JP5105095B2 - Method for manufacturing chemical mechanical polishing pad and method for processing object to be polished - Google Patents

Abstract

Provided is a method for manufacturing a chemical mechanical polishing pad having a surface to be a polishing surface and a surface, i.e., the rear surface of the polishing surface, to be a non-polishing surface. The surface to be the non-polishing surface has a recessed section opened on the non-polishing surface, and the recessed section forms a bottomed pad profile. The pad profile is fixed on a surface plate of a cutting machine by suction, and a groove or a groove group (3) is formed by cutting the surface to be the polishing surface.

Description

  The present invention relates to a method for manufacturing a chemical mechanical polishing pad and a method for processing an object to be polished.

In the chemical mechanical polishing of a semiconductor wafer, the purpose of polishing is achieved, and the polishing end point at which the polishing is completed can be determined based on the empirically obtained time. However, there are various materials constituting the surface to be polished, and the polishing time varies depending on these materials. In addition, the material constituting the surface to be polished may change in the future. Further, the same applies to the aqueous dispersion and polishing apparatus used for polishing. For this reason, it is very inefficient to know the time to reach the polishing end point empirically from each of various different polishings.
In recent years, an optical end point detector and method using an optical method capable of directly observing the state of the surface to be polished have been developed and are becoming popular (Japanese Patent Laid-Open Nos. 9-7985 and 2000-326220). The optical end point detection method is a method of detecting the film thickness of the layer to be polished by spectral reflectance measurement to know the polishing end point. During chemical mechanical polishing, the surface to be polished is irradiated with, for example, laser light. In this technique, the film thickness is detected based on the reflectance. In order to perform chemical mechanical polishing by applying the optical end point detection method, it is necessary to provide a light path in a part of the chemical mechanical polishing pad to be used. There has been proposed a pad that secures a light-transmitting region by providing a through-hole and fitting a transparent plug into the hole (US Pat. No. 6,045,439).

However, the use of such a chemical mechanical polishing pad has two major problems.
One is a problem caused by the fact that the material of the translucent region is different from the material of the polishing substrate. That is, when the material constituting the light-transmitting region is harder than the material constituting the polishing substrate, the light-transmitting region protrudes from the surface of the polishing substrate with the continuous use of the polishing pad, and is on the surface to be polished. In some cases, scratch-like defects called scratches may occur. On the other hand, when the material constituting the light-transmitting region is softer than the material constituting the polishing substrate, the light is transmitted as the polishing pad continues to be used. The light-sensitive region sinks and polishing scraps are liable to stay, which also causes scratches on the surface to be polished.
Another problem is that more precise end point detection accuracy has been required in response to a demand for reducing the manufacturing cost of semiconductor wafers. In other words, the end point is detected quickly when the layer to be polished of the object to be polished is removed by polishing, which contributes to the saving of the polishing time and polishing aqueous dispersion and reduces the total production cost. It becomes. In order to satisfy this requirement, it is necessary to keep the translucency of the translucent region sufficiently high. However, even if the translucent region has sufficient translucency in the polishing pad immediately after manufacture, since the aqueous dispersion for polishing is used in the chemical mechanical polishing, this is the translucent region. The second problem is that the desired light-transmitting property is not exhibited because it penetrates between the surface and the surface to be polished and hinders the detection of the film thickness of the layer to be polished.
Among the above, in order to solve the problem of the former, examination of the material which comprises a translucent area | region, examination of the shape of a translucent area | region, etc. are made | formed, and the fixed result is achieved (Japanese Patent Laid-Open No. 2005-260688) 2004-327974, JP-A-2005-340795).

On the other hand, in order to solve the latter problem, it has been proposed not to form a groove over a relatively wide area including a translucent area of the polished surface. According to Japanese Patent Laid-Open No. 2006-239833, by not providing a groove in the light-transmitting region and the region surrounding the light-transmitting region, the polishing aqueous dispersion is prevented from flowing between the light-transmitting region and the surface to be polished. This is said to maintain the sensitivity of optical end point detection. This publication realizes that a groove is not formed in a certain region of the polished surface by a cutting method using a polishing surface plate subjected to special processing. However, such a cutting method lacks versatility and has a problem in practical use. Furthermore, the chemical mechanical polishing pad obtained by this method is described as achieving both optical end point detection sensitivity and polishing speed in the examples of the publication, but most of the polishing pads having a translucent region. The scratch on the polished surface that is a concern is not evaluated at all, and in this publication, such a problem seems to be left unsolved.
Furthermore, in recent years, there is a reality that optical end point detectors with low detection sensitivity are widespread. That is, at the beginning of the proposal of the optical end point detection method, only a relatively expensive device with high detection sensitivity was commercially available as a chemical mechanical polishing apparatus equipped with an optical end point detector. However, since around 2001, many inexpensive general-purpose machines with inferior detection sensitivity have become commercially available, and this type of device has become widespread. Therefore, coupled with the second problem of the optical end point detection device described above, there is a demand for a chemical mechanical pad having a translucent region that exhibits higher translucency than ever before.
A chemical mechanical polishing pad having a translucent region that can be used in a chemical mechanical polishing method to which the optical end point detection method is applied has not yet been known to solve the above two problems at the same time.

  Recently, as a new polishing end point detection method, a method using eddy current has been proposed. This method is effective when the surface to be polished is a metal. By utilizing the phenomenon that the eddy current depends on the resistance of the metal layer, the eddy current of the metal layer is induced by a magnetic field, and the eddy current This is a technique for measuring the generated magnetic flux to determine the resistance value of the metal layer and thereby knowing the thickness of the metal layer (eddy current monitoring system, see International Publication No. 2003/066284). The international pamphlet outlines a polishing end point detection method using eddy current, and the chemical mechanical polishing pad used in the method has a recess for inserting a part of a coil for inducing eddy current. It is shown that it should have. However, this international pamphlet does not describe any other aspects of the chemical mechanical polishing pad suitable for the polishing end point detection method using eddy current, the material, etc., and the relationship with the polishing performance.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to exhibit good end point detection sensitivity when used in an optical end point detector or a chemical mechanical polishing apparatus equipped with an eddy current monitoring system. An object of the present invention is to provide a method for manufacturing a chemical mechanical polishing pad in which surface defects such as scratches do not substantially occur on the polishing surface and a method for processing an object to be polished.

According to the present invention, the above object of the present invention is firstly
It has a surface that should be a polishing surface and a surface that should be a non-polishing surface that is the back surface of the surface, and has a cylindrical shape with both the surfaces that should be the polishing surface and the surfaces that should be the non-polishing surface as bottom surfaces. , the surface to become non-polished surface has a recess which is open to the surface, the recesses have a bottom surface, and bottom surface, the radial length parallel to that of the non-polishing surface become to face 10 It is 100 mm, tangential length parallel to that of the non-polishing surface and becomes to face to form a 10~50mm der Ru pad envelope,
That said pad envelope cutting machine with suction fixed to the surface plate, cutting in a state where the concave at least a portion of the area of the region corresponding to the concave portion of the surface to be polished surface Forming a groove or a groove group on a surface to be a polishing surface, but having an area in which no groove or groove group is formed in an area corresponding to the concave portion of the surface to be the polishing surface This is achieved by a method of manufacturing a chemical mechanical polishing pad. When the chemical mechanical polishing pad manufactured by the method is used by being mounted on a chemical mechanical polishing apparatus having an optical end point detector, at least the area of the bottom surface of the recess should be a polishing surface. A translucent region that optically communicates from the surface to the bottom surface of the recess is preferable.

Secondly, the object of the present invention is as follows.
Producing a chemical mechanical polishing pad by the above method;
A step of chemically and mechanically polishing an object to be polished using the chemical mechanical polishing pad;
A step of optically detecting the polishing end point or a step of detecting the polishing end point by a change in magnetic flux caused by an eddy current;
It is achieved by a method for processing an object to be polished.

The cross-sectional schematic which shows an example of the recessed part which the pad rough shape used for the method of this invention has. The cross-sectional schematic which shows an example of the recessed part which the pad rough shape used for the method of this invention has. The cross-sectional schematic which shows an example of the recessed part which the pad rough shape used for the method of this invention has. Schematic which shows the vicinity of the recessed part which an example of the chemical mechanical polishing pad manufactured by the method of this invention has. Schematic which shows the vicinity of the recessed part which an example of the chemical mechanical polishing pad manufactured by the method of this invention has. Schematic which shows the vicinity of the recessed part which an example of the chemical mechanical polishing pad manufactured by the method of this invention has.

The pad outline in the present invention becomes a chemical mechanical polishing pad by forming a groove or a group of grooves in the pad, and is a precursor of the pad.
The pad outline used in the method for producing a chemical mechanical polishing pad of the present invention has a surface to be a polishing surface and a surface to be a non-polishing surface which is the back surface thereof.
The shape of the pad envelope is Ru cylindrical der. The size of the pad envelope is not particularly limited. However, it is preferable to use a pad shape that is shaped and sized to fit the surface plate of the chemical mechanical polishing apparatus that is used by mounting the chemical mechanical polishing pad manufactured by the method of the present invention. The thickness of the approximate pad shape is preferably 0.5 to 5.0 mm, more preferably 1.5 to 3.0 mm, and further preferably 1.9 to 2.9 mm. One of the bottom surfaces of the cylindrical pad outline is a surface (upper surface) to be a polishing surface, and the bottom surface on the back surface side is a surface (lower surface) to be a non-polishing surface. Hereinafter, in this specification, the surface to be the polishing surface of the pad outline may be referred to as “upper surface”, and the surface to be the non-polishing surface may be referred to as “lower surface”.
The pad outline used in the method for producing a chemical mechanical polishing pad of the present invention has a recess opening on its lower surface, and the recess has a bottom surface. Due to the presence of such recesses, a specially configured groove or groove group of the polishing surface of the chemical mechanical polishing pad manufactured by the method of the present invention can be easily formed by a simple general-purpose cutting machine as will be described later. Thus, a chemical mechanical polishing pad can be obtained in which the stress generated between the polishing pad and the surface to be polished during chemical mechanical polishing is moderately relaxed to give a high-quality surface to be polished.

