JP5183454B2 - Liquid crystal display - Google Patents

Description

The present invention relates to a liquid crystal display device manufactured using a liquid crystal dropping (One Drop Fill: hereinafter referred to as “ODF”) method, and more particularly to a resin layer of each substrate at a position overlapping with a connecting portion of a sealing material in a plan view. The present invention relates to a liquid crystal display device that can suppress a partial seal material from becoming too thick when both substrates are bonded together by providing a notch.

There is an ODF method as a method of sealing liquid crystal in a liquid crystal display device. In the ODF method, before bonding two substrates on which various wirings are formed, for example, an array substrate and a color filter substrate, a sealing material is applied in a closed loop shape to one of the lower substrates. In this method, the liquid crystal is dropped on the inner side, and then the other upper substrate is covered and bonded together, and the sealing material is cured by irradiation of ultraviolet rays or the like.

In the ODF method, since the liquid crystal is directly dropped and sealed inside the sealing material applied in a closed loop shape, it is not necessary to form a liquid crystal injection port. Therefore, the frame area of the liquid crystal display device can be narrowed to increase the display area, and the number of manufacturing processes can be simplified.

When applying the sealing material of the liquid crystal display device by the ODF method, the sealing material will be formed in a closed loop shape by a dispenser. About the application start point and the application end point of the sealing material,
The amount of the sealing material that is discharged tends to increase compared to other parts. Further, the connecting portion of the sealing material where the starting point and the ending point overlap each other with a large amount of the sealing material, and the width of the sealing material is increased and thickened by the pressure when the two substrates are bonded together. As a result, the thickness of the sealing material partially becomes too large, and the liquid crystal in the substrate tends to accumulate around the periphery, resulting in uneven cell thickness and poor appearance.

An invention relating to a liquid crystal display device with improved seal reliability manufactured using the ODF method is disclosed in Patent Document 1 below. In the liquid crystal display device disclosed in Patent Document 1 below, two substrates each having a display unit formed at the center are arranged opposite to each other so as to surround each substrate and the display unit between these substrates. A liquid crystal display device in which liquid crystal is arranged in a space formed by a sealing material formed in a closed loop shape, and the sealing material has a closed loop shape around the periphery of the display portion, and its end point is the starting point. It is formed so as to cross the end. A portion where the end point of the sealing material intersects with the start point is formed at one of the four corners of the rectangular substrate, and the start point and the end point of the sealing material are outside the closed loop. And is formed so as to intersect at a substantially right angle.
JP 2003-344863 A

According to the liquid crystal display device disclosed in Patent Document 1, since the intersection of the end point end portion and the start point end portion of the sealing material is formed at the corner portion of the substrate, the sealing material is temporarily insufficiently overlapped. It is said that a liquid crystal display device with high seal reliability can be obtained without causing a gap defect due to excessive seal puncture or seal material. However, in the liquid crystal display device disclosed in Patent Document 1 described above, even if the intersection of the sealing material is formed at the corner portion of the substrate, if the amount of the sealing material exceeds the allowable amount of the corner portion, the seal There is a risk that a gap defect will occur due to excessive piling of material. In addition, the sealing material may overflow into the display area and cause display failure. In addition, since it becomes difficult to control the dispenser that applies the sealing material at the corner portion of the liquid crystal display device, if the connecting portion of the sealing material is formed at the corner portion, the connection of the sealing material is not reliable, and the sealing material application is poor. This may cause a problem.

As a result of various studies to solve the problems of the prior art as described above, the present inventors have intentionally overlapped a resin film (for example, overcoat layer, When creating a step by cutting out an interlayer film, etc., it becomes a refuge area for the sealing material when bonding the substrates, and it can be found that the connecting portion of the sealing material can be suppressed from becoming thick,
The present invention has been completed. That is, an object of the present invention is to provide a liquid crystal display device manufactured by the ODF method, in which the connection portion where the application start point and the application end point of the sealing material overlap is prevented from becoming thick.

