JP5080393B2 - Heat dissipation structure for electronic devices - Google Patents

Description

  The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure for an electronic device.

  In recent years, operations required for devices such as motors for motors and electric compressors have been advanced, and accordingly, a configuration for driving an electric device via an electronic device such as an inverter device has been proposed. Such an electronic device has various electronic components, and is required to have a structure with a good assembly property in mass production.

Patent Document 1 discloses a method for assembling a vehicle control unit in which a substrate on which an electronic component is mounted is pressed by a pressing protrusion provided on a cover and bonded to a base coated with an adhesive.
JP 2003-198159 A

  However, in the configuration proposed in Patent Document 1, the cover provided with the pressing protrusions can surely facilitate the fixing of the substrate to the base, but the electronic component mounted on the substrate is not in operation. When heat is generated, it is impossible to effectively dissipate the heat generated by the electronic component to the outside.

  Here, the present inventor examines in more detail, in recent electronic parts for vehicles, etc., the power is increased corresponding to the higher functionality, and at the time of operation, it is more than before. There is a tendency to generate fever. In addition, such electronic components are also required to operate in a high temperature environment such as an engine room. Under such circumstances, in order to stabilize the operation of the electronic component, increase the heat dissipation, and extend the life, it is required to efficiently and reliably radiate the heat generated by the electronic component to the outside.

  From this point of view, the cover of Patent Document 1 is simply made of an integral resin, and when the electronic component generates heat, it has a strong tendency to receive and store heat, and the heat can be effectively radiated to the outside. It is not a thing. Furthermore, to effectively dissipate the heat stored in the cover to the outside, it is necessary to provide a separate cooling mechanism to forcibly cool the cover, or to dissipate heat by bringing a heat transfer member into contact with the cover. Therefore, the configuration must be complicated.

  On the other hand, when such an electronic component is mounted on a vehicle or the like, since it is used for a long time in a vibration environment, it is also required to adopt a configuration that reliably suppresses vibration applied to the electronic component.

  The present invention has been made in view of such circumstances. With a simple configuration, heat from an electronic component that generates heat during use is efficiently and reliably dissipated to the outside, and vibration applied to the electronic component is also reliably ensured. It is an object of the present invention to provide a heat dissipation structure for an electronic device that can be suppressed.

In order to achieve the above object, the present invention provides a heat dissipation structure that is a plate-like member extending in a first direction in a heat dissipation structure for an electronic device that dissipates heat emitted by an electronic component mounted on a substrate of the electronic device. and the member, provided on the heat dissipation member, the electronic component in thermal contact with a heat contact portion to which the electronic component is subjected to heat release, provided on the heat radiating member, the first to the heat contact portion The first heat dissipating part that dissipates heat transferred from the heat contact part, and a part of the first heat dissipating part, mechanically contacting the substrate, A first pressing portion that presses the surface in a direction perpendicular to the first direction, and the electronic device is fixed to the fixed body by a fixing portion provided in a case that accommodates the substrate. The heat dissipation member is further connected to the first heat dissipation portion in the first direction. A vertical wall portion and a fixed end portion that is connected to the vertical wall portion in the first direction and is fixed to the fixed body together with the electronic device in the fixing portion of the case. end is fixed to the fixed body with the fixing portion of the case to the first, wherein Rukoto.

Moreover, in addition to this 1st characteristic, this invention makes the said heat contact part of the said heat radiating member 2nd characteristic that it has the surface shape corresponding to the external shape of the said electronic component .

According to the present invention, in addition to the first or second feature, the first pressing portion of the heat radiating member is formed in a convex shape with a part of the first heat radiating portion facing the substrate. the curved portion der Rukoto the third feature.

The present invention, according the third addition to the features of the previous SL first the first direction and the width in the width direction perpendicular to the direction orthogonal to the first direction of the pressing portion, the thermal interface A fourth feature is that the width of the portion is narrower than the width in the width direction .

In addition to the third or fourth feature, the present invention has a fifth feature in which a pair of edges are provided with the first pressing portion sandwiched in the width direction .

