JP5143657B2 - Liquid processing equipment - Google Patents

Description

  The present invention relates to a liquid processing apparatus for processing an end portion of an object to be processed such as a semiconductor wafer.

Conventionally, by supplying a gas to the upper surface of the substrate (object to be processed) and simultaneously supplying an etching solution (processing solution) to the lower surface of the substrate, it is possible to selectively etch the peripheral portion and the lower surface of the upper surface of the substrate. A bevel etching apparatus (liquid processing apparatus) is known (see Patent Document 1). A bevel etching apparatus (liquid processing apparatus) described in Patent Document 1 performs etching toward a lower surface of a substrate rotated by the substrate holding and rotating means that rotates while holding the substrate substantially horizontally. It is placed on the substrate holding and rotating means so as to face the upper surface of the substrate with a gap of a predetermined interval, and is rotated together with the substrate by the substrate holding and rotating means. And a shielding plate (top plate) having an opening for supplying a gas for controlling the flow of the etching solution from the lower surface to the upper surface to the upper surface of the substrate.
JP 2002-110626 A

  In general, the etching solution (processing solution) jumps in various directions while the substrate (object to be processed) is processed. For this reason, the etching solution may adhere to the blocking plate (top plate). As a result, in the conventional technique such as Patent Document 1, when the processed substrate is removed from the substrate holding and rotating means and moved below the blocking plate, the etching solution attached to the blocking plate falls on the substrate. there is a possibility. In addition, if the etching solution adheres to the blocking plate in this way, it may adversely affect the substrate to be processed next time.

  The present invention has been made in consideration of such points, and even if the processing liquid adheres to the top plate while the object to be processed is processed, the processing liquid remains on the object to be processed. It is an object of the present invention to provide a liquid processing apparatus that prevents an object from being dropped or having an adverse effect on an object to be processed after the next time.

The liquid processing apparatus according to the present invention comprises:
In the liquid processing apparatus for processing the end of the object to be processed,
A support part for supporting the object to be processed;
A rotation drive unit for rotating the object to be processed supported by the support unit;
A processing liquid supply mechanism for supplying a processing liquid to the object to be processed;
A discharge mechanism for discharging the processing liquid that has processed the object to be processed;
A rotating cup that is provided outside the periphery of the object to be processed and guides the processing liquid that has processed the object to be processed to the discharge mechanism;
A top plate provided on the upper surface side of the object to be processed and covering the object to be processed;
The top plate has a peripheral outward protrusion that extends to above the rotating cup;
A suction mechanism having a suction port for sucking the processing liquid adhering to the outer peripheral protrusion is provided on the peripheral outer protrusion.

In the liquid processing apparatus according to the present invention,
The suction port preferably has a first suction port and a second suction port.

In the liquid processing apparatus according to the present invention,
The first suction port sucks a processing liquid to be reused,
The second suction port preferably sucks a processing liquid to be processed as drainage.

In the liquid processing apparatus according to the present invention,
The processing liquid supplied from the processing liquid supply mechanism to the object to be processed includes a cleaning liquid and a rinsing liquid,
The first suction port sucks cleaning liquid,
The second suction port preferably sucks the rinse liquid.

In the liquid processing apparatus according to the present invention,
It is preferable that the apparatus further includes an inert gas supply mechanism that is provided on the upper surface side of the object to be processed and supplies an inert gas to a gap between the object to be processed and the rotating cup.

In the liquid processing apparatus according to the present invention,
It is preferable that the apparatus further includes a pure water supply unit that is provided on the upper surface side of the object to be processed and supplies pure water to a gap between the object to be processed and the rotating cup.

  According to the present invention, the top plate has a peripheral outer protrusion that extends to above the rotary cup, and the peripheral outer protrusion is provided with a suction mechanism that sucks the processing liquid adhering to the peripheral outer protrusion. It has been. For this reason, even if the processing liquid adheres to the top plate while the object to be processed is processed, the processing liquid can be removed at any time. As a result, the processing liquid adhering to the top plate is prevented from falling on the processed object to be processed, or the processing object adhering to the top plate is not adversely affected on the object to be processed next time. be able to.

BEST MODE FOR CARRYING OUT THE INVENTION

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a liquid processing apparatus according to the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 8 are diagrams showing an embodiment of the present invention.

