JP5037011B2 - Optical sensor device - Google Patents

Optical sensor device Download PDF

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JP5037011B2
JP5037011B2 JP2005372322A JP2005372322A JP5037011B2 JP 5037011 B2 JP5037011 B2 JP 5037011B2 JP 2005372322 A JP2005372322 A JP 2005372322A JP 2005372322 A JP2005372322 A JP 2005372322A JP 5037011 B2 JP5037011 B2 JP 5037011B2
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optical sensor
light emitting
sensor
light receiving
emitting element
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JP2007173708A (en
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実 糸魚川
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Ricoh Co Ltd
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Ricoh Co Ltd
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本発明は、光学式センサ全般、とくに発光素子および受光素子を含んでいる光学センサからなる光学センサ装置に関するものである。   The present invention relates to an optical sensor in general, and more particularly to an optical sensor device including an optical sensor including a light emitting element and a light receiving element.

図7は光学センサの従来例を示す斜視図である。図8は図7の光学センサを取り付けブラケットに取り付けた状態で示す斜視図である。図9は図8の取り付けブラケット単体を示す斜視図である。
図7の光学センサ1は図9の取り付けブラケット2に図8に示すように取り付けられる。光学センサ1に設けられた弾性部分(図示せず)は取り付けブラケット2の穴部2a、2b部分に嵌合され、光学センサ1は取り付けブラケット2に固定される。
FIG. 7 is a perspective view showing a conventional example of an optical sensor. FIG. 8 is a perspective view showing the optical sensor of FIG. 7 attached to a mounting bracket. FIG. 9 is a perspective view showing a single mounting bracket of FIG.
The optical sensor 1 of FIG. 7 is attached to the mounting bracket 2 of FIG. 9 as shown in FIG. Elastic portions (not shown) provided in the optical sensor 1 are fitted into the hole portions 2 a and 2 b of the mounting bracket 2, and the optical sensor 1 is fixed to the mounting bracket 2.

図10は従来技術の光学センサの動作状態を示す概略断面図である。光学センサ1は取り付けブラケット2により光学センサ装置A内に固定されている。光学センサ1の光軸1c部分を、上方から挿入される遮光板6が横切って遮光した場合、光学センサ1の信号が変わる。
光学センサ1はその内部に発光素子1d及び受光素子1eを備えている。外装カバー5は光学センサ1及び光学センサ装置A全体を覆っている。外装カバー5の一部は、遮光板6が光学センサ1に向かって内部に入り込むための穴5aを有している。
図11は従来技術の光学センサの内部を示す回路図である。この回路図は一般的であるので、発光素子部1d及び受光素子部1eのみを示し、詳細は省略する。
FIG. 10 is a schematic cross-sectional view showing an operation state of a conventional optical sensor. The optical sensor 1 is fixed in the optical sensor device A by a mounting bracket 2. When the optical axis 1c portion of the optical sensor 1 is shielded by the light shielding plate 6 inserted from above, the signal of the optical sensor 1 changes.
The optical sensor 1 includes a light emitting element 1d and a light receiving element 1e. The exterior cover 5 covers the entire optical sensor 1 and the optical sensor device A. A part of the outer cover 5 has a hole 5 a for allowing the light shielding plate 6 to enter the inside toward the optical sensor 1.
FIG. 11 is a circuit diagram showing the inside of a conventional optical sensor. Since this circuit diagram is general, only the light emitting element portion 1d and the light receiving element portion 1e are shown, and the details are omitted.

