JP5174272B1 - heating furnace - Google Patents

Abstract

An object of the present invention is to provide a heating furnace in which the entire apparatus can be formed compactly and the configuration is simplified in a heating furnace for soldering a substrate by performing preheating, main heating and cooling. Is an issue.
A single work space 9 is formed, and a heating device 38 is provided directly below or directly above a substrate B that is lifted and lowered by a lifting mechanism. In the work space 9, preheating by preheating means and main heating are performed. When performing the main heating by the means and the cooling by the cooling means in this order, the preheating means performs the preheating by moving the substrate B up and down to a preheating position separated from the heating device by a predetermined interval. The heating means raises and lowers the substrate B to a main heating position close to the heating device to perform main heating, and the cooling means raises and lowers the substrate to a cooling position away from the heating device 38 to perform cooling.
[Selection] Figure 2

Description

  The present invention relates to a heating furnace for soldering a substrate.

Preheating means for preheating the substrate at a temperature at which the surface solder does not melt, main heating means for main heating the substrate at a temperature at which the solder melts after the preheating, and a temperature at which the solder solidifies after the main heating. A heating furnace having a cooling means for cooling a substrate is conventionally known (for example, see Patent Document 1).
However, in this heating furnace, since the preheating chamber for preheating, the main heating chamber for main heating, and the cooling chamber for cooling are formed separately, the apparatus becomes large and the manufacturing cost increases. There is a problem of doing.

  Therefore, a single working chamber (working space) is formed, and an elevating mechanism for raising and lowering the substrate in the working chamber is provided. Preheating by the preheating means and main heating by the main heating means are performed by raising and lowering the substrate by the elevating mechanism. The heating furnace shown in Patent Document 2 that switches between cooling by the cooling means and soldering the substrate surface has been developed and is publicly known.

Japanese Patent No. 2852456 JP 2002-1444076 A

Since the heating furnace of Patent Document 2 performs preheating, main heating, and cooling by a single working chamber, the heating in which the preheating chamber, the main heating chamber, and the cooling chamber are separately provided as in Patent Document 1, respectively. Compared with a furnace, the configuration of the apparatus is simplified.
However, in the work chamber, the preheating space, the main heating space, and the cooling space are individually formed so that their ranges do not overlap each other, and a cylindrical heater formed along the outer periphery of the preheating space, Since the cylindrical heater formed along the outer periphery of the heating space and the cylindrical water jacket formed along the outer periphery of the cooling space are provided separately, the working chamber becomes longer in the vertical direction. At the same time, the overall configuration is still complicated.

  The present invention provides a heating furnace in which the entire apparatus can be compactly formed and the configuration is simplified in a heating furnace for soldering a substrate by performing preheating, main heating, and cooling. This is the issue.

In order to solve the above problems, first, a preheating means for preheating the substrate B at a temperature at which the solder on the surface does not melt, and a main heating means for main heating the substrate B at a temperature at which the solder melts after the preheating. And a cooling unit that cools the substrate B at a temperature at which the solder solidifies after the main heating, and includes a lifting mechanism 37 that lifts and lowers the substrate B. A single working space 9 is formed in a soldering heating furnace for soldering the surface of the substrate B by switching between preheating, main heating by the main heating means, and cooling processing by the cooling means, and a heating device 38 is provided. The preheating means is provided immediately below or directly above the substrate B which is moved up and down by the elevating mechanism 37, and the preheating means is arranged in a preheating position separated from the heating device 38 by a predetermined distance in the work space 9. The main heating means raises and lowers the substrate B to the main heating position closer to the heating device than the preheating position in the work space 9, and the main heating means performs the main heating. 9, the substrate B is moved up and down to a cooling position farther from the heating device 38 than the main heating position to perform cooling, and the heating device 38 is a hot plate facing along the substrate B. An introduction hole 38b for introducing an inert gas or a reducing gas is formed in the surface of the hot plate 38 facing the substrate B, and the main heating position is set to a position where the substrate B is close to the hot plate 38. a substrate B which is in the heating position, that the clearances S for permitting the flow of the inert gas or reducing gas between said facing surfaces of the hot plate 38 is formed It is a symptom.

Second, a heated inert gas or reducing gas is introduced into the work space 9.

Third, preheating means for preheating the substrate B at a temperature at which the surface solder does not melt, main heating means for main heating the substrate B at a temperature at which the solder melts after the preheating, and after the main heating, the above A cooling means for cooling the substrate B at a temperature at which the solder solidifies, and an elevating mechanism 37 for elevating and lowering the substrate B. The elevating mechanism 37 elevates and lowers the substrate B to perform preliminary heating by the preheating means and main heating means. In the soldering heating furnace for soldering the surface of the substrate B by switching between the main heating by the cooling and the cooling process by the cooling means, a single work space 9 is formed, and the heating device 38 is moved up and down by the lifting mechanism 37. The preheating means is provided immediately below or directly above the substrate B to be preheated by moving the substrate B up and down to a preheating position separated from the heating device 38 by a predetermined distance in the work space 9. The main heating means performs the main heating by moving the substrate B up and down to the main heating position closer to the heating device than the preheating position in the work space 9, and the cooling means from the main heating position in the work space 9. Also, the substrate B is moved up and down to a cooling position away from the heating device 38 to perform cooling, the hot plate 38 is disposed directly below the substrate B, and the elevating mechanism 37 is movable up and down on the hot plate 38. A plurality of vertical lifting pins 43 inserted therethrough, a connecting body 42 that is disposed below the hot plate 38 and connects the plurality of lifting pins 43 and moves up and down integrally, and an actuator 44 that moves the connecting body 42 up and down. And the substrate B is supported on the upper end side of the lifting pins 43 .

Fourth, the elevating pins 43 are grouped into a group that supports the small substrate B and a group that supports the large substrate B.

