JP5003783B2 - Piezoelectric vibrating piece, piezoelectric vibrator and acceleration sensor - Google Patents

Description

  The present invention relates to a piezoelectric vibrating piece, a piezoelectric vibrator, and an acceleration sensor with reduced other-axis sensitivity.

The tuning-fork type crystal vibrating piece is generally symmetric in the shape of the front and back surfaces (XY plane) of the vibrating arm. It is described in. The tuning fork type crystal resonator can be used as an acceleration sensor material for detecting the acceleration in the Y-axis direction when the longitudinal direction of the vibrating arm is the Y-axis. In addition, when the tuning fork crystal unit is accelerated in the + Z axis direction, which is the thickness direction of the tuning fork type crystal unit, the vibrating arm of the tuning fork type crystal unit is affected by the inertial force and bends in the -Z axis direction. On the other hand, when the acceleration movement is performed in the −Z axis direction, the bending is performed in the + Z axis direction.

JP 2004-200917 A

Then, in the tuning fork type piezoelectric vibrator formed by the Z-cut quartz substrate, the inventor investigated the stress distribution in the state where the vibrating arm was bent, and found that the stress was concentrated on the plane on the + Z plane side. did. That is, the present inventors have found that a neutral surface that is not subjected to compression or tension due to bending is generated by being offset toward the + Z surface side. From this, the + Z plane side of the tuning fork type crystal vibrating piece is
It can be said that the rigidity is higher than that on the −Z plane side.

As described above, the tuning fork type crystal resonator is mainly formed on the basis of a Z-cut quartz substrate, but in this case, the coupled state in the thickness direction of the crystal has no symmetry and has anisotropy in the thickness direction. . That is, when the tuning fork type crystal vibrating piece is turned over, the original tuning fork type crystal vibrating piece and the crystal arrangement are not the same. Due to this anisotropy, the elastic constant, the piezoelectric constant, etc. related to the bending stress are not the same on the + Z plane and the −Z plane, and this causes a difference in rigidity. In the case of quartz, the + Z plane side is higher. It is considered a thing.

As described above, a tuning fork type piezoelectric vibrator having a difference in rigidity between the + Z plane side and the −Z plane side as described above is used.
When used as an acceleration sensor for detecting the axial acceleration, the acceleration sensor reacts to the acceleration in the Z-axis direction, that is, other axis sensitivity is generated. Can't get.

Such a problem of other-axis sensitivity is considered to occur as follows. In the case where there is an imbalance in rigidity with respect to the bending in the Z direction on the + Z plane side and the −Z plane side, when the tuning fork type quartz vibrator is excited and bent, the + Z plane side from the neutral plane is against the bending vibration. The rigidity is strong and the -Z plane side is weak. As a result, since the amplitude of the −Z plane side is larger than that of the + Z plane side, the vibration arm is pulled toward the + Z plane side by the tensile stress from the strong + Z plane at the portion where the amplitude is large. As a result, the vibrating arm does not vibrate horizontally with the plane formed by the plate-like tuning fork-shaped piezoelectric vibrator as a whole. That is, the vibrating arm of the tuning fork crystal resonator vibrates not only in the X-axis direction but also in the Z-axis direction. Under such a vibration form,
When the tuning fork-type crystal oscillator performs an acceleration motion in the Z-axis direction, the component that vibrates in the Z-axis direction of the vibrating arm receives an inertial force due to the acceleration in the Z-axis direction, so the vibration frequency in the Z-axis direction changes. Accordingly, the resonance frequency of the vibrating arm that swings in the X-axis direction also changes. This effect appears as noise in addition to the desired resonance frequency of the tuning fork type crystal resonator.

Therefore, the present invention pays attention to the above-mentioned problems, and provides a piezoelectric vibrating piece that reduces the other-axis sensitivity by balancing the rigidity of both sides of the piezoelectric vibrating piece with respect to the bending vibration described above, and a piezoelectric vibrator and an acceleration sensor mounted with the piezoelectric vibrating piece. The purpose is to provide.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

[Application Example 1] A vibrating arm extending in a first direction and cantilevered, a base for cantilevering the vibrating arm, and bending the vibrating arm in a second direction perpendicular to the first direction A piezoelectric vibrating piece having an excitation electrode to vibrate, wherein the vibrating arm is provided with a stiffness adjusting portion for bending in a third direction perpendicular to the first and second directions. .
The piezoelectric vibrating piece formed from the piezoelectric substrate may have different rigidity against bending stress or the like on each surface due to its anisotropy. When such a piezoelectric vibrating piece is bent and vibrated by the excitation electrode, it has a component that amplitudes not only in a predetermined amplitude direction but also in a direction perpendicular thereto. Therefore, according to the application example 1, by balancing rigidity with respect to the bending vibration, it is possible to reduce a component that vibrates in a direction that vibrates perpendicularly to the bending vibration of the vibrating arm. Therefore, it is possible to form a piezoelectric vibrating piece that reduces the occurrence of a deviation in the resonance frequency of the bending vibration caused by the acceleration from the third direction.

Application Example 2 A vibrating arm formed of a Z-cut piezoelectric substrate and cantilevered in the longitudinal direction, a base for cantilevering the vibrating arm, and the vibrating arm bent in a direction perpendicular to the thickness direction A piezoelectric vibrating piece comprising an excitation electrode to be vibrated, wherein the vibrating arm is provided with an adjustment portion for rigidity against bending in the thickness direction.
A piezoelectric vibrating piece formed of a Z-cut piezoelectric substrate has different rigidity against bending stress or the like on the + Z plane and the −Z plane due to its anisotropy. When such a piezoelectric vibrating piece is flexibly vibrated by an excitation electrode, it has not only a component that horizontally swings with the plane formed by the plate-like piezoelectric vibrating piece but also a component that also swings in the direction perpendicular to the plane (thickness direction). become. Therefore, according to Application Example 2, the component that vibrates in the thickness direction of the vibrating arm can be reduced by balancing the rigidity against the bending vibration. Therefore, it is possible to form a piezoelectric vibrating piece that reduces the occurrence of a deviation in the resonance frequency of bending vibration caused by acceleration from the thickness direction.

Application Example 3 The application example 2 is characterized in that the adjustment portion is a groove provided along the free end direction of the vibrating arm from the base side of the surface facing the third direction of the vibrating arm. The piezoelectric vibrating piece according to 1.
According to the third application example, the bending side of the vibrating arm on the + Z plane side is formed on the base side of the vibrating arm, which is the portion where the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece. It is possible to effectively weaken the rigidity against bending stress due to vibration, balance the rigidity between the + Z plane side and the −Z plane side of the vibrating arm, and reduce the thickness direction component of the bending vibration of the vibrating arm. Therefore, it is possible to form a piezoelectric vibrating piece in which the detection sensitivity of the acceleration in the thickness direction, that is, the other-axis sensitivity is reduced.

Application Example 4 The piezoelectric vibrating piece according to Application Example 2, wherein the adjustment unit is a notch provided on the base side of the + Z plane of the vibrating arm.
According to the application example 4, in the case of the application example 3, by forming a notch on the base side of the vibrating arm, which is a portion to which the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece, the + Z plane is formed. In comparison, the rigidity against bending stress due to bending vibration on the + Z plane side can be effectively reduced only by etching a smaller region. Further, since the high-precision patterning for positioning the groove in the photolithography processing as in the case of the application example 3 is not required, the manufacturing yield of the piezoelectric vibrating piece can be increased.