しかしながら、上述した従来の光学式センサでは、外部からの静電気が光学センサに浸入する時は、受光素子、及び発光素子に直接浸入するため、センサの誤動作もしくはセンサ破壊が発生していた。
すなわち、従来技術では、穴5aに静電気が帯電した指先などが接近した場合、一番近くのGND(アース)に近いところに放電する。図10の場合では、実験によれば、各素子、すなわち、発光素子1d及び受光素子1eの基板1fに接続する端子部分1gが一番近い導電部となるためこの部分に放電してしまい、センサ機能が異常となる。センサ信号を誤出力したり、最悪の場合、センサ素子が破壊してしまい、機能しなくなる。
そこで、本発明の目的は、外部からセンサ素子に短絡しようとする静電気を外装の導電性部材から短絡させ、直接センサ素子に短絡しないようにして、静電気によるセンサ機能の異常、センサ信号の間違い、センサ素子の破壊等のない光学センサ装置を提供することにある。
However, in the above-described conventional optical sensor, when static electricity from the outside enters the optical sensor, it directly enters the light receiving element and the light emitting element, which causes a malfunction or destruction of the sensor.
That is, in the prior art, when a fingertip or the like charged with static electricity approaches the hole 5a, it is discharged to a place close to the nearest GND (ground). In the case of FIG. 10, according to an experiment, each element, that is, the terminal portion 1g connected to the substrate 1f of the light emitting element 1d and the light receiving element 1e becomes the nearest conductive portion, and thus discharges to this portion. The function is abnormal. If the sensor signal is erroneously output or, in the worst case, the sensor element is destroyed and it does not function.
Therefore, the object of the present invention is to short-circuit static electricity to the sensor element from the outside from the conductive member of the exterior and not directly to the sensor element, so that the sensor function abnormality due to static electricity, sensor signal error, An object of the present invention is to provide an optical sensor device that does not cause destruction of sensor elements.

上記の課題を解決するために、請求項1に記載の発明は、取り付けブラケットに取り付けられた、発光素子、受光素子及びセンサ基板を含んでいる光学センサからなる光学センサ装置において、前記光学センサ内部の前記センサ基板上の、前記発光素子と前記受光素子との間に導電性部材を前記センサ基板から前記発光素子と前記受光素子の光学中心に向かって設けたことを特徴とする In order to solve the above-mentioned problem, the invention according to claim 1 is an optical sensor device comprising an optical sensor including a light emitting element, a light receiving element, and a sensor substrate attached to a mounting bracket. A conductive member is provided on the sensor substrate between the light emitting element and the light receiving element from the sensor substrate toward the optical center of the light emitting element and the light receiving element .

本発明によれば、発光素子、受光素子及びセンサ基板を覆う、外装部材(ケース部材)の全部又は一部を導電性部材で形成しているので、静電気が放電されても外装部材を伝って取り付けブラケットへと放電されるため、光学センサ素子を通電することが無いため、光学センサの破壊、誤動作を防止できる。   According to the present invention, all or part of the exterior member (case member) that covers the light emitting element, the light receiving element, and the sensor substrate is formed of the conductive member. Since it is discharged to the mounting bracket, the optical sensor element is not energized, so that the optical sensor can be prevented from being broken or malfunctioning.

以下、図面を参照して本発明の実施の形態を詳細に説明する。図1は本発明による光学センサ装置の第1の実施の形態を示す概略断面図である。図1において、光学センサ装置Aは光学センサ1をそのケース部材3の底部から延びた先端が爪状の弾性部分3aによって取り付けブラケット2に設けた穴内に取り付けられている。
光学センサ1の発光素子4及び受光素子5を覆っているケース(外装)部材3は導電性のある樹脂材料で形成されている。ケース部材3には、図示しない遮光板を挿入するための挿入穴3bが設けてある。
発光素子4、受光素子5、センサ基板7及び取り付けブラケット2を覆う、外装部材を導電性部材で形成しているので、静電気が放電されてもケース部材3を伝って取り付けブラケット2へと放電されるため、光学センサの各素子4、5を通電することが無く、光学センサ1の破壊、又は誤動作を防止できる。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a first embodiment of an optical sensor device according to the present invention. In FIG. 1, the optical sensor device A has an optical sensor 1 mounted in a hole provided in a mounting bracket 2 with a claw-like elastic portion 3a at the tip extending from the bottom of the case member 3.
A case (exterior) member 3 covering the light emitting element 4 and the light receiving element 5 of the optical sensor 1 is formed of a conductive resin material. The case member 3 is provided with an insertion hole 3b for inserting a light shielding plate (not shown).
Since the exterior member that covers the light emitting element 4, the light receiving element 5, the sensor substrate 7, and the mounting bracket 2 is formed of a conductive member, even if static electricity is discharged, it is discharged to the mounting bracket 2 through the case member 3. Therefore, the elements 4 and 5 of the optical sensor are not energized, and the optical sensor 1 can be prevented from being broken or malfunctioning.

