JP5192162B2 - Inorganic material parts - Google Patents

Description

  The present invention relates to an inorganic material. More specifically, the present invention relates to an inorganic material part obtained by filling a through hole and / or a recess formed in an inorganic material substrate with a specific filler and curing it.

  In recent years, with the development of information communication technology and the dramatic improvement in processing speed of information processing devices, the need for transmission of large-capacity data has increased, and technology for obtaining a high-speed communication environment has been expected. In the technology capable of realizing such a high-speed communication environment, as represented by the optical communication technology, remarkably high connection accuracy and position accuracy are required as compared with the conventional technology. Especially in signal transmission paths at relatively short distances, such as between wiring boards in equipment, between semiconductor chips in wiring boards, and within semiconductor chips, it is necessary to obtain high accuracy, and it is excellent in that it can cope with such fields Inorganic material parts capable of obtaining processing accuracy are desired.

As a technique in such a field, the following Patent Document 1 discloses a microhole array in which a cylindrical portion such as an alignment hole is formed of a resin.
Moreover, the following patent documents 2-4 are disclosed as a sealing agent used in order to seal an electronic component, a semiconductor element, etc.

JP 2003-107283 A JP-A-8-53602 Japanese Patent Laid-Open No. 2000-186183 JP 2001-181479 A

  However, the technique of the above-mentioned Patent Document 1 reduces the thermal expansion difference between the ceramic base (main body base) and the cylindrical portion (the part formed by casting a composite material including a resin and an inorganic filler), It depends only on the filler (inorganic filler such as silica). When trying to reduce the difference in thermal expansion using only the inorganic filler, the viscosity of the filler (a composite material containing a resin and an inorganic filler) increases, and the fillability deteriorates excessively. In addition, the elastic modulus of the cured product obtained by curing the filler is increased, the workability of the cured product is lowered, and in machining, there is a problem that wear of a drilling tool such as a drill is accelerated. Furthermore, the problem that it becomes easy to produce a crack also arises.

  On the other hand, Patent Documents 2 to 4 are sealing agents used for the purpose of sealing electronic components, semiconductor elements, and the like. This sealant is normally a solid, is a sealant that is used by filling a mold at a high temperature and molding the mold. For this reason, there is a problem that it is difficult to obtain sufficient filling properties for small notches (through holes and recesses), and that a mold and an apparatus cost are required. Furthermore, no consideration has been given to low thermal expansion corresponding to the ceramic substrate, high-precision workability of the cured body, adhesion to the inorganic material substrate, and the like.

  The present invention has been made in view of the above problems, and provides an inorganic material part including a cured body having excellent filling properties in the state of a filler and having excellent low thermal expansion and workability. Objective.

That is, the present invention is as follows.
(1) having an inorganic material substrate having at least one notch of the through hole and the recess, and a cured body in which at least one of the notches is filled with a filler and cured. Inorganic material parts,
The filler contains a liquid epoxy resin, a curing agent, a compatibilizing agent, an inorganic filler, and an organic filler,
When the entire filler is 100% by mass, the liquid epoxy resin is 1 to 55% by mass,
When the liquid epoxy resin is 100 parts by mass, the curing agent is 2 to 10 parts by mass, the compatibilizer is 0.5 to 20 parts by mass, and the inorganic filler is 100 to 600 parts by mass. Yes, the organic filler is 0.5-30 parts by mass,
The liquid epoxy resin contains a bisphenol type epoxy resin and an aminophenol type epoxy resin,
The curing agent contains a polyamine curing agent,
The compatibilizer contains a silicone oil having a polyether group at the terminal and / or side chain,
The inorganic filler contains silica,
The organic filler contains a silicone filler,
And the particle size distribution of this inorganic filler WHEREIN: The difference of D10 and D50 is 9 micrometers or more, The inorganic material components characterized by the above-mentioned.
(2) The said hardening | curing agent is an inorganic material component as described in said (1) containing dicyandiamide.
(3) The inorganic material part according to (1) or (2), wherein a volume ratio of the inorganic filler to the entire cured body is 45% by volume or more.
(4) When the total of the bisphenol type epoxy resin and the aminophenol type epoxy resin is 100% by mass, the aminophenol type epoxy resin is 30 to 70% by mass. An inorganic material part according to any one of the above.
( 5 ) The inorganic material part according to (1) to ( 4 ), wherein the cured body includes alignment alignment holes formed in a part of the cured body.
( 6 ) The inorganic material component according to any one of (1) to ( 5 ), wherein a filling volume of the notch is 0.75 mm ³ or more.
( 7 ) The difference between the linear thermal expansion coefficient of the cured body and the linear thermal expansion coefficient of the inorganic material substrate is 30 ppm / K or less, and the elastic modulus of the cured body is 1 to 8 GPa. The inorganic material part according to any one of ( 6 ).

  According to the inorganic material component of the present invention, the adhesion between the cured body and the inorganic material substrate and the adhesion durability are excellent. Moreover, it is excellent in workability of the cured body, can be processed with high processing accuracy, and is particularly excellent in drill workability. Furthermore, in the state of the filler before becoming a cured product, excellent filling properties, particularly filling properties that can be filled using a dispenser can be obtained even when a large amount of filler is contained. Therefore, the present invention can be applied to a wide variety of inorganic material substrates without being restricted by the shape and size of the through holes and the recesses. Moreover, an inorganic material component can be manufactured efficiently at low cost using a simple apparatus. Furthermore, air can be prevented from being mixed during filling.

When the compatibilizing agent contains silicone oil, a high amount of filler (particularly inorganic filler) can be contained. Accordingly, the cured body can be reduced in thermal expansion, the difference in thermal expansion from the inorganic material substrate is effectively suppressed, and the adhesion to the inorganic material substrate and the adhesion durability are particularly excellent. Moreover, it is excellent in workability of the hardened | cured body obtained, can be processed with higher accuracy, and is particularly excellent in drill workability. Furthermore, in the state of the filler before becoming a cured product, excellent filling properties can be obtained despite the high filler content.
When the liquid epoxy resin contains a bisphenol type epoxy resin and an aminophenol type epoxy resin, particularly excellent heat resistance (particularly, heat crack resistance between the inorganic material substrate and the cured body) can be exhibited. In addition, particularly excellent filling properties can be obtained with the filler.