Application Example 5 The adjustment unit includes a first groove provided along the free end direction of the vibrating arm from the base side of the + Z plane of the vibrating arm, and a base side of the −Z plane of the vibrating arm. And a second groove provided along a free end direction of the vibrating arm, wherein the first groove is formed deeper than the second groove. Piezoelectric vibrating piece.
According to Application Example 5, the CI value of the piezoelectric vibrating piece can be reduced by providing grooves on both sides of the base side of the vibrating arm, which is the portion where the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece. By providing the groove on the + Z plane side deeper than the -Z plane side, the relative strength difference of the bending stress due to the bending vibration between the + Z plane side and the -Z plane side is reduced, and the + Z plane side of the vibrating arm against bending vibration And the rigidity on the −Z plane side can be balanced, and the component in the thickness direction of the bending vibration of the vibrating arm can be reduced. Therefore, the sensitivity of detecting the acceleration in the thickness direction, that is, the sensitivity of the other axis can be suppressed, and a piezoelectric vibrating piece having a low CI value can be formed.

Application Example 6 The adjustment unit includes a first groove provided along the free end direction of the vibrating arm from the base side of the + Z plane of the vibrating arm, and a base side of the −Z plane of the vibrating arm. And a second groove provided along a free end direction of the vibrating arm, and an end on the base side of the first groove is located closer to a base side than an end on the base side of the second groove. The piezoelectric vibrating piece according to Application Example 2, wherein
According to the application example 6, by forming a groove on the base side of the vibrating arm, which is the portion where the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece, the bending by the bending vibration on the + Z surface side is formed. Effectively weaken the rigidity against stress, and +
The rigidity of the Z plane side and the −Z plane side can be balanced. Further, the groove on the + Z plane side and the groove on the −Z plane side do not interfere in the depth direction. Therefore, the degree of freedom of design in the depth direction of the groove is improved as compared with Application Example 5, and the groove can be designed deeper than in Application Example 5,
A piezoelectric vibrating piece having a lower CI value than in the case of Application Example 5 can be formed. Further, since the asymmetry in the thickness direction is improved as compared with the case of Application Example 5, the effect of suppressing the occurrence of unnecessary vibration due to the thickness dimension is improved.

Application Example 7 The base end side of the second groove is positioned on the base side of the free end side of the first groove, and the first and second grooves are from the thickness direction. The piezoelectric vibrating piece according to Application Example 6, wherein an overlap region that overlaps when viewed is formed.
According to Application Example 7, as in Application Example 6, the groove on the + Z plane side and the groove on the −Z plane side do not interfere with each other in the depth direction, and the degree of freedom in designing the groove depth direction is improved. In the overlap region, the vibrating arms are thinned in the thickness direction, the distance between the excitation electrodes formed in the grooves on both sides is shortened, and a large electric field can be applied to the overlap region. Can be formed. In addition, since the contact with the etching solution in the groove region is sparser than that in the outer region, the etching rate in the groove region is slower than the etching rate in the outer region. Therefore, a special process for digging the groove is not required, and the piezoelectric vibrating piece can be formed simultaneously with the outer shape extraction of the piezoelectric vibrating piece. Thus, a piezoelectric vibrating piece having a higher yield than that of the application example 6 can be formed.

Application Example 8 The adjustment unit includes a first groove provided along the free end direction of the vibrating arm from the base side of the + Z plane of the vibrating arm and a base side of the −Z plane of the vibrating arm. The piezoelectric vibrating piece according to Application Example 2, comprising a second groove provided along a free end direction of the vibrating arm and a beam provided on a base side of the second groove.
According to the configuration of the application example 8, the groove length can be configured to be short so that the base side of the vibrating arm, which is the portion where the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece, is thick.
Even if the length of the beam is shortened, the rigidity against bending stress due to bending vibration on the −Z plane side is relatively increased with respect to the + Z plane side, and the + Z plane side of the vibrating arm against bending stress due to bending vibration and −Z It is possible to balance the rigidity with the surface side. In addition, since the length of the groove for forming the excitation electrode film can be sufficiently secured, the electrode of the piezoelectric vibrating piece can be formed widely in the groove. Moreover, since the form which provided the groove | channel on both surfaces is maintained, the piezoelectric vibrating piece which has a CI value comparable with the piezoelectric vibrating piece of the application example 5 can be formed. Furthermore, since the asymmetry in the thickness direction is improved by forming the beam as compared with the case of the application example 5 or 6, the effect of suppressing the occurrence of unnecessary vibration depending on the thickness dimension is improved.

[Application Example 9] The piezoelectric vibrating piece according to Application Example 8, wherein the beam is isolated from the base side of the second groove to the free end side.
According to the application example 9, in the groove on the −Z plane, −Z is increased as the beam is separated from the base side to the free end side.
The rigidity against bending stress due to the bending vibration of the surface can be reduced. Therefore, by appropriately determining the position of the beam, it is possible to finely adjust the rigidity against the bending stress caused by the bending vibration of the −Z plane of the vibrating arm. In addition, since the degree of asymmetry in the thickness direction can be determined by appropriately determining the position of the beam, optimization for suppressing unnecessary vibration can be performed.

Application Example 10 the adjusting portion includes a first electrode film provided on the + Z surface of the resonating arm, is provided on the -Z face of the vibrating arm, and a thin first than the second electrode film The piezoelectric vibrating piece according to any one of application examples 1 to 9, wherein the piezoelectric vibrating piece includes an electrode film.
According to Application Example 10, the −Z plane side flexural vibration can be obtained by making the −Z plane side electrode film thicker than the + Z plane side without performing a special etching process for forming the above-described groove or the like in the piezoelectric vibrating piece. By relatively increasing the rigidity with respect to the bending stress caused by the above, it is possible to balance the rigidity of both surfaces with respect to the bending vibration, and to reduce the thickness direction component of the bending vibration of the vibrating arm. Therefore, it is possible to form a piezoelectric vibrating piece in which the detection sensitivity of the acceleration in the thickness direction, that is, the other-axis sensitivity is reduced. In addition, since it is not necessary to form a groove or the like in the piezoelectric vibrating piece, the manufacturing process is prevented from becoming complicated, and the manufacturing yield of the piezoelectric vibrating piece can be increased. Furthermore, by adding this application example to the piezoelectric vibrating reeds described in Application Examples 1 to 9, not only the grooves and the like obtained by etching, but also the rigidity balance against bending vibration is adjusted by the electrode film. Therefore, the adjustment range of the rigidity of the vibrating arm is expanded, and the sensitivity of the other axis can be more effectively reduced.

Application Example 11 Two resonating arms are provided in parallel at the base with cantilever support, and the excitation electrode formed on one resonating arm and the excitation electrode formed on the other resonating arm are crossed. 11. The piezoelectric vibrating piece according to any one of application examples 1 to 10, wherein the piezoelectric vibrating piece is connected by wiring.
According to Application Example 11, by providing two vibrating arms in a cantilevered manner in parallel with the base,
The resonating arm is formed in a tuning fork type, and further by cross-wiring excitation electrodes to the resonating arm, the tuning fork type is capable of anti-phase vibration with the bending mode in which the resonating arms approach and separate from each other as the fundamental wave mode. Further, by applying any one of the application examples 1 to 10 to the piezoelectric vibrating piece, a tuning-fork type piezoelectric vibrating piece with reduced thickness direction acceleration, that is, sensitivity to other axes can be obtained. Can be formed.

[Application Example 12] A piezoelectric vibrator or an acceleration sensor in which the piezoelectric vibrating piece according to any one of Application Examples 1 to 11 is mounted in a cantilevered state with the base portion as a fixed end.
According to the application example 12, the piezoelectric vibration mounted with the piezoelectric vibrating piece with the other axis sensitivity reduced by reducing the component of the bending vibration that vibrates in the Z-axis direction using the first direction or the longitudinal direction as the detection axis. Can build a child. Also, it is possible to construct an acceleration sensor mounted with a piezoelectric vibrating piece in which the sensitivity of the other axis is reduced by reducing the component that vibrates in the thickness direction of the bending vibration by using the first direction or the longitudinal direction as an acceleration detection axis. it can. Furthermore, the frequency adjustment after mounting is performed on the free end side of the vibrating arm, but the rigidity adjustment is performed on the base side of the vibrating arm, so the frequency adjustment and the rigidity adjustment can be performed independently without interfering with each other. it can.

