JP5142218B2 - Tape substrate and adhesive tape - Google Patents

Description

  The present invention relates to a tape substrate using a specific ethylene-aromatic vinyl compound copolymer, and an adhesive tape using the tape substrate.

  In addition to vehicles such as automobiles, trains, etc., in various adhesive tape fields such as insulating tapes used in electrical equipment such as airplanes, ships, houses, factories, etc., they have moderate flexibility and extensibility, flame resistance, machinery It is superior in terms of mechanical strength, heat distortion resistance, electrical insulation, moldability, etc., and is relatively inexpensive, so that it is made from a resin composition containing a vinyl halide resin such as polyvinyl chloride as a raw material. Have been used. Such a halogenated vinyl resin tape generates a toxic gas when incinerated. Recently, metal hydroxides (eg, magnesium hydroxide, aluminum hydroxide, etc.) that have less environmental impact on polyolefin resins are used. Tapes made from a non-halogen resin composition containing a large amount of an inorganic flame retardant composed of an inorganic metal compound such as the above have begun to be used.

As a pressure-sensitive adhesive tape using such a non-halogen resin composition, a pressure-sensitive adhesive tape (see Patent Document 1) or a styrene-based polymer using a composition containing an olefin polymer and an inorganic flame retardant as a tape base material. -Adhesive tape (see Patent Document 2) using a tape substrate of the composition has been proposed, but in order to use it as an adhesive tape for bundling complicated electric cables such as an engine room of an automobile, There were cases where there were problems with flexibility, hand cutting and wear resistance.
In addition, an adhesive tape using an ethylene-styrene copolymer having no stereoregularity obtained by CGC catalyst technology (see Patent Documents 3 and 4) has been proposed. The oil resistance is low, and there is a case where it becomes a problem particularly when used in an automobile engine room or used in a vehicle or a factory.
JP 2001-192629 A JP 2004-315658 A JP-T-2002-506116 Special table 2003-500514 gazette

  An object of the present invention is to provide a tape base material excellent in oil resistance while having a good balance of flexibility and hand cutting properties necessary as an adhesive tape, and an adhesive tape using the tape base material. It is to provide.

（式中、Ｐｈは芳香族基であり、ｘaは繰り返し単位数を示し２以上の整数である。）
３．記エチレン−芳香族ビニル化合物共重合体の製造に用いられる芳香族ビニル化合物が、スチレンである上記１又は２に記載のテ−プ基材。
４．前記エチレン−芳香族ビニル化合物共重合体と、芳香族ビニル化合物系樹脂及びオレフィン系樹脂の少なくとも一方とを含む上記１〜３のいずれか一項に記載のテ−プ基材。
５．前記エチレン−芳香族ビニル化合物共重合体１００質量部に対し、芳香族ビニル化合物系樹脂及び／又はオレフィン系樹脂の合計が１〜１００質量部である樹脂組成物からなる上記４に記載のテ−プ基材。
６．前記芳香族ビニル化合物系樹脂が、アタクティックポリスチレン、ゴム強化ポリスチレン（ＨＩＰＳ）、スチレン−メタクリル酸メチル共重合体、スチレン−メタクリル酸共重合体及びスチレン−イミド化マレイン酸共重合体からなる群から選択される少なくとも１種である上記４又は５に記載のテ−プ基材。
７．前記オレフィン系樹脂が、アイソタクティックポリプロピレン（ｉ−ＰＰ）、ブロックポリプロピレン、ランダムポリプロピレン、プロピレン−エチレンランダム共重合体からなる群から選択される少なくとも１種である上記４〜６いずれか一項に記載のテ−プ基材。
８．前記エチレン−芳香族ビニル化合物共重合体１００質量部に対して、無機質充填剤１〜２００質量部を含む上記１〜７のいずれか一項に記載のテ−プ基材。
９．前記エチレン−芳香族ビニル化合物共重合体が、１０以上８０以下の交互構造指数λを有する上記１〜８のいずれか一項に記載のテ−プ基材。
１０．上記１〜９のいずれか一項に記載のテ−プ基材の少なくとも片面に粘着剤層を形成した粘着テ−プ。
１１．上記１０に記載した粘着テープを用いた結束用テープ。As a result of diligent research, the present inventor has achieved the above object by using a resin composition containing an ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity. I found.
The present invention is based on the above findings and has the following gist.
1. A tape substrate comprising a resin composition comprising an ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity.
2. The ethylene-aromatic vinyl compound copolymer has an alternating structure composed of ethylene and an aromatic vinyl compound represented by the following formula (1), and an isotactic dyad of Ph (aromatic group) in the structure: 2. The tape substrate according to 1 above, wherein the fraction m is greater than 0.75.

(In the formula, Ph is an aromatic group, xa represents the number of repeating units and is an integer of 2 or more.)
3. 3. The tape substrate according to 1 or 2 above, wherein the aromatic vinyl compound used in the production of the ethylene-aromatic vinyl compound copolymer is styrene.
4). 4. The tape base material according to any one of 1 to 3, comprising the ethylene-aromatic vinyl compound copolymer and at least one of an aromatic vinyl compound resin and an olefin resin.
5). 5. The tea according to 4, wherein the total amount of the aromatic vinyl compound resin and / or the olefin resin is 1 to 100 parts by mass with respect to 100 parts by mass of the ethylene-aromatic vinyl compound copolymer. Base material.
6). The aromatic vinyl compound-based resin is selected from the group consisting of atactic polystyrene, rubber reinforced polystyrene (HIPS), styrene-methyl methacrylate copolymer, styrene-methacrylic acid copolymer, and styrene-imidated maleic acid copolymer. 6. The tape substrate according to the above 4 or 5, which is at least one selected.
7). In any one of 4 to 6 above, wherein the olefin resin is at least one selected from the group consisting of isotactic polypropylene (i-PP), block polypropylene, random polypropylene, and propylene-ethylene random copolymer. The tape substrate as described.
8). The tape base material as described in any one of 1 to 7 above, containing 1 to 200 parts by mass of an inorganic filler with respect to 100 parts by mass of the ethylene-aromatic vinyl compound copolymer.
9. The tape substrate according to any one of 1 to 8, wherein the ethylene-aromatic vinyl compound copolymer has an alternating structure index λ of 10 or more and 80 or less.
10. 10. An adhesive tape having an adhesive layer formed on at least one side of the tape substrate according to any one of 1 to 9 above.
11. A bundling tape using the adhesive tape described in 10 above.

  ADVANTAGE OF THE INVENTION According to this invention, the tape base material which was excellent in oil resistance while having the property of a softness | flexibility and hand cutting property in good balance, and the adhesive tape using this tape base material can be provided.