Fifth, preheating means for preheating the substrate B at a temperature at which the surface solder does not melt, main heating means for main heating the substrate B at a temperature at which the solder melts after the preheating, and after the main heating, the above A cooling means for cooling the substrate B at a temperature at which the solder solidifies, and an elevating mechanism 37 for elevating and lowering the substrate B. The elevating mechanism 37 elevates and lowers the substrate B to perform preliminary heating by the preheating means and main heating means. In the soldering heating furnace for soldering the surface of the substrate B by switching between the main heating by the cooling and the cooling process by the cooling means, a single work space 9 is formed, and the heating device 38 is moved up and down by the lifting mechanism 37. The preheating means is provided immediately below or directly above the substrate B to be preheated by moving the substrate B up and down to a preheating position separated from the heating device 38 by a predetermined distance in the work space 9. The main heating means performs the main heating by moving the substrate B up and down to the main heating position closer to the heating device than the preheating position in the work space 9, and the cooling means from the main heating position in the work space 9. Also, the substrate B is moved up and down to a cooling position away from the heating device 38 for cooling, and the heating device 38 is arranged directly below the substrate B to be moved up and down. In addition to the heating device 38, a heating device 39 for heating the substrate B by radiant heat is provided .

Sixth, a cooling device 41 that causes cooling air to flow downward is disposed directly above the substrate B to be lifted and lowered.

  According to the above configuration, a single work space is formed, and the heating device is provided directly above or directly below the substrate that is lifted and lowered by the lifting mechanism. Preheating is performed by moving the substrate up and down to the isolated preheating position, and the main heating means raises and lowers the substrate to a main heating position closer to the heating device than the preheating position in the work space, and performs cooling. In order to perform cooling by raising and lowering the substrate to a cooling position farther from the heating device than the main heating position in the work space, the means includes a preheating space, a main heating space, and a cooling space. , It is not necessary to form each in the work space separately, the entire device can be made compact, and it is possible to perform both preheating and main heating by the heating device Because, the configuration can also be simplified.

  In addition, according to the heating plate which is a hot plate facing the substrate, and the substrate is brought close to or in contact with the hot plate at the main heating position, the preheating and the main heating can be switched by raising and lowering the substrate. It is possible to perform reliably.

  In addition, according to the introduction hole for introducing the inert gas or the reducing gas into the work space on the surface facing the substrate in the hot plate, the inert gas or the reducing gas can be used for high quality and efficient. The soldering operation can be performed, and it is not necessary to separately provide a member for forming the introduction hole for introducing the inert gas or the reducing gas, and the configuration is simplified.

  Further, according to the present heating position set so that a clearance allowing the flow of the inert gas or the reducing gas is formed between the substrate at the main heating position and the facing surface of the hot plate. Then, the entire substrate is encased in an inert gas or a reducing gas, and the above configuration becomes more prominent.

  If the heated inert gas or reducing gas is introduced into the work space, the inert gas or reducing gas also functions to heat the substrate, facilitating efficient heating of the substrate. Is done.

  Also, a hot plate is arranged directly under the substrate, and the lifting mechanism is connected to a plurality of vertical lifting pins inserted in the hot plate so as to be movable up and down, and arranged below the hot plate and connected to the plurality of lifting pins. According to the structure that includes the connecting body that moves up and down integrally and the actuator that moves the connecting body up and down, and supports the substrate on the upper end side of the lifting pins, the heat conduction to the lifting mechanism is minimized. In addition to heating the substrate uniformly, the coupling body is disposed on the lower side of the hot plate, so that it is easy to bring the substrate closer to the hot plate.

  Further, according to the lifting pins grouped into a group supporting a small substrate and a group supporting a large substrate, a single lifting mechanism can support substrates of different sizes. Therefore, versatility is improved.

(A), (B) is the front view and side view of a heating furnace with solder to which the present invention is applied. It is a principal part front view of the heating furnace for soldering of FIG. It is a principal part top view of the heating furnace for soldering of FIG. It is a top view of a hot plate and a raising / lowering mechanism. It is a plane sectional view of a hot plate. It is AA sectional drawing of FIG. It is principal part side sectional drawing of a working chamber. It is a block diagram of a control part. It is a flowchart which shows the process sequence with the reflow solder which a control part performs. It is a graph which shows the time-dependent change of the temperature of a board | substrate.

  1 (A) and 1 (B) are a front view and a side view of a heating furnace with solder to which the present invention is applied, and FIGS. 2 and 3 are a front view and a main part of the heating furnace with solder of FIG. It is a principal part top view. In the soldering heating furnace 1, the half on one side serves as a working unit 2 for performing soldering work on the substrate B, and the other half on the other side carries the substrate B into the working unit 2, while It becomes the conveyance part 3 taken out and cooled. The soldering furnace 1 performs reflow solder melting in the working unit 2. Specifically, soldering is performed on the substrate B by melting the solder positioned and placed on the substrate B such as a silicon wafer, a metal substrate, or a ceramic substrate. This soldering includes an operation of forming solder bumps with a sufficient amount of solder such as solder balls of the substrate B, and an operation of soldering electronic components to the substrate B.

  The transport unit 3 includes a transport device 4 that forms a transport path toward the working unit 2, a mounting table 6 that is a horizontal cooling plate on which the substrate B transported by the transport device 4 is mounted, and a mounting table 6. A loading / unloading device 7 for loading the substrate B on the upper surface side of the substrate to the working unit 2 side and unloading the substrate B on the working unit 2 side to the upper surface side of the mounting table 6, and a conveying side covering the entire upper portion on the conveying unit 3 side And a cover 8.

