JP5219290B2 - Electronic device having a ground terminal - Google Patents

Description

  The present invention relates to an electronic device, and more particularly to an electronic device such as an inverter device having a ground terminal.

  In recent years, operations required for electric devices such as motors and compressors have been advanced, and accordingly, a configuration in which the electric device is driven via an electronic device such as an inverter device has been proposed. In such a configuration, the electronic device includes not only a semiconductor element such as a transistor and a controller that controls the operation of the semiconductor element, but also an input / output terminal for the semiconductor element and a relay terminal that communicates the semiconductor element and the controller.

  In such a configuration, a configuration is employed in which a semiconductor element such as a transistor is mounted on the lower substrate fixed to the lower side of the case, and a controller that controls the operation of the semiconductor element is mounted on the upper substrate fixed to the upper side of the case. There is a case.

  Specifically, in Patent Document 1, control for controlling the power switching semiconductor element 4 by accommodating the power insulating substrate 3 on which the power switching semiconductor element 4 is mounted on the front main surface is accommodated below the case 1. Electromagnetic shielding integrally formed on the back main surface of the control board 7 in the power module in which the control board 7 on which the control component 8 such as the semiconductor element is mounted on the front main surface is placed on the upper side of the case 1 A configuration in which a conductive connector 15 that supports the control substrate 7 while electrically connecting the plate 9 and the conductive base plate 2 having an outer peripheral edge fixed to the lower end of the case 1 is disclosed. Here, the lower main surface of the conductive base plate 2 is attached to a grounded heat sink 14.

JP 2002-076257 A

  However, in the configuration provided with the electromagnetic shielding plate 9 and the conductive connector 15 proposed in Patent Document 1, the electromagnetic wave emitted from the power switching semiconductor element 4 mounted on the power insulating substrate 3 is used for control. The purpose is to shield the control component 8 mounted on the substrate 7 from reaching the control component 8, and the configuration for grounding the control component 8 mounted on the control substrate 7 is disclosed. No.

  Further, in such a configuration, since the conductive connection body 15 is insert-molded in the case 1, not only the number of parts to be integrally molded in the case 1 is increased, but the configuration tends to be complicated and cost increases. .

  Further, in such a configuration, since heat expansion occurs in the conductive connecting body 15 during insert molding, when the length of the conductive connecting body 15 is increased to some extent, the control substrate 7 and the electromagnetic shielding plate 9 are It tends to be difficult to manage the position accuracy.

  Further, in this configuration, the conductive connector 15 is connected to the electromagnetic shielding plate 9 integrally formed on the back main surface of the control board 7 with a fastening member such as a bolt. It is necessary to form a wiring pattern for ground on the 7 itself, and the configuration of the control substrate 7 tends to be complicated.

  Further, according to the study of the present inventor, when a metal collar is arranged around a fastening member such as a bolt for fixing the case 1 to the heat sink 14 and the fastening member is tightened, the collar is electrically conductive. Although it is conceivable to connect the sexually connected body 15, not only the number of parts increases but also the configuration tends to be complicated and the cost tends to increase.

  The present invention has been made in view of such circumstances, and an electronic device having a ground terminal that can be grounded from a control board with a simple configuration without adopting a complicated configuration such as insert molding or bolting. The purpose is to provide.

In order to achieve the above object, the present invention provides an electronic device comprising a metal substrate on which a power semiconductor element is mounted, and a control substrate disposed above the metal substrate, the metal substrate and the control substrate. The metal substrate further includes a metal base layer and an insulating layer provided thereon, and the ground terminal is mounted on the control substrate and connected to a ground potential. electrically connecting between the control board and the pre-Kikin Shokumoto material layers, together provide the ground potential to the control board, the ends of the metal substrate in the ground terminal, the metal A first feature is that the taper has a tapered shape on the substrate side, and the end on the metal substrate side penetrates the insulating layer and bites into the metal base layer .

According to the present invention, in addition to the first feature, the metal substrate and the control substrate are provided in a case, and an insertion hole is formed between the metal substrate and the control substrate. The ground terminal is configured to receive a pressing force applied from the case when the case is fastened to the support that gives the ground potential. in, it is inserted while being press-fitted into the insertion hole of the insertion portion, a second feature that extends between the control board and the metal substrate.

