JP5001217B2 - Temperature detection module and manufacturing method thereof - Google Patents

Temperature detection module and manufacturing method thereof Download PDF

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JP5001217B2
JP5001217B2 JP2008124686A JP2008124686A JP5001217B2 JP 5001217 B2 JP5001217 B2 JP 5001217B2 JP 2008124686 A JP2008124686 A JP 2008124686A JP 2008124686 A JP2008124686 A JP 2008124686A JP 5001217 B2 JP5001217 B2 JP 5001217B2
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cover
circuit body
temperature detection
detection module
flat circuit
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JP2009276071A (en
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智洋 池田
真明 岩部
幸久 菊池
光一郎 望月
一久 目黒
亮 真野
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Toyota Motor Corp
Yazaki Corp
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Yazaki Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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Description

本発明は、電気自動車等のバッテリに装着されて、各電池の温度を検出する温度検出モジュールとその製造方法に関するものである。   The present invention relates to a temperature detection module that is mounted on a battery of an electric vehicle or the like and detects the temperature of each battery, and a manufacturing method thereof.

図7は、従来の温度検出モジュールの一形態を示すものである(特許文献1参照)。   FIG. 7 shows an embodiment of a conventional temperature detection module (see Patent Document 1).

この温度検出モジュール61は、電気自動車やハイブリッドカーの高電圧バッテリ62に適用され、水平に配置された各電池列63の側面に沿って帯状に配置され、リード線65に接続された各温度センサ66で、電池列63を成す円柱状の各単電池64の表面温度を検出するものである。   This temperature detection module 61 is applied to a high voltage battery 62 of an electric vehicle or a hybrid car, and is arranged in a strip shape along the side surface of each battery row 63 arranged horizontally, and each temperature sensor connected to a lead wire 65. 66, the surface temperature of each cylindrical unit cell 64 forming the battery array 63 is detected.

温度センサ66はPTCサーミスタである。温度センサ66は伝熱シート(図示せず)を介して単電池64に接触する。リード線65の両端末は温度検出装置(図示せず)に接続される。   The temperature sensor 66 is a PTC thermistor. The temperature sensor 66 contacts the cell 64 via a heat transfer sheet (not shown). Both ends of the lead wire 65 are connected to a temperature detection device (not shown).

図8は、従来の温度検出モジュールの他の形態(特許文献1参照)として、垂直に配置された長方形状の各電池78の上面78aに樹脂部72と電熱用の金属体73と伝熱シート74とを介して温度センサ75を密着させたものである。温度センサ75は樹脂製のフック76で押さえられている。   FIG. 8 shows another embodiment of the conventional temperature detection module (see Patent Document 1). On the upper surface 78a of each rectangular battery 78 arranged vertically, a resin portion 72, a metal body 73 for electric heating, and a heat transfer sheet. 74, the temperature sensor 75 is brought into close contact with each other. The temperature sensor 75 is pressed by a resin hook 76.

樹脂部72は各電池71を区画するケース77の一部である。上記以外に、特許文献1には、電池78の上面に樹脂部72のみを介して温度センサ75を配置することも記載されている。この温度センサ75はリード線を介して温度検出装置(図示せず)に接続される。
特開2001−91363号公報(図3,図8〜図9)
The resin part 72 is a part of a case 77 that partitions each battery 71. In addition to the above, Patent Document 1 also describes that the temperature sensor 75 is arranged on the upper surface of the battery 78 through only the resin portion 72. The temperature sensor 75 is connected to a temperature detection device (not shown) via a lead wire.
Japanese Patent Laid-Open No. 2001-91363 (FIGS. 3, 8 to 9)

しかしながら、上記従来の図7に示す温度検出モジュール61にあっては、電池64の表面に伝熱シート(図示せず)を介して温度センサ66を密着させるべく、隣接する電池列63の間に温度センサ66を挟む様に配置しており、温度センサ66を電池64に押し付ける力にばらつきを生じやすく、強く押し付けた場合は温度センサ66が傷み、弱く接触させた場合は、温度検知精度が低下し兼ねないという懸念があった。また、リード線65の長手方向に各温度センサ66を等間隔で位置精度良く配置することが難しいという懸念があった。   However, in the conventional temperature detection module 61 shown in FIG. 7, the temperature sensor 66 is closely attached to the surface of the battery 64 via a heat transfer sheet (not shown). The temperature sensor 66 is arranged so as to sandwich the temperature sensor 66, and the force for pressing the temperature sensor 66 against the battery 64 is likely to vary. When the pressure is strongly pressed, the temperature sensor 66 is damaged, and when it is weakly touched, the temperature detection accuracy is lowered. There was concern that it could be. Further, there is a concern that it is difficult to arrange the temperature sensors 66 at equal intervals in the longitudinal direction of the lead wire 65 with high positional accuracy.

また、上記従来の図8に示す温度検出モジュール71にあっては、樹脂部72や伝熱用の金属体73を介して温度センサ75を配置するために、温度検知精度が低下し兼ねないという懸念があった。   In the conventional temperature detection module 71 shown in FIG. 8, since the temperature sensor 75 is disposed via the resin portion 72 and the heat transfer metal body 73, the temperature detection accuracy may be lowered. There was concern.

本発明は、上記した点に鑑み、電池の表面に各温度センサを適切な接触圧力で押し付けて、温度センサの破損を防ぐと共に温度検知精度を向上させることができ、また、各温度センサを位置精度良く配置することのできる温度検出モジュールと、その温度検出モジュールを簡単に形成することのできる温度検出モジュールの製造方法を提供することを目的とする。   In view of the above points, the present invention can press each temperature sensor against the surface of the battery with an appropriate contact pressure to prevent the temperature sensor from being damaged and improve the temperature detection accuracy. It is an object of the present invention to provide a temperature detection module that can be arranged with high accuracy and a method for manufacturing the temperature detection module that can easily form the temperature detection module.

上記目的を達成するために、本発明の請求項1に係る温度検出モジュールは、複数の突出部をなすように波形状に屈曲される可撓性のフラット回路体と、該突出部の先端内面に設けられる温度センサと、該突出部を収容して該突出部の先端側部分を開口から外部に撓み自在に突出させる各収容部を有する絶縁性の第一のカバーと、該先端側部分が電源装置に接して撓んだ状態で、各温度センサを該電源装置側に弾性的に押圧する押圧部を有する第二のカバーとを備えることを特徴とする。   In order to achieve the above object, a temperature detection module according to claim 1 of the present invention includes a flexible flat circuit body that is bent into a wave shape so as to form a plurality of protrusions, and an inner surface at the tip of the protrusions. A temperature sensor provided on the first cover, an insulating first cover having each housing portion that houses the projecting portion and flexibly projects the distal end portion of the projecting portion to the outside from the opening, and the distal end portion includes A second cover having a pressing portion that elastically presses each temperature sensor toward the power supply device while being bent in contact with the power supply device.