  The work unit 2 includes a rectangular parallelepiped work box 11 having a work chamber (work space) 9 formed therein, a work side frame 2a that supports the work box 11 on the main frame 1a side of the heating furnace 1 with solder, A work-side cover 12 that covers the entire upper side of the work box 11 is provided.

  The transport side cover 8 and the work side cover 12 have their rear end portions connected to the main frame 1a side so as to be rotatable up and down, and the inside of the transport unit 3 is opened and closed by the vertical rotation of the transport side cover 8. The working unit 2 side is opened and closed by the vertical rotation of the working side cover 12.

  The work box 11 includes a lower half fixed side divided body 13 and an upper half movable side divided body 14 as separate bodies, and the rear end portions of the fixed side divided body 13 and the movable side divided body 14 are arranged together. Are connected to each other by a connecting tool 16 such as a hinge, and the movable side divided body 14 is rotated up and down with respect to the fixed side divided body 13, whereby the work chamber 9 is opened and closed.

  The movable side divided body 14 is turned up and down separately from the work side cover 12 described above, and after opening the work side cover 12 and then opening the movable side divided body 14, the work chamber 9 is opened. Incidentally, the work side cover 12 is urged toward the opening operation side by a gas spring 17 that expands and contracts, and the work side cover 12 is locked in a closed state so as to be releasable.

  Further, an opening 11a is formed on the side surface of the transfer unit 3 of the work box 11, and the substrate B is carried into the work chamber 9 through the opening 11a, and the substrate B from the work chamber 9 is loaded. Unloading is also performed, and an opening / closing device 18 is provided on the opening 11a side.

  The opening / closing device 18 includes a closing plate 19, a support mechanism 21 that supports the closing plate 19 movably on the work box 11 side, and an opening / closing actuator 22 that moves the closing plate 19 by the support mechanism 21. . By the opening / closing actuator 22, the closing plate 19 is switched between a closing position for closing the opening 11a and an opening position for opening. Incidentally, during work with reflow soldering in the work chamber 9, the upper side of the work chamber 9 is closed by the movable-side divided body 14 and the opening 11 a is closed by the closing plate 19.

  The conveying device 4 is a pair of left and right side frames 23, 23 that stand up and face each other in parallel, a plurality of pulleys 24 that are rotatably supported on the left and right inner side surfaces of each side frame 23, An annular conveyor belt 26 is provided in a side view disposed on the left and right inner side surfaces of the side frame 23.

  The side frame 23 is installed on the main frame 1a side, and the left and right transport belts 26 and 26 are wound around a plurality of pulleys 24 supported on the side frame 23 on the near side. The substrate B is transported toward the working unit 2 while being stretched between the upper surfaces.

  The mounting table 6 is disposed and formed in the transport downstream half of the transport belt 26 and is installed on the main frame 1a side. The mounting table 6 includes a horizontal central plate 27 on the center side of the conveyance width, and a pair of horizontal end plates 28 and 28 arranged on both sides of the central plate 27, respectively. A belt-like movement space 29 is formed between the end plate 27 and each end plate 28.

  In addition, a receiving groove 28a extending in the transport direction is recessed in the portion closer to the moving space 29 on the upper surface of each end side plate 28, and the upper portion of the transport downstream half of the transport belt 26 is stored in the receiving groove 28a. Is possible. The transport device 4 described above, including the side frames 23, 23, is supported by the main frame 1a so that it can be driven up and down. When the transport device 4 is raised, the transport belt 26 is displaced upward from the receiving groove 28a. On the other hand, when the transport device 4 is moved down, the transport belt 26 is stored in the receiving groove 28a. Become.

  For this reason, the substrate B transported to the mounting table 6 side by the pair of left and right transport belts 26 and 26 with the transport device 4 raised, drives the transport device 4 to move downward so that the above-described portion of each transport belt 26 is moved. By being accommodated in the corresponding accommodating groove 28 a, it is placed at the mark positions 6 a and 6 b of the mounting table 6. When placing on the raised conveyor belts 26, 26 or on the mounting table 6, the substrate B is mounted along the marks 6 a, 6 b indicated on the mounting table 6. Incidentally, the mark 6a indicates a mounting position for mounting the small substrate B1, which is the small-sized substrate B, and the mark 6b indicates a mounting position for mounting the large-sized substrate B2, which is the large-sized substrate B.

  Further, since the mounting table 6 is cooled by a cooling means such as water cooling (not shown), the substrate B mounted on the mounting table 6 is cooled. Specifically, since the soldering operation is completed in the work box 11 and the substrate 2 taken out to the outside is still hot and cannot be touched by hand, the substrate 2 is touched on the mounting table 6 by hand. Allow to cool rapidly to temperature.

  The carry-in / carry-out device 7 includes a pair of left and right transfer plates 31 and 31 that are formed in an inverted L shape when viewed from the side and extend toward the working unit 2, and a support base on which the transfer 31 is supported so as to be movable in the carrying direction. 32, a support member 33 that supports the support base 32 on the main frame 1a so as to be movable up and down, a transport actuator 34 that moves the transfer 31 in the transport direction relative to the support base 32, and a lift actuator 36 that moves the support base 32 up and down. The two actuators 31, 31 are integrally driven to move in the transport direction and the up-down direction by the two actuators 34, 36.

  The left and right transfer 31, 31 are positioned below the upper surface of the mounting table 6, and directly above the mounting table 6 and lifted from the conveying belt 26 via the left and right moving spaces 29, 29, respectively. The pair of left and right transfer 31 and 31 can move the substrate B on the mounting table 6 or the transport belt 26.26 by moving the transfer 31 up and down through the moving space 29. In addition to being able to receive, it is also possible to place the substrate B suspended between the left and right transfer 31, 31 on the placement table 6 or the left and right transport belts 26, 26. And by this transfer 31, while the board | substrate B by the side of the mounting base 6 is carried in into the working chamber 9, the board | substrate B in the working chamber 9 is carried out to the mounting base 6 side.

