JP5172901B2 - Transfer material set and transfer method using the transfer material set - Google Patents

Description

  The present invention relates to a transfer material set composed of a plurality of transfer materials and a transfer method using the transfer material set. Specifically, when transferring to a surface having fine irregularities on the surface, a transfer layer is easily formed. The present invention relates to a transfer material set and a transfer method using the transfer material set that can be easily fitted into and closely attached to a fine uneven surface so as not to peel off.

  In recent years, with the rapid development of various electronic devices, there is an increasing tendency that electromagnetic waves emitted from these electronic devices may cause some damage to the body. Therefore, an electromagnetic shielding film has been developed and proposed as a countermeasure.

  The configuration of the electromagnetic wave shielding film will be briefly described. The metal layer has a configuration in which a metal layer is laminated in a mesh shape by a technique such as plating on the surface of a plastic film as a base material. Conductive metals such as are widely used. Note that the mesh shape specifically refers to a state in which the stripes of the metal layer are orthogonal to the shape of a “field” in a plan view and the stripes of the metal layer are convex in a sectional view. In addition, this indicates that the distance between the streaks of the metal layer is substantially equal, and here, description will be made assuming such a state.

  The electromagnetic shielding film is used, for example, to protect against harmful electromagnetic waves generated by sticking it to a front panel of a plasma television that has recently become widespread. In addition, for example, it can be used to control the transparency of the glass so that the room is difficult to see from the outside, or it can be used to block hot sunlight and inflow of heat. Is also used to prevent debris scattering when the glass breaks by sticking to the glass.

  Thus, it is no exaggeration to say that the electromagnetic wave shielding film is now an article that is widely used by sticking to a transparent surface such as a glass surface.

  However, with such use, it has been desired to give a specific function to the electromagnetic wave shielding film.

  For example, by attaching an electromagnetic wave shielding film to a window, the electromagnetic wave can be effectively shielded after being attached, but the electromagnetic wave shielding film is scratched or an article or a human body comes into contact with the electromagnetic wave. The metal layer, which is the origin of shielding, peels off and falls off, and the phenomenon that the shielding effect of electromagnetic waves decreases with time may occur.

  In order to prevent or suppress such a phenomenon, it is conceivable to laminate a hard coat layer on the surface of the electromagnetic wave shielding film as necessary. As a technique for this purpose, the hard coat layer can be transferred to a desired location. Use of a transfer material or a transfer foil can be mentioned.

  For example, the hard coat transfer foil described in Patent Document 1 has a configuration of peelable base sheet / hard hard coat layer / soft hard coat layer, and the hard coat layer is laminated in this manner. In the resin molded product that is desired, cracks occur in the hard hard coat layer at the place where the molding state is abruptly narrowed down, but the lower layer has a soft hard coat layer, which is the place of the sudden narrowing down. Even if there is no crack, in other words, because it is possible to follow a sharply narrowed shape, as a result, no crack is generated in the hard coat layer, that is, a specific function of hard coat properties can be reliably imparted. To do.

Japanese Patent Laid-Open No. 3-130199

  However, even if an attempt is made to transfer the hard coat layer by using such a hard coat transfer foil on the surface of the electromagnetic wave shielding film, it cannot be transferred as desired. This point will be described with reference to FIG.

  Consider that an adhesive layer is laminated on the outermost surface of the hard coat layer described in Patent Document 1 so that its thickness is 25 μm, and that the hard coat layer is transferred to the surface of the electromagnetic wave shielding film using it.

  The metal layer streaks provided on the surface of the electromagnetic wave shielding film 34 in a mesh shape have various sizes, specifically depending on the manufacturer and according to the purpose. Here, the height is 20 μm in side view, Similarly, the planar view width of the muscle is assumed to be 20 μm.

  When the hard coat transfer foil 30 is pasted so that the adhesive layer surface 33 is in contact with the side where the mesh-like metal layer is provided on the surface of the electromagnetic wave shielding film 34, and then a high pressure is applied from the base film 31 side. At the same time, heat at 220 ° C. is applied. Finally, the base film 31 is peeled off, and the thermal transfer operation for transferring and laminating the functional layer 32 to the electromagnetic wave shielding film 34 via the adhesive layer 33 is completed.

