JP5208722B2 - Electronic component feeder - Google Patents

Description

  The present invention picks up an electronic component with a nozzle provided in the mounting head, then moves the nozzle to a corresponding position on the substrate, and mounts the picked-up electronic component in the longitudinal direction. The present invention relates to an electronic component supply apparatus that arranges components, sequentially feeds an electronic component supply tape covered with a cover tape, and supplies an electronic component picked up by a nozzle. In particular, it should remain on the bottom tape even after the cover tape is peeled off. However, the electronic parts attached to the peeled cover tape are reliably separated with a relatively simple structure, thereby preventing malfunction and damage of the mechanism section that handles the peeled cover tape afterwards. It is related with the electronic component supply apparatus which can do.

  FIG. 1 is a perspective view of a conventional electronic component mounting apparatus.

  As shown in FIG. 1, the electronic component mounting apparatus 1 is transported by a circuit board transport path 6 that extends in the left-right direction slightly behind the center, and is positioned on the circuit board 5 that is positioned on the lower side of the figure. A mounting head 3 for picking up and mounting an electronic component 7 (FIGS. 3 and 5 to be described later) supplied from an electronic component supply device 45 such as a tape feeder arranged in FIG. An X-axis moving mechanism 7X and a Y-axis moving mechanism 7Y that move in the X direction and the Y direction indicated by the middle arrows are provided. Here, the Y-axis moving mechanism 7Y moves the mounting head 3 integrated with the X-axis moving mechanism 7X in the Y-axis direction.

  Note that the above pickup by the nozzle 4 is not specifically limited, and may be, for example, suction by a vacuum pressure. However, in the following description, it is assumed that the nozzle 4 is the suction nozzle 4 and the suction nozzle 4 sucks the electronic component P by vacuum pressure.

  Next, the mounting head 3 includes a Z-axis moving mechanism that moves the suction nozzle 4 so as to be movable up and down in the Z-axis direction, and rotates the suction nozzle 4 about the nozzle axis (suction axis). It has a mechanism.

  Further, a substrate recognition device 8 for imaging the circuit board 5 from above is attached to the mounting head 3 via a support member. The board recognition device 8 picks up and recognizes a board mark formed on the circuit board 5 and an origin mark based on the origin of the mounting head from above. The mounting head unit origin reference is provided in the electronic component mounting apparatus 1 within a range where the mounting head 3 can be moved and imaged by the board recognition device 8.

  In addition, a component recognition camera 9 is arranged on the side of the electronic component supply device 45 so that the mounting head 3 is moved upward and the electronic component 7 sucked by the suction nozzle 4 is imaged and recognized from below. .

  FIG. 2 is a side view showing an outline of a conventional electronic component supply apparatus 45. FIG. 3 is a top view of the electronic component supply tape T used in the electronic component supply device 45. 4 is an enlarged side view of the vicinity of the suction opening 20 in FIG. 2, and FIG. 5 is a side view of the vicinity of the suction opening 20 further enlarged.

  As shown in FIG. 1, a plurality of electronic component supply devices 45 shown in FIG. 2 are arranged side by side on the right front side of the electronic component mounting device 1. Further, as shown in FIG. 3, the electronic component supply tape T wound around the tape reel 40 of FIG. 2 is provided with a tape feed hole H for meshing the sprocket teeth and feeding it at a predetermined pitch. The electronic parts P are arranged and stored in the longitudinal direction. A cover tape C is attached to such an electronic component supply tape T so that the stored electronic component P does not fall off, and the cover tape C covers the electronic component P.

  In the electronic component mounting apparatus 1 as described above, after the electronic component is sucked by the suction nozzle 4 provided in the mounting head 3, the suction nozzle is moved to a corresponding position on the substrate, and the sucked electronic component is mounted. Further, the electronic component supply device 45 supplies the electronic component P attracted by the suction nozzle 4 by sequentially feeding out the electronic component supply tape T.

  3 and 5, the electronic component P is illustrated by ■, and in FIG. 5, the corresponding part of the electronic component supply tape T after the electronic component P is removed by suction is illustrated by a symbol NP. Has been.

  As shown in FIG. 2, the electronic component supply tape T is fed out from the tape reel 40 in the direction of arrow A <b> 3 by the driving force inside the electronic component supply device 45 and pulled into the electronic component supply device 45. As shown in FIGS. 4 and 5, the electronic component P exposed by peeling the cover tape C is sucked by the suction nozzle provided in the mounting head portion of the electronic component mounting apparatus in the suction opening 20. After the suction, the electronic component mounting apparatus moves the suction nozzle to a corresponding position on the substrate and mounts the sucked electronic component P. The suction opening 20 is also referred to as a suction position or a pickup position.

  On the other hand, as shown in FIGS. 4 and 5, the extremely thin cover tape C after peeling is collected in the electronic component supply device 45 in the direction of arrow A5. Further, the electronic component supply tape T from which the cover tape C is removed is a relatively bulky bottom tape B (FIG. 5), which is guided in the direction of the arrow A4, and as shown in FIG. 45 is sent out to the cutter 41.

  The cutter 41 includes a pair of fixed blades 46 and a blade 43 movable by a drive source such as a cylinder as indicated by an arrow A2, so that the movable blade 43 is in the tape cutting direction (left direction in the figure). The taken electronic component supply tape T is cut by moving to. The electronic component supply tape T is cut into a length that can be easily processed as waste material by the cutter 41, and becomes a cutting tape B 'in the drawing.

  Here, Patent Documents 1 to 3 disclose various techniques for handling the cover tape C that peels from the bottom tape as described above.

  First, in patent document 1, the peripheral surface which formed the knurled surface opposes, and it peels from a bottom tape by transmitting strong rotational force to the cover tape C by the rotors 44 and 45 which rotate while pinching the cover tape C. The cover tape C to be removed is surely peeled off. The cover tape C is a thin and slippery plastic material. By forming a knurled surface on the peripheral surfaces of the rotors 44 and 45 sandwiching the cover tape C, a strong tension for peeling can be obtained.

  Further, in Patent Document 2, the cover tape C is sandwiched between the meshing portions of the drive gear 8 and the driven gear 12 to obtain a strong tension for peeling. Further, the guide 13 prevents the cover tape C from being wound around the drive gear 8 and the driven gear 12, and guides the cover tape C to the storage portion 14.

  In Patent Document 3, a guide rail 3 provided with a guide support portion is provided so that a tape having a short tape length for small-scale production or trial production can be used, and an electronic component does not pop out when the cover tape is peeled off. The lid 5 is provided.

  Here, in FIG. 5, after peeling the cover tape C from the bottom tape B, the electronic component P may stick to the peeled cover tape C where it should originally be on the bottom tape. For example, like the electronic component P1 and electronic component P2 of FIG. 11 described later, the jumped electronic component rides on the upper surface of the cover tape C (electronic component P1), and the very small electronic component P is applied to the cover tape C. It may stick (electron component P2) due to static electricity or the like. Conventionally, a technique for processing the electronic component P attached to the cover tape C has not been disclosed.

  In Patent Document 4, the dirt on the transfer roller 15 is removed by the scraping roller 16. Patent Document 5 discloses a technique including a scraping roller 29 for appropriately storing a paper sheet to be carried in a paper sheet stacking mechanism.

Japanese Patent No. 3173206 (FIG. 3) JP 2004-327898 A (FIG. 2) Japanese Patent Laid-Open No. 11-68382 (FIG. 1) Japanese Patent Laid-Open No. 61-173443 (FIG. 2) JP-A-11-68382 (FIG. 1)

  However, as described above, when the electronic component P is attached to the peeled cover tape C, in the case of Patent Document 1, the attached electronic component forms the knurled surface of the rotors 44 and 45 described above. As a result, the rotors 44 and 45 may malfunction or be damaged. In the case of Patent Document 2, the electronic parts stuck in this way are sandwiched together with the cover tape C in the meshing portion of the drive gear 8 and the driven gear 12, and the operation of the drive gear 8 and the driven gear 12 is performed. May cause defects or damage. Furthermore, in both Patent Document 1 and Patent Document 2, there is a risk of malfunction or damage of other parts due to the stuck electronic components.

  Moreover, the above-mentioned Patent Document 4 and Patent Document 5 cannot handle an electronic component attached to the cover tape C as in the present invention. Also, in the above-mentioned Patent Document 3, the lid 5 is provided to prevent the electronic component from popping out. Therefore, it does not prevent the electronic component from adhering to the cover tape C.

  The present invention has been made to solve the above-described conventional problems, and the electronic components attached to the peeled cover tape are relatively simple structures where the cover tape should remain as it is after the cover tape is peeled off. Therefore, it is an object to provide an electronic component supply device that can reliably prevent malfunction and damage of a mechanism unit that can be surely separated and thereby handle a peeled cover tape.

  The present invention picks up an electronic component with a nozzle provided in the mounting head, then moves the nozzle to a corresponding position on the substrate, and mounts the picked-up electronic component in the longitudinal direction. In an electronic component supply device for supplying electronic components that are arranged and covered with a cover tape, and supplying electronic components to be picked up by a nozzle, the cover tape of the electronic component supply tape fed from the tape reel is used as a nozzle. A peeling part that peels off before the pickup position for picking up the electronic component, a cover tape that is peeled off at the peeling part, and a cover tape collecting part that collects the cover tape, and the peeling part and the cover tape collecting part In contact with the surface of the cover tape that is in tension in the air, A tension roller that bends into a square shape, and an arm that holds the tension roller in a rotatable manner and makes the tension roller abut against the cover tape by the stress of an elastic member, thereby stabilizing the tension in the tension state. The above-described problem is solved by forming a concavo-convex shape on the peripheral surface of the tension roller, which is in contact with the surface of the cover tape.

  According to the present invention, the tension of the cover tape C can be stabilized by bringing the tension roller into contact with the cover tape by the stress of the elastic member when the peeled cover tape is pulled in for recovery. The uneven surface of the tension roller can be kept in contact with the cover tape that is in tension in the air with a stable pressing force. This tension roller has an increased frictional force due to the uneven shape, and is driven to rotate according to the movement of the cover tape as it is recovered. it can. Further, the uneven surface of the tension roller can be physically brought into contact with the attached electronic component P. Therefore, the attached electronic components can be reliably separated with a relatively simple structure, and malfunctions and damages such as a mechanism portion that is pulled in to collect the cover tape can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 6 is a schematic perspective view showing a main configuration of an electronic component supply device 45 according to an embodiment to which the present invention is applied. FIG. 7 is an enlarged perspective view around the tensioner 22 of the electronic component supply device 45, and FIG. 8 is a side view thereof. FIG. 9 is a cross-sectional view of the electronic component supply tape T used in the present embodiment.

  The electronic component supply device 45 of the present embodiment can be used in the electronic component mounting device 1 of FIG. 1 described above. When the feed motor (first motor) 10 composed of a stepping motor is rotationally driven, the relay gear 12 is used. Through which the sprocket wheel 14 rotates. By this rotation, an electronic component supply tape T composed of a bottom tape B containing an electronic component P as schematically shown in part in the longitudinal direction in FIG. When the upper tape is sent to the downstream side (right direction) and the cover tape C (not shown in FIGS. 6 and 7) is peeled off at the peeling portion 18, the bottom tape B is further fed to pick up the exposed electronic component P. It can supply to the suction opening 20 for doing.

  Here, as shown in FIG. 9, in the electronic component supply tape T, the electronic component P is housed in the recess of the bottom tape B and covered with the cover tape C. Therefore, even if the cover tape C is peeled from the bottom tape B at the peeling portion 18, the electronic component P should remain on the bottom tape B as it is.

  As described above, the bottom tape B is sent to the suction opening 20, while the cover tape C peeled off by the peeling portion 18 is a scraping motor comprising a stepping motor in a state where a predetermined tension is applied by the rear tensioner 22. By driving the (second motor) 24, the scraper gear 28 rotated via the relay gear 26 is further collected in the collection box 30 at the rear. The scraping gear 28 is similar to the configuration of the driving gear 8 and the driven gear 12 in Patent Document 2 described above. The scraping motor (second motor) 24 is used as a driving force and the cover tape C is pulled to collect the recovery box 30. Scratch and collect.

  In the present embodiment, the scraping gear 28, the recovery box 30, and the like constitute the cover tape recovery unit of the present invention.

  Further, between the peeling portion 18 and the collection box 30, the tension roller 22B comes into contact with the surface of the cover tape that is in the tension state in the air, and thereby the cover tape C is convex downward. It is bent in the direction perpendicular to the surface to stabilize the tension in the tension state.

  FIG. 10 is an enlarged view showing the characteristics of the tensioner 22 serving as a feed path for the cover tape C behind the peeling portion 18 in the present embodiment. FIG. 11 is an enlarged view for explaining the shape and action of the tension roller 22B in the tensioner 22. As shown in FIG.

  As shown in these drawings, the tensioner 22 has a fulcrum roller 22A on the base end side of the arm 22D and a rotating shaft on the distal end side of the arm 22D that swings about the central axis of the fulcrum roller 22A. Tension roller 22B provided. Further, the arm 22D is biased downward by a spring 42 (elastic member) through a member 22C that swings about the fulcrum 32, so that the tension roller 22B is indicated by an arrow by the spring 42. It is urged in a downward direction and in a direction to contact the cover tape C.

  The elastic member that urges the tension roller 22B in the direction in which the tension roller 22B is brought into contact with the cover tape C is not limited to the spring 42 as described above. The swing member 22C is also used as a sensor dog as will be described later.

  As shown in the figure, the lower surface of the cover tape C is supported by the fulcrum roller 22A, and the upper surface is urged downward by the tension roller 22B, so that tension is applied.

  Further, in the cover tape C, for example, as shown by reference numerals P1 and P2 in FIG. In the present embodiment, an uneven shape is formed on the peripheral surface of the tension roller 22B that contacts the surface of the cover tape C, as shown in the enlarged view of FIG.

  Therefore, when the scraping motor (second motor) 24 is used as a driving force and the cover tape C is pulled by the scraping gear 28 and the cover tape C is scraped into the collection box 30, the operation of the cover tape C is performed. Following this, the tension roller 22B rotates, and the cover tape C that is in tension in the air vibrates due to the uneven shape of the peripheral surface.

  Then, the electronic component P adhering to the upper surface and the lower surface of the cover tape C falls as indicated by reference numerals P2 and P3 in FIG. 11 due to such vibration and physical contact with the cover tape C. It will be removed from the cover tape C.

  Further, if the tension roller 22B is a conductive member and the static electricity of the cover tape C contacting the peripheral surface of the tension roller 22B is released to the housing of the electronic component supply device and removed (static electricity removal), The electronic component P adhering to the cover tape C is easily removed.

  Therefore, the electronic component P adhering to the cover tape C can be reliably separated by the tensioner 22 having a relatively simple structure, and the operation of the mechanism portion that is pulled in to collect the cover tape, such as the scraping gear 28, is performed. Defects and damage can be prevented in advance.

  In FIG. 11, the concave / convex shape of the tension roller 22B including the length L1 of the concave portion, the length L2 of the convex portion, the height H1 of the convex portion with respect to the concave portion, and the like is an electronic component targeted by the electronic component supply device According to the shape of P, when the target electronic component P adheres to the cover tape C, the shape can be easily removed.

  For example, in the outer shape of the electronic component P, it is assumed that the height is H0 and the size (the length of one side in the case of a rectangle) is approximately L0. Then, as a shape that makes it easy to remove the attached electronic component P, the height H1 of the above-described recess is about 10% (0.1) to about half (0.5) of the height H0 in the experiment of the inventors. . Further, the length L1 and the length L2 of the recesses can be about 10% (0.1) to half (0.5) of the length L0. At least the length L1 and the length L2 need to be shorter than the length L0.

  A tension sensor 32 made of a photocoupler is disposed below the tensioner 22, and the tension of the cover tape C depends on whether or not the sensor dog 22C attached to the tensioner 22 by the sensor 32 shields the photocoupler. Large and small are to be detected. Furthermore, the electronic component supply device 45 of the present embodiment is provided with a control device 50, and various control operations of the electronic component supply device 45 are executed by the control device 50.

  For example, the control device 50 rotates the scraping gear 28 so that the tension of the cover tape C with which the tension roller 22B abuts becomes a predetermined strength according to the magnitude of the tension of the cover tape C detected by the photocoupler. Electronically control operations and others.

  For example, when the tension is weakened and the tension roller 22B is raised in FIG. 9 and the arm 22D is moved in the direction opposite to the arrow A8 in the drawing, the movement is detected by the sensor dog 22C and the photocoupler. First, the rotation operation of the scraping gear 28 is controlled so as to start or speed up.

  Such control of the tension of the cover tape C may be performed by a mechanical mechanism.

  In addition, although the electronic component supply apparatus 45 demonstrated above is an electric tape feeder provided with the feed motor 10, this invention is not limited to such a thing. For example, the present invention can be applied to a mechanical tape feeder using a knock pin hit from the electronic component mounting apparatus 1 side as a power source.

A perspective view of a conventional electronic component mounting apparatus Side view showing outline of conventional electronic component supply apparatus Top view of electronic component supply tape T used in the electronic component supply apparatus The side view which expanded the adsorption position of the electronic parts supply device Side view further enlarging the suction position The schematic perspective view which shows the principal part structure of the electronic component supply apparatus which is embodiment which this invention was applied to The perspective view expanded centering on the tensioner of the said electronic component supply apparatus Side view enlarged around the tensioner Sectional drawing of the electronic component supply tape used for the said embodiment In the said embodiment, the enlarged view which shows the characteristic of the tensioner used as the feed path of the cover tape behind a peeling part. Enlarged view explaining the shape and action of the tension roller in the tensioner

Explanation of symbols

T ... Electronic component supply tape C ... Cover tape B ... Bottom tape 1 ... Electronic component mounting device 3 ... Mounting head 4 ... Suction nozzle 18 ... Peeling part 20 ... Suction opening 22 ... Tensioner 22A ... Supporting roller 22B ... Tension roller 22C ... Swing member 22D ... Arm 28 ... Scraping gear 40 ... Tape reel 42 ... Spring 45 ... Electronic component supply device

Claims (1)

An electronic component is arranged in the longitudinal direction, which is used in an electronic component mounting apparatus that picks up an electronic component with a nozzle provided in the mounting head and then moves the nozzle to a corresponding position on the substrate to mount the picked-up electronic component. In the electronic component supply device that sequentially feeds the electronic component supply tape covered with the cover tape and supplies the electronic component picked up by the nozzle,
A peeling part that peels the cover tape of the electronic component supply tape fed out from the tape reel in front of the pickup position where the nozzle picks up the electronic component;
Pulling the cover tape peeled off at the peeling portion, and collecting the cover tape, a cover tape collecting portion;
A tension roller that abuts against the surface of the cover tape that is in tension in the air between the peeling portion and the cover tape recovery portion, and bends the cover tape into a dogleg shape, and holds the tension roller rotatably. And an arm part that abuts the tension roller against the cover tape by the stress of the elastic member, and a tensioner that stabilizes the tension in the tension state.
Furthermore, the uneven | corrugated shape is formed in the surrounding surface of the said tension roller which contact | abuts the surface of a cover tape, The electronic component supply apparatus characterized by the above-mentioned.

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