JP5190087B2 - Defect review device - Google Patents

Description

  The present invention relates to a method and an apparatus for reviewing defects generated in a process of manufacturing a thin film device such as a semiconductor electronic circuit board or a liquid crystal display board using an enlargement imaging apparatus such as a scanning electron microscope.

  The manufacture of thin film devices such as semiconductors, liquid crystal displays, and hard disk magnetic heads is composed of a number of processes. The number of such processing steps sometimes reaches several hundreds. If an appearance abnormality such as foreign matter or wire breakage occurs on the thin film device due to inadequate or abnormal manufacturing conditions of the processing apparatus, the probability that a product will be defective increases and the yield decreases. Therefore, it is important to identify the device in which the problem has occurred and take measures to maintain and improve the yield. For this reason, inspections such as foreign matter inspection and appearance inspection are performed for each main process, and whether or not the processing is normally performed is monitored. At this time, since it is impossible to inspect all the substrates to be processed for each processing process due to time and labor constraints, it is usually a lot unit or a substrate unit for each series of processes. Alternatively, an inspection is performed on a substrate to be processed sampled by a combination thereof. Here, the substrate to be processed means a minimum unit for processing a product, and in the case of a semiconductor device, it indicates one wafer.

  In the inspection apparatus, when foreign matter inspection is performed, for example, the wafer surface is scanned with a laser, and the presence or absence of scattered light is detected to obtain information on the position and number of foreign matters. In addition, when performing defect inspection that inspects both foreign matter and pattern abnormality, for example, an image of a wafer circuit pattern is captured by an optical enlargement imaging device and compared with an image of another adjacent same pattern region. Obtain information about the position and number of singular points. Here, the “singular point” refers to a point that is output as a point where an abnormality has been found by the inspection of the inspection apparatus. The foreign object and the appearance abnormality are combined and hereinafter referred to as “defect”.

  The apparatus abnormality is often determined as the number of defects detected by the inspection apparatus or the density management index. If the number of defects exceeds a preset reference value, it is determined that an abnormality has occurred in the apparatus, and the defect is detected by an optical microscope or a scanning electron microscope (Scanning Electron Microscope) based on defect coordinate information detected by the inspection apparatus. An enlarged image is taken by a review device such as SEM, and detailed information such as size, shape, and texture is obtained, and detailed inspection such as elemental analysis and cross-sectional observation is performed to identify the device in which the failure occurred and the content of the failure. Then, based on the result, measures are taken for devices and processes to prevent a decrease in yield.

  In order to automate and improve the efficiency of such review work, in recent years a function (Automatic Defect Review: ADR) that automatically acquires an enlarged image of foreign matter / defects based on inspection data from foreign matter inspection devices and appearance inspection devices. ) Has been developed (see Patent Document 1). Patent Document 2 discloses a method of automatically classifying an acquired image according to a specific rule (Automatic Defect Classification: ADC).

JP 2000-30652 JP Japanese Unexamined Patent Publication No. 7-201946

  In the semiconductor manufacturing process, thin film formation, processing, and cleaning are repeated many times. At that time, if the adhesion of the film generated for some reason, such as adhesion of foreign matter or surface roughness, deteriorates at the outermost edge of the wafer, not only in the process of generating the film but also in the subsequent process. The film may be easily peeled off from the edge portion. These peeled films adhere to the circuit pattern processed as a foreign substance and may cause electrical defects. For this reason, after film formation, the wafer edge may be observed for problems such as roughening or peeling, in terms of film formation. Since the width and interval of recent wiring are on the order of submicrometers, the size of foreign matter and defects to be observed is also in the same order. An electron microscope is mainly used as a means for observing such minute foreign matters and defects in detail.

  Ordinary defects are generally observed from vertically above the wafer, but in order to observe the details of the edge of the wafer in detail, it is not from vertically above, but from obliquely above so that the side surface can be easily observed. Is desirable. Such a method for observing the wafer edge is described in, for example, Japanese Patent Application Laid-Open No. 2001-221749. However, this document does not disclose a suitable method when an electron microscope is used for the observation apparatus.

  An object of the present invention is to provide a suitable method for observing a wafer edge using an electron microscope.