  When the compatibilizing agent contains a silicone oil having a polyether group at the terminal and / or side chain, and the liquid epoxy resin contains a bisphenol type epoxy resin and an aminophenol type epoxy resin, a filler (particularly, While maintaining a high content of (inorganic filler), it is possible to maintain a stable dispersion state with the two liquid epoxy resins. Therefore, the cured body can be reduced in thermal expansion while having excellent filling properties, and the difference in thermal expansion from the inorganic material substrate can be effectively suppressed. For this reason, it is particularly excellent in adhesion and adhesion durability between the cured body and the inorganic material substrate. Further, the cured body is excellent in processability and can be processed with particularly high accuracy. In addition, the cured body can exhibit particularly excellent heat resistance (particularly between the ceramic substrate and the cured body and between the LTCC substrate and the cured body).

When the organic filler contains a silicone filler, high crack resistance (particularly, crack resistance between the inorganic material substrate and the cured body) can be obtained. Moreover, it is excellent in the workability of a hardening body, and the crack and crack of a hardening body at the time of processing are prevented. Moreover, high durability can be exhibited against stress due to thermal cycling. Furthermore, an excellent filling property can be obtained with the filler.
When the curing agent contains dicyandiamide, curing shrinkage is suppressed and crack resistance between the inorganic material substrate and the cured body is improved. Moreover, it is excellent in the workability of a hardening body and can prevent the crack and crack of a hardening body at the time of processing.
When the volume ratio of the inorganic filler to the entire cured body is 45% by volume or more, that is, when the inorganic filler is highly contained, the cured body is reduced in thermal expansion while maintaining excellent workability, and thus an inorganic material. The difference in thermal expansion from the substrate is effectively suppressed, and the adhesion and adhesion durability between the inorganic material substrate and the cured body are excellent.
When the cured body includes an alignment matching hole formed in a part thereof, position control with other members can be performed with high accuracy.
When the filling volume of the notch is as large as 0.75 mm ³ or more, the above various advantages can be obtained particularly effectively.
When the difference between the coefficient of linear thermal expansion of the cured product and the coefficient of linear thermal expansion of the inorganic material substrate is 30 ppm / K or less and the modulus of elasticity of the cured product is 1 to 8 GPa, it is excellent in low thermal expansion and workability. It is excellent in adhesion and adhesion durability with an inorganic material substrate, and can be processed with high accuracy.

Hereinafter, the present invention will be described in detail.
[1] Inorganic material parts inorganic material component of the present invention,
An inorganic material part having an inorganic material base having at least one of a through hole and a recess, and a cured body in which at least one of the notches is filled with a filler and cured. Because
The filler contains a liquid epoxy resin, a curing agent, a compatibilizing agent, an inorganic filler, and an organic filler,
When the entire filler is 100% by mass, the liquid epoxy resin is 1 to 55% by mass,
When the liquid epoxy resin is 100 parts by mass, the curing agent is 2 to 10 parts by mass, the compatibilizer is 0.5 to 20 parts by mass, and the inorganic filler is 100 to 600 parts by mass. Yes, the organic filler is 0.5-30 parts by mass,
The liquid epoxy resin contains a bisphenol type epoxy resin and an aminophenol type epoxy resin,
The curing agent contains a polyamine curing agent,
The compatibilizer contains a silicone oil having a polyether group at the terminal and / or side chain,
The inorganic filler contains silica,
The organic filler contains a silicone filler,
The particle size distribution of the inorganic filler is characterized in that the difference between D10 and D50 is 9 μm or more.

  The “inorganic material substrate” is a substrate whose main part is made of an inorganic material. Examples of the inorganic material constituting the inorganic material substrate include ceramic materials, glass ceramic materials (crystallized glass materials), glass materials, and metal materials. Among these, the inorganic material is preferably a ceramic material and / or a glass ceramic material. That is, a ceramic substrate and a glass ceramic substrate are preferable. These substrates are particularly poor in workability, difficult to process with high accuracy after firing, and are particularly easy to obtain the effects of the configuration of the present invention.

  Further, the type of ceramic material constituting the ceramic substrate is not particularly limited. For example, alumina, alumina nitride, silicon nitride, boron nitride, beryllia, mullite, silica (amorphous silica), silicon carbide, mica, wax The last night etc. are mentioned. Examples of the glass ceramic material include low-temperature fired glass ceramics (LTCC). Of these, ceramic materials are preferable, and alumina and alumina nitride are more preferable. These ceramic materials may be used alone or in combination of two or more.

These ceramic materials are excellent in thermal conductivity, and can efficiently dissipate heat generated from various elements (particularly optical elements) and their operation circuits. For this reason, it is possible to obtain a component having excellent operation stability and reliability.
The shape and size of the inorganic material substrate are not particularly limited. Examples of the inorganic material substrate using a ceramic material and / or a glass ceramic material include a wiring substrate (ceramic wiring substrate, ceramic optical waveguide substrate, low-temperature fired glass). Ceramic wiring board, etc.), microhole array block, optical fiber array block, lens array block, connector block and the like.

The “notch” is any one of a through hole and a recess formed in the inorganic material substrate. The shape of this notch is not particularly limited. Further, the size of the notch is not particularly limited, but the characteristics of the cured body are easily obtained when the notch is relatively large. This is because when the filling volume is large as compared with the case where the filling volume is small, the influence of shrinkage at the time of curing, the difference in thermal expansion from the inorganic material substrate, and the elastic modulus is more greatly affected. That is, for example, the filling volume of the notch in the inorganic material part (the same as the volume of the hardened body in the state where it is actually filled regardless of the entire volume of the notch and not subjected to drilling or the like) ) is when 0.75 mm ³ or more (further 0.785~80mm ^3, in particular 1~80mm ^3), in particular easy to obtain the effect of construction of the present invention. In addition, the filling cross-sectional area (opening area of the site | part which performs filling) of a missing part is 0.25-16 mm < ² > (further 0.785-16 mm < ² >) normally.

The “filler” is filled in the notch and cured to form a cured body. Further, it contains a liquid epoxy resin, a curing agent, a compatibilizing agent, an inorganic filler, and an organic filler, and the particle size distribution of the inorganic filler is such that the difference between D10 and D50 is 9 μm or more.
The “liquid epoxy resin” is an epoxy resin that is liquid at least at a temperature of 20 to 30 ° C. In particular, the viscosity at a temperature of 25 ° C. is preferably 25 Pa · s or less (more preferably 20 Pa · s or less, further preferably 15 Pa · s or less, usually 0.01 Pa · s or more). The softening point of the liquid epoxy resin is not particularly limited, but is usually 25 ° C. or lower (more preferably 20 ° C. or lower, more preferably 18 ° C. or lower, usually −30 ° C. or higher).