図2は本発明による光学センサ装置の第2の実施の形態を示す概略断面図である。図2では、光学センサの発光素子4、受光素子5及びセンサ基板7を覆うケース部材3の表面が導電性のある金属材料でコーティング3cされている。図中、符号3aは弾性部分、3bは遮光板(図示せず)の挿入穴を示している。
光学センサ1の外装部材(ケース部材)3表面の全面又は一部を導電性金属でコーティングし、この部分(コーティング層)3cから静電気を短絡させ、直接発光素子4及び受光素子5に短絡しないようにしている。
これにより、第1の実施の形態の場合と同様に、静電気が放電されても外装部材(ケース部材)3の表面のコーティング部分3cを伝って取り付けブラケット2へと放電されるため、光学センサ素子4、5に通電することが無いため、光学センの破壊又は誤動作が防止できる。
FIG. 2 is a schematic cross-sectional view showing a second embodiment of the optical sensor device according to the present invention. In FIG. 2, the surface of the case member 3 that covers the light emitting element 4, the light receiving element 5, and the sensor substrate 7 of the optical sensor is coated with a conductive metal material 3c. In the figure, reference numeral 3a denotes an elastic portion, and 3b denotes an insertion hole for a light shielding plate (not shown).
The entire surface or part of the surface of the exterior member (case member) 3 of the optical sensor 1 is coated with a conductive metal, and static electricity is short-circuited from this portion (coating layer) 3c so that the light-emitting element 4 and the light-receiving element 5 are not directly short-circuited. I have to.
Thus, as in the case of the first embodiment, even if static electricity is discharged, it is discharged to the mounting bracket 2 through the coating portion 3c on the surface of the exterior member (case member) 3, and thus the optical sensor element. Since no current is supplied to the electrodes 4 and 5, the optical sensor can be prevented from being broken or malfunctioning.

図3は光学センサを覆う金属部材を示す斜視図である。図4は光学センサを覆った状態の図3の金属部材を示す概略図である。図3及び図4において、図3の金属部材6は、図4に示すように、光学センサ1を覆いながら取り付けブラケット2を抱え込み、金属部材6の弾性部分6a、6bで取り付けブラケット2に固定させる。また、光学センサ単体は一般的な光学センサを使用でき、安価に静電気対策を行うことができる。
光学センサ1の外装部材(ケース部材)3に沿って、別の導電性部材6を取り付け、この導電性部材6で静電気を短絡させ、直接光学センサ素子に短絡しないようにしている。
これにより静電気が放電されても、この静電気は別の導電性部材6を伝って取り付けブラケット2へと放電されるため、光学センサ素子に通電することが無いため、光学センサの破壊又は誤動作が防止できる。
FIG. 3 is a perspective view showing a metal member covering the optical sensor. 4 is a schematic view showing the metal member of FIG. 3 in a state where the optical sensor is covered. 3 and 4, the metal member 6 of FIG. 3 holds the mounting bracket 2 while covering the optical sensor 1 and is fixed to the mounting bracket 2 by the elastic portions 6a and 6b of the metal member 6 as shown in FIG. . In addition, the optical sensor alone can use a general optical sensor, and can take measures against static electricity at low cost.
Another conductive member 6 is attached along the exterior member (case member) 3 of the optical sensor 1, and static electricity is short-circuited by the conductive member 6 so as not to be directly short-circuited to the optical sensor element.
As a result, even if static electricity is discharged, the static electricity is discharged to the mounting bracket 2 through another conductive member 6, so that the optical sensor element is not energized, thereby preventing the optical sensor from being damaged or malfunctioning. it can.

図5は本発明による光学センサ装置の第3の実施の形態を示す概略断面図である。図6は第3の実施の形態の光学センサ装置の回路図である。図5及び図6において、光学センサ1のセンサ基板7上に金属部材8、9を設けている。符号3はケース部材、3aはケース部材の弾性部分を示している。   FIG. 5 is a schematic cross-sectional view showing a third embodiment of the optical sensor device according to the present invention. FIG. 6 is a circuit diagram of the optical sensor device according to the third embodiment. 5 and 6, metal members 8 and 9 are provided on the sensor substrate 7 of the optical sensor 1. Reference numeral 3 denotes a case member, and 3a denotes an elastic portion of the case member.