The planar shape of the bottom surface of the recess is not particularly limited, and may be, for example, a circle, an ellipse, a polygon, or the like. Examples of the polygon include a quadrangle, a hexagon, and an octagon. The size of the bottom surface of the recess, for example, when the pad envelope is cylindrical, is 1 0 to 100 mM by Satoshi length parallel to the radial direction of the lower surface of the pad envelope, the good Mashiku is 20 to 80 mm, is preferably further 30 to 60 mm, a 10 ～50Mm as the lower surface of the length parallel to the tangential direction of the pad envelope, good Mashiku is 10 ～30Mm, preferably a further 10 to 20 mm.
The bottom surface of the recess preferably has a surface roughness (Ra) of 10 μm or less, more preferably 8 μm or less, and even more preferably 7 μm or less. By setting the bottom surface of the recess to such a surface roughness, it is possible to further improve the detection accuracy when detecting the polishing end point by a change in magnetic flux generated optically or by eddy current during chemical mechanical polishing. This surface roughness (Ra) is expressed by the following formula (1)

Ra = Σ | Z−Z _av | / N (1)

(In the above formula, N is the number of measurement points, Z is the height of the roughness surface, and Z _av is the average height of the roughness surface.)
For example, using a three-dimensional surface structure analysis microscope (model “Zygo New View 5032”) manufactured by Canon Inc. It can be known as an average value obtained from the three average surface roughnesses.

The depth of the recess opening in the lower surface of the pad outline (the distance from the lower surface of the pad outline to the bottom surface of the recess) is preferably 0.1 to 2.0 mm, more preferably 0.4 to 1.8 mm. It is preferable that it is 0.6-1.4 mm. The distance from the top surface of the pad outline to the bottom surface of the recess is preferably 0.1 to 2.0 mm, more preferably 0.4 to 1.8 mm, and further 0.6 to 1.4 mm. It is preferable. Note that the distance from the top surface of the pad outline to the bottom surface of the recess corresponds to the thickness of the translucent region when the region of the bottom surface of the recess is a translucent region.
The chemical mechanical polishing pad produced by the method of the present invention will have grooves or groove groups on its polishing surface as described later. The depth of the concave portion is preferably the same as or deeper than the depth of this groove or groove group (the preferred range thereof will be described later). The depth of the recess is preferably 100 to 300% with respect to the depth of the groove or groove group to be formed on the polishing surface, more preferably more than 100% and within 300%, and further 110 It is preferable that it is -200%, and it is especially preferable that it is 120-150%.
The depth of the recess is in the above range, and the thickness of the approximate pad shape is in the above range, and the ratio of the depth of the recess to the thickness of the approximate pad shape is 10 to 90%. It is preferably 30 to 70%, more preferably 40 to 60%.

The opening of the recess opening in the lower surface of the pad outline used in the chemical mechanical polishing pad manufacturing method of the present invention can be the same size as the bottom surface of the recess or larger than the size of the bottom surface of the recess. Also good.
When the size of the opening of the recess to the lower surface of the pad outline is the same as the bottom of the recess, the shape is preferably the same as the bottom of the recess. In this case, the cross-sectional shape of the concave portion on the lower surface of the pad (referring to a cross-sectional shape obtained by cutting the concave portion in a direction perpendicular to the lower surface of the approximate pad shape; the same shall apply hereinafter) is preferably rectangular.
On the other hand, the shape of the opening when the size of the opening of the recess on the lower surface of the pad outline is larger than the bottom of the recess may be the same as or different from the shape of the bottom of the recess. It is only necessary that the opening of the recess surrounds the bottom surface of the recess when the shape is observed from the direction of the lower surface. In this case, it is preferable that the opening of the recess has the same shape as the bottom surface of the recess, and it is more preferable that these center points substantially coincide. The size of the opening when the size of the opening of the recess of the lower surface of the pad envelope is larger than the bottom surface of the recess, preferably a length in a direction parallel to the radial direction of the lower surface of the Pas head envelope Is 20 to 200 mm, more preferably 30 to 150 mm, and further preferably 50 to 100 mm. The length in the direction parallel to the tangential direction of the lower surface is preferably 5 to 100 mm, and more preferably 10 mm. It is ~ 80mm, and it is further preferable that it is 10-30mm.

When the size of the opening of the recess to the lower surface of the pad outline is larger than the bottom surface of the recess, the cross-sectional shape of the recess may be, for example, a trapezoidal shape, a two-stage shape with a smaller rectangle superimposed on a rectangle, It can be a multi-stage shape or the like in which small rectangles are sequentially stacked on top. Of these, the cross-sectional shape of the recess is preferably a two-stage shape. In this case, the depth from the lower surface of the pad outline to the first step is preferably 0.1 to 2.5 mm, It is more preferably 0.3 to 2.0 mm, and further preferably 0.8 to 1.4 mm. Further, the depth from the lower surface of the pad outline to the first step of the recess is preferably 5 to 60% of the depth of the recess (the distance from the lower surface to the bottom surface of the recess), more preferably 10 to 30. %.
There are countless cutting planes perpendicular to the lower surface of the pad outline when evaluating the cross-sectional shape, but either the surface parallel to the radial direction of the lower surface of the pad outline or the surface parallel to the tangential direction of the lower surface The cross-sectional shape on the surface is preferably the above shape, and the cross-sectional shape on both of these two surfaces is more preferably the above shape.

1 to 3 show preferred examples of the cross-sectional shape of the recesses of the pad outline. Each of these figures is a schematic cross-sectional view schematically showing the vicinity of the concave portion of the pad outline. 1-3, 0 is the pad outline, 10 is the top surface of the pad outline, 20 is the bottom surface of the pad outline, 30 is the bottom surface of the recess, and 40 is the bottom surface of the pad outline. It is the opening part of the recessed part to.
In the recess of FIG. 1, the size of the opening 40 of the recess in the lower surface of the pad outline is the same as the size of the bottom surface 30. The shape of the cross section of the recess is rectangular.
In the concave portion of FIG. 2, the size of the opening 40 of the concave portion on the lower surface of the pad outline is larger than that of the bottom surface 30, and the cross-sectional shape of the concave portion is trapezoidal.
In the recess of FIG. 3, the size of the opening 40 of the recess on the lower surface of the approximate pad shape is larger than that of the bottom surface 30, and the cross section of the recess has a two-stage shape in which a smaller rectangle is superimposed on the rectangle.

  When the chemical mechanical polishing pad produced by the method of the present invention is used by being mounted on a chemical mechanical polishing apparatus equipped with an optical end point detector, at least a recess opening on the lower surface of the general pad shape is provided. The bottom region is preferably a translucent region that optically communicates from the polished surface to the bottom surface of the recess. Here, the “region of the bottom surface of the recess” is a three-dimensional concept that penetrates the pad outline in the thickness direction, and refers to a portion obtained by virtually cutting the pad outline in the thickness direction in the shape of the bottom surface of the recess. . Further, “optically communicated” means that light having any wavelength between 100 and 3,000 nm passes in the region, preferably any wavelength between 100 and 3,000 nm. It means that the transmittance at a wavelength or the accumulated transmittance in an arbitrary wavelength region between 100 and 3,000 nm is 10% or more. This transmittance or integrated transmittance is more preferably 15% or more, and further preferably 20% or more. In the polishing pad used for polishing using the optical end point detection device, it is particularly preferable that the transmittance at 400 to 800 nm, which is a high frequency of use as the end point detection light, is high, and any wavelength between 400 and 800 nm is used. It is preferable that the transmittance at a certain wavelength or the accumulated transmittance in an arbitrary wavelength region between 400 and 800 nm satisfy the above requirements. This transmittance is a value when the transmittance at each wavelength is measured using an appropriate device such as an ultraviolet-visible absorptiometer capable of measuring the absorbance at a predetermined wavelength. The integrated transmittance can be obtained by integrating the transmittance in a predetermined wavelength range measured in the same manner.

The translucent region is made of a translucent material. Here, “having translucency” means that when the thickness of the material is 2 mm, the transmittance at the above wavelength or the integrated transmittance at the above wavelength region is preferably 5% or more, more preferably 10%. More preferably, it means 15% or more.
The translucent region constitutes a part of the upper surface (surface to be a polishing surface) on the upper surface side of the pad outline.
When the chemical mechanical polishing pad manufactured by the method of the present invention is used by being attached to a chemical mechanical polishing apparatus equipped with an optical end point detector, the pad outline is such that at least the above-mentioned translucent region is the above In this sense, the entire outline of the pad is made of the same material having translucency, and the area of the recess that opens in the lower surface of the outline of the pad is thinned. It may be a rough pad shape (hereinafter also referred to as “first pad rough shape”) that is a light-transmitting region, or at least a light-transmitting region of the pad rough shape has a light-transmitting property. The pad is generally composed of a translucent member having other parts (hereinafter also referred to as “polishing substrate”) made of a material different from that of the translucent member, and the two are fused together. (Hereafter referred to as "second pad outline" That.) May be. The first pad outline is a surface on which a surface having no recesses should be a polishing surface. The second pad outline is a surface on which the translucent member and the polishing base form a common surface having no recess, and the common surface is a surface to be polished. “Fusion” in the second pad outline means a state in which at least a joining surface of both or one of the translucent member and the polishing substrate is melted or dissolved without using an adhesive. At the time of production, not only the joining surface but also the whole light-transmitting member may be melted or melted and joined, or the entire polishing substrate may be melted or melted and joined.

A specific fusion method is not particularly limited. For example,
(A) Insert molding method in which one of the translucent member or the polishing substrate is held in a mold, and the raw material composition of the other member is charged and fused in the remaining space of the mold (B) The translucent member and polishing A method of forming a base body into a predetermined shape and fitting them together, and then fusing and joining the contact surfaces by infrared welding, high frequency welding, microwave welding, ultrasonic welding, etc. (C) a translucent member and For example, a method of bonding the surfaces of the polishing substrates to be bonded using a solvent may be used. Since the translucent member and the polishing substrate are fused, the polishing pad obtained from the pad outline is composed of the translucent member and the polishing substrate. There is no gap between them, so that the aqueous dispersion does not leak to the back side of the polishing pad during polishing.
As an aspect of fusion bonding in the second pad outline, it is preferable that the material constituting the polishing base and the material constituting the translucent member are in a chemically crosslinked state. By fusing both of them in a chemically cross-linked state, the strength of the fused part is remarkably improved, and the chemical mechanical polishing aqueous dispersion caused by peeling of the fused part in the chemical mechanical polishing process is covered by Surface defects on the polished surface can be prevented. As for the strength of the fused part, a test piece cut into the shape of No. 3 dumbbell so that the fused part is located at the approximate center of the stretched part is subjected to a tensile test at a tensile speed of 500 mm / min in accordance with JIS K6251. When performed, it is preferable that the test piece does not break or is broken at a site other than the fused portion.
From the viewpoint of fusing as described above, the fusing method is preferably the method (A).

