JP5215119B2 - Connection structure of LED power feeding part - Google Patents

Connection structure of LED power feeding part Download PDF

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JP5215119B2
JP5215119B2 JP2008272670A JP2008272670A JP5215119B2 JP 5215119 B2 JP5215119 B2 JP 5215119B2 JP 2008272670 A JP2008272670 A JP 2008272670A JP 2008272670 A JP2008272670 A JP 2008272670A JP 5215119 B2 JP5215119 B2 JP 5215119B2
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led
electrode
coupler
wiring pattern
led mounting
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JP2010103271A (en
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聡二 大和田
隆照 酒井
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Stanley Electric Co Ltd
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Description

本発明は、LED実装基板上に実装されたLEDに給電するための給電部の接合構造に関するものである。   The present invention relates to a joining structure of a power feeding unit for feeding power to an LED mounted on an LED mounting substrate.

従来、LEDへの給電は、コネクタ部品であるカプラをLED実装基板に実装し、このカプラによって電源とLEDとを電気的に接続することによってなされている。ここで、LED実装基板にはLEDに給電するための配線パターンが形成されており、このLED実装基板には、カプラがチップ抵抗やコンデンサ等の電子部品と同様にハンダ付けによって実装されている。尚、カプラのLED実装基板への実装方法としては、ハンダ付け以外にネジ止め、抵抗溶接、レーザー溶接等による接合が一般的に採用されている。   Conventionally, power is supplied to an LED by mounting a coupler, which is a connector component, on an LED mounting board, and electrically connecting the power source and the LED by the coupler. Here, a wiring pattern for supplying power to the LED is formed on the LED mounting board, and a coupler is mounted on the LED mounting board by soldering similarly to electronic components such as a chip resistor and a capacitor. As a method for mounting the coupler on the LED mounting substrate, bonding by screwing, resistance welding, laser welding, or the like is generally employed in addition to soldering.

ところで、近年、車両のヘッドランプのLED化への開発が進められており、ハイパワーLEDへの給電方法に関する提案が種々なされている。   By the way, in recent years, the development of a vehicle headlamp as an LED has been promoted, and various proposals regarding a method of supplying power to a high power LED have been made.

例えば、車載LEDの実装技術に関して特許文献1には、クリップ状の端子でLEDを挟み込むことによってLEDへの給電と固定を同時に行う提案がなされ、特許文献2には、LEDとヒートシンクを給電アタッチメントで挟み込み、これらをクリップ状の部品で押さえ込んで固定する構成が提案されている。   For example, regarding the mounting technology of in-vehicle LEDs, Patent Document 1 proposes to simultaneously supply and fix the LED by sandwiching the LED with a clip-shaped terminal, and Patent Document 2 includes an LED and a heat sink with a power supply attachment. There has been proposed a structure in which these are sandwiched and pressed and fixed with clip-shaped parts.

又、特許文献3には板バネを備えた端子付き部品にLEDを嵌め込んで給電と固定を行う構成が提案され、特許文献4には、LEDに雄端子を接合し、この雄端子に雌端子を挿入してLEDと電源とを電気的に接続するとともに、LEDをヒートシンクにクリップ状の部品で押さえて固定する構成が提案されている。   Patent Document 3 proposes a configuration in which an LED is fitted into a terminal-equipped component having a leaf spring to perform power feeding and fixing. Patent Document 4 joins a male terminal to the LED, and a female terminal is connected to the male terminal. A configuration has been proposed in which a terminal is inserted to electrically connect an LED and a power source, and the LED is fixed to a heat sink by holding it with a clip-shaped component.

他方、車載LED以外の実装技術に関して特許文献5には、接続端子を鰐口クリップの噛み合わせの開口方向と直交する姿勢で並列するよう支持する構成が提案され、特許文献6には、挟持部材に設けられている一対の挟持板が帯状の雄タブを厚み方向に沿って挟持する雌端子において、雄タブが振動した場合でも多数の接触点を確保して接触信頼性の向上を図るため、挟持板の対向する面に設けられた奥側突出部と手前側突出部が雄タブに接触する構成とする提案がなされている。
特開2007−207594号公報 特開2007−242267号公報 特開2007−200697号公報 特開2007−194172号公報 特開2006−300877号公報 特開2005−209518号公報
On the other hand, regarding the mounting technology other than the in-vehicle LED, Patent Document 5 proposes a configuration in which the connection terminals are supported in parallel so as to be orthogonal to the opening direction of the engagement of the mouth clip. In a female terminal in which a pair of provided clamping plates clamp a strip-shaped male tab along the thickness direction, even when the male tab vibrates, a large number of contact points are secured to improve contact reliability. There has been proposed a configuration in which a rear side protruding portion and a front side protruding portion provided on opposite surfaces of the plate are in contact with the male tab.
JP 2007-207594 A JP 2007-242267 A JP 2007-200757 A JP 2007-194172 A Japanese Patent Laid-Open No. 2006-300877 JP 2005-209518 A

ヘッドランプ等の車載用部品の信頼性試験項目にはヒートショックが含まれており、カプラのLED実装基板へのハンダ付けに関して、現在、ハンダメーカーによって高信頼性製品が多数リリースされているが、部材の組み合わせや金属基板とLEDの線膨張係数の違いのためにハンダ接合部にクラックが発生するという問題がある。ハンダ接合部にクラックが発生すると、ヘッドライトの給電不良による不灯やLED等の実装部品の脱落が発生する可能性がある。   The reliability test items for automotive parts such as headlamps include heat shock, and many soldering manufacturers have released many high-reliability products for soldering the coupler to the LED mounting board. There is a problem that cracks occur in the solder joints due to the combination of members and the difference in linear expansion coefficient between the metal substrate and the LED. When cracks occur in the solder joints, there is a possibility that mounting parts such as non-lights and LEDs will drop due to poor power feeding of the headlights.

又、エンジンに近い位置に取り付けられた車載用部品は高温環境下に晒されるため、実装部品とハンダとの間に熱による金属拡散が発生して金属間化合物が形成される。この金属間化合物は、一般的に脆くなってしまうために自動車の振動や衝撃、更にはリード線の撓み等によってハンダ接合部が破壊され、カプラが脱落する可能性がある。   Moreover, since the vehicle-mounted component attached to the position close to the engine is exposed to a high temperature environment, metal diffusion due to heat occurs between the mounting component and the solder, and an intermetallic compound is formed. Since this intermetallic compound generally becomes brittle, there is a possibility that the solder joint portion is broken due to vibration or impact of the automobile, bending of the lead wire, etc., and the coupler falls off.

特許文献1〜3に記載された構成では、LEDの固定と給電を板バネ状の端子で行っているが、この固定方法では、振動によって板バネが共振した場合、LEDへの給電が遮断されてLEDの不灯が発生したり、LEDが点灯と不灯を繰り返し、LEDを光源とするヘッドライト等の車両用灯具にあっては法規を満たさない事態が発生する。   In the configurations described in Patent Documents 1 to 3, the LED is fixed and fed with a leaf spring-shaped terminal. However, in this fixing method, when the leaf spring resonates due to vibration, feeding to the LED is cut off. Thus, there is a situation where the LED is not lit or the LED is repeatedly turned on and off, and the vehicle lamp such as a headlight using the LED as a light source does not meet the regulations.

