JP5017523B2 - Package growing package LED, plant growing light source unit and plant growing apparatus - Google Patents

Package growing package LED, plant growing light source unit and plant growing apparatus Download PDF

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JP5017523B2
JP5017523B2 JP2008312912A JP2008312912A JP5017523B2 JP 5017523 B2 JP5017523 B2 JP 5017523B2 JP 2008312912 A JP2008312912 A JP 2008312912A JP 2008312912 A JP2008312912 A JP 2008312912A JP 5017523 B2 JP5017523 B2 JP 5017523B2
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light emitting
led
package
substrate
emitting element
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JP2010140644A (en
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昌之 礒谷
純 宇佐美
和広 秋間
賢治 米田
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CCS Inc
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CCS Inc
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Description

本発明は、植物育成に好適に用いられるパッケージLED、及びこのパッケージLEDを用いた植物育成用光源ユニット並び植物育成装置に関するものである。   The present invention relates to a package LED suitably used for plant growth, and a plant growth light source unit and a plant growth apparatus using the package LED.

従来、植物育成用の光源としては、特許文献1に示すように、複数のLEDを用いたものが考えられている。具体的にこの光源は、ベース上に複数のLEDを所定等間隔(例えば10〜30mmピッチ)で設けることによって構成されている。   Conventionally, as a light source for plant growth, as shown in Patent Document 1, a light source using a plurality of LEDs has been considered. Specifically, this light source is configured by providing a plurality of LEDs on a base at predetermined equal intervals (for example, 10 to 30 mm pitch).

しかしながら、このようにLEDを設置して構成したものでは、各LEDから発せられる光を十分に混色するためには、光源と植物との距離を大きく設定する必要がある。また、LED毎に発光色(RGB)が異なっていることから、各色の発光領域を狭めることに限界があり、照射場所によって植物に当たる光にムラが生じてしまうという問題もある。特に、植物が成長するに連れて、植物と光源との距離が変化することからも、植物の成長段階によって、照射態様が異なってしまうという問題がある。具体的には、植物が成長するに連れて、光源と植物との距離が小さくなってしまい、植物が成長するに連れて十分に混色されない光が照射されることになってしまう。   However, in the case where the LED is installed and configured as described above, it is necessary to set a large distance between the light source and the plant in order to sufficiently mix the light emitted from each LED. Moreover, since the light emission color (RGB) is different for each LED, there is a limit to narrowing the light emission region of each color, and there is a problem that unevenness occurs in the light hitting the plant depending on the irradiation place. In particular, since the distance between the plant and the light source changes as the plant grows, there is a problem that the irradiation mode varies depending on the growth stage of the plant. Specifically, as the plant grows, the distance between the light source and the plant decreases, and as the plant grows, light that is not sufficiently mixed in color is irradiated.

なお、拡散板を用いて各LEDからの光を十分に混色させることが考えられるが、拡散板によって光が損失してしまい、十分な強度を得にくいという問題がある。
特開2006−320314号公報
In addition, although it is possible to fully mix the light from each LED using a diffuser plate, there exists a problem that light is lost with a diffuser plate and it is difficult to obtain sufficient intensity | strength.
JP 2006-320314 A

そこで本発明は、上記問題点を一挙に解決するとともに、植物の育成に適した赤色光、緑色光及び青色光の強度比率を鋭意検討した結果なされたものであり、簡単な構成でありながら各色光を十分に混色するとともに、植物育成に適した光を植物に照射するだけでなく、LED回路を共通化するとともに配線を容易にすることをその主たる所期課題とするものである。 Therefore, the present invention has been made as a result of diligently examining the intensity ratio of red light, green light and blue light suitable for plant growth while solving the above problems all at once. In addition to sufficiently mixing the colors of light and irradiating the plant with light suitable for plant growth, the main intended task is to make the LED circuit common and facilitate wiring .

すなわち本発明に係る植物育成用光源ユニットは、複数の植物育成用パッケージLEDと、前記パッケージLEDを支持するLED基板と、前記LED基板のLED搭載面の前方に設けられ、各パッケージLED毎にレンズ部が形成されたレンズ基板と、前記LED基板及び前記レンズ基板を保持する保持部材と、を具備し、前記パッケージLEDが、1つのパッケージ内に赤色発光素子、緑色発光素子及び青色発光素子が封止されており、前記パッケージ内に封止される赤色発光素子の数、緑色発光素子の数及び青色発光素子の数の比が4:1:1とされることにより、赤色光の強度、緑色光の強度及び青色光の強度の比が略4:1:1とされており、前記パッケージ内で直列接続された緑色発光素子の個数及び直列接続された緑色発光素子の個数をnとしたときに、前記パッケージ内に封止された赤色発光素子が2n個ずつ直列に接続されており、前記緑色発光素子及び前記青色発光素子の回路構成は、前記LED基板の長手方向に沿って設けられたパッケージLEDの個数分直列接続したLED列を、前記LED基板の短手方向に沿って設けられたパッケージLEDの個数分並列接続することにより構成され、前記赤色発光素子の回路構成は、前記LED基板の長手方向に沿って設けられたパッケージLEDの個数の2倍分直列接続したLED列を、前記LED基板の短手方向に沿って設けられたパッケージLEDの個数の2倍分並列接続することにより構成されていること特徴とする。 That is, the plant growing light source unit according to the present invention is provided in front of a plurality of plant growing package LEDs, an LED substrate that supports the package LED, and an LED mounting surface of the LED substrate, and each package LED has a lens. A lens substrate on which a portion is formed, and the LED substrate and a holding member that holds the lens substrate, and the package LED has a red light emitting element, a green light emitting element, and a blue light emitting element sealed in one package. The ratio of the number of red light emitting elements, green light emitting elements and blue light emitting elements sealed in the package is 4: 1: 1, so that the intensity of red light, green The ratio of the light intensity and the blue light intensity is approximately 4: 1: 1, and the number of green light emitting elements connected in series in the package and the green light emitting elements connected in series 2n, 2n red light emitting elements sealed in the package are connected in series, and the circuit configuration of the green light emitting element and the blue light emitting element is the length of the LED substrate. LED arrays connected in series for the number of package LEDs provided along the direction are connected in parallel for the number of package LEDs provided along the short direction of the LED substrate. The circuit configuration is such that an LED array connected in series by twice the number of package LEDs provided along the longitudinal direction of the LED substrate is two times the number of package LEDs provided along the short direction of the LED substrate. It is characterized in that it is configured by parallel connection in double .

このようなものであれば、1つのパッケージLED内に赤色発光素子、緑色発光素子及び青色発光素子が封止されており、光源と植物との距離に関係なく、各発光素子から発せられる光を十分に混色することができる。また、拡散板を用いることなく混色することができるので、各発光素子からの光の損失を低減することができる。さらに、このようなパッケージLEDを複数用いることによって、混色された光を高密度で植物に照射することができる。その上、赤色光の強度、緑色光の強度及び青色光の強度の比を略4:1:1としているので、植物育成に好適な光を植物に照射することができる。また、前記パッケージ内に封止される赤色発光素子の数、緑色発光素子の数及び青色発光素子の数の比が、4:1:1であり、簡単な構成により各色光を上記比率にすることができる。なお、このとき、各色の発光素子のサイズは略同じであり、パッケージLED内の赤色発光素子の発光面積、緑色発光素子の発光面積及び青色発光素子の発光面積の比が、略4:1:1である。 If it is such, the red light emitting element, the green light emitting element, and the blue light emitting element are sealed in one package LED, and the light emitted from each light emitting element is emitted regardless of the distance between the light source and the plant. It is possible to mix colors sufficiently. In addition, since color mixing can be performed without using a diffusion plate, loss of light from each light emitting element can be reduced. Furthermore, by using a plurality of such package LEDs, it is possible to irradiate a plant with mixed light with high density. In addition, since the ratio of the intensity of red light, the intensity of green light, and the intensity of blue light is about 4: 1: 1, the plant can be irradiated with light suitable for plant growth. The ratio of the number of red light emitting elements, the number of green light emitting elements and the number of blue light emitting elements sealed in the package is 4: 1: 1, and each color light is set to the above ratio with a simple configuration. be able to. At this time, the sizes of the light emitting elements of the respective colors are substantially the same, and the ratio of the light emitting area of the red light emitting element, the light emitting area of the green light emitting element, and the light emitting area of the blue light emitting element in the package LED is approximately 4: 1: 1.