Explanatory drawing of the catalyst rac-dimethylmethylenebis (4,5-benzo-1-indenyl) zirconium dichloride used in Synthesis Example 1. Explanatory drawing of the catalyst CGC (restraint geometric structure) type | mold Ti complex (tertiary butyramide) dimethyltetramethyl- (eta) 5-cyclopentadienyl) silane titanium dichloride used for the comparative synthesis example 1. FIG.

  The ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity used in the present invention (hereinafter also referred to as the present copolymer) will be described below. In the present specification, the aromatic vinyl compound content of the copolymer indicates the content of units derived from the aromatic vinyl compound monomer contained in the copolymer. Similarly, the ethylene content indicates the content of units derived from the ethylene monomer contained in the copolymer.

  As the aromatic vinyl compound constituting the copolymer used in the present invention, styrene or various substituted styrenes such as p-methylstyrene, m-methylstyrene, o-methylstyrene, ot-butylstyrene, m -T-butyl styrene, pt-butyl styrene, α-methyl styrene and the like. Industrially, styrene, p-methylstyrene, and particularly preferably styrene is used.

  The ethylene-aromatic vinyl compound copolymer having an isotactic stereoregularity used in the present invention is composed of ethylene and an aromatic vinyl compound represented by the following formula (1) contained in the copolymer structure. The alternating structure of Ph (aromatic group) is a copolymer having isotactic stereoregularity.

（式中、Ｐｈはフェニル基等の芳香族基、ｘaは繰り返し単位数を示し、２以上の整数である。）

(In the formula, Ph represents an aromatic group such as a phenyl group, xa represents the number of repeating units, and is an integer of 2 or more.)

In this copolymer, the stereoregularity of an alternating structure composed of ethylene and an aromatic vinyl compound has isotactic stereoregularity, which means that the isotactic dyad fraction m (or also called mesodyad fraction). It indicates that it is greater than 0.75, preferably 0.85 or more, more preferably 0.95 or more. The isotactic dyad fraction m is, for example, the peak area Ar derived from the r structure of the methylene carbon peak appearing around 25 ppm by measurement of nuclear magnetic resonance (13C-NMR) spectrum with TMS (tetramethylsilane) as a reference. From the peak area Am derived from the m structure, the following formula (2) can be used.
m = Am / (Ar + Am) (2)

  The appearance position of the methylene carbon peak may slightly shift depending on the type of aromatic vinyl compound used, the measurement conditions, and the solvent. For example, in an ethylene-styrene copolymer using styrene, which is the most preferable example among aromatic vinyl compounds, when deuterated chloroform is used as a solvent and TMS is used as a standard, the peak derived from the r structure is 25.4. A peak derived from the m structure appears around 25.2 to 25.3 ppm at around ˜25.5 ppm. In addition, when heavy tetrachloroethane is used as a solvent and the center peak (73.89 ppm) of the triplet of heavy tetrachloroethane is used as a reference, the peak derived from the r structure has an m structure in the vicinity of 25.3 to 25.4 ppm. The peak derived from appears in the vicinity of 25.1 to 25.2 ppm. The m structure represents a meso dyad structure, and the r structure represents a racemic dyad structure.

  This copolymer can be crystallized due to the isotactic stereoregularity of the aromatic group of an alternating structure composed of ethylene and an aromatic vinyl compound, and can take a microcrystalline structure to a crystalline structure. Therefore, it has the characteristics that it is excellent in mechanical properties such as elastic modulus, breaking strength, elongation and oil resistance.

The copolymer is more preferably an ethylene-aromatic vinyl compound copolymer having an alternating structure index λ given by the following formula (3) of less than 80 and greater than 10. Its structure is determined by a nuclear magnetic resonance method (NMR method). The index λ indicating the ratio of the ethylene-styrene alternating structure contained in the copolymer is defined by the following formula (3).
λ = A ₃ / A ₂ × 100 (3)
In the formula (2), A ₃ is an area of three types of peaks a, b, and c derived from an ethylene-aromatic vinyl compound alternating structure represented by the following formula (4) obtained by 13C-NMR measurement. It is the sum. A ₂ is the total area of peaks derived from main chain methylene and main chain methine carbons observed in the range of 0 to 50 ppm by 13C-NMR based on TMS.

（式中、Ｐｈはフェニル基等の芳香族基、ｘaは繰り返し単位数を示し２以上の整数である。）

(In the formula, Ph represents an aromatic group such as a phenyl group, and xa represents the number of repeating units and is an integer of 2 or more.)

  The copolymer has an alternating structure index λ of 80 or less and 10 or more, preferably 70 or less and 15 or more. When the alternating structure index λ exceeds 80, the present copolymer has an excessive ratio of alternating structures, which is an adverse effect due to excessive crystallization, that is, the tape substrate becomes hard, lacks flexibility, and elongation decreases. There is. Further, when the alternating structure index λ is less than 10, the crystal structure derived from the alternating structure is reduced, instead the polyethylene crystallinity or the polystyrene chain amount is increased, and the mechanical properties such as loss of softness are deteriorated, Furthermore, oil resistance may be reduced.

The range in which the alternating structure index λ of the copolymer is smaller than 80 and larger than 10 is 15 mol% or more and 85 mol% or less in terms of aromatic vinyl compound content. When the alternating structure index λ is less than 70 and greater than 15, the aromatic vinyl compound content is 15 mol% or more and 60 mol% or less. When the content of the aromatic vinyl compound is higher than 60 mol%, particularly higher than 85 mol%, the chain structure of the aromatic vinyl compounds increases, and hardness and brittleness unsuitable as a tape substrate may be exhibited. is there.
The weight average molecular weight of this copolymer is 30,000 to 1,000,000, preferably 100,000 to 500,000. If the weight average molecular weight is lower than 30,000, the mechanical properties may be lowered, or the film may be easily blocked, resulting in poor blocking properties. If the weight average molecular weight is higher than 1 million, molding processability may deteriorate.

  The production method of this copolymer is described, for example, in EP-087492B1, JP-A-11-130808, JP-A-9-309925, WO02 / 102862, US 6239242, 6579996, and 6451946. And can be suitably used in the present invention. Examples of the raw material monomer for the copolymer other than ethylene and aromatic vinyl compounds include α-olefins having 3 to 20 carbon atoms such as propylene, 1-octene, and cyclic olefins having 3 to 40 carbon atoms such as norbornene and dicyclopentadiene. Can be mentioned.

  In addition, the copolymer can be used in a general grafted, modified, or modified form. Further, the present copolymer may be a cross copolymer described in WO01 / 19881 and WO00 / 37517. In this case, the main chain used for the cross copolymer is preferably an ethylene-aromatic vinyl compound-diene copolymer, particularly preferably an ethylene-styrene-divinylbenzene copolymer. The composition of the main chain is the same as the range of the ethylene and aromatic vinyl compounds, and the diene content is 0.001 to 1 mol%, and the total is 100 mol%.

