JP4986300B2 - Method for producing fine particles - Google Patents

Description

  The present invention relates to a method for producing fine particles that can produce uniform fine particles, can be easily produced with high energy efficiency, and can be mass-produced and have good redispersibility.

Mitsue Koizumi (others), "Latest Technology of Nanomaterials", 1st Edition, CMC Publishing Co., Ltd., April 2001 Nanotechnology Handbook Editorial Committee, “Nanotechnology Handbook-I Create”, 1st edition, Ohm Corporation, May 2003 JP 7-144102 A JP 2002-97281 A Japanese Patent Laid-Open No. 2007-8924

  Fine particles, especially nanoparticles of 100 nm or less, have a rapid increase in the surface area ratio to the volume of the particles, and new properties appear. Therefore, nanomaterials such as nanoparticles alone or their aggregates and organic-inorganic composites are used in the 21st century. There is great expectation as a material for this (Non-Patent Document 1). In other words, by simply making a conventional substance into fine particles, new functions can be manifested in the substance. Therefore, nanoparticles are an important theme across the entire industry. Of course, the relationship with the particles is not separable (Non-patent Document 2).

  Therefore, a new method for producing fine particles has been appealed. Furthermore, in order to utilize industrially, it is the most important subject in nanotechnology to establish a manufacturing method which can be stably and mass-produced.

  As a method for producing fine particles in a liquid, there is a method of precipitating fine particles using a difference in solubility of a solvent caused by a temperature difference while stirring a solution in which a specific solute is dissolved as shown in Patent Document 1. is there. This method utilizes the fact that the solubility of a solute in a solvent at a certain temperature is lowered by lowering the temperature of the solvent, and an amount of solute exceeding the saturation solubility is precipitated in the solvent. However, since this method uses a general-purpose kettle having a Faudler wing, it is difficult to produce substantially nano-sized particles, and when the purpose is to precipitate crystals, the crystal type is Difficult to be uniform. Therefore, as in Patent Document 2, a method of dissolving an organic substance in an organic solvent and injecting the organic substance solution into a solvent having a lower solubility than the organic solvent, that is, a good solvent having a high solubility with respect to the solute and a low solubility. A method of obtaining fine particles by lowering the apparent solubility in a good solvent by mixing a poor solvent and precipitating a solute exceeding the saturation solubility is becoming common. However, both of the above two methods are methods of depositing a substance in a so-called batch-type reaction vessel and reaction vessel, and it is very difficult to stably produce nano-sized fine particles or a uniform crystal form. The reason for this is that, generally, in the case of a precipitation reaction in a batch using an agitation operation, a temperature gradient or a concentration gradient in the batch always causes nonuniform reaction. For this reason, temperature control and concentration control within the batch are very difficult, and it is inevitably difficult to perform a uniform reaction. Therefore, it is extremely difficult to manage all the reaction conditions, such as the necessity to lengthen the reaction time.

  Further, as disclosed in Patent Document 3, there is a method of obtaining fine particles using a difference in solubility using a microreactor or a micromixer or microreactor that is a microchannel reactor. However, in the case of using a general microreactor, although there are several advantages of the microdevice and the system, in fact, the smaller the microchannel diameter is, the more the pressure loss is inversely proportional to the fourth power of the channel. In fact, it is necessary to supply pressure so high that it is difficult to obtain a pump for feeding fluid, and in the case of a reaction accompanied by precipitation, the product is clogged in the flow path or the micro flow path is closed due to bubbles generated by the reaction. Furthermore, in order to expect the reaction to the diffusion rate of the molecule basically, the micro space is not effective and adaptable for all reactions, but in reality, the reaction is tried in a trial and error system, There are many problems, such as the need to select a successful one. Furthermore, scale-up has been solved by increasing the number of microreactors themselves, that is, numbering up, but in reality, the number of layers that can be stacked is limited to several tens, and the focus is on products with high product value. The increase in the number of devices means that the absolute number of causes of the failure also increases. When a problem such as clogging actually occurs, it is very difficult to detect the problem location such as the failure location. There is a possibility that it can be.

  In view of the above, the present invention provides a change in saturation solubility due to a fluid temperature difference in a thin film fluid formed between processing surfaces that are arranged so as to be able to approach and separate from each other and at least one rotates relative to the other. This is a method for producing fine particles by precipitating dissolved matter to obtain fine particles. The temperature uniformity in the thin film fluid is high and the uniformity in stirring of the reaction vessel is high. Monodisperse fine particles can be produced according to the purpose because the concentration distribution is very uniform, and there is no clogging of the product due to self-discharge, no large pressure is required, and high productivity. It is an issue to provide. Furthermore, it is an object to produce fine particles with lower energy than conventional manufacturing methods.

In the invention according to claim 1 of the present application, at least one of two or more types of fluids to be processed containing a fine particle raw material is disposed so as to be able to approach and separate from each other, at least one of which rotates relative to the other Introduced between at least two processing surfaces to form a thin film fluid, and the thin film fluid is cooled or heated (heated) to change the saturation solubility, thereby depositing fine particles. And at least any one of the two or more types of fluids to be processed passes between the processing surfaces while forming the thin film fluid, and the at least one type of fluids to be processed. A separate introduction path that is independent from the flow path through which the body flows, and at least one of the at least two processing surfaces includes at least one opening that communicates with the introduction path. 1 At least one kind of fluid to be treated different from the fluid to be treated is introduced between the processing surfaces through the opening and merged with the thin film fluid. A fluid to be treated is uniformly mixed in the thin film fluid, and at least the fine particle raw material contained in any of the fluids to be treated and a fluid to be treated different from the fluid to be treated. The method for producing fine particles, wherein the fine particles are precipitated by being uniformly mixed in the thin film fluid .

The invention according to claim 2 of the present application uses at least two kinds of fluids as the fluid to be treated, and at least one of the fluids contains at least one kind of fine particle raw material, and is subject to treatment other than the above. Among the fluids, at least one type of fluid has a temperature difference with respect to the fluid containing the fine particle raw material, and is disposed so as to be able to approach and separate from each other, at least one of which is in relation to the other in a thin film fluid formed between the processing surfaces of rotating it is intended for combining the respective processed fluid above, fine particles in the thin film fluid by utilizing the change of saturation solubility due to the temperature change of the fluid containing the fine particles material This is a method for producing fine particles, characterized in that precipitation is performed .

Further, the invention according to claim 3 of the present application is capable of relatively approaching / separating from the fluid pressure applying mechanism for applying pressure to the fluid to be processed, the first processing part, and the first processing part. The second processing unit includes at least two processing units, and a rotation drive mechanism that relatively rotates the first processing unit and the second processing unit. At least two processing surfaces of a first processing surface and a second processing surface are provided at positions facing each other, and the fluid to be processed to which the pressure is applied flows on each of the processing surfaces. It is, which constitutes part of a sealed flow path at between the processing surfaces of the, including particulate material to at least one, and uniformly mixing two or more processed fluids reaction Among the first processing unit and the second processing unit, at least a second processing is performed. The portion includes a pressure receiving surface, and at least a part of the pressure receiving surface is configured by the second processing surface, and the fluid pressure applying mechanism applies the pressure receiving surface to the fluid to be processed. A first processing surface and a second processing surface that generate a force to move the second processing surface away from the first processing surface in response to pressure, and that are capable of approaching / separating and relatively rotating; When the fluid to be treated having the pressure applied is passed between the two fluids, the fluid to be treated passes between the treatment surfaces while forming a thin film fluid having a thickness equal to or less than the distance between the treatment surfaces. And a separate introduction path that is independent from the flow path through which the fluid to be treated to which the pressure is applied flows is provided, and at least one of the first processing surface and the second processing surface, Provided with at least one opening that leads to the introduction path. At least one of the fluids to be treated is introduced between the two treatment surfaces, and the fine particle raw material contained in at least one of the fluids to be treated is different from the fluid to be treated. 3. The method for producing fine particles according to claim 2 , wherein the treatment fluid is uniformly mixed in the thin film fluid to cause precipitation of the fine particles.

In addition, the invention according to claim 4 of the present application is capable of relatively approaching and moving away from the fluid pressure applying mechanism that applies pressure to the fluid to be processed, the first processing portion, and the first processing portion. The second processing unit includes at least two processing units, and a rotation drive mechanism that relatively rotates the first processing unit and the second processing unit. At least two processing surfaces of a first processing surface and a second processing surface are provided at positions facing each other, and the fluid to be processed to which the pressure is applied flows on each of the processing surfaces. Part of the sealed flow path, and of the first processing part and the second processing part, at least the second processing part has a pressure receiving surface, and this At least a part of the pressure receiving surface is configured by the second processing surface, and the pressure receiving surface is The body pressure applying mechanism receives a pressure applied to the fluid to be processed and generates a force to move the second processing surface away from the first processing surface so that the body can be approached / separated and rotates relatively. A thin film having a thickness equal to or smaller than the distance between the two processing surfaces by passing the processing fluid to which the pressure is applied between the first processing surface and the second processing surface. 2. The method for producing fine particles according to claim 1, wherein the fluid passes between the processing surfaces while forming a fluid.

The invention according to claim 5 of the present application is characterized in that at least one of the fluids to be treated contains a surfactant, and the production of fine particles according to any one of claims 1 to 4 Is the method.

The invention according to claim 6 of the present application is the method for producing fine particles, wherein heating (heating) is performed between the processing surfaces, or ultraviolet (UV) is irradiated between the processing surfaces, or between the processing surfaces. The method for producing fine particles according to any one of claims 1 to 5, wherein ultrasonic energy is applied to the microparticles.

In the invention according to claim 7 of the present application, the precipitation reaction for precipitating the fine particles is performed in a container capable of ensuring a reduced pressure or a vacuum state, and at least the secondary side from which the fluid to be treated is discharged after the reaction is reduced in pressure. or by a vacuum state, wherein the perform desolvation of the degassing of gas contained in the gas as well as in the above processed fluid occurs during the reaction, or said processed fluid, claim The method for producing fine particles according to any one of 1 to 6 .

  The present invention provides a saturated solubility due to a temperature difference of a fluid in a thin film fluid formed between opposing processing surfaces that are disposed opposite to each other and at least one of which is rotating relative to the other. The method for producing fine particles by precipitating a dissolved substance by changing the value and the fine particles produced by this production method. The obtained fine particles have a smaller particle size than conventional methods, are excellent in redispersibility, and can obtain monodispersed fine particles without agglomeration. In addition, it is possible to provide finer particles that are cheaper by continuous, short-time, and low-energy processing as compared with conventional manufacturing methods. Further, the present invention can increase the size of the airframe using a general scale-up concept according to the required production amount.

  Hereinafter, the method for producing fine particles of the present invention will be described in detail.

  The present invention uses a fluid in which at least one kind of fine particle raw material is dissolved in a solvent as a fluid to be treated, and produces fine particles by precipitating a dissolved substance in the fluid using a change in saturation solubility due to a temperature difference of the fluid. In this case, the above-described fluids are arranged so as to face each other so as to be able to approach and separate from each other, and at least one of them is introduced between processing surfaces rotating with respect to the other to form a thin-film fluid. It is characterized in that the dissolved matter is precipitated by utilizing the change in saturation solubility due to the temperature difference of the fluid. Also, as used herein, “dissolution” means, for example, dissolution indicating that a solute decomposes into cations and anions in water, such as dissolution in water, and without decomposition into ions such as molecular dispersion. This includes the case where solute molecules dissolve or mix with solvent molecules.

  As a method of uniformly stirring and mixing in a thin film fluid, which is formed between processing surfaces that are disposed so as to be able to approach and separate from each other and at least one rotates with respect to the other, used in the present invention, for example, An apparatus having the same principle as that described in Japanese Patent Application Laid-Open No. 2004-49957 by the applicant of the present application can be used.

Hereinafter, a fluid processing apparatus suitable for carrying out this method will be described.
As shown in FIG. 1A, this apparatus includes two first and second processing units 10 and 20 that face each other, and at least one processing unit rotates. The opposing surfaces of the processing parts 10 and 20 are processed surfaces 1 and 2, respectively, and the processing target fluid is processed between the processing surfaces. The first processing unit 10 includes a first processing surface 1, and the second processing unit 20 includes a second processing surface 2.
Both processing surfaces 1 and 2 are connected to the flow path of the fluid to be processed, and constitute a part of the flow path of the fluid to be processed.
More specifically, this apparatus constitutes at least two flow paths for the fluid to be processed and joins the flow paths together.
That is, this apparatus is connected to the flow path of the first fluid to be treated, forms a part of the flow path of the first fluid to be treated, and is separate from the first fluid to be treated. 2 Form a part of the flow path of the fluid to be treated. And this apparatus makes both flow paths merge, mixes both fluids between the processing surfaces 1 and 2, and makes it react when a reaction is accompanied. In the embodiment shown in FIG. 1A, each of the above-mentioned flow paths is sealed, and is liquid-tight (when the fluid to be treated is liquid) or air-tight (when the fluid to be treated is gas). It is said that.

More specifically, as shown in FIG. 1A, this apparatus includes a first processing unit 10, a second processing unit 20, and a first processing unit 10 that holds the first processing unit 10. Holder 11, second holder 21 that holds second processing unit 20, contact surface pressure applying mechanism 4, rotation drive unit (hereinafter, the rotation drive mechanism is also referred to as a rotation drive unit or a drive unit), and second. 1 introduction part d1, 2nd introduction part d2, fluid pressure giving mechanism p1, 2nd fluid supply part p2, and case 3 are provided.
In addition, illustration of a rotational drive part is abbreviate | omitted.
At least one of the first processing unit 10 and the second processing unit 20 can be approached / separated from at least either one, and both processing surfaces 1 and 2 can be approached / separated. .
In this embodiment, the second processing unit 20 approaches and separates from the first processing unit 10. However, conversely, the first processing unit 10 may approach or separate from the second processing unit 20, and both processing units 10 and 20 may approach or separate from each other. It may be.

The second processing unit 20 is disposed above the first processing unit 10, and the lower surface of the second processing unit 20, that is, the lower surface is the second processing surface 2, and The first processing surface 1 is an upper surface, that is, an upper surface of the first processing portion 10.
As shown in FIG. 1A, in this embodiment, the first processing unit 10 and the second processing unit 20 are each an annular body, that is, a ring. Hereinafter, the first processing unit 10 is referred to as a first ring 10 and the second processing unit 20 is referred to as a second ring 20 as necessary.
In this embodiment, both the rings 10 and 20 are members whose one end made of metal is mirror-polished, and the mirror surfaces are referred to as a first processing surface 1 and a second processing surface 2. That is, the upper end surface of the first ring 10 is mirror-polished as the first processing surface 1, and the lower end surface of the second ring 20 is mirror-polished as the second processing surface 2.

At least one of the holders can be rotated relative to the other holder by the rotation driving unit. Reference numeral 50 in FIG. 1A denotes a rotation shaft of the rotation drive unit. An electric motor can be adopted as the rotation drive unit. In the rotation drive unit, the processing surface of the other ring can be rotated relative to the processing surface of the one ring.
In this embodiment, the first holder 11 receives the driving force from the rotation driving unit at the rotation shaft 50 and rotates with respect to the second holder 21. The integrated first ring 10 rotates with respect to the second ring 20. Inside the first ring 10, the rotation shaft 50 is provided in the first holder 11 so as to be concentric with the center of the circular first ring 10 in plan view.
The rotation of the first ring 10 is centered on the axis of the first ring 10. Although not shown, the axis indicates the center line of the first ring 10 and is an imaginary line.

As described above, in this embodiment, the first holder 11 holds the first ring 10 with the first processing surface 1 of the first ring 10 facing upward, and the second holder 21 is the second ring. The second ring 20 is held with the second processing surface 2 of 20 facing downward.
Specifically, each of the first and second holders 11 and 21 includes a concave ring housing portion. In this embodiment, the first ring 10 is fixed to the ring housing portion so that the first ring 10 fits into the ring housing portion of the first holder 11 and does not protrude from the ring housing portion of the first holder 11. ing.

That is, the first processing surface 1 is exposed from the first holder 11 and faces the second holder 21 side.
The material of the first ring 10 is not only metal, but also ceramic, sintered metal, wear-resistant steel, other metal that has been subjected to hardening treatment, or hard material that has been subjected to lining, coating, plating, or the like. . In particular, since it rotates, it is desirable to form the 1st process part 10 with a lightweight raw material. What is necessary is just to employ | adopt and implement the material similar to the 1st ring 10 also about the material of the 2nd ring 20. FIG.

