JP5103409B2 - Electric / electronic module and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electric / electronic module having an electronic circuit board on which electronic components are mounted, and a method for manufacturing the same, and more particularly, an electronic circuit board integrally formed of a resin molding material, which is suitable for use in automobiles. -It is related with an electronic module and its manufacturing method.

  Conventionally, an electric / electronic module generally used is a case in which an electronic circuit board on which electronic components are mounted is stored in a case, the electronic parts and the electronic circuit board are sealed with silicone gel or the like, and then a cap is attached. It is a structure that is attached by bonding. For this reason, the number of equipment and the number of work steps are increased, and the electric / electronic module is large and thick.

  On the other hand, in the field of automobiles, from the viewpoint of improving comfort, there is a tendency to narrow the engine room and widen the passenger compartment space, so electric and electronic modules are also required to be smaller and thinner. Yes. In addition, since the number of cases where electric / electronic modules are installed in an engine room is increasing, improvement in environmental resistance such as water resistance and gas resistance is also required.

  In view of this, the inventors of the present invention have previously proposed an electronic circuit board that is directly formed integrally using a resin molding material to reduce the thickness (see, for example, Patent Document 1). In the structure of Patent Document 1, after potting with a resin in advance, the connector, the electronic circuit board, and the metal base are transfer-molded with a thermosetting sealing resin. Furthermore, a member that restrains the movement of the potting resin is provided on the inner wall surface of the metal base on which the resin is potted to withstand the stress generated by the molding pressure during transfer molding.

JP 2008-186955 A

  However, in the thing of patent document 1, in order to harden potting resin, it is necessary to heat for several hours at the temperature more than the glass transition point which potting resin has (this will often exceed 120 degreeC). As described above, in the case of using a potting resin, since heating time is required, there is a problem that productivity is lowered. In addition, there is a problem that energy for heating is required.

  In addition, a member for restraining the potting resin from moving due to the molding pressure at the time of transfer molding needs to be additionally processed in the case, resulting in a problem that productivity is lowered.

  An object of the present invention is to provide an electric / electronic module with improved productivity and a method for manufacturing the same.

(1) In order to achieve the above object, the present invention is connected to an electronic circuit board on which electronic components are mounted, a metal base for mounting the electronic circuit board, and an electronic circuit of the electronic circuit board, And an electrical / electronic module comprising a connector formed of a resin having a connecting metal terminal that is detachably connected to an external electronic circuit system, and a thermosetting resin that covers the electronic circuit board, The connector is composed of a resin-molded housing part and a resin-molded terminal holding member for fixing and aligning the metal terminals, separately from the housing part. The portion is assembled after the thermosetting resin is molded .
With this configuration, productivity can be improved.

  (2) In the above (1), preferably, a magnetic material that is assembled to the terminal holding member and into which the metal terminal is inserted is provided.

( 3 ) In the above (1), preferably, the metal terminal is press-fitted into the terminal holding member.

( 4 ) To achieve the above object, according to the present invention, a metal terminal is fixedly aligned, a resin-molded terminal holding member is assembled to a metal base, and an electronic circuit board on which an electronic component is mounted is attached to the metal base. After mounting, the metal terminal is connected to the electronic circuit of the electronic circuit board, the electronic circuit board is covered with a thermosetting resin, and the housing portion of the resin-molded connector is assembled. .
By this method, productivity can be improved.

( 5 ) In the above ( 4 ), preferably, when molding the thermosetting resin, at least a part of the terminal holding member is pressed by a block.

  According to the present invention, the productivity of electric / electronic modules can be improved.

Hereinafter, the configuration and manufacturing method of the electric / electronic module according to the embodiment of the present invention will be described with reference to FIGS.
First, the overall configuration of the electric / electronic module according to the present embodiment will be described with reference to FIGS.
FIG. 1 is a cross-sectional view showing the overall configuration of an electric / electronic module according to an embodiment of the present invention. FIG. 2 is a perspective view showing the overall configuration of the electric / electronic module before transfer molding according to an embodiment of the present invention. FIG. 3 is a perspective view showing the overall configuration of the electric / electronic module after transfer molding according to an embodiment of the present invention. FIG. 4 is a perspective view showing the overall configuration of the electrical / electronic module according to an embodiment of the present invention after the connector housing is assembled. 1 to 4, the same reference numerals indicate the same parts.