このように本発明によれば、簡単な構成でありながら各色光を十分に混色するとともに、植物育成に適した光を植物に照射するだけでなく、LED回路を共通化するとともに配線を容易にすることができる。 Thus, according to the present invention, each color light is sufficiently mixed with a simple configuration, and not only the plant is irradiated with light suitable for plant growth, but also an LED circuit is shared and wiring is easily performed. it can be.

次に、本発明に係るパッケージLED21を用いた植物育成装置100について図面を参照して説明する。なお、図1は本実施形態の植物育成装置100の概略構成図、図2は光源ユニット103の平面図、図3は光源ユニット103のA−A線端面図、図4はLED基板2の平面図、図5はパッケージLED21の概略構成図、図6はパッケージLED21の回路構成図、図7は緑色発光素子21G又は青色発光素子21Bの回路構成図、図8は赤色発光素子21Rの回路構成図、図9はレンズ基板3の平面図、図10はLED基板2及びレンズ基板3のサイズを模式的に示す図、図11はLED基板2、レンズ基板3及び保持部材4の分解斜視図、図12は1つのレンズ基板3のみを取り外した状態を示す斜視図、図13はLED基板2、レンズ基板3及び保持部材4の部分拡大断面図、図14は冷却循環機構7を示す部分拡大断面図である。   Next, a plant growing apparatus 100 using the package LED 21 according to the present invention will be described with reference to the drawings. 1 is a schematic configuration diagram of the plant growing apparatus 100 of the present embodiment, FIG. 2 is a plan view of the light source unit 103, FIG. 3 is an end view taken along line AA of the light source unit 103, and FIG. 5 is a schematic configuration diagram of the package LED 21, FIG. 6 is a circuit configuration diagram of the package LED 21, FIG. 7 is a circuit configuration diagram of the green light emitting element 21G or the blue light emitting element 21B, and FIG. 8 is a circuit configuration diagram of the red light emitting element 21R. 9 is a plan view of the lens substrate 3. FIG. 10 is a diagram schematically showing the size of the LED substrate 2 and the lens substrate 3. FIG. 11 is an exploded perspective view of the LED substrate 2, the lens substrate 3 and the holding member 4. 12 is a perspective view showing a state where only one lens substrate 3 is removed, FIG. 13 is a partially enlarged sectional view of the LED substrate 2, the lens substrate 3 and the holding member 4, and FIG. 14 is a partially enlarged sectional view showing the cooling circulation mechanism 7. It is.

<1.装置構成>
本実施形態に係る植物育成装置100は、図1に示すように、植物育成室Rの床面(不図示)に立設した複数の棚支柱101と、この棚支柱101に支持させた植物生育用の棚部102と、棚部102で生育する植物に光を照射するための光源ユニット103と、を具備するものである。
<1. Device configuration>
As shown in FIG. 1, the plant growing apparatus 100 according to the present embodiment has a plurality of shelf columns 101 erected on the floor surface (not shown) of the plant growing room R, and the plant growth supported by the shelf columns 101. And a light source unit 103 for irradiating light to the plants growing on the shelf 102.

棚部102の上面には、内部に液肥を保持できる略箱形状の液肥パレット104及びその液肥パレット104上に載置される栽培用パレット105が棚状に支持される。本実施形態では、棚部102を板状としているが、例えば、複数のパイプを水平方向に並べたものとすることもできる。また、栽培用パレット105では、1度に複数個の植物を栽培できるようにしている。   A substantially box-shaped liquid fertilizer pallet 104 capable of holding liquid fertilizer therein and a cultivation pallet 105 placed on the liquid fertilizer pallet 104 are supported on the shelf 102 in a shelf shape. In the present embodiment, the shelf 102 has a plate shape, but for example, a plurality of pipes may be arranged in the horizontal direction. Further, the cultivation pallet 105 allows a plurality of plants to be cultivated at a time.

棚部102の下面には、光源ユニット103が、当該棚部102下方に設けられた別の棚部102の上面と略平行となるように設けられる。そのため棚部102の下面には、光源ユニット103を着脱可能に取り付けるための取り付け部106が設けられている。   The light source unit 103 is provided on the lower surface of the shelf 102 so as to be substantially parallel to the upper surface of another shelf 102 provided below the shelf 102. Therefore, an attachment portion 106 for detachably attaching the light source unit 103 is provided on the lower surface of the shelf portion 102.

この取り付け部106は、例えば棚部102の幅方向(左右方向)に1本ずつ対となるように設けられたレールである。このレールは、断面略L字形状をなし、その折れ曲がり部が下側となり、かつL字凹部が棚部102内側を向くように設けられている。このような構成により、光源ユニット103がレールにスライドされ、折れ曲がり部上に載置されることにより、棚部102上方に光源ユニット103が取り付けられる。   The attachment portions 106 are rails provided so as to be paired one by one in the width direction (left-right direction) of the shelf portion 102, for example. This rail has a substantially L-shaped cross section, and is provided such that the bent portion is on the lower side and the L-shaped concave portion faces the inside of the shelf portion 102. With such a configuration, the light source unit 103 is slid on the rail and placed on the bent portion, so that the light source unit 103 is attached above the shelf portion 102.

<2.光源ユニット103について>
光源ユニット103は、図2及び図3に示すように、平面視において概略矩形形状をなすものであり、保持部材4の一方面側に複数のLED基板2及び複数のレンズ基板3を取り付けることによって構成されている。
<2. About Light Source Unit 103>
As shown in FIGS. 2 and 3, the light source unit 103 has a substantially rectangular shape in plan view, and by attaching a plurality of LED substrates 2 and a plurality of lens substrates 3 to one surface side of the holding member 4. It is configured.

LED基板2は、植物に生育用の光を照射する複数のパッケージLED21(以下、単にLED21ともいう。)を支持するものある。具体的にLED基板2は、図4に示すように、平面視において概略矩形形状をなすものであり、一方の平面(以下、LED搭載面という。)に複数の表面実装型のパッケージLED21が設けられている。これらパッケージLED21は、縦横に互いにほぼ等間隔にマトリックス状に設けられている。   The LED substrate 2 supports a plurality of package LEDs 21 (hereinafter also simply referred to as LEDs 21) that irradiate plants with light for growth. Specifically, as shown in FIG. 4, the LED substrate 2 has a substantially rectangular shape in plan view, and a plurality of surface-mounted package LEDs 21 are provided on one plane (hereinafter referred to as an LED mounting surface). It has been. These package LEDs 21 are provided in a matrix form at substantially equal intervals in the vertical and horizontal directions.