According to one aspect of the present invention for solving the above-described problem, a pair of opposing substrates are bonded to each other by a sealing material arranged in a closed loop shape in a frame region around the display region, and the liquid crystal is paired by a liquid crystal dropping method. In the liquid crystal display device sealed between the substrates, an interlayer film made of an insulating film is arranged in the frame region on the side where the liquid crystal exists in one of the pair of substrates, and the other of the pair of substrates In the frame area on the side where the liquid crystal exists, an overcoat layer made of an insulating film is arranged, and the sealing material arranged in a closed loop has a connection portion between the application start point and the application end point. In addition, in both the interlayer film and the overcoat layer, a liquid crystal display in which a plurality of groove-shaped notches with the outer periphery of the liquid crystal display device as an open end is provided at a position overlapping the connection portion in plan view. An apparatus is provided.

In the liquid crystal display device in which liquid crystal is injected by the ODF method of the conventional example, the connecting portion between the end point of the sealing material application end point and the end point of the application start point is thicker than the other portions when the sealing material is applied. Since it rises, when the two substrates are bonded together, pressure is applied and the sealing material is deformed and the width of the sealing material is increased. This thickened connecting portion of the sealing material may cause cell gap unevenness between the two substrates, or the sealing material may overflow to the display area, causing display defects.

However, according to the liquid crystal display device described above, the excess portions of the connection portion of the sealing material can flow to the switching interrupt section, it is possible to suppress partial Overweight sealing material, between the substrates Cell gap unevenness and display defects can be suppressed. Incidentally, it refers to a portion where the start and end points of the sealant application portion overlapping the connection portion of the sheet Lumpur material.

The manufacturing process of the liquid crystal display device, after the sealant is applied to one of the pair of substrates, there is a step of bonding the other substrate. In this process, the connecting part of the sealing material is crushed and expanded, but the expanded sealing material is blocked by the thickness of the common wiring and easily moved to the open end side. It becomes difficult to get into .

Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a liquid crystal display device for embodying the technical idea of the present invention, and is not intended to specify the present invention for this liquid crystal display device. Other embodiments within the scope of the claims are equally applicable. In each drawing used for the description in this specification, each layer and each member are displayed in different scales so that each layer and each member can be recognized on the drawing. However, it is not necessarily displayed in proportion to the actual dimensions.

FIG. 1 is a plan view of a liquid crystal display device according to first to fourth embodiments of the present invention. FIG. 2 is an enlarged plan view showing an enlarged one pixel region. FIG. 3 is a cross-sectional view of the main part taken along line III-III in FIG. FIG. 4 is a cross-sectional view of an essential part taken along line IV-IV in FIG. FIG. 5A is a schematic perspective view showing a state in which the application of the sealing material is started, FIG. 5B is a schematic perspective view showing a state in which the start point and the end point of the sealing material are connected, and FIG. It is an enlarged view of VC part. 6A is an enlarged plan view in which the VI portion of FIG. 1 is transmitted through the array substrate with the color filter substrate down in the liquid crystal display device of Embodiment 1, and FIG. 6B is a main portion cut along the VIB-VIB line of FIG. 6A. It is sectional drawing. FIG. 7 is a cross-sectional view of a main part corresponding to FIG. 4 in the liquid crystal display device of the second embodiment. FIG. 8A
FIG. 8B is an enlarged plan view corresponding to FIG. 6A viewed through the color filter substrate with the array substrate facing down in the liquid crystal display device of Embodiment 2, and FIG. 8B is a cross-sectional view taken along line VIII-VIII in FIG. It is principal part sectional drawing corresponding to these. FIG. 9 is a cross-sectional view of a main part corresponding to FIG. 4 in the liquid crystal display device according to the third embodiment. 10A is an enlarged plan view corresponding to FIG. 6A as seen through the array substrate with the color filter substrate down in the liquid crystal display device of Embodiment 3. FIG.
FIG. 8B is a cross-sectional view of the main part corresponding to FIG. 6B taken along line XX in FIG. 8A. 11A is an enlarged plan view corresponding to FIG. 6A seen through the array substrate with the color filter substrate facing down in the liquid crystal display device of Embodiment 4, and FIG. 11B is cut along the XI-XI line of FIG. 9A. It is principal part sectional drawing corresponding to FIG. 6B.