  After completing this work, when observing whether the hard coat layer is stuck on the surface of the electromagnetic wave shielding film as desired, the adhesive layer is between the meshes in most places, that is, the blank portion of the character of “da”, Was not inserted as desired. That is, it was found that the adhesive layer was not beautifully adhered to both the mesh metal layer and the exposed base film surface portion. And even if it is intended to be used as an electromagnetic shielding film in which a hard coat layer is actually laminated in this state, the adhesive layer that mediates the adhesion between the hard coat layer and the electromagnetic shielding film is not in close contact with the electromagnetic shielding film. As described above, it is obvious that the hard coat layer peels off as time passes. That is, even if a layer having a specific functionality of hard coat is laminated by transfer, it can be easily peeled off and dropped off. The effect will not continue, and in fact it will be.

The following can be considered as the reason.
First, when using an adhesive layer that generally requires durability, it is common to use a thermoplastic resin having a high glass transition temperature (Tg). In order to effectively use an adhesive layer made of a thermoplastic resin, it is melted once by heat applied at the time of transfer and solidifies later, and this effect is manifested. The amount of heat increases. However, if the amount of heat increases, it may happen that the Tg of the base film is exceeded. If the Tg of the resin of the adhesive layer actually exceeds the Tg of the base film, the thermal transfer may be executed. The base film is destroyed and cannot be put to practical use. In addition, in this case, the act of giving heat is not given directly to the adhesive layer, but is given through the base film and the hard coat layer laminated on the surface. As a result, a sufficient amount of heat may not reach the transfer layer.

  And even if the heat transfer is forcibly executed in a state where a sufficient amount of heat does not reach the adhesive layer, the adhesive layer will melt once if it was originally, and the molten adhesive layer will flow firmly into the blank area of the `` field '' character, And it is desirable to solidify in that state, but because the sufficient amount of heat does not reach, the melting of the adhesive layer is also insufficient, and the solidification is performed in an insufficient state, so that the adhesive layer is sufficiently It is thought that the state where the effect can be exhibited is not reached.

  On the other hand, it is possible to select a resin having a low Tg used for the adhesive layer, but in this case, even if the adhesive layer comes into close contact by the same operation as described above, it is desirable because the Tg is low. It is difficult to obtain durability. That is, it can be said that it is not preferable to use a resin having a low Tg as the adhesive layer.

  In the transfer of the hard coat layer to the electromagnetic wave shielding film as described above, the desirable Tg of the adhesive layer is generally 80 ° C. or higher, but a resin having a Tg of this temperature or higher is used as the adhesive layer. If the Tg is 80 ° C. or lower, there is a problem in durability.

  The above is an explanation from the viewpoint of transferring to an electromagnetic wave shielding film whose surface is mesh-like, but other than that, for example, any functional film other than an electromagnetic wave shielding film, the surface of which is a mesh When a specific functional layer is to be laminated by a transfer method on the surface of a functional film in which a shape other than the shape, for example, the surface thereof is uniformly or randomly provided with fine irregularities, is always the same. Problems can occur, and in the same case, there has always been a need to solve the problems.

  Therefore, the present invention has been made in view of such problems. The purpose of the present invention is to use a resin having a Tg of 80 ° C. or more as an adhesive layer, and at the same time, against a mesh portion or an uneven portion on the surface of the adherend. And a transfer method using the transfer material set that enables the specific function layer to be adhered to the adherend surface while ensuring the durability of the specific functional layer. Is to provide.

In order to solve the above-mentioned problems, the invention according to claim 1 of the present invention includes a first transfer material obtained by laminating an adhesive layer made of a thermoplastic resin on the surface of a first base film, and a second base film. And a second transfer material formed by laminating a functional layer for exhibiting a specific function on the surface of the substrate, wherein the first base film has a thickness of 50 μm or less and the adhesive layer has a thickness of 50 μm or less The thickness of the second base film is 12 μm or more and 125 μm or less, and the glass transition temperature Tg of the adhesive layer is 80 ° C. or more.

Invention of Claim 2 of this invention is the transfer material set of Claim 1, Comprising: The said contact bonding layer is an acrylic resin, a polyvinyl chloride resin, a polyvinyl chloride vinyl acetate resin, a polyester resin, a polyurethane resin, Alternatively, any one or a plurality of polyamide resins are mixed.

Invention of Claim 3 of this invention is a transfer material set of Claim 1 or Claim 2, Comprising: The said functional layer is hard-coat property, antireflection property, fingerprint resistance property, antifouling property Any one or more of antistatic property, antiglare property, and weather resistance.

Invention of Claim 4 of this invention is a transfer material set of any one of Claim 1 thru | or 3, Comprising: A metal is laminated | stacked by the substantially mesh shape by planar view, and the said The surface of the mesh-like metal layer having a side view depth of 1 μm or more and 50 μm or less is a transfer target surface.

Invention of Claim 5 of this invention is a transfer material set of any one of Claim 1 thru | or 3, Comprising: It has a fine uneven | corrugated shape on the surface, and the side surface of the said fine uneven | corrugated shape A surface having a visual depth of 1 μm or more and 50 μm or less is a transfer target surface.

The invention related to the transfer method according to claim 6 of the present invention is a transfer method using the transfer material set according to any one of claims 1 to 5, wherein the transfer imparts a specific function. After the adhesive layer is transferred to the target surface using the first transfer material, the functional layer is laminated to the surface of the transfer layer using the second transfer material. To do.

The invention related to the transfer method according to claim 7 of the present invention is the transfer method according to claim 6, wherein the surface to be transferred is formed by laminating metal in a substantially mesh shape in plan view, and the mesh The depth of the side view of the metal layer is 1 μm or more and 50 μm or less.

The invention related to the transfer method according to claim 8 of the present invention is the transfer method according to claim 6, wherein the transfer target surface has a fine uneven shape, and a side view depth of the fine uneven shape is A surface having a thickness of 1 μm or more and 50 μm or less is a surface to be transferred.

  As described above, in the conventional hard coat transfer foil, when the surface of the adherend has a concavo-convex laminate in a substantially sectional view, the hard coat layer could not be adhered to the adherend. In such a transfer material set, since the transfer is performed in two stages, first, the adhesive layer is securely adhered and laminated first, and then the surface of the exposed adhesive layer, for example, hard coat or antireflection is used. It was set as the structure of laminating | stacking the functional layer for providing a specific function. Therefore, if the transfer material set according to the present invention is applied to the adherend surface having a mesh-like surface or fine uneven surface, which has been difficult with conventional transfer materials, the desired specific functional layer is finally adhered securely. , It can be easily laminated. Further, if the transfer method using the transfer material set according to the present invention is used, it is possible to reliably laminate the desired functional layer on the desired adherend surface in a durable state.

It is a conceptual diagram for demonstrating the transfer process using the transfer material set which concerns on this Embodiment. It is a conceptual diagram for demonstrating the transfer process using the conventional transfer material. 2 is an electron micrograph showing a close contact state after carrying out Example 1. FIG. 6 is an electron micrograph showing a close contact state after carrying out Example 2. FIG. 2 is an electron micrograph showing a close contact state after carrying out Comparative Example 1. FIG. It is an electron micrograph which shows the contact | adherence state after implementing Comparative Example 2.

  Embodiments of the present invention will be described below. The embodiment shown here is merely an example, and is not necessarily limited to this embodiment.

(Embodiment 1)
A transfer material set according to the present invention will be described as a first embodiment.
The transfer material set according to the present embodiment assumes that two transfer materials are used as one set, and will be referred to as a first transfer material and a second transfer material, respectively, in the following description.

  The first transfer material is formed by laminating an adhesive layer on the surface of the first base film, and the second transfer material is configured by laminating a functional layer for exhibiting a specific function on the surface of the second base film. Have.

Hereinafter, the first transfer material will be described in order.
As the base film (first base film) of the first transfer material, this may be a conventionally known type used for the transfer material, specifically, a known film such as a polyethylene terephthalate (PET) film. Any plastic film may be used as long as it is conventionally used as a support for a transfer material. The thickness of the first base film is preferably 50 μm or less, and in the present embodiment, it is a PET film having a thickness of 25 μm. The reason why the thickness is preferably 50 μm or less will be described later.

  In the present embodiment, the adhesive layer laminated on the surface of the first base film is preferably a thermoplastic resin, and more specifically, an acrylic resin, a polyvinyl chloride resin, a polychloroacetic acid. It is preferable to use that one or a plurality of resins such as a vinyl resin, a polyester resin, a polyurethane resin, or a polyamide resin is mixed. In this embodiment, an acrylic resin is used. The thickness of the adhesive layer made of acrylic resin is preferably 50 μm or less.

  The Tg of the adhesive layer is preferably 80 ° C. or higher. That is, when high durability is required for the transfer layer after the transfer process is finally completed, the adhesive layer needs to have a certain degree of hardness, and in order to exhibit a certain degree of hardness, the Tg of the adhesive layer has a certain amount. This is because height is required. These materials are preferred, their thickness, and Tg will be described later. The method for laminating the adhesive layer is not particularly limited and may be any conventionally known general method. In this embodiment, it is assumed that this is a technique called wet coating.

Next, the second transfer material will be described.
As the base film (second base film) of the second transfer material, this may also be of a conventionally known type used for the transfer material like the first base film, specifically, polyethylene terephthalate (PET). Any known plastic film such as a film may be used as long as it is suitably used as a support for a transfer material. Preferably, the thickness of the second base film is preferably 12 μm or more and 125 μm or less, and in the present embodiment, it is a PET film having a thickness of 50 μm. The reason why the thickness range is as described above will be described later.

  The functional layer laminated on the surface of the second base film is, for example, a layer for expressing hard coat properties for imparting scratch resistance and antireflection properties for preventing external light reflection. This may be any conventionally known one. For example, if the purpose is to impart hard coat properties, the functional layer is an active energy ray-curable composition, for example, a (meth) acrylate compound having 3 or more (meth) acryloyl groups, for example, Ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, alkyl-modified dipentaerythritol tetra (Meth) acrylate, alkyl-modified dipentaerythritol penta (meth) acrylate, ethylene oxide-modified pentaerythritol tetra (meth) acrylate, caprolactone-modified dipentaerythritol Hexa (meth) acrylate, trimethylolpropane tri (meth) acrylate, ethylene oxide modified trimethylolpropane tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris ((meth) acryloxyethyl) isocyanurate, Examples include caprolactone-modified tris ((meth) acryloxyethyl) isocyanurate, pentaerythritol tri (meth) acrylate, and alkyl-modified dipentaerythritol tri (meth) acrylate. These polyfunctional (meth) acrylates may be used alone or in combination of two or more.

  If the purpose of the functional layer, such as antireflection or functionality, is imparted, a conventionally known material capable of imparting them may be used. Of course, this functional layer does not need to be a single layer, and a material capable of imparting hard coat properties and antireflection properties to one layer may be used, or a hard layer exhibiting hard coat properties. The coat layer and the antireflection layer exhibiting antireflection properties may be separately laminated. The method for laminating these layers may be a conventionally well-known method, and the thickness of the layer may be a minimum thickness that allows the functional layer to sufficiently exhibit a desired function. That's fine.

  In the present embodiment, the functional layer is a layer for imparting hard coat properties (hereinafter referred to as “hard coat layer”), and is composed of a (meth) acrylate compound having three or more (meth) acryloyl groups. Shall be. The method for laminating the hard coat layer is not particularly limited. For example, the casting method, roller coating method, bar coating method, spray coating method, air knife coating method, spin coating method, flow coating method, curtain coating method, direct gravure method. Method, kiss gravure reverse method, and slit reverse method. The thickness is 1 to 10 μm. As described above, the function exhibited by the functional layer according to the present embodiment is not limited to the hard coat. For example, fingerprint resistance, antifouling property, antistatic property, antiglare property, weather resistance, etc. I refuse to be okay.

  In the first transfer material and the second transfer material described above, the first base film and the second base film may be peelable, but in some cases, they are bonded to the respective base films. A release layer for imparting peelability may be provided before laminating the layers and functional layers, but further details are omitted here.

  In the present invention, the functional layer is laminated on the surface of the adherend using the transfer material set composed of the first transfer material and the second transfer material described above. The functional layer is a hard coat layer. As the electromagnetic wave shielding film exemplified above for the adherend, the lamination method will be described with reference to the drawings.

  In the following description and FIG. 1, the first transfer material 10 has a PET film having a thickness of 25 μm as the first base film 1, and an adhesive layer 2 made of acrylic resin having a thickness of 25 μm is laminated on the surface thereof. The Tg of the adhesive layer 2 is 100 ° C. The second transfer material 20 is a PET film having a thickness of 50 μm as the second base film 3, and a hard coat layer 4 made of an active energy ray-curable composition having a thickness of 30 μm is laminated on the surface thereof. The electromagnetic shielding film 5 is provided with a mesh-like metal layer on the surface thereof, and the width of the metal layer stripe in plan view and the convex height in side view are both 20 μm.

  In the following description, it is assumed that a mesh-like metal layer is provided on a plane to be transferred, but the transfer material set according to the present embodiment is not only a mesh-like metal layer, but also has fine irregularities on its surface. Even if it is a case where it is provided regularly or randomly on one side, it is refused in advance that it acts similarly.

  First, the adhesive layer 2 side of the first transfer material 10 is brought into contact with the metal layer lamination surface side of the electromagnetic wave shielding film 5 and disposed. Subsequently, it heats from the 1st base film 1 side of the 1st transfer material 10, and it pressurizes simultaneously. That is, a thermal transfer process is performed. The degree of pressurization at this time is high pressure, and the heating temperature is 220 ° C.

  When the thermal transfer process is completed, only the first base film 1 of the first transfer material 10 adhered to the electromagnetic wave shielding film 5 is peeled off. Thus, it laminates | stacks in the state which the contact bonding layer 2 inserted with respect to the mesh-shaped surface of the electromagnetic wave shielding film 5. FIG.

  In this state, the hard coat layer 4 side of the second transfer material 20 is then brought into contact with the adhesive layer 2 on the surface of the electromagnetic wave shielding film 5 and disposed. Next, the second transfer material 20 is heated from the second base film 3 side and simultaneously pressurized. That is, the thermal transfer process is performed again. This thermal transfer is similar to the previous one, and is performed by high heat and high pressure.

  When the thermal transfer process is completed, only the second base film 3 of the second transfer material 20 in a state of being attached to the adhesive layer 2 on the surface of the electromagnetic wave shielding film 5 is peeled off. For example, the second base film 3 is removed. It may be used as a whole protective film and peeled off only immediately before actual use.

  Thus, the state where the hard coat layer is finally laminated on the surface of the electromagnetic wave shielding film via the adhesive layer is completed.

Based on the above steps, the transfer material set according to the present embodiment will be further described.
In the present embodiment, the thickness of the first base film is preferably 50 μm or less. This is because the first transfer film is subjected to the above-described thermal transfer process from the first base film side. The amount of heat given by the high heat needs to reach the adhesive layer sufficiently, that is, if the first base film is thicker than necessary, it will reach the adhesive layer even if high heat is applied from the first base film side. This is because it is assumed that the amount of heat required for the adhesive layer is not reached. In the case assumed here, the Tg of the adhesive layer is 100 ° C., that is, the amount of heat of 100 ° C. must reach the adhesive layer at the time of heating by thermal transfer. It can be said that the film should not be thicker than necessary.

  On the other hand, if the necessary amount of heat is applied to the adhesive layer regardless of the thickness of the first base film, higher heat is applied from the first base film side at a higher temperature. Naturally, it is also conceived that the material film breaks due to high heat and high temperature.

  In other words, as long as the first base film is a polymer resin film, it is obvious that it is not possible to perform a heat transfer process at a higher temperature and temperature than necessary. It is also obvious that the degree of freedom in the actual transfer process is remarkably lost.

  For the same reason, it can be said that it is not preferable to laminate a layer other than the adhesive layer, for example, a functional layer such as a hard coat layer, on the surface of the first base film. As described above, if the functional layer such as the hard coat layer is laminated in addition to the first base film and the adhesive layer, the adhesive layer is securely attached to the adherend surface as it is. However, since the Tg of the adhesive layer is high, the transfer operation cannot be performed at once.

  As a result of extensive research by the inventor, it can withstand high pressure and high temperature during normal thermal transfer, and can transmit a necessary and sufficient amount of heat even if the adhesive layer has a high Tg. It is found that the upper limit of the thickness of the first base film is 50 μm, and therefore, in the present embodiment, the thickness of the first base film is preferably 50 μm or less.

  By the way, as a PET film with a thickness of less than 25 μm, the thickness of the first base film is 25 μm in the description here because it is widely distributed. However, it is not necessarily limited to this thickness. Let me state that there is nothing.

  As for the thickness of the adhesive layer, as described above, in order to achieve the purpose of fully digesting the given amount of heat, firmly melting it, and then melting it into the mesh surface. The inventor has found that a preferable thickness of the metal layer is 30 μm or less, and in the case of an actually circulating electromagnetic wave shielding film, the height of the convex portion in the side view of the metal layer forming the mesh is about 30 μm or less. Therefore, in this embodiment, the thickness of the adhesive layer is set to 30 μm or less. Of course, if the height of the convex portion exceeds 30 μm, all the convex portions must be covered in order to exert the function of the adhesive layer, so if the thickness of the adhesive layer is adjusted accordingly Good. However, it goes without saying that in the adjustment, sufficient consideration must be given to the fact that it must melt during thermal transfer.

  For this reason, in the present embodiment, the first transfer material is used to securely bond the adhesive layer to the surface of the electromagnetic wave shielding film without generating a gap.

  In addition, for the second transfer material, it is only necessary to transfer the functional layer for imparting a specific function to the electromagnetic wave shielding film in which the adhesive layer is surely laminated. However, the thickness of the second base film for laminating any functional layer is generally set so that the second base film is not damaged when the functional layer is laminated. A thickness of 12 μm or more is necessary, and the upper limit of the thickness for ensuring that heat reaches the functional layer when performing thermal transfer is 125 μm. Therefore, in this embodiment, the thickness is 12 μm or more and 125 μm or less. It is said that it is preferable.

  It should be noted that the functional layer only needs to have a thickness that allows its function to be sufficiently exerted, and may be a thickness that takes into account the relationship with the adherend, and does not impose any particular restrictions. I refuse.

  By executing the above transfer method using the transfer material set according to the present embodiment, even for a mesh-like surface having fine convex portions on its surface, such as an electromagnetic wave shielding film. In addition, it is possible to obtain an adhesive layer having a high hardness, that is, a resin having a high Tg, which can be securely inserted and fitted, that is, a highly durable adhesive layer that can maintain the interlayer adhesion for a long period of time. By laminating a specific functional layer such as a hard coat using a separate transfer material on the top, interlaminar adhesion is ensured even on the adherend surface, which is ultimately difficult with a single transfer material. It is possible to execute the transfer that has been completed.

  It should be noted that the transfer can be reliably performed in a similar manner to a shape other than the mesh shape, that is, a plane provided with fine irregularities, but detailed description thereof is omitted here.

  In order to further explain the present invention, a transfer material set and a transfer material were prepared as follows, and the state after each transfer was examined.

Example 1
The first transfer material was configured as follows.
PET film (thickness 25 μm) / acrylic resin (thickness 25 μm)
The second transfer material was configured as follows.
PET film (thickness 50 μm) / active energy ray curable composition (thickness 5 μm)
And the hard-coat layer was transcribe | transferred on the electromagnetic wave shield film surface using the transfer material set which consists of these 2 transfer materials.

(Example 2)
The first transfer material was configured as follows.
PET film (thickness 25 μm) / acrylic resin (thickness 30 μm)
The second transfer material was configured as follows.
PET film (thickness 50 μm) / active energy ray-curable composition layer (thickness 5 μm)
And the hard-coat layer was transcribe | transferred on the electromagnetic wave shield film surface using the transfer material set which consists of these 2 transfer materials.

(Comparative Example 1)
The transfer material was constructed as follows.
PET film (thickness 50 μm) / active energy ray-curable composition layer (thickness 5 μm) / acrylic resin (thickness 25 μm)
Using this transfer material, the hard coat layer was transferred to the surface of the electromagnetic wave shielding film.

(Comparative Example 2)
The transfer material was constructed as follows.
PET film (thickness 50 μm) / active energy ray-curable composition layer (thickness 5 μm) / acrylic resin (thickness 30 μm)
Using this transfer material, the hard coat layer was transferred to the surface of the electromagnetic wave shielding film.

Here, the electromagnetic wave shielding film used as the adherend was formed with a mesh-like convex portion formed of copper wire on the surface, and the approximate height of the convex portion was 20 μm.
All the transfer performed here was thermal transfer under the same conditions, and the heating temperature was 260 ° C. and the pressure was extremely high.

  The state after transfer was observed with a microscope. The photographs are shown in FIGS.

  As can be seen from FIGS. 3 and 4, the transfer results according to Example 1 and Example 2 are fitted into the mesh-shaped recess without any particular problem.

  On the other hand, the transfer results of Comparative Example 1 and Comparative Example 2 show that a bubble-like space is generated in the vicinity of the center of the mesh-like recess as seen in FIGS. This space causes a decrease in interlayer adhesion.

  Thus, it can be clearly seen that the transfer product after the transfer process according to the example has good adhesion, while the transfer product after the transfer process according to the comparative example does not have good adhesion.

  With the transfer material set according to the present invention, it is surely desired even for an adherend having fine irregularities on the surface, which could not ensure interlayer adhesion with the conventional transfer material. Since the functional layer to be transferred can be transferred, it is particularly useful for actions such as transferring the hard coat layer to the surface of the electromagnetic wave shielding film.

DESCRIPTION OF SYMBOLS 10 1st transfer material 1 1st base film 2 Adhesion layer 20 2nd transfer material 3 2nd base film 4 Functional layer 5 Electromagnetic wave shield film 30 Conventional transfer material 31 Base film 32 Functional layer 33 Adhesion layer 34 Electromagnetic shielding film

Claims (8)

A first transfer material formed by laminating an adhesive layer made of a thermoplastic resin on the surface of the first base film;
A second transfer material formed by laminating a functional layer for exhibiting a specific function on the surface of the second base film;
And
The thickness of the first base film is 50 μm or less,
The adhesive layer has a thickness of 50 μm or less,
The thickness of the second base film is 12 μm or more and 125 μm or less,
The glass transition temperature Tg of the adhesive layer is 80 ° C. or higher,
A transfer material set featuring: The transfer material set according to claim 1,
The adhesive layer is a mixture of one or more of acrylic resin, polyvinyl chloride resin, polyvinyl chloride vinyl acetate resin, polyester resin, polyurethane resin, or polyamide resin;
A transfer material set featuring: The transfer material set according to claim 1 or 2,
The functional layer is one or a plurality of hard coat properties, antireflection properties, fingerprint resistance properties, antifouling properties, antistatic properties, antiglare properties, and weather resistance properties,
A transfer material set featuring: The transfer material set according to any one of claims 1 to 3,
A surface obtained by laminating a metal in a substantially mesh shape in plan view, and a side view depth of the mesh metal layer being 1 μm or more and 50 μm or less is a transfer target surface;
A transfer material set featuring: The transfer material set according to any one of claims 1 to 3,
A surface having a fine uneven shape on the surface and having a side view depth of the fine uneven shape of 1 μm or more and 50 μm or less is a transfer target surface;
A transfer material set featuring: A transfer method using the transfer material set according to any one of claims 1 to 5,
For the transfer target surface that gives a specific function,
After transferring the adhesive layer using the first transfer material,
The functional layer is laminated on the surface of the transfer layer using the second transfer material,
A transfer method characterized by The transfer method according to claim 6,
The transfer target surface is formed by laminating a metal in a substantially mesh shape in a plan view, and a side view depth of the mesh metal layer is 1 μm or more and 50 μm or less,
A transfer method characterized by The transfer method according to claim 6,
The transfer target surface has a fine uneven shape, and the side surface depth of the fine uneven shape is 1 μm or more and 50 μm or less is the transfer target surface,
A transfer method characterized by

Images