パッケージLED21は、図5に示すように、1つのパッケージ基板211内に赤色発光素子21R、緑色発光素子21G及び青色発光素子21Bを設け、透明樹脂212により封止して形成されるものであり、各色毎に+端子、−端子が設けられている。   As shown in FIG. 5, the package LED 21 is formed by providing a red light emitting element 21R, a green light emitting element 21G, and a blue light emitting element 21B in one package substrate 211, and sealing with a transparent resin 212. A positive terminal and a negative terminal are provided for each color.

本実施形態のパッケージLED21は、赤色光、緑色光又は青色光の少なくとも2色以上の光が混合した混合光を射出するものであり、特に本実施形態では赤色光の強度、緑色光の強度及び青色光の強度の比が、略4:1:1となるように構成している。具体的には、図5及び図6に示すように、1つのパッケージ基板211内に設けられる赤色発光素子21Rの数、緑色発光素子21Gの数及び青色発光素子21Bの数の比が、4:1:1となるようにしている。このとき、各色の発光素子21R、21G、21Bのサイズは略同じであり、パッケージLED21内の赤色発光素子21Rの発光面積、緑色発光素子21Gの発光面積及び青色発光素子21Bの発光面積の比が、略4:1:1となるようにしている。また、パッケージLED21内に設けられた4個の赤色発光素子21Rは2つずつ直列にボンディングワイヤを介して接続されている。このように、赤色発光素子21Rを2つずつ直列に接続することにより、直列接続された赤色発光素子21Rの順方向電圧(約2.0V×2)を緑色発光素子21Gの順方向電圧(約3.5V)及び青色発光素子の順方向電圧(約3.5V)に可及的に近づけることができ、LED回路を共通化することができると共に、配線を容易にすることができ、さらに電圧ロスを低減することができる。電圧ロスを低減することにより、ロス分の無駄な電圧がLED21において熱に変換されてしまい、結果的にLED21の寿命を縮めてしまうという問題を解決することができる。   The package LED 21 of the present embodiment emits mixed light in which light of at least two colors of red light, green light, or blue light is mixed. In particular, in this embodiment, the intensity of red light, the intensity of green light, and The intensity ratio of blue light is configured to be approximately 4: 1: 1. Specifically, as shown in FIGS. 5 and 6, the ratio of the number of red light emitting elements 21R, the number of green light emitting elements 21G and the number of blue light emitting elements 21B provided in one package substrate 211 is 4: The ratio is 1: 1. At this time, the sizes of the light emitting elements 21R, 21G, and 21B of the respective colors are substantially the same, and the ratio of the light emitting area of the red light emitting element 21R, the light emitting area of the green light emitting element 21G, and the light emitting area of the blue light emitting element 21B in the package LED 21 is , Approximately 4: 1: 1. The four red light emitting elements 21R provided in the package LED 21 are connected in series via bonding wires two by two. Thus, by connecting two red light emitting elements 21R in series, the forward voltage (about 2.0 V × 2) of the red light emitting elements 21R connected in series is changed to the forward voltage (about 2.0 V) of the green light emitting element 21G. 3.5V) and the forward voltage (about 3.5V) of the blue light emitting device as close as possible, the LED circuit can be shared, wiring can be facilitated, and the voltage can be increased. Loss can be reduced. By reducing the voltage loss, it is possible to solve the problem that a wasteful voltage corresponding to the loss is converted into heat in the LED 21, and as a result, the life of the LED 21 is shortened.

このようなパッケージLED21を用いたLED基板2において、緑色発光素子21G及び青色発光素子21Bの回路構成は、例えば、図7に示すように、LED基板2の長手方向に沿って設けられたパッケージLED21の個数分(N列)直列接続したLED列をLED基板2の短手方向に沿って設けられたパッケージLED21の個数分(M行)並列接続することにより構成されている。   In the LED substrate 2 using such a package LED 21, the circuit configurations of the green light emitting element 21G and the blue light emitting element 21B are, for example, package LEDs 21 provided along the longitudinal direction of the LED substrate 2, as shown in FIG. Are connected in series (M columns) in parallel to the number of package LEDs 21 provided along the short direction of the LED substrate 2.

また、赤色発光素子21Rの回路構成は、例えば、図8に示すように、LED基板2の長手方向に沿って設けられたパッケージLED21の個数の2倍分(2N列)直列接続したLED列をLED基板2の短手方向に沿って設けられたパッケージLED21の個数の2倍分(2M行)並列接続することにより構成されている。   Further, for example, as shown in FIG. 8, the circuit configuration of the red light emitting element 21R includes LED rows that are connected in series (2N rows) twice as many as the number of package LEDs 21 provided along the longitudinal direction of the LED substrate 2 (2N rows). It is configured by connecting in parallel (2M rows) twice the number of package LEDs 21 provided along the short direction of the LED substrate 2.

なお、LED基板2には、LED搭載面及び裏面を貫通する第1貫通孔2a(図4には不図示)が複数個形成されているが、この第1貫通孔2aについては後述する。また、LED基板2の長手方向両辺部には、後述する固定具5によって固定するための固定用孔2bが複数個形成されている。   The LED substrate 2 is formed with a plurality of first through holes 2a (not shown in FIG. 4) penetrating the LED mounting surface and the back surface. The first through holes 2a will be described later. In addition, a plurality of fixing holes 2b for fixing with a fixture 5 described later are formed on both sides in the longitudinal direction of the LED substrate 2.

レンズ基板3は、図9に示すように、LED基板2のLED搭載面前方に設けられ、LED21からの光を集光して棚部102上の植物に導く複数のレンズ部31を有するものである。具体的にレンズ基板3は、平面視において概略矩形形状をなすものであり、保持部材4に固定された状態において、LED基板2の各LED21に対応して、複数のレンズ部31が形成されている。このとき、LED21の光軸とレンズ部31の光軸とが略一致するようにしている。また、レンズ基板3の光入射面(裏面)はLED21の光射出面(上面)と接触して設けられ、LED21から射出される光の略全てをレンズ部31によって集光できるようにしている。なお、レンズ基板3の光入射面(裏面)とLED21の光射出面(上面)との間に機械的遊び(例えば0.2mm程度の隙間)を設けることにより、各部品の製作誤差や組み立て誤差を吸収可能にし、容易に量産できるようにしても良い。   As shown in FIG. 9, the lens substrate 3 is provided in front of the LED mounting surface of the LED substrate 2, and has a plurality of lens portions 31 that collect the light from the LEDs 21 and guide it to the plants on the shelf 102. is there. Specifically, the lens substrate 3 has a substantially rectangular shape in plan view, and in a state of being fixed to the holding member 4, a plurality of lens portions 31 are formed corresponding to each LED 21 of the LED substrate 2. Yes. At this time, the optical axis of the LED 21 and the optical axis of the lens unit 31 are substantially matched. The light incident surface (back surface) of the lens substrate 3 is provided in contact with the light emission surface (upper surface) of the LED 21 so that substantially all of the light emitted from the LED 21 can be condensed by the lens unit 31. In addition, by providing mechanical play (for example, a gap of about 0.2 mm) between the light incident surface (back surface) of the lens substrate 3 and the light emitting surface (upper surface) of the LED 21, manufacturing errors and assembly errors of each component are provided. May be absorbed so that it can be easily mass-produced.