The defect review apparatus according to the present invention includes a sample stage for holding a sample, a column having an electron optical system for irradiating the sample with an electron beam, and a first and a second based on a signal generated from the sample by the electron beam irradiation. An image acquisition unit that acquires a second image and an image calculation unit that determines the presence or absence of a predetermined type of defect from the first image, and the image calculation unit determines that the defect exists. The electron optical system irradiates the sample with an electron beam at an angle different from an angle formed between the electron beam and the sample surface when the first image is acquired, and the image acquisition unit A second image is acquired based on the generated signal .

The defect review apparatus according to the present invention also includes a sample stage that holds and moves a sample, an optical microscope that can observe the outer periphery of the sample, and the presence or absence of defects in the outer periphery from the observation result of the optical microscope. And an electron microscope that observes the defect position determined by the calculation unit by irradiating the electron beam, and the electron beam is incident on the sample from a direction inclined with respect to the sample surface. It is characterized by .

  According to the present invention, it is possible to effectively observe a wafer edge in a semiconductor defect review using an electron microscope.

The figure which shows the connection structural example of the apparatus in the manufacturing line of a wafer. The figure which shows the apparatus structural example of this invention. The figure explaining the difference of the acquired image by the difference in an observation angle. The flowchart which shows one Example of the observation procedure using the apparatus of this invention. The figure which shows one Example of the wafer edge observation position judgment method of this invention. The figure which shows one Example of the wafer edge observation position judgment method of this invention. The flowchart which showed one Example of the observation procedure using the apparatus of this invention. The flowchart which showed one Example of the observation procedure using the apparatus of this invention. The figure which showed the example of a screen display of this invention. The figure which showed the example of a screen display of this invention. The figure which shows one Example of the image imaging method of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, referring to FIG. 1, a specific example of each apparatus and its connection configuration in a wafer production line will be described. In the figure, 1 is a data management server, 2 is a semiconductor manufacturing device, 3 is an inspection device, 4 is a review device, 5 is an analysis device, 6 is a review / analysis device, and 7 is a network. As shown in the figure, the production line has a configuration in which a semiconductor wafer production device 2, an inspection device 3, a review device 4, an analysis device 5, and a review / analysis device 6 are interconnected by a data management server 1 and a network 7. There is no.

  The manufacturing apparatus 2 is used for manufacturing a semiconductor wafer such as an exposure apparatus or an etching apparatus. The inspection apparatus 3 is for inspecting a defect position. For example, a light beam spot or beam line is scanned on a semiconductor wafer, and the defect position is specified based on the degree of irregular reflection, or the pattern of the formed pattern is detected. Images are acquired from the two chips, and these images are compared to determine a different portion as a defect, and the position of the defect is detected. The review device 4 is for observing defects based on the inspection information of the inspection device 3. The review device 4 moves the stage on which the semiconductor wafer is mounted, and on the semiconductor wafer based on the defect position information output from the inspection device 3. Position the target defect and observe the defect. For example, an SEM is used as the observation apparatus. The analysis device 5 performs elemental analysis using, for example, EDX or Auger electron spectroscopy. Auger electron spectroscopy is a method that detects and analyzes Auger electrons emitted from an object when the object is irradiated with an electron beam, and is a well-known method. The review / analysis device 6 is a device that enables observation of defects and elemental analysis.

  Note that these inspection, observation, and analysis apparatuses are not necessarily separated, and may be combined, for example, such that inspection and review can be performed in the same apparatus.

  The data management server 1 manages data obtained by the inspection device 3, the review device 4, the analysis device 5, and the review / analysis device 6. The review device 4 and the analysis device 5 are the data management server 1 It is possible to acquire information such as the defect position coordinates output from the inspection apparatus 3 via. The review device 4, the analysis device 5, or the review / analysis device 6 acquires the coordinate data of the defect position obtained by the inspection device 3, positions the defect based on the coordinate data, and performs the review and analysis.

  Although an example of connection is shown here, any connection configuration may be used as long as data can be used between devices. In addition, all the devices shown in this configuration are not essential, and may be combined according to the purpose.

