JP5036654B2 - Semiconductor chip compression molding method - Google Patents

Description

  The present invention relates to a semiconductor chip compression molding method in which a semiconductor chip such as an IC mounted on a substrate is compression molded (resin-sealed molding) with a resin material, and an improvement of a mold.

  Conventionally, a semiconductor chip mounted on a substrate is compression-molded using a compression molding method. This method is performed as follows.

That is, using a semiconductor chip compression mold (upper mold, lower mold), first, a substrate with a semiconductor chip mounted on a required position (substrate set portion) of the upper mold is supplied and set by a substrate supply mechanism. A resin material is supplied into a lower mold cavity covered with a release film by a resin material supply mechanism and heated and melted, and the mold is clamped.
At this time, the semiconductor chip mounted on the substrate can be immersed in a heat-melted resin material (molten resin) in the lower mold cavity.
Therefore, next, the required resin pressure can be applied to the resin in the lower mold cavity by moving up the cavity bottom surface member provided on the bottom surface of the lower mold cavity.
After the elapse of the time necessary for curing, the mold is opened to compress the semiconductor chip mounted on the substrate into a resin molded body corresponding to the shape of the cavity (resin sealing molding).

In some cases, instead of the above-described mold for semiconductor chip compression molding comprising an upper mold and a lower mold, a semiconductor chip compression molding mold comprising an upper mold, a lower mold and an intermediate mold may be used.
In this case, for example, the release film is sandwiched between the lower mold side and the intermediate mold, and the release film is covered in the lower mold cavity.
Further, at the time of mold clamping, at least the inside of the lower mold cavity is shut off from outside air to form an outside air blocking space portion, and air is forcibly sucked and discharged to the outside from the outside air blocking space portion. There is a case where the inside of the cavity can be set to a required degree of vacuum.

JP 2007-194287 A

Further, in recent years, for example, an LED (Light Emitting Diode) chip mounted on a substrate with a resin material having transparency can be compression-molded to form an LED molded product using a semiconductor chip compression-molding die. Has been done.
In this case, the lower mold cavity is composed of a large cavity and a plurality of required small cavities provided on the bottom surface of the large cavity, and at the time of mold clamping, the position of the small cavity and the position of the LED chip (semiconductor chip) Are configured to match.
Furthermore, since both the small cavity and the LED chip are extremely small, when a substrate with the LED chip mounted on the required position of the upper die is set by the substrate supply mechanism, the allowable range of displacement is extremely narrow. Is required to be efficiently (accurately) positioned.

However, when a substrate having a semiconductor chip (for example, an LED chip) mounted on a required position of the upper die of a semiconductor chip compression molding die is supplied and set by the substrate supply mechanism, the substrate supply mechanism is mounted on the substrate supply mechanism. Although the position of the substrate to be placed is slight, it is usually easy to shift.
Therefore, when the substrate is supplied and set to the required position of the upper mold by moving the substrate from the substrate supply mechanism in the mold (lower position of the upper mold), the substrate is efficiently positioned at the required position of the upper mold. Thus, there is an adverse effect that the supply cannot be set (exactly).
In particular, when the substrate is sucked and set at the required position of the upper mold, the substrate is easily shaken by the air (fluid) sucked, and the substrate is efficiently positioned and set at the required position of the upper mold. I can't.

  Accordingly, an object of the present invention is to provide a semiconductor chip compression molding method and its mold capable of efficiently positioning and setting a substrate on which a semiconductor chip is mounted at a required position of the mold.

The semiconductor chip compression molding method according to the present invention for solving the technical problem is for compression molding of a semiconductor chip comprising an upper mold, a lower mold, and an intermediate mold having a through hole for loosely fitting the lower mold. A mold is used to supply and set a substrate on which a semiconductor chip is mounted on an upper substrate set portion, and the release film is sandwiched between the lower mold and the intermediate mold, and the clamped mold release is performed as described above. A semiconductor chip mounted on a substrate in a resin molded body corresponding to the shape of the cavity in the cavity by supplying and setting a resin material in the lower mold cavity coated with the film and clamping the mold. A method of compression molding a semiconductor chip, wherein a mold release film is sandwiched between the intermediate mold and the clamping member provided on the lower mold, and a base provided on the mold surface of the lower mold. A step of making a hole in the released release film and penetrating it with a positioning pin for use, and a holding of the lower mold cavity with a movable support pin provided on the lower mold surface so as to be movable up and down A step of covering the released release film, a step of supplying a resin material into the cavity covered with the release film and heating and melting, and a step of passing the positioning pins through the positioning holes provided in the substrate And a step of setting a required interval between the substrate and the lower mold surface by supporting the substrate with the movable support pin through the release film, and the gold A step of clamping the mold, a step of supplying and setting a substrate to the substrate setting portion of the upper mold when the mold is clamped, and a movable supporting pin at the substrate when the mold is clamped Pressing downward More, the step of compression molding the steps of housing the above-mentioned movable支受pin into the lower mold described above, the semiconductor chips mounted on the substrate in the resin molded body corresponding to the shape of the cavity and the inside lower cavity described above It is characterized by comprising.

In addition, the semiconductor chip compression molding method according to the present invention for solving the technical problem includes a step of sandwiching a release film between the above-described intermediate mold and a clamping member provided in the lower mold, and the above-described lower mold A step of making a hole in the sandwiched release film by means of a positioning pin for a substrate provided on the mold surface of the mold, and a movable support pin provided below the mold surface of the lower mold so as to be movable up and down. A step of covering the mold cavity with the sandwiched release film, a step of passing the positioning pin through a positioning hole provided in the substrate, and the movable support pin described above via the release film. By supporting the substrate, the step of setting a required interval between the substrate and the lower mold surface, the step of clamping the mold, and the mold clamping of the mold Board on the upper mold board set part A step of supplying and setting, a step of opening the above-mentioned mold, a step of supplying a resin material into the cavity coated with the above-mentioned release film and heating and melting, and a step of clamping the above-mentioned mold A step of accommodating the movable support pin in the lower mold by pressing the movable support pin downward with a substrate when the mold is clamped; and the lower mold cavity described above And a step of compression-molding a semiconductor chip mounted on a substrate in a resin molded body corresponding to the shape of the cavity described above.

  According to the present invention, it is possible to provide a semiconductor chip compression molding method capable of efficiently positioning and supplying and setting a substrate on which a semiconductor chip is mounted at a required position of the mold, and its mold. There is an effect.

In the present invention (Example 1), first, a release film sandwiched between an intermediate mold and a lower mold clamping member is perforated with a lower mold positioning pin, and the sandwiching release film can be moved up and down. The movable support pin and the lower mold cavity provided on the lower mold cavity are coated, and a resin material is supplied into the lower mold cavity coated with the release film to melt by heating.
Next, by passing the positioning pin through the positioning hole of the substrate and supporting the substrate with the movable supporting pin through the release film, a required interval is provided between the substrate and the lower mold surface. In addition to setting, the mold is clamped to supply and set the substrate in the substrate setting unit.
Accordingly, by passing the lower die positioning pin through the positioning hole of the substrate, the substrate on which the semiconductor chip is mounted can be efficiently positioned and supplied and set at the required position of the compression molding die for the semiconductor chip.

