JP5184394B2 - Electro-optic crystal support, electro-optic crystal support method, and electric field detection optical apparatus - Google Patents

Description

  The present invention relates to an electro-optic crystal support, an electro-optic crystal support method, and an electric field detection optical device.

  Electric field communication uses, for example, the body surface as a transmission path. During communication, a weak electric field change is measured, and thus information is transmitted by the electric field. For electric field communication, a detecting device is used that detects the change with laser light by utilizing the fact that the optical property of an electro-optic crystal (hereinafter referred to as a crystal) changes with an electric field. For example, a detection device described in Patent Document 1 is known.

  Crystals are originally relatively large cuboids having a size on the order of millimeters. As shown in FIG. 16, the crystal 10 is formed by, for example, manually thinning an upper part of a rectangular parallelepiped crystal and sandwiching the thin portion (ridge) between the electrodes 11 and 12. During signal detection, laser light passes through the ridge. Such a crystal is disclosed in Patent Document 2.

JP 2005-277719 A JP 2007-183517 A

  By the way, since crystals are expensive, attempts have been made to reduce costs by reducing the thickness and size. Although thin and small crystals themselves are difficult to handle, as shown in FIG. 17, if such a thin and small crystal 100 is supported by a large support base 200, the crystal 100 can be handled by having the support base 200, and Easy to handle.

  However, since the crystal is hard and brittle, for example, when a small crystal is fixed to a support base by soldering or bonding, a large stress (impact) is accidentally applied to the crystal in the process, and a part of it is lost, There is a possibility that the characteristics of the crystal deteriorate due to the stress.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electro-optic crystal support base and an electro-optic crystal support method that can support the electro-optic crystal so that defects and deterioration of characteristics do not occur. An object of the present invention is to provide an electric field detection optical device using an electro-optic crystal support.

Electrooptic crystal support table of the present invention is an electro-optic crystal support table for supporting the electro-optic crystal that is sandwiched between two electrodes, the electro-optical crystal support base, have a metal body in contact with the respective electrodes And an electrode for applying an electric signal to each of the metal bodies is connected, and the electro-optic crystal support base emits light to the electro-optic crystal and emits from the electro-optic crystal. The electro-optic crystal support is used together with a means for detecting the electrical signal by light, and applies stress to the electro-optic crystal when at least one of the metal bodies is deformed.

  For example, the metal body that applies stress to the electro-optic crystal is a shape memory alloy. When the shape memory alloy is deformed by stress and the shape memory alloy is heated, the shape memory alloy is deformed in the reverse direction by heating. However, the shape memory alloy applies stress to the electro-optic crystal during deformation in the reverse direction.

  For example, the metal body that applies stress to the electro-optic crystal is a bimetal, and when the bimetal is heated, the bimetal is deformed when heated, the bimetal is cooled and deformed in the reverse direction, and in the reverse direction. During the deformation, the bimetal applies stress to the electro-optic crystal.

  For example, the metal body that applies stress to the electro-optic crystal has a plurality of bent portions.

  For example, the metal body that applies stress to the electro-optic crystal is a plate-like metal body having a plate shape, and when the plate-like metal body is deformed, the plate-like metal body tends to deform in the reverse direction. Thus, stress is applied to the electro-optic crystal.

The electro-optical crystal support method of the present invention is an electro-optical crystal support method using an electro-optical crystal support base that supports an electro-optical crystal sandwiched between two electrodes , and the electro-optical crystal support base is attached to each electrode. An electrode for applying an electric signal to each of the metal bodies is connected, and the electro-optic crystal support is configured to make light incident on the electro-optic crystal; The electro-optic crystal supporting method is used together with a means for detecting the electrical signal by light emitted from the electro-optic crystal, and the electro-optic crystal supporting method applies stress to the electro-optic crystal by trying to deform at least one of the metal bodies. Features.

  For example, the metal body that applies stress to the electro-optic crystal is a shape memory alloy, and the electro-optic crystal support method includes a step of deforming the shape memory alloy and a step of heating the shape memory alloy, The shape memory alloy is deformed in the reverse direction upon heating, and the shape memory alloy applies stress to the electro-optic crystal during the deformation in the reverse direction.

  For example, the metal body that applies stress to the electro-optic crystal is a bimetal, and the electro-optic crystal support method includes a step of heating the bimetal, and the bimetal is deformed when heated, and the bimetal is cooled. The bimetal applies stress to the electro-optic crystal during deformation in the reverse direction.

  For example, the metal body that applies stress to the electro-optic crystal has a plurality of bent portions.