なお、レンズ基板3には、光入射面(裏面)及び光射出面(表面)を貫通する第2貫通孔3aが複数個形成されているが、この第2貫通孔3aについては後述する。また、レンズ基板3の短手方向両辺部には、後述する固定具5によって固定するための固定用孔3bが複数個形成されている。なお、図9においては、固定用孔3bは、短手方向両辺部に設けられているが、これに限定されず、例えば長手方向略中央部に設けても良い。具体的には、固定用孔3bを長手方向略中央部の両辺部に設けても良い。これにより、長尺状のレンズ基板3を用いた場合に、長手方向の中央部が撓むことを防止することができ、レンズ基板3が長手方向の中央部で撓むことによるレンズ性能の低下を好適に防止することができる。   The lens substrate 3 is formed with a plurality of second through holes 3a penetrating the light incident surface (back surface) and the light emitting surface (front surface). The second through holes 3a will be described later. In addition, a plurality of fixing holes 3b for fixing with a fixture 5 described later are formed on both sides of the lens substrate 3 in the short direction. In FIG. 9, the fixing holes 3b are provided on both sides in the short direction, but the present invention is not limited to this, and may be provided, for example, in a substantially central part in the longitudinal direction. Specifically, the fixing holes 3b may be provided on both sides of the substantially central portion in the longitudinal direction. Thereby, when the elongate lens board | substrate 3 is used, it can prevent that the center part of a longitudinal direction bends, and the lens performance falls by the lens board | substrate 3 bending at the center part of a longitudinal direction. Can be suitably prevented.

また、レンズ基板3のサイズは、図10に示すように、1つのLED基板2において、保持部材4に固定される両辺部に直交するように複数に等分割したサイズと略同一である。なお、図10においては、理解を簡単にするため、レンズ基板3のサイズを若干小さく示している。   Further, as shown in FIG. 10, the size of the lens substrate 3 is substantially the same as the size obtained by equally dividing the lens substrate 3 into a plurality of portions so as to be orthogonal to both sides fixed to the holding member 4. In FIG. 10, the size of the lens substrate 3 is shown slightly smaller for easy understanding.

保持部材4は、図2及び図3に示すように、複数のLED基板2及び複数のレンズ基板3が固定されるものであり、一面が開口する概略箱形状をなす基枠体41と、当該基枠体41の長手方向(一方向)の側壁411に並行となるように短手方向(他方向)の側壁412を等分するように横架された2本の梁枠42とからなる。これら基枠体41及び梁枠42がそれぞれ一対の保持枠となり、これら保持枠に対してLED基板2及びレンズ基板3が架け渡されて固定される。   As shown in FIGS. 2 and 3, the holding member 4 is configured to fix the plurality of LED substrates 2 and the plurality of lens substrates 3, and includes a base frame body 41 having a substantially box shape with one surface opened, It consists of two beam frames 42 that are horizontally mounted so as to equally divide the side wall 412 in the short direction (other direction) so as to be parallel to the side wall 411 in the longitudinal direction (one direction) of the base frame body 41. The base frame body 41 and the beam frame 42 form a pair of holding frames, and the LED substrate 2 and the lens substrate 3 are bridged and fixed to the holding frames.

具体的に、少なくとも基枠体41の長手方向(一方向)の側壁411は、図3の部分拡大図に示すように、断面L字形状をなす。そして、側壁411の折れ曲がり部4111にLED基板2及びレンズ基板3が固定される。なお、図2及び図3に固定具5は図示しない。   Specifically, at least the side wall 411 in the longitudinal direction (one direction) of the base frame body 41 has an L-shaped cross section as shown in the partially enlarged view of FIG. Then, the LED substrate 2 and the lens substrate 3 are fixed to the bent portion 4111 of the side wall 411. 2 and 3, the fixture 5 is not shown.

梁枠42は、特に図3に示すように、断面概略コの字形状をなす長尺状のものであり、その底部421が基枠体41の開口外側となるように基枠体41の短手方向の両側壁412に固定される。そして、梁枠42の底部421にLED基板2及びレンズ基板3が固定される。   As shown in FIG. 3 in particular, the beam frame 42 is a long one having a substantially U-shaped cross section, and a short portion of the base frame body 41 so that the bottom portion 421 is outside the opening of the base frame body 41. It is fixed to both side walls 412 in the hand direction. Then, the LED substrate 2 and the lens substrate 3 are fixed to the bottom 421 of the beam frame 42.

なお、保持部材4、具体的には側壁411の折れ曲がり部4111及び梁枠42の底部421には、LED基板2の固定用孔2bに対応して固定用孔4aが形成されている。   The holding member 4, specifically, the bent portion 4111 of the side wall 411 and the bottom portion 421 of the beam frame 42 are formed with fixing holes 4 a corresponding to the fixing holes 2 b of the LED substrate 2.

また、基枠体41の長手方向両端部は、棚部102の取り付け部106(レール)にスライド可能とするためにLED基板2及びレンズ基板3が取り付けられない部分であるスライド部413が形成されている(図2参照)。   In addition, slide portions 413 that are portions to which the LED substrate 2 and the lens substrate 3 are not attached are formed at both ends in the longitudinal direction of the base frame body 41 so as to be slidable on the attachment portion 106 (rail) of the shelf portion 102. (See FIG. 2).

このような保持部材4において、基枠体41の側壁411の一方及び当該側壁411に隣接する梁枠42にLED基板2及びレンズ基板3が架け渡されて固定される。また、2つの梁枠42間にLED基板2及びレンズ基板3が架け渡されて固定される。さらに、基枠体41の側壁411の他方及び当該側壁411に隣接する梁枠42にLED基板2及びレンズ基板3が架け渡されて固定される。このとき、LED基板2の両辺部及びレンズ基板3の両辺部が、基枠体41及び梁枠42に固定具5によって外側から取り付けられる。   In such a holding member 4, the LED substrate 2 and the lens substrate 3 are bridged and fixed to one of the side walls 411 of the base frame body 41 and the beam frame 42 adjacent to the side wall 411. The LED substrate 2 and the lens substrate 3 are bridged between the two beam frames 42 and fixed. Further, the LED substrate 2 and the lens substrate 3 are bridged and fixed to the other side wall 411 of the base frame body 41 and the beam frame 42 adjacent to the side wall 411. At this time, both sides of the LED substrate 2 and both sides of the lens substrate 3 are attached to the base frame 41 and the beam frame 42 from the outside by the fixture 5.

保持部材4が棚部102の取り付け部106に取り付けられた状態において、保持部材4は、略水平方向に沿って設けられることになり、LED基板2及びレンズ基板3が保持部材4に鉛直下側から固定具5によって固定されることになる。なお、LED基板2及びレンズ基板3を保持部材4に固定するための固定具5については後述する。   In a state where the holding member 4 is attached to the attaching portion 106 of the shelf portion 102, the holding member 4 is provided along a substantially horizontal direction, and the LED substrate 2 and the lens substrate 3 are vertically below the holding member 4. To be fixed by the fixture 5. Note that a fixture 5 for fixing the LED substrate 2 and the lens substrate 3 to the holding member 4 will be described later.

保持部材4において基枠体41の底部414には、電源ユニット(不図示)が取付られており、また、当該電源ユニットから各LED基板に延びるケーブル群は、梁枠42内に収容されている。   In the holding member 4, a power supply unit (not shown) is attached to the bottom 414 of the base frame body 41, and a cable group extending from the power supply unit to each LED board is accommodated in the beam frame 42. .

<3.取り付け及び取り外しについて>
次に、固定具5、保持部材4へのLED基板2及びレンズ基板3の取り付け方法及び取り外し方法について説明する。
<3. About installation and removal>
Next, a method for attaching and removing the LED substrate 2 and the lens substrate 3 to the fixture 5 and the holding member 4 will be described.

