JP5045054B2 - 圧電デバイス - Google Patents
圧電デバイス Download PDFInfo
- Publication number
- JP5045054B2 JP5045054B2 JP2006277684A JP2006277684A JP5045054B2 JP 5045054 B2 JP5045054 B2 JP 5045054B2 JP 2006277684 A JP2006277684 A JP 2006277684A JP 2006277684 A JP2006277684 A JP 2006277684A JP 5045054 B2 JP5045054 B2 JP 5045054B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- piezoelectric
- electrode
- arm
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 238000000605 extraction Methods 0.000 claims description 16
- 230000005284 excitation Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 235000014676 Phragmites communis Nutrition 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910017401 Au—Ge Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 244000089486 Phragmites australis subsp australis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006277684A JP5045054B2 (ja) | 2006-10-11 | 2006-10-11 | 圧電デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006277684A JP5045054B2 (ja) | 2006-10-11 | 2006-10-11 | 圧電デバイス |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008098909A JP2008098909A (ja) | 2008-04-24 |
JP2008098909A5 JP2008098909A5 (enrdf_load_stackoverflow) | 2009-11-05 |
JP5045054B2 true JP5045054B2 (ja) | 2012-10-10 |
Family
ID=39381307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006277684A Expired - Fee Related JP5045054B2 (ja) | 2006-10-11 | 2006-10-11 | 圧電デバイス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5045054B2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4709260B2 (ja) * | 2008-10-16 | 2011-06-22 | 日本電波工業株式会社 | 圧電振動片および圧電デバイス |
WO2010061469A1 (ja) | 2008-11-28 | 2010-06-03 | セイコーインスツル株式会社 | 圧電振動子の製造方法、並びに圧電振動子、発振器、電子機器及び電波時計 |
WO2010061468A1 (ja) * | 2008-11-28 | 2010-06-03 | セイコーインスツル株式会社 | 圧電振動子の製造方法、並びに圧電振動子、発振器、電子機器及び電波時計 |
JP5621285B2 (ja) * | 2010-03-16 | 2014-11-12 | セイコーエプソン株式会社 | 振動片、振動子および発振器 |
JP5085681B2 (ja) | 2010-03-31 | 2012-11-28 | 日本電波工業株式会社 | 圧電振動片、圧電デバイスおよび圧電振動片の製造方法 |
JP2014197728A (ja) * | 2013-03-29 | 2014-10-16 | セイコーエプソン株式会社 | 振動片の製造方法 |
JP6346423B2 (ja) * | 2013-09-25 | 2018-06-20 | エスアイアイ・クリスタルテクノロジー株式会社 | 圧電振動子 |
JP2015097366A (ja) * | 2013-11-16 | 2015-05-21 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56737A (en) * | 1979-06-15 | 1981-01-07 | Seiko Epson Corp | Tuning fork type crystal oscillator |
JPS5665516A (en) * | 1979-11-02 | 1981-06-03 | Seiko Epson Corp | Quartz oscillator of composite oscillation |
JPS60153212A (ja) * | 1984-01-20 | 1985-08-12 | Matsushima Kogyo Co Ltd | 音叉型水晶振動子 |
JP2002111437A (ja) * | 2000-09-29 | 2002-04-12 | Daishinku Corp | 水晶片及び水晶振動子 |
JP4301200B2 (ja) * | 2004-10-20 | 2009-07-22 | セイコーエプソン株式会社 | 圧電振動片および圧電デバイス |
JP2006262456A (ja) * | 2005-02-21 | 2006-09-28 | Seiko Instruments Inc | 圧電振動片とその製造方法、圧電振動子、発振器、電子機器及び電波時計 |
-
2006
- 2006-10-11 JP JP2006277684A patent/JP5045054B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008098909A (ja) | 2008-04-24 |
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