According to the present invention, in addition to any of the third to fifth features, the fixed end of the heat radiating member is located at an end of the heat radiating member in the first direction. heat from the heat radiating portion is a sixth feature of the heat transfer freely der Turkey.

  Further, in addition to any one of the first to sixth features, the present invention is further provided in the heat radiating member, connected to the thermal contact portion in a second direction, and transfers heat from the thermal contact portion. A seventh feature comprising: a second heat radiating portion that radiates heat; and a second pressing portion that is provided in the second heat radiating portion and mechanically contacts the substrate to press the substrate. And

According to the first aspect of the present invention, the thermal contact portion provided in the heat dissipation member, which is a plate-like member extending in the first direction, is in thermal contact with the electronic component, and the electronic component is released. The first heat dissipating part that receives heat reliably and is connected to the heat dissipating member in the first direction reliably dissipates the heat transferred from the heat contact part, and is part of the first heat dissipating part. The provided first pressing portion is in mechanical contact with the substrate and is connected to the first heat radiating portion in the first direction while reliably pressing the surface of the substrate in a direction orthogonal to the first direction. was in continuous in a first direction to the vertical wall portion, the fixed end is fixed to the fixed body with an electronic device in the fixed part of the case is fixed to the fixed body with the fixing portion of the case can Rukoto, radiator Fastening member used for fixing part in addition to easy and reliable assembly of members Through, and it is possible to heat transfer heat to the fixing member, the heat from the electronic components that generate heat efficiently and reliably can be dissipated and the heat transfer to the outside in use, is applied to the electronic component together Can be reliably suppressed.

According to a second aspect of the present invention, the heat contact portion of the heat radiating member, because it has a surface shape corresponding to the outer shape of the electronic components, with a simple structure, is Rukoto reliably receive heat by the electronic component release it can.

According to a third aspect of the present invention, the first pressing portion of the heat radiating member, a portion of the first heat radiating portion bending portions der because formed in a convex facing the substrate, a simple structure It can reliably pressed to Rukoto the substrate while increasing the heat radiation area.

According to a fourth aspect of the present invention, the width in the width direction perpendicular to the direction orthogonal to the first direction and the first direction of the first pressing portion is narrower than the width in the width direction of the heat contact portion Therefore, the forbidden band in which electronic components or the like cannot be mounted on the substrate can be reduced, and the board mounting area can be increased.

According to the fifth feature of the present invention, since the pair of edges are provided with the first pressing portion sandwiched in the width direction, the heat in the first pressing portion is passed through the first pressing portion. Instead, the heat can be transferred to the fixed body side by the shortest route through the pair of edges.

According to the sixth feature of the present invention, the fixed end portion of the heat radiating member is located at the end portion in the first direction of the heat radiating member so that heat can be transferred from the first heat radiating portion. While ensuring easy and reliable assembly, heat the heat that is not completely dissipated by the heat-dissipating part by transferring heat to the fixed body through the fastening member used for the fixing part. be able to.

  According to the seventh feature of the present invention, since the second heat radiating portion and the second pressing portion are further provided, the heat transferred from the heat contact portion can be radiated more reliably with a simple configuration. At the same time, the first pressing part provided in a part of the first heat radiating part mechanically contacts the substrate and can reliably press the substrate, and the vibration applied to the electronic component is also generated. It can suppress more reliably.

  Hereinafter, a heat dissipation structure for an electronic device in each embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the figure, the x-axis, y-axis, and z-axis form a three-axis orthogonal coordinate system. In addition, the positive direction side of the z-axis may be described as “up” and the negative direction side of the z-axis may be described as “down”.

(First embodiment)
First, the heat dissipation structure of the electronic device according to the first embodiment of the present invention will be described in detail from the heat dissipation member with reference to FIGS.

  FIG. 1 is a top view of a heat radiating member in the heat radiating structure of the electronic device of the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA in FIG.

  As shown in FIGS. 1 and 2, the heat radiating member 10 is a plate-like member extending in the x-axis direction. The heat radiating member 10 can be made of a material having both thermal characteristics and mechanical strength for receiving heat and transferring heat while radiating heat. For example, a metal can be used.