固定具5は、保持部材4(側壁411の折れ曲がり部4111又は梁枠42の底部421)に形成された固定用孔4aと、LED基板2に形成された固定用孔2bと、レンズ基板3に形成された固定用孔3bとに挿入されて、それらを一体的に同時に固定するものである。   The fixing tool 5 includes a fixing hole 4 a formed in the holding member 4 (the bent portion 4111 of the side wall 411 or the bottom 421 of the beam frame 42), a fixing hole 2 b formed in the LED substrate 2, and the lens substrate 3. It is inserted into the formed fixing hole 3b to fix them together integrally.

固定具5の具体的な構成は、2動作で取り付け及び取り外し可能なものであり、図13に示すように、複数の係止爪511が放射状に形成された概略筒形状をなす係止部51と、当該係止部51の基端に設けられたフランジ部52と、当該係止部51の内部に挿入され、係止爪511を径方向外側に押し広げる挿入部53と、を有するものである。   A specific configuration of the fixture 5 is attachable and detachable by two operations. As shown in FIG. 13, as shown in FIG. 13, a locking portion 51 having a substantially cylindrical shape in which a plurality of locking claws 511 are radially formed. A flange portion 52 provided at the base end of the locking portion 51, and an insertion portion 53 that is inserted into the locking portion 51 and pushes the locking claw 511 outward in the radial direction. is there.

そして、挿入部53を係止部51内に挿入していない状態(抜取位置)では、係止爪511が径方向外側に広がらずに窄まっており、係止爪511が固定用孔4aの開口縁には係止しない。一方で、挿入部53を係止部51内に挿入した状態(挿入位置)では、係止爪が径方向外側に広がって固定用孔4aの開口縁に係止して、当該係止爪511とフランジ部52によって保持部材4にLED基板2及びレンズ基板3が固定される。   In a state where the insertion portion 53 is not inserted into the locking portion 51 (sampling position), the locking claw 511 is narrowed without spreading outward in the radial direction, and the locking claw 511 is narrowed in the fixing hole 4a. Do not lock to the opening edge. On the other hand, in a state where the insertion portion 53 is inserted into the locking portion 51 (insertion position), the locking claw spreads outward in the radial direction and is locked to the opening edge of the fixing hole 4a. The LED substrate 2 and the lens substrate 3 are fixed to the holding member 4 by the flange portion 52.

つまり、保持部材4にLED基板2及びレンズ基板3を固定する際には、まず、保持部材4の固定用孔4a、LED基板2の固定用孔2b及びレンズ基板3の固定用孔3bを連通させた(重ね合わせた)後、係止部51をそれら固定用孔2b、3b、4aに挿入する。その後、挿入部53を係止部51に押し込むことによって、係止爪511が広がって反挿入側の固定用孔4aの開口縁に係止して、係止爪511及びフランジ部52により、保持部材4、LED基板2及びレンズ基板3が一体的に固定される。このように、固定具5を固定用孔2b、3b、4aに挿入する挿入工程と、当該挿入工程後に挿入部53を押し込み係止爪511を広げる押込工程との2工程より保持部材4にLED基板2及びレンズ基板3を固定することができる。   That is, when the LED substrate 2 and the lens substrate 3 are fixed to the holding member 4, first, the fixing hole 4 a of the holding member 4, the fixing hole 2 b of the LED substrate 2, and the fixing hole 3 b of the lens substrate 3 are communicated. After being put (overlapped), the locking portion 51 is inserted into the fixing holes 2b, 3b, 4a. Thereafter, when the insertion portion 53 is pushed into the locking portion 51, the locking claw 511 spreads and is locked to the opening edge of the fixing hole 4a on the opposite insertion side, and is held by the locking claw 511 and the flange portion 52. The member 4, the LED substrate 2 and the lens substrate 3 are fixed integrally. As described above, the LED is applied to the holding member 4 by two steps of the insertion step of inserting the fixing tool 5 into the fixing holes 2b, 3b, and 4a and the pressing step of pushing the insertion portion 53 and expanding the locking claw 511 after the insertion step. The substrate 2 and the lens substrate 3 can be fixed.

次に、LED基板2及びレンズ基板3の取付態様について説明する。   Next, how the LED substrate 2 and the lens substrate 3 are attached will be described.

前述した通り、LED基板2には長手方向両辺部(左右)にそれぞれ3個ずつ固定用孔2bが形成されている。また、レンズ基板3には、短手方向両辺部(左右)にそれぞれ1個ずつ固定用孔3bが形成されている。   As described above, the LED board 2 has three fixing holes 2b on both sides (left and right) in the longitudinal direction. The lens substrate 3 has one fixing hole 3b on each side (left and right) in the lateral direction.

そして、レンズ基板3の固定用孔3bは、LED基板2に形成された左右3個ずつの固定用孔2bのうち、左右1対の固定用孔2bに対応する。つまり、図10に示すように、1枚のLED基板2には3枚のレンズ基板3が固定されることになる。レンズ基板3は、LED基板2を3等分したサイズであるから、LED基板2の固定用孔2bとレンズ基板3の固定用孔3bとを連通した状態において、LED基板2及びレンズ基板3は平面視において略同一形状をなす。なお、LED基板2に設けられる固定用孔2bの個数は、左右3個ずつに限られず、適宜設定可能である。またそれに対応して、レンズ基板3に設けられる固定用孔3bの個数も設定される。   The fixing holes 3b of the lens substrate 3 correspond to a pair of right and left fixing holes 2b among the three fixing holes 2b on the left and right sides formed on the LED substrate 2. That is, as shown in FIG. 10, three lens substrates 3 are fixed to one LED substrate 2. Since the lens substrate 3 has a size obtained by dividing the LED substrate 2 into three equal parts, the LED substrate 2 and the lens substrate 3 are in a state where the fixing hole 2b of the LED substrate 2 and the fixing hole 3b of the lens substrate 3 are communicated with each other. It has substantially the same shape in plan view. The number of fixing holes 2b provided on the LED substrate 2 is not limited to three on the left and right, and can be set as appropriate. Correspondingly, the number of fixing holes 3b provided in the lens substrate 3 is also set.

このように本実施形態の植物育成装置100は、LED基板2及びレンズ基板3を固定具5によって同時に固定可能にし、さらに、レンズ基板3のみを別個に取り外し可能に構成している。言い換えると、LED基板2を保持部材4に着脱可能に固定する固定具5と、レンズ基板3を保持部材4に着脱可能に固定する固定具5とを共通にしている。つまり、LED基板2及びレンズ基板3が、固定具5によって保持部材4にまとめて同時に固定されるとともに、1つのLED基板2を固定するための複数の固定具5が、異なるレンズ基板3を固定するようにしている。   As described above, the plant growing device 100 according to the present embodiment is configured such that the LED substrate 2 and the lens substrate 3 can be simultaneously fixed by the fixture 5 and only the lens substrate 3 can be separately detached. In other words, the fixture 5 that removably fixes the LED substrate 2 to the holding member 4 and the fixture 5 that removably fixes the lens substrate 3 to the holding member 4 are shared. That is, the LED substrate 2 and the lens substrate 3 are fixed to the holding member 4 together by the fixture 5 and simultaneously fixed, and a plurality of fixtures 5 for fixing one LED substrate 2 fix different lens substrates 3. Like to do.