  FIG. 2 shows an embodiment of the apparatus configuration. WF is a semiconductor wafer, EB is an electron beam, and 8 is a first imaging device using a scanning electron microscope. This is called the first column. 9 is an electron source of the first column, 10 and 11 are condenser lenses of the first column, 12 is a deflection scanning coil of the first column, 13 and 14 are objective lenses of the first column, and 15 is a detector of the first column. It is. 16 is the second column, 17 is the electron source of the second column, 18 and 19 are the condenser lenses of the second column, 20 is the deflection scanning coil of the second column, 21 and 22 are the objective lenses of the second column, 23 is a detector of the second column. 24 is an XYθ stage, 25 is a storage device, 26 is a monitor, 27 is an input device, 28 is an overall control unit, 29 is an image calculation unit, 30 is an A / D conversion unit, 31 is an electron optical system control unit, and 32 is a stage The control unit 33 is a defect data analysis calculation unit. 34 and 35 are detectors for elemental analysis, and 36 is an elemental analysis control unit. In the figure, a first column 8 is formed by an electron source 9, an electron optical system 10-14, and a detector 15, and a second column 16 is formed by an electron source 17, an electron optical system 18-22, and a detector 23. Is forming. The first column 8, the second column 16, and the XYθ stage 24 constitute an SEM, and this is used as an imaging device for the semiconductor wafer WF mounted on the XYθ stage 24.

  The semiconductor wafer WF to be reviewed is mounted on the XYθ stage 24. The XYθ stage 24 is controlled to move in the X and Y directions and the rotation θ direction by the stage control unit 32 based on a control signal from the overall control unit 28. In the first column 8, the semiconductor wafer WF fixed to the XYθ stage 24 is enlarged and imaged. That is, the electron beam EB emitted from the electron source 9 is converged by the condenser lenses 10 and 11 and the objective lenses 13 and 14, and is scanned by the deflection scanning coil 12 to be irradiated to the semiconductor wafer WF to be measured. The secondary electrons and reflected electrons obtained from the semiconductor wafer WF by this irradiation are detected by the detector 15 and processed by the A / D converter 30 to generate an SEM image of the semiconductor wafer WF.

  Similarly, in the second column 16, the semiconductor wafer WF fixed to the XYθ stage 24 is enlarged and imaged. That is, the electron beam EB emitted from the electron source 17 is converged by the condenser lenses 18 and 19 and the objective lenses 21 and 22, and is scanned by the deflection scanning coil 20 to be irradiated to the semiconductor wafer WF to be measured. The secondary electrons and reflected electrons obtained from the semiconductor wafer WF by this irradiation are detected by the detector 23 and processed by the A / D converter 30 to generate an SEM image of the semiconductor wafer WF.

  The first column 8 and the second column 16 are arranged with different angles of the axis of the electron optical system. For example, while the axis of the electron optical system of the first column 8 is parallel to the normal direction of the surface of the wafer, the second column 16 is arranged at an angle. In this way, information observed from different directions can be obtained in the first column 8 and the second column 16, respectively.

  For example, when energy dispersive X-ray analysis is used as the elemental analysis method, the detectors 34 and 35 detect X-rays generated by receiving an electron beam irradiated on the measurement target. The element analysis control unit 36 receives a control signal from the overall control unit 28 and controls ON / OFF of X-ray detection. The detected X-ray spectrum is subjected to spectrum analysis by the elemental analysis control unit 36 or the overall control unit 28, and information on the contained elements is extracted and displayed on the display device 26 to the user.

  An example of the direction in which the wafer is observed is shown in FIG. FIG. 3 is a view showing the wafer from a vertical sectional direction. For example, the first column is arranged to image the wafer from the direction A in the figure, and the second column is arranged to image the wafer from the direction B in the figure. FIG. 3A shows an example of an observed image when a rectangular parallelepiped is imaged in the case where columns are arranged in this manner, and FIG. 3B shows an example of an observed image when an image of a wafer edge is taken.

  As shown in FIG. 3A, when a foreign object is imaged, the state of the side surface of the foreign object can be observed in the B direction. In addition, as shown in FIG. 3B, when the wafer edge is imaged, it is difficult to obtain information such as the shape of a foreign substance existing on the wafer edge in the A direction, whereas in the B direction, the edge portion is compared with the A direction. It can be observed from the front, and it is easy to obtain information such as the shape of the foreign matter.

  Which column is used for imaging is instructed by the user from the input device 27, or calculated by the overall control unit 28 according to a predetermined rule, and controlled by the overall control unit 28. Based on the control signal from the control unit 28, the stage control unit 32 controls the stage position to the position corresponding to the corresponding column, and the electron optical system control unit 31 sends the control signal of the electron optical system to the corresponding column. In the A / D conversion unit 30, an image of the corresponding column is acquired.