Examples of the liquid epoxy resin include bisphenol type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, glycidyl ether type epoxy resin, and glycidyl ester type epoxy resin. Among these, bisphenol type epoxy resin and glycidylamine type epoxy resin are used, and aminophenol type epoxy resin is used as the glycidylamine type epoxy resin . These epoxy resins may use only 1 type and may use 2 or more types together.

  Examples of the bisphenol type epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, hydrogenated bisphenol A type resin and the like. These may be used alone or in combination of two or more. Among these, bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferable, and bisphenol A type epoxy resins are particularly preferable. It is excellent in heat resistance and chemical resistance in the cured body, fluidity in the filler and filling in the notch, and as a whole has a very good balance.

An aminophenol type epoxy resin is used as the glycidylamine type epoxy resin. The aminophenol-based epoxy resin has one or more amino groups directly bonded to a benzene ring in the structure, and the hydrogen atom of the amino group is substituted with a substituent having a glycidyl group end, and It is a polyfunctional epoxy resin having a structure having at least two or more glycidyl groups in the whole molecule. This aminophenol type epoxy resin is excellent in heat resistance and chemical resistance in the cured product, fluidity in the filler and filling property in the notch, and as a whole has a very good balance.

These liquid epoxy resins may be used alone or in combination of two or more, but are composed of two or more of the above liquid epoxy resins, and further include bisphenol type epoxy resins and aminophenol type epoxy resins. both rather preferably be contained in the, in the present invention include both the bisphenol type epoxy resin and an amino phenol epoxy resins. By using these two types of epoxy resins in combination, it is possible to obtain high heat resistance in the cured product while having excellent filling properties in the filler. Although the filler content is particularly high, the viscosity can be kept low enough to allow filling with a dispenser as described later.

  When the bisphenol type epoxy resin and the aminophenol type epoxy resin are contained, the total content thereof is 55% in total of the bisphenol type epoxy resin and the aminophenol type epoxy resin when the entire liquid epoxy resin is 100% by mass. % Or more (more preferably 70% by mass or more, still more preferably 80% by mass or more, or 100% by mass). In this range, the balance of heat resistance and chemical resistance in the cured body and fluidity in the filler is excellent.

  Further, when the total of the bisphenol type epoxy resin and the aminophenol type epoxy resin is 100% by mass, the bisphenol type epoxy resin is contained in an amount of 30 to 95% by mass, and the aminophenol type epoxy resin is contained in an amount of 5 to 70% by mass. More preferably, the bisphenol type epoxy resin is contained in an amount of 30 to 70% by mass, and the aminophenol type epoxy resin is more preferably contained in an amount of 30 to 70% by mass. Within these ranges, the advantages obtained by using the bisphenol type epoxy resin and the aminophenol type epoxy resin in combination can be obtained particularly effectively.

  Furthermore, content of the liquid epoxy resin with respect to the whole filler is 1-55 mass% (more preferably 10-40 mass%, still more preferably 15-35 mass%), when the whole filler is 100 mass%. It is. Further, when the total volume of the filler is 100% by volume, it is preferably 5 to 55% by volume, more preferably 20 to 50% by volume, and particularly preferably 25 to 45% by volume. . This is because within this range, appropriate fluidity as a filler can be exhibited, and high reliability can be obtained in the cured product.

The “curing agent” is not particularly limited as long as it can cure the liquid epoxy resin to be used. That is, it may be a polyaddition type curing agent or a catalyst type curing agent. Examples of the polyaddition type curing agent include a polyamine curing agent, an acid anhydride curing agent, a polyphenol curing agent, and an isocyanate curing agent. Examples of the catalyst type curing agent include imidazole type curing agents, tertiary amine type curing agents and Lewis acids. These curing agents may be used alone or in combination of two or more. In the present invention, among these, a polyamine curing agent is contained.

By using a polyamine curing agent, the crack resistance of the resulting cured product can be improved. In particular, the adhesion and adhesion durability between the inorganic material substrate and the cured body can be improved. This advantage can be effectively obtained particularly when a bisphenol type epoxy resin and an aminophenol type epoxy resin are used in combination as a liquid epoxy resin.
Examples of polyamine curing agents include dicyandiamide, diethylenetriamine, triethylenetriamine, metaxylylenediamine, isophoronediamine, diaminodiphenylmethane, phenylenediamine, and dihydrazide. Of these, dicyandiamide is preferred.

When the dicyandiamide is used as a curing agent, the crack resistance of the resulting cured product can be particularly improved. This advantage tends to be obtained effectively when a bisphenol type epoxy resin and an aminophenol type epoxy resin are used in combination. This is probably because when dicyandiamide is used, curing shrinkage of these liquid epoxy resins can be particularly suppressed.
Moreover, when this dicyandiamide is used, the heat resistance and chemical resistance (for example, corrosion resistance with respect to an oxidizing agent, a base, etc.) of a hardening body can be improved. In addition, the lifetime in which the filler can be used stably can be extended. Generally, after mixing an epoxy resin and a curing agent, curing proceeds during storage. For this reason, the lifetime which can be used stably depending on a hardening | curing agent may become short. On the other hand, dicyandiamide is less likely to change with time after mixing in the filler, and tends to have a longer life that can be stably used.

When the total mass of the liquid epoxy resin is 100 parts by mass, the curing agent is 2 to 10 parts by weight (more preferably 3 to 9 parts by weight). Moreover, when the whole filler is 100 mass%, it is preferable to set it as 0.1-5 mass% (more preferably 0.5-5 mass%, still more preferably 1-3 mass%). When the total volume of the filler is 100% by volume, it is preferably 1 to 5% by volume (more preferably 1 to 4% by volume, still more preferably 1 to 3% by volume). If it is this range, the improvement effect of the crack resistance of the hardened | cured material obtained will be especially excellent.
As will be described later, one type or two or more types of curing accelerators can be used in combination with the curing agent.

  The “compatibility agent” is a component capable of increasing the blending amount of fillers (including inorganic fillers and organic fillers, particularly inorganic fillers) while suppressing the thickening of the filler. That is, this filler can contain more fillers (particularly inorganic fillers) by containing a compatibilizing agent than when it does not contain a compatibilizing agent. In particular, the filler content can be greatly increased while the viscosity of the filler is kept low (further, while maintaining a state where filling with a dispenser is possible). Thereby, while being able to make a thermal expansion difference with an inorganic material base | substrate smaller, the outstanding workability can be obtained in a hardening body.