On the other hand, the ring accommodating part 41 with which the 2nd holder 21 is provided accommodates the 2nd ring 20 so that it can protrude and retract.
The ring holder 41 included in the second holder 21 is a recess that mainly stores a portion of the second ring 20 on the side opposite to the processing surface 2 side. It is a groove.
The ring accommodating portion 41 is formed larger than the size of the second ring 20 and accommodates the second ring 20 with a sufficient clearance between the ring accommodating portion 41 and the second ring 20.
By this clearance, the second ring 20 can be displaced in the ring housing portion 41 in the axial direction of the annular ring housing portion 41 and further in the direction intersecting with the axial direction. In other words, with this clearance, the second ring 20 can be displaced with respect to the ring housing part 41 so that the center line of the second ring 20 breaks the parallel relationship with the axial direction of the ring housing part 41. .
Hereinafter, a portion of the second holder 21 surrounded by the second ring 20 is referred to as a central portion 22.
In other words, in other words, the second ring 20 is further decentered with respect to the thrust direction of the ring accommodating portion 41, that is, the direction in which the second ring 20 protrudes and retracts, with respect to the center of the ring accommodating portion 41. Is accommodated so that it can be displaced. In addition, the second ring 20 can be displaced so that the width of the protrusions and depressions from the ring accommodating portion 41 is different from each other in the circumferential direction of the second ring 20 with respect to the ring accommodating portion 41. The ring 20 is accommodated.

  The second ring 20 includes the first ring 10 while having the above three degrees of freedom of freedom, that is, the degree of freedom of the second ring 20 with respect to the ring accommodating portion 41 in the axial direction, the eccentric direction, and the center deflection direction. Is held by the second holder 21 so as not to follow the rotation. Although not shown in the drawing, this point may be implemented by providing each ring accommodating portion 41 and the second ring 20 with an appropriate contact that restricts the ring accommodating portion 41 from rotating in the circumferential direction. However, the hit must not impair the three degrees of freedom of displacement.

Said contact surface pressure provision mechanism 4 provides the processing part with a force that causes the first processing surface 1 and the second processing surface 2 to approach each other. In this embodiment, the contact surface pressure application mechanism 4 is provided in the second holder 21 and biases the second ring 20 toward the first ring 10.
The contact surface pressure application mechanism 4 urges each position in the circumferential direction of the second ring 20, that is, each position of the second processing surface 2, evenly toward the first ring 10. A specific configuration of the contact surface pressure imparting mechanism 4 will be described in detail later.
As shown in FIG. 1 (A), the case 3 is disposed outside the outer peripheral surfaces of the rings 10 and 20 and is generated between the processing surfaces 1 and 2. Contains the product discharged to the outside. As shown in FIG. 1A, the case 3 is a liquid-tight container that houses the first holder 11 and the second holder 21. However, the 2nd holder 21 can be implemented as what was formed integrally with case 3 as a part of the case concerned.
As described above, when the second holder 21 is formed as a part of the case 3 or formed separately from the case 3, the second holder 21 has a space between the rings 10 and 20, that is, both processing surfaces 1. , Are not movable so as to affect the distance between the two. In other words, the second holder 21 does not affect the distance between the processing surfaces 1 and 2.
The case 3 is provided with a discharge port 32 for discharging the product outside the case 3.

The first introduction part d1 supplies the first fluid to be processed between the processing surfaces 1 and 2.
The fluid pressure applying mechanism p1 is connected to the first introduction part d1 directly or indirectly and applies a fluid pressure to the first fluid to be treated. For the fluid pressure imparting mechanism p1, a compressor or other pump can be employed.
In this embodiment, the first introduction part d1 is a passage provided inside the central portion 22 of the second holder 21, and one end of the first introduction part d1 is the second holder 21 and the second ring 20 is in plan view. Open at the center of the presenting circle. The other end of the first introduction part d1 is connected to the fluid pressure applying mechanism p1 outside the second holder 21, that is, outside the case 3.

The second introduction part d2 supplies the second processed fluid to be mixed with the first processed fluid between the processing surfaces 1 and 2. In this embodiment, the second introduction part is a passage provided inside the second ring 20, one end of which opens at the second processing surface 2, and the other end supplies the second fluid supply. The part p2 is connected.
A compressor and other pumps can be employed for the second fluid supply part p2.

The first fluid to be processed, which is pressurized by the fluid pressure applying mechanism p1, is introduced from the first introduction part d1 into the space inside the rings 10 and 20, and the first treatment surface 1 and the first 2 Passes between the processing surfaces 2 and tries to pass outside the rings 10 and 20.
At this time, the second ring 20 that has received the pressure of the first fluid to be treated moves away from the first ring 10 against the urging force of the contact surface pressure imparting mechanism 4, and a minute amount between both treatment surfaces. Open a large interval. The interval between both surfaces 1 and 2 due to the approach and separation of both processing surfaces 1 and 2 will be described in detail later.
Between the processing surfaces 1 and 2, the second fluid to be treated is supplied from the second introduction part d <b> 2, merges with the first fluid to be treated, and mixing (reaction) is caused by the rotation of the processing surface. Promoted. And the product by mixing (reaction) of both fluid is discharged | emitted from the both processing surfaces 1 and 2 to the outer side of both rings 10 and 20. FIG. The product discharged to the outside of both rings 10 and 20 is finally discharged from the discharge port 32 of the case 3 to the outside of the case (self-discharge).
The mixing and reaction of the fluid to be processed (when accompanied by a reaction) is performed by rotating the first processing surface 1 and the second processing by the rotation of the driving unit 5 of the first processing unit 10 with respect to the second processing unit 20. This is done with the working surface 2.
Between the first and second processing surfaces 1 and 2, the downstream side of the opening m2 of the second introduction portion d2 mixes the first fluid to be treated and the second fluid to be treated. It becomes a room. Specifically, between the processing surfaces 1 and 2, in FIG. 11C showing the bottom surface of the second ring 20, the second introduction is shown in the inner and outer directions r1 of the diameter of the second ring 20 indicated by diagonal lines. The opening m2 of the part, that is, the region H outside the second opening m2 functions as the processing chamber. Therefore, this processing chamber is located downstream of both openings m1 and m2 of the first introduction part d1 and the second introduction part d2 between the processing surfaces 1 and 2.
With respect to the first fluid to be processed introduced from the first opening m1 into the space between the processing surfaces 1 and 2 through the space inside the ring, the processing surfaces 1 and 2 from the second opening m2. The second fluid to be treated introduced between them is mixed in the region H serving as the treatment chamber, and when the reaction is involved, both fluids to be treated react. The fluid to be treated is fed by the fluid pressure applying mechanism p1 and tries to move to the outside of the ring through a minute gap between the processing surfaces 1 and 2, but the first ring 10 rotates. Therefore, in the region H, the mixed fluid does not move linearly from the inside to the outside in the inner and outer directions of the diameter of the ring, but in a state where the processing surface is viewed in plan, the rotation axis of the ring Around the center of the ring. In this way, in the region H where mixing (reaction) is performed, the section required for sufficient mixing (reaction) at a minute interval between the processing surfaces 1 and 2 by moving spirally from the inside to the outside. Can be ensured, and uniform mixing can be promoted.
Further, the product produced by the mixing (reaction) becomes a homogeneous product between the minute first and second processing surfaces 1 and 2, and particularly becomes fine particles in the case of crystallization and precipitation.
At least the balance between the processing surfaces 1 and 2 on the balance of the pressure applied by the fluid pressure applying mechanism p1, the urging force of the contact surface pressure applying mechanism 4 and the centrifugal force due to the rotation of the ring. The interval can be balanced to a preferable minute interval, and the fluid to be processed that receives the pressure applied by the fluid pressure applying mechanism p1 and the centrifugal force due to the rotation of the ring is between the processing surfaces 1 and 2 described above. Mixing (reaction) is promoted by moving the minute gap in a spiral.
The above-mentioned mixing (reaction) is forcibly performed by the pressure feeding applied by the fluid pressure applying mechanism p1 and the rotation of the ring. That is, the mixing (reaction) is forcedly and uniformly performed between the processing surfaces 1 and 2 that are disposed so as to be able to approach and separate from each other and at least one of which rotates relative to the other.
Therefore, in particular, the crystallization or precipitation of the product due to the reaction is performed by a method that is relatively easy to control, such as adjustment of the feed pressure applied by the fluid pressure imparting mechanism p1 and adjustment of the rotation speed of the ring, that is, the rotation speed of the ring. Can be controlled.
As described above, this fluid processing apparatus can control the distance between the processing surfaces 1 and 2 that affect the size of the product by adjusting the feeding pressure and the centrifugal force. This is excellent in that the distance moved in the region H that affects generation can be controlled.
Moreover, said process is not restricted to what a product precipitates, but also includes the case of a liquid. In addition, when the product is a fine mass such as fine particles, the product may be precipitated in the treated fluid after treatment, or a dispersion liquid in which a dispersed phase is present in the continuous phase. It may be in a state.
The rotating shaft 50 is not limited to the one arranged vertically, but may be arranged in the horizontal direction or may be arranged inclined. This is because, during processing, the mixing (reaction) is performed at a fine interval between the processing surfaces 1 and 2, and the influence of gravity can be substantially eliminated.
In FIG. 1 (A), the 1st introduction part d1 has corresponded with the axial center of the 2nd ring 20 in the 2nd holder 21, and has shown what was extended up and down perpendicularly. However, the first introduction part d1 is not limited to the one that coincides with the axial center of the second ring 20, and the first fluid to be treated is supplied to the space surrounded by the rings 10 and 20. As long as it is possible, it may be provided at other positions of the central portion 22 of the second holder 21, and may extend obliquely rather than vertically.

FIG. 12A shows a more preferable embodiment of the above apparatus. As illustrated, the second processing unit 20 includes the second processing surface 2 and a pressure receiving surface 23 located inside the second processing surface 2 and adjacent to the second processing surface 2. . Hereinafter, the pressure receiving surface 23 is also referred to as a separation adjusting surface 23. As shown in the figure, the separation adjusting surface 23 is an inclined surface.
As described above, the ring holder 41 is formed at the bottom or lower part of the second holder 21, and the second processing member 20 is received in the ring holder 41. Further, although not shown, the second processing unit 20 is received so as not to rotate with respect to the second holder 21 by being prevented from rotating. The second processing surface 2 is exposed from the second holder 21.
In this embodiment, the inside of the first processing part 10 and the second processing part 20 between the processing surfaces 1 and 2 is an inflow part of the object to be processed, and the first processing part 10 and the second processing part 20 The outside of the processing portion 20 is an outflow portion of the object to be processed.

The contact surface pressure applying mechanism 4 presses the second processing surface 2 close to the first processing surface 1, and both processing surfaces such as the contact surface pressure and the fluid pressure are used. A thin film fluid having a thickness equal to or smaller than the distance between the processing surfaces 1 and 2 is formed by the balance with the force separating the two. In other words, the distance between the processing surfaces 1 and 2 is kept at a minute distance by the balance of the forces.
Specifically, in this embodiment, the contact surface pressure imparting mechanism 4 includes the ring accommodating portion 41 and the ridge receiving portion 42 provided in the back of the ring accommodating portion 41, that is, at the deepest portion of the ring accommodating portion 41. And a spring 43 and an air introduction portion 44.
However, the contact surface pressure imparting mechanism 4 only needs to include at least one of the ring accommodating portion 41, the sway receiving portion 42, the spring 43, and the air introducing portion 44.

The ring accommodating portion 41 loosely fits the second processing portion 20 so that the position of the second processing portion 20 in the ring accommodating portion 41 can be displaced deeply or shallowly, that is, vertically. .
One end of the spring 43 is in contact with the back of the sway receiving portion 42, and the other end of the spring 43 is in contact with the front portion, that is, the upper portion of the second processing portion 20 in the ring housing portion 41. Although only one spring 43 appears in FIG. 1, it is preferable that the plurality of springs 43 press each part of the second processing unit 20. That is, by increasing the number of springs 43, a more uniform pressing force can be applied to the second processing unit 20. Accordingly, the second holder 21 is preferably a multi-type in which several to several tens of springs 43 are attached.

In this embodiment, the air introduction part 44 can introduce air into the ring housing part 41 from others. By introducing such air, the space between the ring accommodating portion 41 and the second processing portion 20 can be used as a pressurizing chamber, and the air pressure can be given to the second processing portion 20 together with the spring 43 as a pressing force. Therefore, it is possible to adjust the contact pressure of the second processing surface 2 with respect to the first processing surface 1 during operation by adjusting the air pressure introduced from the air introducing portion 44. It is also possible to use a mechanism that generates a pressing force with another fluid pressure such as a hydraulic pressure instead of the air introduction portion 44 that uses the air pressure.
The contact surface pressure application mechanism 4 supplies and adjusts a part of the pressing force, that is, the contact surface pressure, and also serves as a displacement adjustment mechanism and a buffer mechanism.
Specifically, the contact surface pressure imparting mechanism 4 is a displacement adjusting mechanism, and can follow the axial displacement due to axial extension or wear during start-up or operation by adjusting the air pressure, and can maintain the initial pressing force. . Further, as described above, the contact surface pressure imparting mechanism 4 also functions as a buffer mechanism for fine vibration and rotational alignment by adopting a floating mechanism that holds the second processing portion 20 so as to be displaceable.

Next, the state of use of the processing apparatus having the above configuration will be described with reference to FIG.
First, the first fluid to be processed is introduced from the first introduction part d1 into the internal space of the sealed case under pressure supplied from the fluid pressure imparting mechanism p1. On the other hand, the first processing unit 10 is rotated by the rotation of the rotating shaft 50 by the rotation driving unit. Thereby, the 1st processing surface 1 and the 2nd processing surface 2 rotate relatively in the state where a minute interval was maintained.
The first fluid to be processed becomes a thin film fluid between the processing surfaces 1 and 2 at a minute interval, and the second fluid to be processed introduced from the second introduction part d2 is the both processing surfaces 1. , 2 merge with the thin film fluid to form a part of the thin film fluid. By this merging, the first and second fluids to be treated are mixed to form a product. In the case where a reaction is involved, both fluids react to promote a uniform reaction and form a reaction product. This makes it possible to produce relatively uniform and fine particles in the case of precipitation, and even in the case of no precipitation, a uniform mixed state (a uniform reaction in the case of reaction). ) Is realized. The precipitated product may be further refined by being sheared with the second processing surface 2 by the rotation of the first processing surface 1. Here, the first processing surface 1 and the second processing surface 2 are adjusted to a minute interval of 1 μm to 1 mm, particularly 1 μm to 10 μm, so that a uniform mixed state (in the case where there is a reaction) (Uniform reaction) and ultrafine particles of several nanometers can be generated.
The product exits between the processing surfaces 1 and 2 and is discharged from the case 3 through the discharge port 32 to the outside of the case. The discharged product is atomized in a vacuum or depressurized atmosphere with a known decompression device, and the product that has fallen as a fluid by hitting the other in the atmosphere is recovered as a liquid after degassing can do.
In this embodiment, the processing apparatus includes the case 3. However, the processing apparatus can be implemented without providing the case 3. For example, a depressurization tank, that is, a vacuum tank for degassing may be provided, and a processing apparatus may be disposed inside the tank. In that case, naturally, the above-described discharge port is not provided in the processing apparatus.

As described above, the first processing surface 1 and the second processing surface 2 can be adjusted to a minute interval of μm, which is impossible by setting mechanical clearance. Next, a description will be given.
The first processing surface 1 and the second processing surface 2 are relatively close to and away from each other, and rotate relatively. In this example, the first processing surface 1 rotates and the second processing surface 2 approaches and separates from the first processing surface 1 with a structure (floating structure) that can move in the axial direction.
Therefore, in this example, the axial position of the second processing surface 2 is set with an accuracy of the unit of μm by the force, that is, the balance between the contact surface pressure and the separation force described above. A minute interval between the two is set.

