JP5106457B2 - Electronic component joining method, bump forming method and apparatus therefor - Google Patents

Abstract

An electronic components jointing method includes: supplying a fluid (4) to a circuit substrate (1), performing image process to images shot by a camera (22) so as to measure quantity of conductive particles (3) in the fluid (4); and controlling a value of a gap between a first electrode (2) of the circuit substrate (1) and a second electrode (6) of the electronic components (5) to be a proper value in the jointing procedure according to the measured value. Thereby, it is able to joint electronic components even if the supplying quantity of the jointing material has a deviation and form a salient point on the electrode without open circuit short circuit owing to bad scolder.

Description

  The present invention relates to a method of mounting an electronic component on a circuit board or forming a bump on an electrode.

  When the electronic component 5 is mounted on the circuit board 1 as shown in FIG. 9E, the solder self-assembly method shown in FIGS. 9A to 9E is known. In this case, the pitch of the electrodes 2 formed on the circuit board 1 and the pitch of the electrodes 6 formed on the electronic component 5 are the same.

  In FIG. 9A, the fluid 4 including the solder powder 3 is supplied onto the circuit board 1. The fluid 4 is supplied by a general viscous material supply method such as dispenser, screen printing, or transfer.

  In FIG. 9B, the circuit board 1 supplied with the fluid 4 is placed on the heating stage 9 and the electronic component 5 is sucked and held by the electronic component suction tool 7 to flow the electrode 6 of the electronic component 5. It is pressed against the body 4 and held so as to secure a gap H between the electrode 2 and the electrode 6.

  In this state, the electronic component suction tool 7 is heated by the heater 8 and the heating stage 9 is heated by the heater 10 to execute a predetermined temperature profile, whereby the solder powder 3 is melted as shown in FIG. In addition, the molten solder 12 and the resin component of the fluid 4 convect A in and around the gap H between the electrode 2 and the electrode 6.

As a result, the molten solder 12 is self-assembled between the electrode 2 and the electrode 6 due to the particle integration phenomenon on the electrode due to the surface tension of the liquid.
In FIG. 9D, by cooling the circuit board 1 and the electronic component 5 below the melting point of the solder powder 3, the molten solder 12 self-assembled between the electrode 2 and the electrode 6 is solidified, and the electrode 2 and the electrode 6 are solidified. Is solder-metal bonded 20. Reference numeral 11 denotes a cured resin component in the fluid 4, which serves as an underfill for protecting the joint between the electronic component 5 and the circuit board 1 after solder joining and securing the joint strength.

9A to 9D, the process of mounting the electronic component 5 on the circuit board 1 has been described. If this “solder self-assembly method” is used, as shown in FIG. The bumps 31 can also be formed on the electrodes 2 of the circuit board 1. In this case, after supplying the fluid 4 onto the circuit board 1 in the same manner as in FIG. 9A, a constant amount is provided between the heating tool 7a and the electrode 2 as shown in FIG. By securing, holding, and heating the gap H, solder is self-assembled on the electrodes 2 of the circuit board 1 to form solder bumps 31. Note that the resin component of the fluid 4 is cleaned and removed after the solder bumps 31 are formed, so that the state shown in FIG.
JP 2006-100775 A

  When the electronic component 5 is mounted on the circuit board 1 by the conventional electronic component bonding method, there is a problem that a solder short defect or a bonding open defect occurs due to the amount of the solder powder 3 and stable mass production cannot be performed.

  FIG. 11B shows an example of a solder open defect B. FIG. 12B shows an example of a solder short defect C. The solder open failure occurs when the amount of the solder powder 3 in the supplied fluid 4 is small as shown in the schematic diagram of FIG. The solder short-circuit failure occurs when the amount of the solder powder 3 in the supplied fluid 4 is large as shown in the schematic diagram of FIG.

  The same applies when the bumps 31 are formed on the electrodes 2 of the circuit board 1, and bump shape defects such as bump shorts between the electrodes due to excessive amount of solder and small bump volumes due to excessive amount of solder occur, resulting in stable mass production. There is a problem that cannot be done.

  The present invention solves the above-described conventional problems, and does not cause quality defects such as solder shorts and open defects, regardless of variations in the amount of conductive particles such as solder powder 3 supplied. It is an object of the present invention to provide an electronic component bonding method and apparatus capable of being stably implemented, and a bump forming method and apparatus capable of being stably implemented without poor quality of bump formation on an electrode.