  As shown in FIG. 1, the liquid processing apparatus according to the present embodiment supplies a processing liquid to the lower surface and side surfaces (end portions) of a semiconductor wafer W (hereinafter referred to as a wafer W) that is an object to be processed. The lower surface and side surfaces of the wafer W are cleaned and processed. In the present application, the treatment liquid means a chemical solution or pure water (rinse solution). As the chemical solution, for example, hydrofluoric acid, a mixed solution of nitric acid and hydrofluoric acid, or the like can be used.

  As shown in FIG. 1, the liquid processing apparatus includes processing liquid supply mechanisms 37 and 39 for supplying a processing liquid to the lower surface of the wafer W, discharge mechanisms 20 and 21 for discharging the processing liquid that has processed the wafer W, and a wafer W. , And a rotating cup 10 that guides the processing liquid that has processed the wafer W to the discharge mechanisms 20 and 21.

  Among these, the processing liquid supply mechanisms 37 and 39 guide the processing liquid supplied from the processing liquid supply section 39 and the processing liquid supplied from the processing liquid supply section 39 to the lower surface side of the wafer W, as shown in FIG. And a processing liquid supply pipe 37. The upper surface of the processing liquid supply pipe 37 constitutes a processing liquid supply port 37a.

  As shown in FIG. 1, the discharge mechanisms 20 and 21 include a drain cup 20 that receives the processing liquid guided by the rotating cup 10, and a drain pipe 21 that discharges the processing liquid received by the drain cup 20. And have. An exhaust cup 26 is provided around the drain cup 20, and an exhaust pipe 25 that sucks and discharges a gas such as nitrogen gas in the exhaust cup 26 is provided in the exhaust cup 26. The exhaust pipe 25 is connected to a discharge / suction part (not shown) for applying a suction force.

  As shown in FIGS. 1, 4, and 5, the lower end of the rotary cup 10 is provided with a plurality of support pins (support portions) 15 that protrude inward from the periphery and support the lower surface of the periphery of the wafer W. It has been.

  Further, as shown in FIG. 1, a top plate 40 is provided on the upper surface side of the wafer W supported by the support pins 15 so as to cover the wafer W. Further, an inert gas supply pipe 47 connected to an inert gas supply unit 46 for supplying an inert gas such as nitrogen gas or argon gas (nitrogen gas in the present embodiment) extends inside the top plate 40. Exist. The inert gas supply pipe 47 is an end at the center of the top plate 40, and the end constitutes an inert gas supply port 47a. As shown in FIG. 1, the top plate 40 is connected to a top plate driving unit 49 that moves the top plate 40 in the vertical direction. Note that the distance between the top plate 40 and the rotating cup 10 when the top plate 40 is in the lower position is that the flow of airflow between the top plate 40 and the rotating cup 10 is caused by the rotation of the rotating cup 10. It has become something that occurs.

  As shown in FIG. 2, the top plate 40 has a peripheral outer protrusion 40 p that extends to above the rotating cup 10. In addition, a suction pipe 75 connected to the suction part 70 for applying a suction force extends in the peripheral outer protrusion 40p, and an end of the suction pipe 75 opposite to the suction part 70 is A suction port 75a for sucking the processing liquid adhering to the peripheral outer protrusion 40p is configured (see FIGS. 2 and 3). The suction unit 70 and the suction tube 75 constitute a suction mechanism.

  As shown in FIG. 1, a hollow base plate (base) 30 is provided on the lower side of the rotary cup 10, and the base plate 30 has a hollow rotating shaft 31 extending downward. Is provided. The rotation shaft 31 is connected to a rotation drive unit 60 that rotates the rotation shaft 31. By rotating the rotary shaft 31 in this way, the base plate 30 and the rotary cup 10 can be rotated, and consequently the wafer W on the support pins 15 provided on the rotary cup 10 can be rotated.

  As shown in FIG. 1, the rotary drive unit 60 includes a pulley 62 disposed outside the periphery of the rotary shaft 31, a drive belt 63 wound around the pulley 62, and a driving force applied to the drive belt 63. Thus, the motor 61 that rotates the rotary shaft 31 via the pulley 62 is provided. A bearing 32 is disposed on the outer periphery of the rotating shaft 31.

  Further, as shown in FIG. 1, a lift pin 35a is provided in the hollow of the rotary cup 10 and the rotary shaft 31, and a lift pin plate 35 having a hollow shape, and extending downward from the lift pin plate 35, has a hollow shape. A lift shaft 36 is arranged. Further, as shown in FIG. 1, a processing liquid supply pipe 37 extends in the vertical direction inside the lift pin plate 35 and the lift shaft 36 (inside the hollow space). The lift shaft 36 is connected to a lift shaft driving unit (not shown) that moves the lift shaft 36 in the vertical direction.