  Image processing such as defect detection processing is performed by the image calculation unit 33. The user inputs input items such as defect observation conditions from the input device 27. The defect coordinate data for review is sent from the inspection apparatus to the overall control unit 28 via a network (not shown). The stage control unit 32 performs control so that the defect enters the visual field based on the defect coordinate data. In the present embodiment, only one detector 15 and 23 is shown, but a plurality of detectors 15 and 23 may be arranged depending on the application such as dividing the range of energy of electrons to be detected.

  Next, FIG. 4 shows a flowchart of the first embodiment of the observation method in which both the first column and the second column are used while observing the wafer. First, in step 100, the defect inspection data output from the defect inspection apparatus 3 is read. Next, in step 101, the column is set so as to use a normal defect observation column, for example, a first column in which the axis of the electron optical system is parallel to the normal line of the wafer. Next, in step 102, the wafer is aligned. This is a step of correcting the coordinate deviation between the observation apparatus and the inspection apparatus. For example, by observing the alignment mark in the observation device and manually specifying the position of the alignment mark or automatically recognizing it and comparing it with the output coordinates of the alignment mark in the inspection device, differences in translational deviation, scale, and rotation Is to correct.

  Next, in step 103, an image of a defect is automatically acquired based on the defect inspection data. The acquired image is automatically classified according to the rule determined in advance in step 104. At this time, as pre-preparation (not shown), classification rules are created and classification teaching data is created so that foreign matters and defects caused by wafer peeling can be classified. In step 105, it is determined whether or not the defect classification result is a foreign matter / defect resulting from wafer peeling, that is, whether or not the defect is in a peeling mode. In many cases, the foreign matter / defect caused by the film peeling of the wafer is shaped like a thin film-like substance that is finely broken and can be discriminated from the appearance characteristics. If the foreign matter / defect has the same appearance characteristics, for example, if information such as the shape and brightness of the defect is collected from the image of the foreign matter / defect for each process, the feature is used to perform highly reliable discrimination. It is possible. If the defect is in the peeling mode, in step 106, a peeling mode flag is set in order to memorize that there is a peeling mode defect. If it is determined that the mode is not the peeling mode, step 107 is performed without performing step 106.

  In step 107, it is determined whether or not there is a next defect to be observed, and if there is a defect, the next data is read in step 108 and the same process is repeated from step 103. If it is determined in step 107 that there is no next defect to be observed as a defect observation target, it is determined in step 109 whether or not a defect in the peeling mode exists in the defect to be observed. That is, it is determined whether or not the peeling mode flag is set. If the peeling mode flag is not set, the defect observation in the inspection data is terminated.

  If the peeling mode flag is set, in step 110, the column to be observed is set to the second column. Next, in step 111, a target range for observing the wafer edge is set. This may be set in advance in a recipe that records the procedure for observing defects, or as described later, may be set automatically based on the result of analyzing the acquired defect image, Moreover, you may set by a user's input. As setting contents of the observation target range, for example, the entire circumference of the wafer may be set, or a coordinate range may be set. The coordinates may be an X, Y coordinate system or a polar coordinate system. Further, the outer shape of the wafer may be illustrated, and the user may specify the range using the drawing to determine which range is the observation target. Next, at step 112, an image of the designated wafer edge range is acquired, and the process is terminated.

  An embodiment of a method for automatically setting the wafer edge observation target range based on the result of analyzing the acquired defect image will be described.

  A map indicating the position of the defect on the wafer is called a wafer map. An example of a wafer map of the wafer to be observed is shown in FIG. In FIG. 5, the coordinate points of the defects classified as the peeling mode are indicated by white circles. Focusing only on the defects in the peeling mode, it can be seen that in FIG. 5A, the defects are distributed only in the vertical direction and many exist on the V notch side. In such a case, it can be estimated that the film peeled off at the edge on the V notch side for some reason, and the foreign matter generated thereby was scattered in the vertical direction. In such a case, an edge on the V notch side may be set as the observation target range. In FIG. 5B, the defects in the peeling mode are concentrated in a narrow range of the wafer edge. In such a case, it is only necessary to set the observation target range only around the edge where the foreign matter is concentrated.

  In order to make such a determination, for example, as shown in FIG. 6, the wafer is divided into radial regions, and values indicating the frequency of the presence of peeling mode defects in each region, such as the number and density, are calculated. Then, the wafer edge in the high value area may be set as the observation target range.