On the other hand, when the chemical mechanical polishing pad manufactured by the method of the present invention is used by being attached to a chemical mechanical polishing apparatus equipped with an eddy current monitoring system, the bottom surface of the recess opening in the non-polishing surface is used. The region may have a light-transmitting property or may not have a light-transmitting property. In this case, it is preferable that the thickness of the area | region of the bottom face of a recessed part is 0.5-1.5 mm.
When the chemical mechanical polishing pad produced by the method of the present invention is used by being attached to a chemical mechanical polishing apparatus equipped with an eddy current monitoring system, the pad outline used in the method of the present invention is as follows: The first pad outline or the second pad outline described above, or the entire pad outline is made of the same material having no translucency (hereinafter, “ It may be referred to as “third pad outline”).

Examples of the first pad outline include the following pad outlines.
(1) The pad outline is composed of a light-transmitting material as a whole, and the opening of the recess in the lower surface of the pad outline is the same size as the bottom of the recess. (2) The pad outline The overall shape of the pad is made of a light-transmitting material, and the opening shape of the recess to the lower surface of the approximate pad shape is larger than the bottom surface of the recessed portion. For example, the following pad outline can be cited as the relationship between the light transmitting member and the light transmitting member.
(3) A pad rough shape in which the opening of the concave portion on the lower surface of the rough pad shape is the same size as the bottom surface of the concave portion, and the translucent member is the same size or larger than the opening portion of the concave portion (4) The pad outline shape where the opening of the recess to the lower surface of the pad outline is larger than the bottom surface of the recess and the translucent member is the same size or larger than the opening of the recess. The opening of the recess on the lower surface of the pad outline is larger than the bottom surface of the recess, and the translucent member is the same size as or larger than the bottom surface of the recess and smaller than the opening of the recess. Pad Outline As an example of the third pad outline, for example, the following pad outline can be cited.
(6) The pad outline is formed of a material having no translucency, and the opening of the recess to the lower surface of the pad outline is the same size as the bottom of the recess. (7) The pad outline is formed of a material that does not have translucency, and the opening of the recess in the lower surface of the pad outline is larger than the bottom surface of the recess.

  The concave portion of the pad outline used in the method of the present invention preferably has an opening to the lower surface of the pad outline larger than the bottom surface of the depression. In this case, the area of the bottom surface of the recess is preferably 20 to 90%, more preferably 40 to 70% of the area of the opening of the recess on the lower surface of the pad outline.

The number of recesses opened in the lower surface of the pad outline used in the method of the present invention is not particularly limited, and may be one or two or more. Further, although the arrangement is not particularly limited, the bottom surface of the recess is formed in a portion through which light or eddy current for end point detection of a chemical mechanical polishing apparatus used with the chemical mechanical polishing pad manufactured by the method of the present invention passes. Should be positioned so that
The ratio of the area of the recess to the total area of the lower surface of the pad outline is preferably 10% or less, more preferably 0.0005 to 5.0%, and still more preferably 0.001 to 2.0%. It is particularly preferably 0.005 to 1.5%, and particularly preferably 0.01 to 1.0%. By setting the ratio of the area of the recesses within this range, both reliable end point detection and high polishing performance can be achieved. Here, the area of the recess means the total area of the bottom surface of the recess even when the size of the opening of the recess on the lower surface of the pad outline is larger than the size of the bottom surface of the recess.
In addition, since the recessed part opened to the lower surface of a pad general shape turns into a recessed part opened to the non-polishing surface of a pad after manufacturing a chemical mechanical polishing pad by the method of the present invention, The size is maintained as the shape and size of the recessed portion of the pad after manufacture.

As described above, the pad outline used in the method of the present invention is preferably a pad outline (first pad outline), which is preferably made of the same material having translucency as a whole. A pad outline (second pad outline) consisting of a translucent member having translucency and a polishing substrate made of a different material, or the entire polishing pad being translucent This is a pad general shape (third pad general shape) that is made of the same material that does not have any.
The material constituting the first pad outline and the material constituting the second pad outline translucent member (hereinafter collectively referred to as “translucent material”) include a water-insoluble matrix material. And water-soluble particles added as necessary. When adding water-soluble particles, the water-soluble particles are preferably dispersed in a water-insoluble matrix material.
As the water-insoluble matrix material (hereinafter also simply referred to as “matrix material”), a light-transmitting organic material such as a thermoplastic resin, a thermosetting resin, an elastomer, or a rubber is used alone or in combination. It is preferable. If this matrix material has translucency, it does not need to be transparent or translucent per se, but it is preferably higher in translucency and more preferably transparent.

Examples of the light-transmitting thermoplastic resin include 1,2-polybutadiene resin, polyolefin resin (for example, polyethylene), polystyrene resin, polyacrylic resin (for example, (meth) acrylate resin), vinyl ester resin (however, polyacrylic). Resin), polyester resin, polyamide resin, fluororesin (for example, polyvinylidene fluoride), polycarbonate resin, polyacetal resin and the like.
Examples of the elastomer include a diene elastomer (for example, 1,2-polybutadiene), a polyolefin elastomer (TPO), a styrene-based elastomer (for example, a styrene-butadiene-styrene block copolymer (SBS), and a hydrogenated block copolymer (SEBS). And the like), thermoplastic elastomers (for example, thermoplastic polyurethane elastomer (TPU), thermoplastic polyester elastomer (TPEE), polyamide elastomer (TPAE), etc.), silicone resin elastomers, fluororesin elastomers, and the like.
Examples of the rubber include butadiene rubber (for example, high cis butadiene rubber, low cis butadiene rubber), other conjugated diene rubber (for example, isoprene rubber, styrene-butadiene rubber, styrene-isoprene rubber), and nitrile rubber (for example, acrylonitrile-). Butadiene rubber etc.), acrylic rubber, ethylene-α-olefin rubber (eg ethylene-propylene rubber, ethylene-propylene-diene rubber etc.), butyl rubber and other rubbers (eg silicone rubber, fluorine rubber etc.).
These organic materials may be modified with an acid anhydride group, a carboxyl group, a hydroxyl group, an epoxy group, an amino group, or the like. Moreover, it is preferable that these organic materials are cross-linked polymers in which a part or all of them are cross-linked.

The water-soluble particles can be organic water-soluble particles or inorganic water-soluble particles. Examples of organic water-soluble particles include sugars, polysaccharides (eg, starch, dextrin, cyclodextrin, etc.), lactose, mannitol, celluloses (eg, hydroxypropylcellulose, methylcellulose, etc.), proteins, polyvinyl alcohol, polyvinylpyrrolidone. , Polyacrylic acid, polyethylene oxide, water-soluble photosensitive resin, sulfonated polyisoprene, sulfonated isoprene copolymer, and the like. Examples of the material for the inorganic water-soluble particles include potassium acetate, potassium nitrate, potassium carbonate, potassium hydrogen carbonate, potassium chloride, potassium bromide, potassium phosphate, and magnesium nitrate. These water-soluble particles can be provided with an outer shell that suppresses moisture absorption in at least a part of the outer shell. Examples of the material forming the outer shell include epoxy resin, polyimide, polyamide, polysilicate, and the like.
The average particle diameter of the water-soluble particles is preferably 0.1 to 500 μm, more preferably 0.5 to 100 μm. The water-soluble particles are preferably solid bodies having no cavities inside.
As content of the water-soluble particle | grains in a translucent material, it is preferable that it is 20 volume% or less with respect to the total volume of a water-insoluble matrix material and a water-soluble particle, and it is more preferable that it is 1-10 volume%. Preferably, it is further 2 to 5 volume%.

The “material different from the translucent member” in the polishing base of the second pad outline or the “non-translucent material” in the third pad outline is contained in the material constituting the translucent member. In addition to a material composed of a component different from the component to be formed, a material having the same constituent component but a different content ratio, a material having a different degree of crosslinking, a different degree of crystallinity, or the like may be used. The presence or absence of the translucency of the “material different from the translucent material” in the second pad outline does not matter.
As the “material different from the translucent member” in the polishing substrate of the second pad outline, or the “non-translucent material” in the outline of the third pad, water-soluble particles and the water-soluble particles are dispersed. Preferably, it is made of a material or a cavity made of a water-insoluble matrix and a material made of a water-insoluble matrix material in which the cavity is dispersed (for example, a foam or the like).
As the material constituting the water-insoluble matrix material in the former material, in addition to those exemplified as being usable for the water-insoluble matrix material of the translucent material, cured resins such as urethane resin, epoxy resin, unsaturated polyester resin, A polyurethane-urea resin, a urea resin, a silicon resin, a phenol resin, etc. can be mentioned. These organic materials are preferably cross-linked polymers partially or wholly crosslinked, and may be modified with an acid anhydride group, carboxyl group, hydroxyl group, epoxy group, amino group, or the like. Good. As the water-soluble particles in the former material, the same water-soluble particles as exemplified as the water-soluble particles that can be optionally used for the translucent material can be used. In this case, the content of the water-soluble particles is preferably 1 to 50% by volume, more preferably 2 to 30% by volume based on the total volume of the water-insoluble matrix material and the water-soluble particles. .

On the other hand, examples of the latter material, that is, a water-insoluble matrix material in which cavities are dispersed, include polyurethane, melamine resin, polyester, polysulfone, polyvinyl acetate foams, and the like.
The size of the cavities dispersed in such a water-insoluble matrix material is an average value, preferably 0.1 to 500 μm, more preferably 0.5 to 100 μm.
When the pad outline is the second pad outline, the material constituting the polishing substrate is preferably a material comprising water-soluble particles and a water-insoluble matrix in which the water-soluble particles are dispersed. More preferably, the water-soluble matrix material of the translucent member and the water-insoluble matrix material of the translucent member contain materials belonging to the same type. It differs only in the content ratio, and it is preferable that the chemical species and content ratios of the remaining components are the same. Here, the “type” of the matrix material refers to a thermoplastic resin, a thermosetting resin, an elastomer, or a rubber in the organic material of the matrix material.

The first or third pad outline can be formed using, for example, a mold having a cavity provided with a protrusion that engages with the shape of the recess of the desired pad outline.
The pad outline for manufacturing the second polishing pad is preferably formed by using one of the following methods using a mold similar to the above.
(1) A method in which a translucent member molded in advance is set in a mold, and a raw material composition for constituting a polishing substrate is charged in the remaining space in the mold and molded.
(2) A raw material composition for forming a translucent member in a hole of the polishing base by previously molding a polishing base having a hole for inserting a translucent member, setting the polishing base in a mold, and The method of charging and forming.
In forming the first to third pad outlines, a metal block having a shape corresponding to the convex portion may be used instead of providing the convex portion in the cavity of the mold. Moreover, you may form a recessed part by giving a cutting process to the molded object formed using what does not have the above convex parts as a metal mold | die. Furthermore, you may form a recessed part by combining utilization of the metal mold | die which has a convex part, and cutting. In the case of the second pad outline shape, it is preferable to set the convex portion of the mold or the position of cutting so that the concave portion is formed at the position of the translucent member.