It is the schematic of the tuning fork type piezoelectric vibrating piece of 1st Embodiment. It is AA sectional view taken on the line which shows the neutral surface at the time of bending in the thickness direction. It is the schematic of the tuning fork type piezoelectric vibrating piece of 2nd Embodiment. It is an AA line sectional view of a tuning fork type piezoelectric vibrating piece of a 3rd embodiment. It is the schematic of the tuning fork type piezoelectric vibrating piece of 4th Embodiment. It is a BB sectional view of a tuning fork type piezoelectric vibrating piece of a 5th embodiment. It is BB sectional drawing of the tuning fork type piezoelectric vibrating piece of 6th Embodiment. It is the schematic of the acceleration sensor of 7th Embodiment. It is the schematic which shows stress distribution when a tuning fork type piezoelectric vibrating piece bends in the thickness direction. It is a table | surface which shows the simulation result of the frequency variation of a tuning fork type piezoelectric vibrating piece.

Hereinafter, the best embodiments of a piezoelectric vibrating piece, a piezoelectric vibrator, and an acceleration sensor according to the present invention will be described based on a tuning fork type piezoelectric vibrating piece with reference to the drawings. Needless to say, the present invention can also be applied to piezoelectric vibrating pieces having more than one.
Schematic diagrams of the tuning fork type piezoelectric vibrating piece according to the first embodiment are shown in FIGS.
c) (A-A line sectional view) In addition, since the whole external form is the same also in below-mentioned embodiment, the AA line and BB line which were described in Fig.1 (a) are applied as it is also in other embodiment. Further, the relationship between the directions of the X axis, the Y axis, and the Z axis shown in FIG. 1 and the tuning fork type piezoelectric vibrating piece is applied as it is in the other embodiments. Further, in any of the embodiments, the bending vibration of the tuning fork type piezoelectric vibrating piece is a fundamental wave mode.

The piezoelectric vibrating piece according to the first embodiment is formed of a Z-cut piezoelectric substrate, has a vibrating arm that is cantilevered in the longitudinal direction, a base that cantilever-supports the vibrating arm, and the vibrating arm in the thickness direction. A piezoelectric vibrating piece composed of an excitation electrode that bends and vibrates in a vertical direction, wherein the two vibrating arms are provided in a cantilevered manner in parallel with the base, and the excitation electrode formed on one vibrating arm;
The excitation electrode formed on the other vibrating arm is connected to the vibrating arm by a cross wiring, and the vibrating arm is provided with a rigidity adjusting portion with respect to bending in the thickness direction, and from the base side of the + Z plane of the vibrating arm, It is a groove provided along the free end direction.

FIG. 1A is a plan view showing a tuning-fork type piezoelectric vibrating piece 10 used in a method for manufacturing a piezoelectric vibrator according to an embodiment of the present invention. The bottom view of the tuning-fork type piezoelectric vibrating piece 10 appears symmetrically with the plan view, except that the groove 26 does not appear. The tuning fork type piezoelectric vibrating piece 10 is made of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. In the case of quartz, Z is one of the crystal axes
Although the Z plane with the axis as the normal direction is used, the normal line of the Z plane is actually cut out from the crystal crystal with a declination of about 10 degrees at the maximum with respect to the Z axis. The tuning fork type piezoelectric vibrating piece 10 includes a base 12.
And a pair of vibrating arms 14 extending from the base 12.

FIG. 1B is an enlarged cross-sectional view taken along the line AA of the tuning-fork type piezoelectric vibrating piece 10 shown in FIG. 1A (excluding the excitation electrode film for explanation). FIG. 1C is an enlarged cross-sectional view of the tuning fork type piezoelectric vibrating piece 10 shown in FIG. 1A taken along the line AA (with an excitation electrode film). The resonating arm 14 has a + Z surface 16 (front surface in a broad sense), a −Z surface 18 (back surface in a broad sense), and a first side surface 20 that connects the + Z surface 16 and the −Z surface 18 on both sides. And a second side surface 22.

On the other hand, the first side surface 20 of the vibrating arm 14 (left side in FIG. 1B) and the second side surface 22 of the other vibrating side arm 14 (right side in FIG. 1B) are arranged in parallel. Each cantilever is supported by the base 12. Therefore, the base 12 side of the vibrating arm 14 of the tuning fork type piezoelectric vibrating piece 10 is a fixed end, and the other end is a free end. When the vibrating arm 14 is subjected to bending vibration in the fundamental wave mode, the base 12 side of the vibrating arm 14 is a portion where the bending stress due to bending vibration is most intense, and the free end side is a portion that vibrates with the largest amplitude. Become.

The resonating arm 14 has a base portion 24 (fixed end) connected to the base portion 12 that is widened toward the base portion 12 and is connected to the base portion 12 with a wide width, so that the rigidity is high.
The vibrating arm 14 is formed with grooves 26 extending in the longitudinal direction on the + Z surface 16.
The groove 26 has a length of 50 to 70% in the longitudinal direction of the vibrating arm 14. The groove 26 has a width of 60 to 90% of the width of the vibrating arm 14. The groove 26 includes a first inner surface 28 that extends back to back with the first side surface 20, and a second inner surface 30 that extends back to back with the second side surface 22.

The groove 26 reduces the rigidity of the vibrating arm 14 with respect to bending vibration, and at the same time, generates a strong electric field between the first side surface 20 and the first inner surface 28 and between the second side surface 22 and the second inner surface 30. Since it can be formed, a high reverse piezoelectric effect can be obtained. As a result, the vibrating arm 14 can be vibrated efficiently and the CI value can be lowered. Further, as described later, a groove 26 is provided on the + Z surface 16 side,
By providing a groove on the −Z surface 18 side that is not provided with a groove or a groove that is shallower or smaller than the groove 26 on the + Z surface 16 side even if a groove is provided, the difference in rigidity against bending vibration can be canceled.

A pair of constricted portions 32 are formed in the base 12 so as to be opposed to each other so that the width in the width direction (X-axis direction) becomes narrow. The pair of constricted portions 32 is formed between the mount portion 34 of the tuning fork type piezoelectric vibrating piece 10 and the vibrating arm 14. Therefore, the constricted portion 32 causes the vibrating arm 1 to
Since the transmission of the vibration 4 is cut off, it is possible to suppress the vibration from being transmitted to the outside via the base 12 and the vibrating arm 14 (vibration leakage), and to prevent the CI value from increasing. Constriction length 32 (
The longer the depth (depth) is within a range in which the strength of the base 12 can be secured, the greater the vibration leakage suppressing effect.

As shown in FIG. 1C, an excitation electrode film is formed on the vibrating arm 14. The excitation electrode film may have a multilayer structure including a base Cr film having a thickness of 100 to 300 mm and an Au film formed on the Cr film and having a thickness of 200 to 500 mm. C
The r film has high adhesion to the crystal, and the Au film has low electrical resistance and is difficult to oxidize. The excitation electrode film is the first
The first and second side surface electrode films 36 and 38 formed on the second and second side surfaces 20 and 22, respectively, and the first and second inner surface layers 28 and 30, respectively. Electrode film 40
, 42 and a bottom electrode film 44 formed on the −Z surface 18.

The first and second inner surface electrode films 40, 42 formed in one groove 26 and constituting the first excitation electrode film 46 are continuously formed and electrically connected to each other. A film 46 is formed.
In addition, the first side electrode film 36 and the second side electrode film 38 formed on one vibrating arm 14 are electrically connected to constitute a second excitation electrode film 48.
Further, the bottom electrode film 44 constitutes a third excitation electrode film 50.

