for estimating the temperature profile of the substrate has been proposed in order to determine the heating conditions (such as the set temperature of the heating chamber) of the reflow apparatus for heating the substrate so as to meet predetermined constraints. (For example, refer to Patent Document 1).

  In the method described in Patent Document 1, a temperature profile of a substrate heated by a reflow apparatus under a predetermined heating condition is measured, and a heating characteristic value (hereinafter, referred to as a heating characteristic value of the substrate with respect to the reflow apparatus is measured using the measured temperature profile). Simply referred to as “m value”). And the temperature profile of the board | substrate in the case of changing heating conditions is estimated using the calculated m value. Accordingly, the temperature profile of the substrate when the heating condition is changed can be estimated using the m value calculated from the measured temperature profile.

JP 2004-64002 A

  However, in the above conventional method, the difference between the estimated temperature profile and the actually measured temperature profile may be large. For example, a fluid such as air or nitrogen heated in the heating chamber flows out of the heating chamber where temperature control is not performed, and the substrate is heated at a position upstream or downstream of the heating chamber, whereby the reflow apparatus The estimation accuracy of the temperature profile of the substrate transported inside decreases.

  Accordingly, the present invention has been made to solve the above-described problems, and an object thereof is to provide a temperature profile estimation method capable of accurately estimating the temperature profile of a substrate transported in a reflow apparatus. To do.

  In order to achieve the above object, a temperature profile estimation method according to an aspect of the present invention includes a heating chamber capable of controlling an atmospheric temperature to match a set temperature, a front chamber located upstream of the heating chamber, and A temperature profile estimation method for estimating a temperature profile indicating a temporal change in the temperature of a substrate transported in a reflow apparatus including at least one of a rear chamber located downstream of the heating chamber, wherein the temperature profile is estimated A correspondence relationship between a set temperature acquisition step for acquiring a set temperature of the heating chamber, a representative temperature representative of an atmosphere temperature of at least one of the front chamber and the rear chamber, and a set temperature of the heating chamber. A representative temperature specifying step for specifying a representative temperature corresponding to the set temperature acquired in the set temperature acquisition step, Using the representative temperature specified in the representative temperature specifying step and the set temperature acquired in the set temperature acquiring step, the temperature of the substrate transported in at least one of the front chamber and the rear chamber and the heating chamber A temperature profile estimation step for estimating the profile.

  As a result, the temperature profile of the front chamber or the rear chamber where temperature control is not performed can be estimated, so that the temperature profile of the substrate transported in the reflow apparatus can be estimated with higher accuracy. Furthermore, since the representative temperature of the front chamber or the rear chamber used when estimating the temperature profile can be specified with relatively high accuracy using the set temperature of the heating chamber, the operator represents the representative when the temperature profile is estimated. There is no need to input temperature, and an increase in the load on the operator can be suppressed.

  In addition, the heating chamber is capable of controlling the ambient temperature independently of each other, and the first heating chamber adjacent to the front chamber and the second heating provided downstream of the first heating chamber in the transport direction. And the representative temperature information indicates a correspondence relationship between the representative temperature of the front chamber and the set temperature of the first heating chamber, and is acquired in the set temperature acquisition step in the representative temperature specifying step. It is preferable that the representative temperature of the front chamber corresponding to the set temperature of the first heating chamber is specified.

  Thereby, since the representative temperature of the front chamber can be specified with high accuracy using the set temperature of the first heating chamber adjacent to the front chamber, the temperature profile can be estimated with higher accuracy.

  Further, the heating chamber is provided on the downstream side in the transport direction from the first heating chamber and the first heating chamber, each of which can control the ambient temperature independently of each other, and adjacent to the rear chamber. At least two heating chambers, and the representative temperature information indicates a correspondence relationship between the representative temperature of the rear chamber and the set temperature of the second heating chamber. In the representative temperature specifying step, in the set temperature acquisition step, It is preferable to specify a representative temperature of the rear chamber corresponding to the acquired set temperature of the second heating chamber.

  Thereby, since the representative temperature of the rear chamber can be specified with high accuracy using the set temperature of the second heating chamber adjacent to the rear chamber, the temperature profile can be estimated with higher accuracy.

  Further, the temperature profile estimation device according to one aspect of the present invention includes a heating chamber that can be controlled so that the ambient temperature matches a set temperature, a front chamber positioned upstream of the heating chamber, and a downstream side of the heating chamber. A temperature profile estimation device for estimating a temperature profile indicating a temporal change in the temperature of a substrate transported in a reflow apparatus including at least one of a rear chamber located in the rear chamber, wherein the temperature profile estimation device estimates at least one of the front chamber and the rear chamber A storage unit storing representative temperature information indicating a correspondence relationship between a representative temperature representative of an ambient temperature and a set temperature of the heating chamber, and a set temperature of the heating chamber used for estimating a temperature profile. A representative temperature corresponding to the preset temperature acquired by the preset temperature acquisition unit is identified using the preset temperature acquisition unit to be acquired and the representative temperature information stored in the storage unit Using the representative temperature specifying unit, the representative temperature specified by the representative temperature specifying unit, and the set temperature acquired by the set temperature acquiring unit, and at least one of the front chamber and the rear chamber, and the heating chamber And a temperature profile estimation unit that estimates the temperature profile of the substrate being conveyed.