Incidentally, the “surface” of the array substrate and the color filter substrate described below represents a surface on which various wirings are formed. The liquid crystal display device according to the present invention is a TN (Twiste).
d Nematic) mode, VA (Vertical Alignment) mode or MVA (Multi-domain)
A so-called vertical electric field type liquid crystal display device driven in the vertical alignment (IPS) mode, IPS (
The present invention can be applied to a horizontal electric field type liquid crystal display device such as an in-plane switching (FFS) mode or an FFS (Fringe Field Switching) mode, but in the following, the liquid crystal display of each embodiment is represented by a TN mode liquid crystal display device. The apparatus will be described.

[Embodiment 1]
As shown in FIG. 1, the liquid crystal display device 10 according to the first embodiment includes an array substrate 11 and a color filter substrate 31, a sealing material 40 for bonding the substrates 11 and 31, an array substrate 11, a color filter substrate 31, and This is a so-called COG (Chip On Glass) type liquid crystal display device having a configuration in which the liquid crystal LC is enclosed in a region surrounded by the sealing material 40. In the liquid crystal display device 10, a region surrounded by the sealing material 40 forms a display region 50, and an outer peripheral side of the display region 50 is a frame region 51. Further, since the liquid crystal display device 10 according to the first embodiment is manufactured by the ODF method, a liquid crystal injection port is not formed.

As shown in FIGS. 1 to 4, the array substrate 11 is obtained by forming various wirings for driving liquid crystal on the surface of a transparent substrate 12 made of a rectangular glass substrate or the like. The array substrate 11 has a longer length in the longitudinal direction than the color filter substrate 31 disposed opposite to each other.
When the 31 is bonded, an extended portion 12a extending to the outside is formed. The extension portion 12a is provided with a driver Dr made of an IC chip or an LSI that outputs a drive signal.

In the display area 50 of the array substrate 11, as shown in FIGS. 2 and 3, a plurality of scanning lines 13 and signal lines 14 are formed in a matrix, and the plurality of scanning lines 13 and signal lines are formed. 14 is extended to the outside of the display area 50 and is connected to the driver Dr.

Further, in the display area 50 of the array substrate, in addition to the plurality of scanning lines 13 and the signal lines 14, a plurality of auxiliary capacitance lines 15 parallel to the scanning lines 13 are provided between the plurality of scanning lines 13. Then, a gate insulating film 18 is provided so as to cover the scanning line 13, the auxiliary capacitance line 15, and the exposed transparent substrate 12. A thin film transistor (TFT: Thin Film Tr) as a switching element including the source electrode S, the gate electrode G, the drain electrode D, and the semiconductor layer 16 is formed.
ansistor) 17 is formed on the gate insulating film 18.

Further, a passivation film 19 made of an inorganic insulating material for surface stabilization is formed so as to cover them, and an interlayer film 20 made of an organic insulating material for flattening the surface of the array substrate 11 is further formed. It is filmed. The interlayer film 20 and the passivation film 1
1 is surrounded by the scanning line 13 and the signal line 14 in the portion located on the auxiliary capacitance electrode 9.
For each pixel area PA, for example, ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxid)
A pixel electrode 21 made of e) is provided, and a contact hole CH for electrical connection with the drain electrode D is provided. Then, an alignment film (not shown) is provided on these surfaces, and the array substrate 11 of the first embodiment is formed by rubbing the alignment film. Note that an area surrounded by the plurality of scanning lines 13 and signal lines 14 is one sub-pixel area P.
A.

The color filter substrate 31 is a second substrate made of a glass substrate or the like as shown in FIG.
A light shielding film 33 is formed on the surface of the transparent substrate 32 so as to cover positions corresponding to the scanning lines 13, the signal lines 14, the contact holes CH, and the TFTs 17 of the array substrate 11. Further, the surface of the second transparent substrate 32 surrounded by the light shielding film 33 has a predetermined color, for example, red (R),
A color filter layer 34 of green (G), blue (B) or the like is formed. An overcoat layer 35 is formed so as to cover the surfaces of the light shielding film 33 and the color filter layer 34. The overcoat layer 35 is made of an insulating transparent resin film. The color filter substrate 31 is provided to make the surface as flat as possible.
Note that the overcoat layer 35 has a notch 35a partially cut away (see FIG. 6B).
Is formed.

The notch 35a is formed at a position that overlaps with a connecting portion 40a of a sealing material 40 described later in plan view. As shown in FIG. 4, in the frame region 51 of the color filter substrate 31 to which the sealing material is applied, a transparent substrate 32, a light shielding film 33, an overcoat layer 35, and an alignment film (not shown) extend from the display region 50, respectively. In this way, they are stacked. The cutout portion 35a of the overcoat layer 35 can be formed by a known photolithography method. The alignment film (not shown) is rubbed to form the color filter substrate 31 of the first embodiment.

Next, application of the sealing material 40 will be described. In the first embodiment, a case where the sealing material 40 is applied to the color filter substrate 31 will be described. The sealing material 40 is applied on the color filter substrate 31 using a dispenser 41. In the liquid crystal display device 10 according to the first embodiment, since the liquid crystal injection port is not formed, the sealing material 40 is applied in a closed loop shape. Therefore, the sealing material 40 has a starting point 40b and an ending point 40c, and a connecting portion 40a is formed at the joint portion. The sealing material 40 is applied to the mother substrate on which a plurality of color filter substrate regions are formed. However, for convenience of explanation, only one color filter substrate region is illustrated here. .

And the connection part 40a of this sealing material 40 is formed in the position which overlaps with the notch part 35a of the overcoat layer 35 mentioned above in planar view. That is, as shown in FIG. 5A, application is started by controlling the dispenser 41 so that the application start point 40b of the sealing material 40 is on the cutout portion 35a of the overcoat layer 35. Thereafter, the sealing material 40 is applied on the closed loop so as to surround the display region 50, and the end point 40 c of the sealing material 40 is the overcoat layer 35.
The dispenser 41 is controlled so as to be on the notch portion 35a of FIG.
The application of the sealing material 40 is terminated when the start point 40b and the end point 40c of the sealing material 40 meet. At this time, as shown in FIG. 5C, the portion where the starting point 40b and the end point 40c of the sealing material 40 overlap and the thickness is increased becomes the connecting portion 40a. Since the connecting portion 40a of the sealing material 40 has a certain size, the cutout portion 35a of the overcoat layer 35 is formed larger than the connecting portion 40a so that the entire connecting portion 40a can be accommodated. ing.

After the application of the sealing material 40 is completed, the liquid crystal LC is sealed by the ODF method, the color filter substrates 31 are stacked, the sealing material 40 is cured by ultraviolet irradiation or the like, and the substrates 11 and 31 are bonded together. At this time, the connecting portion 40 where the start point 40b and the end point 40c of the sealing material 40 overlap.
Since a is crushed, the connecting portion 40a is thicker than other sealing material portions. If the sealing material 40 has a portion that is partially thickened, the liquid crystal in the substrate tends to accumulate in the periphery of the sealing material 40, and cell thickness unevenness may occur, resulting in poor appearance.

However, in the liquid crystal display device 10 of the first embodiment, the cutout portion 35a is large so that the connection portion 40a of the sealing material 40 enters all of the cutout portion 35a of the overcoat layer 35, as shown in FIG. 6A. Is formed. Thereby, the excess sealing material of the connection part 40a of the sealing material 40 can be poured into the notch part 35a of the overcoat layer 35,
As shown in FIG. 6B, since the sealing material 40 of the connecting portion 40a enters the notch 35a of the overcoat layer 35, it is possible to suppress the sealing material from becoming thick.

Further, in the liquid crystal display device 10 of the first embodiment, the cutout portion 35a is formed so that the outer peripheral side of the liquid crystal display device 10 is the open end side. Therefore, the sealing material 40 that has been crushed and spread is blocked by the step of the overcoat layer 35 that is cut off on the closed end side, and easily moves to the open end side, so that it is difficult to enter the inside of the display region 50. Thus, the display image quality is less likely to be adversely affected.

Thereafter, the mother substrate is divided into individual liquid crystal display device panels, and the extended portion 1 of the array substrate 11 is separated.
The driver Dr and the like are installed in 2a, and the liquid crystal display device 10 according to the present embodiment is completed.

As mentioned above, according to the liquid crystal display device concerning Embodiment 1, in the liquid crystal display device manufactured by ODF method, the overcoat layer of the position which overlaps with the connection part of the sealing material which intentionally increases the sealing amount in planar view In order to make a difference in the degree of crushing of the seal material at the place where the overcoat layer was cut off and other places Become. By doing so, it is possible to suppress the connection portion where the application start point and the application end point of the seal material overlap from being thick, and the liquid crystal display that suppresses the over connection portion of the seal material and reduces the occurrence of defective products. An apparatus can be provided.

[Embodiment 2]
Next, a liquid crystal display device 10A according to Embodiment 2 will be described with reference to FIGS. 7, 8A, and 8B. In the liquid crystal display device 10A according to the second embodiment, the cutout portion 35a is formed in the overcoat layer 35 of the color filter substrate 31 in the liquid crystal display device 10 according to the first embodiment, whereas the cutout portion 20a is formed. Since it is common except that it is formed on the interlayer film 20 of the array substrate 11, the same components as those of the liquid crystal display device 10 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

The cutout portion 20a is formed by cutting out the interlayer film 20 at a position overlapping the connection portion 40a of the sealing material 40 in plan view. As shown in FIG. 7, the frame region 51 of the array substrate 11 to which the sealing material 40 is applied includes a transparent substrate 12, a gate insulating film 18, a passivation film 19, an interlayer film 20, and an alignment film (not shown) as display areas. 50 is laminated and formed. Although not shown, common wiring is routed around the frame region 51 of the array substrate 11. The notch 20a of the interlayer film 20 is formed by a known photolithography method.

In the liquid crystal display device 10A according to the second embodiment, the method of applying the sealing material 40 is the same as that of the liquid crystal display device 10 according to the first embodiment, but the sealing material 40 is the array substrate 1.
1 and the position overlapping with the notch 20a of the interlayer film 20 in plan view is the start point 40b and the end point 40c of the sealing material 40, and the connection part 40a is formed in this part (FIGS. 5A to 5).
C).

As shown in FIG. 8A, the cutout portion 20a is connected to the connecting portion 40a of the sealing material 40 when viewed in plan view.
Is formed to be large so as to enter all of the notches 20 a of the interlayer film 20. As a result, excess sealing material in the connecting portion 40a of the sealing material 40 can flow into the cutout portion 20a of the interlayer film 20. Further, according to the cross-sectional view shown in FIG. Since the sealing material 40 has entered the 20 notches 20a, the sealing material 40 can be prevented from being overweight. In the liquid crystal display device 10A according to the second embodiment, the cutout portion 20a is formed so that the outer peripheral side of the liquid crystal display device 10A is the open end side. Therefore, the sealing material 40 that has been crushed and spread is blocked by the step of the notched interlayer film 20 on the closed end side and easily moves to the open end side, so that it is difficult to enter the display area 50. The display image quality is less likely to be adversely affected.