In the present invention (Embodiment 2), first, a substrate is supplied and set to the substrate setting unit, and the X substrate alignment mechanism and the Y substrate alignment mechanism are interlocked by the coupling mechanism to simultaneously change from the open state to the closed state.
Next, by pressing the C side of the substrate through the pressing locking piece by the X substrate shifting mechanism, the A side of the substrate is positioned in contact with and pressed against the X reference line (reference pin). By pressing the D side of the substrate through the pressing locking piece by the substrate shifting mechanism, the B side of the substrate is positioned in contact with and pressed against the Y reference line (reference pin).
In other words, by setting the X substrate alignment mechanism and the Y substrate alignment mechanism to the closed state at the same time, it is possible to position the X reference line (reference pin) and the Y reference line (reference pin) by simultaneously pressing them. .
Therefore, it is possible to efficiently position and set the substrate on which the semiconductor chip is mounted at the required position of the semiconductor chip compression molding die.

  First, Example 1 will be described in detail using the semiconductor chip compression molding die shown in FIGS. 1, 2, 3, 4, and 5. FIG.

(About the structure of the semiconductor chip compression molding die in Example 1)
As shown in FIGS. 1 to 5, a semiconductor chip compression mold (semiconductor chip resin mold) 1 includes a fixed upper mold 2 and an upper mold as a basic mold structure. 2 is provided with a movable lower mold 3 disposed opposite to the main body 2.
In addition, an intermediate mold (intermediate plate for film clamping) 4 is provided between the upper mold 2 and the lower mold 3, and at least a loose fitting hole (at least for the lower mold 2 is loosely fitted in the intermediate mold 4). A through-hole) 5 is provided.
Further, on the mold surface of the upper mold 2, a substrate setting unit 7 (required position of the upper mold) for supplying and setting the substrate 6 on which the semiconductor chip is mounted with the semiconductor chip side (semiconductor chip mounting surface side) facing downward. ) And a substrate supply mechanism (not shown) for supplying the substrate 6 to the substrate setting unit 7.
The substrate setting portion 7 of the upper mold 2 can be configured by providing an appropriate means for fixing the substrate 6, for example, a substrate suction fixing means (not shown) for suction fixing the substrate.

Further, a cavity 8 for compression molding for compression molding (resin sealing molding) of a semiconductor chip mounted on the substrate 6 is provided on the mold surface of the lower mold 3.
Further, the release film 9 can be stretched between the intermediate mold 4 and the lower mold 3, and the release film 9 can be adsorbed and coated in the lower mold cavity 8. It is configured.
Although not shown, the mold 1 (2, 3, 4) includes a resin material supply mechanism for supplying the resin material 10 into the lower mold cavity 8, and the mold 1 (2, 3, 4). And heating means for heating 4) to a required temperature.
In addition, the mold surface of the upper mold 2 is provided with an outside air blocking member 11 such as an O-ring that brings at least the inside of the lower mold cavity 8 into an outside air blocking state when the mold 1 (2, 3, 4) is clamped. Although it is configured, an appropriate outside air blocking member is provided at a required portion of the mold 1 (2, 3, 4), although not illustrated.
Accordingly, when the mold 1 (2, 3, 4) is clamped, the upper mold side surface of the intermediate mold 4 is brought into contact with the tip of the outside air blocking member 11 in the upper mold 2 to thereby set the substrate setting portion of the upper mold 2 7 is configured so that intermediate mold clamping of a mold that holds the semiconductor chip mounting surface of the substrate 6 supplied and set to 7 and the mold surface of the lower mold 3 at a predetermined interval (distance) 12 can be performed. (See FIG. 4).
At this time, it is configured so that at least the inside of the lower mold cavity 8 can be set in the outside air blocking state and the outside air blocking space can be set.
In addition, although not shown in the mold 1 (2, 3, 4), air is forcibly sucked and discharged from the outside air blocking space formed in the mold 1 (2, 3, 4). A vacuum evacuation mechanism such as a vacuum pump for setting the outside air blocking space to a required degree of vacuum is provided.
Therefore, air can be forcibly sucked and discharged from the outside air blocking space formed when the mold 1 (2, 3, 4) is clamped so that the outside air blocking space can be set to a required degree of vacuum. It is configured.

(About lower mold)
The lower mold 3 includes a lower mold body 3, a cavity bottom member 13 that presses (presses) the resin (10) in the lower mold cavity 8 with a required pressing force, and a lower position side of the cavity bottom member 13. And a base 14 fixedly provided.
Further, a cavity bottom member 13 is provided on the lower mold body 3 so as to be slidable in the vertical direction.
Accordingly, the cavity bottom member 13 and the base 14 are integrally moved upward so that the resin (10) in the lower mold cavity 8 can be pressed and compression-molded.
Further, the lower mold 3 includes a clamping member 15 for clamping a release film 9 stretched between the lower mold 3 and the intermediate mold 4 between the intermediate mold 4 and the lower mold main body 3 and the base 14. On the other hand, it is configured to be slidable up and down.
Therefore, the release film 9 is moved down with the intermediate mold 4 and the sandwiching member 15 sandwiched, so that the release film 9 is attracted to the mold surface of the lower mold 3 and the lower mold cavity 8. It is comprised so that it can coat | cover.

(About positioning pins)
In addition, a required number of board positioning pins 16 for positioning the position of the board 14 to be supplied and set to the board setting section 7 of the upper mold 2 are erected on the mold surface of the lower mold (lower mold main body) 3. Configured.
Further, the positioning pin 16 has a pointed end, the tip side (upper end side) is formed in a pointed shape (pointed shape), and the base end side (lower end side) is formed on the mold surface of the lower mold 3. It is fixed and configured.
The substrate 6 is configured by being provided with substrate positioning holes (substrate through holes) 17 corresponding to the positioning pins 16 of the lower mold 3.
Accordingly, the positioning pin 16 of the lower mold 3 is fitted (penetrated) into the positioning hole 17 of the substrate from the distal end side thereof so that the base end side (the mold surface of the lower mold 3 will be described later). Or the positioning hole 17 (substrate 6) of the substrate can be positioned at an intermediate portion between the distal end and the proximal end (see FIGS. 3, 4, and 5).
In addition, a positioning insertion hole 18 of a positioning pin corresponding to the positioning pin 16 of the lower mold 3 is provided on the mold surface (substrate set portion 7) of the upper mold 2.
Accordingly, the positioning pin 16 fitted in the positioning hole 17 of the substrate can be inserted into the positioning insertion hole 18 of the upper mold from the front end side and accommodated.

