JP5270225B2 - Cutting blade detection mechanism of cutting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting blade detection mechanism of a cutting device capable of completely retaining a detection block at an adjusted position. <P>SOLUTION: The cutting blade detection mechanism of the cutting device includes: a guide block located at a blade cover and provided with a guide part; the detection block 52 having a blade entering section that has a guided part guided along the guide part and into which a cutting blade enters and a light emitting body and a light receiving body disposed to face the blade entering part; and an adjustment rod 531 inserted and disposed in an adjustment rod insertion hole 512a provided at the guide block and provided with a male screw 531a screwed to a female screw hole provided at the detection block 52 at one end part. The detection block 52 is moved along the guide part of the guide block by rotating the adjustment rod 531. A frictional locking means 571 for locking the adjustment rod 531 by friction is disposed at the adjustment rod insertion hole 512a provided at the guide lock. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a cutting blade detection mechanism for detecting the state of a cutting blade provided in a cutting apparatus for cutting a wafer such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

  Cutting along the streets of the above-described semiconductor wafer, optical device wafer or the like is usually performed by a cutting device called a dicer. This cutting apparatus is provided with a cutting blade detection mechanism for detecting the replacement time of an annular cutting edge of a cutting blade whose diameter has been reduced due to wear, and chipping of the annular cutting edge.

The cutting blade detection mechanism includes a guide block that is provided on a blade cover that covers the cutting blade and includes a guide portion that extends toward the center of the cutting blade, and a guide that is guided along the guide portion of the guide block. And a detection block having a light-emitting body and a light-receiving body disposed opposite to the blade intrusion portion, and a guide block provided on the guide block. The adjustment rod is inserted into the adjustment rod insertion hole and is screwed into the female screw hole provided in the detection block. The detection block is rotated by rotating the adjustment rod in one direction or the other direction. It is comprised so that it may move along the guide part of a guide block. In order to prevent the detection block from moving from the adjusted position due to vibration, a fixing means including a fixing member and a fastening screw for fixing the detection block to the guide block at the adjusted position is provided. Yes. (For example, see Patent Document 1)
Japanese Utility Model Publication 4-70459

  Thus, the cutting blade detection mechanism disclosed in Patent Document 1 includes a fastening screw that constitutes a fixing means for fixing the detection block to the guide block at the adjusted position each time the position of the detection block is adjusted. A loosening operation and a tightening operation must be performed, which causes a problem of poor workability. Further, if the tightening screw is forgotten to be tightened, there is a problem that the detection block moves and erroneous detection is performed.

  The present invention has been made in view of the above facts, and the main technical problem thereof is to reliably hold the detection block at the adjusted position by operating the adjustment rod to adjust the position of the detection block. Another object of the present invention is to provide a cutting blade detection mechanism of a cutting device that can be used.

In order to solve the above-mentioned main technical problem, according to the present invention, a guide block provided with a guide portion disposed on a blade cover covering the cutting blade and extending toward the center of the cutting blade, and the guide portion of the guide block And a detection block including a light-emitting body and a light-receiving body provided with a guided portion that is guided along the blade and having a blade intrusion portion into which the cutting blade of the cutting blade enters, An adjustment rod provided at one end with a male screw that is inserted into an adjustment rod insertion hole provided in the guide block and is screwed into a female screw hole provided in the detection block. Cutting blade detection mechanism of a cutting device configured to move the detection block along the guide portion of the guide block by rotating in one direction or the other direction Oite,
Friction locking means for frictionally locking the adjustment rod is disposed in the adjustment rod insertion hole provided in the guide block ,
The friction locking means is disposed in an adjustment rod insertion hole provided in the guide block, and is fitted into the adjustment rod insertion hole from both sides, and a friction ring that frictionally engages with the outer peripheral surface of the adjustment rod. The first sliding member and the second sliding member, the first sliding member and the second sliding member are arranged in a state of pressing the friction ring,
The adjustment rod is provided with a locking flange portion with which the first sliding member abuts, and an adjustment knob is attached to the other end portion, and the first knob is disposed between the locking flange portion and the adjustment knob. Holding the sliding member and the second sliding member while pressing the friction ring,
A cutting blade detection mechanism for a cutting apparatus is provided.

