JP5184334B2 - Probe for temperature measurement - Google Patents

Description

  The present invention relates to a temperature measurement probe that measures the temperature of a plate-like body under a heat treatment environment by a contact method.

  Conventionally, this type of temperature measurement probe has a structure in which a sheath thermocouple is inserted into a thin tubular covering member and the whole body of the sheath thermocouple is covered with the covering member, and the tip of the covering member is blocked. A long and thin circular tube, whose tip is processed and formed into a flat surface with a width of about 0.5 mm and a length of about 15 mm, is proposed to be used to come into surface contact with the surface of a semiconductor wafer. (For example, refer to Patent Documents 1 and 2.) In particular, in Patent Document 2, due to warpage of a heated semiconductor wafer and warpage or distortion of a covering member, floating occurs between the above-described flat surface and the semiconductor wafer, thereby inhibiting heat conduction from the semiconductor wafer and measuring temperature. It has been found that this is the cause of deterioration in accuracy and responsiveness, and in order to eliminate this, the flat surface is formed by rotating the covering member in three-dimensional directions using the load received by the flat surface from the semiconductor wafer as a driving force. There has been proposed one provided with a posture correcting mechanism for making surface contact with the lower surface of the semiconductor wafer. However, such a posture correction mechanism of Patent Document 2 becomes a large-scale device, which increases costs and is a mechanism that rotates the entire covering member, and therefore requires a certain amount of extra space in the heat treatment apparatus. there were.

  On the other hand, a plate-like probe head configured separately from the probe main body is attached to the tip end side of the probe main body so that it can be swung in response to the weight of the semiconductor wafer without moving the probe main body which is a covering member. There has also been proposed a probe head that is provided with a thermocouple temperature sensing portion, and the probe head is closely attached to the back surface of the semiconductor wafer to measure the temperature (see, for example, Patent Documents 3 and 4). However, the temperature measurement probe of Patent Document 3 is a probe head mounted on a raised lip protruding in a cylindrical shape at the tip of the probe body and attached in a state where the two are connected by a thermocouple sensor wire. Yes, the probe head can tilt on the lip due to the weight of the wafer, but the probe head has lifted from the end surface of the lip to tilt from the contact with the ring, and the sensor wire of the thermocouple has been pulled or lifted There is a risk of breakage or disconnection due to stress due to being caught in the gap. In addition, since the probe head and the probe main body are contacted in an annular shape, the contact area is large, and the heat of the probe head escapes to the main body side, resulting in a decrease in temperature measurement accuracy.

  On the other hand, the temperature measurement probe of Patent Document 4 is configured such that the probe head is supported only by the sensor wire of the temperature sensor and the probe body does not touch the probe head. In this case, since the probe head is thermally separated from the probe body, heat escape can be avoided. Specifically, the sensor line of the temperature sensor forms two triangular legs with the head apex, and the sensor line itself has an appropriate hardness to support the probe head and the weight of the semiconductor wafer. In response to this, the sensor wire is bent so that the probe head follows and tilts the wafer. However, in such a configuration, a special sensor wire that has strength and elasticity is required, and the accuracy is high. This is inconvenient because the width that can be selected is limited. Also, once the probe head is tilted at an angle exceeding the elastic range of the sensor wire, it will not return to its original shape, and repeated use will cause the sensor wire to be bent at multiple locations, resulting in insufficient support strength and contact pressure. The sensor line is lowered and affects the measurement accuracy, and the bent sensor wire may be sandwiched between the probe head and the probe body.

JP-A-4-148545 JP 2000-81355 A US Pat. No. 5,791,782 JP 2000-227363 A

  Therefore, in view of the above-described situation, the present invention intends to solve the problem that the load of the plate-like body can be supported without imposing a load on the sensor wire, and the probe head receives the weight of the plate-like body. The angle can be changed smoothly (relative rotational movement) to follow and adhere closely, and even during the rotational movement, the sensor line is not burdened at all, and it is possible to use a sensor line with finer sensitivity. Furthermore, another object of the present invention is to provide a temperature measurement probe that can minimize heat escape from the probe head and perform temperature measurement more accurately.