The pad shape as described above can be made into a chemical mechanical polishing pad by suction-fixing on a surface plate of a cutting machine and forming grooves or groove groups on the surface to be the polishing surface by cutting. .
The pad outline is first sucked and fixed onto the surface plate of the cutting machine with the lower surface having the concave portion down. The suction force is preferably 5 to 30 kPa, more preferably 10 to 25 kPa, as the pressure after suction.
Next, a chemical mechanical polishing pad can be obtained by forming grooves or groove groups on the upper surface (surface to be a polishing surface) of the rough pad shape by cutting.
As the groove, for example, one spiral groove that gradually expands from the center part of the polishing surface of the polishing pad toward the peripheral part can be exemplified.
The groove group includes a plurality of spiral grooves, a plurality of concentric groove groups, a plurality of radial grooves, and a groove group that gradually expands from the center to the periphery of the polishing surface of the polishing pad. And a combination of at least one of them and a groove group consisting of one spiral groove that gradually expands from the center to the periphery of the polishing surface. The groove group is preferably a groove group composed of a plurality of concentric circles or a groove group composed of a plurality of concentric circles and a plurality of radial grooves.

When the groove is a single spiral groove, the number of turns is preferably 200 to 400 times. When the groove group is a plurality of concentric circular grooves, the number of grooves is preferably 200 to 400. When the groove group is a plurality of spiral grooves, the number of grooves is preferably 2 to 10. Furthermore, the number of grooves when the groove group is a plurality of radial grooves is preferably 4 to 64.
The width of the groove is preferably 0.1 mm or more, more preferably 0.1 to 5.0 mm, and still more preferably 0.1 to 2.0 mm. The depth of the groove is preferably 0.1 to 2.0 mm, more preferably 0.4 to 1.5 mm, and further preferably 0.8 to 1.4 mm. When the groove or groove group is a spiral groove or a concentric circular groove, the groove pitch (the distance between two adjacent intersections among intersections where the groove intersects with a virtual straight line extending from the center of the polishing surface to the outer periphery) is preferably It is 1.0-30 mm, More preferably, it is 1.2-20 mm, More preferably, it is 1.5-5.0 mm.

  The groove or groove group preferably has an inner surface roughness of 20 μm or less, more preferably 0.05 to 15 μm, and even more preferably 0.05 to 10 μm. The chemical mechanical polishing pad manufactured by the method of the present invention does not have a groove on a part of the polishing surface as described below by setting the inner surface roughness to a groove or groove group having the above range. In spite of this, both the distribution of the chemical mechanical polishing aqueous dispersion supplied during chemical mechanical polishing and the removal of the polishing waste liquid become more efficient, and the effect of suppressing the generation of scratches on the surface to be polished and the high degree of in-plane uniformity. Sex will be obtained more reliably. This surface roughness is defined by the above formula (1) in the same manner as the surface roughness of the bottom surface of the recess described above. For example, a three-dimensional surface structure analysis microscope (model “Zygo New View 5032”) manufactured by Canon Inc. It can be known as an average value obtained from three average surface roughnesses obtained by measuring the average surface roughness of each of the three different visual fields for the inner surface of the groove of the polishing pad before use.

  Since the pad outline has a recess that opens on its lower surface (surface to be non-polishing surface), the upper surface (surface to be polishing surface) is fixed by suction on the surface plate of the cutting machine. A part will bend in the lower surface direction and will sink from the surface which should become a polishing surface. In other words, the upper surface of the pad outline is fixed in a state where at least a part of the region corresponding to the concave portion of the lower surface is recessed, so that the cutting blade does not contact the recessed region during the cutting process, As a result, an area where no groove is formed is formed in an area corresponding to the concave portion on the lower surface of the upper surface. In particular, in the most preferable embodiment of the method for producing a chemical mechanical polishing pad of the present invention, the depth of the concave portion on the lower surface of the pad rough shape is larger than the depth of the groove or groove group. When forming the groove or groove group by suction and fixing on the surface plate, the above effect can be obtained more reliably.

  As described above, the chemical mechanical polishing pad manufactured by the method of the present invention has an area in which no groove is formed in a region corresponding to the recess opened in the lower surface of the polishing surface. The shape of the area where no groove is formed may be, for example, a circle, an ellipse, a polygon, or the like. Examples of the polygon include a quadrangle, a hexagon, and an octagon. As the size of the area where the groove is not formed, for example, when the pad is cylindrical, the length in the direction parallel to the radial direction of the polishing surface is preferably 10 to 100 mm, more preferably 20 to 80 mm, and further 30 The length in the direction parallel to the tangential direction of the polishing surface is preferably 2 to 50 mm, more preferably 5 to 30 mm, and further preferably 10 to 20 mm.

The shape and size of the area where the groove is not formed can be designed by appropriately selecting the shape and size of the recess opening in the lower surface of the approximate pad shape. Hereinafter, the relationship between the recess and the area where no groove is formed will be described in detail with reference to the drawings. 4-6 show a partially enlarged view of a plan view of a polishing surface of a chemical mechanical polishing pad manufactured by the method of the present invention and a cut end view thereof. 4 to 6, (a) is a plan view (partially enlarged view), and (b) is an AA cut end view. FIGS. 4-6 are all examples of chemical mechanical polishing pads made from the second pad outline, but the first or third pad outline should be understood as well.
As shown in FIG. 4A, a rectangular translucent member 2 having four rounded corners is fused to the polishing substrate 1. A concentric groove group 3 is formed in the polishing substrate 1 and the translucent member 2, but the translucent member has an area 4 in which no groove is formed. The area 4 in FIG. 4A has a substantially elliptical shape and is included in the translucent member 2. As shown in FIG. 4B, the lower surface of the translucent member 2 does not reach the lower surface of the polishing substrate 1. A portion below the lower surface of the translucent member 2 becomes a cavity, and when observed from the lower surface side of the polishing substrate 1, a concave portion exists in that portion, and the lower surface of the translucent member 2 constitutes the bottom surface of the concave portion. The opening to the lower surface of the concave portion of the polishing substrate 1 shown in FIG. 4B is the same size as the bottom surface of the concave portion, and the sectional shape of the concave portion is rectangular. The distance from the lower surface of the polishing substrate 1 to the lower surface of the translucent member 2 (the bottom surface of the recess) (that is, the depth of the recess) is greater than the depth of the grooves formed on the upper surfaces of the polishing substrate 1 and the translucent member 2. It ’s a big one. Further, it can be seen from FIG. 4B that there is an area 4 where no groove is formed.

As shown in FIG. 5A, an elliptical translucent member 2 is fused to the polishing substrate 1. A concentric groove group 3 is formed in the polishing substrate 1 and the translucent member 2, and the translucent member has a region 4 in which no groove is formed. An area 4 in FIG. 5A has a substantially elliptical shape and is included in the translucent member 2. The cross-sectional shape shown in FIG. 5B is almost the same as that in FIG.
6A, the elliptical translucent member 2 is fused to the polishing base 1. FIG. A concentric groove group 3 is formed in the polishing base 1 and the translucent member 2. FIG. 6A also shows the existence of an elliptical area 4 in which no groove is formed. In FIG. 6A, the area 4 is included in the minor axis of the translucent member 2 in the minor axis, but in the major axis, it extends beyond the major axis of the translucent member 2 to a part of the polishing substrate 1. Has reached. In FIG. 6B, the lower surface of the translucent member 2 does not reach the lower surface of the polishing base 1, and the lower portion of the translucent member 2 is a recess, and the lower surface of the translucent member 2 is The point forming the bottom surface of the recess and the distance (depth of the recess) from the lower surface of the polishing substrate 1 to the lower surface of the translucent member 2 are the grooves formed on the upper surfaces of the polishing substrate 1 and the translucent member 2. It is the same as FIG. 4B and FIG. 5B in that it is larger than the depth. However, the cross-sectional shape of the concave portion of the polishing base 1 in FIG. 6B is the same size as the bottom surface of the concave portion from the lower surface of the translucent member 2 (that is, the bottom surface of the concave portion) to the intermediate point 5. The size is enlarged at the point 5 and reaches the lower surface of the polishing substrate while maintaining the enlarged size. That is, it can be seen that the recesses in FIG. 6 have an opening on the lower surface of the polishing substrate 1 larger than the bottom surface of the recess, and the cross-sectional shape is a two-stage shape in which a smaller rectangle is superimposed on a rectangle.

  In the chemical mechanical polishing pad manufactured by the method of the present invention, the area where the groove is not formed on the polishing surface exceeds the area corresponding to the bottom surface of the recess opening on the lower surface (non-polishing surface) of the pad. However, it is desirable that the portion other than the region corresponding to the bottom surface of the recess (except for the central portion of the polishing surface) does not have an area where no groove is formed. . Moreover, it is preferable that the groove | channel is formed in at least one part of the area | region corresponding to the bottom face of a recessed part, Preferably the outer peripheral part. Here, it is possible to achieve both higher end point detection sensitivity and extremely good polishing performance by keeping the area where no groove is formed in a part of the region corresponding to the bottom surface of the recess. Of the region corresponding to the bottom surface of the recess of the polishing surface of the chemical mechanical polishing pad manufactured by the method of the present invention, the area of the area where no groove is formed is 20 to 90% of the area of the bottom surface of the recess. Is preferable, and it is more preferable that it is 40 to 70%.

The method for processing an object to be polished according to the present invention includes:
Producing a chemical mechanical polishing pad by the method as described above;
A step of chemically and mechanically polishing an object to be polished using the chemical mechanical polishing pad;
A step of optically detecting the polishing end point or a step of detecting the polishing end point by a change in magnetic flux caused by an eddy current;
It is characterized by including.
The step of chemically and mechanically polishing the object to be polished is carried out using a chemical mechanical polishing pad produced by the method of the present invention, preferably using an appropriate chemical mechanical polishing aqueous dispersion. The method for processing an object to be polished according to the present invention provides a high-quality surface to be polished with suppressed surface defects such as scratches and high in-plane uniformity. The polishing pad can be used in a chemical mechanical polishing process by being mounted on a chemical mechanical polishing apparatus equipped with an eddy current monitoring system, and the polishing end point can be detected with high sensitivity by a change in magnetic flux caused by the eddy current. . In addition, when the polishing pad has a light-transmitting region, it can be used in a chemical mechanical polishing process by being attached to a chemical mechanical polishing apparatus equipped with an optical end point detector. Therefore, it can be detected with high sensitivity. Further, when the polishing pad has a light-transmitting region, the polishing pad is attached to a chemical mechanical polishing apparatus equipped with both an optical end point detector and an eddy current monitoring system and used for the chemical mechanical polishing process. It is possible to detect the polishing end point more precisely by superimposing measurement.
Among the above, high light transmittance and good polishing performance have been conventionally considered to have a trade-off relationship.