According to the present invention, in addition to the first or second feature, the ground terminal has a flange portion, and the flange portion abuts and holds the surface-mounted component mounted on the metal substrate. The third feature.

According to the first feature of the present invention, the metal base layer and the insulating layer provided thereon are connected, and the ground terminal is connected to the ground potential while extending between the metal substrate and the control substrate. By connecting the metal base layer of the metal substrate and the control substrate electrically and applying a ground potential to the control substrate, it is easy to adopt without complicated structures such as insert molding and bolting. With the configuration, an electronic device having a ground terminal that can be grounded from the control board can be provided. At this time, the taper-shaped end portion that tapers on the metal substrate side in the ground terminal penetrates the insulating layer in the metal substrate and connects to the metal substrate layer, thereby connecting to the metal substrate layer in the ground terminal. The state can be made stronger.

According to the second feature of the present invention, when the case is fastened to the support body that provides the ground potential, the ground terminal can freely receive the pressing force applied from the case into the insertion hole of the insertion portion. By being inserted while being pressed in, the ground terminal can be pressed against the metal base material layer when the ground terminal is fixed, and the connection state to the metal base material layer at the ground terminal can be made more reliable. it can.

According to the third feature of the present invention, since the flange portion of the ground terminal is in contact with and held by the surface mounting component mounted on the metal substrate, the mounting state of the surface mounting component can be ensured. .

1 is a perspective view of an electronic device having a ground terminal according to a first embodiment of the present invention. It is a partial top view which shows the electronic device which has a ground terminal of this embodiment, and is the partial arrow line view seen from the Z direction of FIG. It is a partial expanded sectional view which shows the electronic device which has a ground terminal of this embodiment, and is equivalent to AA sectional drawing of FIG. It is a partial expanded sectional view which shows the modification of the ground terminal in the electronic device of this embodiment, and corresponds to FIG. 3 in position. It is a partial expanded sectional view which shows the electronic device which has a ground terminal of the 2nd Embodiment of this invention, and is sectional drawing equivalent to FIG.

  Hereinafter, an electronic device having a ground terminal in each embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the figure, the x-axis, y-axis, and z-axis form a three-axis orthogonal coordinate system, the x-axis direction and the y-axis direction are horizontal directions, and the z-axis direction is the vertical direction.

(First embodiment)
First, an electronic device having a ground terminal according to the first embodiment of the present invention will be described in detail with reference to FIGS.

    FIG. 1 is a perspective view of an electronic device having a ground terminal according to the present embodiment. FIG. 2 is a partial top view showing the electronic device having the ground terminal of the present embodiment, and is a partial arrow view seen from the Z direction of FIG. FIG. 3 is a partial enlarged cross-sectional view showing an electronic device having a ground terminal according to this embodiment, and corresponds to a cross-sectional view taken along line AA in FIG.

  As shown in FIGS. 1 to 3, in the electronic device 1 such as an inverter device in the present embodiment, a control board 20 is placed on a resin case 10 and a metal board 30 is accommodated in the case 10. Have a configuration.

  Specifically, the case 10 has a rectangular cylindrical shape surrounded by a wall portion 10a, and fixed portions 10c each having a flat surface in which insertion holes 10b are formed are provided at four corners of the wall portion 10a. In addition, a fastening member 40 such as a bolt is inserted into the insertion hole 10b of each fixing portion 10c, and the fastening member 40 is fastened to the fastening hole 50a of the support 50, whereby the case 10 is mounted on the support 50. It is fixed in the state where it was mounted on. The support 50 is made of metal such as aluminum and is at a ground potential.

  The control board 20 is typically a glass epoxy board, and is mounted and fixed on the case 10 in a state where electronic parts such as a controller, a driver IC, and a power supply regulator are mounted. The control board 20 is formed with an insertion hole 20a extending in the vertical direction and penetrating therethrough, and a ground connection portion in the control board 20 is provided around the insertion hole 20a.