The type of the compatibilizer is not particularly limited, and examples thereof include silicone oil, silane coupling agent, dispersant, diluent, alicyclic epoxy resin, and the like . Among these, silicone oil is used. Furthermore, a silicone oil having a dimethylsiloxane skeleton is more preferable. Although the kind of this silicone oil is not particularly limited, it is usually preferable that it has at least an epoxy group at the molecular end and / or molecular side chain. This is because the resin constituting the filler is mainly composed of a liquid epoxy resin. By containing this silicone oil having an epoxy group, the amount of filler that can be contained in the filler can be increased. The epoxy equivalent of the silicone oil to be used is not particularly limited, but is preferably 500-20000, and more preferably 5000-15000. Furthermore, the viscosity of the silicone oil is not particularly limited, viscosity at 25 ° C. is preferable ^{10~5000mm 2 / s, 500~3500mm 2 /} s is more preferable.

Further, the silicone oil can have a functional group other than the epoxy group. Other functional groups include polyether groups, hydroxyl groups (including alcoholic hydroxyl groups such as R-OH), alkoxyl groups, amino groups, polyglycerin groups, pyrrolidone groups, betaine groups, and carboxyl groups (that is, various types) Hydrophilic group). These functional groups may use only 1 type and may use 2 or more types together. Among these, a polyether group is used in the present invention . By having a polyether group, the reason is not clear, but the compatibility improvement effect when using an aminophenol type epoxy resin as a liquid epoxy resin is excellent. That is, for example, as long as the inorganic filler is included in the bisphenol-type epoxy resin, other compatibilizers can be used, but three types of aminophenol-type epoxy resin, bisphenol-type epoxy resin, and inorganic filler are used. When these are used together, these three types can be compatibilized by using a silicone oil having a polyether group. Furthermore, the dispersion stability of the compatibilizer is particularly excellent when a bisphenol A type epoxy resin and an aminophenol type epoxy resin are used in combination. By being excellent in dispersion stability, it is possible to maintain a state in which the two liquid epoxy resins and the compatibilizing agent are dispersed with each other over a long period of time.

  The kind of the polyether group is not particularly limited as long as it is a functional group having a plurality of ether bonds. Examples of the polyether group include a polyoxyalkylene group (a group having a structure in which an alkylene group is bonded via an ether bond). Furthermore, a polyoxyethylene group, a polyoxyethylene propylene group, a polyoxypropylene group, etc. are mentioned. These functional groups may use only 1 type and may use 2 or more types together.

Furthermore, the content of the compatibilizer, in the case where the content of the liquid epoxy resin is 100 parts by mass, Ri 0.5 to 20 parts by mass der, more preferably 1 to 15 parts by weight, 5 It is especially preferable that it is -13 mass parts. Moreover, when the whole filler is 100 mass%, it is preferable that it is 0.1-5 mass%, It is more preferable that it is 0.4-5 mass%, It is 1-3 mass% Is particularly preferred. Furthermore, when the total volume of the filler is 100% by volume, it is preferably 1 to 5% by volume, more preferably 2 to 5% by volume, and particularly preferably 2 to 4% by volume. . In this range, it is possible to achieve both high filler filling properties and high filler content.

The “inorganic filler” is a filler made of an inorganic substance, and the difference between D10 and D50 in the particle size distribution is 9 μm or more.
Depending on the type and content of the inorganic filler and the type and content of the organic filler described below, the processability of the obtained cured product can be improved. In addition, since the thermal expansion during curing (in the production of inorganic material parts) can be controlled, an inorganic material part having excellent adhesion between the inorganic material substrate and the cured body can be obtained. Moreover, the thermal expansion accompanying the change of the thermal environment at the time of use of a hardening body can be suppressed.

Examples of the inorganic filler include a ceramic filler, a glass ceramic filler, a glass filler, and a metal filler. Among these, a ceramic filler is used in the present invention . This is because the cured product obtained compared to the metal filler can be greatly reduced in thermal expansion, and the thermal expansion coefficient can be easily controlled. Furthermore, it is easy to obtain a filler having a stable shape as compared with a metal filler, which is preferable from the viewpoint of fluidity and filling properties.
In addition, as a metal filler, the filler which consists of copper, silver, an alloy of copper and silver, etc. is mentioned.

Examples of the ceramic filler include silica, alumina, talc, calcium carbonate, and aluminum nitride. Among these, silica and alumina are preferable, and silica is used in the present invention . When silica filler is used, the difference between the coefficient of linear thermal expansion of the obtained cured product and the coefficient of linear thermal expansion of the inorganic material base to be filled can be particularly reduced, and the inorganic generated by the large difference in coefficient of linear thermal expansion. This is because poor adhesion between the material substrate and the cured body can be suppressed. The above-mentioned various ceramic fillers may be used alone or in combination of two or more.
The shape of the inorganic filler is not particularly limited, but is preferably spherical (for example, including a substantially spherical shape such as a rugby ball shape) for the purpose of high filling. By using a spherical inorganic filler, both fluidity and filling property can be improved.

  As described above, the particle size distribution of the inorganic filler is such that the difference between D10 and D50 is 9 μm or more. If this difference is less than 9 μm, the inorganic filler content cannot be achieved even if a compatibilizing agent is contained. In addition, sufficient adhesion and adhesion durability between the inorganic material substrate and the cured body cannot be obtained. The difference between D10 and D50 is preferably 9 to 25 μm, and more preferably 10 to 21 μm. That is, it is preferable that an inorganic filler having a smaller particle diameter is positively contained with respect to D50 (average particle diameter). By using a liquid epoxy resin and a compatibilizing agent in combination, and further including an inorganic filler having a particle size distribution in this range, the content of the inorganic filler in the filler can be particularly increased. For this reason, the obtained hardened | cured material can obtain the high adhesiveness with the inorganic material base | substrate, and the outstanding adhesion | attachment durability, suppressing the thermal expansion difference with an inorganic material base | substrate small. Furthermore, the cured body can obtain excellent processability.

Although the magnitude | size of said each D10 and D50 is not specifically limited, D50 (average particle diameter) is 9-25 micrometers normally, it is preferable that it is 10-17 micrometers, and it is more preferable that it is 11-15 micrometers. Moreover, D10 is 0.1-5 micrometers normally, it is preferable that it is 0.1-4 micrometers, and it is more preferable that it is 0.1-3 micrometers. Furthermore, although D90 is not specifically limited, Usually, it is 25-60 micrometers, it is preferable that it is 30-50 micrometers, and it is more preferable that it is 34-45 micrometers.
In addition, these particle size distributions are based on measured values when measured using a laser diffraction / scattering particle size distribution measuring apparatus (manufactured by Horiba, Ltd., model “LA-750 (500 MODE)”).