  As shown in FIG. 1, the metal terminal 3 is a component for electrically connecting a harness provided outside the electric / electronic module and the electronic circuit board 5. The metal terminal 3 receives supply of power, mediates signal input from an external sensor and signal output to an external actuator. As the metal terminal 3, a brass material plated with tin or gold is used. The metal terminal 3 is bent into an L shape, and is press-fitted into and held by the terminal holding component 9. One end of the metal terminal 3 protrudes from the upper surface of the electronic circuit board 5 (the surface opposite to the substrate mounting surface (the surface on which the substrate 5 is mounted on the base 1)). The other end of the metal terminal 3 projects into the connector housing part 11. The number of metal terminals 3 is 48, 60, or more.

  As a material for the terminal holding component 9, a thermoplastic resin containing an inorganic filler, such as polybutylene terephthalate (PBT), nylon (PA66), or polyphenylene sulfide (PPS) is used. The terminal holding component 9 is molded by a thermoplastic resin. The terminal holding component 9 is processed with a hole smaller than the cross-sectional area of the metal terminal 3 after molding, and the metal terminal 3 is press-fitted into the hole. It is also possible to use a retraction molded product in which a plurality of metal terminals are set in advance in the mold shape of the terminal holding component 9 and the plurality of metal terminals 3 are fixed to the terminal holding component 9 by insert molding. . However, in this case, since it takes time to set a plurality of metal terminals in advance in the mold shape, the method of press-fitting the metal terminals 3 into the terminal holding parts 9 improves the productivity.

  The connector housing part 11 is fixed to the metal base 1 using a connector fixing screw 6 (FIG. 2). In addition, you may make it fix using an adhesive agent. As a material for the connector housing portion 11, a thermoplastic resin containing an inorganic filler, such as polybutylene terephthalate (PBT), nylon (PA66), or polyphenylene sulfide (PPS) is used. The connector housing part 11 is molded by a thermoplastic resin.

  The metal base 1 serves as a fixing member for fixing the electronic circuit board 5, radiating heat generated by electronic components on the electronic circuit board 5, and mounting the electric / electronic module. As the material of the metal base 1, generally aluminum, aluminum alloy, copper, copper alloy, iron (including those plated on the surface) and the like are used. Moreover, as a manufacturing method of the metal base 1, die-casting, pressing, sintering and cutting are mainly used.

  The terminal alignment plate 4 is a member having a guide hole for facilitating insertion of one end of the metal terminal 3 into a terminal connection hole of the electronic circuit board 5.

  The electronic circuit board 5 is formed with a wiring pattern of an electronic circuit, and various electronic components 5A corresponding to the function of the circuit are connected using solder or a silver paste adhesive. As a material for the electronic circuit board 5, ceramic, glass epoxy, metal or the like is used. As shown in FIG. 2, the electronic circuit board 5 is mounted on the metal base 1 so that the terminal connection holes are aligned with the metal terminals 3. After the electronic circuit board 5 is fixed to the metal base 1 with the board fixing screws 7, the metal terminals 3 are connected to the wiring pattern of the electronic circuit board 5 with solder.

  Next, as shown in FIG. 3, the electronic circuit board 5 is molded and sealed with a sealing resin 8. The sealing resin 8 protects the electronic circuit from the external environment by sealing so as to wrap the electronic circuit board 5. A transfer mold is used for molding the sealing resin 8.

  Finally, as shown in FIG. 4, the connector housing part 11 is fixed to the metal base 1 using the connector fixing screw 6 (FIG. 2).

Here, since the resin mold is sealed with a transfer mold, the electric / electronic module is
-Mold temperature 170-180 ° C
-Clamping with a force of several tens of tons-Exposed to an environment of molding pressure of several tens of kgf / cm2.

  The material of the sealing resin 8 is an epoxy resin (thermosetting resin) that contains an inorganic filler and is solid at 40 ° C. or lower. The epoxy resin material has a composition comprising an epoxy resin and a phenol resin curing agent, and is an orthocresol type epoxy resin solid at 40 ° C. or lower, an epoxy resin having a biphenyl skeleton, an epoxy resin having a dicyclopentadiene skeleton, and a naphthalene skeleton. It can be obtained from a combination of an epoxy resin or bisphenol A type epoxy resin having a phenol novolac resin, an orthocresol novolak resin, a phenol resin having a dicyclopentadiene skeleton, a phenol resin having a naphthalene skeleton, or the like.