又、特許文献1〜3に記載された構成ではLEDを板バネ状端子で挟み込んでいるが、通常、金属は高温環境下において柔らかくなる傾向があるため、初期状態ではLEDを所定の圧力で保持していても、LEDの発熱や環境温度の上昇によって圧力が低下してしまい、板バネ状の端子の接点不良によるLEDの不灯やLED自体の脱落が発生する可能性がある。   Further, in the configurations described in Patent Documents 1 to 3, the LED is sandwiched between leaf spring terminals, but normally, metal tends to soften in a high temperature environment, so the LED is held at a predetermined pressure in the initial state. Even so, the pressure decreases due to the heat generation of the LED and the increase of the environmental temperature, and there is a possibility that the LED will not be lit due to a contact failure of the leaf spring-like terminal, or the LED itself may fall off.

特許文献4に記載された構成では、LEDに雄端子を溶接等によって接合しているが、この雄端子に雌端子を差し込む際に、LEDに接合されている雄端子が変形する可能性がある。又、溶接等による端子のLEDへの接合は、LEDは小型で給電用電極も小さいことから、十分に広い接合面積を確保することができず、雌端子の抜き差しによってLEDに接合されている雄端子が剥がれてしまう可能性がある。   In the configuration described in Patent Document 4, the male terminal is joined to the LED by welding or the like, but when the female terminal is inserted into the male terminal, the male terminal joined to the LED may be deformed. . Also, the bonding of the terminal to the LED by welding or the like is not possible because it is small in size and the power supply electrode is small, so that a sufficiently large bonding area cannot be ensured. The terminal may be peeled off.

以上の問題を解決するためには電極の形状を改良する必要があるが、既存の電極には下記のような問題があるため、車載LEDの実装分野には利用することができないのが実情である。   In order to solve the above problems, it is necessary to improve the shape of the electrodes. However, since the existing electrodes have the following problems, they cannot be used in the field of mounting on-vehicle LEDs. is there.

即ち、特許文献5において提案された構成では、鰐口クリップと実装基板は、鰐口クリップの弾性力に起因する静止摩擦力を超えない大きさの力に対しては安定的な接続が可能であるが、鰐口クリップは一般的に人が使用することを前提として作られている。このため、鰐口クリップをLED実装分野に応用するとすれば、必然的に人による作業で組み立てられることになり、LED実装基板の給電部の電極の大きさが1cm以下であり、且つ、電極の刃の大きさがmm単位であることを考慮すると、人の手で正しい位置を正確に把握することは困難であり、正しい位置を正確に把握したとしても、その位置に正確に移動させることは困難である。   That is, in the configuration proposed in Patent Document 5, the hook clip and the mounting substrate can be stably connected to a force that does not exceed the static frictional force caused by the elastic force of the hook clip. In general, the mouth clip is made on the premise that the person will use it. For this reason, if the mouth clip is applied to the LED mounting field, it will inevitably be assembled by human work, the size of the electrode of the power supply part of the LED mounting substrate is 1 cm or less, and the electrode blade Considering that the size of the unit is in mm, it is difficult to accurately grasp the correct position with human hands, and even if the correct position is accurately grasped, it is difficult to accurately move to that position. It is.

又、鰐口クリップの凹凸が正しく噛み合っているか否かを認識することが困難であるため、誤って接続した場合にそのことに気づかず、不良品を生産する可能性がある。   In addition, since it is difficult to recognize whether or not the unevenness of the mouth clip is correctly meshed, there is a possibility that a defective product will be produced without noticing that it has been mistakenly connected.

特許文献6に記載された雌端子は、雄タブが振動した場合でも多数の接触点を確保することによって接触信頼性の向上を図ることができるものであり、雄端子が振動すると、それに追随して可撓性を有する雌端子が動くことによって安定した電気的接続が実現される。このように、雌タブの機能は振動によって初めて発揮されるが、車載LEDの分野においては長時間の振動は金属疲労を引き起こすという問題がある。   The female terminal described in Patent Document 6 can improve contact reliability by securing a large number of contact points even when the male tab vibrates. When the male terminal vibrates, the female terminal follows it. Therefore, stable electrical connection is realized by moving the flexible female terminal. Thus, the function of the female tab is exhibited for the first time by vibration, but in the field of in-vehicle LEDs, there is a problem that long-time vibration causes metal fatigue.

本発明は上記問題に鑑みてなされたもので、その目的とする処は、電源に連なる電極とLED実装基板上に形成された配線パターンとの電気的接合を確実に行うことができるLED給電部の接合構造を提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an LED power supply unit that can reliably perform electrical connection between an electrode connected to a power source and a wiring pattern formed on an LED mounting substrate. It is to provide a joint structure.

上記目的を達成するため、請求項1記載の発明は、LEDが実装されたLED実装基板の絶縁層上に形成された配線パターンを前記LED実装基板の端部まで延ばし、電源に連なる電極と前記配線パターンとを電気的に接合するLED給電部の接合構造において、前記電極又は前記配線パターンの一方に、断面略直角三角形の刃をその短辺と平行な方向に複数配列して成る凹凸端子を形成し、他方に、断面略長方形の刃を複数配列して成る凹凸端子を形成し、両凹凸端子同士を噛み合わせることによって前記電極と前記配線パターンとを電気的に接合することを特徴とする。   In order to achieve the above object, the invention according to claim 1 is directed to extending a wiring pattern formed on an insulating layer of an LED mounting substrate on which an LED is mounted to an end portion of the LED mounting substrate, In the junction structure of the LED power feeding portion that electrically joins the wiring pattern, an uneven terminal formed by arranging a plurality of substantially right-angled triangular blades in a direction parallel to the short side of one of the electrodes or the wiring pattern. And forming an uneven terminal formed by arranging a plurality of blades having a substantially rectangular cross section on the other side, and electrically connecting the electrode and the wiring pattern by engaging the both uneven terminals. .

請求項2記載の発明は、請求項1記載の発明において、前記電極と前記配線パターンの表面にAuメッキを施したことを特徴とする。
The invention described in claim 2 is characterized in that, in the invention described in claim 1, Au plating is applied to the surfaces of the electrode and the wiring pattern.

請求項3記載の発明は、請求項1又は2記載の発明において、前記電極を非導電性の耐熱性樹脂で構成されたカプラの内部に配置し、該カプラを前記電極と共に前記LED実装基板に圧入することによって前記電極と前記配線パターンとを電気的に接合することを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, the electrode is disposed inside a coupler made of a non-conductive heat-resistant resin, and the coupler is mounted on the LED mounting substrate together with the electrode. The electrode and the wiring pattern are electrically joined by press-fitting.

請求項4記載の発明は、請求項3記載の発明において、前記カプラを前記LED実装基板にネジ止めによって固定することを特徴とする。   According to a fourth aspect of the present invention, in the third aspect of the present invention, the coupler is fixed to the LED mounting board by screws.