  Next, the configuration of the working unit 2 will be described in detail with reference to FIGS. 4 is a plan view of the hot plate and the lifting mechanism, FIG. 5 is a plan sectional view of the hot plate, FIG. 6 is a sectional view taken along line AA of FIG. 4, and FIG. It is principal part sectional drawing. In addition to the above-described work box 11, work-side frame 2 a and work-side cover 12, the working unit 2 includes a lift mechanism 37 that lifts and lowers the substrate B in the work chamber 9, and a substrate B that is lifted and lowered by the lift mechanism 37. A horizontal hot plate (heating device) 38 for heating the substrate B, an infrared heater (heating device) 39 for heating the substrate B, which is arranged directly above the substrate B moved up and down by the lifting mechanism 37, and infrared rays And a cooling device 41 disposed on the heater 39 side.

  The elevating mechanism 37 includes a horizontal connecting plate (connecting body) 42 disposed immediately below the work box 11, a plurality of elevating pins 43 integrally projecting directly above the connecting plate 42, and the connecting plate 42. And an elevating cylinder (actuator) 44 for elevating the working box 11 with respect to the work box 11.

  The connecting plate 42 is located below the hot plate 38 (more specifically, directly below the work box 11), and connects all the lifting pins 43 to each other to move up and down integrally. The elevating pin 43 includes a support sleeve 43a that is attached to the connecting plate 42 and extends in the vertical direction, and a pin body 43b that has the same axis as the support sleeve 43a and protrudes upward from the support sleeve 43a. The elevating pin 43 penetrates the floor side of the work box 11 up and down, and is inserted into an up and down insertion hole 38 a formed in the hot plate 38 so as to be movable in the axial direction.

  When the elevating pin 43 is raised by the elevating cylinder 44, the upper portion of the elevating pin 43 protrudes upward from the upper surface of the hot plate 38, while when the elevating pin 43 is lowered, the upper portion of the elevating pin 43 is raised. Is substantially contained in the insertion hole 38a, that is, in the hot plate 38.

  The hot plate 38 is a horizontal thick plate member that is heated by resistance heat or other means. Since the hot plate 38 heats the substrate B by its own temperature, the substrate B can be efficiently heated. It is necessary to bring the substrate B into contact with or close to the upper surface of the hot plate 38 facing the substrate B (in this example, close). Near the center of the upper surface of the hot plate 38, an installation groove 46 having a polygonal shape (regular octagonal shape in the illustrated example) is formed, and an inner portion of the installation groove 46 is in contact with or close to the substrate B. It becomes a heat conducting surface 47 that conducts heat to the substrate B.

  In addition to the above-described insertion hole 38a, the heat conducting surface 47 has a plurality of fixing pins 48 integrally projecting upward.

  The plurality of insertion holes 38a and the lifting pins 43 are small movable side groups (groups) located on the circumference of a virtual circle (movable side small diameter circle C1a) centered on the center of the heat conducting surface 47 in plan view. A large-sized movable side group (group) that is located on the circumference of a virtual circle (movable-side large-diameter circle C2a) that has the same center as the movable-side small-diameter circle C1a and has a larger diameter than the movable-side small-diameter circle C1a. Grouped into

  Incidentally, the elevating pins 43 and the insertion holes 38a are arranged and formed on the movable side small diameter circle C1a and the movable side large diameter circle C2a at equal intervals (specifically, every 1/3 round), respectively, and the movable side small diameter circle C1a. The phases of the lifting pins 43 and the insertion holes 38a of the movable upper diameter circle C2a and the lifting pins 43 and the insertion holes 38a of the movable large-diameter circle C2a are shifted from each other by a half interval (specifically, 1/6 circumference). ing.

  The plurality of fixed pins 48 are also the same center as the movable side small diameter circle C1a and the movable side large diameter circle C2a in plan view, and are larger than the movable side small diameter circle C1a and have a diameter larger than that of the movable side large diameter circle C2a. A small-sized fixed side group (group) positioned on the circumference of a small virtual circle (fixed side small diameter circle C1b), the same center as the movable side small diameter circle C1a and the movable side large diameter circle C2a, and the movable side large diameter They are grouped into large-sized fixed-side groups (groups) located on the circumference of a virtual circle (fixed-side large-diameter circle C2b) having a slightly larger diameter than the circle C2a.

  Incidentally, the fixed pins 48 are arranged and formed on the fixed side small diameter circle C1b and the fixed side large diameter circle C2b at equal intervals (specifically, every ¼ round), and the fixed pins 48 of the fixed side small diameter circle C1b. The phases of the fixed-side large-diameter circle fixing pin 48 are shifted from each other by a half of the above-mentioned equal interval (specifically, 1/8 circumference).

  When the substrate B is small (8-inch small substrate B1 in the illustrated example), the small substrate B1 is horizontally supported by the upper ends of a plurality of lifting pins 43 of the small movable side group. The peripheral edge of the small substrate B1 is located closer to the center than the lift pins 43 of the large movable group in a plan view. On the other hand, when the substrate B is large (12-inch large substrate B2 in the illustrated example), the large substrate B2 is horizontally supported by the upper ends of the plurality of lifting pins 43 of the large movable side group. The peripheral edge of the large substrate B2 is located closer to the center than the installation groove 46 in plan view.

  Thus, in order to horizontally support the substrate B, the plurality of lifting pins 43 constituting the small movable side group are set to have the same upper end height, and the plurality of lifting pins 43 constituting the large movable side group are configured. The elevating pins 43 have the same upper end height.