In the cutting blade detection mechanism of the cutting device according to the present invention, a friction locking means for frictionally locking the adjustment rod is disposed in the adjustment rod insertion hole provided in the guide block attached to the blade cover covering the cutting blade , The friction locking means is disposed in an adjustment rod insertion hole provided in the guide block, and a friction ring that frictionally engages with the outer peripheral surface of the adjustment rod; and a first that is fitted into the adjustment rod insertion hole from both sides. The sliding member and the second sliding member are arranged, the first sliding member and the second sliding member are arranged in a state where the friction ring is pressed, and the adjustment rod has the first sliding member. Is provided with an engaging flange at the other end, and an adjustment knob is mounted on the other end, and the first sliding member and the second sliding member are interposed between the engaging flange and the adjustment knob. Pressed And then, it is sandwiched state, the adjustment rod by vibration does not rotate. Therefore, by operating the adjustment rod to adjust the position of the detection block, the detection block can be reliably held at the adjusted position.

  Hereinafter, a preferred embodiment of a cutting blade detection mechanism of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a cutting apparatus equipped with a cutting blade detection mechanism constructed according to the present invention. A cutting device 1 shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. A chuck table 3 for holding a workpiece is disposed in the apparatus housing 2 so as to be movable in a cutting feed direction indicated by an arrow X. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a workpiece through a dicing tape. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  A cutting apparatus 1 shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is moved in the index feed direction indicated by the arrow Y in FIG. 1 (direction perpendicular to the cutting feed direction indicated by the arrow X) by the index feed means (not shown), and the arrow feed in FIG. It can be moved in the cutting feed direction indicated by Z (direction perpendicular to the holding surface of the chuck table 3). The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housing 41 is freely rotatable. And a cutting blade 43 attached to the front end of the rotating spindle 42. For example, as shown in FIG. 2, the cutting blade 43 has a disk-shaped base 431 formed of aluminum, and diamond abrasive grains are hardened by nickel plating on the outer peripheral side surface of the base 431 to a thickness of 15 to 30 μm. It consists of a formed annular cutting edge 432.

  Continuing with reference to FIG. 2, a blade cover 44 covering the upper half of the cutting blade 43 is attached to the front end of the spindle housing 41. The blade cover 44 includes a first cover member 441 mounted on the spindle housing 41 and a second cover member 442 mounted on the first cover member 441 in the illustrated embodiment. A female screw hole 441a and two positioning pins 441b are provided in the side surface of the first cover member 441, and an insertion hole 442a is provided in a position corresponding to the female screw hole 441a in the second cover member 442. It has been. Further, on the surface of the second cover member 442 facing the first cover member 441, two recesses (not shown) into which the two positioning pins 441b are fitted are formed. The first cover member 441 and the second cover member 442 configured in this way are provided with two recesses (not shown) formed in the second cover member 442 provided in the first cover member 441. The positioning is performed by fitting to the positioning pin 441b. Then, the fastening bolt 443 is inserted into the insertion hole 442a of the second cover member 442, and is screwed into the female screw hole 441a provided in the first cover member 441, whereby the second cover member 442 is engaged with the first cover member 442. The cover member 441 is attached.

  Cutting water supply pipes 451 and 452 are disposed on the first cover member 441 and the second cover member 442 constituting the blade cover 44, respectively. The cutting water supply pipes 451 and 452 are respectively provided at the lower ends of the cutting blade 43 on both sides of the annular cutting edge 432, and the cutting water sprays the cutting water toward both side surfaces of the annular cutting edge 432. Supply nozzles 461 and 462 are connected. The cutting water supply pipes 451 and 452 are connected to a cutting water supply means (not shown).

  The first cover member 441 constituting the blade cover 44 of the spindle unit 4 in the illustrated embodiment has a cutting blade detection mechanism 5 for detecting wear or chipping of the annular cutting edge 432 of the cutting blade 43. It is arranged. The cutting blade detection mechanism 5 will be described with reference to FIGS. The cutting blade detection mechanism 5 in the illustrated embodiment is arranged along a guide block 51 attached to the first cover member 441 and a later-described guide portion provided on the guide block 51 as shown in FIGS. 3 and 6. The detection block 52 is movably disposed, and the adjusting unit 53 adjusts the movement of the detection block 52 along a guide portion of the guide block 51 which will be described later.