A preferred method for producing an ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity used in the present invention will be described. Although the manufacturing method of this copolymer is not specifically limited, it can be obtained by copolymerizing ethylene and an aromatic vinyl compound and, if necessary, the other monomers in the presence of a polymerization catalyst. The polymerization catalyst most suitably used in the production of the present copolymer is a coordination polymerization catalyst composed of a transition metal compound represented by the following formula (5) and a cocatalyst.
When a coordination polymerization catalyst composed of a transition metal compound represented by formula (5) and a co-catalyst is used, an ethylene-aromatic vinyl compound copolymer having a remarkably high activity and uniform composition suitable for industrialization is produced. Is possible.
Moreover, a highly transparent copolymer can be provided. Furthermore, an ethylene-aromatic vinyl compound copolymer having excellent isophytic properties and isotactic stereoregularity and a head-tail styrene chain structure can be provided.

In formula (5), A and B are each independently selected from an unsubstituted or substituted benzoindenyl group, an unsubstituted or substituted cyclopentadienyl group, an unsubstituted or substituted indenyl group, or an unsubstituted or substituted fluorenyl group. Represents a group.
Y is a group having a bond with A or B and additionally containing hydrogen or a hydrocarbon having 1 to 20 carbon atoms (this group is an atom of nitrogen, boron, silicon, phosphorus, selenium, oxygen, fluorine, chlorine or sulfur). Represents a methylene group, a silylene group, an ethylene group, a germylene group, or a boron atom. The substituents may be different or the same. Y may have a cyclic structure such as a cyclohexylidene group or a cyclopentylidene group.
X is independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 15 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkylaryl group having 8 to 12 carbon atoms, or a hydrocarbon substitution having 1 to 4 carbon atoms. A silyl group having a group, an alkoxy group having 1 to 10 carbon atoms, hydrogen, or an amide group having a hydrocarbon substituent having 1 to 22 carbon atoms. n is an integer of 0, 1 or 2. M is zirconium, hafnium, or titanium.

  When the transition metal compound represented by the formula (5) is a mixture of a racemic body and a meso body, the meso body is preferably 30 mol% or less, and most preferably a racemic body is used. D-form or L-form may be used. Particularly preferably, at least one of A and B is an unsubstituted or substituted benzoindenyl group or an unsubstituted or substituted indenyl group. Preferable examples of such a transition metal compound are transition metal compounds having a substituted methylene bridge structure specifically exemplified in EP-0874492A2, JP-A-11-130808, and JP-A-9-309925. .

  As a co-catalyst used in the production method of the copolymer, a known co-catalyst or alkyl aluminum compound which has been conventionally used in combination with a transition metal compound can be used. As such a cocatalyst, methylaluminoxane (or methylalumoxane or MAO) or a boron compound is preferably used. Examples of promoters (methylaluminoxane and boron compounds) and alkylaluminum compounds that can be used are EP-0874492A2, JP-A-11-130808, JP-A-9-309925, WO00 / 20426, EP0985689A2. Examples thereof include promoters (methylaluminoxane and boron compounds) and alkylaluminum compounds described in JP-A-6-184179.

  In producing the ethylene-aromatic vinyl compound copolymer used in the present invention, the monomers and catalysts (transition metal compounds and promoters) exemplified above are brought into contact with each other. A known method can be used. Any known polymerization conditions and polymerization methods can be employed. From another viewpoint, when an ethylene-aromatic vinyl compound copolymer that can be suitably used in the present invention is defined, a coordination polymerization catalyst composed of a transition metal compound represented by the formula (5) and a cocatalyst is obtained. An ethylene-aromatic vinyl compound copolymer having an aromatic vinyl compound content of 15 mol% or more and 85 mol% or less, and preferably an aromatic vinyl compound content of 15 mol% or more and 60 mol% or less. It is.

  Below, the "aromatic vinyl compound polymer and olefin polymer" that can be contained in the resin composition used for forming the tape substrate will be described.

[Aromatic vinyl compound resin]
The aromatic vinyl compound-based resin is a polymer of an aromatic vinyl compound alone, or an aromatic vinyl compound content including at least one monomer component copolymerizable with the aromatic vinyl compound is 10% by mass or more, preferably 30 It is a copolymer of mass% or more. Examples of the aromatic vinyl compound monomer used in the aromatic vinyl compound polymer include styrene and various substituted styrenes such as p-methylstyrene, m-methylstyrene, o-methylstyrene, ot-butylstyrene, m- Examples thereof include t-butyl styrene, p-t-butyl styrene, α-methyl styrene, etc., and compounds having a plurality of vinyl groups in one molecule such as divinylbenzene. A copolymer between these plural aromatic vinyl compounds is also used. Note that the stereoregularity between the aromatic groups of the aromatic vinyl compound may be any of atactic, isotactic, and syndiotactic.

  Examples of the monomer copolymerizable with the aromatic vinyl compound include butadiene, isoprene, other conjugated dienes, acrylic acid, methacrylic acid or amide derivatives or ester derivatives thereof, maleic anhydride or derivatives thereof. The copolymerization method may be any of block copolymerization, tapered block copolymerization, random copolymerization, and alternating copolymerization. Further, it may be a polymer comprising the above-mentioned monomer, which is obtained by graft polymerization of the aromatic vinyl compound and containing 10% by mass or more, preferably 30% by mass or more of the aromatic vinyl compound. In the case of a copolymer containing butadiene and isoprene, a part or all of the double bonds in the polymer main chain may be hydrogenated.

  Examples of the aromatic vinyl compound-based resin include isotactic polystyrene (i-PS), syndiotactic polystyrene (s-PS), atactic polystyrene (a-PS), rubber-reinforced polystyrene (HIPS), and acrylonitrile-butadiene. -Styrene copolymer (ABS) resin, styrene-acrylonitrile copolymer (AS resin), styrene-methacrylic acid ester copolymer such as styrene-methyl methacrylate copolymer, styrene-methacrylic acid copolymer, styrene- Diene block / tapered copolymer (SBS, SIS, etc.), hydrogenated styrene-diene block / tapered copolymer (SEBS, SEPS, etc.), styrene-diene copolymer (SBR, etc.), hydrogenated styrene-diene copolymer Combined (hydrogenated SBR, etc.), styrene-ma Ynoic acid copolymer, styrene - imidized maleic acid copolymer. These may be used alone or in combination of two or more.