  The metal substrate 30 has a two-layer structure in which an insulating layer 30b made of resin is laminated on a metal base layer 30a made of metal such as aluminum. Further, the insulating layer 30b of the metal substrate 30 is formed with an insertion hole 30c extending in the vertical direction and penetrating therethrough, and the upper surface of the metal base layer 30a is exposed at the portion of the insertion hole 30c.

On the metal substrate 30, terminals such as an input terminal 60, an output terminal 70, and a relay terminal 80 are mounted in addition to a power semiconductor element such as an insulated gate bipolar transistor. The metal substrate 30 is housed and fixed in the case 10 in such a mounted state, and the lower surface of the metal base layer 30a is in contact with the upper surface of the metal support 50. Here, the input terminal 60 has two terminals of a P terminal and an N terminal connected to a DC input power source through a smoothing capacitor that stabilizes the operation of the power semiconductor element, and the output terminal 70 is a power semiconductor element. The three-phase AC U-phase terminal 70U, V-phase terminal 70V, and W-phase terminal 70W are applied to a load such as a motor or a compressor. The relay terminal 80 has a plurality of terminals that are fixed on the control board 20 and connected to a controller that controls the operation of the power semiconductor element. For convenience of explanation, the ground connection portion, the power semiconductor element, the smoothing capacitor, the input power supply, the load such as the motor and the compressor, and the electronic components such as the controller are omitted from the illustration.

  Now, in a part of the wall portion 10a of the case 10, a protruding portion 10d that protrudes the wall portion 10a inward is provided. The protruding portion 10d is an insertion portion through which the ground terminal 90 is inserted while penetrating in the vertical direction.

  More specifically, as shown in FIG. 3 in particular, the protruding portion 10d has an insertion hole 10e penetrating in the vertical direction, and the bottom surface 10f of the protruding portion 10d is in contact with the upper surface of the insulating layer 30b of the metal substrate 30. Unnecessary vibration of the metal substrate 30 is suppressed. The ground terminal 90 is a conductive terminal made of metal or the like extending in the vertical direction, and an upper portion thereof is inserted into an insertion hole 20 a formed in the control board 20 placed on the case 10. Thus, it protrudes above the control board 20 while being connected to the ground connection portion of the control board 20 provided around the insertion hole 20a via solder or the like. On the other hand, the lower portion of the ground terminal 90 passes through the insertion hole 10e formed in the protruding portion 10d of the wall portion 10a of the case 10 and is positioned with respect to the control board 20 and the metal board 30 fixed to the case 10. At the same time, it is also inserted into the insertion hole 30c formed in the insulating layer 30b of the metal substrate 30, and is in contact with the upper surface of the metal base layer 30a exposed in the insertion hole 30c.

  Here, when the ground terminal 90 inserts the fastening member 40 into the insertion hole 10 b of each fixing portion 10 c in the case 10 and fastens the fastening member 40 to the fastening hole 50 a of the support body 50, the case 10 That is, the pressing force applied from the projecting portion 10d provided thereon is set to be freely received. In order for the ground terminal 90 to receive such a pressing force, the ground terminal 90 only needs to be gripped by the insertion hole 10e formed in the protruding portion 10d so as to exhibit a desired drag force. For example, the ground terminal 90 is press-fitted into the insertion hole 10e. It only has to be inserted. Note that the insertion hole 20a formed in the control substrate 20 and the insertion hole 30c formed in the insulating layer 30b of the metal substrate 30 are in contrast to the insertion hole 10e formed in the protruding portion 10d of the wall portion 10a of the case 10. The case 10 has a radial tolerance as needed considering the mounting tolerance of the control board 20 and the metal board 30 in the case 10.

  A ground terminal of an electronic component such as a controller mounted on the control board 20 is connected to a ground connection portion provided around the insertion hole 20a of the control board 20 and connected to the ground terminal 90. On the other hand, the lower surface of the metal base layer 30a with which the lower end portion 90a of the ground terminal 90 contacts through the insertion hole 30c formed in the insulating layer 30b of the metal substrate 30 is pressed against the upper surface of the metal support 50. Touching.

  Therefore, the ground terminal of the electronic component such as a controller mounted on the control board 20 is sequentially passed through the ground connection portion of the control board 20, the ground terminal 90, the metal base layer 30a of the metal board 30, and the support 50. It will be connected to ground potential.