As shown in FIG. 12A, examples of the contact pressure include the pressure when air pressure, that is, positive pressure is applied from the air introduction portion 44 in the contact pressure application mechanism 4, and the pressing force of the spring 43. .
In addition, in embodiment shown to FIGS. 12-15, in order to avoid the complexity of drawing, the 2nd introduction part d2 is abbreviate | omitted and drawn. This point may be considered as a cross section at a position where the second introduction part d2 is not provided. In the drawing, U indicates the upper side, and S indicates the lower side.
On the other hand, as the separation force, the fluid pressure acting on the separation-side pressure receiving surface, that is, the second processing surface 2 and the separation adjusting surface 23, the centrifugal force due to the rotation of the first processing unit 10, and the air introduction unit 44. The negative pressure when a negative pressure is applied to can be mentioned.
When cleaning the apparatus, by increasing the negative pressure applied to the air introduction portion 44, the processing surfaces 1 and 2 can be separated greatly, and cleaning can be performed easily.
Then, due to the balance between these forces, the second processing surface 2 is stabilized at a position spaced apart from the first processing surface 1 by a minute distance, so that setting with an accuracy of μm is realized.

The separation force will be described in more detail.
First, regarding the fluid pressure, the second processing unit 20 in the sealed flow path receives the feeding pressure of the fluid to be processed, that is, the fluid pressure, from the fluid pressure applying mechanism p1. At that time, the surface facing the first processing surface in the flow path, that is, the second processing surface 2 and the separation adjusting surface 23 become the pressure receiving surface on the separation side, and fluid pressure acts on the pressure receiving surface to A separation force due to pressure is generated.
Next, with regard to centrifugal force, when the first processing unit 10 rotates at high speed, centrifugal force acts on the fluid, and a part of this centrifugal force acts in the direction of moving the processing surfaces 1 and 2 away from each other. It becomes power.
Furthermore, when a negative pressure is applied from the air introduction part 44 to the second processing part 20, the negative pressure acts as a separation force.
As described above, in the description of the present application, the force that separates the first and second processing surfaces 1 and 2 from each other is described as the separation force, and the above-described force is not excluded from the separation force.

  As described above, in the sealed flow path of the fluid to be processed, the separation force and the contact surface pressure exerted by the contact surface pressure applying mechanism 4 are balanced through the fluid to be processed between the processing surfaces 1 and 2. By forming this state, a uniform mixed state is realized between the processing surfaces 1 and 2, and when a reaction is involved, a uniform reaction is achieved, and a fine product is crystallized. Form a thin film fluid suitable for performing the deposition. In this way, this apparatus forcibly passes the thin film fluid between the processing surfaces 1 and 2, thereby reducing a minute interval that was impossible with a conventional mechanical device. In this way, it was possible to maintain the fine particles as a product with high accuracy.

In other words, the thickness of the thin film fluid between the processing surfaces 1 and 2 is adjusted to a desired thickness by adjusting the above-mentioned separation force and contact surface pressure, and the required uniform mixed state (in the case involving reaction). Can achieve a uniform reaction) and can produce fine products. Therefore, when trying to reduce the thickness of the thin film fluid, the contact surface pressure or the separation force may be adjusted so that the contact surface pressure is relatively increased with respect to the separation force. If it is going to do, what is necessary is just to adjust a separation force or a contact surface pressure so that a separation force may become large relatively with respect to a contact surface pressure.
When increasing the contact surface pressure, the contact surface pressure applying mechanism 4 may apply air pressure, that is, positive pressure from the air introduction portion 44, or the spring 43 may be changed to one having a large pressing force or the number thereof may be increased. .
When the separation force is increased, the feeding pressure of the fluid pressure imparting mechanism p1 is increased, or the areas of the second processing surface 2 and the separation adjusting surface 23 are increased, and in addition to this, the first processing unit 10 It is only necessary to increase the centrifugal force by adjusting the rotation of the air or to reduce the pressure from the air introduction portion 44. Alternatively, negative pressure may be applied. The spring 43 is a pushing ridge that generates a pressing force in the extending direction, but may be a part or all of the configuration of the contact surface pressure imparting mechanism 4 as a pulling ridge that generates a force in the contracting direction.
When the separation force is decreased, the feeding pressure of the fluid pressure imparting mechanism p1 is decreased, or the areas of the second processing surface 2 and the separation adjusting surface 23 are decreased, and in addition to this, the first processing unit 10 The centrifugal force may be reduced by adjusting the rotation of the air or the pressure from the air introduction part 44 may be increased. Alternatively, the negative pressure may be reduced.

  Furthermore, in addition to the above, the properties of the fluid to be treated such as viscosity can be added as an element for increasing and decreasing the contact surface pressure and the separation force. As an adjustment of

Of the separation force, the fluid pressure acting on the separation-side pressure receiving surface, that is, the second processing surface 2 and the separation adjustment surface 23 is understood as a force constituting an opening force in the mechanical seal.
In the mechanical seal, the second processing unit 20 corresponds to a compression ring. However, when fluid pressure is applied to the second processing unit 20, the second processing unit 20 is treated as the first processing unit. When a force separating from the application portion 10 is applied, this force is used as an opening force.
More specifically, as in the first embodiment, when the second processing portion 20 is provided with only the pressure-receiving surface on the separation side, that is, the second processing surface 2 and the separation adjustment surface 23. All of the infeed pressure constitutes the opening force. In addition, when the pressure receiving surface is provided also in the back side of the 2nd process part 20, in the case of FIG. 12 (B) and FIG. 17 mentioned later, it is as separation force among sending pressure. The difference between what works and what works as contact pressure is the opening force.

Here, another embodiment of the second processing unit 20 will be described with reference to FIG.
As shown in FIG. 12 (B), the second processing portion 20 is exposed from the ring housing portion 41 and has an inner peripheral surface side facing the opposite side, that is, the upper side, of the second processing surface 2. An adjustment surface 24 is provided.
That is, in this embodiment, the contact surface pressure imparting mechanism 4 includes a ring housing portion 41, an air introduction portion 44 (not shown), and the approach adjustment surface 24. However, the contact surface pressure applying mechanism 4 includes at least one of the ring accommodating portion 41, the sway receiving portion 42, the spring 43, the air introducing portion 44, and the approach adjusting surface 24. If it is.

The approach adjustment surface 24 receives a pressure applied to the fluid to be processed and generates a force for moving the first processing surface 1 in the direction in which the second processing surface 2 is brought closer to the contact surface pressure applying mechanism 4. As part of this, it plays the role of the contact pressure supply side. On the other hand, the second processing surface 2 and the above-described separation adjusting surface 23 receive the pressure applied to the fluid to be processed and move the second processing surface 2 away from the first processing surface 1 in the direction of separating. And the role of the supply side for a part of the separation force.
The approach adjustment surface 24, the second processing surface 2 and the separation adjustment surface 23 are both pressure receiving surfaces that receive the pressure of the fluid to be processed, and the direction of the contact surface pressure is generated depending on the orientation thereof. It has a different effect of generating separation force.

The projection area A1 of the approach adjustment surface 24 projected onto the virtual plane orthogonal to the approaching / separating direction of the processing surface, that is, the direction of appearance of the second ring 20, and the second processing unit projected onto the virtual plane The area ratio A1 / A2 of the total area A2 of the projected areas of the 20 second processing surface 2 and the separation adjusting surface 23 is called a balance ratio K and is important for adjusting the opening force.
The tip of the approach adjustment surface 24 and the tip of the separation adjustment surface 23 are both defined by the inner peripheral surface 25 of the annular second processing portion 20, that is, the tip line L <b> 1. For this reason, the balance ratio K is adjusted by determining where to place the base line L2 of the adjustment surface 24 for approach.
That is, in this embodiment, when the pressure of the fluid to be processed is used as the opening force, the total projected area of the second processing surface 2 and the separation adjusting surface 23 is determined by the approach adjusting surface 24. By setting it to be larger than the projected area, an opening force corresponding to the area ratio can be generated.

The opening force can be adjusted by the pressure of the fluid to be treated, that is, the fluid pressure, by changing the balance line, that is, the area A1 of the approach adjustment surface 24.
The sliding surface actual surface pressure P, that is, the contact surface pressure due to the fluid pressure is calculated by the following equation.
P = P1 × (K−k) + Ps
Here, P1 represents the pressure of the fluid to be treated, that is, the fluid pressure, K represents the balance ratio, k represents the opening force coefficient, and Ps represents the spring and back pressure.
By adjusting the actual surface pressure P of the sliding surface by adjusting the balance line, a fluid film is formed by the fluid to be processed with a desired minute gap between the processing surfaces 1 and 2, and the product is made fine. Further, uniform mixing (reaction) processing is performed.

Usually, if the thickness of the thin film fluid between the processing surfaces 1 and 2 is reduced, the product can be made finer. On the contrary, if the thickness of the thin film fluid is increased, the processing becomes rough and the processing amount per unit time increases. Therefore, by adjusting the sliding surface actual surface pressure P, the gap between the processing surfaces 1 and 2 is adjusted to obtain a desired uniform mixed state (a uniform reaction in the case where a reaction is involved). A fine product can be obtained while being realized. Hereinafter, the actual sliding surface pressure P is referred to as a surface pressure P.
To summarize this relationship, when the product is roughened, the balance ratio is reduced, the surface pressure P is reduced, the gap is increased, and the thickness is increased. On the contrary, when the product is made finer, the balance ratio K is increased, the surface pressure P is increased, the gap is decreased, and the thickness is decreased.
As described above, the approach adjustment surface 24 is formed as a part of the contact surface pressure applying mechanism 4, and the contact surface pressure is adjusted at the position of the balance line, that is, the gap between the processing surfaces is adjusted. Can also be implemented.

As described above, the clearance is adjusted in consideration of the pressing force of the spring 43 and the air pressure of the air introduction portion 44 as described above. In addition, adjustment of the fluid pressure, that is, the feed pressure of the fluid to be processed, and the adjustment of the rotation of the first processing unit 10, that is, the first holder 11, which is an adjustment of the centrifugal force, are also important adjustment factors.
As described above, this apparatus uses the second processing unit 20 and the first processing unit 10 that rotates relative to the second processing unit 20 to feed the fluid to be processed and the rotational centrifugal force, The pressure balance is achieved by the contact surface pressure, and a thin film fluid is formed on both processing surfaces. Also, at least one of the rings has a floating structure to absorb alignment such as runout and eliminate the risk of wear due to contact.

Also in the embodiment of FIG. 12B, the configuration other than the provision of the adjustment surface is the same as that of the embodiment shown in FIG.
Further, in the embodiment shown in FIG. 12B, as shown in FIG. 17, it is possible to carry out without providing the separation adjusting surface 23 described above.
When the approach adjusting surface 24 is provided as in the embodiment shown in FIG. 12B or FIG. 17, the opening force is set by making the area A1 of the approach adjusting surface 24 larger than the area A2. On the contrary, all the pressure applied to the fluid to be treated works as a contact pressure. Such a setting is also possible. In this case, both processing surfaces 1 and 2 can be balanced by increasing other separation force.
With the above area ratio, the force that acts in the direction of separating the second processing surface 2 from the first processing surface 1 is determined as the resultant force of the force received from the fluid to be processed.

In the above embodiment, as described above, the spring 43 is preferably attached in a larger number in order to apply a uniform stress to the sliding surface, that is, the processing surface. However, as the spring 43, as shown in FIG. 13, a single coil spring can be adopted. As shown in the figure, this is a single coil spring whose center is concentric with the annular second processing portion 20.
The space between the second processing unit 20 and the second holder 21 is sealed so as to be airtight, and well-known means can be employed for the seal.

As shown in FIG. 14, the second holder 21 is provided with a temperature adjustment jacket 46 capable of adjusting the temperature of the second processing unit 20 by cooling or heating. Moreover, 3 of FIG. 14 has shown the above-mentioned case, This case 3 is also provided with the temperature-adjusting jacket 35 for the same purpose.
The temperature adjustment jacket 46 of the second holder 21 is a water space formed in the side surface of the ring housing portion 41 in the second holder 21, and passages 47 and 48 that communicate with the outside of the second holder 21. I'm in touch. Either one of the passages 47 and 48 introduces a cooling or heating medium into the temperature adjusting jacket 46, and either one discharges the medium.
Further, the temperature adjusting jacket 35 of the case 3 allows heating water or cooling water provided between the outer peripheral surface of the case 3 and the covering portion 34 to pass through the covering portion 34 covering the outer periphery of the case 3. It is a passage.
In this embodiment, the second holder 21 and the case 3 are provided with the above-described temperature adjustment jacket. However, the first holder 11 can also be provided with such a jacket. is there.

In addition to the above, a cylinder mechanism 7 shown in FIG. 15 may be provided as a part of the contact surface pressure applying mechanism 4.
The cylinder mechanism 7 includes a cylinder space portion 70 provided in the second holder 21, a communication portion 71 that connects the cylinder space portion 70 to the ring storage portion 41, and a communication portion 71 that is accommodated in the cylinder space portion 70. Through the piston body 72 connected to the second processing section 20, the first nozzle 73 communicating with the upper part of the cylinder space part 70, the second nozzle 74 communicating with the lower part of the cylinder space part 70, and the upper part of the cylinder space part 70 A pressing body 75 such as a ridge formed between the piston body 72 and the piston body 72 is provided.

The piston body 72 can slide up and down in the cylinder space 70, and the second processing portion 20 slides up and down by the sliding of the piston body 72, and the first processing surface 1. The gap between the second processing surface 2 can be changed.
Although not shown, specifically, a pressure source such as a compressor and the first nozzle 73 are connected, and air pressure, that is, positive pressure is applied from the first nozzle 73 to the piston body 72 in the cylinder space 70. The piston body 72 can be slid downward to narrow the gap between the first and second processing surfaces 1 and 2. Although not shown, a pressure source such as a compressor is connected to the second nozzle 74, and air pressure, that is, positive pressure is applied from the second nozzle 74 to the lower side of the piston body 72 in the cylinder space 70. 72 can be slid upward to move the second processing portion 20 to widen the gap between the first and second processing surfaces 1 and 2, that is, to move in the opening direction. Thus, the contact pressure can be adjusted by the air pressure obtained by the nozzles 73 and 74.

  Even if there is a margin between the upper part of the second processing unit 20 in the ring accommodating part 41 and the uppermost part of the ring accommodating part 41, the piston body 72 is set to abut on the uppermost part 70a of the cylinder space part 70. By doing so, the uppermost portion 70a of the cylinder space 70 defines the upper limit of the width of the gap between the processing surfaces 1 and 2. That is, the piston body 72 and the uppermost portion 70a of the cylinder space 70 serve as a separation restraining portion that restrains the separation of the processing surfaces 1 and 2, and in other words, the maximum gap between the processing surfaces 1 and 2 is maximum. It functions as a mechanism that regulates the opening amount.

Further, even if the processing surfaces 1 and 2 are not in contact with each other, by setting the piston body 72 to contact the lowermost portion 70b of the cylinder space portion 70, the lowermost portion 70b of the cylinder space portion 70 is The lower limit of the width of the gap between the processing surfaces 1 and 2 is defined. In other words, the piston body 7 and the lowermost portion 70b of the cylinder space 70 serve as an approach deterring part that deters the approach of the processing surfaces 1 and 2, and in other words, the minimum gap between the processing surfaces 1 and 2 is minimized. It functions as a mechanism that regulates the opening amount.
In this way, the gap z1 between the piston body 72 and the uppermost portion 70a of the cylinder space 70, in other words, between the piston body 72 and the lowermost portion 70b of the cylinder space 70, while restricting the maximum and minimum opening amounts of the gap. The interval z2 is adjusted by the air pressure of the nozzles 73 and 74.

The nozzles 73 and 74 may be connected to separate pressure sources, or may be connected by switching or switching one pressure source.
The pressure source can be implemented by either a positive pressure supply or a negative pressure supply. When a negative pressure source such as a vacuum is connected to the nozzles 73 and 74, the above operation is reversed.
Such a cylinder mechanism 7 is provided in place of the other contact surface pressure application mechanism 4 or as a part of the contact surface pressure application mechanism 4 described above, and the nozzles 73 and 74 are provided to the nozzles 73 and 74 depending on the viscosity and properties of the fluid to be processed. The pressure of the pressure source to be connected and the interval z1 and z2 are set, the thickness of the thin film fluid is set to the desired value, and a shearing force is applied to achieve a uniform mixed state (a uniform reaction if a reaction is involved). Particles can be generated. In particular, with such a cylinder mechanism 7, the sliding part can be forcibly opened and closed during cleaning or steam sterilization to increase the reliability of cleaning and sterilization.