  The aromatic vinyl compound-based polymer needs to have a weight average molecular weight of 30,000 or more, preferably 50,000 or more in terms of styrene, in order to exhibit performance as a practical resin. In order to improve the heat resistance of the tape substrate of the present invention, the aromatic vinyl compound-based resin preferably has a glass transition point of 70 ° C. or higher, preferably 100 ° C. or higher. Examples include atactic polystyrene (a-PS), rubber-reinforced polystyrene (HIPS), acrylonitrile-butadiene-styrene copolymer (ABS) resin, styrene-acrylonitrile copolymer (AS resin), styrene-methacrylic. Examples thereof include styrene-methacrylic acid ester copolymers such as acid methyl copolymers, styrene-maleic acid copolymers, and styrene-imidated maleic acid copolymers. More preferred are atactic polystyrene (a-PS), rubber-reinforced polystyrene (HIPS), styrene-methyl methacrylate copolymer, styrene-methacrylic acid copolymer, and styrene-imidated maleic acid copolymer.

[Olefin resin]
Examples of the olefin resin include low density polyethylene (LDPE), high density polyethylene (HDPE), linear low density polyethylene (LLDPE), isotactic polypropylene (i-PP), and syndiotactic polypropylene (s-PP). ), Atactic polypropylene (a-PP), propylene-ethylene block copolymer, propylene-ethylene random copolymer, ethylene-propylene-diene copolymer (EPDM), ethylene-vinyl acetate copolymer, polyisobutene, polybutene And cyclic olefin polymers such as polynorbornene and cyclic olefin copolymers such as ethylene-norbornene copolymer. Olefin resins obtained by copolymerizing dienes such as butadiene and α-ω dienes may be used as necessary. These may be used alone or in combination of two or more.

  The olefinic resin requires 10,000 or more, preferably 30,000 or more, as a styrene-converted weight average molecular weight in order to exhibit performance as a practical resin. In order to improve the heat resistance of the tape substrate of the present invention, the olefin resin preferably has a crystal melting point of 100 ° C or higher, preferably 130 ° C or higher. In particular, isotactic polypropylene (i-PP), block polypropylene, random polypropylene, and propylene-ethylene random copolymer are preferable.

  The compounding (containment) of the aromatic vinyl compound resin and / or olefin resin into the resin composition is for the purpose of adjusting the elastic modulus and improving the heat resistance as a tape base material. It is preferable to contain an ethylene-aromatic vinyl compound copolymer having the following stereoregularity and at least one of an aromatic vinyl compound resin and an olefin resin. However, depending on the purpose and application of the tape substrate and the heat resistance of the ethylene-aromatic vinyl compound copolymer used, it may not be blended.

  The blending amount of the aromatic vinyl compound resin and / or olefin resin is in the range of 1 to 100 parts by mass in total with respect to 100 parts by mass of the ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity. Is preferable, and the range of 5-70 mass parts is especially preferable. If the blending amount exceeds 100 parts by mass, the workability of the tape base material is lost, and further the tape base material becomes stiff, and the elongation, pinhole resistance, The texture may be reduced.

The inorganic filler which can be mix | blended with the resin composition used for this invention is demonstrated. The reason why the inorganic filler is blended is that the tape substrate is improved in hand cutting properties, while the thermal conductivity during the molding process is increased to increase the cooling effect of the tape substrate. This is to suppress the distortion caused by. The average particle diameter of the inorganic filler is, for example, 20 μm or less, preferably 10 μm or less. When the average particle size is less than 0.5 μm, workability and hand cutting properties may be deteriorated. On the other hand, if the average particle diameter exceeds 20 μm, the tensile strength and breaking elongation of the tape substrate may be lowered, and the flexibility may be lowered and pinholes may be generated.
The average particle diameter is a value based on particle distribution measurement by a laser diffraction method. As a particle distribution measuring machine, for example, there is a product name “Model LS-230” manufactured by Beckman Coulter, Inc. Moreover, when an inorganic filler is blended as a non-halogen flame retardant, char (carbonized layer) can be formed, and the flame retardancy of the tape substrate can be improved.

  Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, triphenyl phosphite, ammonium polyphosphate, polyphosphate amide, zirconium oxide and magnesium oxide. , Zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, hydrotalcite, snakerite, zinc borate, anhydrous zinc borate, zinc metaborate, barium metaborate, antimony oxide, antimony trioxide, antimony pentoxide, red phosphorus, Talc, alumina, silica, boehmite, bentonite, sodium silicate, calcium silicate, calcium sulfate, calcium carbonate, and magnesium carbonate, and one or more compounds selected from these are used. In particular, the use of at least one selected from the group consisting of aluminum hydroxide, magnesium hydroxide, hydrotalcite, and magnesium carbonate is excellent in flame retardancy and is economically advantageous.

  The compounding quantity of an inorganic filler is 1-200 mass parts with respect to 100 mass parts of this copolymer, Preferably it is the range of 5-100 mass parts. If the inorganic filler is less than 1 part by mass, the flame retardancy of the tape substrate may be inferior. On the other hand, when the inorganic filler exceeds 200 parts by mass, mechanical properties such as moldability and strength of the tape substrate may be inferior.

Furthermore, a plasticizer and a low molecular weight polymer can be added to the resin composition in the present invention as necessary. Examples of the plasticizer include known paraffinic, naphthenic, aroma-based process oils, mineral oil-based softeners such as liquid paraffin, castor oil, linseed oil, olefinic wax, mineral wax, and various esters. Can be mentioned. Examples of the low molecular weight polymer include polyethylene wax, polypropylene wax, petroleum resin, hydrogenated petroleum resin and the like.
These plasticizers and low molecular weight polymers are used for adjusting the tape substrate molding processability, fluidity, hardness and the like. The blending amount of these plasticizers or low molecular weight polymers is 0.1 to 20 parts by weight, preferably 100 to parts by weight of ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity, preferably It is the range of 0.1-5 mass parts. If the plasticizer or the low molecular weight polymer is less than 1 part by mass, adjustment of the tape substrate molding processability is insufficient. On the other hand, if it exceeds 20 parts by mass, the adhesiveness of the tape itself is deteriorated. There is a fear.

  Furthermore, the resin composition for forming the tape base material may be a known colorant, antioxidant, ultraviolet absorber, lubricant, stabilizer, and the like as long as the effects of the present invention are not impaired as required. Additives can be blended.

  In the present invention, the tape base is usually an ethylene-aromatic vinyl compound copolymer, an aromatic vinyl compound resin and / or an olefin resin, and an inorganic filler, a plasticizer, which is blended as necessary. Other additives and dry blended, the resulting resin composition is kneaded using a Banbury mixer, roll, extruder, etc., the kneaded product is known, such as compression molding, calendar molding, injection molding, extrusion molding, etc. It is obtained by forming into a film by a forming method.

  Although the thickness of a tape base material changes also with uses of an adhesive tape, the thickness in particular of a tape base material is not restrict | limited, For example, it is 40-500 micrometers, Preferably it is 70-200 micrometers, More preferably, it is 80-160 micrometers. The tape substrate may have a single layer form or may have a multiple layer form.

By irradiating the tape base material with an electron beam for crosslinking, the tape base material can be prevented from being deformed or contracted when placed under a high temperature, and the temperature dependence can be reduced. In this case, the irradiation amount of the electron beam is preferably in the range of 10 to 150 Mrad (mega rad), particularly preferably in the range of 15 to 25 Mrad. If the irradiation amount is less than 10 Mrad, the temperature dependency is not improved.
On the other hand, if the irradiation amount exceeds 150 Mrad, the tape base material is deteriorated by the electron beam, which may cause a problem in workability in post-processing. A cross-linking agent for promoting electron beam cross-linking may be added. Specific examples of the crosslinking agent include low molecular weight compounds and oligomers having at least two carbon-carbon double bonds in the molecule, such as acrylate compounds, urethane acrylate oligomers, and epoxy acrylate oligomers.

  The pressure-sensitive adhesive tape of the present invention is configured by providing a pressure-sensitive adhesive layer on at least one surface of the tape base material. As the pressure-sensitive adhesive, all existing pressure-sensitive adhesives such as rubber-based, hot-melt-based, acrylic-based, and emulsion-based can be applied. Moreover, in order to make these adhesives have desirable performance, tackifiers, anti-aging agents, curing agents and the like can be blended.

  As the base polymer of the rubber-based adhesive, natural rubber, recycled rubber, silicone rubber, isoprene rubber, styrene butadiene rubber, polyisoprene, NBR, styrene-isoprene copolymer, styrene-isoprene-butadiene copolymer and the like are preferable. A crosslinking agent, a softening agent, a filler, a flame retardant, etc. can be added to a rubber-type adhesive as needed. Specific examples include isocyanate crosslinking agents as crosslinking agents, liquid rubber as softening agents, calcium carbonate as fillers, and inorganic flame retardants such as magnesium hydroxide and red phosphorus as flame retardants.

  Examples of the acrylic pressure-sensitive adhesive include a homopolymer of (meth) acrylic acid ester or a copolymer with a copolymerizable monomer. (Meth) acrylic acid ester or copolymerizable monomer includes (meth) acrylic acid alkyl ester (for example, methyl ester, ethyl ester, butyl ester, 2-ethylhexyl ester, octyl ester, etc.), (meth) acrylic acid glycidyl ester , (Meth) acrylic acid, itaconic acid, maleic anhydride, (meth) acrylic acid amide, (meth) acrylic acid N-hydroxyamide, (meth) acrylic acid alkylaminoalkyl ester (for example, dimethylaminoethyl methacrylate, t- Butylaminoethyl methacrylate, etc.), vinyl acetate, styrene, acrylonitrile and the like. Of these, as the main monomer, an alkyl acrylate ester whose homopolymer (homopolymer) usually has a glass transition temperature of −50 ° C. or lower is preferred.

The tackifying resin agent can be selected in consideration of the softening point, compatibility with each component, and the like. Examples include terpene resins, rosin resins, hydrogenated rosin resins, coumarone / indene resins, styrene resins, aliphatic or alicyclic petroleum resins, or hydrogenated products thereof, terpene-phenol resins, xylene resins. And other aliphatic hydrocarbon resins or aromatic hydrocarbon resins.
The softening point of the tackifying resin is preferably 65 to 170 ° C, and moreover, an alicyclic saturated hydrocarbon resin of a petroleum resin having a softening point of 65 to 130 ° C, a polyterpene resin having a softening point of 80 to 130 ° C, and a softening point of 80 to 130. More preferred is glycerin ester of hydrogenated rosin at 0 ° C. These can be used either alone or in combination.

  The anti-aging agent is used to improve the rubber-based pressure-sensitive adhesive because it has an unsaturated double bond in the rubber molecule and is likely to deteriorate in the presence of oxygen or light. Examples of the anti-aging agent include phenolic anti-aging agents, amine-based anti-aging agents, benzimidazole-based anti-aging agents, dithiocarbamate-based anti-aging agents, phosphorus-based anti-aging agents and the like alone or as a mixture. it can. Preferable is a phenolic antioxidant.

  Examples of the curing agent for the acrylic pressure-sensitive adhesive include isocyanate-based, epoxy-based, and amine-based ones, and may be a mixture of these alone or a mixture thereof. Specific examples of the isocyanate curing agent include polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, and diphenylmethane. -4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, Examples include lysine isocyanate. Preferred are 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate.

  The means for applying to the tape substrate such as the pressure-sensitive adhesive, pressure-sensitive adhesive imparting agent and anti-aging agent constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is not particularly limited. For example, pressure-sensitive adhesive, pressure-sensitive adhesive application There is a method in which a pressure-sensitive adhesive solution comprising an agent and an anti-aging agent is applied to one side of the tape substrate by a transfer method and dried.

  The thickness of the pressure-sensitive adhesive layer (thickness after drying) can be appropriately selected within a range that does not impair the tackiness and handleability. Although the thickness of an adhesive layer changes with uses of an adhesive tape, it is 5-100 micrometers, Preferably it is 10-50 micrometers. If it is thinner than this, the adhesive force and the unwinding force may decrease. On the other hand, if it is thicker than this, the coating performance may deteriorate.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, the interpretation of this invention is not limited by these Examples. Hereinafter, units such as “parts” and “%” are displayed on a mass basis unless otherwise specified.

The analysis of the copolymer obtained in the examples was carried out by the following means.
<13C-NMR spectrum>
Using α-500 manufactured by JEOL Ltd., a heavy 1,1,2,2-tetrachloroethane solvent was used and the measurement was performed based on TMS. The measurement based on TMS here is the following measurement. First, the shift value of the center peak of the triplet 13C-NMR peak of heavy 1,1,2,2-tetrachloroethane was determined based on TMS.
Next, the copolymer was dissolved in deuterated 1,1,2,2-tetrachloroethane and 13C-NMR was measured, and each peak shift value was determined as the triplet center peak of deuterated 1,1,2,2-tetrachloroethane. Was calculated on the basis of The shift value of the triplet center peak of deuterated 1,1,2,2-tetrachloroethane was 73.89 ppm. The measurement was performed by dissolving 3% by mass / volume of the polymer in these solvents. The 13C-NMR spectrum measurement for quantifying the peak area was performed by a proton gate decoupling method in which NOE was eliminated, using a 45 ° pulse with a repetition time of 5 seconds as a standard.

<1H-NMR>
Determination of the styrene content in the copolymer was carried out by 1H-NMR, and equipment used was α-500 manufactured by JEOL Ltd. and AC-250 manufactured by BRUCKER. It dissolved in deuterated 1,1,2,2-tetrachloroethane, and the measurement was performed at 80 to 100 ° C. The area intensity of the peak derived from the phenyl group proton (6.5 to 7.5 ppm) and the proton peak derived from the alkyl group (0.8 to 3 ppm) was compared based on TMS. As for the molecular weight, the weight average molecular weight in terms of standard polystyrene was determined using GPC (gel permeation chromatography). The measurement was performed using HLC-8020 manufactured by Tosoh Corporation using THF (tetrahydrofuran) as a solvent.

<DSC measurement>
A DSC (Differential Scanning Calorimeter) 200 manufactured by Seiko Denshi was used in a nitrogen stream. That is, using 10 mg of the resin composition, DSC measurement was performed from −50 ° C. to 240 ° C. at a heating rate of 10 ° C./min, and the melting point, heat of crystal melting, and glass transition point were determined. After the first measurement, the second measurement performed after quenching with liquid nitrogen was not performed.

In Tables 2 and 3, the “surface state” was determined by visually observing the condition of the surface of the obtained tape substrate, and evaluated according to the following evaluation criteria.
Excellent: Clean and smooth surface Good: Somewhat fine unevenness (skinned skin) Poor: Unevenness (skinned skin) is observed and tape substrate thickness is uneven

In Tables 2 and 3, “flexibility (tensile stress at 10% elongation)” is the tensile strength of MD (tape longitudinal direction) 10% modulus measured according to JIS K-6251. In an evaluation test chamber set to a temperature of 23 ± 2 ° C. and a humidity of 50 ± 5% RH, the test piece of the tape base material to be tested is measured n = 3 or more, and the average value of the measured values is shown. Evaluation was based on the evaluation criteria.
Excellent: Tensile stress at 10% elongation of 2 to less than 15 MPa Good: Tensile stress at 10% elongation of 0.5 to less than 2 MPa Poor: Tensile stress at 10% elongation of less than 0.5 MPa More than 15MPa

In Tables 2 and 3, “elongation (breaking elongation)” is MD (tape longitudinal direction) tensile breaking elongation measured in accordance with JIS K-6251. In an evaluation test chamber set to a temperature of 23 ± 2 ° C. and a humidity of 50 ± 5% RH, the test piece of the tape base material to be tested is measured n = 3 or more, and the average value of the measured values is shown. Evaluation was based on the evaluation criteria.
Good: Tensile elongation at break of 100 to less than 400% Bad: Tensile elongation at break of less than 100%, 400% or more

In Tables 2 and 3, “hand cutting” means that the tape base material is cut into a length of 100 mm in MD (tape longitudinal direction) and a width of 20 mm in TD (tape width direction). The condition of the cut surface of the cut surface was evaluated according to the following evaluation criteria.
Excellent: The cut was cut cleanly without stretching Good: The cut was slightly stretched but cut cleanly Poor: The cut was extended and further cut into MD (longitudinal direction of the tape) (longitudinal cut)

In Tables 2 and 3, “thermal shrinkage” is set to a temperature of 23 ± 2 ° C. and humidity of 50 ± 5% RH after leaving a 100 mm square tape base in an atmosphere of 110 ° C. for 10 minutes. It is the shrinkage ratio of MD (tape longitudinal direction) after being left in the evaluation test chamber for 20 minutes or more. An average value of measured values of n = 3 or more is shown and evaluated according to the following evaluation criteria.
Excellent: Shrinkage rate of less than 1% Good: Shrinkage rate of 1% or more and less than 10% Poor: Shrinkage rate of 10% or more

In Tables 2 and 3, “Oil resistance test 1” was an oil resistance test of the tape base material according to JIS K 7114. A circular test piece having a thickness of 3 mm was immersed in test oil (engine oil, olive oil hexane) at 23 ° C., and the weight change rate after 14 days was determined by the following formula.
Weight change rate (%) = 100 × (weight after immersion test−weight before immersion test) / weight change rate before immersion test is 0%, indicating that there is no weight change. This causes deformation due to oil absorption (swelling) and indicates low oil resistance. This value is preferably 5% or less.

In Tables 2 and 3, "Oil resistance test 2" was an oil resistance test of the tape base material according to JIS K 7114. A tape base material with a thickness of 1 mm obtained by press molding at 180 ° C. is punched into a JIS No. 2 small 1/2 dumbbell, immersed in test oil (engine oil, olive oil) at 23 ° C., taken out after 14 days, and subjected to a tensile test. The breaking strength was measured, and the retention rate of the breaking strength was determined by the following formula.

Breaking strength retention rate (%) = 100 × breaking strength after immersion test / breaking strength before immersion test

When the retention is 100%, it is most preferable that the breaking strength does not change at all, and this value is preferably 50% or more and 200% or less.

In Tables 2 and 3, "Oil resistance test 3" was an oil resistance test of the tape base material in accordance with JIS K 7114. The tape base material is punched into JIS No. 2 dumbbells in the MD (tape longitudinal direction), immersed in test oil (engine oil, olive oil) at 23 ° C., taken out after 7 days, subjected to a tensile test, the breaking strength is measured, the breaking strength Was obtained by the following equation.
Break strength retention (%) = 100 × break strength after immersion test / break strength retention before immersion test is 100%, indicating that the fracture strength does not change at all. When the retention rate is 100%, it is most preferable that the breaking strength does not change at all, and this value is preferably 50% or more and 200% or less.

In Tables 2 and 3, “Oil-resistant surface state” means that after wiping off the oil on the surface of the tape base material after immersion, the surface state of the tape base material is observed and the presence or absence of stickiness is evaluated according to the following evaluation criteria. It was evaluated with.
Good: The surface of the tape base material does not swell and does not change in dents, etc., and there is no stickiness. Bad: The surface of the tape base material swells, changes in dents, etc.

In Tables 2 and 3, “blocking property” means that the tape base material is cut into a 50 mm × 100 mm shape, and two 50 mm × 50 mm portions are stacked and left at 50 ° C. for 24 hours under a load of 15 kg. Then, the degree of peeling of the tape substrate was evaluated according to the following evaluation criteria.
Good: The tape base material is attached or pressure-bonded but can be removed. Bad: The tape base material is attached or pressure-bonded and cannot be removed.

“Synthesis Example 1”
(Synthesis of ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity)
Using rac-dimethylmethylenebis (4,5-benzo-1-indenyl) zirconium dichloride shown in FIG. 1 as a catalyst, the following procedure was performed.

Polymerization was carried out using an autoclave with a capacity of 10 L, a stirrer and a heating / cooling jacket. In an autoclave, 1900 ml of styrene and 2900 ml of cyclohexane were charged and heated and stirred at an internal temperature of 60 ° C. Next, about 100 L of nitrogen was bubbled to purge the system and the polymerization solution. Next, 8.4 mmol of triisobutylaluminum and 16.8 mmol of methylalumoxane (manufactured by Tosoh Finechem Co., Ltd., MMAO-3A) were added on the basis of Al, and ethylene was immediately introduced and stable at a pressure of 0.98 MPa (10 Kg / cm2G). Then, about 30 ml of a toluene solution in which 8.4 μmol of rac-dimethylmethylenebis (4,5-benzo-1-indenyl) zirconium dichloride and 0.84 mmol of triisobutylaluminum were dissolved was autoclaved from a catalyst tank installed on the autoclave. Was charged.
Next, polymerization was carried out for 60 minutes while maintaining the internal temperature at 60 ° C. and the pressure at 1.1 MPa. The consumption of ethylene at this stage was about 200 L in the standard state. Further, the St (styrene) conversion rate when the polymerization was stopped was 30%. After completion of the polymerization, a large amount of methanol was added to the obtained polymer solution, and the polymer was recovered by vigorously mixing and stirring with a mixer. This polymer was air-dried at room temperature for 1 day and then dried at 50 ° C. in a vacuum until no mass change was observed, to obtain 800 g of polymer A (λ value 30, m value> 0.95). The obtained polymer A was used for the production test of a tape base material.

“Synthesis Example 2”
The same procedure as in Synthesis Example 1 was carried out except that styrene used was changed to 2400 ml, cyclohexane 3600 ml, ethylene pressure 0.6 MPa, catalyst amount 16.8 μmol, and polymerization 1 hour 50 minutes. -B was obtained.

“Synthesis Example 3”
The same procedure as in Synthesis Example 1 was carried out except that the styrene used was changed to 1400 ml, the cyclohexane to 3400 ml, the ethylene pressure to 1.1 MPa, and the polymerization to 1 hour 40 minutes to obtain 630 g of Polymer-C. Tables 2 and 3 show the analytical values of the polymers obtained in Synthesis Examples 2 and 3.

“Comparative Synthesis Example 1”
(Synthesis of ethylene-styrene copolymer having substantially no stereoregularity)
As a catalyst, a CGC (constrained geometric structure) type Ti complex (tertiary butylamide) dimethyltetramethyl-η5-cyclopentadienyl) silane titanium dichloride (hereinafter referred to as {CpMe4-SiMe2-NtBu} TiCl2) shown in FIG. Was used.

  The amount charged into the autoclave is 4,000 ml of styrene, 800 ml of cyclohexane, the polymerization temperature is 70 ° C., the catalyst is 21 μmol of {CpMe4-SiMe2-NtBu} TiCl2, the methylalumoxane is 84 mmol based on Al, and the ethylene pressure is 0.78 MPa (8 Kg / cm2G). The same procedure as in Synthesis Example 1 was carried out except that the polymerization time was changed to 4 hours to obtain 700 g of polymer D (λ value 27, m value 0.5).

  Table 1 shows analytical values of the polymers A to D.

Example 1
(A) A blend of Polymer A of Synthesis Example 1, a small amount of stabilizer, a lubricant (1 part by mass of erucic acid amide), and a colorant was kneaded with a Banbury mixer, and an extruder (extruder type, manufactured by Frontier Corporation) (Short axis, cylinder-diameter 20 mm)], a compounding step at a cylinder temperature of 180-220 ° C.,
(B) Using the above compound, a lab plast mill (manufactured by Toyo Seiki Co., Ltd., extruder type (2-axis, cylinder diameter 25 mm, L / D = 25)) is used, and the die is a coat hanger type (width 150 mm, lip opening). Degree: 0.15 mmt), cylinder temperature = 170 to 200 ° C., die temperature = 210 ° C., screw rotation speed 30 rpm, film forming step,
Then, a tape base material having a thickness of 0.1 mm was obtained.

(Example 2)
Except having changed the polymer A in the (a) process of Example 1 into the polymer B of the synthesis example 2, it implemented similarly to Example 1 and obtained the tape base material.

(Example 3)
In the step (a) of Example 1, the same procedure as in Example 1 was carried out except that 25 parts by mass of polystyrene (G-14L manufactured by Toyo Styrene Co., Ltd.) was added as the aromatic vinyl compound-based resin. Got.

Example 4
Example 1 (a) In the same manner as in Example 1 except that 10 parts by mass of a styrene-MAA (methacrylic acid) copolymer (T-080 manufactured by Toyo Styrene Co., Ltd.) was added as an aromatic vinyl compound resin. It carried out and obtained the tape base material.

(Examples 5 and 6)
Example 5 was carried out in the same manner as in Example 4 except that 25 parts by mass of the styrene-MAA copolymer was used in Example 4 to obtain an adhesive tape. Example 6 was the same as Example 1 except that 20 parts by mass of polystyrene (G-14L manufactured by Toyo Styrene Co., Ltd.) and 20 parts by mass of styrene-MAA copolymer (T-080 manufactured by Toyo Styrene Co., Ltd.) were added. In the same manner as in Example 1, a tape substrate was obtained.

(Example 7)
The polymer A of Example 1 was changed to the polymer C of Synthesis Example 3, and 20 parts by mass of polystyrene (G-14L made by Toyo Styrene Co., Ltd.) and 20 parts by mass of a styrene-MAA copolymer (T-080 made by Toyo Styrene Co., Ltd.) were added. Otherwise, the same procedure as in Example 1 was performed to obtain a tape base material.

(Example 8)
In the process (a) of Example 1, it implemented like Example 1 except having added 25 mass parts of random polypropylene (E-226 by Mitsui Chemicals) as an olefin resin, and obtained the tape base material. .

Example 9
In Example 6, it carried out similarly to Example 6 except having added 30 mass parts of magnesium hydroxide (Magsees W-H4 average particle diameter 5.0micrometer made from Kamishima Chemical Co., Ltd.) as an inorganic filler, Tape base material Got.

(Example 10)
In the step (a) of Example 1, 20 parts by mass of polystyrene (G-14L manufactured by Toyo Styrene Co., Ltd.), 10 parts by mass of random polypropylene (E-226 manufactured by Mitsui Chemicals) as the olefin resin, magnesium hydroxide (Kanshima Chemical Co., Ltd.) Manufactured by Magsees W-H4 (average particle size: 5.0 μm) 10 parts by mass were added in the same manner as in Example 1 to obtain a tape base material.

(Comparative Example 1)
A tape base material was obtained in the same manner as in Example 1 except that the polymer A was changed to the polymer D of Comparative Synthesis Example 1 in the step (a) of Example 1.

(Comparative Example 2)
In Comparative Example 1, it was carried out in the same manner as in Comparative Example 1 except that 20 parts by mass of polystyrene (G-14L manufactured by Toyo Styrene Co., Ltd.) and styrene-MAA copolymer (T-080 manufactured by Toyo Styrene Co., Ltd.) were used. A substrate was obtained.

(Examples 11 to 13)
Example 11 contains a small amount of other stabilizers, lubricants, and colorants in the tape base composition shown in Table 4 (Example 1), and this compounding agent is kneaded with a Banbury mixer and is approximately 0.1 mm by calendering. A thick tape substrate was formed. Next, a rubber adhesive made of a mixture of natural rubber and SBR was applied and dried as an adhesive on the tape substrate, and cut into a 25 mm wide tape to obtain an adhesive tape.
In Example 12, the tape substrate formulation of Example 6 was used, and Example 13 was performed in the same manner as described above, using the tape substrate formulation of Example 10, and was about 0.1 mm thick. After forming the tape base material, an acrylic pressure-sensitive adhesive was applied and dried together, and cut into a 25 mm wide tape to obtain an adhesive tape.

In Table 4, “rear adhesive strength” was measured in accordance with JIS C 2107. In an evaluation test chamber set to a temperature of 23 ± 2 ° C. and a humidity of 50 ± 5% RH, a test piece is pressure-bonded to a SUS test plate on which an adhesive tape to be tested is attached, and the pressure roller is moved at a speed of 300 mm / min. After reciprocating once, after standing for 20 to 40 minutes, the value when the test piece is peeled off from the test plate at a speed of 300 mm / min is the back surface adhesive force, and the average value of n = 3 or more is shown. The evaluation was based on the following criteria.
Good: Back adhesive strength of 0.5 to 5.5 N / 10 mm Bad: Back adhesive strength less than 0.5 N / 10 mm, more than 5.5 N / 10 mm

In Table 4, “Abrasion resistance” means that a cotton cloth No. 3 is placed as a wear material on a tape base material having a length of 100 mm and a width of 50 mm, and a weight of 500 g is placed thereon, and 80 round trips per minute. The tape base material after being rubbed together with the wear material at a high speed was evaluated for visual damage on the tape base material according to the following criteria.
Good: The tape base material is scratched and has no shaving. Bad: The tape base material is scratched and shaved.

In Table 4, “workability” was evaluated based on the following criteria for ease of use when an adhesive tape was wrapped around an electric wire cable having a diameter of 1 mm.
Good: Adhesive tape does not stretch or break during winding Bad: Adhesive tape stretches or breaks during winding

In Table 4, “terminal peeling” means that an adhesive tape was wound around a wire cable in a half wrap shape, and the presence or absence of terminal peeling of the terminal portion at the end of winding was visually evaluated according to the following criteria.
Good: No terminal peeling of the terminal part Bad: Terminal peeling of the terminal part

In Table 4, “whitening” was performed by visually observing the presence or absence of whitening of the cut surface at the end of winding after winding an adhesive tape around a wire cable in a half wrap shape.
Good: No whitening on the cut surface. Bad: Whitening on the cut surface.

In Table 4, “oil resistance” means that the adhesive tape itself is used and immersed in oil under the same conditions as in the above oil resistance test 3, and a tensile test is performed in the MD (tape longitudinal direction) to measure the breaking strength retention rate. did.
Good: When the breaking strength retention is 50% or more and 200% or less.
Poor: When the breaking strength retention is less than 50% or more than 200%.

  As is apparent from Tables 2 and 3, according to the present invention, a tape substrate having excellent oil resistance while having a good balance of flexibility, hand cutting property and heat resistance can be easily obtained. I understand that Further, as is apparent from Table 4, the tape base material has necessary characteristics as an adhesive tape or a binding tape, and can be suitably used as an adhesive tape or a binding tape. .

The tape base material of the present invention is excellent in oil resistance, and the adhesive tape using the tape base material is suitable for bundling tape for bundling electric wires and cables such as wire harnesses for automobile cabins and engine rooms, for example. Can be used.

It should be noted that the entire contents of the specification, claims, drawings and abstract of Japanese Patent Application No. 2006-146124 filed on May 26, 2006 are cited herein as disclosure of the specification of the present invention. Incorporated.

Claims (11)

  A tape substrate comprising a resin composition comprising an ethylene-aromatic vinyl compound copolymer having isotactic stereoregularity. The ethylene-aromatic vinyl compound copolymer has an alternating structure composed of ethylene and an aromatic vinyl compound represented by the following general formula (1), and an isotactic die of Ph (aromatic group) in the structure: 2. The tape substrate according to claim 1, wherein the ad fraction m is greater than 0.75.

(In the formula, Ph is an aromatic group, xa represents the number of repeating units and is an integer of 2 or more.)   The tape base material according to claim 1 or 2, wherein the aromatic vinyl compound used in the production of the ethylene-aromatic vinyl compound copolymer is styrene.   The tape base material according to any one of claims 1 to 3, comprising the ethylene-aromatic vinyl compound copolymer and at least one of an aromatic vinyl compound resin and an olefin resin.   5. The fiber according to claim 4, comprising a resin composition in which the total of the aromatic vinyl compound resin and / or the olefin resin is 1 to 100 parts by mass with respect to 100 parts by mass of the ethylene-aromatic vinyl compound copolymer. -Substrates.   The aromatic vinyl compound-based resin is selected from the group consisting of atactic polystyrene, rubber-reinforced polystyrene (HIPS), styrene-methyl methacrylate copolymer, styrene-methacrylic acid copolymer, and styrene-imidated maleic acid copolymer. The tape substrate according to claim 4 or 5, wherein the tape substrate is at least one selected from the group consisting of the following.   The olefin resin is at least one selected from the group consisting of isotactic polypropylene (i-PP), block polypropylene, random polypropylene, and propylene-ethylene random copolymer. The tape substrate according to one item.   The tape base material as described in any one of Claims 1-7 containing 1-200 mass parts of inorganic fillers with respect to 100 mass parts of said ethylene-aromatic vinyl compound copolymers.   The tape substrate according to any one of claims 1 to 8, wherein the ethylene-aromatic vinyl compound copolymer has an alternating structure index λ of 10 or more and 80 or less.   An adhesive tape having an adhesive layer formed on at least one side of the tape substrate according to any one of claims 1 to 9.   A bundling tape using the adhesive tape according to claim 10.

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