Hereinafter, a method of assembling and fixing the electronic device 1 having such a configuration to the support 50 will be described in detail.

  First, electronic components such as a controller are mounted on the control substrate 20, and power semiconductor elements such as insulated gate bipolar transistors and terminals such as the input terminal 60 are mounted on the metal substrate 30.

  Next, in the mounted state of the control board 20 and the metal board 30 on which such various components are mounted, the metal board 30 is housed and fixed in the lower part of the case 10 and the control board 20 is placed on the upper part of the case 10. And fix.

  Next, in a state where the control board 20 and the metal board 30 are attached to the case 10, the ground terminal 90 is inserted from above the control board 20 into the insertion hole 20 a formed in the control board 20 and the wall 10 a of the case 10. After sequentially passing through the insertion hole 10e formed in the protruding portion 10d, the lower end 90a of the ground terminal 90 is inserted into the insertion hole 30c formed in the insulating layer 30b of the metal substrate 30 and the metal base layer 30a. Abuts the top surface.

  Next, the portion of the ground terminal 90 in this state inserted through the insertion hole 20a of the control board 20 is connected to the ground connection portion of the control board 20 with solder or the like, and the ground terminal 90 is mounted on the control board 20. Electrically connected to the ground terminal of electronic components such as controllers.

  And the fastening member 40, such as a volt | bolt, is inserted in the insertion hole 10b of each fixing | fixed part 10c in the case 10 of this mounting state, the fastening member 40 is fastened by the fastening hole 50a of the support body 50, and the case 10 is supported. It is placed on the body 50 and fixed. At this time, the ground terminal 90 is inserted while being press-fitted into an insertion hole 10e formed in the protruding portion 10d of the wall portion 10a of the case 10, and is held by the protruding portion 10d. Thus, the fastening member 40 is supported by the support member. When the case 10 is fastened and fixed to the 50 fastening holes 50a, a downward pressing force is applied to the ground terminal 90 from the protruding portion 10d of the case 10. Therefore, the lower end 90a of the ground terminal 90 is surely brought into contact with and connected to the metal base layer 30a while being pressed toward the metal base layer 30a of the metal substrate 30.

  The operation of the electronic apparatus 1 having the above configuration is not limited, but a direct current is supplied from an input power supply (not shown) to the input terminal 60 via a smoothing capacitor. 20, a control signal from the controller 20 is input to the power semiconductor element on the metal substrate 30, and the power semiconductor element boosts the voltage while performing a switching operation under the control of the controller, and the U-phase terminal 70 U at the output terminal 70. Correspondingly, from the V-phase terminal 70V and the W-phase terminal 70W, three-phase alternating currents of U-phase, V-phase and W-phase are output to a load such as a motor for a vehicle or a compressor to drive the load. become. Even in the operating state of the electronic apparatus 1, the ground terminals of the electronic components such as the controller on the control board 20 are the ground connection portion of the control board 20, the ground terminal 90, the metal base layer 30 a of the metal board 30, and the support 50. Are sequentially connected to the ground potential.

  Now, with respect to the ground terminal in the electronic device 1 of the present embodiment, the following modifications are conceivable in order to make the connection state of the metal substrate 30 to the metal base layer 30a more reliable.

  FIG. 4 is a partially enlarged cross-sectional view showing a modification of the ground terminal in the electronic device of the present embodiment, and corresponds to FIG. 3 in terms of position.

In this modification, the shape of the lower end portion 100a of the ground terminal 100 is a tapered shape, and the corresponding insertion hole 30c ′ formed in the insulating layer 30b of the metal substrate 30 also has a tapered shape. This is the main difference from the configuration using the ground terminal 90 shown in FIG. 3, and the remaining configuration is the same. Therefore, in this modified example, description will be made by paying attention to such differences, and the same components are denoted by the same reference numerals, and description thereof will be simplified or omitted as appropriate.