The first excitation electrode film 46 formed in the groove 26 of one vibrating arm 14 is the + Z plane 1 of the base 12.
6 is connected to the extraction electrode film 52 formed on the second vibration arm 14 and is connected to the second excitation electrode film 48 formed on the side surface of the other vibrating arm 14. The third excitation electrode film 50 formed on the −Z surface 18 of one vibrating arm 14 is connected to the extraction electrode film (not shown) formed on the −Z surface 18 of the base 12, and the other It is connected to the second excitation electrode film 48 formed on the side surface of the vibrating arm 14. The first side electrode film 36 and the second side electrode film 38 formed on both side surfaces of the other vibrating arm 14 are formed on at least one of the + Z plane 16 and the −Z plane 18 on the distal end side of the vibrating arm 14. The connection electrode film 54 is connected. The connection electrode film 54 may function as a frequency adjusting weight. For example, the mass of the connection electrode film 54 can be reduced and the resonance frequency can be increased.

In the present embodiment, a voltage is applied between the first side electrode film 36 and the first inner surface electrode film 40, and between the first side electrode film 36 and the bottom electrode film 44, so that the second side surface By applying a voltage between the electrode film 38 and the second inner electrode film 42 and between the second side electrode film 38 and the bottom electrode film 44, one side end of the vibrating arm 14 is extended, and the other The vibrating arm 14 is bent and vibrated by contracting the side end of the arm. In other words, in one vibrating arm 14, the first excitation electrode film 46 and the second
A voltage is applied between the excitation electrode film 48 and the third excitation electrode film 50 and the second excitation electrode film 48, so that the first side surface 20 and the second side surface 22 of the vibrating arm 14 are The vibrating arm 14 is bent and vibrated by extending and contracting. It is known that the CI value decreases as the length of the first and second excitation electrode films 46 and 48 in the longitudinal direction is increased to 70% of the length of the vibrating arm 14.

The operation of the tuning-fork type piezoelectric vibrating piece 10 according to the present embodiment will be described with reference to FIG. FIG.
As shown in (c), the first excitation electrode film 46 and the second excitation electrode film 48 of one vibrating arm 14.
A voltage is applied between the third excitation electrode film 50 and the second excitation electrode film 48, and the first excitation electrode film 46 and the second excitation electrode film 48 of the other vibration arm 14 The third excitation electrode film 5 during
A voltage is applied between 0 and the second excitation electrode film 48.

Here, the first excitation electrode film 46 and the third excitation electrode film 50 of one (left side) vibration arm 14 and the second excitation electrode film 48 of the other (right side) vibration arm 14 have the same potential (FIG. 1). In the example of (c), the second excitation electrode film 48 of the one (left side) vibrating arm 14 and the first excitation electrode film 46 of the other (right side) vibrating arm 14 and the third potential become + potential). The first excitation electrode film 46, the second excitation electrode film 48, and the third excitation electrode film 50 are set so that the excitation electrode film 50 has the same potential (−potential in the example of FIG. 1C). It is connected to an AC power supply by a cross wiring, and an alternating voltage as a drive voltage is applied. An electric field is generated by the applied voltage, as indicated by an arrow in FIG. 1 (c), so that the vibrating arms 14 are in anti-phase vibration with each other (the free end side of the vibrating arm 14 modulo the Z axis). It is excited to bend and vibrate so as to approach and separate from each other in the plane of the line.
The alternating voltage is adjusted so as to vibrate in the basic mode.

2A (when no groove 26 is provided) and (b) when the groove 26 is formed, the state of the neutral surface generated when the tuning-fork type piezoelectric vibrating piece 10 is bent in the Z-axis direction is indicated by A−. A cross-sectional view along line A is shown. As described above, when acceleration is applied in the Z-axis direction, the tuning fork type piezoelectric vibrating piece 10 bends and the + Z plane 1
Tensile stress acts on the 6 side and compressive stress acts on the −Z surface 18 side. Then, the neutral surface 56 in which neither compression nor tension is generated in the vibrating arm 14 is generated by being shifted toward the + Z surface 16 side as shown in FIG. When such a tuning fork-shaped piezoelectric vibrating piece 10 is flexibly vibrated, it has a component that not only amplitudes in the X direction but also amplitudes in the Z direction. As a result, the component of the flexural vibration that vibrates in the Z-axis direction receives an inertial force due to the acceleration in the Z-axis direction, which causes the vibration frequency of the flexural vibration in the Z-axis direction to fluctuate. The resonance frequency of the bending vibration that swings in the direction fluctuates.

On the other hand, by forming the groove 26 as shown in FIG. 2B, the resonating arm 14 having a single-sided concave cross-sectional shape is formed. When the tuning fork type piezoelectric vibrating piece 10 is flexibly vibrated in this state,
The groove 26 is formed along the free end side from the base portion 24 on the base 12 side of the vibrating arm 14 which is the portion where the bending stress due to the bending vibration is the most, and thereby the rigidity of the vibrating arm 14 with respect to bending vibration is increased. Since the most contributing part is removed, the rigidity against the bending vibration on the + Z plane 16 side is effectively reduced. At this time, the neutral surface 56 is shifted to an intermediate portion in the thickness direction as shown in FIG. 2 (b), and the + Z surface 16 from the neutral surface 56 in the vibrating arm 14.
The difference between the bending moment of the component on the side and the bending moment of the component on the −Z plane 18 side from the neutral surface 56 is reduced, and thus the component of the bending vibration that vibrates in the Z-axis direction is reduced. Therefore, even if the tuning-fork type piezoelectric vibrating piece 10 receives acceleration from the Z-axis direction, the inertial force that the bending vibration receives due to the acceleration from the Z-axis direction can be suppressed to a small extent, and the detection sensitivity of acceleration from the Z-axis direction can be reduced. it can.

As described above, the piezoelectric vibrating piece formed from the Z-cut piezoelectric substrate is
The rigidity against bending stress or the like is different between the + Z plane 16 and the −Z plane 18. When such a piezoelectric vibrating piece is flexibly vibrated by an excitation electrode, it has not only a component that horizontally swings with the plane formed by the plate-like piezoelectric vibrating piece but also a component that also swings in the direction perpendicular to the plane (thickness direction). become.
Therefore, according to the first embodiment, by balancing the rigidity against the bending vibration,
A component that vibrates in the thickness direction of the vibrating arm can be reduced. Therefore, it is possible to form a piezoelectric vibrating piece that reduces the occurrence of a deviation in the resonance frequency of bending vibration caused by acceleration from the thickness direction. Furthermore, according to the first embodiment, the vibration is generated by forming the groove 26 on the + Z surface 16 on the base 12 side of the vibrating arm 14 which is the portion to which the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece. The bending resistance of the vibrating arm 14 is effectively reduced by effectively reducing the rigidity against bending stress caused by bending vibration on the + Z surface 16 side of the arm 14 to balance the rigidity of the vibrating arm + Z surface 16 side and the −Z surface 18 side. Components in the thickness direction can be reduced. Therefore, it is possible to form a piezoelectric vibrating piece in which the detection sensitivity of the acceleration in the thickness direction, that is, the other-axis sensitivity is reduced. Further, the two vibrating arms 14 are provided in a cantilevered manner in parallel with the base portion, so that the vibrating arm 14 is formed in a tuning fork shape, and further, by vibrating the excitation electrode to the vibrating arm 14, the vibrating arm 14 is formed. It is possible to form a tuning-fork type piezoelectric vibrating piece capable of anti-phase vibration using a bending vibration in which the 14 approaches and separates from each other as a fundamental wave mode, and any one of the following embodiments is applied to the piezoelectric vibrating piece. Thus, a tuning-fork type piezoelectric vibrating piece with reduced acceleration in the thickness direction, that is, sensitivity to other axes can be formed.