上記構成により、第二のカバーの押圧部がフラット回路体側の温度センサを弾性的に押圧して電源装置側に適切な圧力で押し付けてフラット回路体を介して密着させる。フラット回路体の突出部の先端側は電源装置に突き当たって弾性的に撓む。フラット回路体は第一のカバーに組み付けた後、第二のカバーをフラット回路体の上から第二のカバーに組み付ける。あるいは第二のカバーにフラット回路体を屈曲配置して両者を第一のカバーに組み付ける。第二のカバー全体を弾性材で形成してもよく、第二のカバーの押圧部のみを弾性材で形成したり、可撓性に形成してもよい。フラット回路体は第一のカバーに組み付ける際に屈曲させてもよく、組み付ける前に屈曲加工してもよい。   With the above configuration, the pressing portion of the second cover elastically presses the temperature sensor on the flat circuit body side and presses the temperature sensor on the power supply device side with an appropriate pressure so as to be in close contact with the flat circuit body. The front end side of the protruding portion of the flat circuit body hits the power supply device and bends elastically. After the flat circuit body is assembled to the first cover, the second cover is assembled to the second cover from above the flat circuit body. Alternatively, the flat circuit body is bent on the second cover, and both are assembled to the first cover. The entire second cover may be formed of an elastic material, or only the pressing portion of the second cover may be formed of an elastic material, or may be formed flexibly. The flat circuit body may be bent when assembled to the first cover, or may be bent before being assembled.

請求項2に係る温度検出モジュールは、請求項1記載の温度検出モジュールにおいて、前記第二のカバーが弾性材で形成されたことを特徴とする。   The temperature detection module according to claim 2 is the temperature detection module according to claim 1, wherein the second cover is formed of an elastic material.

上記構成により、第二のカバーが合成ゴム等の弾性材料で一体成形される。第二のカバーは弾性材であるので長手方向に伸縮自在で位置ずれ吸収性を有する。   With the above configuration, the second cover is integrally formed of an elastic material such as synthetic rubber. Since the second cover is made of an elastic material, the second cover can be expanded and contracted in the longitudinal direction and has a misalignment absorbability.

請求項3に係る温度検出モジュールは、請求項1又は2記載の温度検出モジュールにおいて、前記フラット回路体が、前記第一のカバーと前記第二のカバーとに位置決め手段で位置決めされると共に、挟持固定されることを特徴とする。   The temperature detection module according to claim 3 is the temperature detection module according to claim 1 or 2, wherein the flat circuit body is positioned between the first cover and the second cover by positioning means and is sandwiched. It is fixed.

上記構成により、位置決め手段でフラット回路体と第二のカバーとが第一のカバーに位置決めされ、フラット回路体側の温度センサが第一のカバーの収容部に位置ずれなく配置される。位置決め手段としては、第一のカバーの突起とそれに係合するフラット回路体の孔部と第二のカバーの孔部等が挙げられる。   With the above-described configuration, the flat circuit body and the second cover are positioned by the first cover by the positioning means, and the temperature sensor on the flat circuit body side is disposed in the housing portion of the first cover without being displaced. Examples of the positioning means include a protrusion of the first cover, a hole of the flat circuit body engaged therewith, a hole of the second cover, and the like.

請求項4に係る温度検出モジュールは、請求項1〜3の何れかに記載の温度検出モジュールにおいて、前記電源装置が複数のセルを集合させた組電池であり、前記フラット回路体の各突出部が各セル毎に接触することを特徴とする。   A temperature detection module according to a fourth aspect of the present invention is the temperature detection module according to any one of the first to third aspects, wherein the power supply device is an assembled battery in which a plurality of cells are assembled, and each protrusion of the flat circuit body Are in contact with each cell.

上記構成により、第一のカバーがセルの並び方向に帯状に配置され、各温度センサが各セル毎に第一のカバーの各収容部で正確に位置決めされる。温度センサは薄いフラット回路体を介してセルに接触するので、セルの表面温度を正確に検知する。セルの並び列毎に各一本の割合で温度検出モジュールが配置される。   With the above configuration, the first cover is arranged in a band shape in the cell arrangement direction, and each temperature sensor is accurately positioned in each housing portion of the first cover for each cell. Since the temperature sensor contacts the cell via the thin flat circuit body, the surface temperature of the cell is accurately detected. One temperature detection module is arranged for each cell row.

請求項5に係る温度検出モジュールは、請求項1〜3の何れかに記載の温度検出モジュールにおいて、前記第一のカバーの各収容部を連結する連結部が可撓性を有して、位置ずれを吸収可能であることを特徴とする。   The temperature detection module according to claim 5 is the temperature detection module according to any one of claims 1 to 3, wherein a connecting portion that connects each housing portion of the first cover has flexibility, It is possible to absorb the deviation.

上記構成により、温度検出モジュールを電源装置に組み付ける際に、第一のカバーの各収容部と電源装置の各電池との位置がずれていても、第一のカバーを連結部から長手方向に伸縮させることで、位置ずれが吸収される。   With the above configuration, when the temperature detection module is assembled to the power supply device, the first cover extends and contracts in the longitudinal direction from the connecting portion even if the positions of the housing portions of the first cover and the batteries of the power supply device are displaced. By doing so, the displacement is absorbed.

請求項6に係る温度検出モジュールの製造方法は、請求項1〜5の何れかに記載の温度検出モジュールを製造する方法であって、円板の外周に複数の歯部を等ピッチで突設した挿入治具を回転させて、平坦な帯状の前記フラット回路体を該歯部で前記第一のカバーの前記各収容部内に押し込むことを特徴とする。   A method for manufacturing a temperature detection module according to claim 6 is a method for manufacturing the temperature detection module according to any one of claims 1 to 5, wherein a plurality of teeth are projected at an equal pitch on the outer periphery of the disc. The inserted jig is rotated, and the flat belt-like flat circuit body is pushed into the accommodating portions of the first cover by the tooth portions.

上記構成により、挿入治具の回転に伴って各歯部が第一のカバーの各収容部内にフラット回路体を収容部の形状に沿って波形に屈曲させつつ連続的に押し込む。これにより、第一のカバーへのフラット回路体の組付が迅速に且つ低い工数で行われる。歯部にはフラット回路体の温度センサを逃がす凹部(溝ないし穴部)を形成しておくことが好ましい。   With the above configuration, each tooth portion continuously pushes the flat circuit body into each housing portion of the first cover while bending the waveform along the shape of the housing portion as the insertion jig rotates. Thereby, the assembly of the flat circuit body to the first cover is performed quickly and with a low man-hour. It is preferable to form a recess (groove or hole) in the tooth portion for allowing the temperature sensor of the flat circuit body to escape.