  Thereby, the same effect as the above-mentioned temperature profile estimation method can be produced.

  Moreover, the reflow apparatus which concerns on 1 aspect of this invention is provided with the said temperature profile estimation apparatus.

  Thereby, the same effect as the above-mentioned temperature profile estimation method can be produced.

  The present invention can be realized not only as such a temperature profile estimation method but also as a program for causing a computer to execute each step included in the temperature profile estimation method. Such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc Read Only Memory) or a transmission medium such as the Internet.

  As is clear from the above description, the temperature profile estimation method according to one aspect of the present invention can estimate the temperature profile of the front chamber or the rear chamber that is not temperature-controlled, and is therefore transported in the reflow apparatus. It is possible to estimate the temperature profile of the substrate with higher accuracy. Furthermore, since the representative temperature of the front chamber or the rear chamber used when estimating the temperature profile can be specified with relatively high accuracy using the set temperature of the heating chamber, the operator represents the representative when the temperature profile is estimated. There is no need to input temperature, and an increase in the load on the operator can be suppressed.

It is sectional drawing which shows the structure of the reflow apparatus which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the temperature profile in the reflow apparatus which concerns on Embodiment 1 of this invention. It is a block diagram which shows the structure of the temperature profile estimation system which concerns on Embodiment 1 of this invention. It is a figure which shows an example of the representative temperature information which concerns on Embodiment 1 of this invention. It is a flowchart which shows the flow of the temperature profile estimation process which concerns on Embodiment 1 of this invention. It is a flowchart which shows the flow of the representative temperature information generation process which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the measuring method of the representative temperature which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the process in the measured value monitoring part which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the structure of the reflow apparatus which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the temperature profile in the reflow apparatus which concerns on Embodiment 2 of this invention. It is a figure which shows an example of the representative temperature information which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the measuring method of the representative temperature which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the process in the measured value monitoring part which concerns on Embodiment 2 of this invention. It is a figure which shows an example of the hardware constitutions of a computer.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing a configuration of a reflow apparatus according to Embodiment 1 of the present invention.

  The reflow apparatus 100 heats a substrate 300 on which a component such as an electronic component is mounted on a substrate on which cream solder is printed. More specifically, for example, the reflow apparatus 100 is a so-called nitrogen reflow furnace, and heats the substrate 300 while filling the inside of the heating chamber 110 or the like with nitrogen in order to reduce the oxygen concentration in the heating chamber 110.

  Note that the temperature profile estimation apparatus 10 described later estimates the temperature profile of the substrate 300 transported in the reflow apparatus 100.

  As shown in FIG. 1, the reflow apparatus 100 includes a front chamber 101, a heating chamber 110, a cooling chamber 107, and a conveyor 111.

  The front chamber 101 is provided on the upstream side of the heating chamber 110 in the transfer direction, and the substrate 300 is transferred therein. Further, the front chamber 101 has a labyrinth structure in order to prevent a fluid such as nitrogen filled inside from flowing out upstream (outside). Specifically, a plurality of plate materials are arranged in the front chamber 101 in a direction intersecting the transport direction so as not to interfere with the substrate 300 transported by the conveyor 111.

  The front chamber 101 does not have a means for positively controlling the ambient temperature, and is not temperature controlled. Therefore, the set temperature is not set for the front chamber 101.

  The heating chamber 110 heats the substrate 300 by controlling the atmospheric temperature so as to match the set temperature. The heating chamber 110 includes a preheating chamber 108 and a reflow chamber 109 in order from the upstream side to the downstream side in the transport direction.

  The preheating chamber 108 preheats the substrate 300 so that the temperature profile of the substrate 300 meets the preheating part constraint. That is, the preheating chamber 108 holds the substrate 300 so that the temperature of the substrate 300 is maintained in a predetermined temperature range (for example, 150 to 180 ° C.) below the melting point of the solder for a predetermined time (for example, a time of 120 seconds or less). Preheat.

  The preheating chamber 108 includes a first preheating chamber 102, a second preheating chamber 103, and a third preheating chamber 104 in order from the upstream side to the downstream side in the transport direction.

  The first preheating chamber 102, the second preheating chamber 103, and the third preheating chamber 104 can independently control the ambient temperature. Specifically, the first preheating chamber 102, the second preheating chamber 103, and the third preheating chamber 104 include, for example, a heat source (not shown) and a temperature sensor (not shown). That is, each of the first preheating chamber 102, the second preheating chamber 103, and the third preheating chamber 104 controls the heat source according to the temperature measured by the temperature sensor, thereby matching the ambient temperature with the set temperature.

  The reflow chamber 109 reflow-heats the substrate 300 so that the temperature profile of the substrate 300 meets the reflow part restriction condition. That is, the reflow chamber 109 reflow-heats the substrate 300 so that the temperature of the substrate 300 is maintained in a predetermined temperature range (for example, 220 to 240 ° C.) higher than the melting point of the solder for a predetermined time (40 seconds or more). To do.