  More specifically, a thermal contact portion 12 that is in thermal contact with an electronic component described later and receives heat released from the electronic component during operation is provided at the center of the heat radiating member 10. Here, the term “thermal contact” means not only direct contact with an electronic component so that it can receive heat, but even if air is interposed between the electronic component and the electronic component. Including the heat contact portion 12 in the vicinity includes indirect heat transfer via air. The shape of the thermal contact portion 12 is typically a flat shape, but may be a shape such as a curved surface deformed in conformity with the outer shape of the electronic component. Moreover, although the position of the heat contact part 12 is typically the center part of the heat radiating member 10, you may deviate from the center part corresponding to the position of an electronic component.

  From the thermal contact portion 12 of the heat radiating member 10, in the negative direction of the x-axis that is the first direction, a first heat radiating portion 14a is formed continuously to the thermal contact portion 12, and the first heat radiating portion 14a is It reaches the vertical wall portion 10w of the heat radiating member 10. That is, the first heat radiating portion 14a radiates the heat received by the thermal contact portion 12 to the outside while transmitting the heat in the negative direction of the x axis, and transfers the heat that cannot be radiated to the vertical wall portion 10w. Thus, although the 1st thermal radiation part 14a connects the thermal contact part 12 and the vertical wall part 10w, between the thermal contact part 12 and the vertical wall part 10w, the 1st press part 16a is connected. Have.

  Specifically, the first pressing portion 16a is curved between the thermal contact portion 12 and the vertical wall portion 10w so as to protrude in the negative direction of the z-axis so as to be convex toward the control board described later. Has a shape. As described above, since the first pressing portion 16a has a curved shape, the surface area of the first heat radiating portion 14a, that is, the heat radiating area is increased, and the heat received by the thermal contact portion 12 is more efficiently transmitted to the outside. Dissipate heat.

  In particular, as shown in FIG. 1, the width in the y-axis direction of the first heat radiating portion 14a is gradually narrowed toward the central portion in the x-axis direction in the first pressing portion 16a. In this way, by reducing the width of the first pressing portion 16a, the contact area is reduced while suppressing the transfer of excess heat to the control board, the surface pressure against the control board is increased, and the control board is securely z While pressing in the negative direction of the shaft, the forbidden band on which other components such as electronic components cannot be mounted on the control board is reduced to increase the board mounting area. The position of the first pressing portion 16a can be appropriately set in consideration of the layout of other components mounted on the control board. Further, the width of the first pressing portion 16a can be appropriately set in consideration of the surface pressure with respect to the control board, the heat radiation area of the first heat radiation portion 14a, and the like.

  The vertical wall portion 10w where the first heat radiating portion 14a having the first pressing portion 16a is continuous is erected in the z-axis direction, and is connected to the first fixed end portion 18a of the heat radiating member 10, Heat that cannot be radiated by the first heat radiating portion 14a is transmitted to the first fixed end portion 18a.

  The first fixed end portion 18a is an end portion of the heat radiating member 10 in the negative direction of the x axis, and is placed on a fixed portion of a case to be described later, and is a fastening member such as a bolt, together with the fixed portion of the case, The heat dissipation member 10 is fixed to the fixed body by being fastened and fixed to the fixed body on the vehicle side. Here, heat that cannot be radiated by the first heat radiating portion 14a is transmitted to the first fixed end portion 18a. However, such heat is transmitted to the fixed body side through the fastening member or the like and radiated. Note that a fastening hole 10h through which a fastening member is inserted is formed in the first fixed end portion 18a.

  Here, as described above, the heat radiating member 10 has the first heat radiating portion 14a having the first pressing portion 16a and the first heat radiating portion 14a with respect to the thermal contact portion 12 via the vertical wall portion 10w. By connecting the first fixed end portions 18a connected in series, the heat dissipating property of the heat received by the thermal contact portion 12, the pressing property of the control board, and the fixing property to the fixed body can be satisfied. In order to improve the characteristics, similarly in the positive direction of the x-axis that is the second direction, the second heat radiating portion 14b and the second heat radiating portion having the second pressing portion 16b with respect to the thermal contact portion 12 are similarly used. It is preferable that the second fixed end portion 18b connected to 14b through the vertical wall portion 10w is connected. The configurations of the second heat radiating portion 14b, the second pressing portion 16b, and the second fixed end portion 18b are the same as those of the first heat radiating portion 14a, the first pressing portion 16a, and the first fixed end portion 18a. It is the same although the direction of the line is opposite to that of the object. Hereinafter, in the present embodiment, the heat radiating member 10 includes the first heat radiating portion 14a, the first pressing portion 16a, the first fixed end portion 18a, the second heat radiating portion 14b, the second pressing portion 16b, and It demonstrates as what has the 2nd fixed end part 18a.