請求項1記載の発明によれば、第二のカバーの押圧部が温度センサを電源装置側に弾性的に押し付けることで、温度センサの傷みが防止されると共に、温度検知精度が向上する。   According to the first aspect of the invention, the pressing portion of the second cover elastically presses the temperature sensor against the power supply device side, so that the temperature sensor is prevented from being damaged and the temperature detection accuracy is improved.

請求項2記載の発明によれば、請求項1記載の発明の効果を第二のカバーの簡単な構造の押圧部で確実に発揮させることができる。また、弾性の第二のカバーを第一のカバーに位置ずれなく組み付けることができる。   According to invention of Claim 2, the effect of invention of Claim 1 can be exhibited reliably with the press part of the simple structure of a 2nd cover. In addition, the elastic second cover can be assembled to the first cover without displacement.

請求項3記載の発明によれば、長尺のフラット回路体が第一のカバーに位置決めされることで、温度センサの位置が正確に規定され、温度検知精度が向上する。また、第一のカバーとフラット回路体と第二のカバーとの相互固定が簡単且つ確実に行われる。   According to the third aspect of the invention, the long flat circuit body is positioned on the first cover, whereby the position of the temperature sensor is accurately defined, and the temperature detection accuracy is improved. In addition, the first cover, the flat circuit body, and the second cover can be easily and reliably fixed to each other.

請求項4記載の発明によれば、組電池のセル毎に位置ずれ等なく温度を正確に計測することができる。   According to the invention described in claim 4, the temperature can be accurately measured for each cell of the assembled battery without any positional deviation.

請求項5記載の発明によれば、各温度センサを電源装置の各電池に位置ずれなく配置することができるから、温度検出精度が向上する。   According to the fifth aspect of the present invention, each temperature sensor can be arranged in each battery of the power supply device without positional deviation, so that temperature detection accuracy is improved.

請求項6記載の発明によれば、第一のカバーへのフラット回路体の組付と同時にフラット回路体の波形加工を簡単且つ迅速に行うことができるから、温度検出モジュールの生産性を高め、且つコストを低減させることができる。   According to the invention of claim 6, since the waveform processing of the flat circuit body can be performed easily and quickly simultaneously with the assembly of the flat circuit body to the first cover, the productivity of the temperature detection module is increased, In addition, the cost can be reduced.

図1〜図2は、本発明に係る温度検出モジュールの一実施形態を示すものである。   1 to 2 show an embodiment of a temperature detection module according to the present invention.

この温度検出モジュール1は、合成樹脂製で絶縁性の長形のロアカバー(第一のカバー)2と、合成ゴム製で絶縁性の長形のアッパカバー(第二のカバー)3と、ロアカバー2とアッパカバー3との間に配置され、ロアカバー2の下部開口6(開口)から一部を突出させる略波状に屈曲した長形のフレキシブルフラット回路体(以下フラット回路体と言う)4と、フラット回路体4の突出部7に配置される温度センサ5とで構成されるものである。   The temperature detection module 1 includes a synthetic resin-made insulating long lower cover (first cover) 2, a synthetic rubber-made insulating long upper cover (second cover) 3, and a lower cover 2. A long flexible flat circuit body (hereinafter referred to as a flat circuit body) 4 which is disposed between the upper cover 3 and the upper cover 3 and is bent in a substantially wave shape so that a part protrudes from the lower opening 6 (opening) of the lower cover 2; It is comprised with the temperature sensor 5 arrange | positioned at the protrusion part 7 of the circuit body 4. FIG.

図1の如く、ロアカバー2の下部開口6から突出したフラット回路体4の下向きの突出部7は、バッテリ(電源装置ないし組電池)8の長方形状の各電池(セル)9の上面9aにフラット回路体4の弾性力とゴム製のアッパカバー3の弾性力とで押し付けられて確実に密着する。   As shown in FIG. 1, the downward projecting portion 7 of the flat circuit body 4 projecting from the lower opening 6 of the lower cover 2 is flat on the upper surface 9 a of each rectangular battery (cell) 9 of the battery (power supply device or assembled battery) 8. The circuit body 4 is pressed firmly by the elastic force of the circuit body 4 and the elastic force of the rubber upper cover 3 so that the circuit body 4 adheres securely.

フラット回路体4の突出部7の裏面(内面)に温度センサ5が固定され、温度センサ5はアッパカバー3の下向きの突出部(押圧部)10で押されて電池9の上面9aに薄いフラット回路体4を介して接触する。図1では便宜上、フラット回路体4は押し付けられる前の位置、電池9は押し付けられた後の位置で示しており、実際には、電池9の上面9aにフラット回路体4の突出部7の下面(表面)7aが接しつつ、突出部7が上向きに撓んで、突出部裏側の温度センサ5が弾性のアッパカバー3の突出部10に押し付けられつつ突出部10を上向きに撓ませる。   A temperature sensor 5 is fixed to the back surface (inner surface) of the projecting portion 7 of the flat circuit body 4, and the temperature sensor 5 is pushed by the downward projecting portion (pressing portion) 10 of the upper cover 3 and is thinly flat on the upper surface 9 a of the battery 9. Contact is made via the circuit body 4. In FIG. 1, for convenience, the flat circuit body 4 is shown at a position before being pressed, and the battery 9 is shown at a position after being pressed. In practice, the lower surface of the protrusion 7 of the flat circuit body 4 is placed on the upper surface 9 a of the battery 9. While the (surface) 7a is in contact, the protruding portion 7 bends upward, and the temperature sensor 5 on the back side of the protruding portion is pressed against the protruding portion 10 of the elastic upper cover 3 to bend the protruding portion 10 upward.

図2の如く、ロアカバー2は、逆台形状の左右両側の壁部11と、傾斜状の前後の壁部12とで成る収容部13を、連結部14,15を介して前後(長手)方向に複数直列に帯状に連続させたものである。前後左右の壁部11,12で囲まれて回路体配索空間16(図1)が形成され、空間16は矩形状の下部開口6と上部開口17に連通し、上部開口17はカバー長手方向の挿通空間18(図1)に続いている。   As shown in FIG. 2, the lower cover 2 includes an accommodating part 13 composed of inverted left and right wall parts 11 and inclined front and rear wall parts 12 via front and rear (longitudinal) directions via connecting parts 14 and 15. A plurality of them are continuously connected in a strip shape in series. A circuit body arrangement space 16 (FIG. 1) is formed by being surrounded by the front, rear, left and right walls 11, 12, and the space 16 communicates with a rectangular lower opening 6 and an upper opening 17, and the upper opening 17 is in the longitudinal direction of the cover. It continues to the insertion space 18 (FIG. 1).