  The method of observing the observation target from an oblique direction is not limited to the above. For example, a configuration having only the first column arranged at an inclination may be used. The column may be arranged at a variable angle. When the column tilt angle is variable, step 110 in the flowchart shown in FIG. 4 is replaced with a step of changing the column tilt angle. In addition, the oblique observation may be performed by inclining the stage. In the case of this configuration, step 110 in the flow of FIG. 4 is replaced with a step of changing the tilt angle of the stage. Further, an image observed from the oblique direction may be acquired by deflecting the irradiated electron beam and irradiating from the oblique direction. In the case of this configuration, step 110 in the flow of FIG. 4 is replaced with a step of changing the beam irradiation direction.

  Next, another embodiment of the method for setting the observation range of the wafer edge will be described. The following may be an example in the flow of FIG. 4 or may be an example in the case where only the wafer edge is an observation target.

  As a first embodiment of the method for setting the observation range of the wafer edge, the observation range may be set based on the inspection data from the inspection apparatus for wafer edge inspection with the output coordinate of the inspection data as the center of the visual field. The size of the field of view may be set by the user as a fixed value, or may be automatically changed according to the size of the defect.

  FIG. 7 shows an example of an observation flow using this setting method when only the wafer edge is an observation target. The same steps as those in FIG. 4 are given the same step numbers. First, in step 200, data is acquired from an inspection apparatus for wafer edge inspection. Next, in step 102, wafer alignment is performed. Next, the visual field is moved based on the read inspection data, and an edge image is acquired in step 201. The image is an image at coordinates output as a position having a defect from the inspection apparatus, and is expected to be an image including a defect. Next, Step 107 and Step 108 are performed and the process is completed.

  As a second embodiment, the observation position and range may be designated in advance by the user. For example, the designated position may be regularly set at a certain interval, or a characteristic position such as the periphery of the V notch or the chuck position of the processing apparatus may be designated. Further, as a third embodiment, the entire circumference of the wafer may be an observation target.

  When acquiring the wafer edge image, the wafer edge is imaged at a certain first magnification, and only when the defect is found in the image captured at the first magnification, the position where the defect exists is the first magnification. You may make it image by a 2nd larger magnification than this. An example of the imaging flow in this case is shown in FIG. As in the embodiment of FIG. 7, steps 200 and 102 are performed, and the first magnification is set in step 300. The first magnification is preferably set so that a defect is included in the visual field range at the first magnification even if these errors are included in consideration of the coordinate output error of the inspection apparatus and the positioning error of the observation apparatus. Next, in step 301, an edge image is acquired at a first magnification. Next, in step 302, the presence / absence of a defect is determined, and if there is a defect, the position of the defect is specified. If it is determined that there is a defect, the second magnification is set in step 303. The second magnification may be designated in advance by the user, or may be made variable based on the information when defect size information is included in the inspection data from the inspection apparatus. Alternatively, the size of the defect may be calculated in the defect presence / absence determination process in step 302 and may be variable based on the calculated value.

  Generally, the second magnification is set higher than the first magnification so that the defect portion can be observed in more detail. However, in the determination process of step 302, when it is determined that the presence of a defect extends over a wider range than the visual field range of the first magnification, it may be set smaller than the first magnification. Next, at step 304, an edge image is acquired at the second magnification. Next, steps 107 and 108 are executed and the process is terminated. If it is determined in step 302 that there is no defect, the routine proceeds to step 107.

  As a method for determining the presence / absence of a defect and detecting a defect position, for example, there are the following methods. A normal image is registered in advance, and compared with an image captured at the time of wafer edge observation, a portion having a large difference is determined as a defect. Alternatively, the field of view is divided into a plurality of small areas, and the variance of the brightness of the pixels constituting the image is calculated for each small area. When the variance exceeds a predetermined threshold value, it is determined that the surface of the small region is rougher than the normal portion assumed, and the small region is determined as a defect. At this time, when both the wafer edge and the background are included in the small area, the dispersion becomes large, and there is a possibility that the defect area is erroneously determined. In such a case, the small area may be excluded from the defect candidates, and a pixel having a certain brightness or less is determined as the background by using the difference in brightness of the pixels and is not used for calculation of the variance. You may do it. Alternatively, a differential value representing the magnitude of the change in brightness of the image is calculated, and a portion having a large differential value is defined as a defect area excluding the boundary portion of the wafer edge. Alternatively, the secondary electrons generated when the electron beam is irradiated generally increase at the stepped portion of the object, i.e., the brightness of the image is increased. To do. At this time, since the luminance may suddenly increase due to noise, it is desirable to perform preprocessing such as averaging for each minute region or applying a low-pass filter.