  The guide block 51 is made of a metal material such as stainless steel or aluminum, and includes a guide portion 511, an adjustment portion 512, and an attachment portion 513 as shown in FIG. The guide portion 511 has a flat guide surface 511a, and the guide surface 511a is provided with a guide groove 511b extending toward the center of the cutting blade 43 when the guide block 51 shown in FIG. 2 is attached. It has been. The adjustment portion 512 is provided on the upper side of the guide portion 511 so as to protrude from the guide surface 511a of the guide portion 511 in the attached state of the guide block 51 shown in FIG. The adjustment portion 512 is provided with an adjustment rod insertion hole 512a in parallel with the guide groove 511b provided on the guide surface 511a of the guide portion 511, and optical fibers to be described later are provided on both sides of the adjustment rod insertion hole 512a. Two optical fiber insertion holes 512b and 512c to be inserted are provided. The attachment portion 513 is formed so as to protrude from the upper end portion of the adjustment portion 512 in the attachment state of the guide block 51 shown in FIG. 2, and a bolt insertion hole 513a is formed in the attachment portion 513. The guide block 51 configured as described above is inserted into the bolt insertion hole 513a formed in the attachment portion 513 with the fastening bolt 54 and screwed into a female screw hole (not shown) provided in the first cover member 441. Accordingly, the first cover member 441 is attached as shown in FIG.

  The detection block 52 is made of a metal material such as stainless steel or aluminum, and includes a support portion 521 and a detection portion 522. As shown in FIG. 3B, the support portion 521 is formed with a guided rail 521b that fits into a guide groove 511b provided in the guide portion 511 of the guide block 51 on the guided surface 521a. The support portion 521 is provided with a female screw hole 521c. The detection unit 522 includes a light emitter attachment part 522a and a light receiver attachment part 522b that protrude at a predetermined interval from the lower end of the support part 521 in the attachment state illustrated in FIG. A blade intrusion portion 523 into which the annular cutting edge 432 of the cutting blade 43 intrudes is formed between the light receiving body attachment portion 522b. The light emitter 55a and the light receiver 55b are attached to the light emitter attachment portion 522a and the light receiver attachment portion 522b of the detection unit 522 thus configured so as to face each other. As shown in FIG. 5, optical fibers 56a and 56b are connected to the light emitter 55a and the light receiver 55b, respectively, and the optical fibers 56a and 56b are optical fiber insertion holes provided in the adjusting portion 512 of the guide block 51, respectively. 512b and 512c are inserted and connected to a control means (not shown). In this specification, the light emitter includes a light emitting portion of an optical fiber connected to a light emitting element such as a light emitting diode, and the light receiver includes a light receiving portion of an optical fiber connected to a light receiving element such as a photodiode.

  The adjusting means 53 includes an adjusting rod 531, an adjusting knob 532, and a fastening pin 533 as shown in FIG. The adjustment rod 531 is provided with a male screw 531a that is screwed into a female screw hole 521c formed in the support portion 521 of the detection block 52 at one end. Further, the adjustment rod 531 is provided with a support flange 531b at an intermediate portion and a pin insertion hole 531c at the other end. The adjustment knob 532 is provided with a through hole 532a fitted to the other end of the adjustment rod 531, and a pin insertion hole 532b orthogonal to the through hole 532a. This adjustment knob 532 has a through hole 532 a fitted into the other end portion of the adjustment rod 531, and the fastening pin 533 is inserted into the pin insertion hole 532 b and the pin insertion hole 531 c provided in the other end portion of the adjustment rod 531. Thus, the adjustment rod 531 is attached.