具体的には、図11に示すように、LED基板2を保持部材4に固定する6個の固定具5のうち2個ずつがそれぞれ異なるレンズ基板3を固定する。このように構成しているので、図12に示すように、LED基板2を取り外す必要なく、一部のレンズ基板3のみを取り外すことができ、レンズ基板3が植物に接触する等して汚れた場合等のメンテナンス作業を極めて簡単にすることができる。また、レンズ基板3のみを交換する場合には、光源ユニット103は棚部102に取り付けられた状態で行うことが考えられるが、固定具5が2動作によって取り付け又は取り外しでき、このようなことを勘案しても極めて簡単である。なお、図12において固定具5は図示しない。   Specifically, as shown in FIG. 11, two of the six fixtures 5 that fix the LED substrate 2 to the holding member 4 each fix a different lens substrate 3. Since it is configured in this manner, as shown in FIG. 12, it is possible to remove only a part of the lens substrate 3 without having to remove the LED substrate 2, and the lens substrate 3 has become dirty due to contact with a plant or the like. In some cases, the maintenance work can be extremely simplified. Further, when only the lens substrate 3 is replaced, it is conceivable that the light source unit 103 is attached to the shelf 102. However, the fixture 5 can be attached or detached by two operations. It is extremely easy to take into account. In FIG. 12, the fixture 5 is not shown.

<4.位置決め機構6>
しかして本実施形態の植物育成装置100は、特に図13に示すように、LED基板2及びレンズ基板3を保持部材4に固定する際に、LED基板2及びレンズ基板3の位置決めを位置決め機構6を備える。
<4. Positioning mechanism 6>
Therefore, the plant growing apparatus 100 according to the present embodiment particularly positions the LED substrate 2 and the lens substrate 3 when the LED substrate 2 and the lens substrate 3 are fixed to the holding member 4, as shown in FIG. Is provided.

位置決め機構6は、LED基板2及びレンズ基板3の固定時において、LED基板2及びレンズ基板3の面方向に沿った相対位置及びLED基板2及びレンズ基板3の相対距離の位置決めを行うものであり、LED基板2又はレンズ基板3の一方に設けられた凹部61と、他方に設けられた凸部62とからなる。本実施形態では、LED基板2に凹部61を設け、レンズ基板3に凸部62を設けている。   The positioning mechanism 6 positions the relative position along the surface direction of the LED substrate 2 and the lens substrate 3 and the relative distance between the LED substrate 2 and the lens substrate 3 when the LED substrate 2 and the lens substrate 3 are fixed. The concave portion 61 provided on one side of the LED substrate 2 or the lens substrate 3 and the convex portion 62 provided on the other side. In the present embodiment, the LED substrate 2 is provided with a concave portion 61, and the lens substrate 3 is provided with a convex portion 62.

そして、レンズ基板3に設けた凸部62は、レンズ基板3の光入射面(裏面)に形成され、LED基板2の凹部61よりも断面積が大きい大径部621と、当該大径部621の頂面に形成され、凸部62に嵌合する小径部622とからなる。また、大径部621は、LED基板2とレンズ基板3の距離を規定するものであり、その高さは、LED21の上面がレンズ基板3の光入射面(裏面)にほぼ接するように構成している。   And the convex part 62 provided in the lens board | substrate 3 is formed in the light-incidence surface (back surface) of the lens board | substrate 3, and the large diameter part 621 whose cross-sectional area is larger than the recessed part 61 of the LED board 2, and the said large diameter part 621. And a small-diameter portion 622 that fits into the convex portion 62. The large-diameter portion 621 defines the distance between the LED substrate 2 and the lens substrate 3, and the height thereof is configured such that the upper surface of the LED 21 is substantially in contact with the light incident surface (back surface) of the lens substrate 3. ing.

これにより、LED基板2にレンズ基板3を取り付ける際に、LED基板2の固定用孔2bとレンズ基板3の固定用孔3bとが連通するように、LED基板2に対してレンズ基板3が位置決めされて、保持部材4への固定作業が容易になる。   Thereby, when attaching the lens substrate 3 to the LED substrate 2, the lens substrate 3 is positioned with respect to the LED substrate 2 so that the fixing hole 2b of the LED substrate 2 and the fixing hole 3b of the lens substrate 3 communicate with each other. Thus, the fixing work to the holding member 4 is facilitated.

<5.冷却循環機構7について>
さらに本実施形態の植物育成装置100は、パッケージLED21を冷却するとともに、植物間の空気を循環させるための冷却循環機構7を備えている。
<5. About cooling circulation mechanism 7>
Furthermore, the plant growing apparatus 100 of the present embodiment includes a cooling circulation mechanism 7 for cooling the package LED 21 and circulating air between plants.

冷却循環機構7は、図14に示すように、LED基板2のLED搭載面及び裏面を貫通する複数の第1貫通孔2aと、レンズ基板3の光入射面及び光射出面を貫通する複数の第2貫通孔3aと、LED基板2の裏面側に形成された空間から空気を吸い込み、冷却して植物育成室R内に吹き出す吸込・吹出機構(不図示)と、を備えている。   As shown in FIG. 14, the cooling circulation mechanism 7 includes a plurality of first through holes 2 a penetrating the LED mounting surface and the back surface of the LED substrate 2, and a plurality of light incident surfaces and light exit surfaces of the lens substrate 3. A second through-hole 3a and a suction / blow-out mechanism (not shown) that sucks air from a space formed on the back side of the LED substrate 2, cools it, and blows it into the plant growing room R are provided.

第1貫通孔2aの開口面積は、第2貫通孔3aの開口面積よりも小さい。本実施形態では、第1貫通孔2a及び第2貫通孔3aはともに円形状をなすものであり、第1貫通孔2aの開口径が第2貫通孔3aの開口径よりも小さく設定されている。   The opening area of the first through hole 2a is smaller than the opening area of the second through hole 3a. In the present embodiment, the first through hole 2a and the second through hole 3a are both circular, and the opening diameter of the first through hole 2a is set smaller than the opening diameter of the second through hole 3a. .

また、1つの光源ユニット103において、第1貫通孔2aは、第2貫通孔3aよりも多く形成されている。また、LED基板2における第1貫通孔2aの形成密度は、LED基板2全域において略均一となるようにし、さらに、第2貫通孔3a毎に対応する第1貫通孔2aの個数が略同一となるようにしている。   Further, in one light source unit 103, the first through holes 2a are formed more than the second through holes 3a. Further, the formation density of the first through holes 2a in the LED substrate 2 is made substantially uniform over the entire area of the LED substrate 2, and the number of first through holes 2a corresponding to each second through hole 3a is substantially the same. It is trying to become.

LED基板2の裏面側に形成された空間とは、本実施形態では基枠体41の内部空間S1であり、基枠体41の所定位置に空気孔41Hが形成されている。この空気孔41Hは、棚部102に取り付けた状態において、棚部102又は棚支柱101に設けられた吸引口(不図示)と連通する。   The space formed on the back surface side of the LED substrate 2 is the internal space S1 of the base frame body 41 in the present embodiment, and air holes 41H are formed at predetermined positions of the base frame body 41. The air hole 41 </ b> H communicates with a suction port (not shown) provided in the shelf portion 102 or the shelf column 101 in a state of being attached to the shelf portion 102.