FIG. 9A is a cross-sectional view taken along the line C-C when the tuning fork type piezoelectric vibrating piece 10 schematically shown in FIG. 9D is cantilevered by the base 12 and the acceleration α is applied in the Z-axis direction. is there. Here, the crystal axis of the crystal of the tuning-fork type piezoelectric vibrating piece 10 is the same as that of FIG. 1A of the present invention.
The shape was such that the grooves and excitation electrodes were eliminated. The length of the vibrating arm made of quartz is 3200μ.
The width was 204 μm.

When the acceleration α is applied in the Z-axis direction, that is, the normal direction of the + Z plane 16, an inertial force acts on the vibrating arm 14 in the −Z plane 18 direction opposite to the acceleration α. As a result, the vibrating arm 14 is bent, and a tensile stress is applied in the Y-axis direction (longitudinal direction) in the vicinity of the + Z surface 16 of the vibrating arm 14.
A compressive stress is applied in the Y-axis direction in the vicinity of the Z surface 18.

The inventor determines that the acceleration α in FIG. 9A is 500 G (G is the absolute value of gravitational acceleration).
The stress distribution in the axial direction was simulated. The simulation result of the stress distribution for the region 76 near the root portion 24 is shown in FIG. 9B (YZ plane), and the simulation result of the stress distribution (neutral plane) in the DD line cross section is shown. It is shown in 9 (c) (XZ plane).

As can be seen from FIGS. 9A and 9B, the stress in the Y-axis direction is away from the + Z plane 16 and −Z plane 1.
As the value approaches 8, the surface continuously changes from tension to compression and the stress in the Y-axis direction becomes zero, that is, the neutral surface 56 is formed. As a result of the simulation, the inventor found that the neutral plane 56 and + Z
The distance to the surface 16 is shorter than the distance between the neutral surface 56 and the −Z surface 18, that is, the neutral surface 5.
I found 6 gaps. The inventor found that the deviation of the neutral surface 56 is such that the rigidity against bending stress due to the Z-axis direction deflection on the + Z surface 16 side of the crystal is larger than the rigidity against bending stress due to the Z-axis direction deflection on the −Z surface 18 side. I thought it would result from the high price.

Further, the absolute value of the tensile stress at the location 78 away from the neutral surface 56 by the distance L toward the + Z surface 16 is greater than the absolute value of the compressive stress at the location 80 away from the neutral surface 56 by the distance L from the −Z surface 18. The inventor found that the price was also higher. That is, the tendency for stress to concentrate on the + Z plane 16 side was found. From these facts, it was considered that the rigidity with respect to the bending stress due to the bending vibration in the fundamental wave mode of the tuning-fork type piezoelectric vibrating piece 10 is also different from the neutral plane 56 to the + Z plane 16 side and the −Z plane 18 side.

A change in the natural resonance frequency of the fundamental wave mode when acceleration in the Z-axis direction, that is, the normal direction of the Z plane is applied to the tuning fork type piezoelectric vibrating piece 10 is obtained by simulation, and the frequency deviation is shown in FIG. . The frequency deviation is a frequency change per unit change amount of acceleration in the normal direction of the Z plane, and here, the unit is ppm / 1G. In addition, the frequency change per unit change amount of acceleration in the Z-axis direction may be referred to as thickness direction sensitivity.

The tuning-fork type piezoelectric vibrating piece used for the simulation is an isotropic material with a shape without grooves (1), and an anisotropic material with a shape without grooves (2). The groove is formed on the + Z plane side and using an anisotropic material (3), and the groove is formed on the −Z plane side and using an anisotropic material (4).

Except for the presence or absence of the groove and the position of the groove, the shape is as shown in FIGS. 1A to 1C, and each dimension is defined as shown in FIG. However, the length of the vibrating arm of the groove (3) using the anisotropic material formed on the + Z plane side is set to 1644 μm, but other examples (1), (2), (4
) Has been fine-tuned. That is, if other dimensions are not changed, the presence or absence of grooves,
The natural resonance frequency Fd of the fundamental wave mode changes depending on the position and material of the groove. However, by adjusting the length of the vibrating arm, other dimensions and Fd were adjusted. Note that the natural resonance frequency of the fundamental wave mode of the cantilever is generally inversely proportional to the square of the length of the vibrating arm.

As can be seen from FIG. 10 (b), even when the anisotropic material is used even when the shape has no groove (
2) When the isotropic material is used, it can be seen that the frequency deviation is larger by about two orders of magnitude compared to (1).
In addition, when an anisotropic material is used, if a groove is provided on the + Z plane side (3), a shape without a groove (2)
On the other hand, when the groove was provided on the −Z plane side (4), the frequency deviation was increased as compared with the shape (2) having no groove.

Therefore, if a groove is provided on the + Z plane side of the vibrating arm, the rigidity against the bending stress due to the bending vibration on the + Z plane side is reduced, and the rigidity against the bending stress due to the bending vibration on the −Z plane side can be balanced. As a result, the frequency deviation is considered to decrease.

On the other hand, if a groove is provided on the −Z plane side, the rigidity against bending stress due to bending vibration on the −Z plane side decreases, the difference from the bending stress due to bending vibration on the + Z plane side further spreads, and the balance becomes worse. As a result, the frequency deviation is considered to increase.

FIG. 3 is a schematic diagram (FIG. 3A) of a tuning-fork type piezoelectric vibrating piece 10 according to the second embodiment, and A−.
A sectional view (FIG. 3B) is shown. The tuning-fork type piezoelectric vibrating piece 10 according to the second embodiment is basically the same as that of the first embodiment, but the adjustment unit for adjusting the rigidity of the vibrating arm with respect to bending vibration is the base of the + Z plane of the vibrating arm. It is a notch provided along the free end direction of the vibrating arm from the side. In the second embodiment and subsequent embodiments, an excitation electrode film is formed on the tuning-fork type piezoelectric vibrating piece, but the form thereof is the same as that of the first embodiment, and the description thereof is omitted.

In the second embodiment, the notch 58 can be formed by etching a tuning fork type piezoelectric vibration element plate (not shown) with a metal film, leaving a portion where the notch is to be formed. Notch 58
It can be considered that the width of the groove 26 in the first embodiment is widened to be the same as the width of the vibrating arm 14 in the X-axis direction. As described above, the base 12 side of the vibrating arm 14 is the portion to which bending stress due to bending vibration is applied most. If the notch 58 is formed here, the portion most contributing to the rigidity against bending vibration is cut out more than the groove 26. Therefore, when a groove and a notch of the same length formed along the free end direction from the base 12 side of the vibrating arm 14 are formed and compared, it is clear that the notch has a greater rigidity adjustment effect. is there. Conversely, the notch need not be formed so long in the direction of the free end, and it is sufficient if it is formed in a small region including the base 12 side of the vibrating arm 14.

Therefore, according to the second embodiment, by forming the notch 58 on the base side of the vibrating arm 14 that is the portion to which the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece, and on the + Z surface 16 thereof, Compared to the case of the first embodiment, it is possible to effectively weaken the rigidity against bending stress due to bending vibration on the + Z surface 16 side only by etching a smaller region. Further, since the high-precision patterning for positioning the groove in the photolithography processing as in the case of the application example 3 is not required, the manufacturing yield of the piezoelectric vibrating piece can be increased.

