JP5268953B2 - 研磨材成形体 - Google Patents
研磨材成形体 Download PDFInfo
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- JP5268953B2 JP5268953B2 JP2009554120A JP2009554120A JP5268953B2 JP 5268953 B2 JP5268953 B2 JP 5268953B2 JP 2009554120 A JP2009554120 A JP 2009554120A JP 2009554120 A JP2009554120 A JP 2009554120A JP 5268953 B2 JP5268953 B2 JP 5268953B2
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- pcd
- polycrystalline diamond
- tspcd
- die
- abrasive compact
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/65—Reaction sintering of free metal- or free silicon-containing compositions
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3817—Carbides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3817—Carbides
- C04B2235/3826—Silicon carbides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3856—Carbonitrides, e.g. titanium carbonitride, zirconium carbonitride
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3873—Silicon nitrides, e.g. silicon carbonitride, silicon oxynitride
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/422—Carbon
- C04B2235/427—Diamond
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2204/00—End product comprising different layers, coatings or parts of cermet
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
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- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Carbon And Carbon Compounds (AREA)
- Powder Metallurgy (AREA)
- Earth Drilling (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
・非金属の触媒/溶媒で焼結されたPCD
・浸出させたPCD、及び
・焼結されたセラミックマトリックス中のダイヤモンド粒子、特に、ケイ素ベースのセラミックマトリックス中のダイヤモンド
等の、様々な材料種から選択され得る(しかしそれらに限定されるものではない)。
・例えば、アルカリ金属又はアルカリ土類金属の炭酸塩、硫酸塩又は水酸化物塩等の、非金属の触媒/溶媒の存在下で焼結されたPCD
・浸出させたPCD、すなわち、金属相が、いくつかの種類の物理化学的処理により次いで大部分除去された、標準的な金属の触媒/溶媒を用いて生成されるPCD材料、及び
・セラミックマトリックスが、酸化物、窒化物、炭化物、及びそれらの任意の組合せであり得る、焼結されたセラミックマトリックス中のダイヤモンド粒子
等の、様々な材料の種類から選択され得る(しかしそれらに限定されるものではない)。
浸潤させ、ダイヤモンド粒と反応させるための元素ケイ素を用いて従来の熱安定性のPCD成形体を製造して、高圧及び高温の条件下でSiC−ダイヤモンド成形体を製造した。この場合におけるダイヤモンド粒は、約20μm大であった。この成形体は、炭化物の基材により支持されていなかった。次いで、焼結された本体は、破砕及び粉砕されて、凝集した又は焼結されたTSPCDの微粒子又は顆粒を生成した。次いで、これらの微粒子又は顆粒を篩いにかけて、所望の大きさ、すなわち50から150μmの間の予備焼結した粒子又は顆粒を得た。
実施例1と同様に、TSPCDの微粒子又は顆粒を、約6μm大のダイヤモンド粒により調製し、30から100μmの間の所望の大きさに篩った。
Claims (14)
- 結合したダイヤモンド粒子の第1の多結晶ダイヤモンド(PCD)材料と、前記第1のPCD材料の至るところに散在するか又は前記第1のPCD材料の所定の領域に散在する第2のPCD材料とを含み、前記第2のPCD材料が、熱安定性多結晶ダイヤモンド(TSPCD)材料の微粒子又は顆粒を含み、前記TSPCDの微粒子又は顆粒の大きさが、1から500μmの間の範囲内であることを特徴とする多結晶ダイヤモンド研磨材成形体。
- 前記第2のPCD材料のTSPCDの微粒子又は顆粒が、前記第1のPCD材料の内部又は前記第1のPCD材料の所定の領域の内部に一様又は均一に分散されている、請求項1に記載の多結晶ダイヤモンド研磨材成形体。
- TSPCDの微粒子又は顆粒の大きさが、5から250μmの間の範囲内である、請求項1又は2に記載の多結晶ダイヤモンド研磨材成形体。
- TSPCDの微粒子又は顆粒中の粒径分布が多峰性である、請求項1から3までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- 予備焼結されたTSPCDの質量パーセントが、2%から50質量%の間の範囲内である、請求項1から4までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- 予備焼結されたTSPCDの質量パーセントが、10%から40質量%の間の範囲内である、請求項1から5までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- TSPCDの微粒子又は顆粒が、非金属の触媒/溶媒で焼結されたPCD、浸出させたPCD、若しくは焼結されたセラミックマトリックス中のダイヤモンド粒子、又はそれらの組合せを含む、請求項1から6までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- 非金属の触媒/溶媒が、アルカリ金属又はアルカリ土類金属の炭酸塩、硫酸塩又は水酸化物塩を含む、請求項7に記載の多結晶ダイヤモンド研磨材成形体。