左右の壁部11は前後の壁部12や連結部14,15よりも上側に突出し、連結部14,15は前後の壁部12に一体に続いている。下部開口6は上部開口18よりも前後に幅狭である。明細書における前後左右の方向は説明の便宜上のものである。   The left and right wall portions 11 protrude above the front and rear wall portions 12 and the connecting portions 14 and 15, and the connecting portions 14 and 15 are integrally connected to the front and rear wall portions 12. The lower opening 6 is narrower in the front-rear direction than the upper opening 18. The front, rear, left, and right directions in the specification are for convenience of explanation.

左及び/又は右の側壁11の下部内面に、フラット回路体4の突出部7を位置決めするための突起19が設けられ、突出部7は突起19を乗り越えて下方に突出し、上向きの戻りが阻止される。その状態(電池側には未だ装着されていない状態)で図1の如く弾性のアッパカバー3の突出部10の先端(下端)面10aが温度センサ5に近接ないし接して位置する。   A protrusion 19 for positioning the protrusion 7 of the flat circuit body 4 is provided on the lower inner surface of the left and / or right side wall 11, and the protrusion 7 climbs over the protrusion 19 and protrudes downward, preventing upward return. Is done. In this state (not yet attached to the battery side), the tip (lower end) surface 10a of the protruding portion 10 of the elastic upper cover 3 is positioned close to or in contact with the temperature sensor 5 as shown in FIG.

図2の如く、ロアカバー2の各連結部14,15の上面にはフラット回路体4を位置きめするための突起(位置決め手段)20が設けられている。各突起20がフラット回路体4の各孔部(位置決め手段)21に係合することで、フラット回路体4が長手方向に正確に位置決めされる。   As shown in FIG. 2, projections (positioning means) 20 for positioning the flat circuit body 4 are provided on the upper surfaces of the connecting portions 14 and 15 of the lower cover 2. Each protrusion 20 engages with each hole (positioning means) 21 of the flat circuit body 4, whereby the flat circuit body 4 is accurately positioned in the longitudinal direction.

ロアカバー2の一方の連結部14は水平な板状の連結壁であり、他方の連結部15は可撓部22を有したものである。図3に可撓性の連結部15を示す如く、ロアカバー2の前後に隣接する各側壁11は側方視略コの字状の可撓性の細い連結片(可撓部)22で連結され、連結片22は下端側で水平に屈曲して(下端側の水平部を符号22aで示す)、平面視で中央の水平な板部23に続いている。   One connecting portion 14 of the lower cover 2 is a horizontal plate-like connecting wall, and the other connecting portion 15 has a flexible portion 22. As shown in FIG. 3, each side wall 11 adjacent to the front and rear of the lower cover 2 is connected by a thin flexible connecting piece (flexible portion) 22 that is substantially U-shaped in side view. The connecting piece 22 is bent horizontally at the lower end side (the horizontal portion at the lower end side is indicated by reference numeral 22a) and continues to the central horizontal plate portion 23 in plan view.

連結片22は上端側の水平部22bで側壁11に続いている。板部23と傾斜状の前後の壁部12との間には隙間24が形成されている。符号6は矩形状の下部開口を示す。図2の如く、板部23と一方の連結部(連結壁)14とに回路体位置決め用の短円柱状の突起20が設けられている。可撓性の連結部15でバッテリ8(図1)に対するロアカバー2の長手方向の位置ずれが吸収される。連結部15は長手方向のみならず、曲げや捩り方向の位置ずれも吸収可能である。   The connecting piece 22 continues to the side wall 11 at the horizontal portion 22b on the upper end side. A gap 24 is formed between the plate portion 23 and the inclined front and rear wall portions 12. Reference numeral 6 denotes a rectangular lower opening. As shown in FIG. 2, a short cylindrical protrusion 20 for positioning a circuit body is provided on the plate portion 23 and one connecting portion (connecting wall) 14. The displacement of the lower cover 2 in the longitudinal direction with respect to the battery 8 (FIG. 1) is absorbed by the flexible connecting portion 15. The connecting portion 15 can absorb not only the longitudinal direction but also the displacement in the bending and twisting directions.

図2の如く、連結壁14の左右両側において前後の逆台形状の側壁11を繋ぐ水平な細長い壁部25に、アッパカバー3の両側の位置決め兼係止用の突起(係止手段)26,27を係合させる孔部(係止手段)28が設けられている。一方の孔部28の上側の細長い壁部25に、アッパカバー3の一方の一対の突起27の間の溝29に進入する位置決め用の突起30が設けられている。   As shown in FIG. 2, positioning and locking projections (locking means) 26 on both sides of the upper cover 3 are formed on a horizontal elongated wall portion 25 that connects the front and rear inverted trapezoidal side walls 11 on both the left and right sides of the connecting wall 14. A hole (locking means) 28 for engaging with 27 is provided. A long and narrow wall portion 25 on the upper side of one hole portion 28 is provided with a positioning projection 30 that enters a groove 29 between one pair of projections 27 of the upper cover 3.

また、ロアカバー2の要所において他方の細長い壁部25に代えて略コの字状の係止用の枠部31が上向きに設けられている。枠部31は図5のバッテリ(バッテリユニット)8の樹脂部32の上端側の爪部33に係合し、これによりロアカバー2を含む温度検出モジュール1全体がバッテリ8に正確に位置決めされる。   In addition, a substantially U-shaped locking frame portion 31 is provided upward in place of the other elongate wall portion 25 at a point of the lower cover 2. The frame portion 31 engages with a claw portion 33 on the upper end side of the resin portion 32 of the battery (battery unit) 8 in FIG. 5, whereby the entire temperature detection module 1 including the lower cover 2 is accurately positioned on the battery 8.

図2の如く、フラット回路体4は略台形波状に屈曲される。屈曲作業は初期形状が平坦で帯状のフラット回路体4をロアカバー2に組み付ける際に行われる。これについては後述する。図2のように予めフラット回路体4を波状に屈曲形成した後、ロアカバー2に組み付けることも可能である。   As shown in FIG. 2, the flat circuit body 4 is bent into a substantially trapezoidal wave shape. The bending operation is performed when the belt-like flat circuit body 4 having a flat initial shape is assembled to the lower cover 2. This will be described later. As shown in FIG. 2, the flat circuit body 4 can be bent in a wave shape in advance and then assembled to the lower cover 2.