請求項5記載の発明は、請求項1又は2記載の発明において、前記LED実装基板にネジ止めされる固定部材によって前記電極を前記LED実装基板との間で挟持することによって前記電極と前記配線パターンとを電気的に接合することを特徴とする。   According to a fifth aspect of the present invention, in the first or second aspect of the invention, the electrode and the wiring are sandwiched between the LED mounting substrate by a fixing member screwed to the LED mounting substrate. The pattern is electrically connected to the pattern.

本発明によれば、電極側の凹凸端子とLED実装基板(配線パターン側)の凹凸端子が正しく噛み合ったときの接触音を聞いたり、凹凸端子同士の接触を皮膚感覚で感じ取ったりすることができるため、従来の鰐口クリップに比べて位置を正確に把握する必要がない上に、正しい接続であるか否かを接触音や皮膚感覚によって容易に認識することができ、従来の鰐口クリップによる作業に比して誤組による不良品発生率を低く抑えることができる。   According to the present invention, it is possible to hear the contact sound when the uneven terminal on the electrode side and the uneven terminal on the LED mounting substrate (wiring pattern side) are properly meshed, or to feel the contact between the uneven terminals with skin sensation. Therefore, it is not necessary to accurately grasp the position compared to the conventional hook clip, and it is possible to easily recognize whether the connection is correct by contact sound or skin sensation. Compared with this, it is possible to reduce the defective product generation rate due to misassembly.

又、本発明によれば、一方の凹凸端子の刃の断面形状が略直角三角形を成し、他方の凹凸端子の刃の断面形状が略長方形を成しているため、電極とLED実装基板の組付方向に対して垂直な力、組付方向とは反対方向の力、組付方向に対して矢上方向に垂直な力、振動等、何れの方向の外力に対しても電極と配線パターンとの確実な電気的接合が維持される。   In addition, according to the present invention, the cross-sectional shape of the blade of one concavo-convex terminal forms a substantially right triangle, and the cross-sectional shape of the blade of the other concavo-convex terminal forms a substantially rectangular shape. Electrode and wiring pattern with respect to external force in any direction such as force perpendicular to the assembly direction, force opposite to the assembly direction, force perpendicular to the ascending direction, vibration, etc. A reliable electrical connection is maintained.

以下に本発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

<実施の形態1>
図1は本発明の実施の形態1に係るLED給電部の接合構造を示す斜視図、図2は同LED給電部の接合構造を示す分解斜視図、図3は同LED給電部の接合構造を示す平面図、図4は図3のA−A線断面図、図5は図4のB部拡大詳細図、図6は図3のC−C線断面図である。
<Embodiment 1>
1 is a perspective view showing a bonding structure of an LED power feeding unit according to Embodiment 1 of the present invention, FIG. 2 is an exploded perspective view showing the bonding structure of the LED power feeding unit, and FIG. 3 is a bonding structure of the LED power feeding unit. 4 is a cross-sectional view taken along line AA in FIG. 3, FIG. 5 is an enlarged detail view of a portion B in FIG. 4, and FIG. 6 is a cross-sectional view taken along line CC in FIG.

図示のLED実装基板1は、Cu層1Aの上に絶縁層1Bを形成して構成されており、絶縁層1B上には配線パターン2が形成されるとともに、LED3が熱伝導性接着剤4によって接着されて実装されている。そして、このLED実装基板1の端部には、断面コの字状(図4参照)に成形されたカプラ5が圧入されており、このカプラ5は、その左右両側から水平に延びる耐熱性樹脂又は金属製のブラケット5aに挿通するネジ6によってLED実装基板1に強固に固定されている。又、LED3はAuワイヤー(又はAlウェッジ)7によって配線パターン2にボンディングされており、配線パターン2はカプラ5の給電部まで延びており、不図示の電源からカプラ5の給電部と配線パターン2及びAuワイヤー(又はAlウェッジ)7を経てLED3に給電がなされる。   The illustrated LED mounting substrate 1 is configured by forming an insulating layer 1B on a Cu layer 1A. A wiring pattern 2 is formed on the insulating layer 1B, and an LED 3 is bonded by a heat conductive adhesive 4. Bonded and mounted. A coupler 5 having a U-shaped cross section (see FIG. 4) is press-fitted into an end portion of the LED mounting substrate 1, and the coupler 5 is a heat-resistant resin that extends horizontally from the left and right sides. Alternatively, the LED mounting substrate 1 is firmly fixed by screws 6 inserted through the metal bracket 5a. The LED 3 is bonded to the wiring pattern 2 by an Au wire (or Al wedge) 7. The wiring pattern 2 extends to the power feeding portion of the coupler 5, and the power feeding portion of the coupler 5 and the wiring pattern 2 from a power source (not shown). Then, power is supplied to the LED 3 through the Au wire (or Al wedge) 7.

上記カプラ5は、非導電性のハウジング5Aと導電性の電極8から構成されている。ここで、電極8はりん青銅や黄銅等のCu合金にAuメッキを施して構成されており、この電極8の上下面には断面直角三角形の刃を短辺と平行な方向に複数配列して成る凹凸端子8aが形成されている。尚、電極8の材質としては、Cu合金以外にも、他の元素を添加することによって高温時の弾性劣化を防ぐことができる材質を使用することができる。又、カプラ5のハウジング5Aの材質としては、導電性を有さない耐熱性の高い樹脂材料若しくはセラミック素材が望ましく、例えばPPSカーボネート、カプトン素材、アルミナ、AlN等を使用することができる。カプラ5のハウジング5Aの内部に配される電極8は、樹脂材料又はセラミック材料によるハウジング5Aのモールド成形時に一体に形成されるか、ハウジング5Aの内部に嵌め込まれる。   The coupler 5 includes a non-conductive housing 5A and a conductive electrode 8. Here, the electrode 8 is configured by applying Au plating to a Cu alloy such as phosphor bronze or brass, and a plurality of right-angled triangular blades are arranged on the upper and lower surfaces of the electrode 8 in a direction parallel to the short side. The uneven terminal 8a is formed. In addition to the Cu alloy, the electrode 8 may be made of a material that can prevent elastic deterioration at high temperatures by adding other elements. Further, the material of the housing 5A of the coupler 5 is preferably a resin material or ceramic material having no electrical conductivity and high heat resistance. For example, PPS carbonate, Kapton material, alumina, AlN, or the like can be used. The electrode 8 disposed inside the housing 5A of the coupler 5 is integrally formed when the housing 5A is molded with a resin material or a ceramic material, or is fitted into the housing 5A.

LED実装基板1を構成する前記絶縁層1Bの材質には、ポリエーテルイミド、ポリエーテルエーテルケトン、ポリエーテルフォン等の熱可塑性樹脂やエポキシ樹脂、ポリイミド樹脂等の熱硬化性樹脂を使用することができ、必要に応じてガラス繊維布等の補強材を介在させても良い。   The insulating layer 1B constituting the LED mounting substrate 1 may be made of a thermoplastic resin such as polyetherimide, polyetheretherketone, or polyetherphone, or a thermosetting resin such as epoxy resin or polyimide resin. Yes, and a reinforcing material such as a glass fiber cloth may be interposed as required.

又、LED実装基板1の前記Cu層1Aには、カプラ5の電極8に形成された凹凸端子8aに対応する凹凸1aが形成されており、カプラ5の給電部である電極8との電気的接合を避けるためにレジストやアルマイト加工等の絶縁加工が施されている。   Further, the Cu layer 1A of the LED mounting substrate 1 is provided with the unevenness 1a corresponding to the uneven terminal 8a formed on the electrode 8 of the coupler 5, and is electrically connected to the electrode 8 which is a power feeding portion of the coupler 5. In order to avoid bonding, insulation processing such as resist and alumite processing is applied.

前記配線パターン2は、Cu箔にAuメッキを施して構成されており、その厚みは0.1mm〜1mmが望ましく、エッチング処理又はプレス処理によってLED実装基板1の絶縁層1B上に形成されている(プレス処理方法については特開平8−222838号公報参照)。そして、この配線パターン2の端部には、カプラ5の電極8に形成された凹凸端子8aに対応する凹凸端子2aが形成されており、この凹凸端子2aは、断面長方形の刃を複数配列して構成されている。尚、Cu箔は絶縁層1Bに埋め込まれなくても良い。   The wiring pattern 2 is formed by applying Au plating to a Cu foil, and the thickness is preferably 0.1 mm to 1 mm, and is formed on the insulating layer 1B of the LED mounting substrate 1 by etching or pressing. (For the press processing method, see JP-A-8-222838). Then, an uneven terminal 2a corresponding to the uneven terminal 8a formed on the electrode 8 of the coupler 5 is formed at the end of the wiring pattern 2, and the uneven terminal 2a includes a plurality of blades having a rectangular cross section. Configured. In addition, Cu foil does not need to be embedded in the insulating layer 1B.

次に、カプラ5の電極8に形成された凹凸端子8aと配線パターン2に形成された凹凸端子2aの形状について説明する。   Next, the shape of the concavo-convex terminal 8a formed on the electrode 8 of the coupler 5 and the concavo-convex terminal 2a formed on the wiring pattern 2 will be described.

図5に示すように、カプラ5の電極8に形成された凹凸端子8aは、その断面が直角三角形を短辺と平行な方向(図5の左右方向)に複数組み合わせた形状を有しており、配線パターン2側の凹凸端子2aとの噛み合わせによる接合強度を十分確保するため、直角三角形の短辺の長さは0.1mm以上、刃と刃の間隔は0.1mm以上に設定されることが望ましく、刃の数は少なくとも2つ以上必要である。又、凹凸端子8aの刃の先端の角度は、短辺の長さ、刃と刃の間隔、刃の数が上記条件を満たせば任意の値に設定し得るが、極端に小さくすると刃の強度を十分に保つことができないため、刃の先端の角度は刃に必要な強度を確保することができる値に設定すべきである。又、刃の形状としては、鋭利なナイフエッジ状の形状に限らず、曲率を持った形状にしても良い。   As shown in FIG. 5, the concavo-convex terminal 8a formed on the electrode 8 of the coupler 5 has a shape in which the cross section is a combination of a plurality of right triangles in a direction parallel to the short side (left and right direction in FIG. 5). In order to ensure sufficient bonding strength by engaging with the concave / convex terminals 2a on the wiring pattern 2 side, the length of the short side of the right triangle is set to 0.1 mm or more, and the distance between the blades is set to 0.1 mm or more. Desirably, at least two blades are required. Further, the angle of the tip of the blade of the concavo-convex terminal 8a can be set to any value as long as the length of the short side, the distance between the blades, and the number of blades satisfy the above conditions. Therefore, the angle of the blade tip should be set to a value that can ensure the strength required for the blade. Further, the shape of the blade is not limited to a sharp knife edge shape, but may be a shape having a curvature.

他方、LED実装基板1側の給電部を構成する配線パターン2の凹凸端子2aは、同じ大きさの断面長方形を一定間隔で複数並設して構成されており、長方形の数はカプラ5側の電極8に形成された凹凸端子8aの刃との噛み合わせを良好に行うために最低3つ必要となる。   On the other hand, the concavo-convex terminals 2a of the wiring pattern 2 constituting the power supply unit on the LED mounting substrate 1 side are configured by arranging a plurality of rectangular cross sections of the same size at regular intervals, and the number of rectangles is on the coupler 5 side. In order to satisfactorily engage with the blades of the uneven terminal 8a formed on the electrode 8, at least three are required.

カプラ5側の電極8とLED実装基板1上の配線パターン2との接触状態は、図5に示す接点Fに示すようにカプラ5側の電極8に形成された凹凸端子8aの刃の斜辺が配線パターン2の凹凸端子2aの断面長方形の刃の角部と接触するか、或いは接点Gで示されるように、カプラ5側の電極8に形成された凹凸端子8aの刃と配線パターン2の凹凸端子2aの刃が辺同士で接触するかの2種類である。   The contact state between the electrode 8 on the coupler 5 side and the wiring pattern 2 on the LED mounting substrate 1 is that the oblique side of the blade of the concavo-convex terminal 8a formed on the electrode 8 on the coupler 5 side as shown in the contact F shown in FIG. As shown by the contact G, the edge of the uneven terminal 8a formed on the coupler 8 side electrode and the unevenness of the wiring pattern 2 are in contact with the corners of the rectangular blade of the uneven terminal 2a of the wiring pattern 2 There are two types of terminal 2a blades in contact with each other.

カプラ5側の電極8に形成された凹凸端子8aとLED実装基板1側の配線パターン2の凹凸端子2aとの組み合わせは、以下の(1)〜(3)の3つの理由によって振動等のような何れの方向から外力が加えられても凹凸端子2a,8a同士の接触が維持される。
(1)圧入方向に対して垂直方向の力が作用する場合:
カプラ5に対して図5の矢印a方向の力が加わり、LED実装基板1に矢印a’方向の力が作用した場合、両凹凸端子2a,8a同士の接合は接点Fにおいて強化され、同様の位置関係にある他の接点においても同様である。
(2)圧入方向とは逆方向の力が作用する場合:
カプラ5に図5の矢印b方向の力が作用し、LED実装基板1に矢印b’方向(カプラ5の圧入方向とは逆方向)の力が作用した場合も、(1)の場合と同様に両凹凸端子2a,8a同士の接合が強化される。なぜならば、両凹凸端子2a,8a同士が接している面は、カプラ5の圧入方向に対して垂直方向であるため、両面に発生する静止摩擦力の大きさとは無関係に両凹凸端子2a,8aの接合が保持される。この性質はカプラ5側の電極8に形成された凹凸端子8aの刃の断面形状が直角三角形であることによるものであって、刃の断面形状が鰐口クリップの刃と同様に二等辺三角形である場合には、このような効果は得られない。なぜならば、接点に生じる力が十分大きい場合には鰐口クリップは開いてしまうからである。尚、電極8の凹凸端子8aの刃の断面形状は、直角三角形に限らず、刃先角が直角に近い(80°〜100°)鋭角三角形又は鈍角三角形であっても良い。なぜならば、カプラ5の圧入方向と両凹凸端子2a,8aの接面はほぼ垂直とみなせるため、圧入方向に対して垂直方向に働く摩擦力の大きさは無視できる程小さいからである。
(3)圧入方向に対して矢状方向に垂直な力が作用する場合:
カプラ5に図5の矢印c方向の力が作用し、LED実装基板1側に矢印c’方向の力が作用した場合は、矢状方向に存在するLED実装基板1側の凹凸端子2aとカプラ5側の凹凸端子8aの刃の先端形状が接触することによって両凹凸端子2a,8aの接合が維持される。尚、逆にカプラ5に矢印c’方向の力が作用し、LED実装基板1側に矢印c方向の力が作用した場合も同様である。
The combination of the concavo-convex terminal 8a formed on the electrode 8 on the coupler 5 side and the concavo-convex terminal 2a of the wiring pattern 2 on the LED mounting substrate 1 side is likely to be vibration or the like for the following three reasons (1) to (3). Even if an external force is applied from any direction, contact between the concave and convex terminals 2a and 8a is maintained.
(1) When a force perpendicular to the press-fitting direction is applied:
When a force in the direction of the arrow a in FIG. 5 is applied to the coupler 5 and a force in the direction of the arrow a ′ acts on the LED mounting substrate 1, the joint between the two concavo-convex terminals 2 a and 8 a is strengthened at the contact F, The same applies to the other contacts in the positional relationship.
(2) When a force in the direction opposite to the press-fitting direction is applied:
The force in the direction of arrow b in FIG. 5 acts on the coupler 5, and the force in the direction of arrow b ′ (the direction opposite to the press-fitting direction of the coupler 5) acts on the LED mounting substrate 1 as in the case of (1). In addition, the bonding between the two concave and convex terminals 2a and 8a is strengthened. This is because the surface where both the concavo-convex terminals 2a and 8a are in contact with each other is perpendicular to the press-fitting direction of the coupler 5, and therefore the both concavo-convex terminals 2a and 8a are independent of the magnitude of the static friction force generated on both surfaces. Is maintained. This property is due to the fact that the cross-sectional shape of the concavo-convex terminal 8a formed on the electrode 8 on the coupler 5 side is a right-angled triangle, and the cross-sectional shape of the blade is an isosceles triangle like the blade of the cleaver clip. In some cases, such an effect cannot be obtained. This is because the hook clip opens when the force generated at the contact is sufficiently large. In addition, the cross-sectional shape of the blade of the concavo-convex terminal 8a of the electrode 8 is not limited to a right triangle, but may be an acute triangle or an obtuse triangle whose blade edge angle is close to a right angle (80 ° to 100 °). This is because the press-fitting direction of the coupler 5 and the contact surface of both the concavo-convex terminals 2a and 8a can be regarded as substantially perpendicular, and the magnitude of the frictional force acting in the direction perpendicular to the press-fitting direction is negligibly small.
(3) When a force perpendicular to the sagittal direction acts on the press-fitting direction:
When a force in the direction of arrow c in FIG. 5 acts on the coupler 5 and a force in the direction of arrow c ′ acts on the LED mounting board 1 side, the concave and convex terminals 2a on the LED mounting board 1 side existing in the sagittal direction and the coupler The contact of both the concavo-convex terminals 2a and 8a is maintained by contact of the tip shape of the blade of the concavo-convex terminal 8a on the 5 side. The same applies to the case where a force in the direction of the arrow c ′ acts on the coupler 5 and a force in the direction of the arrow c acts on the LED mounting substrate 1 side.

ところで、カプラ5の電極8とLED実装基板1側の配線パターン2にそれぞれ形成された各凹凸端子8a,2aの断面形状としては前記形状が望ましいが、製造工程で誤差が生じることは避けられないため、図7〜図10に示すような微小変形が生じることが予想される。しかし、カプラ5側の電極8にはLED実装基板1方向に対して弾性に起因する圧力が作用しているため、下記(1)〜(4)に示す何れの微小変形が生じても、両凹凸端子2a、8a同士の電気的接合が維持される。
(1)LED実装基板側の凹凸端子の刃の間隔:
LED実装基板1側の凹凸端子2aの刃の間隔が図7(a)に示すように小さかったり、図7(b)に示すように大きい場合であっても、両凹凸端子2a,8aは図示の接点H又は接点Iにおいて維持される。尚、カプラ5側の凹凸端子8aの刃の間隔とLED実装基板1側の凹凸端子2aの刃の間隔は複数存在するため、これらの凹凸端子2a,8aの噛み合わせの相対位置が左右にずれることが予想されるが、そのように場合においても接点はH又はIであることに変わりはなく、両凹凸端子2a,8a同士の電気的接合は維持される。
(2)カプラ側の凹凸端子の刃の大きさ:
カプラ5側の端子8aの刃の大きさが図8(a)に示すように小さかったり、図8(b)に示すように大きい場合には、両凹凸端子2a,8a同士の接合は接点J又は接点Kにおいて維持される。ここで、凹凸端子8aの刃の大きさとは、直角三角形の短辺の長さを言う。直角三角形の短辺の長さが変化することによって刃の先端の角度が微小に変化するが、直角三角形の斜辺とLED実装基板1側の凹凸端子2aの刃の先端角部において接点を持つことには変わりがないために問題は生じない。
(3)カプラ側の凹凸端子の刃の形状:
カプラ5側の凹凸端子8aの刃の形状が図9(a)に示すように鋭角三角形又は図9(b)に示すような鈍角三角形である場合、接点L,M又は接点N,Oにおいて両凹凸端子2a,8a同士は電気的接合が維持される。尚、カプラ5側の凹凸端子8aの刃の断面形状が直角三角形ではなくても、刃先以外の角度が直角に近い(80°〜100°)三角形であれば良い。
(4)LED実装基板側の凹凸端子の刃先端形状:
LED実装基板1側の凹凸端子2aの刃先端の形状が図10(a)に示すように鋭角であったり、図10(b)に示すように鈍角(80°〜100°)である場合においても、両凹凸端子2a,8a同士の電気的接合は接点P,Q又は接点Rにおいて維持される。
By the way, the cross-sectional shape of each of the concave and convex terminals 8a and 2a formed on the electrode 8 of the coupler 5 and the wiring pattern 2 on the LED mounting substrate 1 side is desirable, but it is inevitable that an error occurs in the manufacturing process. Therefore, it is expected that micro deformation as shown in FIGS. However, since pressure due to elasticity acts on the electrode 8 on the coupler 5 side in the direction of the LED mounting substrate 1, both the following deformations (1) to (4) may occur. The electrical connection between the uneven terminals 2a and 8a is maintained.
(1) Spacing between the concave and convex terminals on the LED mounting board side:
Even when the gap between the concave and convex terminals 2a on the LED mounting substrate 1 side is small as shown in FIG. 7 (a) or large as shown in FIG. 7 (b), both the concave and convex terminals 2a and 8a are illustrated. Maintained at contact H or contact I. Since there are a plurality of intervals between the blades of the concave / convex terminals 8a on the coupler 5 side and the blades of the concave / convex terminals 2a on the LED mounting substrate 1 side, the relative positions of the engagement of the concave / convex terminals 2a and 8a are shifted to the left and right. However, even in such a case, the contact is still H or I, and the electrical connection between the two concave and convex terminals 2a and 8a is maintained.
(2) Blade size of the concave and convex terminal on the coupler side:
When the size of the blade of the terminal 8a on the coupler 5 side is small as shown in FIG. 8A or large as shown in FIG. Alternatively, it is maintained at the contact K. Here, the size of the blade of the concavo-convex terminal 8a refers to the length of the short side of a right triangle. The angle of the edge of the blade slightly changes as the length of the short side of the right triangle changes. There is no problem because there is no change.
(3) Shape of the concave and convex terminal blade on the coupler side:
When the shape of the blade of the concavo-convex terminal 8a on the coupler 5 side is an acute triangle as shown in FIG. 9A or an obtuse triangle as shown in FIG. The concavo-convex terminals 2a and 8a are maintained in electrical connection. In addition, even if the cross-sectional shape of the blade of the concave-convex terminal 8a on the coupler 5 side is not a right-angled triangle, the angle other than the blade edge may be a triangle that is close to a right angle (80 ° to 100 °).
(4) Blade tip shape of uneven terminal on LED mounting substrate side:
In the case where the shape of the blade tip of the concavo-convex terminal 2a on the LED mounting substrate 1 side is an acute angle as shown in FIG. 10 (a) or an obtuse angle (80 ° to 100 °) as shown in FIG. 10 (b). However, the electrical connection between the two concave and convex terminals 2a and 8a is maintained at the contacts P and Q or the contacts R.