  Specifically, as shown in FIG. 4, the ground terminal 100 has a tapered shape in which the shape of the lower end portion 100 a tapers downward, and is formed on the insulating layer 30 b of the metal substrate 30. Through the insertion hole 30c ′ having a tapered shape, the metal substrate layer 30a is connected to the metal substrate layer 30a while entering and fitting into the recess 30d formed on the upper surface of the metal substrate layer 30a of the metal substrate 30.

  Further, when the electronic device 1 is assembled, in order to connect the ground terminal 100 to the metal base layer 30a of the metal substrate 30, the control substrate 20 and the metal substrate 30 are mounted on the case 10 in the mounted state. Similarly to the ground terminal 90, after the ground terminal 100 is sequentially inserted from above into the insertion hole 30c ′ formed in the insulating layer 30b of the metal substrate 30, the lower end portion 100a of the ground terminal 100 is connected to the upper surface of the metal base layer 30a. The concave portion 30d formed on the metal substrate 30 is inserted into and fitted into the concave portion 30d to be connected to the metal substrate 30.

  Here, the ground terminal 100 is inserted while being press-fitted into an insertion hole 10e formed in the protruding portion 10d of the wall portion 10a of the case 10, and is held by the protruding portion 10d. Therefore, by pressing the fastening member 40 into the fastening hole 50a of the support 50 and fixing the case 10, a downward pressing force is applied to the ground terminal 100 from the protruding portion 10d of the case 10. Thus, the lower end portion 100a of the ground terminal 100 is pressed toward the metal base material layer 30a of the metal substrate 30, and bites into the metal base material layer 30a more firmly.

  In this modification, the insertion hole 30c ′ formed in the insulating layer 30b of the metal substrate 30 has a taper shape corresponding to the taper shape of the lower end portion 100a of the ground terminal 100. Of course, FIG. It is also possible to use an insertion hole 30c having a certain diameter as shown in FIG.

  Moreover, in this modification, when the taper shape of the lower end portion 100a of the ground terminal 100 is sharp with respect to the insulating layer 30b and the metal base layer 30a of the metal substrate 30, the ground terminal 100 is directed downward. If pressed, the lower end portion 100a can penetrate the insulating layer 30b and bite into the upper surface of the metal base layer 30a. In such a case, the insertion hole 30c ′ of the insulating layer 30b or the metal base layer 30a It is not always necessary to form the recess 30d.

  According to the configuration of the present embodiment including the above-described modification, the ground terminal extends between the metal substrate and the control substrate, and the metal base layer and the control substrate of the metal substrate connected to the ground potential By providing a ground potential to the control board, the ground can be connected to the ground from the control board with a simple configuration without adopting a complicated configuration such as insert molding or bolting. An electronic device having a terminal can be provided.

  Moreover, the ground terminal presses the ground terminal against the metal base layer when the ground terminal is fixed by being inserted into the insertion hole of the insertion portion so that the ground terminal can receive the pressing force applied from the case. The connection state to the metal base material layer at the ground terminal can be made more reliable.

Further, in particular, according to the configuration in the modified example, the taper-shaped end portion that is tapered toward the metal substrate side in the ground terminal bites into and connects to the metal substrate layer of the metal substrate, so that the metal substrate layer in the ground terminal is connected. The connection state to can be made stronger.

(Second Embodiment)
Next, an electronic device having a ground terminal according to the second embodiment of the present invention will be described in detail with reference to FIG.

  FIG. 5 is a partially enlarged cross-sectional view showing an electronic device having a ground terminal according to this embodiment, and is a cross-sectional view corresponding to FIG.

  In the electronic device 2 of the present embodiment, the ground terminal 110 has a flange portion 110b and also passes through the insertion hole 120a provided in the resin portion of the surface mount component 120 mounted on the metal substrate 30. Correspondingly, the protruding portion 10g formed on the wall portion 10a of the case 10 is provided above the surface mounting component 120, which is mainly for the configuration of the electronic device 1 having the ground terminal 90 in the first embodiment. This is a difference, and the remaining configuration is the same. Therefore, in this modified example, description will be made by paying attention to such differences, and the same components are denoted by the same reference numerals, and description thereof will be simplified or omitted as appropriate.