The content of the inorganic filler is 100 to 600 parts by mass when the total mass of the liquid epoxy resin is 100 parts by mass. This content is preferably 200 to 600 parts by mass, more preferably 300 to 550 parts by mass, and still more preferably 350 to 500 parts by mass. Further, when the total volume of the filler is 100% by volume, it is preferably 45 to 80% by volume, more preferably 54 to 76% by volume, and particularly preferably 59 to 74% by volume. . Within this range, it is possible to achieve both low thermal expansion and excellent processability in the obtained cured product while preventing excessive thickening of the filler. In addition, the presence or absence of the surface treatment of an inorganic filler is not taken.

The “organic filler” is a filler made of an organic material. Although the organic material which comprises an organic filler is not specifically limited, It is preferable to use silicone from a heat resistant viewpoint especially. That is, it is preferable to use a silicone filler (silicone powder) as the organic filler, and this silicone filler is used in the present invention .
Furthermore, silicone, which is an organic material, includes silicone rubber and silicone resin, and it is particularly preferable to contain silicone rubber as a filler. That is, it is preferable to contain a silicone rubber filler. By containing a silicone rubber filler, the elastic modulus of the obtained cured product can be suppressed to a smaller value than when no silicone rubber filler is contained. Thereby, the shrinkage | contraction at the time of hardening a filler is relieve | moderated, and generation | occurrence | production of the crack between an inorganic material base | substrate and a hardening body can be suppressed remarkably. Furthermore, for example, high durability can be exhibited against heat cycle such as durability against high temperature history such as a reflow process during manufacture and durability against heat cycle during use. Moreover, the workability (particularly machineability by a drill or the like) of the cured body filled in the notch formed in the inorganic material substrate is improved, and particularly high processing accuracy can be obtained.

  Further, the silicone rubber filler is more preferably one whose surface is coated with a silicone resin. This is because, according to the silicone rubber filler whose surface is coated with a silicone resin, it is possible to obtain higher heat resistance while obtaining the effect of reducing the elastic modulus.

While the organic filler can suppress the elastic modulus of the obtained cured body, it tends to increase the linear thermal expansion coefficient of the cured body. Since the filler is used for the notch of the inorganic material part having a small linear thermal expansion coefficient, the cured product is required to have a linear thermal expansion coefficient as small as that of the inorganic material substrate. On the other hand, if the inorganic filler is highly blended, the linear thermal expansion coefficient of the cured body can be further reduced. However, when a high amount of fillers, especially inorganic fillers, is added, the viscosity of the filler increases rapidly, and there is a problem that the liquid and paste cannot be maintained.
On the other hand, in the said filler, filler content can be increased by containing a compatibilizing agent as mentioned above. That is, the inorganic filler can be contained in a high amount, and the effect of low linear thermal expansion by the inorganic filler can be achieved while obtaining the effect of reducing the elastic modulus by the organic filler.

The particle size and particle size distribution of the organic filler are not particularly limited, but D50 (average particle size) is usually 1 to 10 μm, preferably 2 to 8 μm, and more preferably 3 to 5 μm. . Moreover, D10 is 0.1-5 micrometers normally, it is preferable that it is 1-4 micrometers, and it is more preferable that it is 2-4 micrometers. Furthermore, D90 is usually 3 to 11 μm, preferably 4 to 8 μm, and more preferably 5 to 7 μm.
In addition, these particle size distributions are based on measured values when measured using a laser diffraction / scattering particle size distribution measuring apparatus (manufactured by Horiba, Ltd., model “LA-750 (500 MODE)”).

The content of the organic filler is 0.5 to 30 parts by mass when the total mass of the liquid epoxy resin is 100 parts by mass. This content is preferably 1 to 25 parts by mass, more preferably 5 to 25 parts by mass, and even more preferably 7 to 20 parts by mass. Further, when the total volume of the filler is 100% by volume, it is preferably 0.5 to 20% by volume, more preferably 1.5 to 10% by volume, and 2 to 8% by volume. It is particularly preferred. In this range, it is possible to obtain excellent processability of the cured body, excellent adhesion to the inorganic material substrate, and durability thereof while suppressing high thermal expansion.

  Furthermore, the content of the inorganic filler and the organic filler is 55 to 90% by mass (more preferably 60 to 87% by mass) when the total amount of the inorganic filler and the organic filler is 100% by mass. And more preferably 70 to 85% by mass). When the total volume of the filler is 100% by volume, the total amount of the inorganic filler and the organic filler is 50 to 80% by volume (more preferably 55 to 77% by volume, still more preferably 60 to 75% by volume). It is preferable that

The filler may contain other components in addition to the liquid epoxy resin, the curing agent, the compatibilizer, the inorganic filler, and the organic filler. Examples of other components include a curing accelerator, an antifoaming agent, a leveling agent, a thickener, and a dispersing agent. These may use only 1 type and may use 2 or more types together.
Examples of the curing accelerator include urea compounds (aromatic dimethylurea, aliphatic dimethylurea, etc.), tertiary amines (benzylamine, dimethylaminomethylphenol, etc.), tertiary amine salts (of the tertiary amines). Salts), imidazoles (2-ethyl-4-methylimidazole, 1-cyanethyl-2-ethyl-4-methylimidazole, etc.), metabolites of the imidazoles (modification with acrylonitrile, trimellitic acid, dicyandiamide, etc.) Quaternary ammonium salts, phosphines, phosphinium salts, sulfonium salts and the like. Only one type of curing accelerator may be used, or two or more types may be used in combination.

  Of these, urea compounds (particularly latent curing accelerators that start reaction upon heating) are preferred. In particular, when siadiandiamide is used as the curing agent and a urea compound is used as the curing accelerator, the shrinkage of the curing during curing of the filler is suppressed compared to the combination of other curing agents and the curing accelerator. The As a result, the organic filler contained in the filler can be reduced. Therefore, compared with other combinations, the cured body can be further reduced in thermal expansion, and the difference in thermal expansion between the inorganic material substrate and the cured body can be particularly alleviated. Moreover, since the heat resistance of the cured product is further improved as compared with the aliphatic urea compound, the aromatic urea compound is more preferable. Although content of a hardening accelerator is not specifically limited, When the whole filler is 100 mass parts, it is 0.1-7 mass parts (further 0.5-5 mass parts, especially 0.5-2.5. Part by mass).

  Moreover, although the said filler may contain a solvent, it is preferable not to contain substantially. This is because the absence of a solvent can prevent the occurrence of defects (adhesion failure, void formation, etc.) due to the volatilization of the solvent when it is cured after filling in the notches of the inorganic material substrate.