  The reflow chamber 109 includes a first reflow chamber 105 and a second reflow chamber 106 in order from the upstream side to the downstream side in the transport direction.

  The first reflow chamber 105 and the second reflow chamber 106 can control the ambient temperature independently, like the first preheating chamber 102 and the like. Specifically, the first reflow chamber 105 and the second reflow chamber 106 include, for example, a heat source (not shown) and a temperature sensor (not shown), respectively. That is, each of the first reflow chamber 105 and the second reflow chamber 106 controls the heat source in accordance with the temperature measured by the temperature sensor, thereby matching the ambient temperature with the set temperature.

  The cooling chamber 107 cools the substrate 300 by controlling the internal atmospheric temperature to coincide with the set temperature. Specifically, the cooling chamber 107 includes, for example, a cooler (not shown) and a temperature sensor (not shown). That is, the cooling chamber 107 matches the atmospheric temperature with the set temperature by controlling the cooler according to the temperature measured by the temperature sensor.

  Next, the temperature profile of the substrate 300 conveyed in the reflow apparatus 100 will be described.

  FIG. 2 is a diagram for explaining a temperature profile in the reflow apparatus according to Embodiment 1 of the present invention. Specifically, FIG. 2A is a diagram showing the set temperature set in the reflow apparatus 100. FIG. 2B is a graph showing an estimated temperature profile 401 estimated by the conventional temperature profile estimation method using the set temperature, and a measured temperature profile 402 actually measured at the set temperature. It is.

  As shown in FIG. 2, in the conventional estimation method, since the temperature profile is not estimated in the front chamber 101 where temperature control is not performed, the temperature of the substrate 300 at the entrance of the preheating chamber 108 is, for example, the same as the initial temperature of 25 ° C. Is set. Then, the estimated temperature profile is estimated by estimating the temperature change from the initial temperature of the substrate 300 conveyed through the preheating chamber 108, the reflow chamber 109, and the cooling chamber 107.

  However, as is apparent from the measured temperature profile 402, the temperature of the substrate 300 actually increases in the front chamber 101. This is because the fluid temperature such as nitrogen heated in the preheating chamber 108 flows out to the front chamber 101, and the ambient temperature of the front chamber 101 is increased.

  As a result, an error occurs between the estimated temperature profile 401 and the measured temperature profile 402 due to the temperature difference at the inlet of the preheating chamber 108. That is, even if the estimated temperature profile 401 conforms to the preheating part restriction condition 403, the measured temperature profile 402 may not actually conform to the preheating part restriction condition 403.

  A temperature profile estimation system according to the present embodiment that can solve such problems and improve the accuracy of estimation of a temperature profile will be described below with reference to the drawings.

  FIG. 3 is a block diagram showing a configuration of the temperature profile estimation system according to Embodiment 1 of the present invention.

  As shown in FIG. 3, the temperature profile estimation system includes a temperature profile estimation device 10 and a representative temperature information generation device 20.

  First, the temperature profile estimation apparatus 10 will be described.

  The temperature profile estimation device 10 estimates a temperature profile indicating a time change of the temperature of the substrate 300 transported in the reflow device 100. The temperature profile estimation device 10 includes a set temperature acquisition unit 11, a storage unit 12, a representative temperature specifying unit 13, and a temperature profile estimation unit 14.

  The set temperature acquisition unit 11 acquires a set temperature of the heating chamber 110 and the like used when estimating the temperature profile. Specifically, the set temperature acquisition unit 11 acquires set temperatures of the heating chamber 110 and the cooling chamber 107, for example, where the estimated temperature profile is considered to meet the constraint conditions.

  More specifically, for example, as shown in FIG. 2A, the set temperature acquisition unit 11 sets the set temperature 180 ° C. of the first to third preheating chambers 102 to 104, and the first and second reflow chambers. A set temperature 240 ° C. of 105 and 106 and a set temperature 100 ° C. of the cooling chamber 107 are acquired.

  Note that the set temperature acquisition unit 11 does not acquire the set temperature of the front chamber 101. This is because, in the first place, the front chamber 101 cannot be controlled so that the ambient temperature matches the set temperature, and therefore there is no set temperature.

  The storage unit 12 is a memory, for example, and stores representative temperature information 12a. The representative temperature information 12a indicates a correspondence relationship between the representative temperature representing the ambient temperature of the front chamber 101 and the set temperature of the heating chamber 110. Specifically, the representative temperature information 12a is a correspondence relationship between the representative temperature representative of the ambient temperature of the front chamber 101 and the set temperature of the first preheating chamber 102 (corresponding to the first heating chamber) adjacent to the front chamber 101. Indicates. Details of the representative temperature information 12a will be described later with reference to FIG.

  The representative temperature specifying unit 13 specifies a representative temperature corresponding to the set temperature acquired by the set temperature acquiring unit 11 using the representative temperature information 12a. Specifically, the representative temperature specifying unit 13 specifies the representative temperature of the front chamber 101 corresponding to the set temperature of the first preheating chamber 102 by referring to the representative temperature information 12 a stored in the storage unit 12. .