  In addition, the upper end height of the lifting pins 43 of the large movable side group is set higher by a predetermined height Δh than the upper end height of the lifting pins 43 of the small movable side group. Due to the predetermined height Δh, the upper end side of the lift pins 43 of the small movable side group comes into contact with the lower surface side of the large substrate B2 supported by the lift pins 43 of the large movable side group, and the large substrate B2 becomes unstable. Is prevented.

  The fixing pin 48 functions so that the substrate B is not in contact with the heat conducting surface 47 even when the upper portion of the elevating pin 43 is almost accommodated in the insertion hole 38a. In other words, the fixing pin 48 functions as a member that prevents the substrate B from coming into contact with the hot plate 38 even when the elevating pin 43 is moved down. Incidentally, the upper end heights of the fixing pins 48 are all set to be substantially the same, or the upper end heights of the fixing pins 48 of the large fixing side group are all set to be the same, and the fixing pins of the small fixing side group are fixed. The upper end heights of the fixed pins 48 of the small fixed side group may be set lower than the upper end heights of the fixed pins 48 of the large fixed side group.

  Depending on the arrangement configuration and height setting of the fixing pins 48 and the lifting pins 43 as described above, one hot plate 38 can cope with substrates B of different sizes, such as square shapes and circles (circular in the illustrated example). It becomes possible and versatility improves. The lift pins 43 can adjust the gap between the substrate B and the hot plate 38. For this reason, it becomes possible to hold the non-horizontal substrate B in a non-contact state with respect to the hot plate 38 due to warpage or the like caused by heating or the like, and uniform heating is facilitated.

  In addition, a plurality of small introduction holes 38b for introducing gas into the working chamber 9 are formed on the upper surface of the hot plate 38, which is the surface facing the substrate B. In other words, a plurality of introduction holes 38b are arranged to form an introduction row L, and a plurality of introduction rows L are arranged in a direction orthogonal to the row direction in a state of being parallel to each other.

  Directly below each introduction row L in the hot plate 38, a flow path 49 extending linearly in parallel with the introduction row L is formed, and each introduction hole 38b is formed in the vertical direction and communicates with the flow path 49 directly below. ing. The flow path 49 is closed at both ends.

  A straight supply path 51 that extends horizontally in a direction intersecting (specifically, orthogonal to) each flow path 49 in a plan view is formed immediately below the intermediate portion of the flow path 49 in the hot plate 38. 51 communicates with each flow path 49 through a communication port 51a. Supply ports 51b and 51b opened downward are formed at both ends of the supply path 51, and a supply pipe (not shown) is connected to the supply ports 51b and 51b.

  The gas injected from each supply port 51b of the supply path 51 and flowing into the flow path 49 is ejected into the work chamber 9 from the introduction hole 38b. In addition to this, the hot plate 38 is formed with a plurality of horizontal holes and vertical holes, and these various holes are flow paths for supplying gas (specifically, inert gas or reducing gas), or The hot plate 38 is used as a space for accommodating a heating element that heats the hot plate 38 by resistance heat or the like.

  A rectangular parallelepiped gas supply device 52 is installed in each side of the installation groove 46, and the plurality of gas supply devices 52 surround the four sides of the hot plate 38. The edge of the upper surface of the gas supply device 52 on the side of the heat conduction surface 47 is formed with an inclined surface inclined downward toward the heat conduction surface 47, while the edge of the heat conduction surface 47 on the side of the installation groove 46 is also installed. An inclined surface inclined downward toward the groove 46 is formed.

  A plurality of ejection holes 52 a for injecting gas into the work chamber 9 are formed in the inclined surface of each gas supply device 52. Incidentally, the gas injection direction is set in a direction perpendicular to the inclined surface. In other words, each gas supply device 52 is configured to eject gas obliquely upward toward the heat conducting surface 47.

  In this manner, the inert gas and the reducing gas are ejected from the ejection hole 52a in the same manner as the introduction hole 38b of the hot plate 38, and this ejection gas is ejected from the introduction hole 38b by setting the ejection direction. Since the gas acts to guide the gas toward the center side of the hot plate 38 in plan view, these jet gases wrap around the front and back surfaces of the substrate B (see FIG. 7).

  Further, the gas supply path to the gas supply apparatus 52 will be described. A gas supply path 50 formed in parallel with the supply path 51 is formed, and the gas supply path 50 extends in the vertical direction at portions near both ends. Supply ports 50a and 50a are formed, the lower side of the supply port 51a is opened, and a gas supply pipe is connected to the open end.

  On the other hand, a gas hole 38 c opened upward for each gas supply device 52 is formed in the hot plate 38, and the gas from the gas hole 38 c is supplied to the gas supply device 52. The gas that has flowed into the gas supply furnace 50 is directly introduced into the gas supply device 52 from the gas hole 38 c or from the gas hole 38 c to the gas supply device 52 via one or a plurality of flow paths 55. be introduced.

  The infrared heater 39 is formed in a direction orthogonal to the carry-in / carry-out direction, and a plurality of infrared heaters 39 are arranged in the carry-in / carry-out direction. The substrate B located directly below is supplementarily heated by the radiant heat from each infrared heater 39.

  The cooling devices 41 are formed in a direction parallel to the infrared heaters 39, and are installed one by one between the adjacent infrared heaters 39. In other words, the cooling device 41 and the infrared heater 39 are alternately arranged in parallel. The cooling device 41 has a diamond-shaped cross section, and a plurality of injection ports 41 a for injecting gas are arranged in parallel on each pair of surfaces facing the diagonally lower side of the cooling device 41.

  Incidentally, by injecting a gas such as an inert gas, a reducing gas, or cooling air from the hot plate 38, the gas supply device 52, or the cooling device 41, the pressure in the sealed working chamber 9 increases, In order to prevent the pressure from increasing as described above, one or a plurality of exhaust slits (not shown) are provided on the ceiling side of the working chamber 9, and the gas in the working chamber 9 is exhausted to the outside from the slits when the pressure is high. . In addition, flux gas (smoke) generated during soldering is also discharged from the exhaust slit, and the exhausted gas is efficiently discharged to the exhaust duct side.