フラット回路体4の上側の山部の頂面34は下側の谷部すなわち突出部7の底面7aよりも前後に幅広に形成される。頂面をなす水平な壁部(符号34で代用)に位置決め用の円形の孔部21が設けられ、下側の突出部7の底部をなす水平な壁部(符号7aで代用)に温度センサ5が設けられる。上下の壁部34,7aとそれを繋ぐ前後の傾斜状の壁部7bとが長手方向に連続して波型のフラット回路体4が構成されている。温度センサ5は例えばPTCサーミスタであり、矩形状のものがフラット回路体4の回路にハンダで接続固定される。   The top surface 34 of the upper crest portion of the flat circuit body 4 is formed wider in the front-rear direction than the lower trough portion, that is, the bottom surface 7 a of the protruding portion 7. A circular hole 21 for positioning is provided in a horizontal wall portion (substitute with reference numeral 34) forming the top surface, and a temperature sensor is provided in a horizontal wall section (substitute with reference numeral 7a) forming the bottom of the lower projection 7 5 is provided. The corrugated flat circuit body 4 is constituted by the upper and lower wall portions 34, 7a and the front and rear inclined wall portions 7b connecting the upper and lower wall portions 34, 7a in the longitudinal direction. The temperature sensor 5 is, for example, a PTC thermistor, and a rectangular one is connected and fixed to the circuit of the flat circuit body 4 by soldering.

図1の如く、フラット回路体4の上側の壁部34はロアカバー2の連結部14,15の上面に接し、アッパカバー3の下面との間で挟持される。フラット回路体4の前後の傾斜壁7bはロアカバー2の前後の傾斜壁12の内面に接する。   As shown in FIG. 1, the upper wall portion 34 of the flat circuit body 4 is in contact with the upper surfaces of the connecting portions 14 and 15 of the lower cover 2 and is sandwiched between the lower surface of the upper cover 3. The inclined walls 7 b before and after the flat circuit body 4 are in contact with the inner surfaces of the inclined walls 12 before and after the lower cover 2.

図4にフラット回路体4の回路構成の一例を示す如く、絶縁樹脂製の薄肉のシート35に二本のプリント回路36,37が形成され、一方の回路36は絶縁シート35の長手方向に連続し、他方の回路37は各温度センサ5の電極5aを直列に接続している。各温度センサ5の間で絶縁シート35に位置決め用の孔部21が設けられている。各回路36,37は絶縁シート35の端末部で金属製の端子(図示せず)を介して温度検出装置(図示せず)側の回路に接続される。   As shown in FIG. 4 as an example of the circuit configuration of the flat circuit body 4, two printed circuits 36 and 37 are formed on a thin sheet 35 made of insulating resin, and one circuit 36 is continuous in the longitudinal direction of the insulating sheet 35. The other circuit 37 connects the electrodes 5a of the temperature sensors 5 in series. Positioning holes 21 are provided in the insulating sheet 35 between the temperature sensors 5. Each of the circuits 36 and 37 is connected to a circuit on the temperature detection device (not shown) side through a metal terminal (not shown) at a terminal portion of the insulating sheet 35.

図2の如く、アッパカバー3は、各突出部10と、各突出部10を相互に連結する水平な板状の壁部37とで構成され、突出部10は矩形状で中空に形成され、前後左右の壁部38,39と底側の壁部40とを有し、前後の壁部38の中央には底壁40の前後端に続くスリット状の孔部41(図1のハッチングのない部分)が形成されて、上下方向(圧縮方向)にスムーズに潰れやすくなっている。底壁40がフラット回路体4の温度センサ5に当接する。突出部10の上端には補強用の枠部42が突出形成されている。   As shown in FIG. 2, the upper cover 3 is composed of each protruding portion 10 and a horizontal plate-like wall portion 37 that connects the protruding portions 10 to each other, and the protruding portion 10 is formed in a rectangular shape and hollow, Front and rear left and right wall portions 38 and 39 and a bottom side wall portion 40 are provided, and a slit-like hole portion 41 (not hatched in FIG. 1) following the front and rear ends of the bottom wall 40 is provided at the center of the front and rear wall portions 38. Part) is formed, and is easily crushed in the vertical direction (compression direction). The bottom wall 40 contacts the temperature sensor 5 of the flat circuit body 4. A reinforcing frame portion 42 is formed to protrude from the upper end of the protruding portion 10.

各板状の壁部37の中央に、ロアカバー2の位置決め用の突起20に係合する円形の孔部(位置決め手段)43が設けられ、孔部43の周縁は環状に突出して補強されている(環状部を符号44で示す)。板状の壁部37の左右端に、ロアカバー2に対する位置決め用の突起26,27が設けられている。   A circular hole (positioning means) 43 that engages with the positioning protrusion 20 of the lower cover 2 is provided at the center of each plate-like wall portion 37, and the periphery of the hole 43 protrudes in an annular shape and is reinforced. (The annular portion is indicated by reference numeral 44). Protrusions 26 and 27 for positioning with respect to the lower cover 2 are provided on the left and right ends of the plate-like wall portion 37.

図1の如く、ロアカバー2に沿ってフラット回路体4が波型に屈曲して配索され、フラット回路体4の突出部7の先端部分(内側に温度センサ5を有する部分)7aがロアカバー2の収容部13の下部開口6から外側に突出し、先端部分7aが収容部13内の水平方向の突起19で逆戻りを阻止され、ロアカバー2の上向きの位置決め突起20がフラット回路体4の孔部21を貫通してフラット回路体4を位置決めする。   As shown in FIG. 1, the flat circuit body 4 is bent and wired along the lower cover 2, and the tip portion (the portion having the temperature sensor 5 on the inside) 7 a of the protruding portion 7 of the flat circuit body 4 is arranged on the lower cover 2. The front end portion 7 a protrudes outward from the lower opening 6 of the housing portion 13, is prevented from returning backward by a horizontal projection 19 in the housing portion 13, and the upward positioning projection 20 of the lower cover 2 is a hole portion 21 of the flat circuit body 4. And the flat circuit body 4 is positioned.

次いで、アッパカバー3がフラット回路体4の上からロアカバー2に組み付けられ、アッパカバー3の突出部7がロアカバー2の収容部13内でフラット回路体4の突出部7内の温度センサ5に近接ないし接し、ロアカバー2の連結部14の,15位置決め突起20がアッパカバー3の板状の壁部37の孔部43に進入係合し、板状の壁部37が連結部14,15との間でフラット回路体4を挟持する。   Next, the upper cover 3 is assembled to the lower cover 2 from above the flat circuit body 4, and the protruding portion 7 of the upper cover 3 is close to the temperature sensor 5 in the protruding portion 7 of the flat circuit body 4 in the housing portion 13 of the lower cover 2. The 15 positioning projections 20 of the connecting portion 14 of the lower cover 2 enter and engage with the holes 43 of the plate-like wall portion 37 of the upper cover 3, and the plate-like wall portion 37 is connected to the connecting portions 14 and 15. The flat circuit body 4 is sandwiched between them.