  The temperature profile estimation unit 14 estimates the temperature profile of the substrate 300 transported between the front chamber 101 and the heating chamber 110 using the identified representative temperature and the acquired set temperature. That is, the temperature profile estimation unit 14 estimates the temperature profile of the substrate 300 transported in the front chamber 101 using the m value, assuming that the ambient temperature of the front chamber 101 is heated to the representative temperature.

  Specifically, for example, the temperature profile estimation unit 14 estimates the temperature profile of the substrate 300 that is transported through the front chamber 101, the heating chamber 110, and the cooling chamber 107 in order as follows.

  First, the temperature profile estimation unit 14 moves each chamber (the front chamber 101, the first to third preheating chambers 102 to 104, the first reflow chamber 105, the second reflow chamber 106, and the cooling chamber 107) or each chamber in the transport direction. Get the m value of each subdivision. The m value is calculated as in the following formula (1) using, for example, an actually measured temperature profile.

  Here, t is the time required for the substrate 300 to pass through each room or each section into which each room is subdivided.

  Ta is the representative temperature or set temperature of each room or each section into which each room is subdivided. Specifically, when calculating the m value of each section obtained by subdividing the front chamber 101 or the front chamber 101, Ta is a representative temperature. Further, when calculating the m value of the heating chamber 110 and the cooling chamber 107, or the respective sections obtained by subdividing them, Ta is a set temperature.

  Further, Tint is the temperature of the substrate 300 at the entrance boundary of each chamber or each section into which each chamber is subdivided. Ts is the temperature of the substrate 300 at the exit boundary of each chamber or each section into which each chamber is subdivided.

  Next, the temperature profile estimation unit 14 uses the acquired m value to calculate the temperature Ts of the substrate 300 in each chamber or each segment into which each chamber is subdivided according to the following equation (2), thereby obtaining the substrate 300 temperature profiles are estimated.

  Thus, the temperature profile estimation unit 14 estimates the temperature profile of the substrate 300 in consideration of the temperature change of the substrate 300 in the front chamber 101.

  Next, the representative temperature information generation device 20 will be described.

  The representative temperature information generation device 20 generates representative temperature information 12a stored in the storage unit 12 of the temperature profile estimation device 10. The representative temperature information generation device 20 includes a measurement value acquisition unit 21, a representative temperature information generation unit 22, and a measurement value monitoring unit 23.

  The measured value acquisition unit 21 acquires a combination of the representative temperature measured in the front chamber 101 and the set temperature of the first preheating chamber 102 when the representative temperature is measured as a measured value.

  The representative temperature information generation unit 22 generates the representative temperature information 12a based on at least two measurement values acquired by the measurement value acquisition unit 21. The representative temperature information 12 a stores the representative temperature information 12 a in the storage unit 12 by transmitting the generated representative temperature information 12 a to the temperature profile estimation device 10.

  Specifically, the representative temperature information generation unit 22 generates, for example, a linear function approximated by at least two measurement values as the representative temperature information 12a.

  Note that the representative temperature information generation unit 22 may generate, for example, a quadratic function or an exponential function approximated by at least two measurement values as the representative temperature information 12a. Further, for example, the representative temperature information generation unit 22 may generate a table in which at least two measurement values are stored as the representative temperature information 12a.

  The measured value monitoring unit 23 determines that the difference between the acquired representative temperature and the representative temperature corresponding to the acquired set temperature specified by the already generated representative temperature information 12a is within a predetermined allowable range. It is determined whether or not there is. Here, when it is determined that the difference is not within the allowable range, the measurement value monitoring unit 23 instructs the representative temperature information generation unit 22 to regenerate the representative temperature information 12a.

  Next, the representative temperature information 12a stored in the storage unit 12 will be described.

  FIG. 4 is a diagram showing an example of representative temperature information according to Embodiment 1 of the present invention. As shown in FIG. 4, the representative temperature information 12 a indicates a correspondence relationship between the set temperature of the first preheating chamber 102 and the representative temperature of the front chamber 101.

  Specifically, the representative temperature information 12 a is a linear function indicating a straight line passing through the first measurement value 411 and the second measurement value 412 acquired by the measurement value acquisition unit 21. As described above, the representative temperature information 12a is not necessarily a linear function.

  In addition, the set temperature of the first measurement value 411 is preferably a lower limit value of the atmospheric temperature at which the substrate 300 can be stably heated for the preliminary heating of the substrate 300. In addition, the set temperature of the second measured value 412 is preferably an upper limit value of the atmospheric temperature that can stably heat the substrate 300 for the preliminary heating of the substrate 300.

  Thereby, since the representative temperature of the front chamber 101 corresponding to the upper limit value and the lower limit value of the set temperature of the first preheating chamber 102 is specified, the accuracy of the representative temperature specified by the representative temperature information 12a can be improved. .

  Next, the temperature profile estimation process and the representative temperature information generation process executed in the temperature profile estimation apparatus 10 and the representative temperature information generation apparatus 20 configured as described above will be described with reference to FIGS.

  First, the temperature profile estimation process will be described.

  FIG. 5 is a flowchart showing a flow of temperature profile estimation processing according to Embodiment 1 of the present invention.