次に、LED実装基板1とカプラ5の接合構造について説明する。   Next, the junction structure between the LED mounting substrate 1 and the coupler 5 will be described.

LED実装基板1とカプラ5は、以下に示す(1)〜(3)の3種類の構造によって固定されて信頼性の高い接合が可能である。
(1)凹凸端子の噛み合わせ構造:
LED実装基板1側の凹凸端子2aとカプラ5側の凹凸端子8aの噛み合わせ構造によって、カプラ5の圧入方向とは逆方向の引力に強いという利点がある。又、凹凸端子2a,8aがそれぞれ多数存在することによって多数の電気的接点が確保される。
(2)摩擦熱によるAuの拡散接合:
LED実装基板1をカプラ5に圧入すると、カプラ5内部の電極8の凹凸端子8aの凹凸によってLED実装基板1の配線パターン2とカプラ5内部の電極8の酸化皮膜が破壊され、カプラ5内部の電極8のAuメッキとLED実装基板1の配線パターン2のAuメッキの拡散接合が容易になされる。つまり、LED実装基板1にカプラ5を圧入する際、カプラ5内の電極8とLED実装基板1との間に圧力が発生し、これによって摩擦熱が発生する。ここで、カプラ5内での電極8とLED実装基板1上の配線パターン2にはAuメッキが施されているためにAuの拡散接合がなされる。
The LED mounting substrate 1 and the coupler 5 are fixed by the following three types of structures (1) to (3) and can be bonded with high reliability.
(1) Engaging structure of uneven terminal:
The engagement structure of the concave / convex terminal 2a on the LED mounting substrate 1 side and the concave / convex terminal 8a on the coupler 5 side has an advantage of being strong in attractive force in the direction opposite to the press-fitting direction of the coupler 5. In addition, since there are a large number of concave and convex terminals 2a and 8a, a large number of electrical contacts are secured.
(2) Au diffusion bonding by frictional heat:
When the LED mounting substrate 1 is press-fitted into the coupler 5, the unevenness of the uneven terminal 8 a of the electrode 8 inside the coupler 5 destroys the wiring pattern 2 of the LED mounting substrate 1 and the oxide film of the electrode 8 inside the coupler 5. Diffusion bonding between the Au plating of the electrode 8 and the Au plating of the wiring pattern 2 of the LED mounting substrate 1 is easily performed. That is, when the coupler 5 is press-fitted into the LED mounting board 1, pressure is generated between the electrode 8 in the coupler 5 and the LED mounting board 1, thereby generating frictional heat. Here, since the electrode 8 in the coupler 5 and the wiring pattern 2 on the LED mounting substrate 1 are plated with Au, diffusion bonding of Au is performed.

又、カプラ5側の電極8とLED実装基板1側の配線パターン2には、凹凸端子8a,2aの弾性によって常に圧力が掛かっており、この圧力によってカプラ5が確実に固定されるとともに、Auの拡散接合が促進される。   In addition, pressure is always applied to the electrode 8 on the coupler 5 side and the wiring pattern 2 on the LED mounting substrate 1 side by the elasticity of the concave and convex terminals 8a and 2a. Diffusion bonding is promoted.

更に、カプラ5をLED実装基板1に圧入した後に熱履歴を掛けることも効果的である。熱履歴は、長い程拡散接合が進行するが、長過ぎるとLED3の劣化が進行するため、熱履歴温度の上限は約150℃程度で時間は数時間程度が最適である。Auの拡散接合は、Au単体同士の接合であるために熱による接合性の低下が抑えられ、高温環境下やLED3の駆動時の熱が掛かっていることによってAuの拡散が進行し、カプラ5の一層強固な固定が可能になる。又、Auは非常に柔らかい特性を有しているため、ヒートショック等によるクラックの発生が抑えられる。
(3)ネジ止めによる固定:
LED給電部の接合を一層強固にするため、カプラ5をネジ止めによってLED実装基板1に固定する。カプラ5内部の電極8に凹凸端子8aを形成することによってAuの拡散接合を容易に行うことができ、点状ではない電気的に接続がなされる。本実施の形態では、電気的接続部と給電部固定部を別に設けることによって、接点不良やカプラ5の脱落等の不具合の発生を防ぐことができ、信頼性の高い給電部を構成することができる。尚、本実施の形態では、カプラ5をネジ6で固定する構成を採用したが、カプラ5内部の電極8とLED実装基板1との接合だけでカプラ5を固定することができれば、ネジ6による固定は必ずしも必要ではない。
It is also effective to apply a thermal history after press-fitting the coupler 5 into the LED mounting substrate 1. The longer the thermal history, the more the diffusion bonding proceeds. However, when the thermal history is too long, the deterioration of the LED 3 progresses. Therefore, the upper limit of the thermal history temperature is about 150 ° C., and the optimum time is about several hours. Since Au diffusion bonding is a single Au bonding, deterioration of the bonding property due to heat is suppressed, and the diffusion of Au proceeds due to the application of heat in a high temperature environment or when the LED 3 is driven. Can be more firmly fixed. Moreover, since Au has very soft characteristics, the occurrence of cracks due to heat shock or the like can be suppressed.
(3) Fixing with screws:
The coupler 5 is fixed to the LED mounting substrate 1 by screwing in order to further strengthen the bonding of the LED power feeding unit. By forming the concavo-convex terminal 8a on the electrode 8 inside the coupler 5, diffusion bonding of Au can be easily performed, and a non-dot-like electrical connection is made. In the present embodiment, by separately providing the electrical connection portion and the power supply portion fixing portion, it is possible to prevent the occurrence of problems such as contact failure and dropout of the coupler 5, and to configure a highly reliable power supply portion. it can. In this embodiment, the configuration in which the coupler 5 is fixed with the screw 6 is adopted. However, if the coupler 5 can be fixed only by joining the electrode 8 inside the coupler 5 and the LED mounting substrate 1, the screw 6 is used. Fixing is not always necessary.