  In addition, the epoxy resin molding material can contain a stress-reducing material such as silicone rubber or oil or butadiene-based rubber in order to reduce the stress by reducing the elastic modulus. As the inorganic filler, at least one kind of crushed or spherical shape such as fused silica, crystalline silica, alumina, and magnesium oxide can be used.

  The transfer mold is generally used as a method for sealing a semiconductor element, but the size of the semiconductor element is at most about 30 mm × 30 mm.

  On the other hand, the size of the electronic circuit board 5 of the electric / electronic module for automobiles used in this embodiment exceeds the size of 100 mm × 100 mm. At this time, since the volume ratio of the sealing resin 8 exceeds 30 times, the following points need to be considered.

  The thermosetting resin used in the transfer mold is once melted by heating, and has a property that the viscosity is changed (hardened) with time. That is, the flow characteristics of the sealing resin 8 change. The transfer mold is a method of injecting the sealing resin 8 into the mold while the sealing resin 8 is melted, and maintaining the state until the sealing resin 8 is hardened. Accordingly, the size of the sealing resin 8 in the flow direction of the electric / electronic module and the volume of the sealing resin 8 to be injected affect the fluidity (moldability) of the sealing resin 8.

  In the case of a semiconductor, since the size is about 30 mm square, it can be injected while the viscosity of the sealing resin is low. However, in the case of an electric / electronic module that seals the large electronic circuit board 5, the viscosity of the sealing resin 8 may increase before the injection of the sealing resin 8 is completed. When the viscosity increases, a problem that the sealing resin 8 does not go into every corner of the mold, that is, a so-called short shot occurs.

  One measure to avoid short shots is to increase the molding pressure. However, in the electrical / electronic module that adopts a structure in which the housing part of the connector is fixed to the metal base and a part of the metal terminal wiring part of the connector is potted in advance with resin before transfer molding. It can be considered that the stress generated by the pressure exceeds the bonding strength between the potting resin and the metal base.

Here, the configuration of main parts of a conventional electric / electronic module will be described with reference to FIG.
FIG. 5 is a cross-sectional view showing a main configuration of a conventional electric / electronic module. The same reference numerals as those in FIG. 1 indicate the same parts.

Conventionally, a restraining member 19 that restrains the movement of the potting resin 12 is provided on the inner wall of the metal base 1 to restrain the molding pressure at the time of transfer molding and to prevent the stress from being transmitted to the connector 2 side. The constraining member 19 has a convex shape as shown in the figure, but may have a concave shape. When the sealing resin 8 is injected without a mold, a molding pressure is applied from the right-hand direction to the left-hand direction, and the potting resin 12 tends to move leftward. On the other hand, the restraining member 19 restrains the movement of the potting resin 12. Here, for the resin potting, a temperature higher than the glass transition point of the potting resin 12 for curing the potting resin 12 (this is often 120 ° C. However, productivity is reduced because it is necessary to heat for several hours. As the potting resin, a thermosetting resin is used. 5 is rotated 90 degrees counterclockwise, the connector housing part 2 faces downward, and a concave portion formed by the upper part of the connector housing part 2 (right part in FIG. 3) and the metal base 1 is formed. After the liquid thermosetting resin is injected, the resin is cured by heating for several hours, and the potting resin 12 is formed.

  In addition, the member 19 that restrains the movement of the potting resin 12 on the metal base 1 is undercut due to the structure provided on the inner wall, so that it is difficult to form with a mold and requires additional machining. Sexuality is impaired. In addition, since the machine processing is performed, there is a possibility that the residue of the machine oil remains attached after the processing. As a result, the residue may cause interface peeling of the sealing resin 8.

Next, the configuration of the connector portion of the electric / electronic module according to the present embodiment will be described with reference to FIGS. 1 and 6.
FIG. 6 is a cross-sectional view showing the configuration of the connector portion of the electric / electronic module according to the embodiment of the present invention. In addition, the same code | symbol as FIGS. 1-4 shows the same part.

  As shown in FIG. 6, in this embodiment, the connector portion is separated into a connector housing 11 shown in FIG. 6 (A) and a terminal subassembly 10 shown in FIG. 6 (B).