  These methods do not have to be any one type, and a plurality of methods may be used together or may be selected by the user.

  When performing such a defect determination, if a defect is found, or if the frequency or degree of the defect exceeds a predetermined threshold, a warning is issued so that the user can know that the wafer edge is abnormal. Also good. These warnings may be displayed on the monitor 26 of the electron microscope, may be output to another display device connected to the network via the network 7, or an email is sent to the person in charge via a mail system (not shown). You may do it.

  Further, when observing the wafer edge, not only an image but also elemental analysis information such as EDX may be acquired together.

  FIG. 9 and FIG. 10 show an example of a GUI for displaying an operation or an acquired image at the time of edge review. In FIG. 9, reference numeral 37 indicates a unique identifier of a defect added by an inspection apparatus or an observation apparatus. Reference numeral 38 denotes a classification identifier when automatic classification is performed. 39 is a map display showing where on the wafer edge the acquired image is. The circular display in the figure indicates the wafer outer shape, and the black circle indicates the position where the image is acquired. The large black circle display indicates the position of the image being displayed in the image display area shown on the right side of the map display. The arrow button below the map is a switch for designating to switch the image to be displayed to the next or previous image. As a function at the time of operation, when reviewing the entire circumference of the wafer, the movement amount is automatically adjusted according to the imaging magnification by the button so that the field of view is moved so that the field of view range is continuous without leaving a gap. May be.

  40 designates the form of image display, and designates whether to display one image in the display area, or to display a plurality of images by dividing the display area. 41 is a screen for selecting a function to be performed on the display image. For example, when “Measure” is selected, a cursor on two line segments is displayed on the display image so that the user can move the cursor. The actual size is displayed in conjunction with the image capture magnification. An image display area 42 displays an image being observed or an acquired image. The display form is designated by 40. Alternatively, other images reduced in the display area may be displayed as a list, and the selected image may be displayed in the display area. The reduced screen may be configured to display all the images by changing the display magnification or scrolling. In association with the selected image of the reduced list display area, in the map display of 39, the size of the black circle at the position corresponding to the display image is increased so that the imaging position of the image being displayed can be known.

  43 is a screen for displaying the result of elemental analysis, for example, displaying the waveform of the elemental analysis result, displaying the symbol of the detected element, and displaying the name of the substance and the element symbol estimated from the waveform. Reference numeral 44 denotes a screen for performing automatic defect detection processing, which displays processing conditions and processing results. It is possible to adjust the parameters of the defect detection processing based on the processing results and reflect them as processing parameters in the defect detection operation of the observation apparatus.

  The display screen shown in FIG. 9 is an example, and it is possible to display some of the display items shown therein. The display screens may not be the same as long as they have the same contents. Further, as shown in a display 45 in FIG. 10, a wafer map of the defect inspection data on the wafer surface and a defect observation image by the first column of the inspection data may be displayed together. In the display area 45, at least the defect image, ID number, and classification result are displayed for the defect selected on the wafer map.

  FIG. 11 shows an embodiment in which the scanning direction is changed depending on the wafer observation position when acquiring the wafer edge image. When the observation position is changed by rotating the stage, for example, when an image is acquired with the rectangular position shown in FIG. 11A as the visual field range, for example, the image shown in the lower part of FIG. 11A is acquired. The Even when different edge positions of the wafer are imaged, the composition of the acquired image in which the lower side of the screen is the wafer and the upper side of the screen is the background does not change. For this reason, it is necessary to refer to the map displayed at 39 in FIG. Therefore, imaging is performed by changing the scan direction according to the angle at which the stage is rotated. For example, as shown in FIG. 11B, the imaging area of the wafer edge is scanned with the same angle as the rotation angle θ of the stage. When scanning is performed in this way, the image shown in the lower part of FIG. 11B can be acquired. The image has a composition in which the lower right corner is the wafer and the upper left corner is the background, and it is possible to intuitively grasp that the edge of the upper left portion of the wafer has been imaged.