  Next, a heat radiating structure of an electronic device configured by applying the heat radiating member 10 having the above configuration to an electronic device having an electronic component will be described in detail with reference to FIGS.

  FIG. 3 is a schematic perspective view of an electronic device to which the heat dissipation structure in the present embodiment is applied, and FIG. 4 is a view taken in the direction of arrow Y in FIG.

  As shown in FIGS. 3 and 4, the electronic device 100 includes a resin case 20. The case 20 is typically rectangular in a top view as surrounded by the vertical wall portion 28w, and at the four corners, the first fixing portion 28a, the second fixing portion 28b, and the third fixing portion. A portion 28c and a fourth fixing portion 28d are provided correspondingly. The first fixing portion 28a, the second fixing portion 28b, the third fixing portion 28c, and the fourth fixing portion 28d are each formed with a fastening hole 20h through which the fastening member 80 is inserted.

  A control board 30 is accommodated and fixed on the upper part of the case 20, and an electronic component 40 that generates heat during operation, a controller (not shown), and the like are mounted on the control board 30. Examples of the electronic component 40 include a power supply regulator, a transformer, and the like, in addition to a driver IC with high functionality and high power.

  On the other hand, an insulating substrate 50 is accommodated and fixed under the case 20. On the insulating substrate 50, U-phase terminals 60 </ b> U, V that constitute output terminals, in addition to semiconductor elements such as transistors (not shown), are illustrated. Phase terminal 60V, W phase terminal 60W, input terminal 70, and the like are mounted.

  The operation of the electronic device 100 is not limited, but a direct current is supplied to an input terminal 70 from an input power supply (not shown), while a control signal from a controller on the control board 30 is insulated. The semiconductor element is input to the semiconductor element on the substrate 50, and the semiconductor element performs a switching operation under the control of the controller. From the U-phase terminal 60U, the V-phase terminal 60V, and the W-phase terminal 60W at the output terminal, the U-phase, The V-phase and W-phase three-phase alternating current is output to a load such as a vehicle motor or an electric compressor to drive the device. Here, electric power is also supplied to the electronic component 40 on the control board 30, and the electronic component 40 operates to generate heat.

  Now, the heat radiating member 10 is attached on the control board 30 of the electronic device 100.

  Here, in order to mount the heat dissipation member 10 on the control board 30, first, the first pressing portion 16a provided in the first heat dissipation portion 14a of the heat dissipation member 10 and the second heat dissipation portion 14b provided in the second heat dissipation portion 14b. While the two pressing portions 16 b are in contact with the upper surface of the control board 30, the heat contact portion 12 of the heat radiating member 10 is electronically connected to the electronic component 40 mounted on the control board 30. It is located corresponding to the upper surface of the component 40.

  Next, in the heat radiating member 10 in such a state, the vertical wall portion 10w connected to the first heat radiating portion 14a and the vertical wall portion 10w connected to the second heat radiating portion 14b are along the side wall portion 28w of the case 20, respectively. The first fixed end portion 18a and the second fixed end portion 18b are placed on the first fixed portion 28a and the second fixed portion 28b of the case 20, respectively.

  Finally, in the heat dissipation member 10 in such a state, the fastening members 80 are inserted into the fastening holes 10h formed in the first fixed end portion 18a and the fastening holes 10h formed in the second fixed end portion 18b, respectively. To do.