ここで、LED実装基板1のカプラ5への圧入方法を図11に示す。   Here, a method of press-fitting the LED mounting substrate 1 into the coupler 5 is shown in FIG.

LED実装基板1を圧入する前は、図11(a)に示すように、LED実装基板1の凹凸1aと配線パターン2の凹凸端子2aをカプラ5側の電極8に形成された凹凸端子8aとを接触させ、この状態を維持したままLED実装基板1をカプラ5に対して図示矢印方向に圧入すると、カプラ5側の電極8の凹凸端子8aが図示矢印にて示すように上下に変移して広がるため、LED実装基板1を図11(b)に示すように電極8(カプラ5)に容易に圧入することができる。   Before press-fitting the LED mounting substrate 1, as shown in FIG. 11A, the unevenness 1 a of the LED mounting substrate 1 and the unevenness terminal 2 a of the wiring pattern 2 are formed on the electrode 8 on the coupler 5 side. When the LED mounting substrate 1 is press-fitted into the coupler 5 in the direction indicated by the arrow while maintaining this state, the concave / convex terminal 8a of the electrode 8 on the coupler 5 side changes up and down as indicated by the arrow shown in the figure. Since it spreads, the LED mounting substrate 1 can be easily press-fitted into the electrode 8 (coupler 5) as shown in FIG.

このような圧入方法の利点としては、両凹凸端子2a(凹凸1a),8a同士が正しく噛み合っているときには、接触音を聞いたり、凹凸端子2a(凹凸1a),8a同士の接触を皮膚感覚で感じ取ったりすることができるため、正しい接続がなされたか否かを容易に認識することができる点が挙げられる。   As an advantage of such a press-fitting method, when both the concavo-convex terminals 2a (concave / convex 1a) and 8a are properly meshed with each other, a contact sound is heard, or contact between the concavo-convex terminals 2a (concave / convex 1a) and 8a can be sensed by skin. Since it can be felt, it can be easily recognized whether or not a correct connection has been made.

<実施の形態2>
次に、本発明の実施の形態2を図12〜図14に基づいて説明する。
<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS.

図12は本発明の実施の形態2に係るLED給電部の接合構造を示す平面図、図13は図12のD−D線断面図、図14は図12のE−E線断面図であり、これらの図においては図1〜図6において示したものと同一要素には同一符号を付しており、以下、それらについての再度の説明は省略する。   12 is a plan view showing the junction structure of the LED power feeding section according to Embodiment 2 of the present invention, FIG. 13 is a sectional view taken along the line DD in FIG. 12, and FIG. 14 is a sectional view taken along the line EE in FIG. In these drawings, the same elements as those shown in FIGS. 1 to 6 are denoted by the same reference numerals, and repetitive description thereof will be omitted below.

本実施の形態は、上下両面に断面直角三角形の凹凸端子9aが形成された電極9を耐熱樹脂製の固定部材10によってLED実装基板1の配線パターン2の凹凸端子2aとの間には挟み込んでLED給電部を構成したことを特徴としている。   In the present embodiment, the electrode 9 having the concavo-convex terminals 9a having right-and-left triangular cross sections formed on the upper and lower surfaces is sandwiched between the concavo-convex terminals 2a of the wiring pattern 2 of the LED mounting substrate 1 by the fixing member 10 made of heat-resistant resin. It is characterized in that an LED power feeding unit is configured.

上記固定部材10は、導電性を有さない耐熱性の高いPPS、ポリカーボネート、カプトン素材、アルミナ、AlN等の樹脂材料又はセラミック素材で構成されており、その下面には電極9に形成された凹凸端子9aに噛み合う断面長方形の複数の凹凸10aが形成されている。又、電極9の材質には、りん青銅や黄銅等のCu合金が使用されるが、Cu合金以外にも、他の元素を添加することによって高温時の弾性劣化を防ぐことができる材質を使用することができる。   The fixing member 10 is made of resin material or ceramic material such as PPS, polycarbonate, kapton material, alumina, AlN, etc., which has no electrical conductivity, and has unevenness formed on the electrode 9 on its lower surface. A plurality of projections and depressions 10a having a rectangular cross section that engage with the terminals 9a are formed. The material of the electrode 9 is a Cu alloy such as phosphor bronze or brass, but besides the Cu alloy, a material that can prevent elastic deterioration at high temperatures by adding other elements is used. can do.

而して、固定部材10は、その両端に挿通するネジ11によってLED実装基板1に固定され、LED実装基板1の配線パターンとの間に電極9を挟み込んでこれを固定する。このとき、電極9の上下面に形成された凹凸端子9aは、固定部材10に形成された凹凸10aと配線パターン2に形成された凹凸端子2aにそれぞれ噛み合っており、これによって電極9と配線パターン2との電気的接合がなされている。   Thus, the fixing member 10 is fixed to the LED mounting board 1 by screws 11 inserted through both ends thereof, and the electrode 9 is sandwiched between the fixing pattern 10 and the wiring pattern of the LED mounting board 1 to fix it. At this time, the concavo-convex terminals 9a formed on the upper and lower surfaces of the electrode 9 are engaged with the concavo-convex terminals 10a formed on the fixing member 10 and the concavo-convex terminals 2a formed on the wiring pattern 2, respectively. 2 is electrically connected.

以上のように、本実施の形態では、ネジ止めされる固定部材10によって電極9がLED実装基板1との間で挟持され、該電極9の凹凸端子9aと配線パターン2の凹凸端子2aとの噛み合いによって電極9と配線パターン2との電気的接合がなされるため、構成が簡易であり、製造時間が短縮されて製造コストが低く抑えられる。   As described above, in the present embodiment, the electrode 9 is sandwiched between the LED mounting substrate 1 by the fixing member 10 to be screwed, and the uneven terminal 9a of the electrode 9 and the uneven terminal 2a of the wiring pattern 2 are Since the electrode 9 and the wiring pattern 2 are electrically joined by the meshing, the configuration is simple, the manufacturing time is shortened, and the manufacturing cost is kept low.

尚、以上の実施の形態では、電極8,9側の凹凸端子8a,9aを断面略直角三角形の刃を複数配列して構成し、配線パターン2側の凹凸端子2aを断面略長方形の刃を複数配列して構成し構成したが、これとは逆に電極8,9側の凹凸端子8a,9aを断面略長方形の刃を複数配列して構成し、配線パターン2側の凹凸端子2aを断面略直角三角形の刃を複数配列して構成しても前記と同様の効果が得られる。   In the above embodiment, the concave and convex terminals 8a and 9a on the electrodes 8 and 9 side are configured by arranging a plurality of blades having a substantially right-angled triangle cross section, and the concave and convex terminals 2a on the wiring pattern 2 side are formed with a blade having a substantially rectangular cross section. Contrary to this, the concave and convex terminals 8a and 9a on the electrodes 8 and 9 side are configured by arranging a plurality of substantially rectangular blades and the concave and convex terminals 2a on the wiring pattern 2 side are cross-sectioned. Even if a plurality of substantially right triangle blades are arranged, the same effect as described above can be obtained.

本発明は、バックライト用LED、車両灯具用LED、照明用LED等、任意の用途に供されるLEDの給電部接合構造に対して適用可能である。   The present invention can be applied to a power feeding portion joining structure of an LED provided for an arbitrary use, such as a backlight LED, a vehicle lamp LED, and an illumination LED.

本発明の実施の形態1に係るLED給電部の接合構造を示す斜視図である。It is a perspective view which shows the junction structure of the LED electric power feeding part which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係るLED給電部の接合構造を示す分解斜視図である。It is a disassembled perspective view which shows the joining structure of the LED electric power feeding part which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係るLED給電部の接合構造を示す平面図である。It is a top view which shows the junction structure of the LED electric power feeding part which concerns on Embodiment 1 of this invention. 図3のA−A線断面図である。FIG. 4 is a sectional view taken along line AA in FIG. 3. 図4のB部拡大詳細図である。It is the B section enlarged detail drawing of FIG. 図3のC−C線断面図である。It is CC sectional view taken on the line of FIG. (a),(b)はLED実装基板側の凹凸端子の刃の間隔の違いによるLED実装基板側とカプラ側の凹凸端子同士の接触状態を示す図である。(A), (b) is a figure which shows the contact state of the uneven | corrugated terminal of the LED mounting board | substrate side and coupler side by the difference in the space | interval of the blade of the uneven | corrugated terminal on the LED mounting board | substrate side. (a),(b)はカプラ側の凹凸端子の刃の大きさの違いによるLED実装基板側とカプラ側の凹凸端子同士の接触状態を示す図である。(A), (b) is a figure which shows the contact state of the LED mounting substrate side and the uneven terminal of a coupler side by the difference in the magnitude | size of the blade of the uneven terminal of a coupler side. (a),(b)はカプラ側の凹凸端子の刃の形状の違いによるLED実装基板側とカプラ側の凹凸端子同士の接触状態を示す図である。(A), (b) is a figure which shows the contact state of the uneven | corrugated terminal of the LED mounting board side and coupler side by the difference in the shape of the blade of the uneven | corrugated terminal on the coupler side. (a),(b)はLED実装基板側の凹凸端子の刃先端形状の違いによるLED実装基板側とカプラ側の凹凸端子同士の接触状態を示す図である。(A), (b) is a figure which shows the contact state of the uneven | corrugated terminal of the LED mounting board | substrate side and coupler side by the difference in the blade tip shape of the uneven | corrugated terminal of the LED mounting board | substrate side. (a),(b)はLED実装基板のカプラへの圧入方法を示す部分断面図である。(A), (b) is a fragmentary sectional view which shows the press injection method to the coupler of a LED mounting board. 本発明の実施の形態2に係るLED給電部の接合構造を示す平面図である。It is a top view which shows the joining structure of the LED electric power feeding part which concerns on Embodiment 2 of this invention. 図12のD−D線断面図である。It is the DD sectional view taken on the line of FIG. 図12のE−E線断面図である。It is the EE sectional view taken on the line of FIG.

符号の説明Explanation of symbols

1 LED実装基板
1A LED実装基板のCu層
1B LED実装基板の絶縁層
1a LED実装基板の凹凸
2 配線パターン
2a 配線パターンの凹凸端子
3 LED
4 熱伝導性接着剤
5 カプラ
5a カプラのブラケット
6 ネジ
7 Auワイヤー(Alウェッジ)
8,9 電極
8a,9a 電極の凹凸端子
10 固定部材
10a 固定部材の凹凸
11 ネジ
DESCRIPTION OF SYMBOLS 1 LED mounting substrate 1A Cu layer of LED mounting substrate 1B Insulating layer of LED mounting substrate 1a Concavity and convexity of LED mounting substrate 2 Wiring pattern 2a Concavity and convexity terminal of wiring pattern 3 LED
4 Thermal conductive adhesive 5 Coupler 5a Coupler bracket 6 Screw 7 Au wire (Al wedge)
8,9 electrode 8a, 9a electrode uneven terminal 10 fixing member 10a fixing member uneven 11 screw

Claims (5)

LEDが実装されたLED実装基板の絶縁層上に形成された配線パターンを前記LED実装基板の端部まで延ばし、電源に連なる電極と前記配線パターンとを電気的に接合するLED給電部の接合構造において、
前記電極又は前記配線パターンの一方に、断面略直角三角形の刃をその短辺と平行な方向に複数配列して成る凹凸端子を形成し、他方に、断面略長方形の刃を複数配列して成る凹凸端子を形成し、両凹凸端子同士を噛み合わせることによって前記電極と前記配線パターンとを電気的に接合することを特徴とするLED給電部の接合構造。
A connection structure of an LED power feeding portion that extends a wiring pattern formed on an insulating layer of an LED mounting substrate on which an LED is mounted to an end portion of the LED mounting substrate and electrically connects an electrode connected to a power source and the wiring pattern. In
One of the electrodes or the wiring pattern is formed with a concavo-convex terminal formed by arranging a plurality of substantially right-angled triangular blades in a direction parallel to the short side, and the other is formed by arranging a plurality of substantially rectangular blades. A joining structure of an LED power feeding part, wherein an uneven terminal is formed and the electrode and the wiring pattern are electrically joined by engaging both the uneven terminals.
前記電極と前記配線パターンの表面にAuメッキを施したことを特徴とする請求項1記載のLED給電部の接合構造。
The bonding structure of the LED power feeding unit according to claim 1, wherein Au plating is applied to surfaces of the electrodes and the wiring pattern.
前記電極を非導電性の耐熱性樹脂で構成されたカプラの内部に配置し、該カプラを前記電極と共に前記LED実装基板に圧入することによって前記電極と前記配線パターンとを電気的に接合することを特徴とする請求項1又は2記載のLED給電部の接合構造。   The electrode is disposed inside a coupler made of a non-conductive heat-resistant resin, and the electrode and the wiring pattern are electrically joined by press-fitting the coupler together with the electrode into the LED mounting board. The junction structure of the LED power feeding part according to claim 1 or 2. 前記カプラを前記LED実装基板にネジ止めによって固定することを特徴とする請求項3記載のLED給電部の接合構造。   4. The LED power feeding portion joining structure according to claim 3, wherein the coupler is fixed to the LED mounting board by screws. 前記LED実装基板にネジ止めされる固定部材によって前記電極を前記LED実装基板との間で挟持することによって前記電極と前記配線パターンとを電気的に接合することを特徴とする請求項1又は2記載のLED給電部の接合構造。   3. The electrode and the wiring pattern are electrically joined by sandwiching the electrode with the LED mounting substrate by a fixing member screwed to the LED mounting substrate. The junction structure of the LED power feeding portion described.
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