図1の如く、バッテリ8は、前後方向に並列に配置された垂直な長方形状の各電池9と、各電池9の間に配置された絶縁性の垂直な樹脂プレート45とを備えている。樹脂プレート45の上端面45aは電池9の上端面9aよりも上方に突出している。   As shown in FIG. 1, the battery 8 includes vertical rectangular batteries 9 arranged in parallel in the front-rear direction, and an insulating vertical resin plate 45 arranged between the batteries 9. The upper end surface 45 a of the resin plate 45 protrudes above the upper end surface 9 a of the battery 9.

バッテリ8に温度検出モジュール1を装着することで、フラット回路体4の突出部7が電池9の上面9aに当接して弾性的に上向きに撓み、アッパカバー3の突出部10がフラット回路体4の突出部7の内面の温度センサ5に当接して弾性的に撓みつつ、温度センサ5を適切な圧力で電池9の上面9aに押し付ける。   By mounting the temperature detection module 1 on the battery 8, the protruding portion 7 of the flat circuit body 4 abuts on the upper surface 9 a of the battery 9 and flexes upward elastically, and the protruding portion 10 of the upper cover 3 is fixed to the flat circuit body 4. The temperature sensor 5 is pressed against the upper surface 9a of the battery 9 with an appropriate pressure while being elastically bent by coming into contact with the temperature sensor 5 on the inner surface of the projecting portion 7.

アッパカバー3の突出部10が温度センサ5を押す力は、初期位置の温度センサ5と突出部10との間の隙間寸法や、突出部10のスリット孔41の幅や突出部10の板厚等を変えることで、適宜設定される。   The force with which the protruding portion 10 of the upper cover 3 pushes the temperature sensor 5 is the size of the gap between the temperature sensor 5 and the protruding portion 10 at the initial position, the width of the slit hole 41 of the protruding portion 10 and the plate thickness of the protruding portion 10. It is set appropriately by changing etc.

バッテリ8に温度検出モジュール1を装着した状態で、バッテリ8の樹脂プレート45の上面45aはロアカバー2の連結部14,15の下面に隙間46を存して対向して位置する。隙間46を存して樹脂プレート45とロアカバー2とが非接触で位置することで、例えば結露等の発生が防止され、結露によるフラット回路体4や温度センサ5のショート等の懸念が回避される。   In a state where the temperature detection module 1 is mounted on the battery 8, the upper surface 45 a of the resin plate 45 of the battery 8 is positioned opposite to the lower surfaces of the connecting portions 14 and 15 of the lower cover 2 with a gap 46 therebetween. Since the resin plate 45 and the lower cover 2 are positioned in a non-contact manner with the gap 46 therebetween, for example, generation of condensation or the like is prevented, and concerns such as a short circuit of the flat circuit body 4 or the temperature sensor 5 due to condensation are avoided. .

図5は、バッテリ8に温度検出モジュール1を装着した状態を示すものであり、ロアカバー2の枠部31がバッテリ8の水平な樹脂部32の爪部33に係合することで、温度検出モジュール1がバッテリ8に位置決め固定されている。   FIG. 5 shows a state in which the temperature detection module 1 is attached to the battery 8, and the temperature detection module is obtained by engaging the frame portion 31 of the lower cover 2 with the claw portion 33 of the horizontal resin portion 32 of the battery 8. 1 is positioned and fixed to the battery 8.

図5で、符号47は電池の極柱、45は電池間の垂直な樹脂プレート、48はバッテリ8の外側ケースをそれぞれ示している。温度検出モジュール1は各電池9の並び方向に直線的に配置されている。バッテリ8の上側にバスバーモジュール(図示せず)が装着され、各電池9の極柱47が導電金属板のバスバー(図示せず)で直列に接続される。   In FIG. 5, reference numeral 47 is a battery pole, 45 is a vertical resin plate between the batteries, and 48 is an outer case of the battery 8. The temperature detection module 1 is linearly arranged in the direction in which the batteries 9 are arranged. A bus bar module (not shown) is mounted on the upper side of the battery 8, and the pole column 47 of each battery 9 is connected in series with a bus bar (not shown) made of a conductive metal plate.

バッテリ8は図5では一列であるが、実際には二列に配置されて直列接続され、温度検出モジュール1もバッテリ8毎に一本ずつ配置される。バスバーモジュールは、二つの極柱47を挿入する二つの孔を有するバスバーを絶縁樹脂板に並列に配置したものである。   Although the batteries 8 are arranged in a row in FIG. 5, they are actually arranged in two rows and connected in series, and one temperature detection module 1 is also arranged for each battery 8. In the bus bar module, a bus bar having two holes into which two pole columns 47 are inserted is arranged in parallel with an insulating resin plate.

なお、上記実施形態においては、バッテリ8の上面に温度検出モジュール1を配置したが、例えば従来例の図7のようにバッテリ8の側面に温度検出モジュール1を配置することも可能である。また、上記実施形態においては、バッテリ(電源装置)として複数の電池(セル)9を集合させた組電池8を用いたが、それ以外の電源装置に上記温度検出モジュール1を適用することも可能である。   In the above embodiment, the temperature detection module 1 is arranged on the upper surface of the battery 8, but the temperature detection module 1 may be arranged on the side surface of the battery 8 as shown in FIG. Moreover, in the said embodiment, although the assembled battery 8 which assembled the some battery (cell) 9 was used as a battery (power supply device), it is also possible to apply the said temperature detection module 1 to other power supply devices. It is.

また、上記実施形態においては、アッパカバー3を絶縁性のゴム材で形成したが、ゴム材に代えてアッパカバー3をロアカバー2と同様に絶縁性の合成樹脂材で形成することも可能である。この場合、アッパカバー3の突出部10をなくして、温度センサ5をフラット回路体4の弾性力のみで電池9に押接させることも可能である。あるいは、合成樹脂製のアッパカバー3の突出部を10薄肉化したりスリット等を設けたりして、可撓性とすることも可能である。   In the above embodiment, the upper cover 3 is formed of an insulating rubber material. However, the upper cover 3 may be formed of an insulating synthetic resin material in the same manner as the lower cover 2 instead of the rubber material. . In this case, the protrusion 10 of the upper cover 3 can be eliminated, and the temperature sensor 5 can be pressed against the battery 9 only by the elastic force of the flat circuit body 4. Alternatively, the protruding portion of the upper cover 3 made of synthetic resin can be made flexible by thinning it by 10 or providing a slit or the like.