  The adjusting rod 531 described above is disposed in the adjusting rod insertion hole 512 a provided in the adjusting portion 512 of the guide block 51 via the friction locking means 57. As shown in FIG. 3A and FIG. 6, the friction locking means 57 includes a friction ring 571, a first sliding member 572 disposed below the friction ring 571, and the friction ring 571. It consists of a second sliding member 573 disposed on the upper side. The friction ring 571 is formed in an annular shape by an elastic member such as fluorine rubber, and the inner diameter thereof is formed to be slightly smaller than the outer diameter of the other end portion of the adjustment rod 531, and the outer diameter is the adjustment rod insertion hole. It is formed with substantially the same diameter as 512a. Accordingly, when the friction ring 571 is fitted to the other end of the adjustment rod 531, the friction ring 571 is frictionally engaged with the outer peripheral surface of the adjustment rod 531, and when fitted to the adjustment rod insertion hole 512a, the friction ring 571 is frictionally engaged with the inner peripheral surface of the adjustment rod insertion hole 512a. Engage. The first sliding member 572 and the second sliding member 573 are each formed of a synthetic resin having a low friction coefficient such as polyacetal, and fitting portions 572a and 573a that fit into the adjustment rod insertion hole 512a. And engaging flange portions 572b and 573b formed at one end of the fitting portions 572a and 573a and having an outer diameter larger than the inner diameter of the adjusting rod insertion hole 512a. The first sliding member 572 and the second sliding member 573 formed in this way are provided with insertion holes 572c and 573c through which the adjustment rod 531 is inserted, respectively. The sum of the thickness of the friction ring 571 and the lengths of the fitting portions 572a and 573a of the first sliding member 572 and the second sliding member 573 is slightly larger than the thickness of the adjusting portion 512 of the guide block 51. Dimension is formed.

  The adjustment rod 531 having one end screwed into the female screw hole 521c formed in the support portion 521 of the detection block 52 described above is frictionally engaged with the adjustment rod insertion hole 512a provided in the adjustment portion 512 of the guide block 51. The procedure of disposing via the stopping means 57 will be described with reference to FIG. First, the first sliding member 572 is fitted from the other end of the adjustment rod 531, the locking flange portion 752b is brought into contact with the support flange 531b, and the friction ring 571 is fitted from the other end of the adjustment rod 531. Install. Next, the friction ring 571 and the locking flange portion 752b attached to the adjustment rod 531 are inserted and fitted from below into the adjustment rod insertion hole 512a provided in the adjustment portion 512 of the guide block 51. Then, the second sliding member 573 is inserted and fitted into the adjustment rod insertion hole 512a provided in the adjustment portion 512 of the guide block 51 from above. Next, the through hole 532 a of the adjustment knob 532 is fitted from the other end of the adjustment rod 531, and the pin insertion hole 532 b provided in the adjustment knob 532 and the pin insertion hole 531 c provided in the other end of the adjustment rod 531. A fastening pin 533 such as a split pin is inserted through the pin. The distance between the upper surface of the support flange 531b provided on the adjustment rod 531 and the lower surface of the adjustment knob 532 attached to the adjustment rod 531 by the fastening pin 533 is determined by the thickness of the friction ring 571 and the first sliding member. It is formed in a dimension smaller than the sum of the lengths of 572 and the second sliding member 573. As described above, the sum of the thickness of the friction ring 571 and the lengths of the fitting portions 572a and 573a of the first sliding member 572 and the second sliding member 573 is greater than the thickness of the adjusting portion 512 of the guide block 51. Since it is formed in a slightly larger dimension, the friction ring 571 is slightly compressed by attaching the adjustment knob 532 to the adjustment rod 531. Therefore, the frictional force between the inner peripheral surface of the friction ring 571 and the outer peripheral surface of the adjustment rod 531 increases. For this reason, the adjustment rod 531 does not rotate due to vibration or the like.

The cutting blade detection mechanism 5 in the illustrated embodiment is configured as described above, and the operation thereof will be described below with reference to FIG.
In the state where the cutting blade 43 is rotating, light is irradiated from the light emitter 55a toward the light receiver 55b. Then, the light received by the light receiver 55b is sent to control means (not shown). The control means (not shown) indicates that the annular cutting edge 432 of the cutting blade 43 has reached the use limit based on the amount of light transmitted from the photoreceptor 55b, or the annular cutting edge 432 of the cutting blade 43 is missing. Whether or not has occurred is determined. Then, when the annular cutting edge 432 of the cutting blade 43 reaches the use limit or when the annular cutting edge 432 of the cutting blade 43 is chipped, the cutting blade 43 is replaced. When the cutting blade 43 is replaced in this way, the annular cutting edge of the cutting blade 43 in which the positions of the detection block 52 in which the light emitter 55a and the light receiver 55b of the cutting blade detection mechanism 5 are disposed is replaced. Adjust to the optimal position with respect to 432. This adjustment can be performed by rotating the adjustment knob 532 in one direction or the other direction and rotating the adjustment rod 531 in one direction or the other direction. That is, when the adjustment rod 531 rotates in one direction or the other direction, the detection block 52 into which the male screw 531a formed at one end of the adjustment rod 531 is screwed is provided in the guide portion 511 of the guide block 51. It is moved upward or downward along the guide groove 511b. Then, when the light emitter 55a and the light receiver 55b disposed in the detection block 52 reach proper alignment, the adjustment rod 531 stops rotating. When the rotation of the adjusting rod 531 is stopped, the adjusting rod 531 is frictionally engaged with the inner peripheral surface of the friction ring 571 as described above, so that the adjusting rod 531 does not rotate due to vibration or the like. When the adjustment knob 532 is rotated to rotate the adjustment rod 531, the lower surface of the adjustment knob 532, the locking flange portion 573 b, the support flange 531 b of the adjustment rod 531, and the first sliding member 572 are engaged. Although the stop flange portion 752b is in contact, the first sliding member 572 and the second sliding member 573 are made of a synthetic resin having a low friction coefficient such as polyacetal, and therefore do not have a large frictional resistance.