Further, the release film 9 stretched between the intermediate die 4 and the lower die 3 is sandwiched between the intermediate die 4 and the sandwiching member 15 and moved downward, whereby the positioning pin 16 having a sharp tip (the sharp tip). Then, a required portion of the release film 9 that has been sandwiched can be pierced and penetrated to make a hole (hole 19) in the release film 9.
At this time, the release film 9 having the hole 19 is located at the position of the hole 19, and the release film 9 (hole 19) is positioned on the proximal end side of the positioning pin 16 (the mold surface of the lower mold 3). It is comprised so that it can be made to.
At this time, the release film 9 can be covered on the inner surface of the lower mold cavity 8.
Further, the positioning pin 16 penetrating (penetrating) through the release film 9 is fitted (fitted) into the positioning hole 17 of the substrate 6, thereby matching the position of the positioning hole 17 of the substrate 6 with the position of the positioning pin 16. It is comprised so that it can be made to.
Further, when the mold 1 (2, 3, 4) is clamped, the positioning pin 16 penetrating (fitting) the release film 9 and the substrate positioning hole 17 is used as the positioning insertion hole 18 of the positioning pin in the upper mold 2. It is comprised so that it can penetrate and accommodate.
At this time, the substrate 6 can be supplied and set to the substrate setting portion 7 of the upper mold 2.
Therefore, when the substrate 6 is supplied and set to the substrate setting portion 7 (required position of the upper die 2) of the upper die 2, the positioning pins 16 of the lower die 3 can be fitted into the positioning holes 17 of the substrate to be matched. (In addition, since the positioning pin 16 fitted in the positioning hole 17 of the substrate can be inserted and accommodated in the insertion hole 18 of the positioning pin of the upper mold), the substrate 6 can be efficiently stored in the substrate setting portion 7. It can be positioned and set.

(About movable support pins)
Further, the mold surface of the lower mold (main body) 3 is provided with a required number of movable support pins 20 that elastically move up and down while supporting the substrate 6 so as to protrude from the mold surface of the lower mold. Has been.
Further, an elastic member 21 such as a compression spring is configured to be able to elastically urge the movable support pin 20 upward on the base end side (lower end side) of the movable support pin 20.
Further, when the mold release film 9 is coated on the mold surface of the lower mold 3 and the lower mold cavity 8, the mold support film 20 is covered with the mold release film 9 in a state in which the movable support pins 20 protrude from the mold surface of the lower mold 3. It is configured to be able to.
Accordingly, the substrate 6 can be supported by the movable support pin 20 in a state where the movable support pin 20 is covered with the release film 9, that is, through the release film 9.
At this time, the substrate 6 is moved to the required height (distance) 22 with the movable support pin 20, that is, to the distance (22) from the mold surface position of the lower mold 3 to the tip position of the movable support pin 20. And can be held (see FIG. 3).
At this time, the movable support pin 20 is configured to be able to support and hold the substrate 6 in a horizontal plane state.

Further, as described above, the movable support pin 20 can be used to support the substrate 6 in a horizontal plane state and hold it at a required height 22 from the mold surface position of the lower mold 3. Even if there is a variation in the height of the resin material (10) heated and melted in the mold cavity 8, the substrate 6 and the semiconductor chip are not efficiently contacted with the heat-melted resin material (10). Has been.
Further, by closing the semiconductor chip mounting surface of the substrate 6 supplied and set to the substrate setting unit 7 and the mold surface of the lower mold 3 through the release film 9, the mold 1 (2, 3, 4) is closed. When the mold is completely clamped, the movable support pin 20 is configured to be accommodated in the lower mold 3 by being pressed downward by the substrate 6 (upper mold 2).

(About the compression molding method of the semiconductor chip in Example 1)
First, as shown in FIG. 1, a release film 9 is stretched between the intermediate mold 4 and the clamping member 15 of the lower mold 3.
Next, the release film 9 is sandwiched between the intermediate mold 4 and the sandwiching member 15, and the release film 9 is moved downward while being sandwiched between the intermediate mold 4 and the sandwiching member 15.
Therefore, as shown in FIG. 2, the release film 9 that has moved down can be adsorbed onto the mold surface of the lower mold 3 and the lower mold cavity 8.
At this time, the release film 9 can be formed by piercing and penetrating the downwardly moving release film 9 with the positioning pins 16 erected on the lower mold 3 surface. .
At this time, the movable supporting pin 20 can be covered with the release film 9 in a state where the movable supporting pin 20 protrudes from the mold surface of the lower mold 3.
Further, at this time, the mold surface position of the lower mold body 3 can be positioned in a loosely fitted state in the loose fitting hole 5 of the intermediate mold 4.

Next, the resin material 10 can be supplied into the lower mold cavity 8 covered with the release film 9 and melted by heating.
Next, the substrate 6 is supplied and set at a required position of the lower die 3 in the loose fitting hole 5 of the intermediate die 4 with the semiconductor chip mounting surface side facing downward.
At this time, as shown in FIG. 3, the positioning pins 16 can be fitted into the positioning holes 17 of the substrate so as to be matched.
At this time, the substrate 6 is held at a required height (distance) 22 from the mold surface of the lower mold 3 and in a horizontal plane state with the movable support pin 20 covered with the release film 9. Can do.
Accordingly, the substrate 6 (and the semiconductor chip) is configured not to contact the resin material (10) heated and melted in the lower mold cavity 8.

Next, as shown in FIG. 4, the substrate 6 is supported at the required height (22) by the movable receiving pin 20 through the release film 9, and the positioning pin is inserted into the positioning hole 17 of the substrate 6. By moving the lower mold 3 and the intermediate mold 4 up in a state where 16 is matched, the substrate 6 can be supplied and set to the substrate setting section 7 of the upper mold.
At this time, for example, as shown in FIG. 4, a mold for intermediately clamping a mold that abuts the tip of the outside air blocking member 11 on the mold surface of the upper mold 2 and the upper mold side mold surface of the intermediate mold 4. It is possible to perform intermediate mold clamping.
At this time, the space between the semiconductor chip mounting surface of the substrate 6 and the mold surface of the lower mold 3 can be held at a required interval (distance) 12.
Therefore, the surface of the substrate 6 (semiconductor chip mounting surface) and the semiconductor chip can be configured not to efficiently contact the resin material (10) heated and melted in the lower mold cavity 8.

Further, as described above, at this time, the substrate 6 can be supplied (adsorbed) to the substrate setting portion 7 of the upper mold 2 with the semiconductor chip mounting surface side facing downward.
At this time, at least the inside of the lower mold cavity 8 can be blocked by the outside air blocking member 11 provided on the mold surface of the upper mold 2 to form the outside air blocking space.
Therefore, by forcibly sucking and discharging air from the outside air blocking space, the outside air blocking space can be set to a required degree of vacuum.
At this time, the positioning pin 16 fitted with the positioning hole 17 of the substrate 6 is inserted and accommodated in the positioning pin insertion hole 18 in the mold surface (substrate setting portion 7) of the upper mold 2.
Therefore, the positioning pin 16 fitted and matched with the positioning hole 17 of the substrate 6 is inserted into the insertion hole 18 of the positioning pin of the upper mold 2 and accommodated, thereby efficiently positioning the substrate 6 in the substrate setting portion 7. (Accurate) can be set.