また、アッパカバー3自体を排除して、温度センサ5をフラット回路体4の弾性力のみで電池9に押接させることも可能である。この場合、フラット回路体4はロアカバー2の係止突起や係止爪等の係止手段(図示せず)で固定される。ロアカバー2の突起20に、フラット回路体4の孔部21の周縁を係止させる周溝(図示せず)を設けることも可能である。   Further, it is also possible to remove the upper cover 3 itself and press the temperature sensor 5 against the battery 9 only by the elastic force of the flat circuit body 4. In this case, the flat circuit body 4 is fixed by a locking means (not shown) such as a locking projection or a locking claw of the lower cover 2. A circumferential groove (not shown) for locking the peripheral edge of the hole 21 of the flat circuit body 4 may be provided on the protrusion 20 of the lower cover 2.

図6は、上記温度検出モジュール1の製造方法の一実施形態を示すものである。   FIG. 6 shows an embodiment of a manufacturing method of the temperature detection module 1.

この方法は、歯車状の挿入治具50を用いて、平坦な帯状のフレキシブルフラット回路体4(図2)を合成樹脂製のロアカバー(第一のカバー)2内に波形に屈曲させながら挿入するものである。   In this method, a flat belt-like flexible flat circuit body 4 (FIG. 2) is inserted into a synthetic resin lower cover (first cover) 2 while being bent into a waveform using a gear-like insertion jig 50. Is.

挿入治具50は、垂直な円板51の外周に複数の歯部(突出部)52を等ピッチで突設し、円板51の中心に水平な軸部53を設けて成るものである。歯部52は、ロアカバー2の収容部13内にフラット回路体4を押し込むべく収容部13内に上から進入するものであり、各収容部13と同じピッチで配列され、隣接の各歯部52の間には円板51の円弧状の外周面51aが形成されている。   The insertion jig 50 is formed by projecting a plurality of tooth portions (projections) 52 at an equal pitch on the outer periphery of a vertical disc 51 and providing a horizontal shaft portion 53 at the center of the disc 51. The tooth portions 52 enter the housing portion 13 from above in order to push the flat circuit body 4 into the housing portion 13 of the lower cover 2, and are arranged at the same pitch as each housing portion 13. A circular arc-shaped outer peripheral surface 51a of the disc 51 is formed between them.

歯部52は台形状の左右の側面52aと前後の傾斜面52bと先端面52cとを有し、先端面52cの中央に、フラット回路体4の温度センサ5を逃がすための溝部54を有している。溝部54は円板周方向に切欠形成されている。左右の側面52aは、円板51の側面と同一面で垂直に形成してもよいが、ロアカバー2の下部開口6の左右両側の突起19に歯部52の先端52cが干渉しないように、円板51の板厚方向に内向きに少し傾斜していることが好ましい。歯部52の先端面52cはフラット回路体4(図2)の底面7aを押圧する。   The tooth portion 52 has a trapezoidal left and right side surface 52a, front and rear inclined surfaces 52b, and a tip surface 52c, and has a groove portion 54 for allowing the temperature sensor 5 of the flat circuit body 4 to escape in the center of the tip surface 52c. ing. The groove part 54 is notched in the circumferential direction of the disk. The left and right side surfaces 52a may be formed in the same plane as the side surface of the disk 51 and perpendicular to the disk 51. It is preferable that the plate 51 is slightly inclined inward in the plate thickness direction. The front end surface 52c of the tooth portion 52 presses the bottom surface 7a of the flat circuit body 4 (FIG. 2).

図6において、ロアカバー2の上部開口17側に平坦な帯状のフラット回路体4(図4)を載置した状態で、軸部53を中心に挿入治具50を矢印方向に回転させることで、各歯部52でフラット回路体4をロアカバー2の各収容部13内に押し込んで台形状の波形に屈曲変形させる。   In FIG. 6, with the flat belt-like flat circuit body 4 (FIG. 4) placed on the upper opening 17 side of the lower cover 2, the insertion jig 50 is rotated in the arrow direction around the shaft portion 53, Each tooth portion 52 pushes the flat circuit body 4 into each accommodating portion 13 of the lower cover 2 to bend and deform into a trapezoidal waveform.

挿入治具50は、フラット回路体4の最初(一端)の収容部13に歯部52を進入させる位置まで予め下降され、ロアカバー2は作業台上で水平に真直に伸ばした状態にセットされる。この状態から挿入治具50を定位置で回転させる(例えば軸部53を図示しない装置フレームに回転自在に支持させた状態で挿入治具50を回転させる)ことで、ロアカバー2が挿入治具50に引き込まれつつ、ロアカバー内にフラット回路体4が挿入される。   The insertion jig 50 is lowered in advance to a position where the tooth portion 52 enters the first (one end) accommodating portion 13 of the flat circuit body 4, and the lower cover 2 is set in a state where it is horizontally extended straight on the work table. . From this state, the lower jig 2 is rotated at a fixed position (for example, the insertion jig 50 is rotated while the shaft portion 53 is rotatably supported by a device frame (not shown)), whereby the lower cover 2 is inserted into the insertion jig 50. The flat circuit body 4 is inserted into the lower cover while being pulled into the lower cover.

あるいは、ロアカバー2を定位置で真直に伸ばした状態で、挿入治具50を回転させつつロアカバー2に沿って前進させて、ロアカバー内にフラット回路体4を挿入する。この場合、軸部53を作業者が手で持って回転させることも可能である。ロアカバー2は幅方向(左右方向)に曲がりやすいので、例えば作業台上の真直な溝内にセットすることが好ましい。   Alternatively, in a state where the lower cover 2 is straightened at a fixed position, the insertion jig 50 is rotated and advanced along the lower cover 2 to insert the flat circuit body 4 into the lower cover. In this case, it is also possible for the operator to rotate the shaft portion 53 by hand. Since the lower cover 2 is easily bent in the width direction (left-right direction), it is preferable to set the lower cover 2 in a straight groove on the work table, for example.

挿入治具50の各歯部52でフラット回路体4を屈曲させてその突出部7(図2)をロアカバー2の各収容部13内に押し込むことで、各収容部間の連結部14,15にフラット回路体4の頂面34(図2)が水平に配置され、頂面34の孔部21にロアカバー2の突起20が自動的に係合する。   The flat circuit body 4 is bent at each tooth portion 52 of the insertion jig 50 and the protruding portion 7 (FIG. 2) is pushed into each housing portion 13 of the lower cover 2, thereby connecting portions 14, 15 between the housing portions. The top surface 34 (FIG. 2) of the flat circuit body 4 is horizontally disposed, and the protrusion 20 of the lower cover 2 automatically engages with the hole 21 of the top surface 34.