  According to the electronic component joining method of the present invention, a fluid containing conductive particles is interposed between the substrate and the electronic component, and is held in the gap between the first electrode of the substrate and the second electrode of the electronic component. In this state, the heated fluid flows and the conductive particles melted between the first electrode and the second electrode are self-assembled, and then cooled below the solidification temperature of the conductive particles. When mounting the electronic component on the substrate, the step of imaging the fluid supplied to the substrate or the electronic component and measuring the amount of conductive particles by image recognition, and the actual conductive particles measured A step of determining and controlling the value of the gap based on the amount, and determining an appropriate target gap value based on the measured actual amount of conductive particles and controlling the gap to approach the target gap And including a process That.

  In the electronic component bonding apparatus according to the present invention, a fluid containing conductive particles is interposed between the substrate and the electronic component, and is held in the gap between the first electrode of the substrate and the second electrode of the electronic component. The conductive particles that are heated and melted in a heated state are self-assembled between the first electrode and the second electrode, and then cooled below the solidification temperature of the conductive particles to An electronic component bonding apparatus for mounting an electronic component on the substrate, the camera for imaging the fluid supplied to the substrate or the electronic component and measuring the amount of conductive particles by image recognition, and the measured actual And a processing device for determining an appropriate target gap value based on the amount of the conductive particles and controlling the gap to approach the target gap.

In the bump forming method of the present invention, a fluid containing conductive particles is interposed between a substrate and a flat tool, and the bump is formed while being held in a gap between the electrode of the substrate and the tool. The conductive particles melted by the fluid flowing are self-assembled between the electrode and the tool, and then the tool is separated from the substrate and cooled below the solidification temperature of the conductive particles. When forming bumps on the electrodes, an image of the fluid supplied to the substrate and measuring the amount of conductive particles by image recognition and an appropriate amount based on the measured actual amount of conductive particles And a step of determining a value of a target gap and controlling the gap to approach the target gap.
The bump forming apparatus of the present invention is heated in a state where a fluid containing conductive particles is interposed between the substrate and the flat tool and is held in a gap between the electrode of the substrate and the tool. The conductive particles melted by the fluid flowing are self-assembled between the electrode and the tool, and then the tool is separated from the substrate and cooled below the solidification temperature of the conductive particles. A bump forming apparatus for forming bumps on the electrodes, wherein the fluid supplied to the substrate is imaged and the amount of conductive particles is measured by image recognition; and the measured actual conductive particles And a processing device that determines an appropriate target gap value based on the amount and controls the gap to approach the target gap.

  According to this configuration, even in the case of a slight variation in the supply amount of the bonding material in mass production, the optimum value of the gap is determined in the bonding process or the bump formation process according to the amount of the supplied bonding material. It is possible to stably carry out the bonding between the circuit board and the electronic component and the bump formation on the electrode without any quality defect such as short circuit or open defect.

Hereinafter, the electronic component bonding method and the bump forming method of the present invention will be described based on specific embodiments.
FIG. 1 (a) shows an electronic component bonding apparatus that executes the electronic component bonding method of the present invention.

As shown in FIG. 2, the processing device 20 configured with a microcomputer as a main part includes steps S1 to S4.
In step S1, the supply device 21 is operated so that the fluid 4 is supplied onto the circuit board 1 in a shape that covers the electrode 2 as shown in FIGS. In this example, nine electrodes 2 are provided on the circuit board 1 at a predetermined interval. The supply device 21 is a general viscous material supply means such as a dispenser or printing. The fluid 4 contains solder powder 3 as conductive particles that contribute to bonding.

  In this embodiment, the case where the solder powder 3 is used as the conductive particles contained in the fluid 4 will be described, but the conductive particles such as Ag coated with solder, Cu, Au, and the like are also the same. Can be used for

  Further, the resin component of the fluid 4 may be any resin component that has a viscosity that can flow within a range of room temperature to the melting temperature of the conductive particles. Including things. Typical examples include thermosetting resins such as epoxy resins, phenol resins, silicone resins, diallyl phthalate resins, furan resins, and melamine resins, polyester elastomers, fluororesins, polyimide resins, polyamide resins, and aramid resins. A plastic resin, a light (ultraviolet) curable resin, or the like, or a combination thereof can be used.