The method for producing a chemical mechanical polishing pad of the present invention is an industrially extremely advantageous method by which the high performance polishing pad as described above can be produced by a simple method using a general-purpose cutting machine.
The method for processing an object to be polished according to the present invention can detect a polishing end point with high sensitivity by an optical end point detector and an eddy current monitoring system, and can save polishing time and an aqueous dispersion for polishing. This is an industrially very advantageous method.

Example 1
I. Manufacture of chemical mechanical polishing pad (1) Manufacture of polishing substrate 1,2-polybutadiene (manufactured by JSR Corporation, product name “JSR RB830”) 66.5% by volume, polystyrene (manufactured by PS Japan Co., Ltd., product name “HF-”) 55 ”) 28.5% by volume and β-cyclodextrin (product name“ Dexy Pearl β-100 ”, manufactured by Yokohama International Bio-Laboratory Co., Ltd.) as a water-soluble substance, and kneaded in a router heated to 160 ° C. did. Thereafter, Park Mill D-40 (trade name, manufactured by Nippon Oil & Fats Co., Ltd., containing 40% by weight of dicumyl peroxide) was added in an amount of 0.4 with respect to 100 parts by weight of the total amount of 1,2-polybutadiene and polystyrene. A raw material composition for a polishing substrate was prepared by adding parts by weight (corresponding to 0.16 parts by weight in terms of pure dicumyl peroxide) and further kneading. This raw material composition was subjected to a crosslinking reaction in a press die at 160 ° C. for 7 minutes to obtain a molded body having a diameter of 790 mm and a thickness of 3.2 mm. Next, using an end mill manufactured by Kato Machine Co., Ltd., a rectangular penetration having a length of 80 mm in the direction parallel to the radial direction and a length of 30 mm in the direction parallel to the tangential direction is centered at 105 mm from the center of the molded body. A hole was formed to produce a polishing substrate having a hole.
(2) Preparation of raw material composition of translucent member 1,2-polybutadiene “JSR RB830” 98% by volume and β-cyclodextrin “Dexypearl β-100” 2% by volume as a water-soluble substance were heated to 160 ° C. It knead | mixed with the ruder. Thereafter, “Park Mill D-40” was added 0.7 parts by weight (corresponding to 0.28 parts by weight in terms of pure dicumyl peroxide) with respect to 100 parts by weight of 1,2-polybutadiene, and further kneaded. By doing this, the raw material composition of the translucent member was obtained.

(3) Manufacture of pad outline The polishing substrate manufactured in (1) above is set again in the press die, and is 50 mm long, 15 mm wide and 1 mm thick at the center of the hole of the polishing substrate on the lower die. A metal block of 0.5 mm is placed with its length direction parallel to the radial direction of the polishing substrate, and the remaining space of the hole is filled with the raw material composition of the translucent member prepared in (2) above. By carrying out a crosslinking reaction at 10 ° C. for 10 minutes, a molded body having a cylindrical shape with a diameter of 790 mm and a thickness of 3.2 mm, having a translucent member fused thereto, and having a recess on the lower surface thereof was obtained.
This molded body is set in an insertion port of a wide belt sander device (manufactured by Meinan Seisakusho Co., Ltd.), and while rotating the roller at 500 rpm, the particle size meshes # 120, # 150 and # 150 are applied to the upper and lower surfaces of the molded body. 220 sandpapers (manufactured by Kovacs Co., Ltd.) were sequentially used and moved at a speed of 0.1 m / s and ground by 0.1 mm for each standard. Each 0.3 mm). Next, only the upper surface (the surface to be polished) was further ground by 0.1 mm using a # 320 sandpaper.
By the above operation, a pad outline having a diameter of 790 mm and a thickness of 2.5 mm and having a rectangular recess (its cross-sectional shape is rectangular) on its lower surface was manufactured.

(4) Manufacture of chemical mechanical polishing pad The pad outline manufactured above was suction-fixed on a surface plate of a cutting machine manufactured by Kato Machine Co., Ltd. with a lower surface having a recess facing downward at a suction pressure of 30 kPa. By sucking, the pad outline was fixed on the surface plate with a part of the translucent member recessed. In this state, a concentric groove group having a width of 0.5 mm and a depth of 1 mm is formed at a pitch of 2 mm at a radius of 10 mm or more from the center, and then the outer peripheral portion is cut so as to be a cylindrical shape having a diameter of 508 mm, A chemical mechanical polishing pad having a diameter of 508 mm and a thickness of 2.5 mm was produced. Of the polishing surface side of the translucent member of the polishing pad, the major axis is 40 mm parallel to the radial direction and the minor axis is 10 mm parallel to the tangential direction with the center of the translucent member as the center. No groove was formed in this area.
About the chemical mechanical polishing pad manufactured above, the surface roughness inside the groove of the light-transmitting member and the polishing surface was measured using a three-dimensional surface structure analysis microscope “Zygo New View 5032” manufactured by Canon Inc. However, it was 1.1 μm per lower surface of the translucent member and 3.1 μm per groove inside the polished surface. Moreover, when the transmittance | permeability in wavelength 650nm was measured about the area | region in which the groove | channel is not formed among translucent members using UV absorption meter (Corporation | KK Hitachi, Ltd. make, model "U-2010"), it was 5 times. The average transmittance was 12%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer A 3M double-sided tape “# 422” is laminated on the back of the chemical mechanical polishing pad manufactured above, and an optical polishing end point detector is provided. A chemical mechanical polishing apparatus (Applied Materials Co., Ltd., model name “Mirra Mesa”) is attached to a wafer with an 8-inch pattern (product name “SEMATECH-854”), and chemical mechanical polishing is performed under the following conditions. went.

Plate rotation speed: 120 rpm
Polishing head rotation speed: 36 rpm
Polishing pressure: 3 psi
Abrasive machine polishing aqueous dispersion: CMS7401 and CMS7452 (both trade names, manufactured by JSR Corporation) and water mixed at 1: 1: 2 (weight ratio).
Chemical mechanical polishing aqueous dispersion supply rate: 200 mL / min

In the above polishing, the end point could be detected without any problem. Further, the number of scratches measured on the polished surface using a surface defect inspection apparatus “Surf Scan SP1” manufactured by KLA-Tencor Corporation was 0 per wafer.
Subsequently, the same chemical mechanical polishing was carried out on 19 SEMATECH-854 (total polishing number of 20 sheets), but the end point could be detected without any problem in any polishing, and the surface to be polished was No scratch was observed.

(2) Polishing test of unpatterned copper film wafer Using a chemical mechanical polishing pad produced in the same manner as in “I. Production of chemical mechanical polishing pad” above, a wafer with an unpatterned copper film having a diameter of 8 inches was polished. As a body, chemical mechanical polishing was performed in the same manner as in “(1) Polishing test of patterned wafer” except that the polishing time was 1 minute.
For the object to be polished, the thickness of the copper film before and after polishing was measured at 33 points that were uniformly taken in the diametrical direction except for a range of 5 mm from both ends. The internal uniformity was calculated.

Polishing amount = thickness of copper film before polishing-thickness of copper film after polishing Polishing rate = average value of film thickness / polishing time In-plane uniformity (%) = (standard deviation of polishing amount ÷ polishing amount (Average value) x 100

As a result, the polishing rate was 1,200 Å / min, and the in-plane uniformity was 1.15%. When the in-plane uniformity value is 5% or less, it can be said that the in-plane uniformity is good.

(3) Evaluation of fusion bond strength A raw material composition for a polishing substrate prepared in the same manner as described above was subjected to a crosslinking reaction in a press die at 160 ° C. for 7 minutes (first crosslinking reaction), a length of 180 mm, a width A sheet-like molded body having a thickness of 180 mm and a thickness of 3 mm was obtained. One of the molded bodies cut in half in the width direction is put back into the same mold, and the remaining space of the mold is filled with the raw material composition of the translucent member prepared in the same manner as described above, 180 ° C. The second half of the width direction is the same material as the polishing substrate, the other half is the same material as the translucent member, and the length is 180 mm. A sheet-like molded body having a width of 180 mm and a thickness of 3 mm was obtained. The same operation was repeated to produce two similar sheet-like molded bodies.
Next, a total of 10 test pieces, each of which was punched into the shape of a No. 3 dumbbell so that the fused portion was positioned approximately at the center of the stretched portion, were produced from each of the sheet-like molded products. did.
Each of these test pieces was subjected to a tensile test at a tensile speed of 500 mm / min in accordance with JIS K6251. As a result, all ten test pieces were broken at the material portion of the polishing substrate and were broken at the fused portion. There was no piece.

Example 2
I. Manufacture of chemical mechanical polishing pad (1) Manufacture of polishing substrate 1,2-polybutadiene (manufactured by JSR Corporation, product name “JSR RB830”) 80% by volume and β-cyclodextrin (manufactured by Yokohama International Bio-Laboratory Co., Ltd.) 20 volume% of the product name “Dexy Pearl β-100”) was kneaded with a router heated to 160 ° C. Thereafter, 0.7 parts by weight (pure dicumyl) of Parkmill D-40 (trade name, manufactured by NOF Corporation, containing 40% by weight of dicumyl peroxide) with respect to 100 parts by weight of 1,2-polybutadiene. It corresponds to 0.28 parts by weight in terms of peroxide.) Addition and further kneading were performed to prepare a raw material composition for the polishing substrate. This raw material composition is filled in a mold having a convex portion that allows a through hole to be formed at a position 200 mm from the center, and subjected to a crosslinking reaction at 160 ° C. for 5 minutes, thereby forming a diameter of 790 mm and a thickness of 3.2 mm. Got the body. The molded body had an elliptical hole with a major axis of 100 mm parallel to the radial direction and a minor axis of 50 mm parallel to the tangential direction centered at 195 mm from the center. In addition, the position of the convex part of a metal mold | die and the position of the hole of a molded object do not correspond by shrinkage | contraction of a molded object (this is the same also in the subsequent Examples).
(2) Preparation of Raw Material Composition for Translucent Member A raw material composition for a translucent member was obtained in the same manner as in Example 1.