  As shown in FIGS. 16A to 16C, a groove extending on the first processing surface 1 of the first processing unit 10 from the center side of the first processing unit 10 to the outside, that is, in the radial direction. It may be carried out by forming a concave portion 13. In this case, as shown in FIG. 16 (A), the recesses 13... 13 can be implemented as curved or spirally extending on the first processing surface 1. As shown in the figure, the present invention can be carried out even if the individual concave portions 13 are bent in an L shape, and the concave portions 13 ... 13 extend straight radially as shown in FIG. 16 (C). Even if it is, it can be implemented.

Further, as shown in FIG. 16D, the recess 13 in FIGS. 16A to 16C is performed with a gradient so as to become deeper toward the center side of the first processing surface 1. Is preferred. Further, the groove-like recess 13 can be implemented even if it is continuous or intermittent.
By forming such a concave portion 13, there are effects such as a response to an increase in the discharge amount of the fluid to be processed or a decrease in the heat generation amount, a cavitation control, and a fluid bearing effect.
In each of the embodiments shown in FIG. 16 described above, the recess 13 is formed on the first processing surface 1, but can also be formed on the second processing surface 2. The present invention can also be implemented by forming both the first and second processing surfaces 1 and 2.

When the above-mentioned concave portion 13 or taper is not provided on the processing surface, or when these are unevenly distributed on a part of the processing surface, the influence of the surface roughness of the processing surfaces 1 and 2 on the fluid to be processed Is larger than that forming the recess 13. Therefore, in such a case, it is necessary to reduce the surface roughness, that is, to make the surface finer as the particles of the fluid to be processed become smaller. In particular, when the purpose is uniform mixing (reaction), the surface roughness of the processing surface should be the same as the above-described mirror surface, that is, the surface subjected to mirror finishing, in a uniform mixed state (in the case of reaction) Is a uniform reaction), and it is advantageous to realize crystallization / precipitation of a fine and monodisperse product in order to obtain fine particles.
Also in the embodiment shown in FIGS. 12 to 17, configurations other than those explicitly described are the same as those in the embodiment shown in FIG. 1A or FIG. 11C.

In each of the above embodiments, the inside of the case is all sealed. However, only the inside of the first processing unit 10 and the second processing unit 20 is sealed, and the outside is opened. It can also be implemented. That is, the flow path is sealed until it passes between the first processing surface 1 and the second processing surface 2, and the fluid to be processed receives all the pressure, but after passing, May be opened, and the treated fluid after treatment may not receive pressure.
As described above, the fluid pressure applying mechanism p1 is preferably implemented using a compressor as a pressurizing device, but other means may be used as long as it is possible to constantly apply pressure to the fluid to be treated. Can also be implemented. For example, the present invention can be carried out by applying a constant pressure to the fluid to be treated by utilizing its own weight.

To summarize the processing apparatus in each of the above embodiments, pressure is applied to the fluid to be processed, and the first processing surface 1 and the sealed fluid flow path through which the fluid to be processed that receives this pressure flows Connect at least two approachable / separable treatment surfaces of the second treatment surface 2, apply contact pressure to bring both treatment surfaces 1, 2 closer, and apply the first treatment surface 1 and the second treatment surface 2. By rotating the surface 2 relatively, a thin film fluid used for the seal in the mechanical seal is generated using the fluid to be processed, and contrary to the mechanical seal (instead of using the thin film fluid for the seal) ), The thin film fluid is intentionally leaked from between the first processing surface 1 and the second processing surface 2, and the processing of mixing (reaction) is made into a film between the processing surfaces 1 and 2. Realized and recovered between fluids .
By such an epoch-making method, it was possible to adjust the distance between the processing surfaces 1 and 2 to be 1 μm to 1 mm, particularly 1 to 10 μm.

In the above embodiment, the inside of the apparatus constitutes a sealed flow path of the fluid to be processed, and the fluid pressure imparting mechanism p1 provided on the introduction portion side (of the first fluid to be processed) of the processing apparatus. The fluid to be treated was pressurized.
In addition, pressurization using such a fluid pressure applying mechanism p1 is not possible, and the flow path of the fluid to be processed can be opened even if it is open.
18 to 20 show an embodiment of such a processing apparatus. In this embodiment, as the processing apparatus, an apparatus having a function of removing a liquid from a generated product and finally securing only a target solid (crystal) is illustrated.
18A is a schematic longitudinal sectional view of the processing apparatus, and FIG. 18B is a partially cutaway enlarged sectional view thereof. FIG. 19 is a plan view of the first processing unit 101 provided in the processing apparatus shown in FIG. FIG. 20 is a schematic vertical cross-sectional view of a part of the first and second processing parts 101 and 102 of the processing apparatus, partly cut away.

The apparatus shown in FIGS. 18 to 20 is, as described above, charged with a fluid to be processed, that is, a fluid to be processed or a fluid for conveying such a target to be processed under atmospheric pressure. .
In FIG. 18B and FIG. 20, the second introduction portion d2 is omitted and drawn (to be considered as a cross section at a position where the second introduction portion d2 is not provided) in order to avoid complication of the drawings. ).
As shown in FIG. 18A, the fluid processing apparatus includes a mixing apparatus G and a decompression pump Q. The mixing apparatus G includes a first processing unit 101 that is a rotating member, a first holder 111 that holds the processing unit 101, and a second processing unit 102 that is a member fixed to the case. The first processing unit 101 is moved together with the second holder 121 to which the second processing unit 102 is fixed, the urging mechanism 103, the dynamic pressure generation mechanism 104 (FIG. 19A), and the first holder 111. A drive unit that rotates, a housing 106, a first introduction part d1 that supplies (inputs) the first fluid to be processed, and a discharge unit 108 that discharges the fluid to be processed to the decompression pump Q are provided. The illustration of the drive unit is omitted.

Each of the first processing unit 101 and the second processing unit 102 is an annular body that is formed by hollowing out the center of a cylinder. Both the processing parts 101 and 102 are members having the processing surfaces 110 and 120 as one bottom surface of a cylinder which each of the processing parts 101 and 102 exhibits.
The processing surfaces 110 and 120 have flat portions that are mirror-polished. In this embodiment, the processing surface 120 of the second processing unit 102 is a flat surface in which the entire surface is mirror-polished. Further, the processing surface 110 of the first processing unit 101 is entirely flat as in the second processing unit 102, but a plurality of grooves are formed in the flat surface as shown in FIG. 112 ... 112. The grooves 112... 112 extend radially in the outer circumferential direction of the cylinder with the center of the cylinder presented by the first processing unit 101 as the center side.
In the mirror polishing of the processing surfaces 110 and 120 of the first and second processing portions 101 and 102, the surface roughness Ra is preferably set to 0.01 to 1.0 μm. For this mirror polishing, Ra is more preferably 0.03 to 0.3 μm.
As the material of the processing parts 101 and 102, a hard material that can be mirror-polished is adopted. The hardness of the processing parts 101 and 102 is preferably at least 1500 Vickers hardness. Moreover, it is preferable to employ a material having a small linear expansion coefficient or a material having high thermal conductivity. This is because if the difference in the expansion coefficient between the portion that generates heat and other portions in the process is large, distortion occurs, which affects the securing of an appropriate clearance.
As the material of such processing parts 101, 102, in particular, SIC, that is, silicon carbide having a Vickers hardness of 2000-2500, and DLC, that is, diamond-like carbon, having a Vickers hardness of 3000-4000, are coated. SIC, WC, tungsten carbide with Vickers hardness of 1800, WC with DLC coating on the surface, boron-based ceramics represented by ZrB ₂ and BTC, B ₄ C with Vickers hardness of 4000-5000 It is preferable to employ one.

The housing 106 shown in FIG. 18 is a bottomed cylindrical body, although the illustration of the bottom is omitted, and the upper part is covered with the second holder 121. The second holder 121 has the second processing portion 102 fixed to the lower surface thereof, and the introduction portion d1 provided above. The introduction part d1 includes a hopper 170 for introducing a fluid to be processed and an object to be processed from the outside.
Although not shown, the drive unit includes a power source such as an electric motor and a shaft 50 that rotates upon receiving power from the power source.
As shown in FIG. 18A, the shaft 50 is arranged inside the housing 106 and extends vertically. The first holder 111 is provided at the upper end of the shaft 50. The first holder 111 holds the first processing unit 101, and is provided on the shaft 50 as described above so that the processing surface 110 of the first processing unit 101 is processed by the second processing unit 102. It corresponds to the work surface 120.

The first holder 111 is a cylindrical body, and the first processing portion 101 is fixed at the center of the upper surface. The first processing unit 101 is fixed so as to be integrated with the first holder 111 and does not change its position with respect to the first holder 111.
On the other hand, a receiving recess 124 for receiving the second processing portion 102 is formed in the center of the upper surface of the second holder 121.
The receiving recess 124 has an annular cross section. The second processing portion 102 is accommodated in the cylindrical receiving recess 124 so as to be concentric with the receiving recess 124.
The structure of the receiving recess 124 is the same as that of the embodiment shown in FIG. 1A (the first processing portion 101 is the first ring 10, the first holder 111 is the first holder 11, and the second processing is the second processing portion. The part 102 corresponds to the second ring 20 and the second holder 121 corresponds to the second holder 21).

  The second holder 121 includes the urging mechanism 103 described above. The urging mechanism 103 preferably uses an elastic body such as a spring. The urging mechanism 103 corresponds to the contact surface pressure applying mechanism 4 in FIG. 1A and adopts the same configuration. That is, the urging mechanism 103 presses the surface opposite to the processing surface 120 of the second processing portion 102, that is, the bottom surface, and positions each position of the second processing portion 102 on the first processing portion 101 side, that is, below. Energize evenly.

On the other hand, the inner diameter of the receiving recess 124 is larger than the outer diameter of the second processing portion 102, so that when arranged concentrically as described above, the outer peripheral surface 102 b of the second processing portion 102 and the receiving recess 124. As shown in FIG. 18 (B), a gap t1 is set between the inner circumferential surface and the inner circumferential surface.
Similarly, a gap t2 is set between the inner peripheral surface 102a of the second processing portion 102 and the outer peripheral surface of the central portion 22 of the receiving recess 124 as shown in FIG.
Each of the gaps t1 and t2 is for absorbing vibrations and eccentric behavior, and is set to a size that can ensure the operating dimension or more and can be sealed. For example, when the diameter of the first processing unit 101 is 100 mm to 400 mm, each of the gaps t1 and t2 is preferably 0.05 to 0.3 mm.
The first holder 111 is integrally fixed to the shaft 50 and rotates together with the shaft 50. Although not shown, the second processing unit 102 does not rotate relative to the second holder 121 due to the rotation stop. However, in order to secure a clearance of 0.1 to 10 μm necessary for processing between the processing surfaces 110 and 120, that is, a minute interval t shown in FIG. 20B, as shown in FIG. A gap t3 is provided between the bottom surface of the receiving recess 124, that is, the top portion, and the top portion 124a of the second processing portion 102, that is, the top surface. The gap t3 is set in consideration of the deflection and elongation of the shaft 50 together with the clearance.

As described above, by setting the gaps t1 to t3, the second processing unit 102 is variable in the direction z1 approaching / separating from the first processing unit 101 as shown in FIG. 18B. In addition, the inclination direction z2 of the processing surface 120 is variable.
That is, in this embodiment, the urging mechanism 103 and the gaps t1 to t3 constitute a floating mechanism, and at least the center and the inclination of the second processing unit 102 are several μm to several μm. A slight amount of about mm is variable. As a result, the runout and shaft expansion of the rotating shaft, the surface runout and vibration of the first processing unit 101 are absorbed.

The groove 112 provided in the processing surface 110 of the first processing unit 101 will be described in more detail. The rear end of the groove 112 reaches the inner peripheral surface 101a of the first processing part 101, and the front end extends toward the outside y of the first processing part 101, that is, the outer peripheral surface side. As shown in FIG. 19A, the groove 112 has a cross-sectional area from the center x side of the annular first processing portion 101 toward the outer side y of the first processing portion 101, that is, the outer peripheral surface side. It is supposed to gradually decrease.
The distance w1 between the left and right side surfaces 112a and 112b of the groove 112 decreases from the center x side of the first processing unit 101 toward the outer side y of the first processing unit 101, that is, the outer peripheral surface side. Further, as shown in FIG. 19B, the depth w2 of the groove 112 decreases from the center x side of the first processing portion 101 toward the outside y of the first processing portion 101, that is, the outer peripheral surface side. Become. That is, the bottom 112c of the groove 112 becomes shallower from the center x side of the first processing portion 101 toward the outer side y of the first processing portion 101, that is, the outer peripheral surface side.
As described above, the groove 112 gradually decreases in both the width and the depth toward the outer side y, assuming that both the width and the depth gradually decrease toward the outer side y, that is, the outer peripheral surface side. And the front-end | tip, ie, y side of the groove | channel 112 is a dead end. That is, the tip of the groove 112, that is, the y side does not reach the outer peripheral surface 101b of the first processing portion 101, and the outer flat surface 113 is interposed between the tip of the groove 112 and the outer peripheral surface 101b. The outer flat surface 113 is a part of the processing surface 110.

In the embodiment shown in FIG. 19, the left and right side surfaces 112a and 112b and the bottom 112c of such a groove 112 constitute a flow path restricting portion. The flow path restricting portion, the flat portion around the groove 112 of the first processing portion 101, and the flat portion of the second processing portion 102 constitute a dynamic pressure generating mechanism 104.
However, only one of the width and the depth of the groove 112 may reduce the cross-sectional area by adopting the above configuration.
The dynamic pressure generating mechanism 104 has a desired fluid flow between the processing units 101 and 102 by the fluid to be processed that tends to pass between the processing units 101 and 102 when the first processing unit 101 rotates. A force acting in the direction of separating both processing parts 101 and 102 that makes it possible to secure a minute interval is generated. By generating such a dynamic pressure, a minute interval of 0.1 to 10 μm can be generated between the processing surfaces 110 and 120. Such a minute interval may be adjusted and selected according to the object of processing, but is preferably 1 to 6 μm, and more preferably 1 to 2 μm. In this apparatus, it is possible to realize an unprecedented uniform mixing state (a uniform reaction in the case where a reaction is involved) and generation of fine particles by the above-mentioned minute intervals.

Each of the grooves 112... 112 can be implemented even if it extends straight from the center x side to the outer side y. However, in this embodiment, as shown in FIG. 19A, the center x side of the groove 112 precedes the outer side y of the groove 112 with respect to the rotation direction r of the first processing portion 101. The groove 112 is curved and extends so as to be positioned forward.
Thus, the grooves 112... 112 are curved and extended, so that the separation force can be generated more effectively by the dynamic pressure generation mechanism 104.

Next, the operation of this apparatus will be described.
As shown in FIG. 18 (A), the first fluid R to be processed that is introduced from the hopper 170 and passes through the first introduction part d1 passes through the hollow part of the annular second processing part 102 and passes through the first part R1. The processing surface 110 of the first processing unit 101 and the processing surface 120 of the second processing unit 102 that enter and rotate between the processing units 101 and 102 under the centrifugal force due to the rotation of the processing unit 101 and the processing surface 120 of the second processing unit 102 In the meantime, uniform mixing (reaction) and, in some cases, generation of fine particles are performed, and after that, it goes out of both processing parts 101 and 102 and is discharged from the discharge part 108 to the decompression pump Q side. (Hereinafter, the first treated fluid R is simply referred to as a fluid R as necessary).
In the above description, the fluid R that has entered the hollow portion of the annular second processing portion 102 first enters the groove 112 of the rotating first processing portion 101 as shown in FIG. On the other hand, both the processing surfaces 110 and 120 that are mirror-polished and are flat portions are kept airtight even through a gas such as air or nitrogen. Accordingly, even if the centrifugal force due to the rotation is received, the fluid R cannot enter from the groove 112 between the processing surfaces 110 and 120 pressed together by the urging mechanism 103. However, the fluid R gradually strikes the side surfaces 112a and 112b and the bottom 112c of the groove 112 formed as the flow path restricting portion, and generates a dynamic pressure that works in a direction that separates both the processing surfaces 110 and 120. As shown in FIG. 20B, this allows the fluid R to ooze out from the groove 112 to the flat surface, and to secure a minute interval t, that is, clearance between the processing surfaces 110 and 120. Then, uniform mixing (reaction) and, if necessary, generation of fine particles are performed between such mirror-polished flat surfaces. In addition, the above-described curvature of the groove 112 causes the centrifugal force to act on the fluid R more reliably, thereby making the generation of the dynamic pressure more effective.
As described above, this fluid processing apparatus ensures a fine and uniform interval, that is, clearance, between both mirror surfaces, that is, the processing surfaces 110 and 120, by balancing the dynamic pressure and the urging force by the urging mechanism 103. It was possible. And by said structure, the said micro space | interval can be made into the ultra fine thing of 1 micrometer or less.
Further, the adoption of the floating mechanism enables automatic adjustment of the alignment between the processing surfaces 110 and 120, and each physical relationship between the processing surfaces 110 and 120 against physical deformation of each part due to rotation or generated heat. The variation in the clearance at the position is suppressed, and the above-mentioned minute interval can be maintained at each position.