  In step S2, photographing information is acquired from a camera 22 that photographs the fluid 4 deposited on the circuit board 1 in step S1 as shown in FIG. 1B, and solder powder in the fluid 4 is obtained. Calculate the quantity of 3.

  Specifically, the fluid 4 supplied onto the circuit board 1 is image-recognized by the camera 22, the color of the solder powder 3 distributed in the fluid 4 is extracted based on the difference in luminance, and the solder powder 3. Only the solder powder image data 15 is identified. FIG. 3C shows a schematic diagram of the solder powder image data 15.

Next, the processing device 20 processes the solder powder image data 15 as follows.
The processing apparatus 20 divides the electrode 2 formed on the circuit board 1 into nine divided areas E1 to E9 at an equal pitch for each electrode 2 as shown in FIG. The area of the solder powder image data 15 is calculated. The area calculation of the solder powder image data 15 is performed by a method of counting the number of pixels occupied by the extracted solder powder image data 15.

  Then, an average value of the amount of solder powder 3 measured for each of the divided areas E1 to E9 is calculated, and the average value is compared with a predetermined target amount to calculate an excess / deficiency amount. When the average value of the amount of the solder powder 3 is within a specified range, the target gap H0 corresponding to the appropriate solder amount is read from the database 23, and the gap H approaches the target gap H0. In step S3, the lifting device 24 is operated to raise and lower the electronic component suction tool 7 to control the gap H. In step S4, the joining operation for joining the electronic component 5 to the circuit board 1 is performed. Here, the electronic component 5 is a semiconductor chip.

  If the average value of the amount of the solder powder 3 exceeds the specified range and is excessive, the target gap H0 is read from the database 23 according to the degree of excess, and the gap H approaches the target gap H0. In step S3, the joining operation in step S4 is performed while controlling the lifting device 24. The target gap H0 when the average value of the amount of the solder powder 3 exceeds the specified range and is excessive is larger than the target gap H0 when the average value of the amount of the solder powder 3 is appropriate.

  When the average value of the amount of the solder powder 3 is less than the specified range, the target gap H0 is read from the database 23 according to the degree of the shortage, and the gap H approaches the target gap H0. Thus, the joining operation of step S4 is performed while controlling the lifting device 24 in step S3. The target gap H0 when the average value of the amount of solder powder 3 is less than the specified range is smaller than the target gap H0 when the average value of the amount of solder powder 3 is appropriate.

  As a result, the gap H is changed to an optimum value every time, instead of always performing mass production with the gap H kept constant, regardless of variations in the amount of fluid 4 supplied onto the circuit board 1 as in the prior art. However, since the joining is performed, it is possible to produce with stable quality.

A comparative example in which the gap H is constant and mass production will be described, and an embodiment in which the gap H is changed to an optimum value as described above will be described. The other joining conditions of the gap H are the same in the comparative example and the example.
Here, as shown in FIG. 5A, on the circuit board 1, the electrodes 2 having a pitch P = 200 μm, an electrode size L = 100 μm □, and an electrode height 18 μm are formed in an 484-pin area arrangement shape. In the electronic component 5, an electrode 6 having a height of 15 μm was formed at a position facing the circuit board 1 by the same pitch, electrode size, and electrode arrangement as those of the electrode 2 of the circuit board 1. As the fluid 4, a solder powder 3 having an average particle diameter of 20 μm, 50 wt%, epoxy resin 22 wt%, curing agent 22 wt%, activator 5 wt%, curing accelerator 1 wt%, and a composition ratio contained was used.

  After supplying the fluid 4 onto the circuit board 1 by the dispensing method, the amount of the solder powder 3 contained in the fluid 4 supplied onto the circuit board 1 as shown in FIG. Was extracted by image recognition, and the amount of solder powder 3 was converted into an area for each divided area for each electrode 2 and calculated.

− Comparative Example −
In the comparative example, the bonding result of the divided area E1 shown in FIG. 5B when the gap H between the electrode 2 of the circuit board 1 and the electrode 6 of the electronic component 5 was fixed at 20 μm was confirmed. The confirmation result is shown in FIG. In this graph, the amount of solder powder 3 is plotted on the horizontal axis, and the short-circuit and open defect rates of the electrodes in the divided area E1 are plotted on the vertical axis.