  First, the set temperature acquisition unit 11 acquires set temperatures of the heating chamber 110 and the cooling chamber 107 that are used when estimating the temperature profile (S101). Specifically, the set temperature acquisition unit 11 acquires set temperatures of the heating chamber 110 and the cooling chamber 107 as shown in FIG.

  Subsequently, the representative temperature specifying unit 13 specifies a representative temperature corresponding to the set temperature acquired by the set temperature acquiring unit 11 using the representative temperature information 12a (S102). Specifically, for example, when the acquired set temperature of the first preheating chamber 102 is 180 ° C., the representative temperature specifying unit 13 uses the representative temperature information 12a illustrated in FIG. Is identified as 73.3 ° C.

  And the temperature profile estimation part 14 estimates the temperature profile of the board | substrate 300 conveyed by the front chamber 101 and the heating chamber 110 using the specified representative temperature and the acquired set temperature (S103).

  As described above, the temperature profile estimation apparatus 10 estimates the temperature profile of the substrate 300.

  Next, the representative temperature information generation process will be described.

  FIG. 6 is a flowchart showing a flow of representative temperature information generation processing according to Embodiment 1 of the present invention. Moreover, FIG. 7 is a figure for demonstrating the measuring method of the representative temperature which concerns on Embodiment 1 of this invention. Moreover, FIG. 8 is a figure for demonstrating the process in the measured value monitoring part which concerns on Embodiment 1 of this invention.

  First, the measured value acquisition unit 21 acquires a combination of the representative temperature measured in the front chamber 101 and the set temperature of the first preheating chamber 102 when the representative temperature is measured as a measured value (S201).

  Specifically, for example, as illustrated in FIG. 7A, the measurement value acquisition unit 21 acquires the temperature measured by the temperature sensor 301 installed in the front chamber 101 as a representative temperature.

  The temperature sensor 301 is preferably installed at a position where it does not interfere with the substrate 300 and in the vicinity of the conveyor 111 in the center of the front chamber 101. Thereby, the measurement value acquisition unit 21 can acquire the ambient temperature around the substrate 300 actually transported in the front chamber 101 as the representative temperature.

  Furthermore, the temperature sensor 301 is preferably installed above the conveyor 111. This prevents the temperature sensor 301 from being damaged even if a component mounted on the board 300 falls during transportation.

  Further, as shown in FIG. 7B, for example, the measurement value acquisition unit 21 is installed in the front chamber by a temperature sensor 302 that is installed on the substrate 300 and is installed a predetermined distance away from the substrate 300 in the transport direction. You may acquire the temperature measured in the center part of 101 as a representative temperature. In this case, the predetermined distance is preferably a distance that is not affected by the temperature of the substrate 300, and may be determined by experience or experiment, for example.

  Next, the measured value monitoring unit 23 sets the measured temperature of the front chamber 101 and the set temperature of the first preheating chamber 102 when the representative temperature is measured, which is specified by the current representative temperature information 12a. It is determined whether the difference from the corresponding representative temperature of the front chamber 101 is within a predetermined allowable range (S202). The predetermined allowable range may be determined by experience or experiment based on the accuracy of the estimated temperature profile, for example.

  Specifically, for example, as shown in FIG. 8, the measured value monitoring unit 23 has an absolute value of a difference between the representative temperature specified by the current representative temperature information 12a and the measured representative temperature within 5%. It is determined whether or not there is. For example, as shown in FIG. 8A, when the measured value 413 is acquired, the measured value monitoring unit 23 determines the representative temperature specified by the current representative temperature information 12a and the representative temperature indicated by the measured value 413. Is determined to be outside the allowable range.

  Here, when the difference is within the predetermined allowable range (Yes in S202), the representative temperature information generation device 20 ends the representative temperature information generation process.

  On the other hand, when the difference is outside the predetermined allowable range, or when the representative temperature information 12a has not been generated yet (No in S202), the measured value acquisition unit 21 receives at least two newly measured values. Measurement values (for example, the first measurement value 414 and the second measurement value 415 shown in FIG. 8B) are acquired (S203). Then, the representative temperature information generation unit 22 newly generates the representative temperature information 12a using at least two measurement values acquired in step S203 (S204), and ends the representative temperature information generation process. Specifically, the representative temperature information generation unit 22 uses, as shown in FIG. 8B, for example, a linear function indicating a straight line passing through the first measurement value 414 and the second measurement value 415, as new representative temperature information. 12a is generated.

  As described above, the representative temperature information generation device 20 newly generates the representative temperature information 12a when the acquired measurement value is outside the allowable range. Thus, even when the correspondence between the set temperature of the first preheating chamber 102 and the representative temperature of the front chamber 101 changes due to a change in temperature outside the reflow apparatus 100 (outside air temperature) or the like, representative temperature information generation is performed. The device 20 can provide the representative temperature information 12a with high accuracy.

  As described above, the temperature profile estimation apparatus 10 according to the present embodiment can estimate the temperature profile of the front chamber 101 that is not temperature-controlled, and thus the temperature of the substrate 300 that is transported in the reflow apparatus 100. The profile can be estimated with higher accuracy. Furthermore, since the temperature profile estimation device 10 can specify the representative temperature of the front chamber 101 used when estimating the temperature profile with relatively high accuracy using the set temperature of the heating chamber 110, the temperature profile is estimated. At this time, it is not necessary for the operator to input the representative temperature, and an increase in the load on the operator can be suppressed.