  In order to solve the above-mentioned problems, the present invention includes a temperature sensor, and a temperature measurement probe for measuring the temperature of a plate-like body under a heat treatment environment, including a temperature sensing portion of the temperature sensor, In addition, a probe head having a flat surface that comes into surface contact with the plate-like body is provided, and a sensor wire extending from the probe head from the temperature sensing portion is drawn into the inside through the introduction hole in the wall surface on the front end side. A probe main body made of a long protective tube that guides to the end side is provided, and the sensor wire passes vertically between the sensor wire extension of the probe head and the opening of the introduction hole of the probe main body. A temperature measuring probe comprising a substantially spherical support having a hole was constructed.

  Here, it is preferable that at least one or both of the sensor wire extension part of the probe head and the opening part of the introduction hole of the probe main body be formed with a concave spherical surface part parallel to the convex spherical surface of the support body facing each other. .

  Further, the probe head is made of a material having high thermal conductivity, and the probe main body and the support are made of a material having high light transmittance and low thermal conductivity. What is used for the temperature measurement of this plate-shaped body is preferable.

  The sensor wire is preferably a ceramic-coated thermocouple in which a thermocouple element is coated with ceramic, or a sheath thermocouple in which a thermocouple element is enclosed in a thin tube sheath.

  The temperature measuring probe according to the present invention having the above configuration is obtained by interposing a substantially spherical support between the sensor wire extension of the probe head and the opening of the introduction hole of the probe body. The head receives the weight from the plate-like body and can freely change the angle (relative rotational movement) to follow and closely adhere to it, and the support can completely load the plate-like body acting on the probe head Since it can be supported, no load is applied to the sensor wire and no support strength is required. In addition, since the support body has a substantially spherical shape, the contact between each of the probe head and the probe main body that contact the upper and lower sides is close to a point contact, compared to a conventional support by a raised lip, Smooth angle change when following.

  In addition, since the amount of heat transfer from the probe head to the support is reduced by approaching point contact, the heat transferred from the plate to the probe head does not escape to the support, allowing more accurate and stable temperature measurement. it can. Further, when the relative rotation is performed, the probe head does not float excessively with respect to the support, and the sensor wire is prevented from being pulled or sandwiched between both members. Since no stress is generated, it is possible to use a thin sensor line with higher sensitivity.

  In addition, a concave spherical surface portion parallel to the convex spherical surface of the support body facing the support body is formed in at least one or both of the sensor wire extension portion of the probe head or the opening portion of the introduction hole of the probe body. Even if the through hole is set to be slightly larger, smooth relative rotational movement is maintained, and the sensor wire can be prevented from being pulled or pinched when the angle of the support is changed.

  In addition, since the probe head is made of a material having high thermal conductivity, and the probe main body and the support are made of material having high light transmittance and low thermal conductivity, the temperature of the plate-like body is accurately measured. Reflected in the head, more accurate temperature measurement is possible, and especially when used to measure the temperature of a plate-like body under heat treatment environment heated by light irradiation, the probe body can be prevented from being heated, and the internal sensor wire is heated. Inconvenience such as causing measurement errors can be avoided.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing a principal part of a temperature measurement probe according to the present invention, and FIG. 2 is a longitudinal sectional view showing a state in which the temperature measurement probe is similarly brought into contact with a plate-like body W to measure the temperature. In the figure, reference numeral 1 is a temperature measurement probe, 2 is a temperature sensor, 3 is a probe head, 4 is a probe body, and 5 is a support.