From the result of FIG. 5 (c), in the joining with a constant gap H (= 20 μm), the solder open defect occurs in the region where the amount of the solder powder 3 is as small as 0.045 mm ² or less. It has been clarified that a solder short defect occurs in an area as large as 0.27 mm ² or more.

The optimum value of the fluid supply amount is calculated to be 2.0 mg by calculation of the volume of solder and resin necessary for bonding when the gap H between the electrode 2 and the electrode 6 is 20 μm, but in the actual production process, Even if 2.0 mg is supplied as a target value, management at 2 mg ± 0.1 mg is the limit, and as a result, the amount of solder powder 3 present in the divided area E1 is 0.04 mm ² to 0.29 mm ² and therefore, when combined with the relationship with the amount of solder powder 3 that causes solder shorts and open defects as shown in FIG. 5 (c), joint failure is avoided when mass production is performed with a constant gap H of 20 μm. I can't understand.

− Examples −
Next, based on the configuration of the circuit board 1, the electronic component 5, and the fluid 4 similar to FIG. 5, as shown in FIG. 6A, the amount of the solder powder 3 in the divided area E1 is constant at 0.3 mm ^2. Then, the gap H was varied to perform bonding.

  As a result, as shown in FIG. 6 (b), when the gap H was 26 μm or less, excessive solder was required for the amount of solder necessary for joining, and a short circuit occurred. In other words, there is a range of gap H that does not cause poor bonding with respect to the amount of supplied solder powder 3, and it can be understood that poor bonding can be prevented by controlling the gap H to be bonded. . Although attention is paid to short-circuit defects, it can be said that there is a range of gaps H that can prevent defects with respect to the amount of supplied solder powder 3 even for open defects.

FIG. 7 shows the result of verifying the correlation.
FIG. 7 plots a correlation between the amount of the gap H and the amount of the solder powder 3 in which the open test and the short-circuit defect do not occur by performing a joining experiment in a matrix using the amount of the solder powder 3 in the divided area E1 and the gap H as factors. FIG. The supply amount of the fluid 4 was 2.0 mg ± 0.1 mg.

As a result, the gap H is set to 10 according to the amount of the solder powder 3 within the variation range (0.04 mm ² to 0.29 mm ² ) of the amount of the solder powder 3 when 2 mg is supplied as the target value of the fluid 4. It was confirmed that good bonding without short-circuit failure and open failure could be achieved by appropriately varying and controlling between ˜30 μm.

  In the above embodiment, the area is calculated from the solder powder image data 15 for each individual electrode 2 formed on the circuit board 1, but not for each individual electrode 2 formed on the circuit board 1. 4 may be divided into divided areas E01 to E03 including a plurality of electrodes 2 as shown in FIG. In the case of FIG. 4, the area of the electrode 2 formed on the circuit board 1 is divided into three, but depending on the size, the electrode pitch, the size, etc. of the bonding area of the objects to be bonded, Set the area range to be divided.

Further, the area calculation of the solder powder image data 15 can also calculate the solder volume by three-dimensionally image processing the extracted solder powder image data 15.
Moreover, in each embodiment, although the case where the average value of the measured value of the amount of the solder powder 3 for each of the plurality of divided areas is fed back to the control of the gap H has been described as an example, The minimum value and the maximum value of the measured value of the amount of the solder powder 3 are calculated, the excess or deficiency of the supplied solder powder 3 is determined based on the maximum value and the minimum value, and the appropriate amount of solder is correspondingly determined accordingly. It is also possible to read the target gap H0 from the database 23 and perform the joining operation in step S4 while controlling the lifting device 24 in step S3 so that the gap H approaches the target gap H0.

Moreover, in each embodiment, although the case where the average value of the measured value of the amount of the solder powder 3 for each of the plurality of divided areas is fed back to the control of the gap H has been described as an example, depending on the objects to be joined In advance, a correlation between the defect and the amount of solder powder 3 in the divided area is obtained in advance, and an effective divided area for determining whether the amount of solder powder 3 is excessive or insufficient is defined.
The amount of solder powder 3 in one effective divided area,
Or the average value of its active subdivisions,
Or the maximum of its valid multiple divided areas,
Alternatively, it can be implemented by feeding back to the control of the gap H based on the minimum value of the effective divided areas. That is, also in this case, in step S <b> 2 in which the fluid 4 supplied to the circuit board 1 is imaged and the amount of solder powder is measured by image recognition, it is divided into regions for each electrode 2 or a plurality of regions including the electrodes 2. This is included in determining whether the supplied solder powder 3 is excessive or insufficient based on the amount of the solder powder 3 in a specific area set in advance among a plurality of areas.