  In the above embodiment, the floating mechanism is a mechanism provided only in the second holder 121. In addition, instead of the second holder 121 or together with the second holder 121, a floating mechanism can be provided also in the first holder 111.

FIGS. 21 to 23 show other embodiments of the groove 112 described above.
As shown in FIGS. 21A and 21B, the groove 112 can be implemented as having a flat wall surface 112d at the tip as a part of the flow path restricting portion. Further, in the embodiment shown in FIG. 21, a step 112e is provided between the first wall surface 112d and the inner peripheral surface 101a in the bottom 112c, and this step 112e also forms a part of the flow path restricting portion. Constitute.
As shown in FIGS. 22A and 22B, the groove 112 includes a plurality of branch portions 112f... 112f that branch into a plurality of portions, and each branch portion 112f includes a flow path restriction portion by narrowing the width thereof. It can also be implemented.
In the embodiments of FIGS. 21 and 22 as well, configurations other than those specifically shown are the same as those of the embodiments shown in FIGS. 1 (A), 11 (C), and 18 to 20.

Further, in each of the above-described embodiments, the flow path restriction is achieved by gradually reducing the size of at least one of the width and the depth of the groove 112 from the inside to the outside of the first processing portion 101. The part was to be configured. In addition, as shown in FIGS. 23A and 23B, by providing the end surface 112f in the groove 112 without changing the width and depth of the groove 112, the end surface of such a groove 112 is provided. 112f can be used as a flow path restriction unit. As shown in the embodiment shown in FIG. 19, FIG. 21, and FIG. 22, the generation of dynamic pressure is achieved by changing the width and depth of the groove 112 as described above so that the bottom and both side surfaces of the groove 112 are inclined surfaces. By doing so, this inclined surface became a pressure receiving portion for the fluid to be treated, and dynamic pressure was generated. On the other hand, in the embodiment shown in FIGS. 23A and 23B, the end face of the groove 112 serves as a pressure receiving portion for the fluid to be processed, and generates dynamic pressure.
In addition, in the case shown in FIGS. 23A and 23B, it is possible to gradually reduce at least one of the width and the depth of the groove 112 at the same time.
Note that the configuration of the groove 112 is not limited to that shown in FIGS. 19 and 21 to 23 described above, and the groove 112 can be implemented as having a channel restricting portion of another shape.
For example, in the case shown in FIGS. 19 and 21 to 23, the groove 112 does not penetrate to the outside of the first processing portion 101. That is, the outer flat surface 113 exists between the outer peripheral surface of the first processing unit 101 and the groove 112. However, the present invention is not limited to such an embodiment, and the groove 112 reaches the outer peripheral surface side of the first processing portion 101 as long as the above-described dynamic pressure can be generated. However, it can be implemented.
For example, in the case of the first processing portion 101 shown in FIG. 23B, as shown by a dotted line, a portion having a smaller cross-sectional area than other portions of the groove 112 is formed on the outer flat surface 113. Can do.
Further, the groove 112 is formed so that the cross-sectional area gradually decreases from the inside to the outside as described above, and the portion (terminal) of the groove 112 reaching the outer periphery of the first processing portion 101 has the largest cross-sectional area. It may be small (not shown). However, in order to effectively generate the dynamic pressure, it is preferable that the groove 112 does not penetrate to the outer peripheral surface side of the first processing portion 101 as shown in FIGS. 19 and 21 to 23.

Here, the embodiments shown in FIGS. 18 to 23 will be summarized.
In this fluid processing apparatus, the rotating member having the flat processing surface and the fixing member having the flat processing surface are concentrically opposed to each other by the flat processing surface, and the opening of the fixing member is rotated under the rotation of the rotating member. Instead of mechanically adjusting the clearance in the fluid processing device that processes between the opposing flat processing surfaces of both members while supplying the raw material to be processed from the head, a pressure increasing mechanism is provided on the rotating member to generate the pressure. Can maintain a clearance and can achieve a fine clearance of 1 to 6 μm, which was impossible with mechanical clearance adjustment, and can greatly improve the ability to homogenize mixing (reaction) and, in some cases, refine the generated particles. It is a thing.
That is, in this fluid processing apparatus, the rotating member and the fixed member have a flat processing surface on the outer periphery thereof, and the flat processing surface has a sealing function on the surface, so that it is hydrostatic, that is, hydrostatic. It is an object of the present invention to provide a high-speed rotation type fluid processing apparatus that generates a large force, a hydrodynamic or hydrodynamic force, or an aerostatic-aerodynamic force. The above force can generate a slight gap between the sealing surfaces, and can provide a fluid processing apparatus that is non-contact, mechanically safe, and has a function of highly uniform mixing (reaction). One of the factors that may cause this slight gap is the rotational speed of the rotating member, and the other is the pressure difference between the input side and the discharge side of the object to be processed (fluid to be processed). It is. When there is no pressure application mechanism on the input side, that is, when an object to be processed (processed fluid) is input under atmospheric pressure, there is no pressure difference, so only the rotational speed of the rotating member is sufficient Need to be separated. This is known as hydrodynamic or aerodynamic force.

In the apparatus shown in FIG. 18A, the decompression pump Q is connected to the discharge part of the mixing apparatus G. However, as described above, the housing 106 is not provided, and the decompression pump Q is not provided. As shown in FIG. 24A, the processing apparatus can be a tank T for pressure reduction, and the mixing apparatus G can be disposed in the tank T.
In this case, by depressurizing the inside of the tank T to a vacuum or a state close to a vacuum, the object to be processed generated by the mixing device G is sprayed into the tank T in a mist state, and hits the inner wall of the tank T and flows down. Collecting the object to be processed, or recovering the object to be processed that has fallen into the tank T and separated as a gas (steam) to obtain the target object after processing. it can.
In the case of using the decompression pump Q, as shown in FIG. 24 (B), by connecting an airtight tank T to the mixing device G via the decompression pump Q, the processing is performed in the tank T. The object to be processed can be separated and extracted by making the subsequent object to be processed into a mist.
Further, as shown in FIG. 24 (C), the decompression pump Q is directly connected to the tank T, and the decompression pump Q and a discharge part of the liquid R different from the decompression pump Q are connected to the tank T. The target product can be separated. In this case, the vaporizing part is sucked by the decompression pump Q, and the liquid R (liquid part) is discharged from the discharging part separately from the vaporizing part.

In each of the embodiments described above, the first and second fluids to be treated are introduced from the second holders 21 and 121 and the second rings 20 and 102, respectively, and mixed (reacted). Indicated.
Next, other embodiments relating to the introduction of the fluid to be processed into the apparatus will be described in order.

As shown in FIG. 1 (B), the processing apparatus shown in FIG. 1 (A) is provided with a third introduction part d3 to introduce a third fluid to be processed between the processing surfaces 1 and 2, Similar to the second treated fluid, the first treated fluid can be mixed (reacted).
The third introduction part d3 supplies the third processed fluid to be mixed with the first processed fluid between the processing surfaces 1 and 2. In this embodiment, the third introduction part d3 is a passage provided inside the second ring 20, one end of which opens at the second processing surface 2, and the other end of the third fluid supply part. p3 is connected.
A compressor and other pumps can be employed for the third fluid supply part p3.
The opening in the second processing surface 2 of the third introduction part d3 is located outside the center of rotation of the first processing surface 1 relative to the opening of the second introduction part d2. That is, in the second processing surface 2, the opening of the third introduction part d3 is located on the downstream side of the opening of the second introduction part d2. A gap is provided between the opening of the third introduction part d3 and the opening of the second introduction part d2 in the inner and outer directions of the diameter of the second ring 20.
The apparatus shown in FIG. 1 (B) is the same as the embodiment shown in FIG. 1 (A) except for the third introduction part d3. In FIG. 1B, and in FIGS. 1C, 1D, and 2 to 11, which will be described below, the case 3 is omitted in order to avoid complication of the drawing. In addition, in FIG. 9 (B) (C), FIG. 10, FIG. 11 (A) (B), a part of case 3 is drawn.

Further, as shown in FIG. 1 (C), the processing apparatus shown in FIG. 1 (B) is provided with a fourth introduction part d4 to introduce the fourth fluid to be processed between the processing surfaces 1 and 2. And it can implement also as what is mixed (reacted) to the 1st to-be-processed fluid like the 2nd and 3rd to-be-processed fluid.
The fourth introduction part d4 supplies the fourth processed fluid to be mixed with the first processed fluid between the processing surfaces 1 and 2. In this embodiment, the fourth introduction part d4 is a passage provided inside the second ring 20, one end of which opens at the second processing surface 2, and the other end has a fourth fluid supply part. p4 is connected.
A compressor and other pumps can be employed for the fourth fluid supply part p4.
The opening in the second processing surface 2 of the fourth introduction part d4 is located outside the center of rotation of the first processing surface 1 relative to the opening of the third introduction part d3. That is, in the second processing surface 2, the opening of the fourth introduction part d4 is located on the downstream side of the opening of the third introduction part d3.
About the apparatus shown to this FIG.1 (C), about structure other than the 4th introduction part d4, it is the same as that of embodiment shown to FIG.1 (B).
In addition, although not shown, it is also possible to provide five or more introduction parts such as a fifth introduction part and a sixth introduction part to mix (react) five or more kinds of fluids to be treated. Can be implemented.

Further, as shown in FIG. 1D, in the apparatus of FIG. 1A, instead of providing the first introduction part d1 provided in the second holder 21 in the second holder 21, the second introduction part d2 is provided. Similarly, it can be carried out by being provided inside the second ring 20. In this case, in the second processing surface 2, the opening of the first introduction part d1 is located closer to the center of rotation, that is, the upstream side than the second introduction part d2.
In the apparatus shown in FIG. 1D, the opening of the second introduction part d2 and the opening of the third introduction part d3 are both arranged on the second processing surface 2 of the second ring 20. there were. However, the opening of the introduction part is not limited to such an arrangement with respect to the processing surface. In particular, as shown in FIG. 2A, the opening of the second introduction part d2 may be provided at a position adjacent to the second processing surface 2 on the inner peripheral surface of the second ring 20. In the apparatus shown in FIG. 2A, the opening of the third introduction part d3 is arranged on the second processing surface 2 as in the apparatus shown in FIG. 1B, but the second introduction part d2 Thus, the second fluid to be treated is immediately introduced into the processing surface by disposing the opening in the second processing surface 2 at a position adjacent to the second processing surface 2 in this manner. it can.

  As described above, the opening of the first introduction part d1 is provided in the second holder 21, and the opening of the second introduction part d2 is located inside the second processing surface 2 and adjacent to the second processing surface 2. (In this case, it is not essential to provide the third introduction part d3). In particular, when reacting a plurality of fluids to be treated, the fluid to be treated introduced from the first introduction part d1. And the fluid to be treated introduced from the second introduction part d2 can be introduced between the processing surfaces 1 and 2 without reacting, and the two can be reacted for the first time between the processing surfaces 1 and 2. Therefore, the said structure is suitable especially when using the to-be-processed fluid with high reactivity.

  The “adjacent” described above is not limited to the case where the opening of the second introduction portion d2 is provided so as to contact the inner side surface of the second ring 20 as shown in FIG. . The distance from the second ring 20 to the opening of the second introduction part d2 is such that the mixing (reaction) is not completely performed before the plurality of fluids to be processed are introduced between the processing surfaces 1 and 2. For example, it may be provided at a position close to the second ring 20 of the second holder 21. Moreover, you may provide the opening part of the 2nd introducing | transducing part d2 in the 1st ring 10 or the 1st holder 11 side.

Furthermore, in the apparatus shown in FIG. 1B, there is an interval between the opening of the third introduction part d3 and the opening of the second introduction part d2 in the inner and outer directions of the diameter of the second ring 20. 2B. As shown in FIG. 2 (B), when the second and third fluids to be processed are introduced between the processing surfaces 1 and 2 without providing such an interval, It can also be implemented as a fluid merge. Such an apparatus shown in FIG. 2B may be selected depending on the processing target.
Also, in the apparatus shown in FIG. 1D, the distance between the opening of the first introduction part d1 and the opening of the second introduction part d2 is about the inner and outer directions of the diameter of the second ring 20. However, without introducing such an interval, when the first and second fluids to be treated are introduced between the processing surfaces 1 and 2, both fluids can be merged immediately. (Not shown). What is necessary is just to select arrangement | positioning of such an opening part by the object of a process.
In the embodiment shown in FIG. 1 (B) and FIG. 1 (C) described above, on the second processing surface 2, the opening of the third introduction part d3 is located downstream of the opening of the second introduction part d2, In other words, the second ring 20 is disposed outside the opening of the second introduction part d2 in the inner and outer directions of the diameter. In addition, as shown in FIG. 2C and FIG. 3A, on the second processing surface 2, the opening of the third introduction part d 3 is replaced with the opening of the second introduction part d 2 and the second ring 20. It can also be implemented as being arranged at different positions in the circumferential direction r0. In FIG. 3, m1 represents the opening of the first introduction part d1, that is, the first opening, m2 represents the opening of the second introduction part d2, that is, the second opening, and m3 represents the opening of the third introduction part d3, that is, the first opening. Three openings, r1, indicate the inner and outer directions of the ring diameter.
Further, when the first introduction part d1 is provided in the second ring 20, as shown in FIG. 2D, the opening of the first introduction part d1 is formed on the second processing surface 2 with respect to the second introduction part d2. It can implement also as what arrange | positions in a different position about the opening part and the circumferential direction of the 2nd ring 20. FIG.

In the apparatus shown in FIG. 3A described above, the processing surface 2 of the second ring 20 is shown in which the openings of the two introduction portions are arranged at different positions in the circumferential direction r0. As shown in FIG. 3B, the openings of the three introduction parts are arranged at different positions in the circumferential direction r0 of the ring, or four introduction parts are arranged at different positions in the circumferential direction r0 of the ring as shown in FIG. It can also be carried out by arranging openings. 3B and 3C, m4 represents the opening of the fourth introduction part, and m5 in FIG. 3C represents the opening of the fifth introduction part. Although not shown, the opening of the introduction part may be provided by providing five or more openings at different positions in the circumferential direction r0 of the ring.
In the apparatus described above, the second introduction unit to the fifth introduction unit can introduce different fluids to be processed, that is, second, third, fourth, and fifth fluids to be processed. On the other hand, it can also be implemented by introducing the same kind of second fluid to be processed between the processing surfaces from the second to fifth openings m2 to m5. Although not shown, in this case, the second introduction unit to the fifth introduction unit communicate with each other inside the ring and can be implemented as being connected to one fluid supply unit, that is, the second fluid supply unit p2. .
Also, a combination of a plurality of introduction openings provided at different positions in the circumferential direction r0 of the ring and a plurality of introduction openings provided at different positions in the radial direction of the ring, that is, the inner and outer directions r1 of the ring. It can also be implemented.
For example, as shown in FIG. 3 (D), eight openings m2 to m9 are provided on the second processing surface 2 and four of them are m2 to m5 in the circumferential direction r0 of the ring. They are different positions and are provided at the same position in the radial direction r1, and the other four m6 to m9 are different positions in the circumferential direction r0 of the ring and are provided at the same position in the radial direction r1. Yes. The other openings m6 to m9 are arranged on the outer side in the radial direction of the four openings m2 to m5 in the radial direction r1. Further, each of the outer openings may be provided at the same position as the inner opening in the circumferential direction r0 of the ring, but in consideration of the rotation of the ring, as shown in FIG. It can also be carried out by providing at different positions in the circumferential direction r0 of the ring. Also in that case, the opening is not limited to the arrangement and number shown in FIG.
For example, as shown in FIG. 3E, the radially outer opening is arranged at the vertex position of a polygon, that is, in this case, the vertex position of a quadrangle, and the radially inner opening is located on the side of the polygon. It can also arrange so that it may be located. Of course, other arrangements are possible.
Moreover, when all the openings other than the first opening m1 introduce the second fluid to be treated between the processing surfaces, the openings for introducing each second fluid to be treated are treated. Instead of being scattered about the circumferential direction r0 of the working surface, as shown in FIG. 3F, the circumferential direction r0 can be implemented as a continuous opening.