  As shown in FIGS. 1 and 2, the temperature measurement probe 1 is a contact type probe with a built-in temperature sensor 2, and is a long protective tube into which the sensor wires 21 and 22 of the temperature sensor 2 are inserted. 40, and a probe head 3 provided on the side of the distal end portion of the probe body 4. The probe body 4 extends to the lower surface 6 side of the plate-like body W under the heat treatment environment, and The probe head 3 is brought into contact with the lower surface 6 of the plate-like body W to support the plate-like body W and simultaneously measure its temperature. In the present invention, as a support structure for providing the probe head 3 to the side of the distal end portion of the probe body 4 in particular, a substantially spherical support 5 is interposed between the two so that the warpage of the plate-like body W is reduced. In response to the strain, the probe head 3 receiving the weight from the plate-like body smoothly changes the angle of the plate-like body without imposing a burden on the internal temperature sensor wires 21 and 22 with respect to the probe body 4. It is characterized by following the inclination and supporting it so that it can be in close contact.

  In the following description, a probe used for measuring the temperature of a plate-like body (semiconductor wafer) heated under light irradiation will be described, and the structure and materials of each part will be described with suitable materials. However, the object to be measured is not limited to the semiconductor wafer, and can be appropriately applied to other plate-like bodies. In addition, a conventionally known heat treatment method by light irradiation of the plate-like body (semiconductor wafer) W can be applied. For example, the plate-like body W includes a plurality of support protrusions and a book not shown in the heat treatment apparatus. The temperature measurement probe 1 according to the invention is supported in a substantially horizontal posture by a support structure of three or more points. Further, depending on the structure in the heat treatment apparatus, it is possible to use a probe head 3 provided at the center of the tip of the probe body 4 as shown in FIG.

  The built-in temperature sensor 2 uses a ceramic-coated thermocouple in this example, and a temperature-sensing portion 23 formed by a hot junction connecting each wire end to the tip of each sensor wire 21, 22 coated with ceramics. Is formed. The diameters of the sensor wires 21 and 22 are about 0.1 mm or 0.2 mm. Depending on the heating temperature region, other coating thermocouples can be used. For example, a thermocouple coated with a synthetic resin such as a fluororesin can also be used. Further, in this example, two sensor wires 21 and 22 are formed by covering a single thermocouple wire, but a pair of thermocouple wires may be integrally covered to form only one sensor wire. Good. Of course, it is possible to use a sheathed thermocouple, and it is also possible to use a resistance temperature detector or other temperature sensors in addition to the thermocouple.

  The probe head 3 is a disk-shaped member having a flat surface portion 30 in surface contact with the plate-like body W on its upper surface, and the temperature sensing lines 21 and 22 at the tips of the temperature sensor wires 21 and 22 extended from the probe body 4 through the support body 5. The part 23 is embedded inside. Specifically, a mounting hole 32 for mounting the temperature sensor 23 of the temperature sensor is formed in the substantially central portion of the probe head 3, and the tip of the temperature sensor 2 is inserted into the mounting hole 32 to be caulked or conductive. The thermosensitive part 23 is fixed in a form exposed to the flat part 30 on the surface by being hardened with the adhesive. Although the attachment structure of the temperature sensing portion 23 is not limited to this, more accurate temperature measurement can be performed by exposing the surface and directly touching the plate-like body W as in this example.

  This probe head 3 is made of a material having high thermal conductivity so that the heat of the plate-like body W can be accurately transmitted to the temperature sensing part 23, and in this example, it is made of aluminum or an aluminum alloy. Of course, it may be made of a material. It is also possible to cover the flat portion 30 in contact with the plate-like body W with a heat transfer layer made of a material having high thermal conductivity, and to configure other portions with other members. The shape of the probe head 3 is not particularly limited to a disc shape, and various shapes can be adopted as long as the probe head 3 can be placed on a substantially spherical support 5 and has a flat portion for surface contact. sell.