  In each of the above embodiments, the fluid 4 is supplied to the circuit board 1 and the electronic component 5 is joined to the circuit board 1. However, the fluid 4 is supplied to the electronic component 5 and the electronic component 5 is attached to the circuit board 1. The same can be done when joining.

  In each of the above-described embodiments, the electronic component 5 is a semiconductor chip. However, the electronic component 5 may be, for example, a semiconductor element in which electrodes are arranged in a peripheral manner. The electronic component 5 is not limited to a semiconductor element, and may be other active components, passive components, a rigid type substrate, or a flexible type substrate.

  In each of the above embodiments, the process of mounting the electronic component 5 on the circuit board 1 has been described. However, in the bump formation in which the bump 31 is formed on the electrode 2 of the circuit board 1, the electrode 2, the heating tool 7a, Similarly, by controlling the gap H with the circuit board electrode 2 according to the excess or deficiency of the amount of the solder powder 3, it is possible to form a good bump without a short-circuit defect and a rising defect with stable quality.

  In the processing apparatus 20 in this case, step S4 in FIG. 2 showing the configuration of the processing apparatus of the electronic component bonding apparatus is merely changed from the bonding process to step S4A of the bump formation process, and the other configuration is the electronic component. It is the same as the processing apparatus of the joining apparatus. In the bump forming process, the heating tool 7a is separated from the circuit board 1 by cooling the solder powder 3 below the solidification temperature of the solder powder 3 by increasing the gap H while heating the solder powder 3 above the melting temperature. . FIG. 8 shows the configuration of the processing apparatus 20 of the bump forming apparatus.

  Further, not only when the bumps 31 are formed on the electrodes 2 of the circuit board 1, but also when the bumps 31 are formed on the electrodes of the substrate of the electronic component, the same can be performed. In this case, the electronic component is not limited to a semiconductor element, and may be another active component, a passive component, a rigid type substrate, or a flexible type substrate.

That is, the bump forming method and the bump forming apparatus of the present invention can be configured as follows.
First, a bump forming apparatus that executes a bump forming method is a state in which a fluid containing solder powder is interposed between a substrate and a flat tool and is held in a gap between the electrode of the substrate and the tool. The solder powder, which is heated and melted by the fluid, is self-assembled between the electrode and the tool, and then the tool is separated from the substrate and cooled to a temperature lower than the solidification temperature of the solder powder. A bump forming apparatus for forming bumps on the electrodes, the camera for imaging the fluid supplied to the substrate and measuring the amount of solder powder by image recognition, and the actual amount of solder powder measured And a processing device for determining an appropriate target gap value and controlling the gap to approach the target gap.

  According to the bump forming method of the present invention, a fluid containing solder powder is interposed between a substrate and a flat tool, and the bump is formed while being held in a gap between the electrode of the substrate and the tool. The solder powder melted by flowing the fluid is self-assembled between the electrode and the tool, and then the tool is separated from the substrate and cooled to a temperature lower than the solidification temperature of the solder powder. In forming a bump on the substrate, an image of the fluid supplied to the substrate and measuring the amount of solder powder by image recognition, and an appropriate target gap value based on the actual amount of solder powder measured. And determining to control the gap to approach the target gap.

  In the bump forming method of the present invention, in the step of imaging the fluid supplied to the substrate and measuring the amount of solder powder by image recognition, the number of pixels is counted after the solder powder is identified and color extracted by image recognition. It is carried out by converting it into an area.

  In the bump forming method of the present invention, in the step of imaging the fluid supplied to the substrate and measuring the amount of solder powder by image recognition, the method is divided into regions for each electrode or a plurality of regions including the electrodes. It divides | segments and it implements by determining the excess and deficiency of the supplied said solder powder based on the quantity of the solder powder for every said area | region.