Next, as shown in FIG. 5, the mold 1 (2, 3, 4) is formed by closing the semiconductor chip mounting surface of the substrate 6 and the mold surface of the lower mold 3 with a release film 9 therebetween. The mold can be completely clamped.
At this time, the mold surface of the upper mold 2 and the upper mold side mold surface of the intermediate mold 4 are closed.
Further, as described above, at this time, the positioning pin 16 fitted and matched with the positioning hole 17 of the substrate 6 is inserted and accommodated in the insertion hole 18 of the positioning pin of the upper mold 2.
At this time, since the movable support pin 20 covered with the release film 9 is pressed downward by the substrate 6 (upper mold 2), the movable support pin 20 is accommodated in the lower mold 3. become.
Therefore, next, the cavity bottom member 13 is moved upward to press the resin (10) in the lower mold cavity 8 with the cavity bottom member 13, so that the semiconductor chip mounted on the substrate 6 is brought into the lower mold cavity 8. It can be compression molded.
After the time required for curing has elapsed, the mold 1 (2, 3, 4) is opened to be mounted on the substrate 6 in the resin mold corresponding to the shape of the lower mold cavity 8 in the lower mold cavity 8. The formed semiconductor chip can be compression-molded (resin-sealed molding).

(About the effect of Example 1)
That is, in the first embodiment, as shown in FIG. 4, the positioning pin 16 is fitted in the positioning hole 17 of the substrate 6 while the substrate 6 is supported by the movable supporting pin 20 through the release film 9. The substrate 6 can be supplied (adsorbed) to the substrate setting portion 7 of the upper mold 2 with the semiconductor chip mounting surface facing downward while being fitted.
Therefore, as described above, when the substrate 6 is supplied and set to the substrate setting portion 7, the positioning pin 16 fitted and matched with the positioning hole 17 of the substrate 6 is inserted into the positioning pin insertion hole 18 of the upper mold 2. By inserting and accommodating, the substrate 6 can be efficiently positioned and set on the substrate setting portion 7.

In the first embodiment, as shown in FIG. 4, when the substrate 6 is supplied and set to the substrate setting unit 7, the gap between the semiconductor chip mounting surface of the substrate 6 and the mold surface of the lower mold 3 is set at a required interval 12. Can be held.
Therefore, the surface (semiconductor chip mounting surface) of the substrate 6 and the semiconductor chip can be configured not to efficiently contact the resin material (10) heated and melted in the lower mold cavity 8.

(About the compression molding method of the other semiconductor chip in Example 1)
In Example 1, before supplying the resin material 10 into the lower mold cavity 8 covered with the release film 9, first, the substrate 6 is supplied to the lower mold 3 side, and the lower mold 3, the intermediate mold 4, The substrate 6 is supplied and set to the substrate setting unit 7, and then the lower mold 3 and the intermediate mold 4 are moved downward to cover the release film 9 with the resin material in the lower mold cavity 8. 10 may be employed.
That is, in the state shown in FIG. 2, that is, in a state where the resin material 10 is not supplied into the lower mold cavity 8 covered with the release film 9, the substrate 6 can be supplied and set first.
In this case, as described above, the hole 19 can be formed in the release film 9 by piercing and penetrating the release film 9 with the positioning pins 16.
In this case, as described above, the substrate 6 can be supported by the movable support pins 20 via the release film 9.
Further, in this case, the positioning pin 16 fitted and matched with the positioning hole 17 of the substrate 6 is inserted into the insertion hole 18 of the positioning pin of the upper mold 2 and accommodated therein, whereby the substrate 6 is accommodated in the substrate setting portion 7. Can be positioned and supplied efficiently.

Next, Example 2 is described with reference to FIGS. 6, 7 (1), 7 (2), 8 (1), 8 (2), 9 (1), 9 (2), and 10 ( 1) and will be described in detail with reference to FIG.
The basic configuration of the semiconductor chip compression mold used in the second embodiment is the same as that of the first embodiment.

(About the structure of the semiconductor chip compression molding die in Example 2)
A semiconductor chip compression mold 31 (semiconductor chip resin mold) in the second embodiment shown in FIG. 6 is disposed opposite to the fixed upper mold 32 and the upper mold 32 as in the first embodiment. The movable lower mold (not shown) is provided.
In addition, on the mold surface of the upper mold 32 in the mold 31 used in the second embodiment, there is a substrate setting section 34 for supplying and setting the substrate 33 on which the semiconductor chip is mounted with the semiconductor chip mounting surface side facing downward. It is provided and configured.
Although not shown, the lower mold includes a lower mold cavity for compression molding (resin sealing molding) of a semiconductor chip mounted on a substrate, and a bottom surface of the cavity provided on the bottom surface of the lower mold cavity. And a member.
Further, although not shown in the figure, like the first embodiment, the lower mold cavity can be covered with the release film.
Although not shown, as in the first embodiment, a configuration in which the release film is sandwiched between the intermediate mold and the lower mold (for example, the clamping member shown in the first embodiment) may be employed.

Although not shown, the mold 31 has a substrate supply mechanism for supplying and setting a substrate 33 with a semiconductor chip mounted on the substrate setting portion 34 with the semiconductor chip mounting surface facing downward, A resin material supply mechanism for supplying the resin material into the mold cavity is provided.
Accordingly, the substrate 33 is supplied and set to the substrate set portion 34 by the substrate supply mechanism with the semiconductor chip mounting surface side facing downward, and the resin material is released (release film) by the resin material supply mechanism. It is configured so that it can be fed into the lower mold cavity.

That is, in the second embodiment, as in the first embodiment, first, the substrate 33 on which the semiconductor chip is mounted is supplied and set to the substrate setting portion 34 with the semiconductor chip mounting surface side facing downward, and the separation is performed. A resin material is supplied into the lower mold cavity coated with the mold film to melt by heating, and the mold is clamped.
At this time, the semiconductor chip can be immersed in a resin material heated and melted in the lower mold cavity.
Next, the heat-melted resin material in the lower mold cavity is pressed with a required pressing force by the cavity bottom surface member.
Therefore, after the time required for curing has elapsed, the semiconductor chip mounted on the substrate can be compression-molded (resin-sealed molding) in the resin-molded body corresponding to the shape of the lower mold cavity in the lower mold cavity.

(About positioning reference pins)
Further, a positioning reference pin for determining a position where the substrate 33 is supplied and set is provided at a required position in the substrate setting portion 34 of the upper mold 32.
That is, in the example shown in FIG. 6, two reference pins 35 are provided in the X direction, and the two reference pins 35 arranged in the X direction are used for the X-direction reference line (X reference line). ) Is formed.
Further, in the example shown in FIG. 6, two reference pins 36 are provided in the Y direction, and the two reference pins 36 arranged in the Y direction are used for the reference line in the Y direction (Y reference line). ) Is formed.
Normally, in the substrate setting part 34, the required angle formed by the X reference line and the Y reference line is formed at a right angle.