Depending on the object of processing, as shown in FIG. 4A, the second introduction part d2 provided in the second ring 20 in the apparatus shown in FIG. It can also be carried out by providing the central portion 22 of the second holder 21. In this case, the opening of the second introduction part d2 is located outside the opening of the first introduction part d1 located at the center of the second ring 20 with a gap therebetween. Moreover, as shown to FIG. 4 (B), about the apparatus shown to FIG. 4 (A), the 3rd introduction part d3 can also be provided in the 2nd ring 20, and it can implement. As shown in FIG. 4C, in the apparatus shown in FIG. 4A, there is no space between the opening of the first introduction part d1 and the opening of the second introduction part d2, and the second ring 20 The present invention can be implemented even if both fluids merge immediately when the first and second fluids to be treated are introduced into the inner space. Furthermore, depending on the object of processing, as shown in FIG. 4D, in the apparatus shown in FIG. 4A, the third introduction part d3 is also provided in the second holder 21 in the same manner as the second introduction part d2. be able to. Although not shown in the drawings, it is possible to provide four or more introduction portions in the second holder 21 for implementation.
In addition, depending on the object of processing, as shown in FIG. 5A, in the apparatus shown in FIG. It can also be implemented by introducing it between the working surfaces 1 and 2.

As shown in FIG. 5B, in the apparatus shown in FIG. 1A, instead of providing the second introduction part d2 in the second ring 20, the second introduction part d2 is provided in the first ring 10, The present invention can also be implemented by providing the processing surface 1 with an opening of the second introduction part d2.
As shown in FIG. 5C, in the apparatus shown in FIG. 5B, the third introduction part d3 is provided in the first ring 10, and the opening of the third introduction part d3 is formed on the first processing surface 1. Further, the present invention can be implemented by arranging the opening of the second introduction part d2 and the circumferential position of the first ring 10 at different positions.
As shown in FIG. 5D, in the apparatus shown in FIG. 5B, instead of providing the first introduction part d1 in the second holder 21, the first introduction part d1 is provided in the second ring 20, and the second treatment is performed. It can also be implemented by arranging the opening of the first introduction part d1 on the work surface 2. In this case, both openings of the first and second introduction portions d1 and d2 are arranged at the same position in the inner and outer directions of the diameter of the ring.

Further, as shown in FIG. 6A, in the apparatus shown in FIG. 1A, the third introduction part d3 is provided in the first ring 10, and the opening of the third introduction part d3 is provided in the first processing surface 1. It can also be implemented as an arrangement. In this case, both openings of the second and third introduction portions d2 and d3 are disposed at the same position in the inner and outer directions of the diameter of the ring. However, it is good also as what arrange | positions both said opening part in a different position about the inner / outer direction of the diameter of a ring.
In the apparatus shown in FIG. 5C, both the opening portions of the second and third introduction portions d2 and d3 are provided at the same position in the inner and outer directions of the diameter of the first ring 10, and the circumferential direction of the first ring 10 is provided. That is, although provided in different positions in the rotation direction, in the apparatus, as shown in FIG. 6B, both openings of the second and third introduction parts d2 and d3 are located at the same position in the circumferential direction of the first ring 10. In addition, the first ring 10 can be provided at different positions in the inner and outer directions of the diameter. In this case, as shown in FIG. 6 (B), it is possible to carry out an arrangement in which a gap is provided between the openings of the second and third introduction portions d2 and d3 in the inner and outer directions of the diameter of the first ring 10. Alternatively, although not shown, the second treated fluid and the third treated fluid may be immediately joined without opening the interval.
6C, instead of providing the first introduction part d1 in the second holder 21, the first introduction part d1 may be provided in the first ring 10 together with the second introduction part d2. it can. In this case, on the first processing surface 1, the opening of the first introduction part d <b> 1 is provided upstream of the opening of the second introduction part d <b> 2 (inside in the inner and outer directions of the diameter of the first ring 10). A gap is provided between the opening of the first introduction part d1 and the opening of the second introduction part d2 in the inner and outer directions of the diameter of the first ring 10. However, although not shown in the drawings, the present invention can be carried out without such an interval.
Further, as shown in FIG. 6 (D), the first introduction part d1 and the second introduction part 1 are located at different positions in the circumferential direction of the first ring 10 on the first processing surface 1 of the apparatus shown in FIG. 6 (C). It can be implemented as arranging the opening of each introduction part d2.
Although not shown, in the embodiment shown in FIGS. 6C and 6D, three or more introduction portions are provided in the first ring 10, and the circumferential positions on the first processing surface 1 are different. Alternatively, each opening can be arranged at a different position in the inner and outer directions of the diameter of the ring. For example, the arrangement of the openings shown in FIGS. 3B to 3F taken on the second processing surface 2 can also be adopted on the first processing surface 1.

As shown in FIG. 7 (A), in the apparatus shown in FIG. 1 (A), the second introduction part d2 can be provided in the first holder 11 instead of being provided in the second ring 20. In this case, it is preferable that the opening of the second introduction part d2 is arranged at the center of the central axis of rotation of the first ring 10 in a portion surrounded by the first ring 10 on the upper surface of the first holder 11.
As shown in FIG. 7B, in the embodiment shown in FIG. 7A, the third introduction part d3 is provided in the second ring 20, and the opening of the third introduction part d3 is provided on the second processing surface. 2 can be arranged.
Further, as shown in FIG. 7C, the first introduction part d <b> 1 can be provided in the first holder 11 instead of being provided in the second holder 21. In this case, it is preferable to arrange the opening of the first introduction part d1 on the central axis of rotation of the first ring 10 in a portion surrounded by the first ring 10 on the upper surface of the first holder 11. In this case, as shown in the figure, the second introduction part d2 can be provided in the first ring 10 and the opening can be arranged in the first processing surface 1. Although not shown, in this case, the second introduction part d2 can be provided in the second ring 20, and the opening can be arranged in the second processing surface 2.
Further, as shown in FIG. 7D, the second introduction part d2 shown in FIG. 7C can be provided in the first holder 11 together with the first introduction part d1. In this case, the opening of the second introduction part d2 is arranged at a part surrounded by the first ring 10 on the upper surface of the first holder 11. In this case, in FIG. 7C, the second introduction part d2 provided in the second ring 20 may be the third introduction part d3.

1 to 7, the first holder 11 and the first ring 10 rotate with respect to the second holder 21 and the second ring 20. In addition, as shown in FIG. 8 (A), in the apparatus shown in FIG. 1 (A), the second holder 21 is provided with a rotating shaft 51 that rotates by receiving the rotational force from the rotation driving unit, and the first holder 11 It can also be implemented as rotating the second holder 21 in the opposite direction. The rotation driving unit for the rotating shaft 51 may be provided separately from the rotating shaft 50 of the first holder 11 or the rotating shaft 50 of the first holder 11 is rotated by power transmission means such as a gear. It can also be implemented as receiving power from the drive unit. In this case, it is assumed that the second holder 21 is formed separately from the above-described case and is rotatably accommodated in the case like the first holder 11.
Further, as shown in FIG. 8B, in the apparatus shown in FIG. 8A, instead of providing the second introduction part d2 in the second ring 20, the first holder 11 is provided in the same manner as in the apparatus of FIG. 7B. The second introduction part d2 can be provided in the embodiment.
Further, although not shown, in the apparatus shown in FIG. 8B, the second introduction part d <b> 2 can be provided in the second holder 21 instead of the first holder 11. In this case, the second introduction part d2 is the same as the apparatus of FIG. As shown in FIG. 8C, in the apparatus shown in FIG. 8B, the second ring 20 is provided with the third introduction part d3, and the opening part of the introduction part d3 is arranged on the second processing surface 2. It can also be implemented.
Further, as shown in FIG. 8D, the first holder 11 can be rotated without rotating the second holder 21 alone. Although not shown, the apparatus shown in FIGS. 1B to 7 can also be implemented by rotating the second holder 21 together with the first holder 11 or rotating only the second holder 21 alone.

  As shown in FIG. 9A, the second processing unit 20 is a ring, and the first processing unit 10 is not a ring, but a direct rotating shaft 50 similar to the first holder 11 of the other embodiments. It can be set as the member which rotates by providing. In this case, the upper surface of the first processing portion 10 is the first processing surface 1, and the processing surface is not an annular shape, that is, a flat surface having no hollow portion. Further, in the apparatus shown in FIG. 9A, as in the apparatus of FIG. 1A, the second introduction part d2 is provided in the second ring 20, and the opening is arranged in the second processing surface 2. ing.

  As shown in FIG. 9B, in the apparatus shown in FIG. 9A, the second holder 21 is independent of the case 3, and the second ring 20 is interposed between the case 3 and the second holder 21. It is also possible to implement by providing the contact surface pressure applying mechanism 4 such as an elastic body that allows the second holder 21 provided with the In this case, as shown in FIG. 9C, the second processing portion 20 is not a ring but a member corresponding to the second holder 21, and the lower surface of the member is the second processing surface 2. Can be formed as Further, as shown in FIG. 10 (A), in the apparatus shown in FIG. 9 (C), the first processing unit 10 is not a ring, but is similar to the apparatus shown in FIGS. 9 (A) and 9 (B). In the embodiment, the portion corresponding to the first holder 11 can be used as the first processing portion 10, and the upper surface thereof can be used as the first processing surface 1.

In each of the embodiments described above, mainly at least the first fluid to be processed is supplied from the first processing portion 10 and the second processing portion 20, that is, the central portions of the first ring 10 and the second ring 20. Then, after the treatment with the other fluid to be treated, that is, mixing (reaction), the inside and outside directions of the diameter are discharged to the outside.
In addition, as shown to FIG. 10 (B), it can implement also as what supplies a 1st to-be-processed fluid toward the inner side from the outer side of the 1st ring 10 and the 2nd ring 20. FIG. In this case, as shown in the figure, the outer sides of the first holder 11 and the second holder 21 are hermetically sealed with the case 3, and the first introduction part d1 is provided directly on the case 3 so that both the rings 10 are inside the case. , 20 at the position corresponding to the butting position. And the discharge part 36 is provided in the position used as the center of the 1st ring 10 in the position where the 1st introduction part d1 was provided in the device of Drawing 1 (A). In addition, the opening of the second introduction part d2 is arranged on the opposite side of the opening of the case across the central axis of rotation of the holder. However, the opening of the second introduction part d2 may be located inside the case and at a site corresponding to the butting position of both the rings 10 and 20 like the opening of the first introduction part d1. As described above, the present invention is not limited to being formed on the opposite side of the opening of the first introduction part d1.
In this case, the outside of the diameters of both rings 10 and 20 is upstream, and the inside of both rings 10 and 20 is downstream.

  As described above, when the fluid to be processed is moved from the outside to the inside, as shown in FIG. 16 (E), the first processing portion 1 is formed on the first processing surface 1 of the first processing portion 10. It is also possible to carry out by forming groove-like recesses 13... 13 extending from the outer side of 10 toward the center side. By forming such recesses 13... 13, the balance ratio K is preferably an unbalanced type of 100% or more. As a result, dynamic pressure is generated in the groove-like recesses 13... 13 during rotation, and both the processing surfaces 1 and 2 can be reliably rotated in a non-contact manner, and there is no danger of wear due to contact. In the embodiment shown in FIG. 16E, the separation force due to the pressure of the fluid to be processed is generated at the inner end 13 a of the recess 13.

  As shown in FIG. 10 (C), in the apparatus shown in FIG. 10 (B), the second introduction part d2 provided in the side part of the case 3 is provided in the first ring 10 instead of the position, and the opening part is provided. Can also be carried out by arranging them on the first processing surface 1. In this case, as shown in FIG. 10D, the first processing unit 10 is not formed as a ring, but is similar to the apparatus shown in FIGS. 9A, 9B, and 10A. In another embodiment, a portion corresponding to the first holder 11 is a first processing portion 10, an upper surface thereof is a first processing surface 1, and a second introduction portion is further provided in the first processing portion 10. d2 may be provided, and the opening may be disposed on the first processing surface 1.

As shown in FIG. 11 (A), in the apparatus shown in FIG. 10 (D), the second processing portion 20 is not formed as a ring, but a member corresponding to the second holder 21 in the other embodiment is used. The second processing unit 20 can be used as the second processing surface 2. The second processing unit 20 is a member independent of the case 3, and between the case 3 and the second processing unit 20, the apparatus shown in FIGS. 9B, 9 C, and 10 A. The same contact pressure application mechanism 4 can be provided and implemented.
Further, as shown in FIG. 11B, the second introduction part d2 of the apparatus shown in FIG. 11A can be used as the third introduction part d3, and the second introduction part d2 can be provided separately. In this case, the opening of the second introduction part d2 is arranged on the downstream side of the opening of the third introduction part d3 on the second processing surface 2.
Each of the devices shown in FIG. 4 described above, and the devices shown in FIGS. 5A, 7A, 7B, 8D, 8B, and 8C, before reaching between the processing surfaces 1 and 2. In addition, the other fluid to be treated merges with the first fluid to be treated, and is not suitable for a material having a fast crystallization or precipitation reaction. However, such a device can also be employed for those having a slow reaction rate.

The fluid treatment apparatus suitable for carrying out the method according to the present invention will be summarized below.
As described above, the fluid processing apparatus includes a fluid pressure applying mechanism that applies pressure to the fluid to be processed, and a first fluid channel that is provided in a sealed fluid flow path through which the fluid to be processed to which the pressure is applied flows. At least two processing parts of the second processing part 20 that are relatively close to and away from the processing part 10 and the first processing part 10, and positions facing each other in these processing parts 10 and 20 And at least two processing surfaces of the first processing surface 1 and the second processing surface 2 provided on the surface, and a rotation drive mechanism for relatively rotating the first processing portion 10 and the second processing portion 20. And processing of mixing at least two kinds of fluids to be processed is performed between the processing surfaces 1 and 2 (reaction processing is also performed when a reaction is involved). At least the second processing unit 20 of the first processing unit 10 and the second processing unit 20 includes a pressure receiving surface, and at least a part of the pressure receiving surface is constituted by the second processing surface 2. The pressure receiving surface receives a pressure applied to at least one of the fluids to be processed by the fluid pressure applying mechanism, and generates a force for moving the second processing surface 2 away from the first processing surface 1. And in this apparatus, the to-be-processed fluid which received the said pressure is passed between the 1st processing surface 1 and the 2nd processing surface 2 which can approach / separate and rotate relatively. Thus, each processed fluid passes between the processing surfaces 1 and 2 while forming a thin film fluid having a thickness equal to or less than the distance between the processing surfaces 1 and 2. A desired mixed state (reaction) occurs between the fluids to be processed which are formed into a film.

  Further, in this fluid processing apparatus, it is preferable to employ a fluid processing apparatus provided with a buffer mechanism for adjusting fine vibration and alignment of at least one of the first processing surface 1 and the second processing surface 2.

  In this fluid processing apparatus, the thin film fluid between the processing surfaces 1 and 2 is adjusted by adjusting the axial displacement of one or both of the first processing surface 1 and the second processing surface 2 due to wear or the like. It is preferable to employ a mechanism having a displacement adjusting mechanism that can maintain the thickness.

Further, in this fluid processing apparatus, a pressurizing apparatus such as a compressor that applies a constant feeding pressure to the fluid to be processed can be employed as the fluid pressure applying mechanism.
In addition, the said pressurization apparatus employ | adopts what can adjust the increase / decrease in infeed pressure. This is because the pressurizing apparatus needs to be able to keep the set pressure constant, but it needs to be able to adjust as a parameter for adjusting the interval between the processing surfaces.

  Further, in this fluid processing apparatus, the separation between the first processing surface 1 and the second processing surface 2 is defined so as to prevent further separation between the processing surfaces 1 and 2. A thing provided with a deterrent part can be adopted.