  In the soldering heating furnace 1 configured as described above, the opening / closing device 18 switches the closing plate 19 to the open position to open the opening 11a, and the lifting mechanism 37 lowers all the lifting pins 43. The left and right transfer 31, 31 of the loading / unloading device 7 holds the substrate B in a transfer state and introduces the substrate B into the work chamber 9. Incidentally, the substrate B delivered to the transfer 31, 31 may be placed on the placement table 6, but in this example, is placed on the transport belts 26, 26 raised from the placement table 6.

  When the lift pins 43 are lifted by the lift mechanism 37 with the substrate B introduced into the work chamber 9 by the left and right transfer 31, 31, the lift pins 43 are lifted from the left and right transfer 31, 31. Delivery from the transfer 31 to the substrate B is performed. Thereafter, the transfer 31 of the carry-in / carry-out device 7 is pulled out from the work chamber 9, and the opening plate 11 is switched to the closed position by the opening / closing device 18 to close the opening 11a, thereby heating the substrate B. At this time, the substrate B faces the heat conduction surface 47 of the hot plate 38 in parallel.

  First, a preheating process (preheating means) for preliminarily heating the substrate B is performed. In this preheating treatment, the elevating mechanism 37 raises (lifts) the substrate B to a preheating range (preheating position) at a high position away from the heat conducting surface 47 by a predetermined distance. The substrate B located in the preheating range is not directly heated by the heat from the hot plate 38, but is heated by the radiant heat from the infrared heater 39. The temperature of the radiant heat from the infrared heater 39 rises and the surface temperature of the substrate B rises as it rises to a higher position within this preheating range.

  In this way, in the working chamber 9, the substrate B is raised (lifted / lowered) into the preheating range, and the substrate B is heated at a temperature at which the solder on the substrate B is not melted by the radiant heat from the infrared heater 39, As a result, the flux liquid contained in the solder or under the solder balls is activated (redox). During the preliminary heating, a reducing gas or an inert gas such as nitrogen gas or formic acid gas is introduced into the work chamber 9 from one or both of the introduction hole 38b and the ejection hole 52a. The gas introduced from the hot plate 38 and the gas introduced from the gas supply device 52 are the same type, and this gas is injected into the work chamber 9 in a heated state, and the gas is introduced into the work chamber 9. An atmosphere is formed.

  Subsequently, a main heating process (main heating unit) for heating the substrate B is performed. In this main heat treatment, the elevating mechanism 37 moves the substrate B closer to the heat conduction surface 47 (upper surface of the hot plate 38) than the preheating range and approaches the heat conduction surface 47 in a non-contact state (main book). Lower (up and down) to the heating position. The substrate B located in the main heating range is rapidly heated in a state close to the hot plate 38 and close to direct heat conduction.

  In this manner, the substrate B is lowered into the main heating range in the work chamber 9 and is heated to a temperature at which the solder on the substrate B is melted by the main heating by the hot plate 38 in the work chamber 9. Is heated. Also during the main heating, a reducing gas or an inert gas such as nitrogen gas or formic acid gas is introduced into the working chamber 9 from one or both of the introduction hole 38b and the injection hole 52a. The gas introduced from the hot plate 38 and the gas introduced from the gas supply device 52 are of the same type, and this gas is injected into the working chamber 9 in a heated state.

  Since the substrate B does not come into contact with the hot plate 38 during the main heating, a heat shock in which the substrate B is damaged by rapid heating can be efficiently prevented. Further, a clearance S that allows gas flow is formed between the substrate B in the main heating range and the heat conduction surface 47 of the hot plate 38. Since the gas ejected from the introduction hole 38b of the hot plate 38 flows so as to surround the front and back surfaces of the substrate B via the clearance S, the effect of forming the gas atmosphere is further enhanced. Incidentally, as an effect of forming a gas atmosphere, for example, when an inert gas such as nitrogen gas or a reducing gas is used, the solder bonding property is improved, and the high-temperature gas interacts with the radiant heat, so that the substrate B is formed. There is an effect that it can be heated uniformly without spots.

  Finally, a cooling process (internal cooling process, cooling means) for cooling the substrate B is performed. In this cooling process, the elevating mechanism 37 raises (lifts) the substrate B to a cooling range (cooling position) that is a predetermined distance higher than the heat conducting surface 47 and close to the cooling device 41. This cooling range is close to or partially overlaps the above-described preheating range.

  As described above, the substrate B is moved up and down in the cooling range in the work chamber 9, and the substrate B is cooled by a cooling air or a gas such as nitrogen sprayed downward from the cooling device 41 toward the substrate B side. The solder melted on the substrate B is solidified, and the operation of reflow soldering (specifically, soldering of the bump shape and electronic parts) by heating is completed.

  In this way, when the reflow soldering is completed, the closing plate 19 is switched to the open position by the opening / closing device 18 to open the opening 11a, and all the lifting pins 43 are lifted by the lifting mechanism 37 to Wait while lifted. The transfer 31, 31 is inserted into the working chamber 11 a from the opening 11, and then the lift pin 43 is lowered to place the substrate B floating from the hot plate 38 between the left and right transfer 31, 31. Thus, the substrate B is delivered from the lifting mechanism 37 to the carry-in / out device 7. Then, the carry-in / carry-out device 7 unloads the substrate B from the work chamber 9 by the transfer 31, 31 and places the substrate B on the mounting table 6. The mounting table 6 cools the mounted substrate B (external cooling process), and cools the substrate B to a temperature at which the operator can touch it.