- 焼結されたセラミックマトリックスが、酸化物、窒化物、炭化物、若しくはケイ素ベースのセラミック、又はそれらの組合せを含む、請求項7に記載の多結晶ダイヤモンド研磨材成形体。
- ケイ素ベースのセラミックが、炭化ケイ素、窒化ケイ素、サイアロン、又はケイ素、炭素、窒素、アルミニウム、チタン及び酸素の組合せにより形成される材料を含む、請求項9に記載の多結晶ダイヤモンド研磨材成形体。
- 第1のPCDの平均ダイヤモンド粒径が、50μm以下である、請求項1から10までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- 第1のPCDの平均ダイヤモンド粒径が、25μm以下である、請求項1から11までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- 多結晶ダイヤモンド研磨材成形体が、超硬合金の支持体又は基材に結合している、請求項1から12までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体。
- 請求項1から13までのいずれか一項に記載の多結晶ダイヤモンド研磨材成形体を含む、基材の切削若しくは研磨に適した、又は掘削用途の、研磨材の切削要素。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ZA200702386 | 2007-03-22 | ||
PCT/IB2008/051058 WO2008114228A1 (en) | 2007-03-22 | 2008-03-20 | Abrasive compacts |
Publications (2)
Publication Number | Publication Date |
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JP2011515306A JP2011515306A (ja) | 2011-05-19 |
JP5268953B2 true JP5268953B2 (ja) | 2013-08-21 |
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ID=39511285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009554120A Expired - Fee Related JP5268953B2 (ja) | 2007-03-22 | 2008-03-20 | 研磨材成形体 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20100275523A1 (ja) |
EP (1) | EP2132348B1 (ja) |
JP (1) | JP5268953B2 (ja) |
KR (1) | KR20100015759A (ja) |
CN (1) | CN101617060B (ja) |
AT (1) | ATE510036T1 (ja) |
CA (1) | CA2673467A1 (ja) |
PL (1) | PL2132348T3 (ja) |
WO (1) | WO2008114228A1 (ja) |
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EP2049697A2 (en) * | 2006-07-28 | 2009-04-22 | Element Six (Production) (Pty) Ltd. | Abrasive compacts |
-
2008
- 2008-03-20 EP EP08719781A patent/EP2132348B1/en active Active
- 2008-03-20 KR KR1020097021963A patent/KR20100015759A/ko not_active Application Discontinuation
- 2008-03-20 CA CA002673467A patent/CA2673467A1/en not_active Abandoned
- 2008-03-20 JP JP2009554120A patent/JP5268953B2/ja not_active Expired - Fee Related
- 2008-03-20 US US12/525,945 patent/US20100275523A1/en not_active Abandoned
- 2008-03-20 AT AT08719781T patent/ATE510036T1/de not_active IP Right Cessation
- 2008-03-20 PL PL08719781T patent/PL2132348T3/pl unknown
- 2008-03-20 CN CN2008800053868A patent/CN101617060B/zh active Active
- 2008-03-20 WO PCT/IB2008/051058 patent/WO2008114228A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2008114228A1 (en) | 2008-09-25 |
US20100275523A1 (en) | 2010-11-04 |
EP2132348B1 (en) | 2011-05-18 |
CN101617060B (zh) | 2013-07-03 |
CN101617060A (zh) | 2009-12-30 |
EP2132348A1 (en) | 2009-12-16 |
ATE510036T1 (de) | 2011-06-15 |
JP2011515306A (ja) | 2011-05-19 |
KR20100015759A (ko) | 2010-02-12 |
PL2132348T3 (pl) | 2011-10-31 |
CA2673467A1 (en) | 2008-09-25 |
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