JP5083576B2 - Color filter manufacturing method - Google Patents

Color filter manufacturing method Download PDF

Info

Publication number
JP5083576B2
JP5083576B2 JP2010099414A JP2010099414A JP5083576B2 JP 5083576 B2 JP5083576 B2 JP 5083576B2 JP 2010099414 A JP2010099414 A JP 2010099414A JP 2010099414 A JP2010099414 A JP 2010099414A JP 5083576 B2 JP5083576 B2 JP 5083576B2
Authority
JP
Japan
Prior art keywords
substrate
color filter
suction plate
filter manufacturing
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010099414A
Other languages
Japanese (ja)
Other versions
JP2010231216A (en
Inventor
晶 甘田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2010099414A priority Critical patent/JP5083576B2/en
Publication of JP2010231216A publication Critical patent/JP2010231216A/en
Application granted granted Critical
Publication of JP5083576B2 publication Critical patent/JP5083576B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Optical Filters (AREA)

Description

本発明は、液晶表示装置用のカラーフィルタを製造する方法及びそれに用いるカラーフィルタの製造装置に関する。   The present invention relates to a method for manufacturing a color filter for a liquid crystal display device and a color filter manufacturing apparatus used therefor.

カラーフィルタの製造工程においては、ガラス等の透明基板上に真空成膜法を用いてクロムを成膜する工程、フォトレジストを塗布しフォトマスクを配置して露光、現像、クロムエッチング、フォトレジスト剥離を行いストライプ状パターンあるいは格子状パターン等からなるブラック遮光層を形成する工程、ブラック遮光層の上から着色用感材を塗布した後、フォトマスクを配置し露光した後、現像を行い着色パターンを形成し、この着色パターンをR、G、B3色について繰り返して複数の着色層を形成する工程、これら着色層の上に酸化インジウム錫を成膜し、透明電極層を形成する工程からなる。この自動化ラインにおいては、基板搬送アームにより基板をある工程の基板吸着プレートに搬送し、基板を基板吸着プレートに装着し、処理が終わった基板を基板吸着プレートから剥離し、次工程に搬送するようにしている。従来の基板吸着プレートは、プレートの上面に多数の吸引孔を設け真空吸着により基板を固定するようにしている。   In the color filter manufacturing process, a chromium film is formed on a transparent substrate such as glass by using a vacuum film forming method, a photoresist is applied and a photomask is placed, and exposure, development, chromium etching, and photoresist removal are performed. The step of forming a black light-shielding layer comprising a stripe pattern or a lattice pattern, applying a coloring light-sensitive material from above the black light-shielding layer, placing and exposing a photomask, and developing to develop a colored pattern And forming a plurality of colored layers by repeating this colored pattern for R, G and B colors, and forming a transparent electrode layer by depositing indium tin oxide on these colored layers. In this automated line, the substrate is transported to the substrate suction plate in a certain process by the substrate transport arm, the substrate is mounted on the substrate suction plate, the processed substrate is peeled off from the substrate suction plate, and transported to the next process. I have to. In the conventional substrate suction plate, a large number of suction holes are provided on the upper surface of the plate, and the substrate is fixed by vacuum suction.

近年、例えば、液晶表示装置においては画面の大型化が要望されこれに伴い基板の大型化、薄板化が進んでいるが、上記従来のカラーフィルタの製造工程で用いられる基板吸着プレートにおいては種々の問題が生じている。特に、塗布工程において、塗布ムラが生じぬように均一膜厚で薄膜コーティングをするためには、基板の平面度を高精度に維持する必要があるが、従来の基板吸着プレートでは平面度を高精度にすることが困難であった。また、基板を基板吸着プレートから剥離する場合に空気との摩擦により剥離帯電が生じ、基板が基板吸着プレートから剥がれにくくなり、最悪の場合、基板割れが発生してしまうという問題を有している。さらに、基板吸着プレートと基板との接触面積が大きいために、基板吸着プレートの冷却作用により塗布後の乾燥ムラが生じてしまうという問題を有している。   In recent years, for example, a liquid crystal display device is required to have a large screen, and accordingly, a substrate is becoming larger and thinner, but there are various types of substrate suction plates used in the conventional color filter manufacturing process. There is a problem. In particular, in order to perform thin film coating with a uniform film thickness so that coating unevenness does not occur in the coating process, it is necessary to maintain the flatness of the substrate with high accuracy. However, the flatness of the conventional substrate suction plate is high. It was difficult to achieve accuracy. Further, when the substrate is peeled off from the substrate suction plate, peeling electrification occurs due to friction with air, and the substrate becomes difficult to peel off from the substrate suction plate, and in the worst case, there is a problem that the substrate is cracked. . Furthermore, since the contact area between the substrate suction plate and the substrate is large, there is a problem that uneven drying occurs after coating due to the cooling action of the substrate suction plate.