  Furthermore, in this fluid processing apparatus, a minimum distance between the first processing surface 1 and the second processing surface 2 is defined, and further approach of both processing surfaces 1 and 2 is suppressed. A thing provided with an approach deterrent part can be adopted.

  Further, the fluid processing apparatus may employ one in which both the first processing surface 1 and the second processing surface 2 rotate in opposite directions.

  In addition, the fluid processing apparatus may be provided with a temperature adjusting jacket for adjusting the temperature of one or both of the first processing surface 1 and the second processing surface 2.

  Furthermore, it is preferable that at least a part of one or both of the first processing surface 1 and the second processing surface 2 is mirror-finished in the fluid processing apparatus.

  In this fluid processing apparatus, one or both of the first processing surface 1 and the second processing surface 2 may be provided with a recess.

  Further, the fluid processing apparatus includes a separate introduction path that is independent from the passage of the one fluid to be treated, as supply means for the other fluid to be treated that is mixed (reacted) with one fluid to be treated. The at least one of the first processing surface and the second processing surface is provided with an opening that leads to the separate introduction path, and the other fluid to be processed that has been sent from the separate introduction path, It is preferable to employ one that can be introduced into the one fluid to be treated.

Further, as a fluid processing apparatus for carrying out the present invention, a fluid pressure applying mechanism for applying pressure to a fluid to be processed and a sealed fluid flow path through which the fluid to be processed to which the pressure is applied are flowed are connected. At least two of the first processing surface 1 and the second processing surface 2 that can be relatively approached and separated from each other, and a contact pressure applying mechanism that applies a contact pressure between the processing surfaces 1 and 2. And a rotational drive mechanism that relatively rotates the first processing surface 1 and the second processing surface 2, so that at least two kinds of flow to be processed are provided between the processing surfaces 1 and 2. A body mixing (reaction) process is performed, and pressure is applied from a fluid pressure applying mechanism between a first processing surface 1 and a second processing surface 2 that rotate relatively while a contact pressure is applied. At least one kind of fluid to be treated is passed, and another kind of fluid to be treated is passed. As a result, the above-mentioned kind of fluid to be treated, which has been pressurized by the fluid pressure imparting mechanism, forms a thin film fluid having a thickness equal to or less than the distance between the processing surfaces 1 and 2, while the processing surfaces 1 and 2 are in contact. The other kind of fluid to be treated is mixed when passing through the process fluid, and a desired mixed state (reaction) is generated between the fluids to be treated which are formed into a film between the processing surfaces 1 and 2. You can adopt what you want.
This contact surface pressure imparting mechanism can be implemented as a buffer mechanism or a displacement adjustment mechanism for adjusting fine vibrations and alignment in the above-described apparatus.

  Furthermore, as a fluid treatment apparatus for carrying out the invention of the present application, a first introduction part for introducing at least one of the two treatment fluids to be mixed (reacted) into the apparatus, and a first introduction part A fluid pressure applying mechanism p1 that applies pressure to the one fluid to be treated and a second introduction portion that introduces at least one of the two fluids to be treated (reacted) into the apparatus. And a second processing unit that is relatively close to and away from the first processing unit 10 and the first processing unit 10 provided in a sealed fluid flow path through which the one fluid to be processed flows. At least two processing surfaces of the unit 20, and at least two processing surfaces of the first processing surface 1 and the second processing surface 2 provided at positions facing each other in the processing units 10 and 20, Second processing portion so that second processing surface 2 is exposed The holder 21 that receives 0, the rotational drive mechanism that relatively rotates the first processing unit 10 and the second processing unit 20, and the second processing surface 2 approaching the first processing surface 1 The contact surface pressure imparting mechanism 4 that presses the second processing portion 20 in the state is provided, the mixing (reaction) processing between the fluids to be processed is performed between the processing surfaces 1 and 2, and the holder 21 Is provided with an opening of the first introduction part and is not movable so as to affect the gap between the processing surfaces 1 and 2, and at least of the first treatment part 10 and the second introduction part 20 One is provided with the opening of the second introduction portion, the second processing portion 20 is an annular body, and the second processing surface 2 slides with respect to the holder 21 to form the first processing surface 1. The second processing unit 20 includes a pressure receiving surface, and the pressure receiving surface is formed by the fluid pressure applying mechanism p1 on the fluid to be processed. In response to the applied pressure, a force for moving the second processing surface 2 away from the first processing surface 1 is generated, and at least a part of the pressure receiving surface is configured by the second processing surface 2. One of the fluids to be treated is passed between the first processing surface 1 and the second processing surface 2 that can move toward and away from each other and rotate relative to each other. By supplying the processing fluid between the processing surfaces 1 and 2, both processing surfaces form a thin film fluid having a thickness equal to or less than the distance between the processing surfaces 1 and 2. By passing the fluid to be treated passing between 1 and 2, and mixing the fluid to be treated, desired mixing (reaction) is promoted between the fluids to be treated which are formed into a film between the treatment surfaces 1 and 2. The processing surfaces 1 and 2 for both the contact pressure of the contact pressure applying mechanism 4 and the fluid pressure applied by the fluid pressure applying mechanism p1 It is possible to employ one that keeps the minute distance between the processing surfaces 1 and 2 for generating the above-described thin film fluid by the balance with the force separating the two.

In this fluid processing apparatus, the second introduction unit can also be implemented by being connected to a separate fluid pressure applying mechanism similar to that connected to the first introduction unit and pressurized. In addition, the fluid to be treated introduced from the second introduction part is not pressurized by a separate fluid pressure applying mechanism, but by the fluid pressure of the fluid to be treated introduced by the first introduction part. The present invention can also be implemented by sucking and supplying between the processing surfaces 1 and 2 due to the negative pressure generated in the second introduction portion. Further, the other fluid to be processed can be carried out by moving in the second introduction portion by its own weight, that is, flowing downward from above and supplied between the processing surfaces 1 and 2.
As described above, the opening of the first introduction part that serves as a supply port for one of the fluids to be processed is not limited to the one provided in the second holder, but the opening of the first introduction part. May be provided on the first holder. Moreover, the said opening part of a 1st introducing | transducing part can also be formed and formed in at least one of both processing surfaces. However, when it is necessary to supply the fluid to be treated, which must be introduced between the processing surfaces 1 and 2 by the reaction, from the first introduction part, the inside of the apparatus of the other fluid to be treated The opening part of the second introduction part serving as the supply port to the water needs to be arranged on the downstream side of the opening part of the first introduction part on any processing surface.

Furthermore, the following can be adopted as a fluid processing apparatus used for carrying out the present invention.
The fluid processing apparatus includes a plurality of introduction units that separately introduce two or more types of fluids to be mixed (reacted), and a fluid pressure that applies pressure to at least one of the two or more types of fluids to be processed. A second process that is relatively close to and away from the application mechanism p and the first processing unit 10 and the first processing unit 10 provided in a sealed fluid flow path through which the fluid to be processed flows. At least two processing surfaces 1 of the first processing surface 1 and the second processing surface 2 provided at positions facing each other in the processing portions 10 and 20 and at least two processing portions of the processing portion 20. , 2 and a rotational drive mechanism for relatively rotating the first processing unit 10 and the second processing unit 20, and mixing between the processing fluids between the processing surfaces 1, 2 ( (Reaction) processing, and the first processing unit 10 and the second processing unit 20 are small. At least the second processing portion 20 includes a pressure receiving surface, and at least a part of the pressure receiving surface is constituted by the second processing surface 2. In response to the pressure applied to the body, a force is generated to move the second processing surface 2 away from the first processing surface 1, and the second processing unit 20 is connected to the second processing surface 2. The approaching adjustment surface 24 faces the opposite side, and the approaching adjustment surface 24 receives the pressure applied to the fluid to be treated and brings the second processing surface 2 closer to the first processing surface 1. The total pressure received from the fluid to be treated is determined by the area ratio between the projected area in the approaching / separating direction of the approach adjusting surface 24 and the projected area in the approaching / separating direction of the pressure receiving surface. As a resultant force, the second processing surface 2 moves away from the first processing surface 1. The fluid to be treated is passed between the first processing surface 1 and the second processing surface 2 that are capable of approaching / separating and rotating relatively, and the processing target fluid is determined. Other fluids to be mixed (reacted) with the fluid are mixed between the processing surfaces, and the mixed fluid forms a thin film fluid having a thickness equal to or less than the distance between the processing surfaces 1 and 2. However, a desired product is obtained during passage between the processing surfaces 1 and 2 by passing between the processing surfaces 1 and 2.

  Further, when the fluid processing method according to the present invention is summarized, in this fluid processing method, a pressure is applied to the first fluid to be processed, and the sealed fluid flow path through which the fluid to be processed that has received this pressure flows. To the first processing surface 1 and the second processing surface 2 at least two processing surfaces that can be relatively approached and separated from each other, and a contact pressure is applied to bring both processing surfaces 1 and 2 close to each other. The first treatment surface 1 and the second treatment surface 2 are relatively rotated and the fluid to be treated is introduced between the treatment surfaces 1 and 2 and mixed with the fluid to be treated. A second fluid to be treated (reacted) is introduced between the processing surfaces 1 and 2 through a separate flow path from the above to mix (react) both fluids to be treated. The pressure applied to the fluid to be treated is the separation force that separates the processing surfaces 1 and 2, and the separation The force and the contact pressure are balanced through the fluid to be processed between the processing surfaces 1 and 2 so that the space between the processing surfaces 1 and 2 is maintained at a very small distance so that the fluid to be processed is a thin film. Passing between both processing surfaces 1 and 2 as a fluid, mixing (reaction) of both processed fluids is uniformly performed during the passage, and in the case of a reaction accompanied by precipitation, a desired reaction product is obtained. Crystallize or precipitate.

Hereinafter, other embodiments of the present invention will be described. FIG. 25 is a schematic cross-sectional view of a fluid processing apparatus for processing an object to be processed between processing surfaces in which at least one of the approaching / separating methods rotates relative to the other. 26A is a schematic plan view of the first processing surface of the apparatus shown in FIG. 25, and FIG. 26B is an enlarged view of a main part of the processing surface of the apparatus shown in FIG. FIG. 27A is a cross-sectional view of the second introduction part, and FIG. 27B is an enlarged view of a main part of the processing surface for explaining the second introduction part.
In FIG. 25, U indicates the upper side, and S indicates the lower side. In FIGS. 26A and 27B, R indicates the rotation direction. In FIG. 27B, C indicates the centrifugal force direction (radial direction).

  This apparatus uses at least two kinds of fluids as the fluid to be treated as described above, and at least one kind of fluid contains at least one kind of article to be treated and can be approached and separated. Are arranged so as to face each other, and at least one of the above-mentioned fluids joins between processing surfaces rotating with respect to the other to form a thin-film fluid, and the above-mentioned object to be processed is contained in the thin-film fluid Is a device for processing. The “treatment” is not limited to a form in which an object to be treated reacts, and includes a form in which only mixing and dispersion are performed without a reaction.

As shown in FIG. 25, this apparatus includes a first holder 11 and a second holder 21 disposed above the first holder 11 and a fluid pressure application mechanism P and a contact pressure application mechanism. The contact surface pressure applying mechanism includes a spring 43 and an air introduction portion 44.
The first holder 11 is provided with a first processing part 10 and a rotating shaft 50. The first processing unit 10 is an annular body called a maining ring, and includes a first processing surface 1 that is mirror-finished. The rotary shaft 50 is fixed to the center of the first holder 11 by a fixing tool 81 such as a bolt, and the rear end thereof is connected to a rotary drive device 82 (rotary drive mechanism) such as an electric motor. A driving force is transmitted to the first holder 11 to rotate the first holder 11. The first processing unit 10 rotates integrally with the first holder 11.

The upper part of the first holder 11 is provided with a receiving part capable of receiving the first processing part 10. The first processing part to the first holder 11 is fitted into the receiving part. Ten of the above attachments have been made. Further, the first processing portion 10 is fixed by a rotation stop pin 83 so as not to rotate with respect to the first holder 11. However, instead of the rotation prevention pin 83, it may be fixed so as not to rotate by a method such as shrink fitting.
The first processing surface 1 is exposed from the first holder 11 and faces the second holder 21. As the material for the first processing surface, ceramics, sintered metal, anti-abrasion steel, or other metals that have been hardened, or hard materials that have been lined, coated, plated, or the like are employed.

  The second holder 21 has a second processing portion 20, a first introduction portion d1 into which the fluid to be treated is introduced from the inside of the processing portion, a spring 43 as the contact surface pressure applying mechanism, and an air introduction portion 44. And are provided.

  The second processing unit 20 is an annular body called a compression ring, and is located on the inner side of the second processing surface 2 that is mirror-finished and adjacent to the second processing surface 2. Pressure receiving surface 23 (hereinafter referred to as separation adjusting surface 23). As illustrated, the separation adjusting surface 23 is an inclined surface. The mirror finishing applied to the second processing surface 2 employs the same method as the first processing surface 1 described above. Further, the same material as that of the first processing unit 10 is also used for the material of the second processing unit 20. The separation adjusting surface 23 is adjacent to the inner peripheral surface 25 of the annular second processing portion 20.

A ring housing part 41 is formed at the bottom (lower part) of the second holder 21, and the second processing part 20 is received in the ring housing part 41 together with the O-ring. Further, the second processing unit 20 is received by the rotation stopper 84 so as not to rotate with respect to the second holder 21. The second processing surface 2 is exposed from the second holder 21. In this state, the second processing surface 2 faces the first processing surface 1 of the first processing unit 10.
The ring holder 41 included in the second holder 21 is a recess that mainly stores a portion of the second ring 20 on the side opposite to the processing surface 2 side, and is a groove formed in an annular shape in plan view.
The ring accommodating portion 41 is formed larger than the size of the second ring 20 and accommodates the second ring 20 with a sufficient clearance between the ring accommodating portion 41 and the second ring 20.

Due to this clearance, the second processing portion 20 is accommodated in the ring accommodating portion 41 so that it can be displaced in the axial direction of the ring accommodating portion 41 and further in a direction intersecting with the axial direction. . Further, the second processing portion 20 is accommodated such that the center line (axial direction) of the second processing portion 20 can be displaced relative to the ring accommodating portion 41 so as not to be parallel to the axial direction of the ring accommodating portion 41. Yes.
At least the ring accommodating portion 41 of the second holder 21 is provided with a spring 43 as a contact pressure applying mechanism. The spring 43 urges the second processing unit 20 toward the first processing unit 10. Further, as another urging method, the second processing unit 20 held by the second holder 21 using the pressurizing means for supplying air pressure or other fluid pressure such as the air introduction unit 44 is transferred to the first processing unit 10. A method of biasing in the approaching direction may be used.
The contact surface pressure applying mechanism such as the spring 43 and the air introduction part 44 urges each position in the circumferential direction of the second processing part 20 (each position on the processing surface) equally toward the first processing part 10. To do.
The first introduction part d1 is provided in the center of the second holder 21, and the fluid to be processed that is pumped from the first introduction part d1 to the outer periphery of the processing part is first held by the second holder 21. Guided to a space surrounded by the second processing unit 20, the first processing unit 10, and the first holder 11 that holds the first processing unit 10. Then, the fluid pressure applying mechanism is applied to the pressure receiving surface 23 provided in the second processing section 20 in a direction in which the second processing section 20 is separated from the first processing section 10 against the urging force of the contact surface pressure applying mechanism. A pressure (supply pressure) of the fluid to be processed by P is received.
In addition, in order to simplify description in other places, only the pressure receiving surface 23 is described. However, to be exact, as shown in FIGS. 29A and 29B, together with the pressure receiving surface 23 described above. Of the projection surface in the axial direction of the groove-shaped recess 13 to be described later with respect to the second processing portion 20, the portion 23X not provided with the pressure receiving surface 23 is also used as the pressure receiving surface. Receives body pressure (supply pressure).