(About four sides on the board)
The substrate 33 used in the second embodiment is usually formed in a rectangular shape having four sides (lines), and as shown in FIG. The side of the substrate corresponding to the reference line is set as A side, the side of the substrate corresponding to the Y reference line is set as B side, the side of the substrate arranged opposite to the A side and adjacent to the B side is set as C side, Let it be the D side of the substrate that is oppositely disposed and is adjacent to the A side (C side).
Since the substrate 33 is usually rectangular, the required angle formed by the A side and the B side of the substrate is a right angle.
The names of the A side, the B side, the C side, and the D side in the substrate 33 supplied and set to the substrate setting unit 34 are used corresponding to the positions in the substrate setting unit 34, and the A side in the substrate setting unit 34 is used. , B side, C side, and D side.

(About the relationship between the reference pin and the side of the board)
That is, as will be described later, in the second embodiment, by pressing the C side of the substrate 33, the A side of the substrate 33 is pressed and brought into contact with the reference pin 35 arranged in the X direction so that the X reference line is obtained. It is configured to be able to match.
Further, as will be described later, by pressing the D side of the substrate 33, the B side of the substrate 33 can be pressed and brought into contact with the reference pin 36 arranged in the Y direction so as to match the Y reference line. It is configured.
Therefore, as will be described later, in the second embodiment, the substrate set unit 34 is moved by pressing the substrate 33 separately and simultaneously from the corresponding sides of the substrate 33 against the X reference line and the Y reference line. Is to be positioned.

As will be described later, a substrate locking mechanism 37 is disposed outside the position corresponding to the A side of the substrate setting portion 34 in the substrate setting portion 34.
Further, a substrate shifting mechanism 38 to the X reference line is disposed outside the position corresponding to the C side of the substrate setting portion 34.
Further, a substrate shifting mechanism 39 to the Y reference line is arranged outside the position corresponding to the D side of the substrate setting portion 34.
Further, as described above, an X reference line (a line formed by two reference pins 35 in the X direction) is arranged on the position side corresponding to the A side of the substrate setting unit 34.
Further, as described above, the Y reference line (line formed by the two reference pins 36 in the Y direction) is arranged on the position side corresponding to the B side of the substrate setting portion 34.

(Regarding the board alignment mechanism)
That is, as described above, the substrate set portion 34 on the mold surface of the upper mold 32 is connected to the reference line (reference pin 35) in the X direction by moving (pressing) the substrate 33 to the X reference line. Substrate alignment mechanism (X substrate alignment mechanism) 38 and substrate alignment mechanism to the Y reference line (Y substrate alignment mechanism) that engages (presses) the substrate 33 with the reference line (reference pin 36) in the Y direction. 39 (see FIG. 6).
Accordingly, the substrate 33 is moved by the X substrate moving mechanism 38 so that the side A of the substrate 33 can be brought into contact with the reference pin 35, and the substrate 33 is moved by the Y substrate moving mechanism 39 to move the B of the substrate 33. The side can be brought into contact with the reference pin 36.
In addition, the X substrate shifting mechanism 38 is provided at a position opposite to the reference line (reference pin 35) in the X direction in the substrate setting portion 34 (outside the C side in the substrate setting portion 34). At the same time, the Y substrate shifting mechanism 39 is configured to be provided at a position opposite to the reference line (reference pin 36) in the Y direction (outside the D side in the substrate setting portion 34).
In addition, the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 37 are configured to operate simultaneously in conjunction with a connection mechanism described later.
Therefore, as will be described later, when the substrate 33 is supplied and set to the substrate setting unit 34, the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 39 are operated simultaneously, and the X and Y reference lines (reference pins 35, 36), each side A and B of the substrate 33 is pressed separately, so that the substrate 33 can be efficiently positioned by the substrate setting portion 34.

(Regarding the structure of the substrate alignment mechanism to the X reference line)
That is, as shown in FIGS. 6 and 7 (1), the substrate alignment mechanism (X substrate alignment mechanism) 38 to the X reference line is an X-direction reference line (two reference pins 35) in the substrate setting unit 34. It is configured to be provided on the position side facing the line to be formed) (that is, on the C side side in the substrate setting unit 34).
In addition, the X substrate abutting mechanism 38 is configured by being provided with a pressing latch piece (small piece) 40 for latching the substrate pressing that presses the C side of the substrate 33 and locks it toward the X reference line. In addition, in the illustrated example, two press locking pieces 40 are provided along the C side of the substrate setting portion 34.
That is, by pressing the substrate 33 in the direction toward the reference pin 35 with the pressing and locking piece 40, the reference pin 35 and the pressing and locking piece 40 work together. It can be efficiently locked to the set portion 34 and supplied and set.
Accordingly, the substrate 33 can be efficiently locked to the substrate setting portion 34, and the substrate 33 can be efficiently positioned on the substrate setting portion 34.
In addition, these two press locking pieces 40 can be provided and configured in a state (substantially) parallel to the X reference line.

In addition, the X substrate moving mechanism 38 includes two pressing members (pressing rods) 41 that press the two pressing locking pieces 40 separately, corresponding to the positions of the pressing locking pieces 40. ing.
In addition, the X substrate alignment mechanism 38 is configured by being provided with one rotation shaft (rotation shaft) 42 and two support bases 43.
In addition, one rotating shaft 42 is provided between the two support bases 43 so as to be rotatable.
Further, the pressing member 41 is mounted on the support base 43 so as to be rotatable by the rotating shaft 42, and the rotating shaft 42 is provided at an intermediate portion of the pressing member 41.
Therefore, the support base 43 is configured such that the pressing member 41 can be reciprocally rotated (rotated) between the required angles by the rotation shaft (rotation shaft) 42.
Further, by rotating the pressing member 41 around the rotation shaft 42 as the rotation axis, the distal end portion 41a of the pressing member 41 is (rotated) pressed against the pressing locking piece 40, thereby pressing the pressing locking piece 40 (its base end). It is configured such that it can be deformed (pressed and curved) by tilting in the direction of the reference pin 35 (X reference line) with the side fixed.
Therefore, the substrate can be brought close to the reference pin 35 (X reference line) by the pressing locking piece 40 pressed by the pressing member 41 and locked, so that the substrate 33 can be supplied and set to the substrate setting portion 34. It is configured as follows.
In addition, the support base 43 is configured such that a “torsion spring 44” is mounted on the rotating shaft 42 as an elastic biasing member that elastically biases the pressing member 41.
That is, the “torsion spring (elastic urging member) 44” is configured to be able to elastically urge and press the front end portion 41a of the pressing member 41 to the substrate set portion 34 (the mold surface of the upper die 32). ing.
Therefore, the state in which the tip end portion 41a of the pressing member 41 is pressed against the substrate setting portion 34 can be set to the closed state of the pressing member.
In addition, a shaft 45 is provided on the terminal side opposite to the tip side 41a of the pressing member 41 in the X substrate shifting mechanism 38, and in the pressing member 41, the tip portion 41a, The rotating shaft 42 (intermediate portion) and the shaft 45 (terminal portion) are arranged in this order.