(3) Manufacture of pad outline shape Using a mold that does not have a convex portion different from that used in (1) above as a mold, the polishing substrate obtained in (1) above and (2) above Except that the raw material composition of the obtained translucent member was used and an elliptical columnar shape having a major axis of 60 mm, a minor axis of 20 mm, and a thickness of 2.4 mm was used as the metal block, and the major axis direction was set parallel to the radial direction. In the same manner as in Example 1, a molded body having a cylindrical shape having a diameter of 790 mm and a thickness of 3.2 mm and having a translucent member fused thereto was obtained. Subsequently, grinding with sandpaper was performed in the same manner as in Example 1.
Furthermore, an opening is formed around the opening (area corresponding to the translucent member) of the concave portion on the lower surface (surface to be a non-polished surface) of the molded body using an end mill of a cutting machine manufactured by Kato Machine Co., Ltd. An ellipse-shaped recess having a major axis of 80 mm parallel to the radial direction and a minor axis of 30 mm parallel to the tangential direction and a depth of 0.7 mm was obtained. . This pad outline had an elliptical recess (its cross-sectional shape was a two-stage shape in which a smaller rectangle was superimposed on a rectangle) on its lower surface.

(4) Manufacture of chemical mechanical polishing pad The pad general shape manufactured above is sucked and fixed on the surface plate of the cutting machine in the same manner as in “(4) Production of chemical mechanical polishing pad” in Example 1, and concentric. A chemical mechanical polishing pad having a thickness of 2.5 mm was manufactured. Of the polishing surface of this polishing pad, a groove is formed in a substantially elliptical area having a major axis of 50 mm parallel to the radial direction and a minor axis of 15 mm parallel to the tangential direction centered on the center of the translucent member. Not formed.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent member and a polishing surface was measured like Example 1, they were 1.1 micrometers and 5.2 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area | region in which the groove | channel was not formed among translucent members, the average transmittance of 5 times was 18%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer A 3M double-sided tape “# 422” is laminated on the back of the chemical mechanical polishing pad manufactured above, and an optical polishing end point detector is provided. A chemical mechanical polishing device (Applied Materials, model name “Reflexion”) is mounted, and a wafer with a 12-inch pattern (product name “SEMATECH-754”) is used as a target to perform chemical mechanical polishing under the following conditions: It was.

Plate rotation speed: 120 rpm
Polishing head rotation speed: 36 rpm
Polishing pressure: 3 psi
Abrasive machine polishing aqueous dispersion: CMS7401 and CMS7452 (both trade names, manufactured by JSR Corporation) and water mixed at 1: 1: 2 (weight ratio).
Chemical mechanical polishing aqueous dispersion supply rate: 300 mL / min

In the above polishing, the end point could be detected without any problem. Further, the number of scratches on the polished surface after polishing was measured in the same manner as in Example 1, and found to be 0 per wafer whole surface.
Subsequently, the same chemical mechanical polishing was performed on 19 SEMATECH-754s (total polishing number of 20 sheets), but the end point could be detected without any problem in any polishing, and the surface to be polished was No scratch was observed.

(2) Polishing test of unpatterned copper film wafer Using a chemical mechanical polishing pad produced in the same manner as in “I. Production of chemical mechanical polishing pad”, a wafer with unpatterned copper film having a diameter of 12 inches was polished. A chemical mechanical polishing was performed in the same manner as in “(1) Polishing test of patterned wafer” except that the polishing time was 1 minute.
When the polishing rate and the in-plane uniformity were calculated in the same manner as in Example 1 for the surface to be polished, they were 1,510 Å / min and 2.1%, respectively.
(3) Evaluation of fused portion strength Example 1 except that the polishing substrate material composition prepared above was used as the polishing substrate material composition, and the first crosslinking reaction was performed at 160 ° C. for 5 minutes. Similarly, the fusion part strength was evaluated.
All ten specimens of the tensile test were broken at the material portion of the polishing substrate, and no specimen was broken at the fused portion.

Example 3
I. Production of Chemical Mechanical Polishing Pad (1) Production of Polishing Substrate A raw material composition for a polishing substrate was prepared in the same manner as in Example 1. This raw material composition is subjected to a crosslinking reaction at 160 ° C. for 7 minutes using a mold having a convex part that forms a through-hole centered at a position 200 mm from the center, whereby a diameter of 790 mm and a thickness of 3.2 mm is obtained. A molded body having the following holes was obtained. The hole of this molded body was an ellipse having a major axis of 100 mm parallel to the radial direction and a minor axis of 50 mm parallel to the tangential direction centered at 195 mm from the center.
(2) Preparation of Raw Material Composition for Translucent Member A raw material composition for a translucent member was obtained in the same manner as in Example 1.

(3) Manufacture of pad outline shape Using a mold that does not have a convex part different from that used in (1) above as a mold, the molded body manufactured in (1) above and (2) above Using the obtained raw material composition of the translucent member, the major axis is 80 mm parallel to the radial direction and the minor axis is 30 mm parallel to the tangential direction up to 0.7 mm from the lower surface of the polishing base as a metal block. The major axis is 60 mm parallel to the radial direction, the minor axis is 20 mm parallel to the tangential direction, and the central axes of both are coaxial, from 0.7 mm to the upper surface (2.4 mm height from the lower surface of the polishing substrate), Except for using a metal block having a thickness of 2.4 mm, a molded body having a columnar shape with a diameter of 790 mm and a thickness of 3.2 mm and having a light-transmitting member fused thereto in the same manner as in Example 1. Got. Next, sandpaper grinding is performed in the same manner as in Example 1, whereby an elliptical concave portion (the cross-sectional shape is a two-stage shape in which a smaller rectangle is superimposed on a rectangle) is formed on the lower surface thereof. A pad having a rough shape was produced.

(4) Manufacture of chemical mechanical polishing pad The pad general shape manufactured above is sucked and fixed on the surface plate of the cutting machine in the same manner as in “(4) Production of chemical mechanical polishing pad” in Example 1, and concentric. A chemical mechanical polishing pad having a thickness of 2.5 mm was manufactured. Of the polishing surface side of the translucent member of the polishing pad, the major axis is 50 mm parallel to the radial direction and the minor axis is 15 mm parallel to the tangential direction, with the center of the translucent member as the center. No groove was formed in the shaped area.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent member and a grinding | polishing surface was measured like Example 1, they were 1.9 micrometers and 2.7 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area | region in which the groove | channel is not formed among translucent members, the average transmittance | permeability of 5 times was 21%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) When a wafer with a patternless copper film having a diameter of 12 inches was polished in the same manner as in Example 2 except that the chemical mechanical polishing pad manufactured in the same manner as described above was used, the polishing rate was 1,400 mm / min. The in-plane uniformity was 2.5%.

Example 4
I. Manufacture of chemical mechanical polishing pad (1) Preparation of raw material composition of translucent material 1,2-polybutadiene (manufactured by JSR Corporation, product name “JSR RB830”) 95% by volume and β-cyclodextrin (Yokohama Corporation) 5% by volume (trade name “Dexy Pearl β-100”, manufactured by Kokusai Bio-Institute) was kneaded in a router heated to 160 ° C. Thereafter, Park Mill D-40 (trade name, manufactured by Nippon Oil & Fats Co., Ltd., containing 40% by weight of dicumyl peroxide) was added in an amount of 0.9 parts by weight (pure dicumyl) to 100 parts by weight of 1,2-polybutadiene. It corresponds to 0.36 parts by weight in terms of peroxide.) Addition and further kneading gave a raw material composition of a translucent material.
(2) Manufacture of pad general shape It has a cylindrical cavity, and its lower mold has a length of 80 mm in a direction parallel to the radius centered at 200 mm from the center, and a width of 60 mm in a direction parallel to the tangent line. A raw material composition of the translucent material prepared in the above (1) was filled into a cavity of a mold having a rectangular convex portion with a thickness of 1.5 mm. Thereafter, a cross-linking reaction was performed at 180 ° C. for 10 minutes to obtain a molded body having a cylindrical shape with a diameter of 790 mm and a thickness of 3.2 mm, having transparency as a whole and having a recess opened on the lower surface. Next, sandpaper grinding was performed in the same manner as in Example 1 to produce a pad outline having a rectangular recess (its cross-sectional shape is rectangular) on its lower surface.

(3) Manufacture of chemical mechanical polishing pad The pad general shape manufactured above is sucked and fixed on the surface plate of the cutting machine in the same manner as in “(4) Manufacture of chemical mechanical polishing pad” in Example 1, and concentric. A chemical mechanical polishing pad having a thickness of 2.5 mm was manufactured. Of the region (translucent region) corresponding to the recess on the lower surface of the polishing surface of this polishing pad, the major axis is 70 mm parallel to the radial direction and the minor axis is 40 mm parallel to the tangential direction with the center of the region as the center. No groove was formed in the substantially elliptical area.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent area | region and a grinding | polishing surface was measured like Example 1, they were 1.6 micrometers and 3.2 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area | region in which the groove | channel is not formed among translucent members, the average transmittance of 5 times was 25%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) Polishing test of wafer without pattern copper film Polishing wafer without pattern copper film having a diameter of 12 inches in the same manner as in Example 2 except that the chemical mechanical polishing pad manufactured in the same manner as described above was used. The polishing rate was 1,250 Å / min, and the in-plane uniformity was 3.2%.

Example 5
I. Manufacture of chemical mechanical polishing pad (1) Manufacture of pad outline In the manufacture of pad outline, as a mold, the major axis is 80mm in the direction parallel to the radius and the minor axis is tangent centered at 200mm from the center of the lower mold This was carried out in the same manner as in Example 4 except that a mold having a convex part of 60 mm in height and 1.5 mm in height was used, and was a cylindrical shape having a diameter of 790 mm and a thickness of 3.2 mm. There was obtained a molded body having transparency and having a recess opening on the lower surface thereof. Next, a molded body was obtained by sandpaper grinding in the same manner as in Example 1. Furthermore, the major axis is 110 mm in parallel with the radial direction around the center of the opening around the opening of the recess on the lower surface of the molded body using an end mill of a cutting machine manufactured by Kato Machine Co., Ltd. Is approximately 80 mm parallel to the tangential direction, and an oval recess having a depth of 0.3 mm (its cross-sectional shape is a two-stage shape in which a smaller rectangle is superimposed on a rectangle), and the pad outline The shape was manufactured.