  Further, as shown in FIG. 5, a spacer 11 is disposed between the base plate 30 and the rotating cup 10, and a fastening member such as a screw for fastening the rotating cup 10 and the base plate 30 in the spacer 11. 12 is provided. As shown in FIG. 4, the rotary cup 10 is provided with a hole 10 a for allowing the fastening member 12 to pass therethrough. In the present embodiment, the spacer 11 and the rotary cup 10 are integrally formed and integrally configured.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, a lift pin of a lift pin plate 35 in which a wafer W taken out from a carrier (not shown) by a transfer robot (not shown) is positioned at a delivery position (upper position) by a lift shaft driving unit (not shown). 35a. At this time, the top plate 40 is positioned above the transfer position of the wafer W by the top plate driving unit 49.

  Next, the lift pin plate 35 is moved downward by the lift shaft driving unit (not shown) and positioned at the wafer processing position (see FIG. 1). Thus, while the lift pin plate 35 is moved downward, the lower surface of the wafer W is supported by the support pins 15 provided on the rotary cup 10. Thereafter, the top plate drive unit 49 positions the top plate 40 in the lower position. In the present embodiment, the inner peripheral surface 10f of the rotary cup 10 is inclined downward (see FIG. 5). For this reason, even if the wafer W is mistakenly placed on the rotating cup 10, the wafer W can be slid downward, and the wafer W can be reliably supported by the support pins 15.

  Next, when the rotation shaft 31 is rotationally driven by the rotation driving unit 60, the base plate 30 and the rotation cup 10 are rotated. As a result, the wafer W on the support pins 15 provided in the rotation cup 10 is rotated. (See FIG. 1). Here, the rotating shaft 31 is rotationally driven by applying a driving force from the motor 61 to the pulley 62 via the driving belt 63.

  At this time, the processing liquid supplied from the processing liquid supply unit 39 is supplied to the lower surface of the wafer W (see FIG. 1). Then, the processing liquid supplied to the lower surface of the wafer W is moved outwardly by the centrifugal force generated by the rotation of the wafer W.

  On the other hand, nitrogen gas is supplied from an inert gas supply port 47a provided at the center of the top plate 40 (see FIG. 1). The nitrogen gas passes through the upper surface of the wafer W and is then supplied to the gap between the wafer W and the rotating cup 10 (see FIG. 5). For this reason, the processing liquid reaching the peripheral edge of the wafer W is prevented from flowing into the upper surface side of the wafer W from between the wafer W and the support pins 15 and between the wafer W and the rotating cup 10 by capillary action. can do.

  In addition, according to this Embodiment, the spacer 11 and the rotating cup 10 are also comprised integrally. For this reason, the height position of the wafer W supported by the support pins 15 can be made uniform with respect to the height position of the base plate 30. As a result, since the flow of nitrogen gas flowing on the lower surface side of the wafer W can be made uniform, the processing accuracy of the wafer W can be improved.

  In the present embodiment, the processing liquid supplied from the processing liquid supply mechanisms 37 and 39 to the lower surface of the wafer W can be changed as appropriate. For example, the treatment liquid supply mechanisms 37 and 39 can supply dilute hydrofluoric acid (SC1) first, and then supply pure water (DIW).

  When the process of cleaning the wafer W with the process liquid as described above is completed, the supply of the process liquid (for example, pure water) from the process liquid supply unit 39 is stopped.

  Next, the rotation shaft 31 is rotated at a high speed by the rotation driving unit 60. As a result, the wafer W on the support pins 15 is rotated at a high speed, and the wafer W is dried (see FIG. 1). Thereafter, the motor 61 of the rotation drive mechanism 60 is stopped, and the rotation of the wafer W on the support pins 15 is also stopped (see FIG. 1).

  Next, the top plate drive unit 49 positions the top plate 40 at a position higher than the wafer W transfer position. Thereafter, the lift pin plate 35 is moved to the upper position by the lift shaft driving unit (not shown), and the wafer W is positioned at the delivery position (upper position).

  Next, the wafer W is removed from the lift pin plate 35 by a transfer robot (not shown).

  Here, according to the present embodiment, as shown in FIG. 2 and FIG. 3, the suction port 75 a of the suction pipe 75 connected to the suction part 70 is provided in the peripheral outer protrusion 40 p. As shown in FIG. 3, the treatment liquid adhering to the lower surface or the lower outer surface 40q (see FIG. 2) of the peripheral outer protrusion 40p of the top plate 40 is subjected to airflow generated by the rotation of the rotary cup 10. A rotational force is applied by the flow. For this reason, the processing liquid adhering to the lower surface and the lower outer surface 40q of the peripheral outer protrusion 40p moves on the lower surface and the lower outer surface 40q of the peripheral outer protrusion 40p and is sucked from the suction port 75a. It becomes.

  The treatment liquid adhering to the outer peripheral edge of the peripheral outer protrusion 40p (position away from the suction port 75a in the radial direction of the top plate 40) is between the peripheral outer protrusion 40p and the rotary cup 10. By the flow of the generated air flow or the flow of nitrogen gas and the air flow, the air flows toward the outer periphery of the peripheral outer protrusion 40p and is removed (see FIGS. 2 and 3). Further, the processing liquid adhering to the upper surface of the rotating cup 10 flows toward the outer periphery from between the outer peripheral protrusion 40p and the rotating cup 10 due to the centrifugal force generated by the rotation of the rotating cup 10. It will be removed.

  For these reasons, the processing liquid scatters from between the inner peripheral end of the rotating cup 10 and the outer peripheral end of the wafer W to the upper side of the wafer W, and the lower surface, the lower outer surface 40q, and the rotation of the peripheral outer protrusion 40p Even when it adheres to the upper surface of the cup 10 (see FIG. 2), the treatment liquid can be reliably removed.

  Accordingly, when the processed wafer W is moved below the top plate 40 by a transfer robot (not shown), the processing adhered to the lower surface and the lower outer surface 40q of the peripheral outer protrusion 40p of the top plate 40. The liquid can be prevented from falling on the wafer W. Moreover, it is possible to prevent the wafer W to be processed from the next time from being adversely affected by the processing liquid adhering to the lower surface or the lower outer surface 40q of the peripheral outer protrusion 40p.

  By the way, in the above, it demonstrated using the aspect by which the one suction port 75a was provided in the peripheral outward protrusion part 40p (refer FIG. 3). However, the present invention is not limited to this, and as shown in FIG. 6, two suction ports (first suction port 76a and second suction port 77a) may be provided in the peripheral outer protrusion 40p.

  In this case, a first valve 71 that is openable and closable is provided in a first suction pipe 76 whose end opposite to the suction part 70 constitutes the first suction port 76a, and an end opposite to the suction part 70 is provided. The second suction pipe 77 constituting the second suction port 77a is provided with a second valve 72 that can be freely opened and closed.

  For this reason, by adjusting the open / close state of the first valve 71 and the second valve 72, the type of the processing liquid sucked by the first suction port 76a and the second suction port 77a can be changed. For example, the first suction port 76a can be used for sucking the processing liquid to be reused, and the second suction port 77a can be used for sucking the processing liquid to be processed as drainage. Further, the first suction port 76a can be used for sucking the chemical solution, and the second suction port 77a can be used for sucking pure water.

  When the processing liquid is sucked through the first suction port 76a, the first valve 71 is open and the second valve 72 is closed. On the other hand, when the processing liquid is sucked through the second suction port 77a, the first valve 71 is closed and the second valve 72 is opened.

  Moreover, in the above, it demonstrated using the aspect by which the inert gas supply port 47a was provided in the center part of the top plate 40 (refer FIG. 1). However, the present invention is not limited to this. For example, as shown in FIG. 7, an inert gas supply pipe 47 may be provided at a position that is a peripheral portion of the top plate 40 and faces the peripheral portion of the wafer W. .

  Further, a pure water supply unit 48 that supplies pure water may be further provided on the upper surface side of the wafer W in the gap between the wafer W and the rotary cup 10. Specifically, for example, as shown in FIG. 7, a pure water supply unit 48 that supplies pure water may be provided at a peripheral edge of the top plate 40 and facing the peripheral edge of the wafer W. By providing the pure water supply unit 48 in this manner, the upper surface of the peripheral portion of the wafer W can be rinsed.

  The pure water supplied from the pure water supply unit 48 and the pure water supplied from the treatment liquid supply mechanisms 37 and 39 move on the lower surface of the outer peripheral protrusion 40p and the lower outer surface 40q. The lower surface and the lower outer surface 40q of these peripheral outer protrusions 40p can be cleaned. For this reason, the lower surface and the lower outer surface 40q of the peripheral outer protrusion 40p can be maintained in a clean state.