  Furthermore, since the temperature profile estimation device 10 can specify the representative temperature of the front chamber 101 with high accuracy using the set temperature of the first preheating chamber 102 adjacent to the front chamber 101, the temperature can be determined with higher accuracy. The profile can be estimated.

(Embodiment 2)
Next, a second embodiment of the present invention will be described.

  In the present embodiment, a part of the configuration of the reflow apparatus 200 that heats the substrate 300 for estimating the temperature profile is different from the configuration of the reflow apparatus 100 according to the first embodiment. Hereinafter, the temperature profile estimation apparatus 10 according to the second embodiment will be described with reference to the drawings, focusing on differences from the first embodiment.

  FIG. 9 is a cross-sectional view showing a configuration of a reflow apparatus according to Embodiment 2 of the present invention. 9, the same components as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  The reflow apparatus 200 is, for example, a so-called atmospheric reflow furnace, and does not fill the heating chamber 110 with a special gas. The reflow apparatus 200 includes a rear chamber 201 in addition to the heating chamber 110. In the present embodiment, the reflow apparatus 200 does not include the front chamber 101 and the cooling chamber 107.

  The rear chamber 201 is provided on the downstream side of the heating chamber 110 in the transport direction, and the substrate 300 is transported therein. Further, the rear chamber 201 does not have a means for controlling the atmospheric temperature with high accuracy. Accordingly, the set temperature is not set for the rear chamber 201.

  The rear chamber 201 is provided with a blower that takes in air outside the reflow apparatus 200 and blows the taken-in air onto the substrate 300. As a result, the rear chamber 201 can reduce the temperature of the substrate 300 transported through the rear chamber 201.

  Next, the temperature profile of the substrate 300 conveyed in the reflow apparatus 200 will be described.

  FIG. 10 is a diagram for explaining a temperature profile in the reflow apparatus according to Embodiment 2 of the present invention. Specifically, FIG. 10A is a diagram showing the set temperature set in the reflow apparatus 200. FIG. 10B is a graph showing an estimated temperature profile 451 estimated by the conventional temperature profile estimation method using the set temperature.

  As shown in FIG. 10, in the conventional estimation method, the temperature profile is not estimated in the rear chamber 201 where temperature control is not performed. That is, the temperature profile indicated by the broken line in FIG. 10B is not estimated.

  By the way, as shown in FIG. 10B, for example, the reflow part constraint condition 452 is that the temperature of the substrate 300 extending between the second reflow chamber 106 and the rear chamber 201 is 40 to 240 to 240 ° C. above the melting point of the solder. Indicates that it will be held for more than a second. Therefore, the temperature change of the substrate 300 in the rear chamber 201 also affects whether or not the temperature profile of the substrate 300 meets the reflow restriction condition 452.

  That is, in the conventional estimation method, since the temperature profile in the rear chamber 201 is not estimated, the temperature profile cannot be estimated with high accuracy. As a result, it is difficult to search for an optimal set temperature at which the temperature profile meets the reflow part restriction condition 452.

  A temperature profile estimation system according to the present embodiment that can solve such problems and improve the accuracy of estimation of a temperature profile will be described below with reference to the drawings.

  Note that the temperature profile estimation system according to the present embodiment has the same configuration as the temperature profile estimation system according to the first embodiment, and therefore the illustration thereof is omitted.

  The representative temperature specifying unit 13 according to the present embodiment corresponds to the set temperature of the second reflow chamber 106 (corresponding to the second heating chamber) by referring to the representative temperature information 12b stored in the storage unit 12. The representative temperature of the rear chamber 201 is specified.

  The representative temperature information 12b indicates a correspondence relationship between the representative temperature representing the ambient temperature of the rear chamber 201 and the set temperature of the heating chamber 110. Specifically, the representative temperature information 12b indicates a correspondence relationship between the representative temperature that represents the ambient temperature of the rear chamber 201 and the set temperature of the second reflow chamber 106 adjacent to the rear chamber 201.

  FIG. 11 is a diagram showing an example of representative temperature information according to Embodiment 2 of the present invention. As shown in FIG. 11, the representative temperature information 12 b indicates a correspondence relationship between the set temperature of the second reflow chamber 106 and the representative temperature of the rear chamber 201.

  Specifically, the representative temperature information 12 b is a linear function indicating a straight line passing through the first measurement value 461 and the second measurement value 462 acquired by the measurement value acquisition unit 21. As described above, the representative temperature information 12b is not necessarily a linear function.

  In addition, the set temperature of the first measurement value 461 is preferably a lower limit value of the atmospheric temperature at which the substrate 300 can be stably heated for the reflow heating of the substrate 300. In addition, the set temperature of the second measurement value 462 is preferably an upper limit value of the ambient temperature that can stably heat the substrate 300 for reflow heating of the substrate 300.

  Thereby, since the representative temperature of the rear chamber 201 corresponding to the upper limit value and the lower limit value of the set temperature of the second reflow chamber 106 is specified, the accuracy of the representative temperature specified by the representative temperature information 12b can be improved. .