Furthermore, the properties of the filler are usually liquid at least at a temperature of 20-30 ° C. Further, the viscosity is not particularly limited, but the viscosity at a shear rate of 1 s ⁻¹ when measured at a temperature of 23 ° C. with a rotational viscometer is 250 to 600 Pa · s (more preferably 250 to 500 Pa · s, and still more preferably 250 to 450 Pa · s) is preferable. In this range, excellent filling properties can be obtained, and in particular, filling with a dispenser is also possible.

The above-mentioned “cured body” is formed by filling the filler in the notches of the inorganic material substrate and curing. Moreover, this hardening body has the volume ratio which an inorganic filler occupies 45 volume% or more (more preferably 54-76 volume%, still more preferably 59-74 volume%) when the whole hardening body is 100 volume%. It is preferable.
The properties of the cured product are not particularly limited, but the linear thermal expansion coefficient is 30 ppm / K or less (more preferably 5 to 25 ppm / K, particularly 5 to 15 ppm / K) by curing the filler. be able to. Furthermore, the elastic modulus can be 1-8 GPa (further 2-8 GPa, further 3-8 GPa, especially 5-8 GPa).
Thereby, a hardening body can be processed with high precision. Although the kind of this processing method is not specifically limited, it is suitable for machining and further suitable for drilling. Examples of the drilling include drilling, punching, and laser processing. Among these, drilling is most suitable.

In the cured body constituting the inorganic material component of the present invention, holes and / or recesses can be formed with high accuracy (formation accuracy and position accuracy) by processing. In order to have a high processing accuracy, the holes and / or the recesses formed in the cured body can be used as alignment holes (or alignment holes). That is, it can be used as an alignment matching hole, an external terminal connection hole, an optical fiber holding hole, an optical fiber insertion hole, and the like. Various types of insertion members can be inserted into the alignment holes, and the inorganic material member and other members can be joined with high positional accuracy. Examples of the insertion member include an alignment matching pin, an external terminal, and an optical fiber. The alignment hole (or alignment hole) may be a through hole or a bottomed hole (that is, a hole).
In particular, since the cured body has an elastic modulus in the above range, even if the formed alignment hole is smaller than the cross-section of the insertion member insertion member (alignment alignment pin, external terminal, optical fiber, etc.), the insertion member is attached. It can be carried out. In addition, the fitting member is firmly held by the alignment hole of the cured body by this attachment. That is, the insertion member can be attached with high precision, and the optical element can be mounted on the substrate with the insertion member (particularly, the external terminal) as a reference.

  The difference in the coefficient of linear thermal expansion between the cured body and the inorganic material substrate is not particularly limited, but should be 30 ppm / K or less (more preferably 0.1 to 25 ppm / K, particularly 0.5 to 10 ppm / K). Can do. By having a difference in coefficient of linear thermal expansion in this range, it is inorganic even when it undergoes a processing step (especially a plurality of times) in which a high temperature is applied such as a heat cycle during use or a reflow step during production. It can suppress effectively that a crack and a crack arise between a material base | substrate and a hardening body.

  FIG. 1 is a plan view of a low-temperature fired porcelain (hereinafter simply referred to as “LTCC”) substrate 100a which is an embodiment of the inorganic material component of the present invention. The inorganic material component 100a includes an LTCC base and a wiring layer formed therein. In addition, notches (LTCC substrate through holes) 210 are formed at four corners of the LTCC substrate 200. Furthermore, a cured body 300 is provided in each notch 210. A through hole (cured body through hole) 310 is further formed in the cured body 300.

  FIG. 2 is a plan view of an LTCC substrate 100b which is another embodiment of the inorganic material component of the present invention. The inorganic material component 100b includes an LTCC base and a wiring layer formed therein. In addition, notches (LTCC substrate recesses, that is, notches) 210 are formed on two opposite side surfaces of the LTCC substrate 200. Furthermore, a cured body 300 is provided in each notch 210. The cured body 300 is further formed with a recess (cured body recess) 310.

  The planar shape of the notch 210 may be a semicircular shape as shown in FIG. 2, or may be a polygonal shape or the like. Further, the notch 210 can be formed as a through hole in the multi-piece LTCC substrate at a position where it is divided after cutting, and then the multi-cavity LTCC substrate can be cut to form the notch 210. . It is excellent in mass productivity by forming holes in a multi-piece LTCC substrate. Further, when the LTCC substrate is a multi-layer type, the notch portion 210 may be formed through only a specific layer thickness instead of penetrating the entire substrate.

3 is a cross-sectional view taken along the line aa of FIG. 1 showing a state in which an external terminal (MT pin) 400 is inserted into a through hole (cured body through hole) 310 formed in the inorganic material component shown in FIG. It is.
On the other hand, FIG. 4 is a cross-sectional view taken along the line aa of FIG. 1 showing a state in which an external terminal (rivet) 400 is inserted into a through hole (cured body through hole) 310 formed in the inorganic material component shown in FIG. FIG.
The shape of the external terminal is not particularly limited, and may be a screw or the like in addition to the MT pin and the rivet.

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples.
[1] Preparation of Filler Each raw material was weighed so as to have the formulation shown in Table 1, stirred in a container, kneaded with three rolls, vacuum degassed, and Examples 1 to 5 and Comparative Examples 1 to 4 were prepared.
In addition, each component amount in Table 1 is shown as an external blending amount (parts by mass) when the total amount of the liquid epoxy resin is 100 parts by mass.

Moreover, each component in Table 1 is as follows.
Liquid epoxy resin;
Bisphenol A: Bisphenol A type epoxy resin (made by Japan Epoxy Resin, trade name “Epicoat 828”)
Aminophenol: Aminophenol type epoxy resin (made by Japan Epoxy Resin, trade name “Epicoat 630”)
Curing agent;
Dicyandiamide: Dicyandiamide-based curing agent (trade name “DICY7” manufactured by Japan Epoxy Resin)
Curing accelerator;
Aromatic dimethylurea: Urea-based curing accelerator (manufactured by San Apro, product name “U-CAT3502T”)
Inorganic fillers;
Silica (wide distribution product): Silica filler (manufactured by Tatsumori Co., Ltd., D10 = 3.0 μm, D50 = 13.2 μm, D90 = 39.2 μm, D50-D10 = 10.2 μm)
Silica (narrow distribution product): Silica filler (manufactured by Tatsumori Co., Ltd., D10 = 2.3 μm, D50 = 5.9 μm, D90 = 10.1 μm, D50-D10 = 3.6 μm)
Organic fillers;
Silicone (coating): Silicone composite powder (manufactured by Shin-Etsu Chemical Co., Ltd., trade name “KMP-600”, silicone rubber filler whose surface is coated with a silicone resin, average particle size 3.7 μm)
Silicone (uncoated): Silicone rubber powder (manufactured by Toray Dow Corning Co., Ltd., trade name “Trefill E-601”, epoxy group-containing silicone rubber powder, average particle size 2 μm, bulk specific gravity 0.2)
Compatibilizer;
Silicone oil: Epoxy / polyether-modified silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., 25 ° C. viscosity 2000 mm ² / s, epoxy equivalent 12000)