図6には光学センサ1の発光側10および受光側11を示しており、金属部材8、9は光学センサ1のGND1(アース)とは別に、GND2においてハーネス(図示せず)で制御基板(図示せず)に結線されている。
光学センサ1内部のセンサ基板7上の、発光素子4と受光素子5との間に導電性部材(金属部材)8、9をセンサ基板7から発光素子4と受光素子5の光学中心に向かって設けることにより、静電気が直接光学センサ素子に短絡しないようにする。これにより取り付けブラッケット2等が非導電性の部材(樹脂材料)であっても、光学センサ単体で静電気に対する対策を行なうことができる。
FIG. 6 shows the light emitting side 10 and the light receiving side 11 of the optical sensor 1, and the metal members 8 and 9 are separated from the GND 1 (ground) of the optical sensor 1 by a harness (not shown) on the control board (not shown). (Not shown).
Conductive members (metal members) 8 and 9 are placed between the light emitting element 4 and the light receiving element 5 on the sensor substrate 7 inside the optical sensor 1 from the sensor substrate 7 toward the optical center of the light emitting element 4 and the light receiving element 5. By providing, static electricity does not directly short to the optical sensor element. Thereby, even if the mounting bracket 2 or the like is a non-conductive member (resin material), it is possible to take measures against static electricity with the optical sensor alone.

本発明による光学センサ装置の第1の実施の形態を示す概略断面図である。1 is a schematic cross-sectional view showing a first embodiment of an optical sensor device according to the present invention. 本発明による光学センサ装置の第2の実施の形態を示す概略断面図である。It is a schematic sectional drawing which shows 2nd Embodiment of the optical sensor apparatus by this invention. 光学センサを覆う金属部材を示す斜視図である。It is a perspective view which shows the metal member which covers an optical sensor. 光学センサを覆った状態の図3の金属部材を示す概略図である。It is the schematic which shows the metal member of FIG. 3 of the state which covered the optical sensor. 本発明による光学センサ装置の第3の実施の形態を示す概略断面図である。It is a schematic sectional drawing which shows 3rd Embodiment of the optical sensor apparatus by this invention. 第3の実施の形態の光学センサ装置の回路図である。It is a circuit diagram of the optical sensor apparatus of 3rd Embodiment. 光学センサの従来例を示す斜視図である。It is a perspective view which shows the prior art example of an optical sensor. 図7の光学センサを取り付けブラケットに取り付けた状態で示す斜視図である。It is a perspective view shown in the state where the optical sensor of Drawing 7 was attached to the attachment bracket. 図8の取り付けブラケット単体を示す斜視図である。It is a perspective view which shows the attachment bracket single-piece | unit of FIG. 従来技術の光学センサの動作状態を示す概略断面図である。It is a schematic sectional drawing which shows the operation state of the optical sensor of a prior art. 従来技術の光学センサの内部を示す回路図である。It is a circuit diagram which shows the inside of the optical sensor of a prior art.

符号の説明Explanation of symbols

A 光学センサ装置
1 光学センサ
2 取り付けブラケット
3 ケース部材(外装部材)
3a 弾性部分
3c コーティング
4 発光素子
5 受光素子
6 金属部材
6a 金属部材6の弾性部分
6b 金属部材6の弾性部分
7 センサ基板
8 金属部材
9 金属部材
A Optical sensor device
1 Optical sensor
2 Mounting bracket 3 Case member (exterior member)
3a Elastic part 3c Coating 4 Light emitting element 5 Light receiving element 6 Metal member 6a Elastic part of metal member 6 6b Elastic part of metal member 6 7 Sensor substrate 8 Metal member 9 Metal member

Claims (1)

取り付けブラケットに取り付けられた、発光素子、受光素子及びセンサ基板を含んでいる光学センサからなる光学センサ装置において、前記光学センサ内部の前記センサ基板上の、前記発光素子と前記受光素子との間に導電性部材を前記センサ基板から前記発光素子と前記受光素子の光学中心に向かって設けたことを特徴とする光学センサ装置。 In an optical sensor device including an optical sensor including a light emitting element, a light receiving element, and a sensor substrate attached to a mounting bracket, between the light emitting element and the light receiving element on the sensor substrate inside the optical sensor. An optical sensor device , wherein a conductive member is provided from the sensor substrate toward the optical center of the light emitting element and the light receiving element .
JP2005372322A 2005-12-26 2005-12-26 Optical sensor device Expired - Fee Related JP5037011B2 (en)

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Publication number Priority date Publication date Assignee Title
JPS61173198A (en) * 1985-01-29 1986-08-04 株式会社神戸製鋼所 Neutron shielding material
JPH02137275A (en) * 1988-11-17 1990-05-25 Nec Corp Photo coupler
JP3176496B2 (en) * 1993-12-27 2001-06-18 シャープ株式会社 Optical coupling device and method of manufacturing the same

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