(2) Manufacture of polishing pad Concentric grooves obtained by suction-fixing the rough shape of the pad manufactured above onto the surface plate of a cutting machine in the same manner as in “(4) Manufacture of chemical mechanical polishing pad” in Example 1. Groups were formed to produce a chemical mechanical polishing pad with a thickness of 2.5 mm. Of the region (translucent region) corresponding to the recess on the lower surface of the polishing surface of this polishing pad, the major axis is 70 mm parallel to the radial direction and the minor axis is 40 mm parallel to the tangential direction with the center of the region as the center. No groove was formed in the substantially elliptical area.
The chemical mechanical polishing pad produced above was measured for the surface roughness inside the groove of the lower surface of the light-transmitting region and the polishing surface in the same manner as in Example 1, and found to be 1.9 μm and 3.5 μm, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area | region in which the groove | channel is not formed among translucent members, the average transmittance of 5 times was 29%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) A wafer with a patternless copper film having a diameter of 12 inches was polished in the same manner as in Example 2 except that the chemical mechanical polishing pad manufactured in the same manner as described above was used. The polishing rate was 1,820 Å / min. The in-plane uniformity was 2.9%.

Example 6
I. Production of Chemical Mechanical Polishing Pad (1) Production of Polishing Substrate A raw material composition of a polishing substrate was prepared in the same manner as in Example 1, and this was subjected to a crosslinking reaction at 160 ° C. for 7 minutes in a press mold, whereby a diameter of 790 mm, A molded body having a thickness of 3.2 mm was obtained. Next, using an end mill manufactured by Kato Machine Co., Ltd., a rectangular through hole having a length of 58 mm in the radial direction and a length of 22 mm in the direction parallel to the tangential direction is formed around the center of this molded body at 105 mm. A polishing substrate having holes was produced.
(2) Preparation of Raw Material Composition for Translucent Member A raw material composition for a translucent member was obtained in the same manner as in Example 1.

(3) Manufacture of pad outline The polishing substrate manufactured in (1) above is set again in the press die, and the raw material composition of the translucent member prepared in (2) above is filled in the hole of the polishing substrate. After that, a metal block having a plane shape and size substantially the same as that of the hole and a thickness of 1.5 mm is put in the remaining space of the hole, and subjected to a crosslinking reaction at 180 ° C. for 10 minutes, whereby a diameter of 790 mm and a thickness of 3 is obtained. A molded body having a cylindrical shape of 2 mm, having a translucent member fused thereto, and having a concave portion on the lower surface was obtained.
Thereafter, grinding with sandpaper is performed in the same manner as in Example 1, the diameter is 790 mm, the thickness is 2.5 mm, and the pad has a rectangular recess (its cross-sectional shape is rectangular) on its lower surface. A rough shape was manufactured.
(4) Manufacture of chemical mechanical polishing pad The pad general shape manufactured above is sucked and fixed on the surface plate of the cutting machine in the same manner as in “(4) Production of chemical mechanical polishing pad” in Example 1, and concentric. A chemical mechanical polishing pad having a diameter of 508 mm and a thickness of 2.5 mm was manufactured. Of the polishing surface side of the translucent member of the polishing pad, the major axis is 50 mm parallel to the radial direction and the minor axis is 10 mm parallel to the tangential direction, with the center of the translucent member as the center. No groove was formed in the shaped area.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent member and a grinding | polishing surface was measured like Example 1, they were 1.2 micrometers and 6.2 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured about the area | region where the groove | channel is not formed among the translucent members similarly to Example 1, the average transmittance of 5 times was 15%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-854 were continuously polished in the same manner as in Example 1. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) Polishing Test of Wafer with Patternless Copper Film Using a chemical mechanical polishing pad manufactured in the same manner as in “I. Production of chemical mechanical polishing pad”, the diameter of 8 inches was the same as in Example 1. When a polishing test was performed on a wafer with a copper film having no pattern, the polishing rate was 1,180 Å / min and the in-plane uniformity was 1.12%.

Example 7
I. Production of Chemical Mechanical Polishing Pad (1) Production of Polishing Substrate A raw material composition for a polishing substrate was prepared in the same manner as in Example 2. This raw material composition is molded to have a diameter of 790 mm and a thickness of 3.2 mm by performing a crosslinking reaction at 160 ° C. for 5 minutes using a mold in which convex portions are formed so that a through hole is formed at a position of 200 mm from the center. Got the body. This molded body had an elliptical hole having a major axis of 58 mm parallel to the radial direction and a minor axis of 22 mm parallel to the tangential direction centered at 195 mm from the center.
(2) Preparation of Raw Material Composition for Translucent Member A raw material composition for a translucent member was obtained in the same manner as in Example 1.
(3) Manufacture of pad general shape It is the column shape of diameter 790mm and thickness 3.2mm like Example 6 using the raw material composition of the grinding | polishing base | substrate and translucent member which were obtained above, The translucent member was fused and the molded object which has a recessed part in the lower surface was obtained. Next, grinding with sandpaper was performed in the same manner as in Example 1.
Furthermore, using an end mill of a cutting machine manufactured by Kato Machine Co., Ltd., an opening around the opening (area corresponding to the translucent member) of the recess on the lower surface (surface that becomes the non-polished surface) of the molded body An ellipse-shaped recess having a major axis of 80 mm parallel to the radial direction and a minor axis of 30 mm parallel to the tangential direction and a depth of 0.6 mm is obtained. It was. The concave portion of the lower surface of the pad outline has an elliptical shape, and its cross-sectional shape is a two-stage shape in which a rectangle is further superimposed on a rectangle.

(4) Manufacture of chemical mechanical polishing pad The pad general shape manufactured above is sucked and fixed on the surface plate of the cutting machine in the same manner as in “(4) Production of chemical mechanical polishing pad” in Example 1, and concentric. A chemical mechanical polishing pad having a diameter of 790 mm and a thickness of 2.5 mm was manufactured. Of the polishing surface of this polishing pad, a groove is formed in a substantially elliptical area having a major axis of 60 mm parallel to the radial direction and a minor axis of 15 mm parallel to the tangential direction centered on the center of the translucent member. Not formed. The area where the groove was not formed extended to a part of the polishing substrate.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent member and a grinding | polishing surface was measured like Example 1, they were 1.2 micrometers and 6.2 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area in which the groove | channel is not formed among translucent members, the average transmittance of 5 times was 15%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) Polishing test of wafer without pattern copper film Polishing wafer without pattern copper film having a diameter of 12 inches in the same manner as in Example 2 except that the chemical mechanical polishing pad manufactured in the same manner as described above was used. The polishing rate was 1,500 Å / min, and the in-plane uniformity was 2.18%.

Example 8
I. Production of Chemical Mechanical Polishing Pad (1) Production of Polishing Substrate A raw material composition for a polishing substrate was prepared in the same manner as in Example 1. This raw material composition is an elliptical columnar first having a major axis of 80 mm parallel to the radial direction, a minor axis of 30 mm parallel to the tangential direction, and a height of 0.7 mm centered at a position 200 mm from the center. It has a step convex portion (first convex portion), and the major axis is 58 mm parallel to the radial direction around the center of the upper ellipse of the first convex portion on the first step convex portion. Press mold (first convex part and second convex part) having an elliptic columnar second-stage convex part (second convex part) having a diameter of 22 mm parallel to the tangential direction and a height of 2.5 mm Through-holes are formed by both of them, and are subjected to a cross-linking reaction at 160 ° C. for 5 minutes, and have a diameter of 790 mm, a thickness of 3.2 mm, and polishing with a through-hole centered at 195 mm from the center. A substrate was obtained. The shape of the through hole of this polishing substrate is an elliptical cylinder having a major axis of 58 mm parallel to the radial direction and a minor axis of 22 mm parallel to the tangential direction up to 2.5 mm from the upper surface. The major axis was 80 mm parallel to the radial direction and the minor axis was 30 mm parallel to the tangential direction, and the central axes of both elliptical cylinders were coaxial.
(2) Preparation of Raw Material Composition for Translucent Member A raw material composition for a translucent member was obtained in the same manner as in Example 1.

(3) Manufacture of pad outline shape Using a mold that does not have a convex part different from that used in (1) above as a mold, the molded body manufactured in (1) above is faced up. A cylindrical shape having a diameter of 790 mm and a thickness of 3.2 mm is set in the same manner as in Example 1 except that a metal block that matches the shape of the hole from the lower surface of the polishing base to 1.5 mm is used. Thus, a light-transmitting member was fused and a molded body having a recess on the lower surface was obtained. Next, sandpaper grinding is performed in the same manner as in Example 1, whereby a pad having an elliptical recess (the cross-sectional shape is a two-stage shape in which a rectangle is further stacked on a rectangle) is formed on the lower surface thereof. A rough shape was manufactured.
(4) Manufacture of chemical mechanical polishing pad The pad general shape manufactured above is sucked and fixed on the surface plate of the cutting machine in the same manner as in “(4) Production of chemical mechanical polishing pad” in Example 1, and concentric. A chemical mechanical polishing pad having a thickness of 2.5 mm was manufactured. Of the polishing surface side of the translucent member of the polishing pad, the major axis is 60 mm parallel to the radial direction and the minor axis is 15 mm parallel to the tangential direction with the center of the translucent member as the center. No groove was formed in the shaped area.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent member and a grinding | polishing surface was measured like Example 1, they were 1.2 micrometers and 6.2 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area in which the groove | channel is not formed among translucent members, the average transmittance of 5 times was 15%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) Polishing test of unpatterned copper film wafer Except for using a chemical mechanical polishing pad manufactured in the same manner as described above, a wafer without pattern copper film having a diameter of 12 inches was polished in the same manner as in Example 2. The polishing rate was 1,410 Å / min, and the in-plane uniformity was 1.20%.

Example 9 (Reference Example)
I. Manufacture of chemical mechanical polishing pad (1) Surface treatment of water-soluble particles β-cyclodextrin (manufactured by Yokohama Kokusai Bio Laboratory Co., Ltd., product name “Dexipal β-100”, average particle size 20 μm) 100 parts by weight of mixing mixer ( Γ-aminopropyltriethoxysilane (obtained from GE Toshiba Silicone Co., Ltd.) with stirring at 400 rpm while stirring at 400 rpm, product name “A-1100” ) 0.5 part by weight was mixed while spraying for 5 minutes, and stirring was continued at 400 rpm for another 2 minutes. Thereafter, the taken-out particles are dried by heating in a vacuum dryer set at 130 ° C. until the water content of the particles becomes 5,000 ppm or less, and β-cyclodextrin whose surface is treated with a silane coupling agent is obtained. Obtained.
(2) Production of translucent member: Prepolymer (manufactured by Uniroyal Chemical Co., Ltd., 100 parts by weight “Vibracene B670”) was charged into a container and stirred at 80 ° C., and the surface obtained in (1) above was treated with a silane cup. 3 parts by weight of β-cyclodextrin treated with a ring agent was added, 10.8 parts by weight of trimethylolpropane was further added, and the mixture was stirred for 3 minutes to obtain a raw material composition of a translucent member.
The mixture was poured into a mold having a rectangular parallelepiped cavity of 180 mm × 180 mm and thickness 3 mm, reacted at 110 ° C. for 30 minutes, and then demolded. Then, the translucent member of length 150mm, width 120mm, and thickness 3mm was manufactured using the punching machine.