  In addition, the volume ratio of the inorganic filler with respect to the hardening body (when the whole hardening body is 100 volume%) obtained from each filler of Table 1 is 63 volume% in Example 1, 63 volume% in Example 2, Example 3 is 63% by volume, Example 4 is 63% by volume, Example 5 is 63% by volume, Comparative Example 1 is 46% by volume, Comparative Example 2 is 50% by volume, Comparative Example 3 is 63% by volume, Comparative Example 4 is 65% by volume. Moreover, since this filler hardly shrinks, this ratio is equal to the volume ratio of the inorganic filler with respect to each filler.

[2] Evaluation of filler (1) Preparation of test LTCC substrate Five green sheets formed with through-holes are aligned and laminated so that the through-holes communicate with each other, and then crimped, Baking was performed to obtain an LTCC substrate having a thickness of 5 mm (length 30 mm × width 35 mm) in which through-holes (notches) having sizes of 2.5 mm and 4.5 mm were formed.

(2) Evaluation of paste properties Each filler obtained in [1] above was cast to a thickness of about 200 μm, the surface of the obtained sheet was visually observed, and evaluated according to the following criteria. It was written together as "Paste property".
“O”... The sheet surface is smooth.
"X" .... Holes and / or blurs are observed on the sheet surface.

(3) Dispenser filling property Each filler obtained in the above [1] was filled into the through hole of the LTCC substrate obtained in the above [2] (1) using a dispenser. At this time, the evaluation was made according to the following criteria, and it was also shown in Table 1 as “dispenser filling property”.
“◯”... The filler comes out from a 21 G (φ0.51 mm) dispenser.
“×”... ·············································· 21G (φ0.51mm) dispenser does not come out

(4) Adhesiveness with LTCC substrate The LTCC substrate filled with the filler in the above [2] (3) is put in a heating furnace, and each filler is added at a temperature of 120 ° C for 40 minutes, and then at 150 ° C for 5 hours. It was heat-cured and then allowed to cool to 25 ° C.
Thereafter, after applying a red solution (red check solution) to one surface of the LTCC substrate, the presence or absence of leakage of the solution to the opposite surface when sucked from the opposite surface was inspected. And it evaluated according to the following reference | standard and it described together in Table 1 as "adhesion with a LTCC base | substrate-after a cure."
“◯”: No leakage is observed in both through holes of φ2.5 mm and φ4.5 mm.
“×”... · Leakage is observed at a through hole of φ2.5 mm, or leak is observed at a through hole of φ4.5 mm.

  Furthermore, according to MIL STD202 Condition B, each test piece is placed in an environment where the temperature is changed from −55 to 125 ° C. for 10 minutes each and the temperature is increased / cooled for 5 minutes in the middle, and this cycle (the temperature is increased from −55 ° C. to 125 ° C. 500 cycles were applied), and then the cycle of lowering the temperature from 125 ° C. to −55 ° C. was taken as one cycle). Thereafter, a red check solution was added dropwise in the same manner as described above, and evaluation was performed according to the same criteria as described above, and the results are shown in Table 1 as “Adhesion with LTCC substrate—after durability”.

(5) Evaluation of glass transition point Each filler obtained in the above [1] is formed into a film and cured by heating at 120 ° C. for 40 minutes and then at 150 ° C. for 5 hours, and having a thickness of 200 μm. A cured film was obtained. Thereafter, a test piece having a width of 4 mm was cut out from each cured film, and each test piece was subjected to dynamic viscoelasticity analysis (DMA) measurement (based on JIS C6481). The measurement conditions are a span of 40 mm, a tensile load of 10 g is applied in the longitudinal direction of the test piece, a sine wave having an amplitude of 16 μm and a frequency of 11 Hz is imposed in the longitudinal direction of the test piece, and the loss tangent (tan δ) is calculated. It was measured. The peak temperature of this loss tangent is also shown in Table 1 as “glass transition point”.

(6) Evaluation of thermal expansion coefficient A test piece having a width of 5 mm was cut out from the film-like cured product obtained in (5) above, and the test piece was subjected to thermomechanical analysis (TMA) measurement (based on JPCA-BU01). did. The measurement conditions were a span of 15 mm, a tensile load of 5 g applied in the longitudinal direction of the test piece, cooling to −55 ° C., heating to 125 ° C. at a heating rate of 10 ° C./min, and elongation ε (ε = ΔL / L ₀ , ε; Elongation rate, ΔL; Elongation amount, L ₀ ; Span length). And using this elongation rate (epsilon), linear thermal expansion coefficient (alpha) 1 and (alpha) 2 were computed according to the following formula, and this result was written together in Table 1. The LTCC substrate had a linear thermal expansion coefficient of 5.2 ppm / K.
α1 = (ΔL / ΔT) / L ₀ (ΔT; temperature change, thermal expansion to glass transition temperature)
α2 = (ΔL / ΔT) / L ₀ (ΔT; temperature change, thermal expansion exceeding glass transition temperature)

(7) Evaluation of elastic modulus A test piece having a width of 4 mm was cut out from the film-like cured product obtained in (5) above, and this test piece was subjected to DMA measurement (based on JIS C6481). The measurement conditions were the same as in (5) above, and the storage elastic modulus at 25 ° C. was determined. This value is also shown in Table 1 as “elastic modulus”.

(8) Drill workability In the LTCC board | substrate provided with the hardening body with which the filler was filled and hardened, the drilling was performed to the hardening body using the drill of (phi) 2mm and (phi) 4mm. “◯” indicates that no deviation occurs in the specified pitch between the holes.

(9) Effect of Example In Comparative Example 1, the filler does not contain a compatibilizing agent, and the inorganic filler is a narrow distribution product having a particle size distribution of D50-D10 <9 μm. In this filler, in order to obtain paste properties and dispenser filling properties, a large amount of bisphenol A type epoxy resin must be used as the liquid epoxy resin to suppress the inorganic filler content (particularly the viscosity is shown in Table 1). Although it is relatively small and excellent in the dispenser filling property, if an inorganic filler is further contained, the paste property is drastically lowered, and holes and / or blurs are recognized on the sheet surface). However, it can be seen that even with such a component formulation, sufficient adhesion between the LTCC substrate and the cured body cannot be obtained, and sufficient adhesion durability cannot be obtained. Furthermore, in this inorganic material part, since the amount of the bisphenol A type epoxy resin used as the filler is large, it can be seen that the glass transition point of the obtained cured product is less than 200 ° C.