  The probe body 4 has sensor wires 21 and 22 extending from the probe head 3 through the through holes 50 of the support 5 described later, and introduced into the wall 42 on the tip side in the lateral direction. It is composed of a long hollow protective tube 40 drawn into the interior from 41 and guided to the proximal end side. The protective tube 40 can suppress light absorption due to light irradiation of the heat treatment apparatus and prevent temperature rise. In this example, it is made of quartz glass. However, it is also preferable to use other materials having high light transmittance and low thermal conductivity. When the temperature of the protective tube 40 constituting the probe body 4 rises, the temperature of the internal sensor wires 21 and 22 also rises, resulting in a change in the measured temperature value and causing a measurement error. In this example, this can be prevented. Become. In the present example, a guide tube 20 made of stainless steel or the like through which the sensor wires 21 and 22 are inserted is further provided inside the protective tube 40, and noise or the like to the sensor wires 21 and 22 is provided by the guide tube 20. This prevents signal input and facilitates assembly during manufacture. Here, the guide tube 20 is also preferably made of quartz glass having a high light transmittance and a low thermal conductivity.

  The support body 5 is interposed between the sensor wire extension portion 31 of the probe head 3 and the opening portion of the introduction hole 41 of the probe body 4 for passing the sensor wires 21 and 22 up and down in the vertical direction. A through hole 50 is provided. The material of the support 5 is made of the same quartz glass for the same reason as the probe main body 4, but it is also preferable to use other materials having high light transmittance and low thermal conductivity. The support 5 completely supports the load of the plate-like body W applied to the probe head 3, and no stress acts on the inserted sensor wires 21 and 22. And since this support body 5 is comprised by the substantially spherical body shape, it contacts in the small area between the sensor wire extension parts 31 of a probe head on the upper side, and the heat transmitted from the plate-shaped body W to the probe head 3 is carried out. However, more accurate and stable temperature measurement is possible without escaping to the support 5 side.

  Further, since the support body 5 is substantially spherical in this way, the probe head 3 and the probe main body 4 that are in contact with the support body 5 slide smoothly on the spherical surface of the support body 5 and lift up. The contact state is such that the angle can be changed (relatively rotated) without being subjected to stress such as the sensor wire being pulled. That is, when the load of the plate-like body W tilted due to warpage or the like acts on the probe head 3, the probe head 3 moves relative to the support 5 so as to follow the tilt, or the support 5 and the probe The angle of the probe head 3 is changed (relative rotation movement) until the upper surface of the probe head 3 comes into close contact with the lower surface of the plate-like body W due to the relative rotation movement of the main body 4 or both. .

  In this embodiment, as shown in FIG. 2, a concave spherical surface portion 41 a parallel to the convex spherical surface of the support 5 that faces the support body 5 is formed in the opening portion of the introduction hole 41 of the probe main body 4. Is possible. FIG. 3 shows a state in which the probe head 3 follows and closely contacts when the plate-like body W is tilted. The probe head 3 and the support body 5 do not move relative to each other. This is an example of following and adhering due to relative rotational movement. It should be noted that, as shown in FIG. 6, for example, as shown in FIG. 6, a straight hole may be used, and a hole narrower than that shown in FIG.

  FIG. 4 shows a modified example in which the sensor line extending portion 31 of the probe head 3 is also provided with a concave spherical surface portion 31a parallel to the convex spherical surface of the supporting member 5 facing the same. In this example, the probe head 3 and the support 5 are also rotated relative to each other, and the probe head 3 and the support 5 are also rotated relative to each other so as to follow and adhere to the plate-like body W that is further inclined. In the example of FIGS. 1 to 3, such a concave spherical surface portion 31 a is not formed. Therefore, when the inner diameter of the through hole 50 of the support 5 is increased, the contact with the probe head 3 becomes a larger annular shape. The relative rotational movement with respect to the support 5 does not function smoothly, that is, the probe head 3 is stably supported by the opening of the annular through hole 50, but the concave spherical surface portion 31a as shown in FIG. If the inner diameter of the through hole 50 is somewhat increased, smooth relative rotational movement is possible.