  The connector housing 11 is a member for mechanically coupling to a mating connector assembled to a harness provided outside the electric / electronic module. In some cases, the connector housing 11 has a waterproof function in combination with the mating connector. Also have.

  The terminal subassembly 10 basically includes a metal terminal 3 and a terminal holding component 9 that holds the metal terminal 3 in alignment.

  The metal terminal 3 is a member for electrically connecting the harness provided outside the electric / electronic module and the electronic circuit board 5, receives power supply, inputs signals from an external sensor, Mediates signal output to the actuator.

  The terminal holding component 9 is molded by a thermoplastic resin. The terminal holding component 9 also has a lid function when assembled to the metal base 1.

  However, since the terminal subassembly 10 is pushed out by the molding pressure at the time of transfer molding only in the assembled state, it is a terminal subassembly presser block made of a metal member having high rigidity. Transfer mold by pressing at least a part of The terminal sub-assembly presser block may be provided on the transfer mold equipment side, or may be temporarily fixed to the metal base 1.

  Immediately after the transfer molding, as shown in FIG. 3, the metal terminal 3 is exposed.

  Finally, the connector housing 11 is assembled as shown in FIG. For fixing the connector housing 11, a connector fixing screw 6 or an adhesive can be used.

Next, a method for manufacturing an electric / electronic module according to an embodiment of the present invention will be described with reference to FIGS.
7-20 is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. 7 to 20, the same reference numerals as those in FIGS. 1 to 6 denote the same parts.

  The electric / electronic module of this embodiment is formed by transfer molding.

  As shown in FIG. 7, the terminal subassembly 10 is assembled to the metal base 1 and the terminal alignment plate 4 is attached.

  Next, as shown in FIG. 8, the electronic circuit board 5 is assembled to the metal base 1.

  Next, as shown in FIG. 9, the metal terminal 3 and the wiring pattern of the electronic circuit board 5 are soldered.

  Next, as shown in FIG. 10, the electric / electronic module subassembly 20 is set in the lower mold 15. Here, the upper mold | type 14 and the lower mold | type 15 are dug in arbitrary shapes for external shape formation, and are heated at 170-180 degreeC. At the same time, the pot 16 is charged with a molded resin tablet 8 ′ that is in a solid state at room temperature. Here, if the electric / electronic module subassembly 20 is preheated at a predetermined temperature in advance, the cycle time can be shortened.

  Next, as shown in FIG. 11, the lower mold 15 is clamped to the upper mold 14 with a force of several tens of tons.

  Next, as shown in FIG. 12, the terminal subassembly presser block 13 is pressed to hold the terminal subassembly 10.

  Next, as shown in FIG. 13, the plunger 17 is pushed up at an arbitrary speed.

  Then, as shown in FIG. 14, the molded resin tablet 8 'is melted and injected into the mold.

  Next, as shown in FIG. 15, when the sealing resin 8 is filled, a molding pressure of about several tens of kgf / cm 2 is applied and the state is maintained for about 3 minutes to cure.

  Next, as shown in FIG. 16, the upper die 14 and the lower die 15 are released, and the terminal subassembly presser block 13 is pulled apart.

  Next, as shown in FIG. 17, an extra portion of the sealing resin 8 called a cal 18 is removed.

  This completes the molding as shown in FIG.

  Next, as shown in FIG. 19, the connector housing 11 is assembled.

  Then, as shown in FIG. 20, the assembly is completed.

  This eliminates the need for resin potting and eliminates the need for additional processing of the metal base 1.

  As described above, according to the present embodiment, it is possible to withstand the stress generated by the molding pressure during transfer molding without resin potting in advance, so that additional processing of the metal base 1 is unnecessary. Therefore, productivity can be improved. In addition, heating for resin potting is not required, and waste of energy can be eliminated.

  Further, the connector has a complicated shape and high dimensional accuracy is required. As the material of the connector housing portion 11, a thermoplastic resin containing an inorganic filler such as polybutylene terephthalate (PBT), nylon (PA66) or polyphenylene sulfide (PPS) is used, but these resins are cured and contracted. In addition, “sink” and “warp” occur. The degree of occurrence of “sink” and “warp” depends on the local balance of resin volume, the orientation of the inorganic filler generated during resin flow, and the like. For this reason, there are restrictions on design such as uniform thickness of the resin, stealing the meat, and a gate position provided in the mold.