本発明は、上記従来の問題を解決するものであって、カラーフィルタ製造方法及びカラーフィルタ製造装置で用いる基板吸着プレートを基板の平面性を高精度に維持することができるとともに、剥離帯電、塗布ムラ、乾燥ムラの問題を解消することができるカラーフィルタ製造方法とカラーフィルタ製造装置を提供することを目的とする。 The present invention solves the above-mentioned conventional problems, and the substrate suction plate used in the color filter manufacturing method and the color filter manufacturing apparatus can maintain the flatness of the substrate with high accuracy, and can be peeled and charged. It is an object of the present invention to provide a color filter manufacturing method and a color filter manufacturing apparatus capable of solving the problems of unevenness and drying unevenness.

そのために、本発明のカラーフィルタ製造方法は、着色用感材を塗布する塗布工程と、塗布された着色用感材をプリベークするプリベーク工程と、プリベーク工程後の冷却工程と、フォトマスクを配置して露光する露光工程と、現像工程と、を含むカラーフィルタ製造方法において、前記塗布工程において、表面に多数の凹部が形成され、前記多数の凹部の一部に吸引孔が形成された平面度を維持しながら基板との接触面積を減少させるようにした基板を真空吸着により固定する基板吸着プレートを用い、プリベーク工程後の冷却工程において、表面に多数の凸部が形成され、前記多数の凸部の一部に吸引孔が形成された平面度を維持しながら前記基板との接触面積を減少させるようにした前記基板を真空吸着により固定する基板吸着プレートを用いることを特徴とする。   Therefore, the color filter manufacturing method of the present invention includes a coating process for applying a coloring photosensitive material, a pre-baking process for pre-baking the applied coloring photosensitive material, a cooling process after the pre-baking process, and a photomask. In the color filter manufacturing method including an exposure step for exposing and a developing step, in the coating step, the flatness in which a large number of concave portions are formed on the surface and suction holes are formed in a part of the numerous concave portions. In the cooling process after the pre-baking process, a large number of convex parts are formed on the surface in the cooling step after the pre-baking process, and the large number of convex parts are formed. A substrate suction plate for fixing the substrate by vacuum suction so as to reduce a contact area with the substrate while maintaining a flatness in which a suction hole is formed in a part of the substrate. Characterized by using.

本発明によれば、基板の平面性を高精度に維持しながら基板との接触面積を減少させることにより、均一膜厚での薄膜コーティングを可能にし、また、剥離帯電の問題を解消することにより基板を容易に剥がすことができる。さらに、基板吸着プレートが原因の乾燥ムラの発生を防止することができ、また、プレート上での基板加工時の位置ずれを防止することができる。   According to the present invention, by reducing the contact area with the substrate while maintaining the flatness of the substrate with high accuracy, a thin film coating with a uniform film thickness is enabled, and the problem of peeling charging is eliminated. The substrate can be easily peeled off. Furthermore, it is possible to prevent the occurrence of drying unevenness due to the substrate suction plate, and it is possible to prevent a positional shift during processing of the substrate on the plate.