  On the other hand, if the angle of imaging can be changed by deflecting the beam, it is not always necessary to change the scanning direction. The stage can be moved to the edge position to be imaged without rotating the stage, and the edge can be easily observed. The same effect can be obtained by changing the imaging angle to take an image.

  In addition, a microscope having an optical system using a wavelength in the range of visible light to ultraviolet light may be installed so that the same position as the electron optical system can be observed. Instead of acquiring inspection data from the inspection device, observe the edge of the wafer with an optical system, calculate the presence / absence of a defect and the position of the defect using the method for determining the presence / absence of a defect as described above, and record the position. In addition, the defect position may be observed by switching the optical system used for observation to an electron optical system.

1 ... Data management server
2 ... Semiconductor manufacturing equipment
3 ... Inspection equipment
4 ... Review device
5 ... Analyzer
6 ... Review and analysis equipment
7 ... Network
8 ... First column of scanning electron microscope
9 ... First column electron source
10… Condenser lens in the first column
11 ... First column condenser lens
12 ... First column deflection scanning coil
13 ... Objective lens of the first column
14 ... Objective lens of the first column
15 ... First column detector
16 ... Second column of scanning electron microscope
17 ... Second column electron source
18… Condenser lens in the second column
19… Condenser lens in the second column
20 ... Second column deflection scanning coil
21 ... Second column objective lens
22… Second column objective lens
23… Second column detector
24 ... XYθ stage
25 ... Storage device
26… Monitor
27 ... Input device
28 ... Overall control unit
29… Image calculation part
30 ... A / D converter
31 ... Electronic optical system controller
32 ... Stage control unit
33 ... Defect data analysis calculation unit
34 ... Elemental analysis detector
35 ... Elemental analysis detector
36 ... Elemental analysis control unit
37 ... Unique identifier display area
38 ... Classification identifier display area
39… Imaging position map display area
40… Image display form display area
41… Function display area
42… Image display area
43… Elemental analysis display area
44… Automatic detection processing condition setting area
45… Wafer map display area

Claims (10)

A sample stage for holding the sample;
A column having an electron optical system for irradiating the sample with an electron beam;
An image acquisition unit for acquiring first and second images based on a signal generated from the sample by irradiation of the electron beam;
An image calculation unit that determines the presence or absence of a predetermined type of defect from the first image;
When the image calculation unit determines that the defect is present, the electron optical system applies the electron beam to the sample at an angle different from the angle formed by the electron beam and the sample surface when the first image is acquired. Irradiating, and the image acquisition unit acquires a second image of an edge portion of the sample based on a signal generated from the sample . The defect review apparatus according to claim 1,
The defect reviewing apparatus according to claim 1, wherein the predetermined type is a peeling mode. The defect review apparatus according to claim 1, further comprising:
A defect review apparatus comprising: a mechanism for changing an angle of the column with respect to the sample surface. The defect review apparatus according to claim 1,
The defect review apparatus, wherein the sample stage has an inclination mechanism. The defect review apparatus according to claim 1,
The defect review apparatus according to claim 1, wherein the electron optical system includes a deflection control mechanism that deflects the electron beam so as to be incident obliquely with respect to a normal direction of the sample. The defect review apparatus according to claim 1,
A first electron optical system that irradiates an electron beam with respect to the normal direction of the sample surface, and a second electron optical that irradiates the electron beam at an angle different from the angle at which the first electron optical system is installed And having a system
The defect review apparatus, wherein the image acquisition unit acquires the second image based on an output signal of the second electron optical system. The defect review apparatus according to claim 1,
A defect review apparatus characterized in that the sample stage can be controlled to move in the rotation direction. The defect review apparatus according to claim 1, further comprising:
A defect review apparatus comprising an input unit capable of setting an angle formed by the electron beam and the sample surface. The defect review apparatus according to claim 1,
The defect acquisition apparatus, wherein the image acquisition unit can set a range to be observed in the sample. A sample stage that holds and moves the sample; and
An electron optical system for irradiating the sample with an electron beam;
An image acquisition unit for acquiring an image based on a signal generated from the sample by irradiation of the electron beam;
An image calculation unit that determines the presence or absence of a predetermined type of defect from the image,
When the image calculation unit determines that the defect exists, the electron optical system causes the electron beam to enter the sample surface with an inclination, and the image acquisition unit is an edge portion of the sample. defect review apparatus characterized by acquiring an image of the position where the defect is present again Te.

Images