(3) Preparation of raw material composition of polishing substrate 58 parts by weight of 4,4′-diphenylmethane diisocyanate (manufactured by Sumika Bayer Urethane Co., Ltd., product name “Sumidur 44S”) was charged into a reaction vessel and stirred at 60 ° C. However, 5.1 parts by weight of polytetramethylene glycol having a number average molecular weight of 650 having two hydroxyl groups at both ends of the molecule (product name “PTMG650” manufactured by Mitsubishi Chemical Corporation) and polytetramethylene glycol having a number average molecular weight of 250 ( 17.3 parts by weight of Mitsubishi Chemical Corporation, product name “PTMG250”) was added, and the mixture was allowed to react at 90 ° C. for 2 hours while stirring, and then cooled to obtain a terminal isocyanate prepolymer. This terminal isocyanate prepolymer contained 21% by weight of unreacted 4,4′-diphenylmethane diisocyanate, and the remaining 79% by weight was a mixture containing both terminal isocyanate prepolymers.
80.4 parts by weight of the terminal isocyanate prepolymer obtained above is put in a stirring vessel and kept at 90 ° C., and the surface obtained in (1) above is treated with a silane coupling agent while stirring at 200 rpm. 14.5 parts by weight of β-cyclodextrin was added, mixed and dispersed for 1 hour, and then degassed under reduced pressure to obtain a terminal isocyanate prepolymer in which β-cyclodextrin having a surface treated with a silane coupling agent was dispersed.
12.6 parts by weight of 1,4-bis (β-hydroxyethoxy) benzene (product name “BHEB” manufactured by Mitsui Chemicals Fine Co., Ltd.) having two hydroxyl groups at the end is heated at 120 ° C. for 2 hours in a stirring vessel. After melting and adding 7 parts by weight of trimethylolpropane having three hydroxyl groups (manufactured by BASF Japan Ltd., product name “TMP”) with stirring, the mixture is mixed and dissolved for 10 minutes. Got.
Further, 94.9 parts by weight of a terminal isocyanate prepolymer in which β-cyclodextrin having the surface obtained above treated with a silane coupling agent was dispersed was heated to 90 ° C. in an AJITER (registered trademark) mixer. While stirring, 19.6 parts by weight of the chain extender mixture obtained above was heated to 120 ° C. and mixed for 1 minute to obtain a raw material composition for the polishing substrate.

(4) Manufacture of pad general shape It put in the metal mold | die which has a column-shaped cavity so that the major axis direction of a translucent member might become parallel to a radial direction centering on the position of 190 mm from the center. The remaining part of the cavity of the mold was filled with the raw material composition for the polishing substrate prepared in (3) above, held at 110 ° C. for 30 minutes, and subjected to polyurethane reaction for demolding. Further, post-curing was carried out in a gear oven at 110 ° C. for 16 hours to obtain a rough pad shape having a diameter of 790 mm and a thickness of 3 mm and having a translucent member fused thereto. The volume fraction of water-soluble particles relative to the entire pad outline, that is, the volume fraction of water-soluble particles relative to the total volume of the polyurethane matrix and the water-soluble particles was 10%.
Furthermore, the major axis is 120 mm parallel to the radial direction with the center point of the translucent member on the lower surface (surface to be non-polished) of the molded body using an end mill of a cutting machine manufactured by Kato Machine Co., Ltd. In addition, a rectangular recess (its cross-sectional shape is rectangular) having a minor axis of 90 mm parallel to the tangential direction and a depth of 2.0 mm was obtained to obtain a rough pad shape.

(5) Manufacture of polishing pad About the pad shape manufactured above, the thickness is adjusted to 2.3 mm with sandpaper in the same manner as in Example 1, and is concentrically fixed by suction on the surface plate of a cutting machine. A chemical mechanical polishing pad was produced by forming a group of grooves. Of the region (translucent region) corresponding to the concave portion on the lower surface of the polishing surface of this polishing pad, the major axis is 100 mm parallel to the radial direction and the minor axis is 70 mm parallel to the tangential direction with the center of the region as the center. No groove was formed in the substantially elliptical area.
About the chemical mechanical polishing pad manufactured above, when the surface roughness inside the groove | channel of the lower surface of a translucent area | region and a grinding | polishing surface was measured like Example 1, they were 2.3 micrometers and 3.4 micrometers, respectively. Moreover, when the transmittance | permeability in wavelength 650nm was measured like Example 1 about the area | region in which the groove | channel was not formed among translucent members, the average transmittance of 5 times was 19%.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) Polishing test of wafer without pattern copper film Polishing wafer without pattern copper film having a diameter of 12 inches in the same manner as in Example 2 except that the chemical mechanical polishing pad manufactured in the same manner as described above was used. The polishing rate was 1,300 Å / min, and the in-plane uniformity was 2.5%.

Example 10
I. Production of Chemical Mechanical Polishing Pad (1) Production of Translucent Member A raw material composition for a translucent member was obtained in the same manner as in Example 9.
The mixture was poured into a mold having a rectangular parallelepiped cavity of 180 mm × 180 mm and thickness 3 mm, reacted at 110 ° C. for 30 minutes, and then demolded. Thereafter, a translucent part having a length of 50 mm, a width of 20 mm, and a thickness of 1.5 mm was produced using a punching machine.
(2) Preparation of Raw Material Composition for Polishing Base A raw material composition for a polishing base was obtained in the same manner as in Example 9.
(3) Manufacture of chemical mechanical polishing pad Placed in a mold having a cylindrical cavity so that the minor axis direction of the translucent member is parallel to the tangential direction centered at a position 190 mm from the center. Is the same as the translucent member, and a metal block having a thickness of 1.5 mm was placed on the translucent member. The remaining part of the cavity of the mold was filled with the raw material composition for the polishing substrate prepared in the above (2), held at 110 ° C. for 30 minutes, and subjected to polyurethane reaction for demolding. Further, post-curing was performed at 110 ° C. for 16 hours in a gear oven, the diameter was 790 mm, the thickness was 3 mm, the translucent member was fused, and the pad had a rectangular recess (its cross-sectional shape is rectangular) on the lower surface. I got an outline. The volume fraction of water-soluble particles relative to the entire pad outline, that is, the volume fraction of water-soluble particles relative to the total volume of the polyurethane matrix and the water-soluble particles was 10%.
After that, the chemical mechanical polishing pad was manufactured by forming the concentric groove group by sucking and fixing the rough shape of the pad obtained above in the same manner as in Example 1 on the surface plate of the cutting machine. Of the polishing surface side of the translucent member of the polishing pad, the major axis is 50 mm parallel to the radial direction and the minor axis is 20 mm parallel to the tangential direction with the center of the translucent member as the center. No groove was formed in the shaped area.
Of the translucent member of the chemical mechanical polishing pad produced above, the transmittance at a wavelength of 650 nm was measured in the same manner as in Example 1 for the area where the groove was not formed. %Met.

II. Evaluation of Chemical Mechanical Polishing Pad (1) Polishing Test of Patterned Wafer Using the chemical mechanical polishing pad manufactured above, 20 sheets of SEMATECH-754 were polished continuously in the same manner as in Example 2. The end point could be detected without any problem in all polishing, and no scratch was observed on the polished surface.
(2) Polishing test of unpatterned copper film wafer Except for using a chemical mechanical polishing pad manufactured in the same manner as described above, a wafer without pattern copper film having a diameter of 12 inches was polished in the same manner as in Example 2. The polishing rate was 1,200 Å / min, and the in-plane uniformity was 1.05%.

Claims (8)

It has a surface that should be a polishing surface and a surface that should be a non-polishing surface that is the back surface of the surface, and has a cylindrical shape with both the surfaces that should be the polishing surface and the surfaces that should be the non-polishing surface as bottom surfaces. , the surface to become non-polished surface has a recess which is open to the surface, the recesses have a bottom surface, and bottom surface, the radial length parallel to that of the non-polishing surface become to face 10 It is 100 mm, tangential length parallel to that of the non-polishing surface and becomes to face to form a 10~50mm der Ru pad envelope,
That said pad envelope cutting machine with suction fixed to the surface plate, cutting in a state where the concave at least a portion of the area of the region corresponding to the concave portion of the surface to be polished surface Forming a groove or a groove group on a surface to be a polishing surface, but having an area in which no groove or groove group is formed in an area corresponding to the concave portion of the surface to be the polishing surface The manufacturing method of a chemical mechanical polishing pad.   2. The chemical mechanical polishing pad according to claim 1, wherein the depth of the concave portion is equal to or deeper than a depth of a groove or a groove group formed on a surface to be a polishing surface. Method.   The method for producing a chemical mechanical polishing pad according to claim 1, wherein the opening to the surface to be the non-polishing surface of the recess has the same size as the bottom surface of the recess.   The method for producing a chemical mechanical polishing pad according to claim 1, wherein an opening to a surface of the concave portion to be a non-polishing surface is larger than a bottom surface of the concave portion.   2. The method for producing a chemical mechanical polishing pad according to claim 1, wherein at least a region of the bottom surface of the recess is a light-transmitting region that optically communicates with a bottom surface of the recess from a surface to be a polishing surface. .   6. The chemical mechanical polishing pad according to claim 5, wherein the translucent material constituting the translucent region is composed of a water-insoluble matrix material and water-soluble particles dispersed therein. Method. Producing a chemical mechanical polishing pad by the method of claim 5;
A step of chemically and mechanically polishing an object to be polished using the chemical mechanical polishing pad;
A step of optically detecting a polishing end point;
A method for processing an object to be polished, comprising: Producing a chemical mechanical polishing pad by the method of claim 1;
A step of chemically and mechanically polishing an object to be polished using the chemical mechanical polishing pad;
Detecting the polishing end point by a change in magnetic flux generated by eddy current;
A method for processing an object to be polished, comprising:

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