本発明の基板吸着プレートの1実施形態を示し、図1(A)は模式的正面図、図1(B)は図1(A)の基板吸着プレートの一部を示す平面図、図1(C)は図1(B)のC−C線に沿って切断し矢印方向に見た断面図である。FIG. 1A is a schematic front view, FIG. 1B is a plan view showing a part of the substrate suction plate of FIG. 1A, and FIG. C) is a cross-sectional view taken along line CC in FIG. 1B and viewed in the direction of the arrow. 本発明の基板吸着プレートの他の実施形態を示し、図2(A)は基板吸着プレートの一部を示す平面図、図2(B)は図2(A)のB−B線に沿って切断し矢印方向に見た断面図である。FIG. 2A shows another embodiment of the substrate suction plate of the present invention, FIG. 2A is a plan view showing a part of the substrate suction plate, and FIG. 2B is taken along line BB in FIG. 2A. It is sectional drawing cut | disconnected and seen in the arrow direction. 本発明の実施例の実験結果を示す図である。It is a figure which shows the experimental result of the Example of this invention.

以下、本発明の実施の形態を図面を参照しつつ説明する。図1は、本発明のカラーフィルタ製造方法及びカラーフィルタ製造装置に用いる基板吸着プレートの1実施形態を示し、図1(A)は模式的正面図、図1(B)は図1(A)の基板吸着プレートの一部を示す平面図、図1(C)は図1(B)のC−C線に沿って切断し矢印方向に見た断面図である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows one embodiment of a substrate suction plate used in the color filter manufacturing method and color filter manufacturing apparatus of the present invention, FIG. 1 (A) is a schematic front view, and FIG. 1 (B) is FIG. 1 (A). FIG. 1C is a cross-sectional view taken along the line CC of FIG. 1B and viewed in the direction of the arrow.

図1の実施形態は、塗布工程で好適に用いられる基板吸着プレートであって、図1において、基板吸着プレート1は、プレートの上面に多数の吸引孔1aが設けられ、吸引孔1aは吸引通路2を経て真空ポンプ(図示せず)に接続されている。基板3は基板搬送装置4に保持され、図示矢印に示すように、基板吸着プレート1上に載置され、真空吸着により固定される。   The embodiment of FIG. 1 is a substrate suction plate suitably used in the coating process. In FIG. 1, the substrate suction plate 1 is provided with a plurality of suction holes 1a on the upper surface of the plate, and the suction holes 1a are suction paths. 2 is connected to a vacuum pump (not shown). The substrate 3 is held by the substrate transfer device 4 and is placed on the substrate suction plate 1 and fixed by vacuum suction as indicated by the arrows in the figure.

基板吸着プレート1の表面には、多数の円形状の凹部1bが形成され、基板吸着プレート1の平面度を維持しながら基板3との接触面積を減少させるようにしている。凹部1bを形成する方法としては、基板吸着プレート1上に凹部1bの形状がパターニングされたマスクを被せ、サンドブラスト処理により切削加工する方法や、或いはエッチング処理を行う方法が挙げられる。なお、吸引孔1aは、直径が1〜2mm、間隔が20〜30mmで形成すれば十分吸着できるものであり、吸引孔1aは凹部1b内に配置するのが好ましいがこれに限定されるものではない。また、基板吸着プレート1の材質は、加工精度の出しやすい材料が好ましく、特にはグラナイトが好ましい。なお、凹部1bの直径φは1〜2mm程度、高さhは30μm程度、間隔Lは1.5〜4mm程度が好ましい。   A large number of circular recesses 1b are formed on the surface of the substrate suction plate 1, and the contact area with the substrate 3 is reduced while maintaining the flatness of the substrate suction plate 1. Examples of the method for forming the recess 1b include a method of covering the substrate suction plate 1 with a mask in which the shape of the recess 1b is patterned and performing a cutting process by sandblasting, or a method of performing an etching process. The suction holes 1a can be sufficiently adsorbed if formed with a diameter of 1 to 2 mm and an interval of 20 to 30 mm. The suction holes 1a are preferably disposed in the recesses 1b, but are not limited thereto. Absent. In addition, the material of the substrate suction plate 1 is preferably a material that can be easily processed, and is particularly preferably granite. In addition, the diameter φ of the recess 1b is preferably about 1 to 2 mm, the height h is about 30 μm, and the interval L is preferably about 1.5 to 4 mm.