上記方法を用いることで、例えば作業者が手作業でフラット回路体4をロアカバー2の各収容部13に一々屈曲させながら挿入する場合に較べて、ロアカバー2への可撓性(軟性)のフラット回路体4の組付工数を大幅に削減することができる。また、挿入治具50の各歯部52でフラット回路体4を各収容部13に沿って均一な大きさ形状に屈曲変形させることができるから、手作業で屈曲させる場合に較べて、フラット回路体4の屈曲加工精度が向上する。   By using the above method, for example, compared to a case where the operator manually inserts the flat circuit body 4 into the receiving portions 13 of the lower cover 2 while bending them one by one, the flexible (soft) flat to the lower cover 2 is achieved. The number of assembling steps for the circuit body 4 can be greatly reduced. Further, since the flat circuit body 4 can be bent and deformed into a uniform size along the receiving portions 13 by the respective tooth portions 52 of the insertion jig 50, the flat circuit body can be compared with the case where it is bent manually. The bending accuracy of the body 4 is improved.

ロアカバー2にフラット回路体4を挿入した後、アッパカバー3(図2)をフラット回路体4の上からロアカバー2に挿入係合させる。この作業は手作業で行ってもよいが、例えば、フラット回路体4の上にアッパカバー3を真直に載置した状態で、歯部のない円板(図示せず)の外周面でアッパカバー3をロアカバー2に押し込むことも可能である。アッパカバー3を用いない場合は、押し込み操作は不要である。   After the flat circuit body 4 is inserted into the lower cover 2, the upper cover 3 (FIG. 2) is inserted and engaged with the lower cover 2 from above the flat circuit body 4. Although this operation may be performed manually, for example, the upper cover 3 is placed on the flat circuit body 4 and the upper cover 3 is placed on the outer peripheral surface of a disc (not shown) having no teeth. It is also possible to push 3 into the lower cover 2. When the upper cover 3 is not used, the pushing operation is not necessary.

本発明に係る温度検出モジュールの一実施形態を示す縦断面図である。It is a longitudinal cross-sectional view which shows one Embodiment of the temperature detection module which concerns on this invention. 同じく温度検出モジュールを示す分解斜視図である。It is a disassembled perspective view which similarly shows a temperature detection module. 温度検出モジュールのロアカバーの連結部の一例を示す、(a)は側面図、(b)は平面図である。An example of the connection part of the lower cover of a temperature detection module is shown, (a) is a side view, (b) is a top view. 温度検出モジュールのフラット回路体の一例を示す平面図である。It is a top view which shows an example of the flat circuit body of a temperature detection module. バッテリに温度検出モジュールを装着した状態を示す斜視図である。It is a perspective view which shows the state which mounted | wore the temperature detection module with the battery. 温度検出モジュールの製造方法の一実施形態を示す斜視図である。It is a perspective view which shows one Embodiment of the manufacturing method of a temperature detection module. 従来の温度検出モジュールの一形態を示す平面図である。It is a top view which shows one form of the conventional temperature detection module. 従来の温度検出モジュールの他の形態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the other form of the conventional temperature detection module.

符号の説明Explanation of symbols

1 温度検出モジュール
2 ロアカバー(第一のカバー)
3 アッパカバー(第二のカバー)
4 フラット回路体
5 温度センサ
6 開口
7 突出部
8 バッテリ(電源装置)
9 電池(セル)
10 突出部(押圧部)
13 収容部
15 連結部
20 突起(位置決め手段)
21,28 孔部(位置決め手段)
50 挿入治具
51 円板
52 歯部
1 Temperature detection module 2 Lower cover (first cover)
3 Upper cover (second cover)
4 Flat Circuit Body 5 Temperature Sensor 6 Opening 7 Projection 8 Battery (Power Supply)
9 Battery (cell)
10 Protruding part (pressing part)
13 accommodating part 15 connecting part 20 protrusion (positioning means)
21, 28 hole (positioning means)
50 Insertion jig 51 Disc 52 Tooth

Claims (6)

複数の突出部をなすように波形状に屈曲される可撓性のフラット回路体と、該突出部の先端内面に設けられる温度センサと、該突出部を収容して該突出部の先端側部分を開口から外部に撓み自在に突出させる各収容部を有する絶縁性の第一のカバーと、該先端側部分が電源装置に接して撓んだ状態で、各温度センサを該電源装置側に弾性的に押圧する押圧部を有する第二のカバーとを備えることを特徴とする温度検出モジュール。   A flexible flat circuit body bent into a wave shape so as to form a plurality of protrusions, a temperature sensor provided on the inner surface of the tip of the protrusion, and a tip-side portion of the protrusion containing the protrusion Insulating first cover having each accommodating portion that projects freely from the opening to the outside, and each temperature sensor is elastic to the power supply device side in a state where the tip side portion is bent in contact with the power supply device A temperature detection module comprising: a second cover having a pressing portion that presses automatically. 前記第二のカバーが弾性材で形成されたことを特徴とする請求項1記載の温度検出モジュール。   The temperature detection module according to claim 1, wherein the second cover is made of an elastic material. 前記フラット回路体が、前記第一のカバーと前記第二のカバーとに位置決め手段で位置決めされると共に、挟持固定されることを特徴とする請求項1又は2記載の温度検出モジュール。   3. The temperature detection module according to claim 1, wherein the flat circuit body is positioned and fixed to the first cover and the second cover by positioning means. 前記電源装置が複数のセルを集合させた組電池であり、前記フラット回路体の各突出部が各セル毎に接触することを特徴とする請求項1〜3の何れかに記載の温度検出モジュール。   The temperature detection module according to any one of claims 1 to 3, wherein the power supply device is an assembled battery in which a plurality of cells are assembled, and each protruding portion of the flat circuit body is in contact with each cell. . 前記第一のカバーの各収容部を連結する連結部が可撓性を有して、位置ずれを吸収可能であることを特徴とする請求項1〜4の何れかに記載の温度検出モジュール。   The temperature detection module according to claim 1, wherein a connecting portion that connects each housing portion of the first cover has flexibility and can absorb misalignment. 請求項1〜5の何れかに記載の温度検出モジュールを製造する方法であって、円板の外周に複数の歯部を等ピッチで突設した挿入治具を回転させて、平坦な帯状の前記フラット回路体を該歯部で前記第一のカバーの前記各収容部内に押し込むことを特徴とする温度検出モジュールの製造方法。   A method for manufacturing the temperature detection module according to any one of claims 1 to 5, wherein an insertion jig having a plurality of teeth protruding at an equal pitch on the outer periphery of a disc is rotated to form a flat belt-like shape. A method of manufacturing a temperature detection module, wherein the flat circuit body is pushed into each housing portion of the first cover by the tooth portion.
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