  In Comparative Example 2, the filler does not contain a compatibilizing agent, and 215 parts by mass of a widely distributed inorganic filler is contained. By increasing the amount of the aminophenol type epoxy resin having a lower viscosity and using an inorganic filler having a broad distribution, the content of the inorganic filler can be increased as compared with Comparative Example 1, and the paste property and the dispenser filling property can be secured. However, it can be seen that the obtained inorganic material part does not provide sufficient adhesion and adhesion durability between the LTCC substrate and the cured body. Moreover, in the obtained hardening body, it turns out that a linear thermal expansion coefficient is large compared with Examples 1-5.

In Comparative Example 3, 370 parts by mass of a narrowly distributed product inorganic filler is contained by using a compatibilizing agent as a filler. Although the paste property and the dispenser filling property can be secured, it can be seen that the obtained inorganic material part does not provide sufficient adhesion durability between the LTCC substrate and the cured body. Moreover, in the obtained hardening body, it turns out that a linear thermal expansion coefficient is a little large compared with Examples 1-5.
In Comparative Example 4, a compatibilizer is not used as a filler, but a wide distribution product is used as an inorganic filler, and 420 parts by mass of the same amount as in Examples 1 to 5 is contained. It can be seen that even if the viscosity of this filler is adjusted to be about the same as that of Example 3, dispenser filling properties cannot be obtained, and paste properties cannot be obtained.
In Comparative Example 4, since the paste property is insufficient, evaluation as an inorganic material part in the lower part of Table 1 is not performed.

  On the other hand, the fillers of Examples 1 to 5, which are products of the present invention, are excellent while having an inorganic filler content (420 parts by mass) greater than Comparative Examples 1 to 3 (215 to 370 parts by mass). It can be seen that the paste property and dispenser filling property can be exhibited. Furthermore, it can be seen that the LTCC substrate and the cured body also have sufficient adhesion and adhesion durability in the resulting inorganic material part. Furthermore, it can be seen that the difference in coefficient of linear thermal expansion between the LTCC substrate and the cured body is as small as 0.5 to 10 ppm / K, and the elastic modulus is kept as low as 6.9 GPa or less. And since it was this elasticity modulus, it was excellent also in drill workability. In addition, it can be seen that both of the cured products have a glass transition point of 200 ° C. or higher and can exhibit excellent heat resistance.

  In Example 1, silica having a wide particle size distribution is used as the inorganic filler. For this reason, it was possible to keep the dispenser filling property in a good range while containing a large amount of 420 parts by mass of silica in the filler. And since it contained this large amount of silica filler, the linear thermal expansion coefficient showed a very small value of 9.6 ppm / K. That is, the difference in coefficient of linear thermal expansion from the LTCC substrate was only 4.4 ppm / K. Furthermore, the adhesion between the LTCC substrate and the cured body was excellent, and the drilling workability was also excellent. In addition, while Example 3 and Example 4 ensure all other characteristics, the difference in coefficient of linear thermal expansion from the LTCC substrate, in particular, can be remarkably reduced to 4.1 ppm / K and 4.2 ppm / K. I understand that

  The present invention can be widely used in the field of electronic components. Further, the inorganic material component of the present invention is used for ordinary wiring boards such as motherboards, flip chip wiring boards, CSP wiring boards, MCP wiring boards and other semiconductor element mounting wiring boards, interposer boards, and antenna switch modules. It is used for wiring boards for modules, such as wiring boards, mixer module wiring boards, PLL module wiring boards, and MCM wiring boards.

It is a typical top view which shows an example of the inorganic material component of this invention. It is a typical top view which shows the other example of the inorganic material component of this invention. It is typical sectional drawing in the aa line which shows the state which inserted the external terminal (MT pin) in the through-hole of the inorganic material component of FIG. It is typical sectional drawing in the aa line which shows the state which inserted the external terminal (rivet) in the through-hole of the inorganic material component of FIG.

Explanation of symbols

  100a, 100b; inorganic material component, 200; LTCC substrate, 210; notch (LTCC substrate through hole, LTCC substrate recess), 300; cured body, 310; through hole (cured body through hole), 400; external terminal.

Claims (7)

An inorganic material part having an inorganic material base having at least one of a through hole and a recess, and a cured body in which at least one of the notches is filled with a filler and cured. Because
The filler contains a liquid epoxy resin, a curing agent, a compatibilizing agent, an inorganic filler, and an organic filler,
When the entire filler is 100% by mass, the liquid epoxy resin is 1 to 55% by mass,
When the liquid epoxy resin is 100 parts by mass, the curing agent is 2 to 10 parts by mass, the compatibilizer is 0.5 to 20 parts by mass, and the inorganic filler is 100 to 600 parts by mass. Yes, the organic filler is 0.5-30 parts by mass,
The liquid epoxy resin contains a bisphenol type epoxy resin and an aminophenol type epoxy resin,
The curing agent contains a polyamine curing agent,
The compatibilizer contains a silicone oil having a polyether group at the terminal and / or side chain,
The inorganic filler contains silica,
The organic filler contains a silicone filler,
And the particle size distribution of this inorganic filler WHEREIN: The difference of D10 and D50 is 9 micrometers or more, The inorganic material components characterized by the above-mentioned.   The inorganic material part according to claim 1, wherein the curing agent contains dicyandiamide.   The inorganic material component according to claim 1 or 2, wherein a volume ratio of the inorganic filler to the entire cured body is 45% by volume or more.   The said aminophenol type epoxy resin is 30-70 mass% when the sum total of the said bisphenol type epoxy resin and the said aminophenol type epoxy resin is 100 mass%, The any one of Claims 1 thru | or 3 Inorganic material parts. The cured product, inorganic material parts according to any one of claims 1 to 4 comprising an alignment matching hole formed in a part of the cured resin. Fill volume of the missing portion, the inorganic material component according to any one of claims 1 to 5 is 0.75mm3 or more. The difference between the linear thermal expansion coefficient and linear thermal expansion coefficient of the inorganic material substrate of the cured product is less 30 ppm / K, and the elastic modulus of the cured body of the claims 1 to 6 is 1~8GPa An inorganic material part according to any of the above.

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