  Referring back to FIG. 1, the description will be continued. The cutting device 1 captures an image of the surface of the workpiece held on the chuck table 3 and detects an area to be cut by the cutting blade 43. It has. The imaging means 11 is composed of optical means such as a microscope and a CCD camera. Further, the cutting apparatus 1 includes a display unit 12 that displays an image captured by the imaging unit 11.

  In the cassette mounting area 13a of the apparatus housing 2, a cassette mounting table 13 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 13 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 13, a cassette 14 that houses the semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 14 has a grid-like street formed on the surface, and devices such as ICs and LSIs are formed in a plurality of rectangular regions partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 14 with the back surface adhered to the front surface of the dicing tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer 10 accommodated in a cassette 14 placed on a cassette placement table 13 (a state in which the wafer is supported on an annular frame F via a dicing tape T). The unloading / loading means 16 for unloading the semiconductor wafer 10 to the temporary table 15, the first transport means 17 for transporting the semiconductor wafer 10 unloaded to the temporary table 15 onto the chuck table 3, and cutting on the chuck table 3. A cleaning means 18 for cleaning the semiconductor wafer 10 is provided, and a second transport means 19 for transporting the semiconductor wafer 10 cut on the chuck table 3 to the cleaning means 18 is provided.

Next, a cutting operation for cutting the semiconductor wafer 10 along a predetermined street using the above-described cutting apparatus 1 will be described.
The semiconductor wafer 10 (supported by the annular frame F via the dicing tape T) accommodated in a predetermined position of the cassette 14 placed on the cassette placing table 13 is moved by the lifting means (not shown). The placement table 13 is positioned at the carry-out position by moving up and down. Next, the carry-out / carry-in means 16 moves forward and backward to carry the semiconductor wafer 10 positioned at the carry-out position onto the temporary placement table 15. The semiconductor wafer 10 transported to the temporary placement table 15 is transported onto the chuck table 3 by the turning motion of the first transport means 17.

  When the semiconductor wafer 10 is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer 10 on the chuck table 3. An annular frame F that supports the semiconductor wafer 10 via the dicing tape T is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer 10 is moved to a position directly below the imaging means 11. When the chuck table 3 is positioned immediately below the image pickup means 11, the street formed on the semiconductor wafer 10 is detected by the image pickup means 11, and the spindle unit 4 is moved and adjusted in the arrow Y direction as the indexing direction to cut the street and cut. A precision alignment operation with the blade 43 is performed.

  Thereafter, the chuck table 3 is moved to a cutting region below the cutting blade 43, the cutting blade 43 is rotated in a predetermined direction, and a predetermined amount is cut and fed in the direction indicated by the arrow Z. Position it at the position where it reaches the dicing tape T. Then, the chuck table 3 holding the semiconductor wafer 10 by suction is moved at a predetermined cutting feed speed in a direction indicated by an arrow X which is a cutting feed direction. As a result, the semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined street by the cutting blade 43 (cutting process). When performing this cutting process, cutting water is sprayed from the cutting water supply nozzle 462 toward the side surface of the cutting blade 43.

  When the semiconductor wafer 10 is cut along a predetermined street as described above, the spindle unit 4 is indexed and fed in the direction indicated by the arrow Y in FIG. 1 to perform the cutting process. When the cutting process is performed along all the streets extending in the predetermined direction of the semiconductor wafer 10, the chuck table 3 is rotated 90 degrees to extend in a direction orthogonal to the predetermined direction of the semiconductor wafer 10. By performing the cutting process along the streets, all the streets formed in a lattice shape on the semiconductor wafer 10 are cut and divided into individual devices. The divided individual devices are not separated by the action of the dicing tape T, and the state of the wafer supported by the annular frame F is maintained.