吸込・吹出機構は、前記吸引口に連通する循環経路と、当該循環経路上に設けられ、循環経路内に空気を流通させる循環ポンプと、循環経路上に設けられ、空気を冷却する冷却部と、を備えている。冷却部としては、自然冷却するものであっても良いし、強制的に一定温度に冷却するものであっても良い。   The suction / blow mechanism includes a circulation path that communicates with the suction port, a circulation pump that is provided on the circulation path and circulates air in the circulation path, and a cooling unit that is provided on the circulation path and cools the air. It is equipped with. The cooling unit may be one that naturally cools, or one that is forced to cool to a constant temperature.

このような構成において、光源ユニット103を棚部102に取り付けると、基枠体41の空気孔41Hと吸引口とが連通する。そして、循環ポンプにより空気を吸引すると、空気孔41HからLED基板2裏面側の空間S1から空気が吸い込まれて、循環経路を流れるとともに冷却部により冷却されて再び植物育成室内200に吹き出される。   In such a configuration, when the light source unit 103 is attached to the shelf 102, the air hole 41H of the base frame body 41 communicates with the suction port. When air is sucked by the circulation pump, air is sucked from the air hole 41H from the space S1 on the back surface side of the LED substrate 2, flows through the circulation path, is cooled by the cooling unit, and is blown out again into the plant growing chamber 200.

また、基枠体41内部の空間S1から空気が吸い込まれると、第2貫通孔3aからレンズ基板3前方(つまり植物育成室R内)の空気が吸い込まれて、LED基板2のLED搭載面に沿って流れ、LED21を冷却した後、第1貫通孔2aを通ってLED裏面側の基枠体41内部に吸い込まれる。このとき、第1貫通孔2aの開口径を第2貫通孔3aの開口径よりも小さく設定し、さらに、第1貫通孔2aの数を第2貫通孔3aの数よりも多くしているので、第2貫通孔3aから吸い込まれた空気がLED搭載面上で複数の流路に分岐して流れるので、LED21を万遍無く冷却することができる。さらに、LED基板2における第1貫通孔2aの形成密度をLED基板2全域において略均一にし、第2貫通孔3a毎に対応する第1貫通孔2aの個数を略同一としているので、全LED21を均等に冷却することができる。   Further, when air is sucked from the space S1 inside the base frame body 41, air in front of the lens substrate 3 (that is, in the plant growing room R) is sucked from the second through hole 3a, and the LED mounting surface of the LED substrate 2 is drawn. After flowing along and cooling the LED 21, the LED 21 passes through the first through hole 2 a and is sucked into the base frame body 41 on the LED back surface side. At this time, the opening diameter of the first through hole 2a is set smaller than the opening diameter of the second through hole 3a, and the number of the first through holes 2a is larger than the number of the second through holes 3a. Since the air sucked from the second through-hole 3a branches and flows into a plurality of flow paths on the LED mounting surface, the LED 21 can be cooled uniformly. Further, the formation density of the first through holes 2a in the LED substrate 2 is made substantially uniform over the entire area of the LED substrate 2, and the number of the first through holes 2a corresponding to each second through hole 3a is made substantially the same. Cool evenly.

<6.本実施形態の効果>
このように構成した本実施形態に係る植物育成装置100によれば、1つのパッケージLED21内に赤色発光素子21R、緑色発光素子21G及び青色発光素子21Bが封止されており、光源と植物との距離に関係なく、各発光素子から発せられる光を十分に混色することができる。また、拡散板を用いることなく混色することができるので、各発光素子からの光の損失を低減することができる。さらに、このようなパッケージLED21を複数用いることによって、混色された光を高密度で植物に照射することができる。その上、その各波長の強度の比を略4:1:1としているので、植物育成に好適な光を植物に照射することができる。
<6. Effects of this embodiment>
According to the plant growing apparatus 100 according to the present embodiment configured as described above, the red light emitting element 21R, the green light emitting element 21G, and the blue light emitting element 21B are sealed in one package LED 21, and the light source and the plant are connected. Regardless of the distance, the light emitted from each light emitting element can be sufficiently mixed. In addition, since color mixing can be performed without using a diffusion plate, loss of light from each light emitting element can be reduced. Furthermore, by using a plurality of such package LEDs 21, it is possible to irradiate a plant with mixed light with high density. In addition, since the ratio of the intensities of the respective wavelengths is about 4: 1: 1, the plant can be irradiated with light suitable for plant growth.

<7.その他の変形実施形態>
なお、本発明は前記実施形態に限られるものではない。
<7. Other Modified Embodiments>
The present invention is not limited to the above embodiment.

例えば、前記実施形態のパッケージLED21は、赤色発光素子21R、緑色発光素子21G及び青色発光素子21Bを用いたものであったが、その他、植物の光合成に寄与する赤色発光素子21R及び青色発光素子21Gを封止したものであっても良い。この場合、図14に示すように、赤色発光素子21Rの数及び青色発光素子21Bの数の比を、6:1となるようにし、パッケージLED21から射出される光において、赤色光の強度及び青色光の強度の比を略6:1にすることにより、植物育成の適した光を照射することができる。このとき、パッケージLED21を用いたLED基板2において、青色発光素子21Bの回路構成は、図7と同様であるが、赤色発光素子21Rの回路構成は、2N列直列接続したLED列を3M行並列接続することにより構成している。これは、2M行3N列の回路を構成すると、直列数が増えて電圧が変わるためである。   For example, the package LED 21 of the above embodiment uses the red light emitting element 21R, the green light emitting element 21G, and the blue light emitting element 21B, but in addition, the red light emitting element 21R and the blue light emitting element 21G that contribute to plant photosynthesis. May be sealed. In this case, as shown in FIG. 14, the ratio of the number of the red light emitting elements 21R and the number of the blue light emitting elements 21B is set to 6: 1. By setting the light intensity ratio to about 6: 1, light suitable for plant growth can be irradiated. At this time, in the LED substrate 2 using the package LED 21, the circuit configuration of the blue light emitting element 21 </ b> B is the same as that in FIG. 7, but the circuit configuration of the red light emitting element 21 </ b> R is 3M rows in parallel of 2N columns of LED columns connected in series. It is configured by connecting. This is because, when a circuit of 2M rows and 3N columns is configured, the number of series increases and the voltage changes.

なお、上記の場合でも緑色発光素子を用いることが考えられる。緑色発光素子を用いることにより、光合成には寄与しないものの、植物が色鮮やかにすることができる。したがって、消費者のニーズに応え、購買意欲を掻き立てる色鮮やかな植物を育成することができる。   Even in the above case, it is conceivable to use a green light emitting element. By using a green light emitting element, plants do not contribute to photosynthesis, but plants can be made colorful. Therefore, it is possible to grow a colorful plant that responds to the needs of consumers and stimulates purchase intention.

また、固定具の構成は、前記実施形態に限られず、固定用孔を介して固定するものの他に、保持部材、LED基板及びレンズ基板に固定用孔を設けることなく、それらの端部を挟み込むことによって固定するクリップ型の固定具を用いても良い。   Further, the configuration of the fixing device is not limited to the above-described embodiment, and in addition to what is fixed through the fixing hole, the holding member, the LED substrate, and the lens substrate are sandwiched between the end portions without providing the fixing hole. You may use the clip-type fixing tool fixed by this.

さらに、第1貫通孔及び第2貫通孔の形状は円形状に限られず、その他の長孔形状、楕円形状、多角形形状をなすものであっても良い。   Furthermore, the shape of the first through hole and the second through hole is not limited to a circular shape, and may be another long hole shape, an elliptical shape, or a polygonal shape.