  FIG. 5 shows a modified example in which a diameter-expanded portion 50b that expands toward one end or both end openings of the through hole 50 of the support 5 is formed, and the amount of relative rotation increases. Also, the sensor wires 21 and 22 are configured not to be subjected to stress such as bending at the opening end portion of the through hole 50. In the figure, it is formed in a tapered shape, but it is also preferable that the diameter is gradually increased in an R shape. Further, in FIG. 6, even if the introduction hole 41 of the probe main body 4 is a straight hole and the hole diameter is set to be larger and the relative rotation movement with respect to the support 5 is performed, the sensor wires 21 and 22 do not hit the edge of the introduction hole 41. It is configured as follows. 7 increases the inner diameter of the through hole 5 of the support body 5 while reducing the inner diameter of the introduction hole 41 of the probe main body 4 so that the sensor wires 21 and 22 can be changed even when the angle is changed (relative rotational movement). This is an example in which stress can be prevented from acting on the sensor wires 21 and 22 by being able to move freely left and right within the through hole 50. However, if the inner diameter of the through-hole 5 becomes too large, the relative rotational movement cannot be performed smoothly as described above. Therefore, the inner diameter is set within a range that does not hinder the smooth rotational movement. FIG. 8 shows an example in which the introduction hole 41 is provided vertically in the center of the end portion of the tip side wall surface 42 of the protective tube 40, and the support 5 and the probe head 3 are provided vertically in the center of the tip portion of the probe body 4. is there. Such a thing can be used depending on the space structure under the plate-like body W in the heat treatment apparatus.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and can of course be implemented in various forms without departing from the gist of the present invention.

The perspective view which shows the principal part of the probe for temperature measurement which concerns on typical embodiment of this invention. The longitudinal cross-sectional view which shows the principal part of the probe for temperature measurement similarly. The longitudinal cross-sectional view which shows the state which followed and closely_contact | adhered to the plate-shaped object in which the probe head inclines. The longitudinal cross-sectional view which shows the modification which provided the concave spherical surface part in the sensor wire extension part of a probe head. (A), (b) is a longitudinal cross-sectional view which shows the modification which formed the enlarged diameter part in the edge part in the through-hole opening part of a support body. (A), (b) is a longitudinal cross-sectional view which shows the modification which made the introduction hole of the probe main body the straight hole with a large internal diameter. (A), (b) is a longitudinal cross-sectional view which shows the modification which enlarged the internal diameter of the through-hole of the support body. The longitudinal cross-sectional view which shows the modification which provided the probe head in the vertical direction in the center of the front-end | tip part of a probe main body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe for temperature measurement 2 Temperature sensor 3 Probe head 4 Probe main body 5 Support body 6 Lower surface 20 Guide tube 21 and 22 Sensor wire 23 Temperature sensing part 30 Plane part 31 Extension part 31a Concave spherical part 32 Mounting hole 40 Protective tube 41 Introduction Hole 41a Concave spherical portion 42 Wall surface 50 Through hole 50b Expanded portion W Plate-like body

Claims (4)

In the temperature measurement probe that has a built-in temperature sensor and measures the temperature of the plate in the heat treatment environment,
While providing a probe head having a temperature sensing part of the temperature sensor and having a flat part in surface contact with the plate-like body,
A probe main body made of a long protective tube is provided to guide the sensor wire from the temperature sensing portion extending from the probe head from the introduction hole of the wall surface on the distal end side to the inside, and guiding it to the proximal end side,
Between the sensor wire extension part of the probe head and the opening part of the introduction hole of the probe body, a substantially spherical support body having a through hole through which the sensor line passes vertically is interposed. A characteristic temperature measurement probe.   2. The concave spherical surface parallel to the convex spherical surface of the supporting body is formed on at least one or both of the sensor wire extension portion of the probe head and the opening portion of the introduction hole of the probe main body. Temperature measurement probe.   A plate in a heat treatment environment in which the probe head is made of a material having high thermal conductivity, and the probe body and the support are made of a material having high light transmittance and low thermal conductivity, and are heated by light irradiation. The temperature measuring probe according to claim 1 or 2, which is used for measuring a temperature of a solid body.   The sensor wire according to any one of claims 1 to 3, wherein the sensor wire is a ceramic-coated thermocouple in which a thermocouple element is coated with ceramics, or a sheath thermocouple in which a thermocouple element is enclosed in a thin tube sheath. Temperature measurement probe.

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