  As described above, when the cutting process is completed along the street of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first returned to the position where the semiconductor wafer 10 is sucked and held. Then, the suction holding of the semiconductor wafer 10 is released. Next, the semiconductor wafer 10 is transferred to the cleaning unit 18 by the second transfer unit 19. The semiconductor wafer 10 conveyed to the cleaning means 18 is cleaned here. The semiconductor wafer 10 thus cleaned is transported to the temporary table 15 by the first transport means 17 after drying. Then, the semiconductor wafer 10 is stored in a predetermined position of the cassette 14 by the unloading / loading means 16.

  The cutting blade detection mechanism 5 is also operating during the cutting process described above, and the annular cutting edge 432 of the cutting blade 43 has reached the use limit as described above, or the cutting blade 43 It is detected whether or not the annular cutting edge 432 is chipped. Then, when the annular cutting edge 432 of the cutting blade 43 reaches the use limit or when the annular cutting edge 432 of the cutting blade 43 is chipped, the cutting blade 43 is replaced. When the cutting blade 43 is replaced in this way, the position of the detection block 52 where the light emitter 55a and the light receiver 55b are disposed by rotating the adjustment knob 532 of the cutting blade detection mechanism 5 as described above. The replaced cutting blade 43 is adjusted to an optimum position with respect to the annular cutting edge 432.

The perspective view of the cutting device equipped with the cutting blade detection mechanism comprised according to this invention. The principal part perspective view of the spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. The perspective view which decomposes | disassembles and shows the cutting blade detection mechanism comprised according to this invention. The perspective view which shows the assembled state of the cutting blade detection mechanism comprised according to this invention. Explanatory drawing which shows the relationship between the cutting blade with which the cutting apparatus shown in FIG. 1 is equipped, and the cutting blade detection mechanism comprised according to this invention. Sectional drawing of the cutting blade detection mechanism comprised according to this invention.

1: Cutting device 2: Device housing 3: Chuck table 4: Spindle unit 41: Rotating spindle 43: Cutting blade 44: Blade cover 461, 462: Cutting water supply nozzle 5: Cutting blade detection mechanism 51: Guide block 52: Detection block 55a: luminous body 55b: light receiving body 53: adjustment means 531: adjustment rod 532: adjustment knob 533: fastening pin 57: friction locking means 571: friction ring 572: first sliding member 573: second sliding member DESCRIPTION OF SYMBOLS 10: Semiconductor wafer 11: Imaging means 12: Display means 13: Cassette mounting table 14: Cassette 15: Temporary placing table 16: Unloading / carrying means 17: 1st conveyance means 18: Cleaning means 19: 2nd conveyance means

Claims (1)

A guide block provided with a guide portion disposed on a blade cover covering the cutting blade and extending toward the center of the cutting blade, and a guided portion guided along the guide portion of the guide block, and the cutting blade A detection block having a light-emitting body and a light-receiving body that has a blade intrusion portion into which the cutting blade enters and is opposed to the blade intrusion portion, and is inserted into an adjustment rod insertion hole provided in the guide block The adjustment block is provided with a male screw at one end that is screwed into a female screw hole provided in the detection block, and the detection block is rotated by rotating the adjustment rod in one direction or the other direction. In a cutting blade detection mechanism of a cutting device configured to move along the guide portion of the guide block,
Friction locking means for frictionally locking the adjustment rod is disposed in the adjustment rod insertion hole provided in the guide block ,
The friction locking means is disposed in an adjustment rod insertion hole provided in the guide block, and is fitted into the adjustment rod insertion hole from both sides, and a friction ring that frictionally engages with the outer peripheral surface of the adjustment rod. The first sliding member and the second sliding member, the first sliding member and the second sliding member are arranged in a state of pressing the friction ring,
The adjustment rod is provided with a locking flange portion with which the first sliding member abuts, and an adjustment knob is attached to the other end portion, and the first knob is disposed between the locking flange portion and the adjustment knob. Holding the sliding member and the second sliding member while pressing the friction ring,
A cutting blade detection mechanism for a cutting apparatus.

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