  Specifically, as shown in FIG. 5, the protruding portion 10 g is a portion in which a part of the wall portion 10 a of the case 10 protrudes inward, like the protruding portion 10 d in the first embodiment, The terminal 110 is an insertion part that is press-fitted and inserted while being penetrated in the vertical direction, and is provided above the protruding part 10 d so as not to interfere with the surface-mounted component 120. The protruding portion 10g has an insertion hole 10h penetrating in the vertical direction, and the upper surface 10i of the protruding portion 10g abuts on the lower surface of the control board 20 to suppress unnecessary vibration of the control board 20.

  The ground terminal 110 is a conductive terminal made of metal or the like extending in the vertical direction, and has a flange portion 110b extending in the lateral direction at an intermediate portion thereof. The upper surface of the flange portion 110b of the ground terminal 110 is in contact with the bottom surface 10j of the protruding portion 10g, and the lower surface of the flange portion 110b is in contact with the upper surface 120b of the resin portion of the surface mount component 120 mounted on the metal substrate 30. In contact therewith, unnecessary vibrations of the surface-mounted component 120 are suppressed. The surface-mounted component 120 is a connector, a capacitor, or the like, and the bottom surface 120c is in contact with the upper surface of the insulating layer 30b of the metal substrate 30.

  Further, the upper portion of the ground terminal 110 is press-fitted into an insertion hole 10 h formed in the protruding portion 10 g of the wall portion 10 a of the case 10 and penetrates through the insertion hole formed in the control board 20 placed on the case 10. It is inserted through the hole 20a and protrudes above the control board 20 while being connected to a ground connection portion of the control board 20 provided around the insertion hole 20a via solder or the like. On the other hand, the lower portion of the ground terminal 90 is inserted into the insertion hole 120a provided in the resin portion of the surface mount component 120 and also inserted into the insertion hole 30c formed in the insulating layer 30b of the metal substrate 30. The upper surface of the metal base layer 30a exposed in the hole 30c is in contact. The insertion hole 120 a provided in the resin portion of the surface mounting component 120 is a surface of the metal substrate 30 accommodated in the case 10 with respect to the insertion hole 10 h formed in the protruding portion 10 g of the wall portion 10 a of the case 10. A radial tolerance in consideration of the mounting tolerance of the mounting component 120 is provided as necessary.

  Therefore, the ground terminal of an electronic component such as a controller mounted on the control board 20 is grounded via the ground connection portion of the control board 20, the ground terminal 110, the metal base layer 30a of the metal board 30, and the support 50. It will be connected to the potential.

Hereinafter, a method for assembling and fixing the electronic device 2 having the above configuration to the support 50 will be described in detail.

  First, an electronic component such as a controller is mounted on the control board 20, and the upper portion of the ground terminal 110 is inserted from below into an insertion hole 10 h formed in the protruding portion 10 g of the wall portion 10 a of the case 10. 20 is inserted into the insertion hole 20a from below. On the other hand, in addition to a power semiconductor element such as an insulated gate bipolar transistor and a terminal such as the input terminal 60, the surface mounting component 120 having the insertion hole 120 a is mounted on the metal substrate 30.

  Next, when the various components are mounted on the control board 20 and the metal board 30, the metal board 30 is housed and fixed in the lower part of the case 10, and the control board 20 is placed on the upper part of the case 10. Fix it. At this time, the lower portion of the ground terminal 110 is inserted from above into the insertion hole 120a formed in the resin portion of the surface mount component 120, and then inserted into the insertion hole 30c formed in the insulating layer 30b of the metal substrate 30. The lower end portion 110a of the ground terminal 110 is in contact with and connected to the upper surface of the metal base layer 30a. Here, the upper surface of the flange portion 110 b of the ground terminal 110 contacts the bottom surface 10 j of the protruding portion 10 g of the wall portion 10 a of the case 10, and the lower surface of the flange portion 110 b contacts the upper surface 120 b of the surface mounting component 120.

  Next, a portion of the ground terminal 110 in such a state that is inserted into the insertion hole 20a of the control board 20 is connected to a ground connection portion of the control board 20 provided around the insertion hole 20a by solder or the like. Is electrically connected to a ground terminal of an electronic component such as a controller mounted on the control board 20.