図2は、本発明のカラーフィルタ製造方法及びカラーフィルタ製造装置に用いる基板吸着プレートの他の実施形態を示し、図2(A)は基板吸着プレートの一部を示す平面図、図2(B)は図2(A)のB−B線に沿って切断し矢印方向に見た断面図である。   2 shows another embodiment of the substrate suction plate used in the color filter manufacturing method and color filter manufacturing apparatus of the present invention, FIG. 2A is a plan view showing a part of the substrate suction plate, and FIG. ) Is a cross-sectional view taken along the line BB in FIG.

本実施形態は、露光機前プリベーク後の冷却工程で好適に用いられる基板吸着プレートである。冷却工程では前のプリベークの工程で基板が暖められているため、静電気が増大し剥離帯電の問題が大きい。   The present embodiment is a substrate suction plate that is suitably used in a cooling process after pre-baking before an exposure machine. In the cooling process, since the substrate is warmed in the previous pre-baking process, static electricity increases and the problem of peeling charging is great.

そこで、基板吸着プレート1の表面に多数の円形状の凸部1cを形成し、基板吸着プレート1の平面度を維持しながら基板3との接触面積を減少させるようにしている。凸部1cを形成する方法としては、基板吸着プレート1上に凸部1bの形状がパターニングされたマスクを被せ、サンドブラスト処理により切削加工する方法や、或いはエッチング処理を行う方法が挙げられる。なお、図1の構造に比べ図2の構造の方が吸着力が弱いため、特に吸着力が要求される工程では、吸引孔1aは凸部1c内に配置されるようにするのが好ましいが、これに限定されるものではない。また、基板吸着プレート1の材質はグラナイトが好ましく、凸部1cの直径φは1〜2mm程度、高さhは30μm程度、間隔Lは1.5〜4mm程度が好ましい。   Therefore, a large number of circular convex portions 1c are formed on the surface of the substrate suction plate 1 so as to reduce the contact area with the substrate 3 while maintaining the flatness of the substrate suction plate 1. Examples of the method for forming the convex portion 1c include a method in which a mask on which the shape of the convex portion 1b is patterned is placed on the substrate suction plate 1 and a cutting process is performed by sandblasting, or an etching method is performed. 2 is weaker than the structure of FIG. 1, the suction hole 1 a is preferably disposed in the convex portion 1 c particularly in a process where the suction force is required. However, the present invention is not limited to this. The material of the substrate suction plate 1 is preferably granite, and the diameter φ of the convex portion 1c is preferably about 1 to 2 mm, the height h is about 30 μm, and the interval L is preferably about 1.5 to 4 mm.

以上、本発明の実施の形態について説明したが、本発明はこれに限定されるものではなく種々の変更が可能である。例えば、上記実施形態においては、凹部1b、凸部1cの形状を円形としているが、矩形、多角形など特に限定されるものではない。   Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible. For example, in the said embodiment, although the shape of the recessed part 1b and the convex part 1c is circular, it is not specifically limited, such as a rectangle and a polygon.

(実施例)次に、実施例により本発明をさらに詳細に説明する。図1の基板吸着プレートを塗布工程に用いる場合には、凹部1bの直径φと間隔Lが塗布ムラ、剥離性へ影響を与える。特に、スロットコーティング、ダイコーティングを用いる場合にはその影響が大きい。そこで、以下の方法で、基板吸着プレート凹部1bの直径φと間隔Lが、基板の剥離帯電等による剥離性と基板の塗布ムラに与える影響を調べ、図3に示した。   (Example) Next, the present invention will be described in more detail with reference to an example. When the substrate suction plate of FIG. 1 is used in the coating process, the diameter φ and the interval L of the recess 1b affect coating unevenness and peelability. In particular, when slot coating or die coating is used, the influence is great. Therefore, the influence of the diameter φ and the interval L of the substrate adsorption plate recess 1b on the releasability due to the substrate peeling charging and the coating unevenness of the substrate was examined by the following method, and is shown in FIG.