  At this time, the fastening holes 10h of the first fixed end portion 18a and the second fixed end portion 18b are positioned with respect to the fastening holes 20h of the first fixed portion 28a and the second fixed portion 28b of the case 20, respectively. Since they are aligned, each fastening member 80 is fastened to a fastening portion such as a screw hole formed in a fixed body (not shown), and the heat radiating member 10 is fixed to the fixed body together with the case 20. Here, a metal case of a device such as a motor for a vehicle or an electric compressor is applied to the fixed body.

  In such a configuration, the heat contact portion 12 receives heat released from the electronic component during operation, and the heat radiating portion 14a and the second heat radiating portion 14b receive heat received by the heat contact portion 12 on the x axis. While transmitting in correspondence with the negative direction and the positive direction, while radiating heat to the outside, which is outside the electronic device, the heat that cannot be radiated by the first heat radiating portion 14a and the second heat radiating portion 14b is The heat is transmitted corresponding to the fixed end portion 18a and the second fixed end portion 18b, and the heat is transmitted to the fixed body side via the fastening member 80, and is radiated to the outside which is outside the electronic device. At the same time, the first pressing portion 16a provided in the first heat radiating portion 14a of the heat radiating member 10 and the second pressing portion 16b provided in the second heat radiating portion 14b respectively move the upper surface of the control board 30 to the z axis. Are suppressed in the negative direction, suppressing vibrations mainly in the z-axis direction that may occur in the control board 30 in a vibration environment, thereby preventing unnecessary vibrations from being applied to the electronic component 40.

  In the present embodiment, only one heat radiating member 10 is applied so that the first fixing portion 28a and the second fixing portion 28b of the case 20 and the fastening member 80 are fastened together. Accordingly, the heat radiating member 10 may be added so that the third fixing portion 28c and the fourth fixing portion 28d of the case 20 and the fastening member 80 are fastened together.

(Second Embodiment)
Next, a heat dissipation structure for an electronic device according to the second embodiment of the present invention will be described in detail with reference to FIGS.

  FIG. 5 is a top view of a heat radiating member in the heat radiating structure of the electronic device of this embodiment, and FIG. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a schematic perspective view of an electronic device to which the heat dissipation structure of this embodiment is applied.

  In the heat dissipation structure of the electronic device in the present embodiment, the main difference is that the heat dissipation member 90 is different from the heat dissipation member 10 in the first embodiment in the shape of the first pressing portion and the like. The configuration is the same. Therefore, in the present embodiment, description will be made by paying attention to such differences, and the same components are denoted by the same reference numerals, and description thereof will be simplified or omitted as appropriate.

  As shown in FIGS. 5 and 6, the heat radiating member 90 is provided with a thermal contact portion 12 at the center thereof, and is connected to the thermal contact portion 12 in the negative direction of the x axis, which is the first direction. The heat radiating portion 14a is formed, and the first heat radiating portion 14a reaches the vertical wall portion 10w of the heat radiating member 10, but the first pressing portion is between the thermal contact portion 12 and the vertical wall portion 10w. 96a.

  Specifically, the first pressing portion 96a has a curved shape that protrudes in the negative direction of the z-axis to be convex toward the control board between the thermal contact portion 12 and the vertical wall portion 10w. . Here, the first pressing portion 96a has a vertical wall so that the first heat radiating portion 14a maintains the same height at both ends in the y-axis direction and leaves the pair of first edge portions 97a. It is formed to extend downward toward the thermal contact portion 12 while bending downward from the portion 10w side, and is separated from the first heat radiating portion 14a on the thermal contact portion 12 side. Of course, if necessary, the first pressing portion 96a is not separated from the first heat radiating portion 14a on the thermal contact portion 12 side, and the first pressing portion 96a is not separated from the first wall portion 10w side and the thermal contact portion 12 side. It is good also as a structure connected to the thermal radiation part 14a. In addition, the width of the heat dissipation member 90 in the y-axis direction is kept constant even in the pair of first edge portions 97a.

  As described above, since the first pressing portion 96a has a curved shape, the surface area of the first heat radiating portion 14a, that is, the heat radiating area is increased, and the width of the heat radiating member 90 in the y-axis direction is a pair of first radiating portions. Since the first edge portion 97a is maintained constant without being reduced, the heat received by the thermal contact portion 12 is more efficiently radiated to the outside.