FIG. 4 is a cross-sectional view taken along line AA of the tuning fork type piezoelectric vibrating piece 10 according to the third embodiment. The tuning fork-type piezoelectric vibrating piece 10 according to the second embodiment has the same basic configuration as that of the first embodiment, but the rigidity adjusting portion of the vibrating arm is the vibrating arm from the base side of the + Z plane of the vibrating arm. A first groove provided along the free end direction of the vibration arm and a second groove provided along the free end direction of the vibration arm from the base side of the −Z plane of the vibration arm, The first groove is formed deeper than the second groove. The CI of the tuning fork type piezoelectric vibrating piece 10 is formed by forming grooves on both sides in this way.
The value is further lowered than in the case of the first embodiment. Here, in order to form the + Z plane groove 60 as the first groove and the −Z plane groove 62 as the second groove, since the depths are different, it is not possible to perform the etching process by patterning at the same time. It is necessary to do in the process. Further, since the positions of the + Z plane groove 60 and the −Z plane groove 62 are aligned in the longitudinal direction of the vibrating arm 14, the sum of the depths of the respective grooves exceeds the thickness of the vibrating arm 14. Can not.

When the + Z plane groove 60 and the −Z plane groove 62 are formed on the vibrating arm 14 in this way, the portion contributing to the rigidity against the bending stress due to the bending vibration of the vibrating arm 14 is removed by the formation of the groove. The rigidity on the minute + Z surface 16 side and the −Z surface 18 side is weakened. However, since the + Z plane groove 60 is formed deeper than the −Z plane groove 62, the rigidity on the + Z plane 16 side is relatively reduced, so that the rigidity on the + Z plane 16 side is equal to the rigidity on the −Z plane 18 side. The values are relatively close, and as a result, the rigidity against bending stress due to bending vibration on the + Z plane 16 side and the −Z plane 18 side can be balanced.

Therefore, according to the third embodiment, the tuning fork-type piezoelectric vibrating piece is provided by providing grooves on the base portion 24 of the vibrating arm 14, that is, the base 12 side, which is the portion where the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece. Further, by providing the + Z plane groove 60 deeper than the -Z plane groove 62, the relative strength difference in rigidity against bending stress due to bending vibration on the + Z plane 16 side and the -Z plane 18 side can be reduced. + Z plane 16 side of the vibrating arm against bending vibration and −
It is possible to balance the rigidity on the Z surface 18 side and reduce the component in the Z-axis direction, that is, the thickness direction, of the bending vibration of the vibrating arm 14. Therefore, the sensitivity of detecting the acceleration in the thickness direction, that is, the sensitivity of the other axis can be suppressed, and a piezoelectric vibrating piece having a low CI value can be formed.

FIG. 5 is a schematic diagram (FIG. 5A) and a cross-sectional view taken along line BB (FIG. 5B) of a tuning-fork type piezoelectric vibrating piece according to the fourth embodiment. The tuning fork-type piezoelectric vibrating piece according to the fourth embodiment has the same basic configuration as that of the first embodiment, but the adjusting portion of the vibrating arm is a free-running vibrating arm from the base side of the + Z plane of the vibrating arm. A first groove provided along the end direction, and a second groove provided along the free end direction of the vibrating arm from the base side of the −Z surface of the vibrating arm, and the first groove The end on the base side of the groove is located closer to the base side than the end on the base side of the second groove.

If the depth of the + Z plane groove 64 as the first groove and the −Z plane groove 66 as the second groove are different, they cannot be simultaneously patterned by photolithography and etched. If the depth is the same, they can be formed simultaneously. Since the −Z plane groove 66 is formed along the free end direction with the free end side as a base point further than the free end side end of the + Z plane groove 64, the + Z plane groove 64 and the −Z plane groove 66 are mutually connected. There is no interference to form a through hole in the thickness direction of the vibrating arm 14. Therefore, each groove can be formed to a depth close to the thickness of the vibrating arm 14. Therefore, the CI value can be further reduced as compared with the case of the third embodiment.

The + Z surface groove 64 is formed on the base 12 side of the vibrating arm 14 which is the portion to which the bending stress due to bending vibration is the largest, whereas the −Z surface groove 66 is not subjected to bending stress due to bending vibration. It is formed at a position considerably away from the base portion 12. Therefore, the effect of weakening the rigidity against bending stress due to bending vibration due to the formation of these grooves is greater in the + Z plane groove 64.

Therefore, according to the fourth embodiment, at the base portion 24 side of the vibrating arm 14 that is the portion to which the strongest bending stress is applied by the bending vibration of the tuning fork type piezoelectric vibrating piece, that is, on the base portion 12 side,
By forming a groove on the Z surface 16 side, the rigidity against bending stress due to bending vibration on the + Z surface 16 side is effectively weakened, and the + Z surface 16 side and the −Z surface 18 of the vibrating arm against bending stress due to bending vibration are reduced.
The side rigidity can be balanced. Further, the + Z surface groove 64 and the −Z surface groove 66 do not interfere in the depth direction. Therefore, the degree of freedom in designing the depth direction of the groove is improved as compared with the third embodiment, and the groove can be designed deeper than in the case of the third embodiment. A piezoelectric vibrating piece having a low CI value can be formed. Moreover, since the asymmetry in the thickness direction is improved as compared with the case of the third embodiment, the effect of suppressing the occurrence of unnecessary vibration due to the thickness dimension is improved.

Further, as shown in FIG. 5C, the end on the base 12 side of the −Z plane shaft 66 that is the second groove is an end on the free end side of the + Z plane shaft 64 that is the first groove. Located closer to the base 12 than the first
Further, an overlap region 67 that overlaps the second groove when viewed from the thickness direction may be provided. The overlap region 67 can be formed by a difference in etching rate on each crystal plane due to crystal anisotropy. Therefore, if anisotropic etching is used, the + Z plane groove 64 and the −Z plane groove 66 can be formed not to penetrate while providing the overlap region 67.

Therefore, with the configuration of FIG. 5C, the + Z surface groove 6 which is the groove on the + Z surface 16 side as described above.
4 and the −Z plane groove 66, which is a groove on the −Z plane side, do not interfere with each other in the depth direction, and the degree of freedom of design in the depth direction of the groove is improved. Becomes thinner in the thickness direction, the distance between the excitation electrodes formed in the grooves on both sides is shortened, and a large electric field can be applied to the overlap region 67, so that a piezoelectric vibrating piece with a lower CI value can be formed. In addition, since the contact with the etching solution in the groove region is sparser than that in the outer region, the etching rate in the groove region is slower than the etching rate in the outer region. Therefore, a special process for digging up the groove is not required, and the piezoelectric vibrating piece can be formed simultaneously with the outer shape extraction of the piezoelectric vibrating piece, so that a piezoelectric vibrating piece with a higher yield than the above case can be formed.

Sectional view taken along line B-B of the tuning fork type piezoelectric resonator element according to a fifth embodiment in FIG. 6 shows a (FIG. 6 (a)). The tuning-fork type piezoelectric vibrating piece 10 according to the fifth embodiment as shown in FIG. 6 (a), is basically the same as the first embodiment, the adjustment unit for adjusting the rigidity of the vibrating arm, the vibrating A first groove provided along the free end direction of the vibrating arm from the base side of the + Z plane of the arm, and provided along the free end direction of the vibrating arm from the base side of the −Z plane of the vibrating arm. The second groove and a beam provided on the base side of the second groove are characterized in that the beam is isolated from the base side of the second groove to the free end side. Yes.

Since the + Z plane groove 68 as the first groove and the −Z plane groove 70 as the second groove have the same depth, they can be patterned simultaneously with the beam 72 and formed by etching. Since the depth and position of both grooves are the same on the + Z surface 16 side and the −Z surface 18 side, the rigidity against bending vibration is reduced at the same rate if only the grooves are considered. Since there is a beam 72 on the base portion 24, that is, on the base 12 side, this contributes to the direction of increasing the rigidity against bending stress due to bending vibration. As a result, the rigidity against bending stress due to bending vibration on the −Z surface 18 side from the + Z surface 16 side. Can be relatively increased to balance the rigidity between the + Z plane 16 and the −Z plane 18 side.