図1の実施形態におけるグラナイトでできた基板吸着プレートにガラス基板(面積:300mm×400mm、厚み:0.7mm、重量:約228g)を吸着させた後、吸着を解除して基板を1cm/secの速度で垂直方向に剥離するときに必要な力を重量計を用いて測定し、基板重量に対して2倍の負荷がかからないときはOKとし、基板重量に対して2倍以上の負荷がかかるときはNGとして、剥離性を図3に示した。   After adsorbing a glass substrate (area: 300 mm × 400 mm, thickness: 0.7 mm, weight: about 228 g) on the substrate adsorption plate made of granite in the embodiment of FIG. 1, the adsorption is released and the substrate is 1 cm / sec. Measure the force required for peeling in the vertical direction at a speed of 5 mm using a weigh scale. If the load is not twice as large as the substrate weight, it is OK, and the load is twice as large as the substrate weight. In some cases, NG is shown in FIG.

次に、塗布ムラについて、富士フィルムオーリン製カラーモザイクCB7001を膜厚1.5μmで塗布したガラス基板を用いて、ビューワで観察し判断した。評価はムラが観察されなかったときにOKとし、ムラが観察されたときにNGとして図3に記載した。   Next, the coating unevenness was determined by observing with a viewer using a glass substrate on which a color mosaic CB7001 manufactured by Fuji Film Olin was applied with a film thickness of 1.5 μm. The evaluation is shown in FIG. 3 as OK when no unevenness is observed, and as NG when unevenness is observed.

図3の結果から剥離性について凹部の直径φが凹部の間隔Lより大きい方が良好となる傾向があり、凹部の直径φが凹部の間隔Lより小さくなると悪くなる傾向であった。また、塗布ムラについては凹部の直径φも間隔Lも小さい方が良好であり、大きくなるに従い凹部の位置に対応する部分に丸い形状のムラが観察されるようになった。しかしながら、サンドブラスト加工により凹部形成する場合には、1mm程度が限界であり、好ましくは実施の形態に記載したように、1.5mm〜4mm程度が適切である。   From the results of FIG. 3, the releasability tended to be better when the diameter φ of the recesses was larger than the interval L between the recesses, and worsened when the diameter φ of the recesses was smaller than the interval L between the recesses. In addition, as for the coating unevenness, it is better that the diameter φ and the interval L of the recesses are small, and as the size increases, a round shape unevenness is observed in a portion corresponding to the position of the recess. However, when the concave portion is formed by sandblasting, the limit is about 1 mm, and preferably about 1.5 mm to 4 mm as described in the embodiment.

1:基板吸着プレート、1a:吸引孔、1b:凹部、1c:凸部、2:吸引通路、3:基板、4:基板搬送装置   1: substrate suction plate, 1a: suction hole, 1b: concave portion, 1c: convex portion, 2: suction passage, 3: substrate, 4: substrate transfer device

Claims (1)

着色用感材を塗布する塗布工程と、
塗布された着色用感材をプリベークするプリベーク工程と、
プリベーク工程後の冷却工程と、
フォトマスクを配置して露光する露光工程と、
現像工程と、
を含むカラーフィルタ製造方法において、
前記塗布工程において、表面に多数の凹部が形成され、前記多数の凹部の一部に吸引孔が形成された平面度を維持しながら基板との接触面積を減少させるようにした基板を真空吸着により固定する基板吸着プレートを用い、
プリベーク工程後の冷却工程において、表面に多数の凸部が形成され、前記多数の凸部の一部に吸引孔が形成された平面度を維持しながら前記基板との接触面積を減少させるようにした前記基板を真空吸着により固定する基板吸着プレートを用いることを特徴とするカラーフィルタ製造方法。
An application step of applying a coloring photosensitive material;
A pre-baking step of pre-baking the applied color sensitive material;
A cooling step after the pre-baking step;
An exposure process of arranging and exposing a photomask;
Development process;
In a color filter manufacturing method including:
In the coating step, a substrate having a reduced number of contact areas with the substrate while maintaining flatness in which a plurality of recesses are formed on the surface and suction holes are formed in a part of the plurality of recesses is obtained by vacuum suction. Using the substrate adsorption plate to be fixed,
In the cooling process after the pre-baking process, the contact area with the substrate is reduced while maintaining the flatness in which a large number of protrusions are formed on the surface and suction holes are formed in a part of the plurality of protrusions. A color filter manufacturing method using a substrate suction plate for fixing the substrate by vacuum suction.
JP2010099414A 2010-04-23 2010-04-23 Color filter manufacturing method Expired - Fee Related JP5083576B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010099414A JP5083576B2 (en) 2010-04-23 2010-04-23 Color filter manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010099414A JP5083576B2 (en) 2010-04-23 2010-04-23 Color filter manufacturing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP29537699A Division JP2001118913A (en) 1999-10-18 1999-10-18 Substrate suction plane