  And the fastening member 40, such as a volt | bolt, is penetrated to the insertion hole 10b of each fixing | fixed part 10c in the case 10 of this mounting state, the fastening member 40 is fastened to the fastening hole 50a of the support body 50, and a case is a support body 50 to be fixed. At this time, the ground terminal 110 is press-fitted into and inserted into the insertion hole 10h formed in the protruding portion 10g of the wall portion 10a of the case 10, and is thus clamped by the protruding portion 10g. By fastening the case 40 into the fastening hole 50a of the support 50 and fixing the case 10, a downward pressing force is applied to the ground terminal 110 from the projecting portion 10g. The lower end portion 110a of the metal substrate 30 is pressed toward the metal base layer 30a of the metal substrate 30 and is fixed more firmly. At the same time, since the lower surface of the flange portion 110b of the ground terminal 110 is in contact with the upper surface 120b of the surface mounting component 120, the bottom surface 120c of the surface mounting component 120 is reliably pressed against the upper surface of the insulating layer 30b of the metal substrate 30. However, the surface mounting component 120 on the metal substrate 30 is held.

  Of course, the ground terminal 100 having a tapered shape in which the shape of the lower end portion 100a described in the first embodiment tapers downward can be applied to the configuration of the present embodiment.

  According to the configuration of the present embodiment described above, since the flange portion of the ground terminal is in contact with and held by the surface mount component mounted on the metal substrate, the mounting state of the surface mount component can be ensured. .

  In the present invention, the type, arrangement, number, and the like of the members are not limited to the above-described embodiments, and the constituent elements thereof are appropriately replaced with those having the same operational effects, and the gist of the invention is not deviated. Of course, it can be appropriately changed within the range.

As described above, in the present invention, it is possible to provide an electronic device having a ground terminal that can be grounded from a control board with a simple configuration without adopting a complicated configuration such as insert molding or bolting. It is expected that it can be widely applied to electronic devices such as inverter devices because of its general-purpose universal character.

DESCRIPTION OF SYMBOLS 1 ......... Electronic device 10 ... Case 10a ... Wall part 10b ... Insertion hole 10c ... Fixing part 10d ... Protrusion part 10e ... Insertion hole 10f ... Bottom surface 10g ... Protrusion part 10h ... Insertion hole 10i ... Upper surface 10j ... Bottom surface 20 ... Control board 30 ... Metal board 30a ... Metal base layer 30b ... Insulating layer 30c ... Insertion hole 30d ... Recess 40 ... Fastening member 50 ... Support 50a ... Fastening hole 60 ... Input terminal 70 ... Output terminal 70U ... U phase terminal 70V ... V phase terminal 70W ... W phase terminal 80 ... relay terminal 90 ... ground terminal 90a ... lower end 100 ... ground terminal 100a ... lower end 110 ... ground terminal 110a ... lower end 110b ... flange 120 ... Surface mount component 120a ... Upper surface 120b ... Bottom surface

Claims (3)

In an electronic device comprising: a metal substrate on which a power semiconductor element is mounted; and a control substrate disposed above the metal substrate.
A ground terminal extending between the metal substrate and the control substrate;
The metal substrate has a metal base layer and an insulating layer provided thereon,
The ground terminal is mounted on the control board, and electrically connects between the control board and the pre-Kikin Shokumoto material layer connected to the ground potential, together with providing the ground potential to the control board The end on the metal substrate side of the ground terminal has a tapered shape that tapers to the metal substrate side, and the end on the metal substrate side penetrates the insulating layer and the metal base material layer. An electronic device characterized by being connected to a bite . The metal board and the control board are provided in a case, and an insertion portion formed in the case and having an insertion hole is disposed between the metal board and the control board, and the ground terminal is connected to the ground When the case is fastened to a support that provides an electric potential, the ground terminal is inserted while being press-fitted into the insertion hole of the insertion portion so that the ground terminal can receive a pressing force applied from the case. The electronic device according to claim 1, wherein the electronic device extends between the metal substrate and the control substrate. The ground terminal has a flange portion, an electronic device according to claim 1 or 2, wherein the flange portion is characterized in that the retaining contact with the implemented surface mount component on the metal substrate.

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