  In particular, as shown in FIG. 1, the width of the first pressing portion 96a in the y-axis direction is narrower than the width of the first heat radiating portion 14a, so that it is possible to suppress transmission of excess heat to the control board. While reducing the contact area, the surface pressure against the control board is increased, the control board is surely pressed in the negative direction of the z-axis, and a prohibited band in which other components such as electronic components cannot be mounted on the control board Reduce the board mounting area. Further, the heat does not pass through the first pressing portion 96a, but directly through the pair of first edge portions 97a and directly through the vertical wall portion 10 from the first heat radiating portion 14a through the shortest route. This is transmitted to the fixed end 18a.

  Here, the heat radiating member 90 has the second pressing portion 96b sandwiched between the pair of second edge portions 97b with respect to the thermal contact portion 12 similarly in the positive direction of the x axis that is the second direction. The second heat dissipating part 14b and the second heat dissipating part 14b having a second fixed end 18b connected to the second heat dissipating part 14b through the vertical wall 10w are provided.

  To attach the heat radiating member 90 having the above configuration onto the control board 30 of the electronic device 100, first, as shown in FIG. 7, the first pressing portion 96a and the first pressing portion 96a provided in the first heat radiating portion 14a. The heat contact portion 12 of the heat dissipation member 10 is mounted on the control board 30 while the second pressing portions 96b provided on the second heat release portion 14b are in contact with the upper surface of the control board 30 respectively. The electronic component 40 is positioned so as to be in thermal contact with the component 40.

  Then, in the heat radiating member 90 in such a state, the vertical wall portion 10w connected to the first heat radiating portion 14a and the vertical wall portion 10w connected to the second heat radiating portion 14b are aligned with the side wall portion 28w of the case 20, respectively. After the first fixed end portion 18a and the second fixed end portion 18b are placed on the first fixed portion 28a and the second fixed portion 28b of the case 20, respectively, the first fixed end portion 18a is placed on the first fixed end portion 18a. A fastening member 80 is inserted into the formed fastening hole 10h and the fastening hole 10h formed in the second fixed end portion 18b, and fastened to a fastening portion such as a screw hole formed in the fixed body. Is fixed to the fixed body together with the case 20.

  In such a configuration, the heat contact portion 12 receives heat released from the electronic component during operation, and the heat radiating portion 14a and the second heat radiating portion 14b receive heat received by the heat contact portion 12 on the x axis. While transmitting in correspondence with the negative direction and the positive direction, the heat that is radiated to the outside, which is outside the electronic device, but is not completely radiated by the first heat radiating portion 14a and the second heat radiating portion 14b, The heat is transmitted through the shortest route corresponding to the first fixed end portion 18a and the second fixed end portion 18b via the one edge portion 97a and the pair of second edge portions 97b. Then, the heat is transmitted to the fixed body side and is radiated to the outside which is the outside of the electronic device. At the same time, the first pressing portion 96a provided in the first heat radiating portion 14a of the heat radiating member 90 and the second pressing portion 96b provided in the second heat radiating portion 14b respectively move the upper surface of the control board 30 to the z axis. Are suppressed in the negative direction, suppressing vibrations mainly in the z-axis direction that may occur in the control board 30 in a vibration environment, thereby preventing unnecessary vibrations from being applied to the electronic component 40. Further, by adjusting the width in the y-axis direction of the first pressing portion 96a and the second pressing portion 96b, the pressing force on the control board 30 can be adjusted, and the first edge portion 97a and the pair of first pressing portions 96a can be adjusted. The amount of heat radiation can be adjusted by adjusting the width of the second edge 97b in the y-axis direction.

  In the present embodiment, the heat radiating member 90 may be added so that the third fixing portion 28c and the fourth fixing portion 28d of the case 20 and the fastening member 80 are fastened together as necessary. .

  Further, the present invention is not limited to the above-described embodiments in terms of the type, arrangement, number, etc. of the members, and does not depart from the gist of the invention, such as appropriately replacing its constituent elements with those having the same effects. Of course, it can be appropriately changed within the range.