  FIG. 12 is a diagram for explaining a representative temperature measuring method according to Embodiment 2 of the present invention.

  As shown in FIG. 12, in the present embodiment, the temperature sensor 303 is preferably installed at a position where it does not interfere with the substrate 300 and in the vicinity of the conveyor 111 in the center of the rear chamber 201. Thereby, the measurement value acquisition unit 21 can acquire the ambient temperature around the substrate 300 that is actually transported through the rear chamber 201 as the representative temperature.

  FIG. 13 is a diagram for explaining processing in the measurement value monitoring unit according to Embodiment 2 of the present invention.

  The measured value monitoring unit 23 according to the present embodiment determines whether or not the absolute value of the difference between the representative temperature specified by the current representative temperature information 12b and the measured representative temperature is within 5%. . For example, as illustrated in FIG. 13A, when the measurement value 463 is acquired, the measurement value monitoring unit 23 determines the representative temperature specified by the current representative temperature information 12 b and the representative temperature indicated by the measurement value 463. Is determined to be outside the allowable range.

  Therefore, the measurement value acquisition unit 21 acquires at least two measurement values newly measured (for example, the first measurement value 464 and the second measurement value 465 shown in FIG. 13B). Then, for example, as shown in FIG. 13B, the representative temperature information generation unit 22 generates a linear function indicating a straight line passing through the first measurement value 464 and the second measurement value 465 as new representative temperature information 12b. To do.

  As described above, the representative temperature information generation device 20 newly generates the representative temperature information 12b when the acquired measurement value is outside the allowable range. As a result, even if the correspondence between the set temperature of the second reflow chamber 106 and the representative temperature of the rear chamber 201 changes due to a change in the outside air temperature or the like, the representative temperature information generation device 20 can display the representative temperature with high accuracy. Information 12b can be provided.

  As described above, the temperature profile estimation apparatus 10 according to the present embodiment can estimate the temperature profile of the rear chamber 201 that is not temperature-controlled, and therefore is transported in the reflow apparatus 100 with higher accuracy. The temperature profile of the substrate 300 can be estimated. Furthermore, since the temperature profile estimation device 10 can specify the representative temperature of the rear chamber 201 used when estimating the temperature profile with relatively high accuracy using the set temperature of the heating chamber 110, the temperature profile is estimated. At this time, it is not necessary for the operator to input the representative temperature, and an increase in the load on the operator can be suppressed.

  Furthermore, since the temperature profile estimation device 10 can specify the representative temperature of the rear chamber 201 with high accuracy using the set temperature of the second reflow chamber 106 adjacent to the rear chamber 201, the temperature can be determined with higher accuracy. The profile can be estimated.

  As described above, the temperature profile estimation device according to one aspect of the present invention has been described based on the embodiments, but the present invention is not limited to these embodiments. Unless it deviates from the meaning of this invention, the form which carried out the various deformation | transformation which those skilled in the art thought to this embodiment, or the structure constructed | assembled combining the component in a different embodiment is also contained in the scope of the present invention. .

  For example, the temperature profile estimation device 10 according to the first or second embodiment may include the representative temperature information generation device 20.

  In the first and second embodiments, the representative temperature information indicates the correspondence between the set temperature of the heating chamber 110 and the representative temperature of the front chamber 101 or the rear chamber 201. However, the representative temperature information is not limited to such correspondence. Absent. For example, the representative temperature information may indicate a correspondence relationship between the set temperature and the outside air temperature of the heating chamber 110 and the representative temperature of the front chamber 101 or the rear chamber 201. Accordingly, the representative temperature specifying unit 13 can specify the representative temperature with high accuracy when the representative temperature of the front chamber 101 or the rear chamber 201 also depends on the outside air temperature.

  Moreover, the temperature profile estimation apparatus 10 according to the first or second embodiment may be included in the reflow apparatus 100 or 200.

  Moreover, the reflow apparatus 100 or 200 shown in FIG. 1 or FIG. 9 is an example, and the present invention can be applied to a reflow apparatus having a different configuration. For example, the reflow apparatus 100 according to Embodiment 1 may include the rear chamber 201 without including the cooling chamber 107. In this case, if the representative temperature specifying unit 13 specifies the representative temperatures of the front chamber 101 and the rear chamber 201 using the representative temperature information 12a according to the first embodiment and the representative temperature information 12b according to the second embodiment. Good. Even in such a case, the temperature profile estimation device can estimate the temperature profile with high accuracy.

  Furthermore, the present invention can also be realized as a temperature profile estimation method for executing processing performed by characteristic components of such a temperature profile estimation device. Also, the temperature profile estimation method can be realized as a program for causing a computer as shown in FIG. Such a program can be distributed via a recording medium such as a CD-ROM or a transmission medium such as the Internet.

  FIG. 14 is a diagram illustrating an example of a hardware configuration of a computer. A program for causing a computer to execute the temperature profile estimation method is stored in, for example, a CD-ROM 515 that is a computer-readable medium, and is read via the CD-ROM device 514. In addition, for example, a program for causing a computer to execute the temperature profile estimation method is transmitted via a wired or wireless network, broadcast, or the like.

  The computer 500 includes a CPU (Central Processing Unit) 501, a ROM (Read Only Memory) 502, a RAM (Random Access Memory) 503, a hard disk 504, a communication interface 505, and the like.

  The CPU 501 executes a program read via the CD-ROM device 514 or a program received via the communication interface 505. Specifically, the CPU 501 expands a program read via the CD-ROM device 514 or a program received via the communication interface 505 in the RAM 503. The CPU 501 executes each coded instruction in the program expanded in the RAM 503.

  The ROM 502 is a read-only memory that stores programs and data necessary for the operation of the computer 500. The RAM 503 is used as a work area when the CPU 501 executes a program. Specifically, the RAM 503 temporarily stores data such as parameters at the time of program execution, for example. The hard disk 504 stores programs, data, and the like.

  The communication interface 505 communicates with other computers via a network. The bus 506 connects the CPU 501, ROM 502, RAM 503, hard disk 504, communication interface 505, display 511, keyboard 512, mouse 513 and CD-ROM device 514 to one another.

  The present invention can be used as a temperature profile estimation device that estimates a temperature profile indicating a temporal change in the temperature of a substrate conveyed in the reflow apparatus.

DESCRIPTION OF SYMBOLS 10 Temperature profile estimation apparatus 11 Set temperature acquisition part 12 Storage part 12a, 12b Representative temperature information 13 Representative temperature specific | specification part 14 Temperature profile estimation part 20 Representative temperature information generation apparatus 21 Measurement value acquisition part 22 Representative temperature information generation part 23 Measurement value monitoring Part 100, 200 Reflow device 101 Front chamber 102 First preheating chamber 103 Second preheating chamber 104 Third preheating chamber 105 First reflow chamber 106 Second reflow chamber 107 Cooling chamber 108 Preheating chamber 109 Reflow chamber 110 Heating chamber 201 Rear chamber

Claims (6)

Inside a reflow apparatus comprising a heating chamber that can be controlled so that the atmospheric temperature matches a set temperature, and at least one of a front chamber located upstream of the heating chamber and a rear chamber located downstream of the heating chamber. A temperature profile estimation method for estimating a temperature profile indicating a temporal change in temperature of a substrate to be conveyed,
A set temperature acquisition step for acquiring a set temperature of the heating chamber, which is used when estimating a temperature profile;
The set temperature acquired in the set temperature acquisition step using the representative temperature information indicating the correspondence between the representative temperature representative of the atmosphere temperature of at least one of the front chamber and the rear chamber and the set temperature of the heating chamber A representative temperature specifying step for specifying a representative temperature corresponding to
Using the representative temperature specified in the representative temperature specifying step and the set temperature acquired in the set temperature acquiring step, at least one of the front chamber and the rear chamber and the heating chamber A temperature profile estimation method comprising: a temperature profile estimation step for estimating a temperature profile. The heating chamber is capable of controlling the ambient temperature independently of each other, a first heating chamber adjacent to the front chamber, and a second heating chamber provided downstream of the first heating chamber in the transport direction, Having at least
The representative temperature information indicates a correspondence relationship between the representative temperature of the front chamber and the set temperature of the first heating chamber,
The temperature profile estimation method according to claim 1, wherein in the representative temperature specifying step, a representative temperature of the front chamber corresponding to the set temperature of the first heating chamber acquired in the set temperature acquiring step is specified. The heating chamber is provided on the downstream side in the transport direction with respect to the first heating chamber and the first heating chamber, each of which can control the ambient temperature independently of each other, and the second heating adjacent to the rear chamber. And at least a chamber,
The representative temperature information indicates a correspondence relationship between the representative temperature of the rear chamber and the set temperature of the second heating chamber,
The temperature profile estimation method according to claim 1 or 2, wherein in the representative temperature specifying step, a representative temperature of the rear chamber corresponding to the set temperature of the second heating chamber acquired in the set temperature acquiring step is specified.   A program for causing a computer to execute the temperature profile estimation method according to claim 1. Inside a reflow apparatus comprising a heating chamber that can be controlled so that the atmospheric temperature matches a set temperature, and at least one of a front chamber located upstream of the heating chamber and a rear chamber located downstream of the heating chamber. A temperature profile estimation device for estimating a temperature profile indicating a change in temperature of a substrate to be transported over time,
A storage unit that stores representative temperature information representing a correspondence relationship between a representative temperature representing the ambient temperature of at least one of the front chamber and the rear chamber, and a set temperature of the heating chamber;
A set temperature acquisition unit for acquiring a set temperature of the heating chamber, used when estimating a temperature profile;
Using the representative temperature information stored in the storage unit, a representative temperature specifying unit that specifies a representative temperature corresponding to the set temperature acquired by the set temperature acquiring unit,
Using the representative temperature specified by the representative temperature specifying unit and the set temperature acquired by the set temperature acquiring unit, at least one of the front chamber and the rear chamber and the heating chamber are conveyed. A temperature profile estimation device comprising: a temperature profile estimation unit that estimates a temperature profile.   A reflow apparatus comprising the temperature profile estimation apparatus according to claim 5.

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