  By performing the reflow soldering of the substrate B according to the procedure of the preheating process → the main heating process → the cooling process as described above, the soldering of the substrate B can be performed efficiently in a space-saving manner with high quality. . Incidentally, the reflow soldering operation as described above is specifically performed by the control unit 53 (see FIG. 8) including a microcomputer or the like.

  Next, an example of a processing procedure with reflow soldering performed by the control unit 53 will be described with reference to FIGS. In addition, description is abbreviate | omitted about the part which overlaps with the above-mentioned description.

  FIG. 8 is a block diagram of the control unit, FIG. 9 is a flowchart showing a processing procedure with reflow soldering performed by the control unit, and FIG. 10 is a graph showing a change in temperature of the substrate with time. On the input side of the control unit 53, temperature detecting means 54 including a sensor for detecting the temperature of the substrate B, the working chamber 9, and the like, and an elevation for detecting the height of the substrate B from the heat conduction surface 47 of the hot plate 38. A height detecting means 56 is connected.

  On the other hand, on the output side of the control unit 53, a lifting mechanism control means 57 that drives the lifting cylinder 44 to drive the lifting pins 43 and a first heating control that controls the temperature of the hot plate 38 including the heat conduction surface 47. Means (heating control means) 58, second heating control means (heating control means) 59 for controlling the temperature of the infrared heater 39, and whether or not gas is injected into the working chamber 9 from the injection hole 52a of the gas supply device 52. A flow rate control means 61 for atmosphere comprising a control solenoid valve or the like for switching, and a flow rate control means for hot plate side comprising a control solenoid valve or the like for switching the presence or absence of the amount of gas injected from the introduction hole 38b of the hot plate 38 into the work chamber 9. 62 and a cooling flow rate control means 63 comprising a control solenoid valve or the like for switching the presence or absence of the amount of cooling gas injected from the cooling device 41 into the working chamber 9 is connected.

  Incidentally, the elevating cylinder 44 is expanded and contracted by a built-in stepping motor, and the driving amount of the stepping motor is adjusted according to the number of input pulses. That is, the extension / contraction length of the lift cylinder 44 (that is, the lift height of the substrate B) is controlled by the number of pulses of the pulse signal input via the lift mechanism control means 57. For this reason, it is not always necessary to perform feedback control of the elevation height of the substrate B, and the elevation height detection means 56 may be omitted.

  When reflow soldering is performed, the control unit 53 advances the processing in the order of preheating processing → main heating processing → cooling processing as described above. In other words, the control unit 53 includes a preliminary heating unit, a main heating unit, and a cooling unit, and these units are sequentially executed.

  In the preheating means, the preheating time, the temperature of the infrared heater 39, the temperature of the hot plate 38, the amount of gas ejected from the hot plate 38, the amount of gas ejected from the gas supply device 52, and cooling As an example, the ejection amount of the cooling gas from the apparatus 41 and the relative height of the substrate B from the heat conduction surface 47 controlled by the elevating mechanism 37 are set as shown in Table 1 below. The oxygen concentration in the working chamber 9 at this time is as shown in the same table, and the temperature of the gas supplied from the hot plate 38 and the gas supply device 52 is set to be the same as the temperature of the hot plate 38. The pressure of the supplied gas is set to 0.1 Mpa, the pressure of the gas supplied from the gas supply device 52 is set to 0.3 Mpa, and the height of the substrate B is set to the infrared heater 39 for temperature adjustment. And is raised to any close height.

  In the main heating means, the time for performing the main heating, the temperature of the infrared heater 39, the temperature of the hot plate 38, the amount of gas ejected from the hot plate 38, the amount of gas ejected from the gas supply device 52, and the cooling As an example, the ejection amount of the cooling gas from the apparatus 41 and the relative height of the substrate B from the heat conduction surface 47 controlled by the elevating mechanism 37 are set as shown in Table 2 below. The oxygen concentration in the working chamber 9 at this time is as shown in the same table, and the temperature of the gas supplied from the hot plate 38 and the gas supply device 52 is set to be the same as the temperature of the hot plate 38. The pressure of the supplied gas is set to 0.1 Mpa, the pressure of the gas supplied from the gas supply device 52 is set to 0.3 Mpa, and the height of the substrate B is set to the hot plate 38 for temperature adjustment. Is lowered to a height close to

  In the cooling means, the cooling time, the temperature of the hot plate 38, the amount of cooling gas ejected from the cooling device 41, and the relative height of the substrate B from the heat conduction surface 47 controlled by the elevating mechanism 37 are set. As an example, settings are made as shown in Table 3 below. The oxygen concentration in the working chamber 9 at this time is as shown in the same table, and the pressure of the cooling gas supplied from the cooling device 41 is set to 0.4 Mpa. At this time, the infrared heater 39 is turned off, but the hot plate 38 is held in the ON state in consideration of the processing efficiency of the next substrate B.

  The set value is an example, but the heating temperature of the substrate B can be controlled by raising and lowering the substrate B without changing the temperatures of the hot plate 38 and the infrared heater 39. Note that the temperature change of the substrate B is as shown in FIG. 10, and during the preliminary heating and the main heating, the temperature is controlled so that the temperature rise becomes moderate after the rapid heating toward the target temperature. It becomes possible to perform soldering quickly and efficiently even in the narrow working chamber 9.

  In the flow chart of FIG. 9, in addition to preheating, main heating, and cooling, “transfer” of the substrate B into the work chamber 9 by the transfer 31, 31, “take out” of the substrate B, and on the mounting table 6. A processing procedure including “external cooling” of the substrate B is shown.

  Next, differences from the above will be described with respect to the modified example of the present invention.

  In the example described above, the infrared heater 39 is disposed directly above the substrate B that is lifted and lowered by the lifting mechanism 37 and the hot plate 38 is disposed directly below, but the vertical positional relationship between the infrared heater 39 and the hot plate 38 is as follows. It may be reversed. In this case, the substrate B is heated by the radiant heat radiated upward from the infrared heater 39, and the heat conduction surface 47 is formed on the lower surface of the hot plate 38 that faces the substrate B, thereby avoiding the infrared heater 39. Thus, the lifting mechanism 37 is installed.

  Further, depending on the type and heat capacity of the substrate B, the substrate B may be brought into contact with the heat conducting surface 47 to perform the main heating. In this case, the fixing pin 48 as a means for preventing heat shock is not provided. Furthermore, since the introduction hole 38b on the hot plate 38 is closed by the substrate B placed in close contact with the hot plate 38, in this case, other locations (specifically, the gas supply device 52) Increase gas supply.

  Furthermore, the infrared heat 39 may be omitted, and the preheating and the main heating may be performed on the substrate B by the hot plate 38. Alternatively, the infrared plate 39 may be provided on the upper and lower sides of the substrate B without the hot plate 38. Thus, preheating and main heating of the substrate B may be performed.

9 Working room (Working space 37 Elevating mechanism 38 Hot plate (heating device)
38b Introduction hole 39 Infrared heater (auxiliary heating device)
41 Cooling device 42 Connecting plate (connecting body)
43 Lifting pin 44 Lifting cylinder (actuator)
B substrate (wafer, silicon wafer)
S clearance

Claims (6)

Preheating means for preheating the substrate (B) at a temperature at which the solder on the surface does not melt; main heating means for main heating the substrate (B) at a temperature at which the solder melts after the preheating; A cooling means for cooling the substrate (B) at a temperature at which the solder solidifies, and an elevating mechanism (37) that elevates and lowers the substrate (B). A single working space (9) is formed in a soldering furnace for soldering the surface of the substrate (B) by switching between preheating by the heating means, main heating by the main heating means, and cooling processing by the cooling means. The heating device (38) is formed immediately below or directly above the substrate (B) which is lifted and lowered by the lifting mechanism (37), and the preheating means is provided within a predetermined space from the heating device in the work space (9). Isolated Preheating is performed by moving the substrate (B) up and down to the preheating position, and the main heating means is located at the main heating position closer to the heating device (38) than the preheating position in the work space (9). The cooling means is configured to raise and lower the substrate to a cooling position farther from the heating device (38) than the main heating position in the work space (9), and perform cooling. The apparatus (38) is a hot plate facing along the substrate (B), and an introduction hole (38b) for introducing an inert gas or a reducing gas into the work space (9) is formed on the substrate ( It is formed on the surface facing B), and the main heating position is a position where the substrate (B) is close to the hot plate (38), so that the substrate (B) at the main heating position and the hot plate (38) are located. Of the above facing surface Furnace clearance (S) is formed to allow the flow of the inert gas or reducing gas between. The heating furnace according to claim 1 , wherein an inert gas or a reducing gas in a heated state is introduced into the work space (9). Preheating means for preheating the substrate (B) at a temperature at which the solder on the surface does not melt; main heating means for main heating the substrate (B) at a temperature at which the solder melts after the preheating; A cooling means for cooling the substrate (B) at a temperature at which the solder solidifies, and an elevating mechanism (37) that elevates and lowers the substrate (B). A single working space (9) is formed in a soldering furnace for soldering the surface of the substrate (B) by switching between preheating by the heating means, main heating by the main heating means, and cooling processing by the cooling means. The heating device (38) is formed immediately below or directly above the substrate (B) which is lifted and lowered by the lifting mechanism (37), and the preheating means is provided within a predetermined space from the heating device in the work space (9). Isolated Preheating is performed by moving the substrate (B) up and down to the preheating position, and the main heating means is located at the main heating position closer to the heating device (38) than the preheating position in the work space (9). The cooling means is configured to raise and lower the substrate to a cooling position farther from the heating device (38) than the main heating position in the work space (9), and perform cooling. A plate (38) is arranged directly below the substrate (B), and the elevating mechanism (37) includes a plurality of elevating pins (43) in the vertical direction inserted through the hot plate (38) so as to be movable up and down, and a hot plate A connecting body (42) disposed below (38) and connecting the plurality of lifting pins (43) to move up and down integrally; and an actuator (44) for moving the connecting body (42) up and down. Of pin (43) Furnace for supporting a substrate (B) at the end side. The heating furnace according to claim 3 , wherein the elevating pins (43) are grouped into a group supporting the small substrate (B) and a group supporting the large substrate (B). Preheating means for preheating the substrate (B) at a temperature at which the solder on the surface does not melt; main heating means for main heating the substrate (B) at a temperature at which the solder melts after the preheating; A cooling means for cooling the substrate (B) at a temperature at which the solder solidifies, and an elevating mechanism (37) that elevates and lowers the substrate (B). A single working space (9) is formed in a soldering furnace for soldering the surface of the substrate (B) by switching between preheating by the heating means, main heating by the main heating means, and cooling processing by the cooling means. The heating device (38) is formed immediately below or directly above the substrate (B) which is lifted and lowered by the lifting mechanism (37), and the preheating means is provided within a predetermined space from the heating device in the work space (9). Isolated Preheating is performed by moving the substrate (B) up and down to the preheating position, and the main heating means is located at the main heating position closer to the heating device (38) than the preheating position in the work space (9). The cooling means is configured to raise and lower the substrate to a cooling position farther from the heating device (38) than the main heating position in the work space (9), and perform cooling. The apparatus (38) is disposed directly below the substrate (B) to be moved up and down, and the substrate (B) is heated by radiant heat separately from the heating apparatus (38) directly above the substrate (B). A heating furnace provided with a device (39) . The heating furnace according to claim 5 , wherein a cooling device (41) for causing cooling air to flow downward is disposed directly above the substrate (B) to be moved up and down.

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