  As described above, in the present invention, heat from an electronic component that generates heat during use can be efficiently and reliably radiated to the outside with a simple configuration, and vibration applied to the electronic component can be reliably suppressed. It is possible to provide a heat dissipation structure for an electronic device, and is expected to be widely applicable to electronic devices such as vehicles because of its general-purpose universal character.

It is a top view of the heat radiating member in the heat radiating structure of the electronic device of the 1st Embodiment of this invention. It is sectional drawing by the AA line in FIG. It is a schematic perspective view of the electronic device to which the heat dissipation structure of this embodiment is applied. FIG. 4 is a view on arrow Y in FIG. 3. It is a top view of the thermal radiation member in the thermal radiation structure of the electronic device of the 2nd Embodiment of this invention. It is sectional drawing by the BB line in FIG. It is a schematic perspective view of the electronic device to which the heat dissipation structure of this embodiment is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Radiating member 10h ... Fastening hole 10w ... Vertical wall part 12 ... Thermal contact part 14a ... 1st thermal radiation part 14b ... 2nd thermal radiation part 16a ... 1st press part 16b ... 2nd press part 18a ... 1st fixed end 18b ... 2nd fixed end 20 ... Case 20h ... Fastening hole 28a ... 1st fixed part 28b ... 2nd fixed part 28c ... 3rd fixed part 28d ... 4th fixed part 28w ... Vertical wall 30 ... Control board 40 ... Electronic component 50 ... Insulating board 60U ... U phase terminal 60V ... V phase terminal 60W ... W phase terminal 70 ... Input terminal 80 ... Fastening member 90 ... Heat dissipation member 96a ... 1st press part 96b ... 2nd press part 97a ... 1st edge part 97b ... 2nd edge part 100 ... Electronic device

Claims (7)

In the heat dissipation structure of the electronic device that dissipates the heat emitted by the electronic component mounted on the substrate of the electronic device,
A heat dissipating member which is a plate-like member extending in the first direction ;
A thermal contact portion provided on the heat dissipation member, in thermal contact with the electronic component and receiving heat emitted by the electronic component;
Provided on the heat radiating member, and continuous in the first direction to the heat contact portion, a first heat radiation member for radiating the heat heat is transferred from the heat contact portion,
A first pressing portion that is provided in a part of the first heat dissipation unit, mechanically contacts the substrate , and presses the surface of the substrate in a direction orthogonal to the first direction ;
Equipped with a,
The electronic device is fixed to a fixed body by a fixing portion provided in a case that accommodates the substrate,
The heat dissipating member further includes a vertical wall portion connected to the first heat dissipating portion in the first direction, and connected to the vertical wall portion in the first direction, and the electron in the fixing portion of the case. A fixed end fixed to the fixed body together with the device,
Heat radiation structure of the fixed end is fixed to the fixed body with the fixed portion of the casing electronic device according to claim Rukoto. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the thermal contact portion of the heat dissipation member has a surface shape corresponding to an outer shape of the electronic component . The first pressing portion of the heat radiating member, wherein a portion of the first heat radiation member to claim 1 or 2, characterized in the curved portion der Rukoto formed in a convex shape facing the substrate Heat dissipation structure for electronic devices. Before SL first the first direction and the width in the width direction perpendicular to the direction orthogonal to the first direction of the pressing portion, and wherein the narrower than the width in the width direction of the heat contact portion The heat dissipation structure for an electronic device according to claim 3. 5. The heat dissipation structure for an electronic device according to claim 3 , wherein a pair of edges are provided to sandwich the first pressing portion in the width direction . Wherein the fixed end of the heat radiating member, according to claim 3, wherein the heat from the first said located on the edge portion in the direction of the first heat radiation member of the heat radiating member, characterized in the heat transfer freely der Turkey 5. A heat dissipation structure for an electronic device according to any one of 1 to 5.   Further, provided in the heat radiating member, connected to the thermal contact portion in a second direction, and provided in a second heat radiating portion for radiating heat transferred from the thermal contact portion, and the second heat radiating portion. A heat dissipation structure for an electronic device according to claim 1, further comprising: a second pressing portion that mechanically contacts the substrate and presses the substrate.

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