  In the bump forming method of the present invention, determining whether the supplied solder powder is excessive or insufficient based on the amount of solder powder for each region is based on an average value of the amount of solder powder measured for each region. This is done by determining whether the supplied solder powder is excessive or insufficient.

  In the bump forming method of the present invention, determining whether the supplied solder powder is excessive or insufficient based on the amount of solder powder for each region is based on the maximum value and the minimum value of the amount of solder powder measured for each region. Based on this, it is determined by determining whether the supplied solder powder is excessive or insufficient.

  In the bump forming method of the present invention, in the step of imaging the fluid supplied to the substrate and measuring the amount of solder powder by image recognition, the method is divided into regions for each electrode or a plurality of regions including the electrodes. This is performed by dividing and determining the excess or deficiency of the supplied solder powder based on the amount of solder powder in a specific area set in advance among the plurality of areas.

  In the bump forming method and the bump forming apparatus, the case where the solder powder 3 is used as the conductive particles contained in the fluid 4 has been described. As the conductive particles, conductive material such as Ag, Cu, or Au coated with solder is used. Particles can be used as well.

  In the bump forming method and the bump forming apparatus, the resin component of the fluid 4 may have any viscosity that can flow within the range of room temperature to the melting temperature of the conductive particles. Including those that fall to a flowable viscosity. Typical examples include thermosetting resins such as epoxy resins, phenol resins, silicone resins, diallyl phthalate resins, furan resins, and melamine resins, polyester elastomers, fluororesins, polyimide resins, polyamide resins, and aramid resins. A plastic resin, a light (ultraviolet) curable resin, or the like, or a combination thereof can be used. Furthermore, as the fluid 4 in the case of the bump forming method and the bump forming apparatus, a high boiling point solvent, oil, or the like can be used in addition to the above resin.

  The present invention improves the connection quality of interelectrode bonding between a semiconductor having a fine and fine inter-electrode pitch and a printed wiring board on which a fine wiring pattern is formed, for example, used in electronic devices that are becoming smaller and lighter. Can contribute.

The block diagram of the electronic component joining apparatus in connection with embodiment of this invention, and explanatory drawing which shows an imaging state Configuration diagram of processing apparatus of the embodiment Schematic diagram showing a cross section of the main part of the embodiment and an explanatory diagram of image processing Explanatory drawing of image processing of another embodiment Explanatory drawing of the main part cross section of the comparative example joined with a constant gap and the joining result Explanatory drawing of the joining result of the electronic component joining method in connection with embodiment of this invention Explanatory drawing of the joining result of the electronic component joining method concerning the embodiment Configuration diagram of processing apparatus of the embodiment Process diagram of conventional electronic component joining method Process diagram of conventional bump formation method Explanatory diagram of open defects caused by conventional electronic component joining methods Explanatory diagram of short-circuit defects that occur due to conventional electronic component joining methods

1 Circuit board 2, 6 Electrode 3 Solder powder (conductive particles)
DESCRIPTION OF SYMBOLS 4 Fluid 5 Electronic component 7 Electronic component adsorption | suction tool 7a Heating tool H The clearance gap between the electrode 2 and the electrode 8, 10, Heater 9 Heating stage 11 The hardened resin component 12 in the fluid 4 Molten solder 15 Solder powder image data 20 Processing device 21 Supply device 22 Camera 23 Database 24 Lifting devices E1 to E9 Dividing area 31 Bump

Claims (14)