Publications (2)

Publication Number Publication Date
JP2010231216A JP2010231216A (en) 2010-10-14
JP5083576B2 true JP5083576B2 (en) 2012-11-28

Family

ID=43047022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010099414A Expired - Fee Related JP5083576B2 (en) 2010-04-23 2010-04-23 Color filter manufacturing method

Country Status (1)

Country Link
JP (1) JP5083576B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5810517B2 (en) * 2010-12-02 2015-11-11 富士電機株式会社 Adsorption device and adsorption method
CN107228648A (en) * 2017-06-08 2017-10-03 爱佩仪中测(成都)精密仪器有限公司 The method that testee is fixed from bottom surface

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831515B2 (en) * 1988-06-21 1996-03-27 株式会社ニコン Substrate suction device
JPH04302707A (en) * 1991-03-29 1992-10-26 Dainippon Printing Co Ltd Substrate fixing device
JP3259059B2 (en) * 1991-10-18 2002-02-18 大日本印刷株式会社 Color filter
JPH0851143A (en) * 1992-07-20 1996-02-20 Nikon Corp Board holding apparatus
JPH10260310A (en) * 1997-03-19 1998-09-29 Jsr Corp Coloring composition for color filter
JPH10300921A (en) * 1997-04-28 1998-11-13 Sumitomo Chem Co Ltd Production of black matrix
JP3881425B2 (en) * 1997-06-18 2007-02-14 大日本スクリーン製造株式会社 Substrate processing equipment
JPH1190301A (en) * 1997-09-18 1999-04-06 Dainippon Printing Co Ltd Surface plate with adsorption mechanism
JPH11145262A (en) * 1997-11-06 1999-05-28 Nikon Corp Substrate holding method, substrate holding device and aligner using the device
JP2001118913A (en) * 1999-10-18 2001-04-27 Dainippon Printing Co Ltd Substrate suction plane

Also Published As

Publication number Publication date
JP2010231216A (en) 2010-10-14

Similar Documents

Publication Publication Date Title
US9188856B2 (en) Type of fine metal mask (FFM) used in OLED production and the method of manufacturing it
US20160062170A1 (en) Display Substrate and Fabricating Method Thereof, and Display Device
JP2012111985A (en) Vapor deposition mask and thin film pattern-forming method using the same
JP2006199998A (en) Film-forming apparatus and film-forming method
JP6963014B2 (en) Deposition mask, display panel manufacturing method, and display panel
WO2014058592A1 (en) Display devices with logos and alignment marks
EP3276413B1 (en) Mask plate, mask exposure device and mask exposure method
KR20150017191A (en) Method for manufacturing metal mask
CN105324704A (en) Display with color mixing prevention structures
JP2001118913A (en) Substrate suction plane
TW201131216A (en) Color filter substrate, display device and exposure method
TW201523378A (en) Method of manufacturing a touch panel
JP5083576B2 (en) Color filter manufacturing method
CN109887960B (en) Array substrate and preparation method thereof
WO2016074387A1 (en) Mask plate
WO2011086882A1 (en) Method for exposing color filter base
JP2009128462A (en) Method of manufacturing substrate for display panel
KR20120028579A (en) Printing plate and fabricating method thereof
TWI250557B (en) Method of producing a photo mask blank
JP7413713B2 (en) Vapor deposition mask manufacturing method and vapor deposition mask
JPH10146784A (en) Board carrying robot hand
JP5823339B2 (en) Photomask substrate, photomask and pattern transfer method
JP7340160B2 (en) Vapor deposition mask manufacturing method and vapor deposition mask
JP2004361933A (en) Color filter substrate, method of manufacturing color filter substrate and display device
KR20110069459A (en) Cliche, method of fabricating the same, and method of fabricating thin film pattern using the cliche

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120201

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120509

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120702

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20120709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120808

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120821

R150 Certificate of patent or registration of utility model

Ref document number: 5083576

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150914

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees