JP5179562B2 - Insulating spacer - Google Patents

Description

  The present invention relates to an insulating spacer, and more particularly to an insulating spacer having an embedded electrode for supporting a conductor embedded in a resin.

  Insulating spacers with an embedded electrode for supporting the central conductor are usually manufactured by casting such as epoxy resin, and the interface between the embedded electrode and the resin is subject to bending and thermal loads due to the different physical properties of each material. When acting, a high tensile stress is generated at this interface, which may lead to a decrease in strength. In order to obtain a stress state that does not cause this strength reduction, the low stress state can be achieved by considering the shape of the buried electrode for supporting the central conductor at the interface. Hereinafter, the buried electrode for supporting the central conductor is expressed as “filling”.

In the prior art, a U-shaped groove is provided on the outer surface in the vicinity of the resin interface of the buried metal to provide a function of reducing stress acting on the resin in the vicinity of the interface (see, for example, Patent Document 1).
However, in such a buried structure, it is necessary to provide a U-shaped groove and machining is required, and unless the groove tip has an appropriate R shape, stress concentrates on this part and the strength is reduced. In addition, there are problems in quality assurance such as metal foreign matter entering the groove, and problems such as increased costs due to the complexity of processing.

Japanese Patent Publication No. 6-9415

  An object of the present invention is to obtain an insulating spacer capable of appropriately maintaining the stress state at the interface between the conductor supporting embedded electrode and the insulating spacer body with a simple configuration.

The insulating spacer according to the present invention includes an embedded electrode for supporting a conductor formed integrally with the disk-shaped insulating spacer main body, and the disk-shaped in the interface portion of the embedded electrode for conductor supporting with the insulating spacer main body. Protruding to the insulating spacer main body and provided with an annular protrusion for reducing the peeling force acting in the direction perpendicular to the interface between the conductor supporting embedded electrode and the insulating spacer main body, the conductor supporting embedded together by bonding a projecting distal end portion of the annular projection of the electrode on the insulating spacer body to secure the bonding strength, lower modulus than that of the insulating spacer body at the interface between the insulating spacer body and the conductor supporting buried electrode the deformation absorbing member having provided, the conductor supporting extends from the outer surface of the insulating spacer body at the interface with the insulating spacer body and the conductor supporting buried electrode The deformation absorbing member in contact with the annular projection in use buried electrodes is obtained by arranging the.

According to the invention, by a simple configuration with a bonding strength between the insulating spacer main body conductor supporting buried electrode can be secured, the stress state at the interface between the insulating spacer main body conductor supporting buried electrode buried conductor support An insulating spacer that can be appropriately held by the deformation absorbing member that extends from the outer surface portion of the insulating spacer body at the interface between the embedded electrode and the insulating spacer body and contacts the annular protrusion of the embedded electrode for conductor support can be obtained.

It is the longitudinal cross-sectional view and cross-sectional view which show a structure when the insulating spacer in Embodiment 1 by this invention is integrated in an electric equipment. It is sectional drawing which shows the structure of the insulating spacer in Embodiment 1 by this invention. It is sectional drawing which shows the structure of the insulating spacer in Embodiment 2 by this invention. It is sectional drawing which shows the structure of the insulating spacer in Embodiment 3 by this invention. It is sectional drawing which shows the structure of the insulating spacer in Embodiment 4 by this invention. It is sectional drawing which shows the structure of the insulating spacer in Embodiment 5 by this invention. It is sectional drawing which shows the structure of the insulating spacer in Embodiment 6 by this invention.

Embodiment 1 FIG.
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a longitudinal sectional view and a transverse sectional view showing a configuration when the insulating spacer according to the first embodiment is incorporated in an electric device. FIG. 1A is a longitudinal sectional view showing a configuration when an insulating spacer is incorporated in an electric device. FIG.1 (b) is a longitudinal cross-sectional view which shows typically a structure when an insulating spacer is integrated in an electric equipment. FIG. 2 is a cross-sectional view showing the configuration of the insulating spacer in the first embodiment.

In FIG. 1 showing the configuration when the insulating spacer according to the first embodiment of the present invention is incorporated in an electrical device, the insulating spacer 2 is clamped by the metal flange 8 of the cylindrical container 1 arranged so as to sandwich the insulating spacer 2. 7 is fixed.
In addition, a fixing bracket 4 that supports a central conductor 5 disposed at the central portion of the cylindrical container 1 is fixed to the insulating spacer 2 with bolts 6. In this example, there are three central conductors 5 and this is an example of a three-phase structure.
The insulating spacer 2 has a disk-like shape composed of an insulating spacer main body 9 made of an insulating material such as an epoxy resin and a padding 3. In the following embodiments, description is limited to one conductor fixing portion among the three central conductors 5.

A first embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 2, a thin ring-shaped thin protrusion 3 c is formed around the contact surface with the fixing metal 4 (see FIG. 1) that supports the central conductor 5 in the shape of the buried metal 3 embedded in the insulator 9. The structure was provided.
According to this structure, the ring-shaped thin protrusion 3c provided on the outer periphery of the outer surface of the metal pad 3 has a ring shape that is thinner than other portions. Therefore, as shown in FIG. When a bending moment M is applied by the load, the ring-shaped thin protrusion 3c provided on the outer periphery of the outer surface of the metal pad 3 is elastically deformed, so that the pulling at the interface acting perpendicularly to the interface acting on this portion is performed. The peeling force P can be reduced.
Further, although the central conductor 5 is fixed to the buried metal 3, the positioning accuracy of the conductor end can be improved by the ring-shaped inner diameter portion.

The buried metal 3 forms a small disk-like structure integrally embedded in the center of the disk-shaped insulating spacer main body 9, and a flat surface 9 a forming an end surface forming a pair of disk-shaped insulating spacer main bodies 9 on the end surface. , 9b have planes 3a, 3b formed at the same plane level. The flat surfaces 3 a and 3 b of the metal pad 3 extend in the same direction as the extending direction of the flat surfaces 9 a and 9 b that form the end surfaces forming a pair of the insulating spacer main bodies 9.
The ring-shaped thin protrusion 3c provided on the outer surface outer periphery of the metal pad 3 protrudes from the flat surfaces 3a and 3b of the metal pad 3 in a direction perpendicular to the extending direction of the flat surfaces 3a and 3b. The insulating spacer main body 9 is also integrally provided with a protrusion 9 c corresponding to the thin protrusion 3 c of the buried metal 3. Of course, an interface is also formed between the thin protrusion 3c of the metal pad 3 and the protrusion 9c of the insulating spacer body 9, and between the metal pad 3 and the insulating spacer body 9, the thin wall protrusion 3 An interface is formed to reach the outer surface portion where the portion 3c and the protrusion 9c of the insulating spacer body 9 are provided.
As described above, the peeling force P at the interface between the buried metal 3 and the insulating spacer body 9 can be reduced by the ring-shaped thin protrusion 3 c provided on the buried metal 3.

  In the first embodiment, the surfaces 9a and 9b forming the end surfaces forming a pair of the insulating spacer main body 9 are flat, but the same effect can be obtained even if they are not flat. Further, the same effect can be obtained even if the surfaces 9a and 9b and the planes 3a and 3b are not at the same level.

  According to the first embodiment of the present invention, the surface 9a, 9b that forms the pair of end surfaces of the disk-shaped insulating spacer body made of an insulator 9 such as an epoxy resin and the disk-shaped insulating spacer body made of the insulator 9. And a conductive support embedded electrode 3 formed integrally with a disk-shaped insulating spacer body 9 made of the insulator 9 and provided with electrode planes 3a and 3b extending in the extending direction of A conductor supporting embedded electrode protrudes from the electrode planes 3a and 3b at an interface portion with the insulating spacer body made of the insulator 9, and an insulating spacer body made of the conductor supporting embedded electrode 3 and the insulator 9. Since the elastically deformable thin protruding portion 3c for reducing the peeling force P acting in the vertical direction of the interface of the conductor is provided, the elastically deformable protruding portion is provided at the interface portion with the insulating spacer body of the embedded electrode for conductor support. Provided The Do Kiyoshi configuration, it is possible to obtain an insulating spacer to hold properly the stress state at the interface between the insulating spacer main body conductor supporting buried electrode.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view showing the configuration of the insulating spacer in the second embodiment.
In the second embodiment, the configuration other than the specific configuration described here has the same configuration as the configuration in the first embodiment described above and exhibits the same function. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In the first embodiment, the outer periphery of the contact surface of the metal pad 3 is a ring-shaped protrusion, but the second to fourth embodiments shown in FIGS. 3 to 5 also have the same configuration as the first embodiment. The same effect as the effect can be obtained. Hereinafter, other embodiments will be described.

FIG. 3 showing the configuration of the insulating spacer in the second embodiment has a structure in which the interface that contacts the insulator 9 such as the epoxy resin of the buried metal 3 is greatly expanded toward the insulator 9 side.
That is, a protrusion 3d having a semicircular cross section at the interface contacting the insulator 9 of the buried metal 3 is provided in the insulator 9 so as to protrude in the horizontal direction in the figure with the semicircular protrusion side as a tip. It is. This projecting portion 3d is provided so as to project over the entire circumference of the peripheral surface of the disk-shaped padding 3, and forms an annular shape.

In the second embodiment, the buried metal 3 has a structure in which the interface of the buried metal 3 that contacts the insulator 9 is greatly expanded toward the insulator 9 and the annular protrusion 3d having a semicircular cross section is provided. The adhesion strength can be increased by increasing the adhesion area of the interface of the insulator 9.
Further, among the peeling force and shearing force generated at the interface when pressure or thermal load is applied, this structure has the effect that the shearing force of the inflated portion is dominant and the pulling force is reduced. Moreover, since the wall thickness of the insulator 9 part close to the outer surface is reduced by this swelling, the peeling force acting on the interface can be reduced. Therefore, it becomes a structure advantageous with respect to interface peeling.

  According to Embodiment 2 of the present invention, a disk-shaped insulating spacer body made of an insulator 9 such as an epoxy resin, and a conductor supporting embedded electrode formed integrally with the disk-shaped insulating spacer body made of the insulator 9 3 and projecting at the interface portion between the embedded electrode 3 for supporting the conductor and the insulating spacer body made of the insulator 9 with a convex portion as a tip to the inside of the disk-shaped insulating spacer body made of the insulator 9, The conductor supporting embedded electrode is provided with the annular projecting portion 3d having a semi-elliptical cross section for reducing the peeling force P acting in the direction perpendicular to the interface between the conductor supporting embedded electrode and the insulating spacer body. With a simple configuration in which an annular protrusion having a semicircular cross section is provided at the interface with the insulating spacer body, the stress state at the interface between the conductor supporting embedded electrode and the insulating spacer body can be properly maintained. It is possible to obtain an insulating spacer.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a longitudinal sectional view showing the configuration of the insulating spacer in the third embodiment.
In the third embodiment, the configuration other than the specific configuration described here has the same configuration as that in the first and second embodiments described above, and has the same function. is there. In the drawings, the same reference numerals indicate the same or corresponding parts.

  FIG. 4 showing the configuration of the insulating spacer according to the third embodiment of the present invention has a structure in which the buried metal 3 is greatly expanded in the resin 9 as in the embodiment of FIG. Then, an annular protrusion 3e having a V-shaped cross section for reducing the peeling force acting in the direction perpendicular to the interface between the conductor supporting embedded electrode and the insulating spacer body is provided in the filling 3, The V-shaped projecting portion 3e has a V-shaped cross-sectional shape having an arbitrary angle from the outer surface of the metal pad 3. The tip portion has an R shape having a predetermined cross-sectional curvature radius in order to avoid stress concentration and electric field concentration. Let me.

  In this structure, as in the second embodiment shown in FIG. 3, the adhesive strength can be increased by increasing the adhesive area, and the peeling force and shear generated at the interface when pressure or thermal load is applied. Among the forces, this structure has an effect that the shearing force of the inflated V-shaped portion is dominant and the peeling force is reduced. Therefore, it becomes a structure advantageous with respect to interface peeling.

  According to Embodiment 3 of the present invention, a disk-shaped insulating spacer body made of an insulator 9 such as an epoxy resin, and a conductor supporting embedded electrode formed integrally with the disk-shaped insulating spacer body made of the insulator 9 3 at the interface between the embedded electrode 3 for supporting the conductor and the insulating spacer body made of the insulator 9, and the tip of the embedded electrode 3 for supporting the conductor is projected into the inside of the disk-shaped insulating spacer body made of the insulator 9. Since the cross section for reducing the peeling force P acting in the vertical direction of the interface between the embedded electrode and the insulating spacer body has a V shape and the annular protrusion 3e having a predetermined cross section radius of curvature is provided at the tip, The stress state at the interface between the embedded electrode for supporting the conductor and the insulating spacer body is achieved by a simple configuration in which a V-shaped protrusion having a V-shaped cross section is provided at the interface between the embedded electrode for supporting the conductor and the insulating spacer body. The It is possible to obtain a positively holding it insulating spacer.

Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a longitudinal sectional view showing a configuration of the insulating spacer in the fourth embodiment.
In the fourth embodiment, the configuration other than the specific configuration described here has the same configuration as the configurations in the first to third embodiments described above and has the same function. It is. In the drawings, the same reference numerals indicate the same or corresponding parts.

FIG. 5 which shows the structure of the insulating spacer in the fourth embodiment according to the present invention is such that the interface shape with the insulator 9 such as the epoxy resin of the buried metal 3 is a corrugated shape.
That is, a plurality of annular protrusions 3f having an arcuate cross section are provided at the interface between the buried metal 3 and the insulator 9, and the interface between the buried metal 3 and the insulator 9 is formed in a wavy shape. .

  In this manner, when the cross-sectional shape of the buried metal 3 at the interface with the insulator 9 such as an epoxy resin is a corrugated shape provided with a plurality of projecting portions 3f, pressure and thermal load act and a bending moment M acts. The peeling force P caused by this becomes a component P1 perpendicular to the interface and a component P2 along the interface at the interface. Of these, the direction of the peeling force P1 is all different in each position. Accordingly, the peeling force does not appear in the same direction in the thickness direction, but appears in a plurality of directions, so that an effect of canceling the force inside can be expected, and since it appears as a component force, the peeling force is reduced.

  In this embodiment, two peaks are formed by the protruding portion 3f of the buried metal 3 on the insulator 9 side, but the same effect can be expected with three or more.

  According to Embodiment 4 of the present invention, a disk-shaped insulating spacer body made of an insulator 9 such as an epoxy resin, and a conductor supporting embedded electrode formed integrally with the disk-shaped insulating spacer body made of the insulator 9 3 to form a plurality of annular projecting portions with the shape of the interface between the conductor supporting embedded electrode 3 and the insulating spacer body made of the insulator 9 as a cross-sectional corrugated shape, and the conductor supporting embedded electrode 3 And a plurality of annular protrusions 3f having a wavy cross section for reducing the peeling force P acting in the direction perpendicular to the interface between the insulating spacer main body made of the insulator 9 and the conductor supporting embedded electrode. A simple configuration in which a corrugated protrusion having a corrugated cross section is provided at the interface portion with the insulating spacer main body, the stress state at the interface between the embedded electrode for conductor support and the insulating spacer main body is appropriately adjusted. Can be obtained lifting may insulating spacer.

Embodiment 5 FIG.
A fifth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a longitudinal sectional view showing the configuration of the insulating spacer in the fifth embodiment.
In the fifth embodiment, the configuration other than the specific configuration described here has the same configuration as the configurations in the first to fourth embodiments described above and exhibits the same operation. It is. In the drawings, the same reference numerals indicate the same or corresponding parts.

FIG. 6 showing the configuration of the insulating spacer in the fifth embodiment according to the present invention is the same as that in the second embodiment shown in FIG. 3, but the insulator 9 is formed on the outer surface side of the insulator 9 such as the buried metal 3 and epoxy resin. This is a structure in which a deformation absorbing member made of an elastic member 11 having an elastic constant smaller than that of the resin constituting the resin is sandwiched.
That is, an annular protrusion 3d having a semicircular cross section is provided at the interface of the buried metal 3 in contact with the insulator 9 so as to protrude into the insulator 9 in the horizontal direction shown in the drawing with the semicircular protrusion side as a tip. A deformation absorbing member made of an elastic member 11 having an elastic constant smaller than that of the resin constituting the insulator 9 is sandwiched between the outer surface side of the metal pad 3 and the insulator 9.

  In this configuration, when the bending moment M acts, the elastic member 11 absorbs the deformation of the insulator 9, and an effect of reducing the peeling force P acting perpendicularly to the interface between the buried metal 3 and the insulator 9 can be expected.

  In addition, although what was applied to the structure in Embodiment 2 was demonstrated here, this Embodiment 5 is applied to either the structure in Embodiment 1, Embodiment 3, and Embodiment 4. You can also.

  According to Embodiment 5 of the present invention, in any one of the configurations from Embodiment 2 to Embodiment 4, the conductor supporting embedded electrode 3 and the insulator 9 such as the epoxy resin are used. Since the deformation absorbing member made of the elastic member 11 having an elastic modulus smaller than that of the insulating spacer main body made of the insulator 9 is provided on the outer surface portion of the interface with the insulating spacer main body, the insulating spacer of the embedded electrode for conductor support The conductor support embedded electrode and the insulating spacer main body have a simple structure in which a protrusion is provided at the interface with the main body and a deformation absorbing member is provided on the outer surface of the interface between the conductor supporting embedded electrode and the insulating spacer main body. It is possible to obtain an insulating spacer that can properly maintain the stress state at the interface with the.

Embodiment 6 FIG.
A sixth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a longitudinal sectional view showing the structure of the insulating spacer in the sixth embodiment.
In the sixth embodiment, the configuration other than the specific configuration described here has the same configuration as the configuration in the first embodiment described above, and has the same function. In the drawings, the same reference numerals indicate the same or corresponding parts.

FIG. 7 showing the configuration of the insulating spacer according to the sixth embodiment of the present invention has the same shape of the buried metal 3 as that of the first embodiment, and is formed on the outer surface of the interface between the buried metal 3 and the insulator 9 such as an epoxy resin. This is an example of an interface structure in which a close portion is bonded with an adhesive member 12 and a conductive member 13 is inserted therein.
That is, the shape of the buried metal 3 embedded in the insulator 9 is a structure provided with a thin ring-shaped thin protrusion 3c, and a portion close to the outer surface of the interface between the buried metal 3 and the insulator 9 is an adhesive member. 12 and an interface structure in which a conductive member 13 is inserted into the interface between the buried metal 3 and the insulator 9 inside the insulator 9.

  This structure also has an effect of reducing the peeling force acting perpendicularly to the interface between the buried metal 3 and the insulator 9 when pressure or thermal load is applied, as in the first embodiment. By applying a conductive member 13 such as conductive rubber between the insulators 9, even when peeling occurs, the conductive members 13 adhere to the insulator 9, and the gap between the conductor and the resin due to the peeling is applied. The effect of suppressing discharge and improving the insulation deterioration characteristics of the insulating spacer can be expected.

  According to Embodiment 6 of the present invention, in the configuration in Embodiment 1, it is close to the outer surface of the interface between the conductor supporting embedded electrode 3 and the insulating spacer body made of the insulator 9 such as the epoxy resin. Since the portion is bonded with the adhesive member 12 and the conductive member 13 such as conductive rubber is inserted into the interior to form a composite interface structure, the outer surface of the interface between the conductor supporting embedded electrode and the insulating spacer body An insulating spacer that can properly maintain the stress state at the interface between the conductor supporting embedded electrode and the insulating spacer body is obtained by a simple configuration in which the portion close to the surface is bonded with an insulating adhesive member and a conductive member is inserted into the inside. be able to.

  In the embodiment according to the present invention, configurations shown in the following items (A1) to (A5) are proposed.

(A1) A thin ring-shaped protrusion 3c can be formed around the contact surface of the buried metal 3 with the conductor 5 to increase the positioning accuracy of the conductor 5, and when pressure or thermal load is applied to the insulating spacer 2. The peeling force P acting perpendicularly to the interface between the cylindrical protrusion 3c of the buried metal 3 and the resin 9 bonded thereto is reduced by the elastic effect of the cylindrical thin plate structure protruding part 3c on the outer periphery of the buried metal 3. be able to.

(A2) Adhesive strength can be increased by using the structure of the resin 3 and the metal 3 in which the inner shape of the metal pad 3 in contact with the resin 9 is greatly expanded in a semi-oval shape on the resin 9 side. When the pressure or thermal load is applied to the insulating spacer 2, the shearing force along the interface is superior to the peeling force P in the semi-elliptical part 3d at the interface, and the peeling force P component is reduced. can do.

(A3) The shape of the buried metal 3 in contact with the resin 9 has a structure of the buried metal 3 and the resin 9 which are expanded in a V shape on the resin side extending from the outer surface, so that all of the adhesive interface from the outer surface to the inside is formed. It is possible to reduce the peeling force P at the interface and to increase the adhesion area, leading to an increase in adhesion strength.

(A4) By making the shape of the buried metal 3 in contact with the resin 9 corrugated, it is possible to increase the adhesion area and increase the adhesion strength, and to act on the interface when pressure or thermal load is applied to the insulating spacer 2. The peeling force P is not always in the same direction but has a different distribution in the acting direction, and the interface peeling force P is a component component corresponding to the inclination angle of the interface, so that the peeling force P can be reduced. it can.

(A5) When the elastic member 11 having an elastic modulus smaller than that of the resin is sandwiched between the outer surface portion of the interface where the buried metal 3 and the resin P are in contact with each other, when pressure or thermal load is applied to the insulating spacer 2 The peeling force P acting on the resin interface of this part can be reduced.

(A5) Even in the composite interface structure in which the portion close to the outer surface in the shape of the filling 3 in the item (A1) is bonded with the adhesive member 12 and the conductive member 13 is inserted toward the inside, the peeling force P is reduced. be able to.

  DESCRIPTION OF SYMBOLS 1 Cylindrical container, 2 Insulating spacer, 3 Filling metal, 4 Fixing metal fitting, 5 Conductor, 6, 7 Bolt, 8 Metal flange, 9 Insulating spacer body.

Claims (2)

A disk-shaped insulating spacer body, and a conductor-supporting embedded electrode formed integrally with the disk-shaped insulating spacer body, and the disk-shaped insulating spacer at an interface portion of the conductor-supporting embedded electrode with the insulating spacer body Protruding to the main body and provided with an annular protrusion for reducing the peeling force acting in the direction perpendicular to the interface between the conductor supporting embedded electrode and the insulating spacer main body, in the conductor supporting embedded electrode while securing the bonding strength by bonding the projecting distal end portion of the annular projection in the insulating spacer body, it has the insulating spacer lower modulus than the body at the interface between the insulating spacer body and the conductor supporting buried electrode the deformation absorbing member is provided, wherein the conductor supporting buried collector extending from the outer surface of the insulating spacer body at the interface with the insulating spacer body and the conductor supporting buried electrode Insulating spacer, characterized in that arranged the deformation absorbing member in contact with the annular projection of the. The insulating spacer according to claim 1, wherein a cross section of the annular projecting portion of the embedded electrode for supporting a conductor is a semicircular shape.

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