In addition, the X substrate shifting mechanism 38 is provided with a pusher (not shown) that presses the shaft 45 on the distal end side of the pressing member 41 toward the upper mold 32 (upward).
Therefore, when the shaft 45 is pressed upward by the pusher, the distal end portion 41a of the pressing member 41 is directed in the direction of the lower mold with the rotating shaft 42 provided at the intermediate portion of the pressing member 41 in the support base 43 as a fulcrum ( It will rotate (turn down) at the required angle.
At this time, the front end portion 41a of the pressing member 41 can be configured from the closed state of the pressing member to the open state of the pressing member.
Further, by releasing the upward pressure on the shaft 45 by the pusher, the distal end portion 41 a of the pressing member 41 is pressed upward by the elastic action of the “torsion spring 44”, and the distal end portion 41 a of the pressing member 41 is It is possible to return to the original state by closing the pressing member.
That is, the distal end portion 41a of the pressing member 41 is reciprocally rotated (rotated) at a required angle in the vertical direction with the rotation shaft 42 as a fulcrum.

(Regarding the configuration of the substrate alignment mechanism to the Y reference line)
In other words, the Y reference line has a substrate reference mechanism (Y substrate alignment mechanism) 39 in which two pressing locking pieces 46 are formed by two reference pins 36 as in the case of the X substrate alignment mechanism 38. Corresponding to the line (B side of the substrate setting part 34), it is arranged outside the D side of the substrate setting part 34.
Similarly to the X substrate shifting mechanism 38, the Y substrate shifting mechanism 39 includes a pressing member 47, a support base 48 on which the pressing member 47 is mounted, and a rotation shaft (rotation) provided at an intermediate portion of the pressing member 48. (Dynamic axis) 49, a “torsion spring 50” mounted on the rotary shaft 49 by the support base 48, and a shaft 51 provided on the terminal side of the pressing member 47 are provided.
Further, the Y substrate shifting mechanism 39 can be set by opening the distal end portion 47a of the pressing member 47 from the closed state of the pressing member to the open state in conjunction with the X substrate shifting mechanism 38 by a connecting mechanism described later. It is configured.
In other words, in the Y substrate shifting mechanism 39, as in the X substrate shifting mechanism 38, the tip end portion 47a of the pressing member 47 is pressed upward by the elastic action of the “torsion spring 50”. As described above, the front end portion 47a of the pressing member 47 can be reciprocally rotated (rotated) at a required angle in the vertical direction.
At this time, the front end portion 47a of the pressing member 47 can be set by opening from the closed state of the pressing member to the open state.
Note that, similarly to the X substrate alignment mechanism 38, the Y substrate alignment mechanism 39 can be configured with a pusher (not shown) that presses the shaft.

(Pressing action of the pressing member)
Next, with reference to FIGS. 8A and 8B, when the substrate 33 is supplied and set to the substrate setting portion 34 and pressed and locked by the X substrate shifting mechanism 38, the tip of the pressing member 41 is used. The effect | action which the part 41a presses the press locking piece 40 is demonstrated.
8 (1) shows a state before the board is brought into engagement and locked (open state of the board approach mechanism), and FIG. 8 (2) shows a state when the board is brought in and out (closed state of the board approach mechanism). Show.

For example, the substrate 33 is moved up from the substrate supply mechanism on which the substrate 33 is placed, and is supplied and set to the substrate setting unit 34 provided on the mold surface of the upper mold 32.
At this time, as shown in FIG. 8 (1), the tip end portion 41a of the pressing member 41 and the pressing locking piece 40 of the substrate set portion 34 are in a separated state. In the example shown in FIG. The substrate 33 is configured to be supplied and set to the substrate setting portion 34 in a state where the substrate 33 is not in contact with the reference pin 35 and the press locking piece 40 (with a gap).
Therefore, next, as shown in FIG. 8 (2), by rotating the tip 41a of the pressing member 41 toward the substrate setting portion 34, the pressing member (pressing bar) 41 is brought into a horizontal state to be in a closed state. The pressing locking piece 40 can be pressed by the tip portion 41 a of the pressing member 41.
At this time, the pressing member 41 is configured so that the pressing locking piece 40 can be pressed and bent toward the substrate 33 side (from the front end side).
At this time, the substrate 33 (the C side) is pressed by the pressing member 41 to the reference pin 35 side via the pressing locking piece 40, thereby bringing the substrate 33 (the A side) into the reference pin 35. The substrate 33 can be pressed and locked, and the substrate 33 can be locked to the substrate setting portion 34 and supplied and set.

For example, first, in the X substrate shifting mechanism 38, the pressing member 41 is rotated to close the pressing member 41, whereby the pressing locking piece 40 is pressed by the distal end portion 41a of the pressing member 41, and then the pressing member 41 is pressed. By pressing the C side of the substrate with the locking piece 40, the A side of the substrate can be pressed (contacted) with the X reference line (the reference pin 35 in the X direction).
At this time, at the same time, the pressing member 47 is rotated in the Y substrate shifting mechanism 39 to close the pressing member, thereby pressing the pressing locking piece 46 with the tip 47a of the pressing member 47, and then By pressing the D side of the substrate 33 with the pressing locking piece 46, the B side of the substrate 33 can be pressed (contacted) with the Y reference line (the reference pin 36 in the Y direction).
Therefore, the substrate 33 supplied and set to the substrate setting unit 34 is pressed against the X reference line (X direction reference pin 35) and the Y reference line (Y direction reference pin 36) separately and simultaneously. Therefore, the substrate 33 supplied and set to the substrate setting unit 34 can be positioned efficiently.

(Regarding the pressing action and reaction of the pressing locking piece)
That is, the press locking pieces 40 and 46 are configured to be curved toward the substrate set portion 34 side by being pressed by the pressing members 41 and 47 that are rotated and closed. can do.
At this time, the pressing locking pieces 40 and 46 press the sides of the substrate 33, and the reference pins 35 and 36 and the pressing locking pieces 40 and 46 work together to bring the substrate 33 into the substrate setting portion 34. It can be locked and set for supply.
Moreover, by pressing the pressing members 41 and 47 to be in the open state, the pressing of the pressing locking pieces 40 and 46 by the pressing members 41 and 47 can be released.
At this time, the pressing locking pieces 40 and 46 (tip portions thereof) are configured to return to the original state (return to the original shape and position) by the reaction to the pressing action by the pressing members 41 and 47.
When the press locking pieces 41 and 47 are formed of metal pieces, the press locking pieces 40 and 46 pressed by the pressing members 41 and 47 return to the original state by the spring back action. become.

(About connection mechanism)
Next, by using FIG. 9 (1), FIG. 9 (2), FIG. 10 (1), and FIG. The connecting mechanism 52 for positioning the substrate by simultaneously pressing in two directions will be described.
9 (1) and 10 (1) show the state of the coupling mechanism 52 when the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 39 are closed.
FIGS. 9 (2) and 10 (2) show the state of the coupling mechanism when the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 39 are in the open state.