  For example, the metal body that applies stress to the electro-optic crystal is a plate-like metal body having a plate shape, and the electro-optic crystal support method includes a step of deforming the plate-like metal body, Stress is applied to the electro-optic crystal by the metal body trying to deform in the opposite direction.

Field detecting optical system of the present invention includes the electro-optic crystal support table, and said means for entering light into the electro-optic crystal and the electro-optic crystal, an electrical signal between the respective electrodes for applying said electric signal and means for applying, and said means for detecting the electrical signal by the light emitted from the electro-optical crystals.

  According to the present invention, since the stress is applied to the electro-optic crystal by the deformation of the metal body, the electro-optic crystal can be supported so as not to give an impact to the electro-optic crystal and to cause no defect or deterioration of characteristics. .

1A and 1B are a perspective view and a side view showing an electro-optic crystal support base and an electro-optic crystal according to a first embodiment of the present invention. It is the perspective view and side view which show a mode that the metal body of the electro-optic crystal support stand shown in FIG. 1 is deformed. FIG. 2 is a perspective view and a side view showing a state in which an electro-optic crystal is arranged on the electro-optic crystal support shown in FIG. It is the perspective view and side view which show a mode that the metal body of the electro-optic crystal support stand shown in FIG. 1 deform | transforms in a reverse direction. It is a schematic diagram which shows the structural example of the electric field detection optical apparatus containing the electro-optic crystal support stand shown in FIG. It is a schematic diagram which shows another structural example of the electric field detection optical apparatus containing the electro-optic crystal support stand shown in FIG. It is the perspective view and side view which show the electro-optic crystal support stand and electro-optic crystal which concern on the 3rd Embodiment of this invention. It is the perspective view and side view which show a mode that the metal body of the electro-optic crystal support stand shown in FIG. 7 is deformed. It is the perspective view and side view which show a mode that an electro-optic crystal is arrange | positioned on the electro-optic crystal support stand shown in FIG. It is the perspective view and side view which show a mode that the metal body of the electro-optic crystal support stand shown in FIG. 7 deform | transforms in a reverse direction. It is the perspective view and side view which show the electro-optic crystal support stand and electro-optic crystal which concern on the 5th Embodiment of this invention. It is the perspective view and side view which show the electro-optic crystal support stand and electro-optic crystal which concern on the 6th Embodiment of this invention. FIG. 13 is a perspective view and a side view showing a state in which an electro-optic crystal is arranged on the electro-optic crystal support shown in FIG. 12. It is the perspective view and side view which show a mode before deforming the metal body of the electro-optic crystal support stand shown in FIG. It is the perspective view and side view which show a mode that the metal body of the electro-optic crystal support stand shown in FIG. 12 deform | transformed. It is a perspective view which shows the conventional electro-optic crystal. It is a perspective view which shows the electro-optic crystal reduced in size and the electro-optic crystal support stand.

[First Embodiment (Second Embodiment)]
As shown in FIG. 1, an electro-optic crystal (hereinafter referred to as a crystal) 1 is sandwiched between two electrodes 11 and 12. The crystal 1 is, for example, a flat plate, and the material thereof is a compound semiconductor crystal (GaAs, InP, CdTe, etc.) having a ZnTe or zinc flash steel type or a sillenite compound (Bi ₁₂ GeO ₂₀ , Bi ₁₂ SiO ₂₀ , Bi _12). TiO ₂₀ etc.). The electrode is, for example, an alloy of gold and copper, and is deposited on the crystal 1 by sputtering. For example, the width, height, and length of the crystal 1 are 0.2 mm, 0.5 mm, and 7.0 mm, respectively.

  An electro-optic crystal support base (hereinafter referred to as a support base) 2 is integrated with the crystal 1 to support the crystal 1. The material of the support base 2 is an insulator such as plastic. For example, the width, height, and length of the support base 2 are 1.5 mm, 1.5 mm, and 7.0 mm, respectively.

  The support base 2 includes metal bodies 21 and 21 that are in contact with the electrode 11, and metal bodies 22 and 22 that are in contact with the electrode 21. The metal body 22 applies a stress to the electro-optic crystal when the metal body 22 itself tries to deform. The metal body 21 is made of, for example, the same material as the electrode, and is disposed on the opposite side of the metal body 22 with the crystal 1 interposed therebetween so as to receive stress from the metal body 22.

  In the first embodiment, the metal body 22 is a shape memory alloy (for example, nickel titanium alloy). The transformation temperature of the crystal memory alloy, which is a nickel titanium alloy, is determined by the nickel composition. For example, when the nickel composition is 46.8 to 47.0%, the transformation temperature is 50 to 80 ° C., and when the nickel composition is 54 to 56%, the transformation temperature is 70 to 100 ° C. In the first embodiment, the metal body 22 which is a shape memory alloy is deformed by applying stress. However, in the case of the former composition, since the elastic modulus is close to 0 at room temperature, the necessary stress can be reduced. it can.

  On the other hand, the support base according to the second embodiment of the present invention has a configuration similar to that of the support base 2, except that the metal body 22 is a bimetal. Bimetal is a laminate of two metals having different coefficients of thermal expansion. As the bimetal, for example, a Ni—Fe alloy (Ni 36%) which is a metal having a low coefficient of thermal expansion and an alloy such as Cu and Ni which are metals having a high coefficient of thermal expansion are bonded. In the second embodiment, the metal body 22 that is a bimetal is deformed by heating or cooling, but the two types of metal may be selected in view of how much the metal is deformed, not the combination of the above examples. May be.

  First, an electro-optic crystal supporting method (hereinafter, the electro-optic crystal supporting method is simply referred to as a supporting method) when the metal body 22 is a shape memory alloy will be described, and then the second embodiment A form, that is, a supporting method in the case where the metal body 22 is a bimetal will be described.

(When the metal body 22 is a shape memory alloy)
First, the shape is stored in the metal body 22. When the metal body 22 is a nickel titanium alloy, the shape is memorized, for example, by quenching at 400 to 500 ° C. And the metal body 22 is arrange | positioned to the support stand 2 as shown in FIG. At this point, the distance between the metal body 22 and the electrode 12 is so narrow that the crystal 1 cannot be arranged.

  Next, as shown in FIG. 2, the metal body 22 is deformed by an external stress, for example, by hand. The metal body 22 is V-shaped. That is, since the metal body 22 has only one bent portion, only the bent portion is deformed. By this deformation, a space for arranging the crystal 1 is generated. If the deformation of the bent portion is too large, the metal body 22 cannot store the shape. For example, the deformation of the bent portion is preferably about 10%.

  Next, the crystal 1 is placed on the support base 2 as shown in FIG. When the transformation temperature of the metal body 22 is higher than room temperature, the steps so far are performed at room temperature, for example.

  Next, the metal body 22 is heated with a lamp heater, a heating iron, hot air, or the like. When the metal body 22 reaches the transformation temperature, the metal body 22 is deformed in the reverse direction as shown in FIG.

  If the space where the crystal 1 can be placed is eliminated in advance as shown in FIG. 1, the metal body 22 contacts the electrode 12 before returning to its original shape. Since the metal body 22 tends to further deform, stress is applied to the crystal 1.

  Next, the heating is stopped. The metal body 22 is cooled to room temperature. The cooled metal body 22 continues to apply stress to the crystal 1 through the electrode 12.

(When the metal body 22 is bimetal)
First, as shown in FIG. 1, the metal body 22 is disposed on the support base 2. At this point, the distance between the metal body 22 and the electrode 12 is so narrow that the crystal 1 cannot be arranged.

  Next, the metal body 22 is heated with a lamp heater or the like. The metal body 22 is deformed by heating as shown in FIG. The metal body 22 has only one bent portion, and only this bent portion is deformed. By this deformation, a space for arranging the crystal 1 is generated.

  Next, the crystal 1 is placed on the support base 2 as shown in FIG. Heating is stopped prior to or after this placement. As shown in FIG. 4, the metal body 22 is cooled and deformed in the reverse direction.

  As shown in FIG. 1, if the space for arranging the crystal 1 is eliminated in advance, the metal body 22 contacts the electrode 12 before returning to its original shape. Since the metal body 22 tends to be further deformed, stress is continuously applied to the crystal 1 through the electrode 12.

  As shown in FIG. 5, the electric field detection optical device emits light from the crystal 1, for example, means 3 for making light incident on the crystal 1, electrodes 41 and 42 for applying an electric signal between the metal bodies 21 and 22. And means 5 for detecting an electrical signal by light. For example, one metal body 21 is connected to the electrode 41. For example, one metal body 22 is connected to the electrode 42. An electric signal is applied between the electrodes 41 and 42. Laser light emitted from the laser diode 31 passes through the lens 32, the polarization beam splitter 33, and the wave plate 34. Laser light is incident on the crystal 1 from one end face. An electric field is generated in the crystal 1 by an electric signal. The laser light is modulated by the electric field and emitted from the other end face. The laser beam is separated into a P wave component and an S wave component by the polarization beam splitter 51. The photodiodes 52 and 52 convert the P wave component and the S wave component into electric signals.

  The electric field detection optical device shown in FIG. 6 operates on the same principle, and is used for evaluating the crystal 1. The AC power source 6 applies an AC signal between the electrodes 41 and 42. The electric field in the crystal 1 due to the AC signal polarizes the laser beam passing therethrough. The evaluation device 7 evaluates the polarization ratio of the laser light and displays the evaluation result on the display device 8.

[Third Embodiment (Fourth Embodiment)]
As shown in FIG. 7, the support base 2 </ b> A has a configuration similar to that of the support base 2 according to the first embodiment shown in FIG. 1 and the like, and the metal body 22 that is a shape memory alloy has a plurality of bent portions. It differs only in having. The metal body 22 is curved.

  Here, in consideration of the first embodiment, in the metal body 22 shown in FIG. 2, for example, if the metal body 22 is greatly deformed so as to widen the space in which the crystal 1 is arranged, the metal body 22 has a large bent portion. Deformation occurs. Due to the characteristics of the shape memory alloy, if the deformation of the bent portion is too large, it will not return to the original shape (the memorized shape). In some cases, in FIG. 4, the metal body 22 does not contact the electrode 21, and no stress is applied to the crystal 1.

  On the other hand, in the third embodiment, even when the metal body 22 is largely deformed as shown in FIG. 8, the amount of deformation is dispersed, and the deformation at each bent portion is small. Therefore, even if the metal body 22 is greatly deformed, the original shape is restored and stress can be applied to the crystal 1 reliably. Further, by greatly deforming the metal body 22, the space for arranging the crystal 1 can be widened, so that the crystal 1 can be easily taken in and out and the crystal 1 can be easily arranged.

  That is, also in the third embodiment, when the crystal 1 is arranged on the support 2A as shown in FIG. 9 and the metal body 22 is heated, the metal body 22 is deformed in the opposite direction as shown in FIG. As shown in FIG. 7, if the space for arranging the crystal 1 is eliminated in advance, the metal body 22 contacts the electrode 12. Since the metal body 22 tends to further deform, stress is applied to the crystal 1. When the heating is stopped, the metal body 22 is cooled to room temperature. The cooled metal body 22 continues to apply stress to the crystal 1 through the electrode 12.

  The support base according to the fourth embodiment of the present invention has a configuration similar to the support base 2A, except that the metal body 22 is a bimetal.

  Similarly to shape memory alloys, bimetals do not return to their original shape due to their characteristics, and the crystal 1 may not be stressed due to its characteristics.

  On the other hand, in the fourth embodiment, similarly to the shape memory alloy, even when the metal body 22 is deformed in the same manner, the deformation at each bent portion is small. Therefore, it is easy to return to the original shape, and stress can be reliably applied to the crystal 1. Further, the space for arranging the crystal 1 can be widened, and the crystal 1 can be easily arranged.

[Fifth Embodiment]
As shown in FIG. 11, the support base 2 </ b> B has a configuration similar to the support base 2 </ b> A shown in FIG. 7 and the like, except that the number of metal bodies 22 is one. That is, in the present invention, the number of the metal bodies 22 is arbitrary. Further, the metal body 22 may be bent at one place without being bent as shown in FIG. Further, the metal body 21 may be configured similarly to the metal body 22. The support method and effects in the fifth embodiment are the same as those in the first embodiment.

[Sixth Embodiment]
As shown in FIG. 12, the metal body 22 of the support base 2C is a plate-shaped metal body having a plate shape. The metal body 22 is formed with a through hole 22a and a surrounding notch 22b. The metal body 22 is curved symmetrically about the through hole 22a. Each end of the metal body 22 is curved in the opposite direction. One end of a shaft rod 2b penetrating the fixed ball 2a is fixed to the support base 2C.

  First, as shown in FIG. 13, the crystal 1 is placed on the support 3C. Next, as shown in FIG. 14, the shaft 2b is passed through the through hole 22a. Next, the metal body 22 is pressed toward the fixed sphere 2a. Then, the fixed sphere 2a widens the cut 22b, and the fixed sphere 2a penetrates the through hole 22a as shown in FIG. If the metal body 22 is in contact with the electrode 12 when the fixed sphere 2a extends the notch 22b, the metal body 22 when the fixed sphere 2a penetrates the through hole 22a receives stress from the fixed sphere 2a. Is deformed. Since the metal body 22 tends to deform in the opposite direction, stress is applied to the crystal 1.

  The shaft 2b may be fixed to the support base 2C later using a screw type or the like. Further, a bolt may be passed through such a shaft rod 2b, and the metal body 22 may be fixed at a desired position by the bolt.

  As described above, the support base according to each embodiment has the metal bodies 21 and 22 that are in contact with the respective electrodes 11 and 12, and stress is applied to the crystal 1 when at least one of the metal bodies tries to deform. Since it is added, the crystal 1 can be supported so as not to give an impact to the crystal 1 and to prevent defects and deterioration of characteristics. Therefore, the yield of the element composed of the crystal and the support base can be improved, and the cost can be reduced because soldering and bonding are unnecessary. Of course, since the support can be held, it is easy to handle crystals. Further, it is compatible in shape with a conventional element (see FIG. 16), and can be used as an inexpensive alternative element.

DESCRIPTION OF SYMBOLS 1 Electro-optic crystal 2, 2A, 2B, 2C Electro-optic crystal support stand 11, 12 Electrode 21, 22 Metal body 2a Fixed ball 2b Axle rod 22a Through-hole 22b Notch

Claims (11)

An electro-optic crystal support that supports an electro-optic crystal sandwiched between two electrodes,
The electro-optic crystal support has a metal body that is in contact with each of the electrodes, and an electrode for applying an electric signal to each of the metal bodies is connected. Used together with means for making light incident on the electro-optic crystal and means for detecting the electric signal by light emitted from the electro-optic crystal,
The electro-optic crystal support is configured to apply stress to the electro-optic crystal when at least one of the metal bodies is deformed. The metal body that applies stress to the electro-optic crystal is a shape memory alloy,
When the shape memory alloy is deformed by stress and the shape memory alloy is heated, the shape memory alloy is deformed in the reverse direction by heating, and when deformed in the reverse direction, the shape memory alloy is transformed into the electro-optic crystal. The electro-optic crystal support table according to claim 1, wherein stress is applied to the electrode. The metal body that applies stress to the electro-optic crystal is a bimetal,
When the bimetal is heated, the bimetal is deformed when heated, the bimetal is cooled and deformed in the reverse direction, and the bimetal applies stress to the electro-optic crystal when deformed in the reverse direction. The electro-optic crystal support base according to claim 1, wherein: The electro-optic crystal support base according to claim 2 or 3, wherein the metal body that applies stress to the electro-optic crystal has a plurality of bent portions. The metal body that applies stress to the electro-optic crystal is a plate-shaped metal body having a plate shape,
2. The electricity according to claim 1, wherein when the plate-like metal body is deformed, stress is applied to the electro-optic crystal when the plate-like metal body tries to deform in a reverse direction. Optical crystal support. An electro-optic crystal support method using an electro-optic crystal support that supports an electro-optic crystal sandwiched between two electrodes,
The electro-optic crystal support has a metal body that is in contact with each of the electrodes, and an electrode for applying an electric signal to each of the metal bodies is connected. Used together with means for making light incident on the electro-optic crystal and means for detecting the electric signal by light emitted from the electro-optic crystal,
The electro-optical crystal supporting method is characterized in that stress is applied to the electro-optical crystal when at least one of the metal bodies is deformed. The metal body that applies stress to the electro-optic crystal is a shape memory alloy,
The electro-optic crystal support method includes a step of deforming the shape memory alloy, and a step of heating the shape memory alloy,
The electro-optic crystal support according to claim 6, wherein the shape memory alloy is deformed in a reverse direction when heated, and the shape memory alloy applies stress to the electro-optic crystal when deformed in the reverse direction. Method. The metal body that applies stress to the electro-optic crystal is a bimetal,
The electro-optic crystal support method includes a step of heating the bimetal,
The bimetal deforms when heated, the bimetal cools and deforms in the reverse direction, and the bimetal applies stress to the electro-optic crystal when deformed in the reverse direction. The electro-optic crystal supporting method as described.   9. The electro-optic crystal supporting method according to claim 7, wherein the metal body that applies stress to the electro-optic crystal has a plurality of bent portions. The metal body that applies stress to the electro-optic crystal is a plate-shaped metal body having a plate shape,
The electro-optic crystal support method includes a step of deforming the plate-like metal body,
The electro-optic crystal supporting method according to claim 6, wherein stress is applied to the electro-optic crystal when the deformed plate-like metal body is deformed in a reverse direction. An electro-optic crystal support table according to any one of claims 1 to 5,
And said means for entering light into the electro-optic crystal and the electro-optic crystal,
Means for applying an electrical signal between the electrodes for applying the electrical signal;
An electric field detecting optical device comprising: the means for detecting the electric signal by light emitted from the electro-optic crystal.

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