As described above, in the liquid crystal display device according to the second embodiment as well, as in the liquid crystal display device according to the first embodiment, it is possible to prevent the connecting portion where the application start point and the application end point of the seal material overlap from being thickened. It is possible to provide a liquid crystal display device that suppresses overweight of the connecting portion of the material and reduces the occurrence of defective products.

[Embodiment 3]
Next, with reference to FIGS. 9, 10A and 10B, the liquid crystal display device 10 according to the third embodiment.
B will be described. The liquid crystal display device 10B according to the third embodiment is different from the liquid crystal display device 10 according to the first embodiment in that the cutout portion 35a is formed in the overcoat layer 35 of the color filter substrate 31. Like the liquid crystal display device 10B,
Since the cutout portion is common except that it is also formed in the interlayer film 20 of the array substrate 11, the same reference numerals are assigned to the same configurations as those of the liquid crystal display devices 10 and 10A according to the first and second embodiments. Detailed description thereof will be omitted.

In the liquid crystal display device 10B according to the third embodiment, the cutout portion 20a is formed in the array substrate 11.
A cutout portion 35 a is formed in the color filter substrate 31. This notch 20a
, 35a are the connecting portions 4 of the sealing material 40 as described in the first and second embodiments.
It is formed by cutting out the overcoat layer 35 and the interlayer film 20 at a position overlapping 0a in plan view. The structure of each of the substrates 11 and 31 in the frame region 51 is as shown in FIG. The overcoat layer 35 and the notches 20a and 35a of the interlayer film 20 are formed by a known photolithography method or the like.

The sealing material 40 is applied in the same manner as in the first and second embodiments. However, in the liquid crystal display device 10B according to the third embodiment, the sealing material 40 is applied in the color filter substrate 31 and the array substrate 11. Either the overcoat layer 35 or the interlayer film 20
The positions overlapping the notches 20a and 35a in plan view become the start point 40b and the end point 40c of the sealing material 40, and the connection part 40a is formed (see FIGS. 5A to 5C).

As shown in FIG. 10A, the cutout portions 35 a and 20 a of the liquid crystal display device 10 </ b> B according to the third embodiment are all connected to the overcoat layer 35 and the cutout portions 20 a and 35 a of the interlayer film 20. It is formed to be large so as to enter. As a result, excess sealing material in the connection portion 40a of the sealing material 40 can flow into the cutout portions 35a and 20a formed by cutting out the overcoat layer 35 and the interlayer film 20. In addition, FIG.
As shown in 0B, since the sealing material enters the notches 35a and 20a of the overcoat layer 35 and the interlayer film 20, the sealing material can be prevented from being overweight. further,
In the liquid crystal display device 10B of the third embodiment, the notches 20a and 35a are formed on the liquid crystal display device 1.
It is formed so that the outer peripheral side of 0B becomes the open end side. Therefore, the sealing material 40 that has been crushed and spread is blocked by the step between the overcoat layer 35 and the interlayer film 20 that are cut off on the closed end side, and can easily move to the open end side. It is difficult to enter inside, and display image quality is less likely to be adversely affected.

That is, in the liquid crystal display device according to the third embodiment, similarly to the liquid crystal display device according to the first embodiment,
It is possible to suppress the connection portion where the application start point and the application end point of the sealing material overlap from being thickened, and it is possible to provide a liquid crystal display device in which the connection portion of the sealing material is suppressed from becoming too thick and the occurrence of defective products is reduced. It becomes like this. In the liquid crystal display device 10B according to the third embodiment, the notch 3
Since 5a and 20a are formed on both the substrates 31 and 11, the notches 35a and 20a are formed.
Since the depth of a can be reduced, particularly when the common wiring is formed on the array substrate, the common wiring does not have to be greatly affected. Furthermore, since the sealing material 40 may be applied to either the color filter substrate 31 or the array substrate 11, the range of design is widened and the degree of freedom in the manufacturing process is increased.
[Embodiment 4]
Next, with reference to FIGS. 11A and 11B, a liquid crystal display device 10C according to Embodiment 4 will be described. In the liquid crystal display device 10C according to the fourth embodiment, the cutout portion 35b is formed in the overcoat layer 35 of the color filter substrate 31 as in the case of the cutout portion 35a of the liquid crystal display device 10 according to the first embodiment. However, since the shape is the same except that the shape is a slit shape, the same components as those of the liquid crystal display device according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

The cutout portion 35b of the liquid crystal display device 10C according to the fourth embodiment cuts the overcoat layer 35 at a position overlapping the connecting portion 40a of the sealing material 40 in plan view, as described in the first embodiment. Although it is formed by lacking, it has a slit shape and a wide range is formed.

As shown in FIG. 4, the structure of the color filter substrate 31 in the frame region 51 in which the cutout portion 35b is formed is as described in the first embodiment, and is not shown. Also,
The slit-shaped notch 35b of the overcoat layer 35 is formed by a known photolithography method or the like.

The application of the sealing material 40 is the same as that of the first embodiment, but in the liquid crystal display device 10C according to the fourth embodiment, the sealing material 40 is applied to the color filter substrate 31 and the overcoat layer 35 is slit-shaped. The positions overlapping the notch 35b in plan view are the start point 40b and the end point 40c of the sealing material 40, and the connection part 40a is formed in this part (FIGS. 5A to 5C).
reference).

As shown in FIG. 11A, the cutout portion 35b formed in the liquid crystal display device 10C according to the fourth embodiment is such that the connecting portion 40a of the sealing material 40 is part of the slit-like cutout portion 35b of the overcoat layer 35. It is formed to overlap. Thereby, the connection part 4 of the sealing material 40 is obtained.
The excess sealing material 40 of 0a can be poured into the slit-shaped notch 35b formed in the overcoat layer 35. Furthermore, as shown in FIG. 11B, the sealing material 40 enters the slit-shaped cutout portion 35 b of the overcoat layer 35, so that the sealing material can be prevented from becoming too thick. Further, since the slit-shaped cutout portion 35b is formed in a wide range, even if the connecting portion 40a of the seal material 40 is formed to be shifted, the excess seal material 40 is poured into the slit-shaped cutout portion 35b. Can do.

Furthermore, in the liquid crystal display device 10 </ b> C according to the fourth embodiment, the slit-shaped notch 35 is formed.
b is formed so that the outer peripheral side of the liquid crystal display device 10C is the open end side. Therefore, the sealing material 40 that has been crushed and spread is blocked by the stepped interlayer film on the closed end side and easily moves to the open end side. The display image quality is less likely to be adversely affected.

In the case of the liquid crystal display device 10C according to the fourth embodiment, the slit-shaped notch 35b.
A portion other than the connecting portion 40a of the sealing material 40 is applied to the sealing material 40, but the thickness of the cutout portion 35b is very thin as compared with the sealing material 40, and the sealing material 40 has a certain degree of elasticity, which is problematic. Glued without.

That is, in the liquid crystal display device according to the fourth embodiment, similarly to the liquid crystal display device according to the first embodiment, it is possible to prevent the connecting portion where the application start point and the application end point of the seal material overlap from being thickened. It is possible to provide a liquid crystal display device that suppresses overweight and reduces the occurrence of defective products.

In addition to those described in the first to fourth embodiments, for example, slit-shaped notches can be formed on both the substrates 31 and 11, and the slit-shaped formed on both the substrates 31 and 11 can be formed. Each notch of the notch may be formed at a position where it is overlapped in plan view, or may be formed in a shifted manner.

Further, the resin layer to be cut out is not limited to the overcoat layer and the interlayer film in Embodiments 1 to 4,
Other layers may be cut out, or all the layers may be cut out thinly.

It is a top view of the liquid crystal display device concerning Embodiments 1-4 of the present invention. It is the enlarged plan view which expanded and showed 1 pixel area | region. It is principal part sectional drawing cut | disconnected by the III-III line of FIG. It is principal part sectional drawing cut | disconnected by the IV-IV line of FIG. FIG. 5A is a schematic perspective view showing a state in which the application of the sealing material is started, FIG. 5B is a schematic perspective view showing a state in which the start point and the end point of the sealing material are connected, and FIG. It is an enlarged view of the VC part. 6A is an enlarged plan view in which the VI portion of FIG. 1 is transmitted through the array substrate with the color filter substrate down in the liquid crystal display device of Embodiment 1, and FIG. 6B is a main portion cut along the VIB-VIB line of FIG. 6A. It is sectional drawing. FIG. 6 is a cross-sectional view of main parts corresponding to FIG. 4 in the liquid crystal display device of Embodiment 2. 8A is an enlarged plan view corresponding to FIG. 6A viewed through the color filter substrate with the array substrate down in the liquid crystal display device of Embodiment 2, and FIG. 8B is cut along the line VIII-VIII in FIG. 7A. It is principal part sectional drawing corresponding to FIG. 6B. FIG. 6 is a cross-sectional view of main parts corresponding to FIG. 4 in the liquid crystal display device of Embodiment 3. 10A is an enlarged plan view corresponding to FIG. 6A seen through the array substrate with the color filter substrate facing down in the liquid crystal display device of Embodiment 3, and FIG. 10B is cut along the line XX in FIG. 8A. It is principal part sectional drawing corresponding to FIG. 6B. 11A is an enlarged plan view corresponding to FIG. 6A seen through the array substrate with the color filter substrate facing down in the liquid crystal display device of Embodiment 4, and FIG. 11B is cut along the XI-XI line of FIG. 9A. It is principal part sectional drawing corresponding to FIG. 6B.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 10A, 10B, 10C ... Liquid crystal display device 11 ... Array substrate 12 ... Transparent substrate
12a ... Extension part 13 ... Scanning line 14 ... Signal line 15 ... Auxiliary capacitance line 16 ... Semiconductor layer 1
DESCRIPTION OF SYMBOLS 7 ... Thin-film transistor 18 ... Gate insulating film 19 ... Passivation film 20 ... Interlayer film 20a ... Notch 21 ... Pixel electrode 31 ... Color filter substrate 32 ... Transparent substrate 33 ... Light-shielding film 34 ... Color filter layer 35 ... Overcoat layer 35a ... notch 35b ... notch 40 ... seal 40b ... start point 40c ... end 40a ...
Connection part 41 ... Dispenser 50 ... Display area 51 ... Frame area CH ... Contact hole D ... Drain electrode G ... Gate electrode S ... Source electrode Dr ... Driver LC ...
Liquid crystal PA ... Pixel area

Claims (5)

A pair of opposing substrates are pasted together by a seal material arranged in a closed loop shape in the frame area around the display area,
In a liquid crystal display device in which liquid crystal is sealed between the pair of substrates by a liquid crystal dropping method,
In one frame of the pair of substrates, an interlayer film made of an insulating film is disposed in the frame region on the side where the liquid crystal exists,
An overcoat layer made of an insulating film is disposed in the frame region on the side where the liquid crystal exists on the other substrate of the pair of substrates,
In the sealing material arranged in the closed loop shape, there is a connection portion between the application start point and the application end point,
Both the interlayer film and the overcoat layer are provided with a plurality of groove-shaped notches that are open at the outer periphery of the liquid crystal display device, at positions that overlap the connection portion in plan view.
Liquid crystal display device. The plurality of notches are formed in a slit shape.
  The liquid crystal display device according to claim 1. Region where the plurality of notches are formed, have a size from the connection portion of the sealing material in a plan view
The liquid crystal display device according to claim 1. The cutout portion provided in the interlayer film and the cutout portion provided in the overcoat layer are formed so as to be shifted in plan view.
  The liquid crystal display device according to claim 1. The cutout portion provided in the interlayer film and the cutout portion provided in the overcoat layer are formed at a position where they overlap in a plan view.
  The liquid crystal display device according to claim 1.

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