その上、前記実施形態では、部品共通化の観点から、レンズ基板のサイズをLED基板を等分割したサイズにしているがこれに限定されず、サイズの異なる複数種類のレンズ基板を用いても良い。   In addition, in the above-described embodiment, from the viewpoint of component commonality, the size of the lens substrate is made equal to the size of the LED substrate. .

その他、前述した実施形態や変形実施形態の一部又は全部を適宜組み合わせてよいし、本発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能であることは言うまでもない。   In addition, some or all of the above-described embodiments and modified embodiments may be combined as appropriate, and the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. .

本実施形態の植物育成装置の概略構成図。The schematic block diagram of the plant growing apparatus of this embodiment. 光源ユニットの平面図。The top view of a light source unit. 光源ユニットのA−A線断面図。The AA sectional view taken on the line of a light source unit. LED基板の平面図。The top view of a LED board. パッケージLEDの概略構成図。The schematic block diagram of package LED. パッケージLEDの回路構成図。The circuit block diagram of package LED. LED基板の緑色発光素子又は青色発光素子の回路構成図。The circuit block diagram of the green light emitting element or blue light emitting element of a LED board. LED基板の赤色発光素子の回路構成図。The circuit block diagram of the red light emitting element of a LED board. レンズ基板の平面図。The top view of a lens board | substrate. LED基板及びレンズ基板のサイズを模式的に示す図。The figure which shows typically the size of a LED board and a lens board | substrate. LED基板、レンズ基板及び保持部材の分解斜視図。The disassembled perspective view of an LED board, a lens board | substrate, and a holding member. 1つのレンズ基板のみを取り外した状態を示す斜視図。The perspective view which shows the state which removed only one lens board | substrate. LED基板、レンズ基板及び保持部材の部分拡大断面図。The partial expanded sectional view of an LED board, a lens board | substrate, and a holding member. 冷却循環機構を示す部分拡大断面図。The partial expanded sectional view which shows a cooling circulation mechanism. 変形実施形態に係るパッケージLEDの構成図。The block diagram of package LED which concerns on deformation | transformation embodiment.

100・・・植物育成装置
103・・・光源ユニット
2 ・・・LED基板
21 ・・・パッケージLED
21R・・・赤色発光素子
21G・・・緑色発光素子
21B・・・青色発光素子
3 ・・・レンズ基板
31 ・・・レンズ部
4 ・・・保持部材
DESCRIPTION OF SYMBOLS 100 ... Plant growing apparatus 103 ... Light source unit 2 ... LED board 21 ... Package LED
21R ... Red light emitting element 21G ... Green light emitting element 21B ... Blue light emitting element 3 ... Lens substrate 31 ... Lens portion 4 ... Holding member

Claims (2)

複数の植物育成用パッケージLEDと、
前記パッケージLEDを支持するLED基板と、
前記LED基板のLED搭載面の前方に設けられ、各パッケージLED毎にレンズ部が形成されたレンズ基板と、
前記LED基板及び前記レンズ基板を保持する保持部材と、を具備し、
前記パッケージLEDが、1つのパッケージ内に赤色発光素子、緑色発光素子及び青色発光素子が封止されており、前記パッケージ内に封止される赤色発光素子の数、緑色発光素子の数及び青色発光素子の数の比が4:1:1とされることにより、赤色光の強度、緑色光の強度及び青色光の強度の比が略4:1:1とされており、
前記パッケージ内で直列接続された緑色発光素子の個数及び直列接続された緑色発光素子の個数をnとしたときに、前記パッケージ内に封止された赤色発光素子が2n個ずつ直列に接続されており、
前記緑色発光素子及び前記青色発光素子の回路構成は、前記LED基板の長手方向に沿って設けられたパッケージLEDの個数分直列接続したLED列を、前記LED基板の短手方向に沿って設けられたパッケージLEDの個数分並列接続することにより構成され、
前記赤色発光素子の回路構成は、前記LED基板の長手方向に沿って設けられたパッケージLEDの個数の2倍分直列接続したLED列を、前記LED基板の短手方向に沿って設けられたパッケージLEDの個数の2倍分並列接続することにより構成されている植物育成用光源ユニット。
A plurality of plant-growing package LEDs;
An LED substrate for supporting the package LED;
A lens substrate provided in front of the LED mounting surface of the LED substrate and having a lens portion formed for each package LED;
A holding member for holding the LED substrate and the lens substrate;
In the package LED, a red light emitting element, a green light emitting element, and a blue light emitting element are sealed in one package. The number of red light emitting elements, the number of green light emitting elements, and the blue light emitting sealed in the package. By the ratio of the number of elements being 4: 1: 1, the ratio of the intensity of red light, the intensity of green light and the intensity of blue light is approximately 4: 1: 1.
When the number of green light emitting elements connected in series in the package and the number of green light emitting elements connected in series is n, 2n red light emitting elements sealed in the package are connected in series. And
In the circuit configuration of the green light emitting element and the blue light emitting element, LED rows connected in series by the number of package LEDs provided along the longitudinal direction of the LED substrate are provided along the short direction of the LED substrate. Configured by connecting in parallel the number of packaged LEDs,
The circuit configuration of the red light emitting device is a package in which LED rows connected in series by twice the number of package LEDs provided along the longitudinal direction of the LED substrate are provided along the short direction of the LED substrate. A plant-growing light source unit configured by connecting in parallel twice the number of LEDs .
LED基板上に設けられた植物育成用パッケージLEDを用いた植物育成装置であって、
前記パッケージLEDが、1つのパッケージ内に赤色発光素子、緑色発光素子及び青色発光素子が封止されており、前記パッケージ内に封止される赤色発光素子の数、緑色発光素子の数及び青色発光素子の数の比が4:1:1とされることにより、赤色光の強度、緑色光の強度及び青色光の強度の比が略4:1:1とされており、
前記パッケージ内で直列接続された緑色発光素子の個数及び直列接続された緑色発光素子の個数をnとしたときに、前記パッケージ内に封止された赤色発光素子が2n個ずつ直列に接続されており、
前記緑色発光素子及び前記青色発光素子の回路構成は、前記LED基板の長手方向に沿って設けられたパッケージLEDの個数分直列接続したLED列を、前記LED基板の短手方向に沿って設けられたパッケージLEDの個数分並列接続することにより構成され、
前記赤色発光素子の回路構成は、前記LED基板の長手方向に沿って設けられたパッケージLEDの個数の2倍分直列接続したLED列を、前記LED基板の短手方向に沿って設けられたパッケージLEDの個数の2倍分並列接続することにより構成されていること特徴とする植物育成装置。
A plant growing device using a plant growing package LED provided on an LED substrate ,
In the package LED, a red light emitting element, a green light emitting element, and a blue light emitting element are sealed in one package. The number of red light emitting elements, the number of green light emitting elements, and the blue light emitting sealed in the package. By the ratio of the number of elements being 4: 1: 1, the ratio of the intensity of red light, the intensity of green light and the intensity of blue light is approximately 4: 1: 1.
When the number of green light emitting elements connected in series in the package and the number of green light emitting elements connected in series is n, 2n red light emitting elements sealed in the package are connected in series. And
In the circuit configuration of the green light emitting element and the blue light emitting element, LED rows connected in series by the number of package LEDs provided along the longitudinal direction of the LED substrate are provided along the short direction of the LED substrate. Configured by connecting in parallel the number of packaged LEDs,
The circuit configuration of the red light emitting device is a package in which LED rows connected in series by twice the number of package LEDs provided along the longitudinal direction of the LED substrate are provided along the short direction of the LED substrate. A plant growing device characterized by being configured by connecting in parallel twice the number of LEDs.
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