JP5192732B2 - 半導体装置及び当該半導体装置を具備するｉｃラベル、ｉｃタグ、ｉｃカード - Google Patents

半導体装置及び当該半導体装置を具備するｉｃラベル、ｉｃタグ、ｉｃカード Download PDF

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Publication number
JP5192732B2
JP5192732B2 JP2007138891A JP2007138891A JP5192732B2 JP 5192732 B2 JP5192732 B2 JP 5192732B2 JP 2007138891 A JP2007138891 A JP 2007138891A JP 2007138891 A JP2007138891 A JP 2007138891A JP 5192732 B2 JP5192732 B2 JP 5192732B2
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circuit
battery
signal
film
antenna
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JP2007138891A
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Japanese (ja)
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JP2008009972A5 (enrdf_load_stackoverflow
JP2008009972A (ja
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潤 小山
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Electroluminescent Light Sources (AREA)
JP2007138891A 2006-05-31 2007-05-25 半導体装置及び当該半導体装置を具備するｉｃラベル、ｉｃタグ、ｉｃカード Expired - Fee Related JP5192732B2 (ja)

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Application Number Priority Date Filing Date Title
JP2007138891A JP5192732B2 (ja) 2006-05-31 2007-05-25 半導体装置及び当該半導体装置を具備するｉｃラベル、ｉｃタグ、ｉｃカード

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006152831 2006-05-31
JP2006152831 2006-05-31
JP2007138891A JP5192732B2 (ja) 2006-05-31 2007-05-25 半導体装置及び当該半導体装置を具備するｉｃラベル、ｉｃタグ、ｉｃカード

Publications (3)

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JP2008009972A JP2008009972A (ja) 2008-01-17
JP2008009972A5 JP2008009972A5 (enrdf_load_stackoverflow) 2010-06-24
JP5192732B2 true JP5192732B2 (ja) 2013-05-08

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009205669A (ja) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
JP5181759B2 (ja) 2008-03-21 2013-04-10 ソニー株式会社 Ｉｃカード
WO2010035848A1 (en) * 2008-09-23 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
MY163862A (en) * 2009-10-30 2017-10-31 Semiconductor Energy Lab Logic circuit and semiconductor device
US9887568B2 (en) * 2010-02-12 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Moving object, wireless power feeding system, and wireless power feeding method
JP2011165997A (ja) * 2010-02-12 2011-08-25 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体装置
JP5899994B2 (ja) * 2012-02-10 2016-04-06 ソニー株式会社 給電装置、受電装置、およびプログラム
US9285848B2 (en) 2012-04-27 2016-03-15 Semiconductor Energy Laboratory Co., Ltd. Power reception control device, power reception device, power transmission and reception system, and electronic device
WO2014147709A1 (ja) 2013-03-18 2014-09-25 富士通株式会社 電子デバイスとその製造方法、及びネットワークシステム
WO2015121771A1 (en) 2014-02-14 2015-08-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP6248779B2 (ja) * 2014-04-18 2017-12-20 富士通セミコンダクター株式会社 電源切り替え回路、半導体集積回路、無線装置、無線システム及び電源切り替え方法
JP6384193B2 (ja) * 2014-08-18 2018-09-05 株式会社ソシオネクスト 無線タグ、無線通信回路及び劣化検出方法
KR101756685B1 (ko) * 2015-01-09 2017-07-12 한국산업기술대학교산학협력단 Ｒｆ 신호 증폭 겸용 축전 장치 및 이를 이용한 시스템
US9935469B2 (en) * 2015-02-10 2018-04-03 Cascade Corporation Wireless power transfer and communications for industrial equipment
CN108711943B (zh) * 2018-07-18 2023-08-15 新疆信息产业有限责任公司 双逻辑电能监测智能分析装置及分析方法
CN112784936A (zh) * 2021-01-06 2021-05-11 王鑫 一种包含rfid的玩具及其制备方法

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