That is, as shown in the figure, the connecting mechanism 52 that simultaneously opens and closes the X-substrate alignment mechanism 38 and the Y-substrate alignment mechanism 39 is connected to the rotation shaft 42 of the X-substrate alignment mechanism 38 in the axial direction. The part 53 and the notch plane part 54 provided by notching the rotating part 53 in a state parallel to the axial direction are provided.
Therefore, the rotating shaft 42 of the X substrate shifting mechanism 38 and the rotating portion 53 having the notched flat surface portion 54 are configured to rotate (turn) with the same axial direction as the axis of rotation.
At this time, the entire cutout flat surface portion 54 of the rotating portion 53 is configured to rotate about the axis of the rotation shaft 42.
The connection mechanism 52 is provided with an arm 55 that rotates (rotates) the rotation shaft 49 of the Y substrate shifting mechanism 39.
Further, the connecting mechanism 52 is configured such that the connecting rod 56 placed and placed on the notch plane portion 54 in a direction perpendicular to the axial direction of the rotating portion 53 is not fixed. Has been.

In addition, a rotation shaft 49 of the Y substrate shifting mechanism 39 is fixed to one end side of the arm 55 in a right angle direction, and a connecting rod 56 is fixed to the end side of the arm 55 in a right angle direction. .
Accordingly, by rotating (rotating) the rotation shaft 42 (rotating portion 53) of the X substrate shifting mechanism 38 at a required angle, the connecting rod 56 is pivoted at the notch plane portion 54 of the rotating portion 53. It is configured such that it can be moved in a horizontal direction with a curved line drawn in the vertical direction.
Further, the arm 55 can be rotated about the rotation shaft 49 of the Y substrate shifting mechanism 39 by moving the connecting rod 56 in a horizontal direction with a curved line (arc). It is configured to be able to.
Accordingly, the rotation shaft 49 of the Y substrate shifting mechanism 39 can be rotated by rotating the arm 55.

That is, as shown in FIGS. 9 (1) and 10 (1), when the notch plane portion 54 is in a horizontal plane state, the X substrate alignment mechanism 38 (rotary shaft 42), the Y substrate alignment mechanism 39 (rotational shaft 49), Is in a closed state and the connecting rod 56 in the horizontal state of the axial direction is not fixed to the notch plane portion 54 but is in contact with and attached to the notch plane portion.
Further, as shown in FIGS. 9 (2) and 10 (2), when the rotation shaft 42 of the X-substrate alignment mechanism 38 is rotated (rotated) at a required angle, the notch of the rotated rotating portion 53 is obtained. The flat surface portion 54 is inclined to the opposite side to the substrate setting portion 34 to become an inclined surface, and the connecting rod 56 is moved in a curved line upward to set the connecting rod 56 on the upper edge of the inclined surface. can do.
At this time, the rotation axis 49 of the Y substrate alignment mechanism 39 is rotated (rotated) by a required angle by the connecting rod 56, so that the Y substrate alignment mechanism 39 can be set in the open state.
Accordingly, by opening and closing the X substrate shifting mechanism 38 (the pressing member 41), the connecting mechanism 52 can simultaneously open and close the Y substrate shifting mechanism 39 (the pressing member 46). .
9 (2) and 10 (2), reference numeral 62 indicates the distance that the connecting rod 56 moves while drawing a curve (arc) in the vertical direction.
In FIG. 10B, reference numeral 63 indicates an angle at which the arm 55 rotates.

(About the board locking mechanism)
Further, in the second embodiment, as shown in FIGS. 6 and 7 (2), a substrate locking mechanism 37 for locking the substrate 33 to the substrate setting portion 34 is provided as an auxiliary.
The basic configuration of the board locking mechanism 37 is the same as that of the board shifting mechanisms 38 and 39 described above.
That is, as shown in the drawing, the substrate locking mechanism 37 is rotated (rotated) to rotate (rotate) the substrate pressing member (grip member) 57 that presses (or releases) the substrate 33 and the substrate pressing member 57 ( A rotating shaft 58 that rotates), a support base 59 that supports the rotating shaft 58 rotatably (rotatably) and supports the substrate pressing member 57 rotatably (rotatably), and a support A “torsion spring 60” that is mounted on the rotary shaft 58 at the position of the base 59 and presses and biases the substrate pressing member 57 toward the substrate set portion 34 (the mold surface side of the upper mold 32), and the substrate via the rotary shaft 58. A shaft 61 provided on the side opposite to the set portion 34 and a pusher (not shown) for pressing the shaft 61 are provided.
In the support base 59, the substrate pressing member 57 is configured to reciprocate (rotate) at a required angle around the rotation shaft 58 supported by the support base 59.

Accordingly, the front end portion 57a of the substrate pressing member 57 can be separated from the substrate setting portion 34 and pressed from the closed state by pressing the shaft 61 upward with the pusher.
Further, by releasing the pressure on the shaft 61 by the pusher, the front end portion 57a of the substrate pressing member 57 is pressed against the substrate setting portion 34 so that the substrate 33 can be (supplementally) locked. ing.
In the substrate setting portion 34, two reference pins 35 in the X direction are arranged between the tip portions 57a of the two substrate pressing members 57.

(About the semiconductor chip compression molding method in Example 2)
That is, in the second embodiment, first, the substrate 33 on which the semiconductor chip is mounted is supplied and set on the substrate setting portion 34 of the upper mold 32 with the semiconductor chip mounting side facing downward. (At this time, in the board setting portion 34, it is usual that a gap exists between the board 33 and the positioning reference pins 35, 36 or the press locking pieces 40, 46.)
At this time, by pressing the shaft 45 in the X substrate abutting mechanism 38 upward with a pusher, the X substrate abutting mechanism 38 and the Y substrate abutting mechanism 39 are simultaneously opened in conjunction with the connecting mechanism 52. Yes.
Next, by releasing the shaft 45 in the X substrate abutting mechanism 38 from the pressing of the pusher, the X substrate abutting mechanism 38 and the Y substrate abutting mechanism 39 can be simultaneously interlocked by the connecting mechanism 52 to be closed. .
At this time, the C-side of the substrate 33 is pressed by pressing the pressing locking piece 40 with the X-board-feeding mechanism 38 (the tip 41a of the pressing member 41), and the A-side of the substrate 33 is pressed against the X reference line. Thus, positioning can be performed (the A side of the substrate 33 is in contact with the reference pin 35).
At this time, by pressing the pressing locking piece 46 with the Y substrate shifting mechanism 39 (the tip portion 47a of the pressing member 47), the D side of the substrate 33 is pressed, and the B side of the substrate 33 is set to the Y reference line. (The B side of the substrate 33 is brought into contact with the reference pin 36) for positioning.
That is, by simultaneously setting the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 39 to the closed state, the X substrate alignment mechanism 38 and the Y reference line (reference pin 36) are simultaneously pressed and positioned. can do.
Therefore, the substrate 33 can be efficiently positioned and set on the substrate setting portion 34 by the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 39 in the second embodiment.

  In the second embodiment, since the X substrate alignment mechanism 38 and the Y substrate alignment mechanism 39 are used for positioning the substrate 33, it is not necessary to provide positioning holes corresponding to the alignment pins in the substrate.

  Further, in the second embodiment, the X substrate shifting mechanism 38 and the Y substrate shifting mechanism 39 are simultaneously closed, and the substrate 33 can be supplementarily locked by the substrate locking mechanism 37.