Further, as shown in FIG. 6 (b), the position of the beam 72 can freely be determined from the -Z-Side Slots 70 by patterning. As described above, since the base portion 24 of the vibrating arm 14, that is, the base 12 side is the portion most subjected to bending stress due to bending vibration, the case where the beam 72 is formed on the base 12 side is the most due to bending vibration on the −Z plane 18 side. If the rigidity against bending stress is increased and the rigidity is formed on the free end side, the rigidity on the −Z plane 18 side is the weakest, but the rigidity on the −Z plane 18 side is increased as compared with the case where the beam 72 is not provided in the −Z plane groove 70. It has been adjusted. That is, by changing the position of the beam 72, the rigidity on the −Z plane 18 side can be controlled to balance the rigidity against the bending stress caused by the bending vibration on the + Z plane 16 side and the −Z plane side 18.

Therefore, according to the fifth embodiment, the length of the −Z surface groove 70 is increased so that the base 12 side of the vibrating arm 14 that is the portion to which the strongest bending stress is applied by the bending vibration of the piezoelectric vibrating piece is thickened.
Since it can be configured shorter than the Z-plane groove 68, the rigidity against bending stress due to bending vibration on the −Z plane 18 side is relatively increased with respect to the + Z plane 16 side even if the beam 72 is configured to be short. And
It is possible to balance the rigidity of the vibrating arm 14 on the + Z plane 16 side and the −Z plane 18 side with respect to bending stress due to bending vibration. In addition, since the length of the groove for forming the excitation electrode film can be sufficiently secured, the electrode of the piezoelectric vibrator can be formed widely in the groove. In addition, since the configuration in which the grooves are provided on both surfaces is maintained, a piezoelectric vibrating piece having a CI value comparable to that of the piezoelectric vibrating piece of the third embodiment can be formed. Furthermore, by forming the beam 72, the asymmetry in the thickness direction is third.
Since it improves compared with the case of embodiment, the suppression effect of generation | occurrence | production of the unnecessary vibration depending on a thickness dimension improves. Further, as the beam 72 is separated from the base 12 side to the free end side in the -Z plane groove 70, the rigidity against bending stress due to the bending vibration of the -Z plane 18 can be reduced. Therefore, by appropriately determining the position of the beam 72, it is possible to finely adjust the rigidity against the bending stress caused by the bending vibration of the −Z surface 18 of the vibrating arm 14. In addition, since the degree of asymmetry in the thickness direction can be determined by appropriately determining the position of the beam 72, optimization for suppressing unnecessary vibration can be performed.

FIG. 7A is a cross-sectional view of the tuning-fork type piezoelectric vibrating piece 10 according to the sixth embodiment taken along line BB. The tuning-fork type piezoelectric vibrating piece according to the sixth embodiment is basically the same as that of the first embodiment, but the adjustment unit for adjusting the stiffness includes the first electrode film provided on the + Z surface of the vibrating arm. The first electrode film is provided on the −Z surface of the vibrating arm and is thinner than the second electrode film.

In the sixth embodiment, the electrode film 74 adjusts the balance of rigidity against bending stress caused by bending vibration on the + Z surface 16 side and the −Z surface 18 side. The electrode film 74 includes a first excitation electrode film 46 and a second excitation electrode film 4 for causing the vibrating arm 14 of the tuning fork type piezoelectric vibrating piece 10 to oscillate.
8, the third excitation electrode film 50, the extraction electrode film 52, and the connection electrode film 54. In the present embodiment, the electrode film 74 formed on the vibrating arm 14 is +
The Z surface 16 side is formed thin, the rigidity against bending stress due to the bending vibration on the −Z surface 18 side is relatively increased, and the neutral surface 56 is moved to the central portion in the thickness direction in the same manner as described above. Exerts the effect of balancing the rigidity against bending vibration. The material of the electrode film 74 is Cr as described above.
, Au, other Al, etc. are used. The first excitation electrode film 46 and the second excitation electrode film 4
8, an electrode film 7 including a third excitation electrode film 50, an extraction electrode film 52, and a connection electrode film 54
The electrode pattern 4 is the same as that in the first embodiment.

When adjusting the rigidity against bending stress due to the bending vibration of the vibrating arm 14 by using the electrode film 74, the Young's modulus of the crystal and these metals is an important factor. The higher the Young's modulus, the smaller the strain against tension and compression, and the higher the rigidity.

In this embodiment, the Young's modulus (285 GPa) of Cr is Au (82 GPa), Al
Higher than (69 GPa). On the other hand, the Young's modulus of quartz is about 100 GPa in the Z plane. Therefore, since the Young's modulus of Cr is higher than the Young's modulus of quartz, the rigidity of the electrode film 74 is adjusted by forming the electrode film 74b on the −Z surface 18 relatively thicker than the electrode film 74a on the + Z surface 16 side. The effect is increased when Cr is used as the material of the electrode film 74.

The electrode film 74 is formed by sputtering or the like. In this case, the −Z plane 18 side is closer to the + Z plane 1.
By devising such as making the sputtering time longer than 6 side,
It can be formed thicker than the Z-plane 16 side. Therefore, by adjusting the material of the electrode film 74 and its thickness, it is possible to adjust the balance of rigidity against bending stress due to bending vibration of the + Z surface 16 and the −Z surface 18. Further, as shown in the cross-sectional view along the line BB in FIG. 7B, even after a groove or the like is formed as in the tuning-fork type piezoelectric vibrating piece 10 of the first to fifth embodiments (FIG. 5 ( In b), the fifth embodiment is used), and the electrode film 74 can be formed without any limitation.

Therefore, according to the sixth embodiment, the −Z plane is obtained by making the electrode film on the −Z plane 18 side thicker than the + Z plane 16 side without performing a special etching process for forming the above-described groove or the like in the piezoelectric vibrating piece. 18
By relatively increasing the rigidity against the bending stress caused by the bending vibration on the side, the rigidity of both surfaces against the bending stress caused by the bending vibration can be balanced, and the Z-axis direction component of the bending vibration of the vibrating arm 14 can be reduced. Therefore, the detection sensitivity of acceleration in the Z-axis direction, that is, the thickness direction,
That is, it is possible to form a piezoelectric vibrating piece with reduced sensitivity to other axes. In addition, since it is not necessary to form a groove or the like in the piezoelectric vibrating piece, the manufacturing process is prevented from becoming complicated, and the manufacturing yield of the piezoelectric vibrating piece can be increased. Furthermore, by adding this application example to the piezoelectric vibrating reeds of the first to fifth embodiments, not only the grooves obtained by etching processing,
Since the electrode film 74 also adjusts the balance of rigidity against bending stress due to bending vibration of the + Z surface 16 and the −Z surface 18, the adjustment range of the rigidity of the + Z surface 16 and the −Z surface 18 is expanded, and the other axis Sensitivity can be reduced more efficiently.

FIG. 8 shows a schematic diagram of a piezoelectric vibrator and an acceleration sensor according to the seventh embodiment. The piezoelectric vibrator and acceleration sensor according to the seventh embodiment cantilever-support the tuning fork type piezoelectric vibrating piece 10 of any one of the first to sixth embodiments and the base 12 of the tuning fork type piezoelectric vibrating piece 10. It is characterized by being implemented in the state. The acceleration sensor 82 according to the seventh embodiment is configured by wiring an external circuit (not shown) with a piezoelectric vibrator including a piezoelectric vibrating piece 10, a mounting electrode 84, a package 86, a lid 88 made of thin glass, and the like. can get. The tuning fork type piezoelectric vibrating piece 10 has its base 12 joined to the bottom surface of the package 86 via a mounting electrode 84. The tuning fork type piezoelectric vibrating piece 10 is fixed to the package 86 in a cantilevered state with the base 12 as a fixed end. ing. After the tuning fork type piezoelectric vibrating piece 10 is mounted on the package 86, the lid 88 is joined to the upper surface of the package 86 by seam welding. With the above configuration, it is possible to construct an acceleration sensor 82 that uses the Y-axis direction as an acceleration detection axis and reduces the other-axis sensitivity in the Z-axis direction, that is, the thickness direction.