  In the above description, the rotating cup 10 has been described using an embodiment in which a plurality of support pins (supporting portions) 15 that protrude inward at the periphery and support the lower surface of the periphery of the wafer W are provided (see FIG. 1, see FIGS. 4 and 5). However, the present invention is not limited to this. For example, as shown in FIG. 8, the wafer W is supported by a plurality of (for example, three) support pins (support portions) 15 a provided on the base plate 30, or provided on the base plate 30. A device that supports the wafer W by holding the peripheral edge of the wafer W with a mechanical chuck (not shown) can also be used.

  Moreover, in the above, it demonstrated using the aspect with which the spacer 11 and the rotating cup 10 were comprised integrally. However, the present invention is not limited to this, and the spacer 11 may be configured separately from the rotating cup 10 and the spacer 11 may be attached to the rotating cup 10.

  In the above description, the processing liquid is supplied to the center of the lower surface of the wafer W and the entire lower surface and side surfaces of the wafer W are processed. However, the present invention is not limited to this. The processing liquid may be supplied to the peripheral portion, and the peripheral portion and the side surface of the lower surface of the wafer W may be processed.

1 is a schematic cross-sectional view showing a configuration of a liquid processing apparatus according to an embodiment of the present invention. The schematic sectional drawing which showed the flow of the process liquid of the rotation cup vicinity of the liquid processing apparatus by embodiment of this invention. The upper side top view of the rotation cup and suction mechanism of the liquid processing apparatus by embodiment of this invention. The perspective view of the rotation cup of the liquid processing apparatus by embodiment of this invention. The schematic sectional drawing which expanded the rotation cup vicinity of the liquid processing apparatus by embodiment of this invention. The upper top view of the rotating cup and suction mechanism of the liquid processing apparatus by the modification of embodiment of this invention. The schematic sectional drawing which expanded the rotation cup vicinity of the liquid processing apparatus by the modification of embodiment of this invention. The schematic sectional drawing which expanded the rotation cup vicinity of the liquid processing apparatus by another modification of embodiment of this invention.

Explanation of symbols

W wafer (object to be processed)
10 Rotating cup 11 Spacer 15 Support pin (support part)
20 drain cup 21 drain pipe 25 exhaust pipe 26 exhaust cup 30 base plate (base)
37 treatment liquid supply pipe 39 treatment liquid supply section 40 top plate 40p peripheral outer protrusion 47 inert gas supply pipe 48 pure water supply section 60 rotation drive section 70 suction section 71 first valve 72 second valves 75, 76, 77 Suction tube

Claims (6)

In the liquid processing apparatus for processing the end of the object to be processed,
A support part for supporting the object to be processed;
A rotation drive unit for rotating the object to be processed supported by the support unit;
A processing liquid supply mechanism for supplying a processing liquid to the object to be processed;
A discharge mechanism for discharging the processing liquid that has processed the object to be processed;
The rotatably provided on the periphery outside of the object, a rotary cup for guiding the processing liquid processing the object to be processed to the discharge mechanism,
A top plate provided on the upper surface side of the object to be processed and covering the object to be processed;
The top plate has a peripheral outer protrusion that extends to above the rotating cup, and a gap is formed between the peripheral outer protrusion and the rotating cup.
The liquid processing apparatus, wherein a suction mechanism having a suction port for sucking the processing liquid adhering to the peripheral outer protrusion is provided in the peripheral outer protrusion.   The liquid processing apparatus according to claim 1, wherein the suction port includes a first suction port and a second suction port. The first suction port sucks a processing liquid to be reused,
The liquid processing apparatus according to claim 2, wherein the second suction port sucks a processing liquid to be processed as waste liquid. The processing liquid supplied from the processing liquid supply mechanism to the object to be processed includes a cleaning liquid and a rinsing liquid,
The first suction port sucks cleaning liquid,
The liquid processing apparatus according to claim 2, wherein the second suction port sucks a rinse liquid.   2. An inert gas supply mechanism that is provided on an upper surface side of the object to be processed and supplies an inert gas into a gap between the object to be processed and the rotating cup. 5. The liquid processing apparatus according to any one of 4 above.   The pure water supply part which is provided in the upper surface side of the said to-be-processed object, and supplies a pure water to the gap | interval between the said to-be-processed object and the said rotation cup is further provided. Liquid processing equipment.

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