  However, in this embodiment, since the connector housing part and the terminal holding part are separate parts, the shape of each part can be simplified, so that the dimensional accuracy can be improved or the degree of freedom in shape design can be increased.

Next, the configuration and manufacturing method of an electric / electronic module according to another embodiment of the present invention will be described with reference to FIG. The overall configuration of the electric / electronic module according to the present embodiment is the same as that shown in FIGS.
FIG. 21 is a cross-sectional view showing a configuration of a connector portion of an electric / electronic module according to another embodiment of the present invention. In addition, the same code | symbol as FIGS. 1-4 shows the same part.

  In the present embodiment, as shown in FIG. 21, a magnetic material 21 such as ferrite is assembled to the terminal holding component 9 of the terminal subassembly 10. The metal terminal 3 is inserted into the hole formed in the magnetic material 21. Thereby, the conduction noise riding on the electric wiring of the electric / electronic module can be attenuated.

  As described above, according to the present embodiment, it is possible to withstand the stress generated by the molding pressure during transfer molding without resin potting in advance, so that additional processing of the metal base 1 is unnecessary. Therefore, productivity can be improved. In addition, heating for resin potting is not required, and waste of energy can be eliminated.

  In addition, since the connector housing part and the terminal holding part are separate parts, the shape of each part can be simplified, so that the dimensional accuracy can be improved or the degree of freedom in shape design can be increased.

  Furthermore, conduction noise riding on the electrical wiring can be attenuated.

The present invention can be widely applied to a transfer mold sealing type electric / electronic module using an electronic circuit.

It is sectional drawing which shows the whole structure of the electric / electronic module by one Embodiment of this invention. It is a perspective view which shows the whole structure before transfer molding of the electric / electronic module by one Embodiment of this invention. It is a perspective view which shows the whole structure after transfer molding of the electric / electronic module by one Embodiment of this invention. It is a perspective view which shows the whole structure after the connector housing assembly | attachment of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows the principal part structure of the conventional electric / electronic module. It is sectional drawing which shows the structure of the connector part of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows each process at the time of manufacture of the electric / electronic module by one Embodiment of this invention. It is sectional drawing which shows the structure of the connector part of the electric / electronic module by other embodiment of this invention.

DESCRIPTION OF SYMBOLS 1 ... Metal base 2 ... Connector 3 ... Metal terminal 4 ... Terminal alignment board 5 ... Electronic circuit board 5A ... Electronic component 6 ... Connector fixing screw 7 ... Board fixing screw 8 ... Sealing resin 8 '... Sealing resin tablet 9 ... Terminal Holding part 10 ... Terminal subassembly 11 ... Connector housing part 12 ... Potting resin 13 ... Terminal subassembly presser block 14 ... Upper mold 15 ... Lower mold 16 ... Pot 17 ... Plunger 18 ... Sealing resin cull part 19 ... Resin restraining member 20 ... Electric / Electronic Module Subassembly 21 ... Magnetic Material

Claims (5)

An electronic circuit board on which electronic components are mounted, a metal base for mounting the electronic circuit board, and a connecting metal that is connected to an electronic circuit of the electronic circuit board and is detachably connected to an external electronic circuit system An electrical / electronic module having a connector formed of a resin having a terminal and a thermosetting resin covering the electronic circuit board,
The connector is composed of a resin-molded housing part, and a housing part separately from the housing part, and a resin-molded terminal holding member for fixing and aligning the metal terminals ,
The electrical / electronic module is characterized in that the housing portion of the connector is assembled after the thermosetting resin is molded . The electric / electronic module according to claim 1,
An electric / electronic module comprising a magnetic material that is assembled to the terminal holding member and into which the metal terminal is inserted. The electric / electronic module according to claim 1,
The electric / electronic module, wherein the metal terminal is press-fitted into the terminal holding member. After fixing and aligning the metal terminals and assembling the resin-molded terminal holding member to the metal base, and mounting the electronic circuit board on which the electronic component is mounted on the metal base, the metal terminal is mounted on the electronic circuit board. Connected to the circuit,
The electronic circuit board is covered with a thermosetting resin,
A method of manufacturing an electric / electronic module, comprising assembling a housing portion of a resin molded connector. In the manufacturing method of the electric / electronic module according to claim 4 ,
A method of manufacturing an electric / electronic module, wherein when molding the thermosetting resin, at least a part of the terminal holding member is pressed by a block.

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