Incidentally, the acceleration sensor 82 needs to finely adjust the vibration frequency after mounting. This fine adjustment of the vibration frequency can be performed by removing the electrode film 74 on the connection electrode film 54 on the free end side of the vibrating arm with the laser 90 and changing its mass, but changing the mass on the base 12 side. However, there is almost no change in the vibration frequency. On the other hand, the rigidity of the + Z plane 16 and the −Z plane 18 can be adjusted by removing the electrode film 68 covering the base 12 side of the vibrating arm 14 with the laser 90. Then, the change in rigidity with respect to the bending stress due to the bending vibration of the + Z plane and the −Z plane 18 is most affected by the change in the mass on the base 12 side of the vibrating arm 14 from the above.
Even if the mass on the side of the connection electrode film 54 is changed by the laser 90, the rigidity balance of the piezoelectric vibrating piece 10 is hardly affected. Therefore, the tuning fork type piezoelectric vibrating piece 10 of the sixth embodiment is shown in FIG.
When the lid 88 is mounted using a material that transmits the laser 90 (for example, thin glass), the connection electrode film 54 of the vibrating arm 14 is irradiated with the laser 90 to finely adjust the resonance frequency. By irradiating the laser 90 to the base 12 side of the vibrating arm 14, the balance of rigidity against bending stress due to bending vibration can be adjusted even after mounting. At this time, either the + Z plane 16 or the −Z plane 18 may be used as a bonding surface with the mounting electrode 84. Of course, the rigidity of the surface that is irradiated with the laser 90 and from which the electrode film 74 is removed becomes weak.

Therefore, according to the seventh embodiment, the acceleration sensor is mounted with the piezoelectric vibrating piece having the other axis sensitivity reduced by reducing the component that vibrates in the Z-axis direction of bending vibration with the longitudinal direction as the acceleration detection axis. can do. Furthermore, the frequency adjustment after mounting is performed on the free end side of the vibrating arm, but the rigidity adjustment is performed on the base side of the vibrating arm, so the frequency adjustment and the rigidity adjustment can be performed independently without interfering with each other. it can.

In any of the embodiments, the description has been given on the assumption of a tuning fork type piezoelectric vibrating piece having two vibrating arms that are cantilevered. However, it goes without saying that the present embodiment can be applied to one or more vibrating arms. Absent. Moreover, it is applicable not only to an acceleration detection sensor but also to other piezoelectric device materials, for example, a piezoelectric vibrating piece used for a clock source.

In any of the embodiments, the piezoelectric vibrating piece according to the present invention extends in the first direction and is cantilevered, a base that cantilever-supports the vibrating arm, and the vibrating arm is attached to the first vibrating arm. A piezoelectric vibrating piece having an excitation electrode that bends and vibrates in a second direction perpendicular to the direction, wherein the vibrating arm has a stiffness adjustment unit for bending in a third direction perpendicular to the first and second directions It is a common feature to have.

The piezoelectric vibrating piece formed from the piezoelectric substrate may have different rigidity against bending stress or the like on each surface due to its anisotropy. When such a piezoelectric vibrating piece is bent and vibrated by the excitation electrode, it has a component that amplitudes not only in a predetermined amplitude direction but also in a direction perpendicular thereto. Therefore, according to the present invention, it is possible to reduce a component that vibrates in a direction that vibrates perpendicularly to the bending vibration of the vibrating arm by balancing the rigidity against the bending vibration. Therefore, it is possible to form a piezoelectric vibrating piece that reduces the occurrence of a deviation in the resonance frequency of the bending vibration caused by the acceleration from the third direction.

Therefore, bending vibration is performed in the direction (second direction, X direction) perpendicular to the longitudinal direction (first direction, Y direction), and the component of bending vibration that vibrates in the Z direction (third direction) is reduced. Thus, it is possible to form a piezoelectric vibrating piece with reduced sensitivity in other axes, and to construct a piezoelectric vibrator and a piezoelectric device mounted in a cantilevered state with the base of the piezoelectric vibrating piece as a fixed end.

10 ......... Tuning Fork Type Piezoelectric Vibrating Piece, 12 ......... Base, 14 ......... Vibrating Arm, 16 ......... + Z Plane, 18 .........- Z Plane, 20 ......... First Side, 22 ... ... the second side, 24 ......... the root, 26 ......... the groove, 28 ......... the first inner surface, 30 ......... the second inner surface, 32 ......... the constriction,
34... Mount portion 36... First side electrode film 38... Second side electrode film 4
0 ......... first inner electrode film, 42 ......... second inner electrode film, 44 ......... bottom electrode film, 46
......... First excitation electrode film, 48 ......... Second excitation electrode film, 50 ......... Third excitation electrode film,
52... Extraction electrode film 54... Connection electrode film 56... Neutral surface 57... Overlapping area 58. ...- Z-plane groove, 64 ...
... + Z-plane groove, 66 .........- Z-plane groove, 68 ......... + Z-plane groove, 70 .........- Z-plane groove, 72 ...
... Beam, 74 ......... Electrode film, 76 ......... Region, 78 ......... Location, 80 ......... Location, 82 ...
... acceleration sensor, 84 ... mount electrode, 86 ... package, 88 ... lid, 90 ... laser.

Claims (6)

Two principal surfaces that define the thickness are formed by a Z-cut piezoelectric substrate intersecting with the Z-axis, a vibrating arm that flexibly vibrates, and a cantilever beam in which one end side in the longitudinal direction of the vibrating arm is an unfixed free end. A base that fixes the other end side in the longitudinal direction of the vibrating arm so that the vibrating arm is supported in a state,
Wherein the main surface of the + Z side of the vibrating arm longitudinally disposed al is along, and a first groove having a bottom shape which is dug in the thickness direction from the main surface, -Z of the vibrating arm side main surface the provided we are along longitudinally of, and a second groove having a bottom shape which is dug in the thickness direction from the main surface of the base in the first groove And an end located on the main surface side on the + Z plane side is closer to the base side in the second groove than an end located on the main surface side on the −Z plane side. A piezoelectric vibrating piece located on the base side. The end located on the free end side in the second groove and on the main surface side on the −Z plane side is on the free end side in the first groove and on the + Z plane side. The piezoelectric vibrating piece according to claim 1, wherein the piezoelectric vibrating piece is located closer to the free end than an end located on a main surface side. The region where the first and second grooves overlap when viewed from the thickness direction includes a region where the first and second grooves overlap when viewed from the longitudinal direction. Piezoelectric vibrating piece. A first electrode film provided on the + Z surface of the vibrating arm; and a second electrode film provided on the -Z surface of the vibrating arm, wherein the first electrode film is the second electrode. the piezoelectric vibrating piece according to any one of claims 1 to 3, characterized in that thinner than film. Two vibrating arms are provided in a cantilevered manner parallel to the base, and the excitation electrode formed on one vibrating arm and the excitation electrode formed on the other vibrating arm are connected by a cross wiring. The piezoelectric vibrating piece according to any one of claims 1 to 4 , wherein the piezoelectric vibrating piece is characterized in that: A piezoelectric vibrator or an acceleration sensor, wherein the piezoelectric vibrating piece according to any one of claims 1 to 5 is mounted on a package in a cantilevered state with the base portion as a fixed end.

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