  In the second embodiment, the substrate locking mechanism 37, the X substrate shifting mechanism 38, and the Y substrate shifting mechanism 39 are interlocked with each other, and the substrate locking mechanism 37, the X substrate shifting mechanism 38, and the Y substrate shifting mechanism 39 are combined. The structure which opens and closes simultaneously is employable.

  In the second embodiment, the semiconductor check compression molding die 31 for compression check is used as an example. However, the positioning configuration (substrate shifting mechanisms 38 and 39) according to the present invention is used for the transfer molding method. It can be employed in a resin-sealing mold for semiconductor chips (molds having resin passages such as pots, plungers, runners and gates, and cavities for resin molding).

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

FIG. 1 is a schematic longitudinal sectional view schematically showing a semiconductor chip compression molding die (semiconductor chip resin molding die) according to the present invention, showing the mold open state. (Example 1). FIG. 2 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 1 and shows a state in which a release film is pierced with a positioning pin (Example 1). FIG. 3 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 1, in which a positioning pin is inserted through and aligned with a positioning hole of the substrate, and the substrate is supported by a movable supporting pin. (Example 1). FIG. 4 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 1, and shows a state in which a substrate is supplied and set to an upper mold substrate setting portion (Example 1). FIG. 5 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 1 and shows a mold clamping state of the mold (Example 1). FIG. 6 is a schematic plan view schematically showing another semiconductor chip compression molding die (semiconductor chip resin molding die) according to the present invention, showing an upper die surface. (Example 2). 7 (1) and 7 (2) are enlarged schematic vertical sectional views schematically showing an enlarged main part of the upper die shown in FIG. 6, and FIG. 7 (1) is an upper die substrate. FIG. 7 (2) shows the board locking mechanism (Example 2). 8 (1) and FIG. 8 (2) are enlarged schematic longitudinal sectional views schematically showing an enlarged main part of the upper-type substrate shifting mechanism shown in FIG. 7 (1). ) Shows a state before the substrate is brought into engagement (open state of the substrate attachment mechanism), and FIG. 8 (2) shows a state when the substrate is brought in engagement (closed state). 2). FIGS. 9 (1) and 9 (2) are enlarged schematic longitudinal sectional views schematically showing an enlarged main part (coupling mechanism) of the upper mold, and FIG. The closed state is shown, and FIG. 9B shows the open state of the substrate shifting mechanism (Example 2). FIGS. 10 (1) and 10 (2) are enlarged schematic longitudinal sectional views schematically showing an enlarged main part (coupling mechanism) of the upper die, and FIG. 10 (1) is FIG. 9 (1). 10 (2) corresponds to FIG. 9 (2) (Example 2).

1 Mold for compression molding of semiconductor chip (mold for resin sealing molding of semiconductor chip)
2 Fixed upper mold 3 Movable lower mold 4 Intermediate mold 5 Free fitting hole (through hole)
6 Substrate 7 Substrate setting portion 8 Lower mold cavity 9 Release film 10 Resin material 11 Outside air blocking member 12 Required interval (distance)
DESCRIPTION OF SYMBOLS 13 Cavity bottom member 14 Base 15 Clamping member 16 Substrate positioning pin 17 Substrate positioning hole 18 Positioning pin insertion hole 19 Hole (release film)
20 Movable bearing pin 21 Elastic member 22 Required height (distance)
31. Mold for compression molding of semiconductor chip (mold for resin sealing molding of semiconductor chip)
32 Fixed upper mold 33 Substrate 34 Substrate setting part 35 Reference pin (X direction)
36 Reference pin (Y direction)
37 Substrate locking mechanism 38 Substrate alignment mechanism (to the X reference line) 39 Substrate alignment mechanism (to the Y reference line) 40 Press locking piece 41 Press member 41a Tip portion 42 Rotating shaft 43 Support base 44 Torsion spring 45 Shaft 46 Press locking piece 47 Press member 47a Tip portion 48 Support base 49 Rotating shaft 50 Torsion spring 51 Shaft 52 Connection mechanism 53 Rotating portion 54 Notch plane portion 55 Arm 56 Connecting rod 57 Substrate pressing member 57a Tip portion 58 Rotating shaft 59 Support base 60 Torsion spring 61 Shaft 62 Distance 63 Angle

Claims (2)

Supplying a substrate with a semiconductor chip mounted on the substrate set part of the upper die using a die for compression molding of a semiconductor chip comprising an upper die, a lower die, and an intermediate die having a through hole for loosely fitting the lower die. The mold is sandwiched between the lower mold and the intermediate mold, and a resin material is supplied and set in the lower mold cavity covering the sandwiched release film. A semiconductor chip compression molding method for compressing and molding a semiconductor chip mounted on a substrate in a resin molded body corresponding to the shape of the cavity in the cavity, by clamping the mold,
Clamping the release film between the intermediate mold and the clamping member provided in the lower mold,
A step of making a hole in the release film sandwiched by the positioning pin for the substrate provided on the mold surface of the lower mold and penetrating the mold,
A step of covering the mold release film sandwiched between the movable support pin provided on the mold surface of the lower mold so as to be vertically movable and the lower mold cavity;
Supplying a resin material into the cavity coated with the release film, and heating and melting;
A step of penetrating the positioning pin described above through a positioning hole provided in the substrate;
A step of setting a required interval between the above-described substrate and the above-described lower mold surface by supporting the substrate with the above-described movable support pin through the above-described release film;
A step of clamping the above-described mold;
A step of supplying and setting a substrate to the substrate setting portion of the upper mold when the mold is clamped;
A step of accommodating the movable support pin in the lower mold by pressing the movable support pin downward on the substrate when the mold is clamped; and
A compression molding method for a semiconductor chip, comprising: a step of compression molding a semiconductor chip mounted on a substrate in a resin molded body corresponding to the shape of the cavity in the lower mold cavity. Clamping the release film between the intermediate mold and the clamping member provided in the lower mold; and
A step of making a hole in the release film sandwiched by the positioning pin for the substrate provided on the mold surface of the lower mold and penetrating the mold,
A step of covering the mold release film sandwiched between the movable support pin provided on the mold surface of the lower mold so as to be vertically movable and the lower mold cavity;
A step of penetrating the positioning pin described above through a positioning hole provided in the substrate;
A step of setting a required interval between the above-described substrate and the above-described lower mold surface by supporting the substrate with the above-described movable support pin through the above-described release film;
A step of clamping the above-described mold;
A step of supplying and setting a substrate to the substrate setting portion of the upper mold when the mold is clamped;
Opening the mold as described above;
Supplying a resin material into the cavity coated with the release film, and heating and melting;
A step of clamping the above-described mold;
A step of accommodating the movable support pin in the lower mold by pressing the movable support pin downward on the substrate when the mold is clamped; and
2. The compression molding of a semiconductor chip according to claim 1, further comprising a step of compression molding a semiconductor chip mounted on a substrate in a resin molded body corresponding to the shape of the cavity in the lower mold cavity. Method.

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