The fluid heated in a state where a fluid containing conductive particles is interposed between the substrate and the electronic component and is held in a gap between the first electrode of the substrate and the second electrode of the electronic component The conductive particles melted between the first electrode and the second electrode are self-assembled and then cooled below the solidification temperature of the conductive particles to mount the electronic component on the substrate. On the occasion
Imaging the fluid supplied to the substrate or the electronic component and measuring the amount of conductive particles by image recognition; and
Determining and controlling the value of the gap based on the measured actual amount of conductive particles;
And a step of determining an appropriate target gap value based on the measured actual amount of conductive particles and controlling the gap to approach the target gap. In the step of imaging the fluid supplied to the substrate or the electronic component and measuring the amount of conductive particles by image recognition,
The electronic component joining method according to claim 1, wherein the conductive particles are identified and color extracted by image recognition, and then the number of pixels is counted and converted into an area. In the step of imaging the fluid supplied to the substrate or the electronic component and measuring the amount of solder powder by image recognition,
Divided into regions for each of the first electrode and the second electrode, or divided into a plurality of regions including the first electrode or the second electrode,
The electronic component joining method according to claim 1, wherein an excess or deficiency of the supplied conductive particles is determined based on an amount of conductive particles for each region. To determine the excess or deficiency of the supplied conductive particles based on the amount of conductive particles for each region,
The electronic component joining method according to claim 3, wherein an excess or deficiency of the supplied conductive particles is determined based on an average value of the amount of conductive particles measured for each region. To determine the excess or deficiency of the supplied conductive particles based on the amount of conductive particles for each region,
The electronic component joining method according to claim 3, wherein an excess or deficiency of the supplied conductive particles is determined based on a maximum value and a minimum value of the amount of conductive particles measured for each region. In the step of imaging the fluid supplied to the substrate or the electronic component and measuring the amount of conductive particles by image recognition,
Divided into regions for each of the first electrode and the second electrode, or divided into a plurality of regions including the first electrode or the second electrode,
The electronic component joining method according to claim 1, wherein an excess or deficiency of the supplied conductive particles is determined based on a predetermined amount of conductive particles in a specific region among the plurality of regions. While the fluid containing conductive particles is interposed between the substrate and the electronic component, the fluid heated while being held in the gap between the first electrode of the substrate and the second electrode of the electronic component is The electroconductive particles that have flowed and melted are self-assembled between the first electrode and the second electrode, and are then cooled below the solidification temperature of the electroconductive particles to mount the electronic component on the substrate. A component joining device,
A camera that images the fluid supplied to the substrate or the electronic component and measures the amount of conductive particles by image recognition;
An electronic component joining apparatus provided with a processing device that determines an appropriate target gap value based on the measured actual amount of conductive particles and controls the gap to approach the target gap. The fluid containing conductive particles is interposed between the substrate and the flat tool, and the fluid heated while being held in the gap between the electrode of the substrate and the tool flows. The molten conductive particles are self-assembled between the electrode and the tool, and then the tool is separated from the substrate and cooled below the solidification temperature of the conductive particle to form bumps on the electrode. On the occasion
Imaging the fluid supplied to the substrate and measuring the amount of conductive particles by image recognition; and
And a step of determining an appropriate target gap value based on the measured actual amount of conductive particles and controlling the gap so as to approach the target gap. In the step of imaging the fluid supplied to the substrate and measuring the amount of conductive particles by image recognition,
9. The bump forming method according to claim 8, wherein the conductive particles are identified and color extracted by image recognition, and then the number of pixels is counted and converted into an area. In the step of imaging the fluid supplied to the substrate and measuring the amount of conductive particles by image recognition,
Divided into regions for each electrode, or divided into a plurality of regions including the electrodes,
The bump forming method according to claim 8, wherein excess or deficiency of the supplied conductive particles is determined based on an amount of conductive particles for each region. To determine the excess or deficiency of the supplied conductive particles based on the amount of conductive particles for each region,
The bump forming method according to claim 10, wherein an excess or deficiency of the supplied conductive particles is determined based on an average value of the amount of conductive particles measured for each region. To determine the excess or deficiency of the supplied conductive particles based on the amount of conductive particles for each region,
The bump forming method according to claim 10, wherein an excess or deficiency of the supplied conductive particles is determined based on a maximum value and a minimum value of the amount of conductive particles measured for each region. In the step of imaging the fluid supplied to the substrate and measuring the amount of conductive particles by image recognition,
Divided into regions for each electrode, or divided into a plurality of regions including the electrodes,
The bump forming method according to claim 8, wherein an excess or deficiency of the supplied conductive particles is determined based on a predetermined amount of conductive particles in a specific region among the plurality of regions. The fluid containing conductive particles is interposed between the substrate and the flat tool, and the fluid heated while being held in the gap between the electrode of the substrate and the tool flows. The molten conductive particles are self-assembled between the electrode and the tool, and then the tool is separated from the substrate and cooled below the solidification temperature of the conductive particle to form bumps on the electrode. A bump forming device,
A camera that images the fluid supplied to the substrate and measures the amount of conductive particles by image recognition;
A bump forming apparatus provided with a processing device that determines an appropriate target gap value based on the measured actual amount of conductive particles and controls the gap to approach the target gap.

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