It can also be carried out without providing the pressure receiving surface 23. In that case, as shown in FIG. 26 (A), the processing obtained by rotating the first processing surface 1 provided with the groove-shaped recess 13 formed so that the contact pressure applying mechanism functions. The introduction effect (micro pump effect) of the fluid to be processed between the working surfaces may be used. Here, the micropump effect means that the fluid to be processed in the recess advances with a speed toward the outer circumferential end of the recess 13 by the rotation of the first processing surface 1, and then is fed to the tip of the recess 13. The processed fluid further receives a pressure from the inner circumferential direction of the recess 13 and finally becomes a pressure in a direction separating the processing surface, and at the same time, the processed fluid is introduced between the processing surfaces. It is. Even if it is not rotated further, the pressure received by the fluid to be processed in the recess 13 provided in the first processing surface 1 is finally the second processing surface as a pressure receiving surface acting on the separation side. Acts on 2.
About the recessed part 13 provided in the processing surface, the depth corresponding to the physical property of the to-be-processed fluid containing the to-be-processed object and a product, the total area in a horizontal direction with respect to the processing surface, the number, and Shape can be implemented.
The pressure receiving surface 23 and the recess 13 can be provided together in one apparatus.

  The recess 13 has a depth of 1 μm to 50 μm, more preferably 3 μm to 20 μm, and a total area in the horizontal direction with respect to the processing surface is 5% to 50%, preferably 15%. % To 25%, and the number thereof is 3 to 50, preferably 8 to 24, and the shape extends in a curved or spiral shape on the processing surface, or bends in an L shape. Furthermore, by providing a gradient in the depth, the flow to be processed can be stably performed between the processing surfaces from the high viscosity range to the low viscosity range, and even when the processed fluid to be introduced using the micropump effect contains solids. The body can be introduced. Further, the recess 13 provided in the processing surface may be connected to each other on the introduction side, that is, inside the processing surface, or may be divided.

  As described above, the pressure receiving surface 23 is an inclined surface. This inclined surface (pressure-receiving surface 23) has a distance in the axial direction with respect to the processing surface of the processing portion provided with the recess 13 at the upstream end on the basis of the flow direction of the fluid to be processed. It is formed to be larger than the same distance at the end. And it is preferable that this inclined surface shall be installed in the downstream direction edge part on the axial direction projection surface of the said recessed part 13 on the basis of the flow direction of a to-be-processed fluid.

  Specifically, as shown in FIG. 28A, the downstream end portion 60 of the inclined surface (pressure receiving surface 23) is placed on the axial projection surface of the concave portion 13. The angle θ1 of the inclined surface with respect to the second processing surface 2 is preferably in the range of 0.1 ° to 85 °, more preferably in the range of 10 ° to 55 °, and still more preferably in the range of 15 ° to 45 °. . This angle θ1 can be appropriately changed depending on the properties of the workpiece before processing. Further, the downstream end portion 60 of the inclined surface is located downstream from the upstream end portion 13-b of the recess 13 provided on the first processing surface 1 by a distance of 0.01 mm downstream. It is provided in a region from -c to a position 0.5 mm away from the upstream side. More preferably, it is provided in a region from a position 0.05 mm away from the upstream end 13-b downstream to a position 1.0 mm away from the downstream end 13-c upstream. Similar to the angle of the inclined surface, the position of the downstream end 60 can be appropriately changed according to the properties of the object to be processed. In addition, as shown in FIG. 28B, the inclined surface (pressure receiving surface 23) can be implemented as a rounded surface. As a result, the workpieces can be introduced more uniformly.

  The recess 13 can be implemented even if it is intermittent as well as continuous as described above. In the case of intermittent connection, the upstream end of the intermittent recess 13 on the innermost peripheral side of the first processing surface 1 becomes the above-mentioned 13-b, and also the upstream of the first processing surface 1 on the outermost peripheral side. The side end is 13-c.

  In the above description, the concave portion 13 is formed on the first processing surface 1 and the pressure receiving surface 23 is formed on the second processing surface 2. Conversely, the concave portion 13 is formed on the second processing surface 2. It is also possible to form the pressure receiving surface 23 on the first processing surface 1.

  Further, the recesses 13 are formed on both the first processing surface 1 and the second processing surface 2, and the recesses 13 and the pressure receiving surfaces 23 are alternately provided in the circumferential direction of the processing surfaces 1 and 2, thereby The concave portion 13 formed on the first processing surface 1 and the pressure receiving surface 23 formed on the second processing surface 2 face each other, and at the same time, the pressure receiving surface 23 formed on the first processing surface 1 and the second processing surface 2 It is also possible that the formed recess 13 is opposed.

A groove different from the recess 13 can be formed on the processing surface. As a specific example, as shown in FIGS. 16 (F) and 16 (G), it extends radially outward (FIG. 16 (F)) or radially inward (FIG. 16 (G)) from the recess 13. A new recess 14 can be applied. This is advantageous when it is desired to extend the residence time between the processing surfaces, or when processing a highly viscous material to be processed.
In addition, about a groove | channel different from the recessed part 13, it does not specifically limit regarding a shape, an area, a number, and a depth. The groove can be formed according to the purpose.

The second processing portion 20 is formed with a second introduction portion d2 having an opening d20 that is independent of the flow path of the fluid to be processed introduced into the processing surface and communicates between the processing surfaces. Yes.
Specifically, as shown in FIG. 27A, the second introduction part d2 has a predetermined introduction direction from the opening d20 of the second processing surface 2 with respect to the second processing surface 2. Is inclined at an elevation angle (θ1). The elevation angle (θ1) is set to be more than 0 degrees and less than 90 degrees, and in the case of a reaction with a higher reaction rate, it is preferably set at 1 to 45 degrees.
Further, as shown in FIG. 27B, the introduction direction from the opening d20 of the second processing surface 2 has a directivity in a plane along the second processing surface 2. . The introduction direction of the second fluid is the outward direction away from the center in the radial direction component of the processing surface, and the rotational direction of the fluid to be processed between the rotating processing surfaces. In the component, it is the forward direction. In other words, a line segment in the radial direction passing through the opening d20 and extending outward is defined as a reference line g and has a predetermined angle (θ2) from the reference line g to the rotation direction R.
This angle (θ2) is also set to be greater than 0 ° and less than 90 °, and is discharged from the opening d20 toward the shaded portion in FIG. Further, in the case of a reaction with a fast reaction rate, the angle (θ2) may be small, and when the reaction rate is slow, the angle (θ2) is preferably set to be large. Moreover, this angle can be changed and implemented according to various conditions such as the type of the fluid to be treated, the reaction speed, the viscosity, and the rotational speed of the processing surface.

  The aperture d20 has a diameter of preferably 0.2 μm to 3000 μm, more preferably 10 μm to 1000 μm. In practice, when the diameter of the opening d20 does not affect the flow of the fluid to be processed, the diameter of the second introduction part d2 may be set within the range. In addition, it is also preferable to change the shape of the opening d20 between the case of obtaining straightness and the case of obtaining diffusivity. These include the type of the fluid to be treated, the reaction speed, the viscosity, and the rotational speed of the treatment surface. It can change and implement according to various conditions, such as.

Further, the opening d20 in the separate flow path is a spiral laminar flow in which the flow direction when introduced by the micropump effect from the recess provided in the first processing surface 1 is formed between the processing surfaces. What is necessary is just to install in the outer diameter side rather than the point converted into a flow direction. That is, in FIG. 26B, it is preferable that the distance n from the radially outer side of the processing surface to the radially outer side of the recess 13 provided in the first processing surface 1 is 0.5 mm or more. Further, in the case where a plurality of openings are provided for the same fluid to be treated, it is preferable to install them on concentric circles. Further, when a plurality of openings are provided for different fluids to be treated, it is preferable to install them on concentric circles having different radii. (1) Reactions such as A + B → C (2) C + D → E are executed in order, and reactions that should not be performed simultaneously, such as A + B + C → F, occur, and the material to be processed is efficient. It is effective in avoiding the problem that the reaction is not carried out without contact.
Further, the liquid to be processed obtained by immersing the processing part in the fluid to be processed and mixing (reacting) between the processing surfaces is a liquid outside the processing part or a gas other than air. Can be implemented.
Furthermore, ultrasonic energy can be applied to the workpiece between the processing surfaces or immediately after being discharged from the processing surface.

Next, in order to generate a temperature difference between the first processing surface 1 and the second processing surface 2, that is, between the processing surfaces, at least one of the first processing portion 10 and the second processing portion 20. A case where temperature control mechanisms (temperature adjustment mechanisms) J1 and J2 are provided will be described.
The temperature control mechanism is not particularly limited, but when cooling is intended, the processing units 10 and 20 are provided with a cooling unit. Specifically, a cooling element capable of electrically or chemically cooling action such as piping for passing ice water or various refrigerants as a temperature control medium or a Peltier element is attached to the processing units 10 and 20.
When heating is intended, the processing parts 10 and 20 are provided with heating parts. Specifically, a heating element that can generate heat electrically or chemically, such as steam as a temperature control medium, piping for passing various heating media, or an electric heater is attached to the processing units 10 and 20. .
Moreover, you may provide the accommodating part for new temperature control media which can be in direct contact with the process part in a ring accommodating part. Accordingly, the temperature of the processing surface can be controlled using the heat conduction of the processing portion. In addition, by embedding a cooling element or a heating element in the processing parts 10 and 20 and energizing it, or by embedding a passage for passing a cooling / heating medium and passing a temperature adjusting medium (cooling / heating medium) through the passage, it is used for processing from the inside. The surface can also be temperature controlled. Note that the temperature control mechanisms J1 and J2 shown in FIG. 25 are an example thereof, and are pipes (jackets) through which the temperature control medium provided in the processing units 10 and 20 is passed.

  By using the temperature control mechanisms J1 and J2, the temperature of one processing surface is higher than that of the other processing surface, and a temperature difference is generated between the processing surfaces. For example, the first processing unit 10 is heated to 60 ° C. by any of the above methods, and the second processing unit 20 is set to 15 ° C. by any of the above methods. At this time, the temperature of the fluid to be processed introduced between the processing surfaces changes from 60 ° C. to 15 ° C. from the first processing surface 1 toward the second processing surface 2. That is, a temperature gradient is generated in the fluid to be processed between the processing surfaces. Then, the fluid to be processed between the processing surfaces starts to convect due to the temperature gradient, and a flow perpendicular to the processing surface is generated. The “vertical flow” means that the flow direction component includes at least a component perpendicular to the processing surface.

  Even when the first processing surface 1 or the second processing surface 2 is rotating, the flow in the direction perpendicular to the processing surface is continued, so that the processing surface is generated by rotating the processing surface. A vertical flow can be added to the laminar flow in a spiral shape. The temperature difference between the processing surfaces can be 1 to 400 degrees, preferably 5 to 100 degrees.

  In addition, the rotating shaft 50 in this apparatus is not limited to what is arrange | positioned perpendicularly. For example, you may arrange | position diagonally. This is because the influence of gravity can be substantially eliminated by the thin film fluid formed between the processing surfaces 1 and 2 during processing. As shown in FIG. 25, the first introduction part d1 coincides with the axial center of the second ring 20 in the second holder 21, and extends vertically. However, the first introduction part d1 is not limited to the one that coincides with the axial center of the second ring 20, and the first fluid to be treated is supplied to the space surrounded by the rings 10 and 20. If possible, the central portion 22 of the second holder 21 may be provided at a position other than the axis, and may extend obliquely instead of vertically. In any of the arrangement angles, a flow perpendicular to the processing surface can be generated by the temperature gradient between the processing surfaces.

In the temperature gradient of the fluid that is the fluid to be processed between the processing surfaces, if the temperature gradient is small, only heat conduction is performed to the fluid, but if the temperature gradient exceeds a certain critical value, the benal is contained in the fluid. A phenomenon called convection occurs. The phenomenon is that the distance between the processing surfaces is L, the acceleration of gravity is g, the volumetric thermal expansion coefficient of the fluid is β, the kinematic viscosity of the fluid is ν, the temperature conductivity of the fluid is α, the temperature between the processing surfaces When the difference is ΔT,
Ra = L ³・ g ・ β ・ ΔT / (α ・ ν)
Is governed by the Rayleigh number Ra, which is a dimensionless number defined by. The critical Rayleigh number at which Benard convection begins to occur is approximately 1700, although it depends on the nature of the interface between the processing surface and the fluid to be processed. Larger values cause Benard convection. Furthermore, when the Rayleigh number Ra is a value larger than around 10 ¹⁰ , the fluid becomes a turbulent state. In other words, the temperature difference ΔT between the processing surfaces or the distance L between the processing surfaces is adjusted so that the Rayleigh number Ra is 1700 or more. A vertical flow can be generated, and the above mixing (reaction) operation can be performed.

  However, the Benard convection hardly occurs at a distance between processing surfaces of about 1 to 10 μm. Strictly speaking, when the Rayleigh number is applied to a fluid in an interval of 10 μm or less and the Benard convection generation conditions are examined, the temperature difference in the case of water needs to be several thousand degrees Celsius or more. difficult. Benard convection is convection due to density difference in the temperature gradient of the fluid, that is, convection related to gravity. There is a high possibility of a microgravity field between the processing surfaces of 10 μm or less, and buoyancy convection is suppressed in such a place. That is, Benard convection actually occurs in this apparatus when the distance between the processing surfaces exceeds 10 μm.

When the distance between the processing surfaces is about 1 to 10 μm, convection is generated not by convection due to density difference but by surface tension difference of fluid due to temperature gradient. Such convection is Marangoni convection, the distance between the processing surfaces is L, the fluid kinematic viscosity is ν, the fluid temperature conductivity is α, the temperature difference between the processing surfaces is ΔT, and the fluid density is ρ When the temperature coefficient of surface tension (temperature gradient of surface tension) is σ,
Ma ＝ σ ・ ΔT ・ L / (ρ ・ ν ・ α)
It is governed by the Marangoni number, which is a dimensionless number defined by. The critical Marangoni number at which Marangoni convection begins to occur is around 80, and Marangoni convection occurs under conditions that are larger than that value. In other words, the temperature difference ΔT between the processing surfaces or the distance L between the processing surfaces is adjusted so that the Marangoni number Ma is 80 or more, so that even if the flow path is 10 μm or less. A flow perpendicular to the processing surface can be generated between the surfaces, and the above mixing (reaction) operation can be performed.

The following equation was used to calculate the Rayleigh number.
L: Distance between processing surfaces [m], β: Volume thermal expansion coefficient [1 / K], g: Gravitational acceleration [m / s ² ]
ν: Kinematic viscosity [m ² / s], α: Temperature conductivity [(m ² / s)], ΔT: Temperature difference between processing surfaces [K]
ρ: Density [kg / m ³ ], Cp: Constant pressure specific heat [J / kg · K], k: Thermal conductivity [W / m · K]
T ₁ : Temperature on the high temperature side of the processing surface [K], T ₀ : Temperature on the low temperature side of the processing surface [K]

If the Rayleigh number when Benard convection begins to occur is the critical Rayleigh number Ra _C , the temperature difference ΔT _{C1 at} that time is obtained as follows.

The following formula was used to calculate the Marangoni number.
L: Distance between processing surfaces [m], ν: Kinematic viscosity [m ² / s], α: Temperature conductivity [(m ² / s)]
ΔT: Temperature difference between processing surfaces [K], ρ: Density [kg / m ³ ], Cp: Constant pressure specific heat [J / kg · K]
k: thermal conductivity [W / m · K], σ _t : surface tension temperature coefficient [N / m · K]
T ₁ : Temperature on the high temperature side of the processing surface [K], T ₀ : Temperature on the low temperature side of the processing surface [K]

When the Marangoni number at which Marangoni convection starts to occur is the critical Marangoni number Ma _C , the temperature difference ΔT _{C2 at} that time is obtained as follows.

  The material of the processing surface that is arranged so as to be able to approach and separate from each other and at least one rotates with respect to the other is not particularly limited, but is hardened to ceramics, sintered metal, wear-resistant steel, and other metals It can be made with a material that has been subjected to lining, a hard material with lining, coating, plating, or the like. In the present invention, the distance between the processing surfaces 1 and 2 that are disposed so as to be able to approach and separate from each other and at least one rotates with respect to the other is 0.1 μm to 100 μm, particularly 1 to 10 μm. preferable.

  Hereinafter, the present invention will be described in more detail with reference to acyclovir as an example. However, the present invention is not limited to this form.

  Acyclovir (generic name: JAN, INN) [chemical name: 9-[(2-hydroxyethoxy) methyl] guanine] is an antiviral agent having a purine skeleton and is caused by herpes simplex virus and varicella-zoster virus. Widely used clinically as a therapeutic agent for infectious diseases that develop, such as herpes simplex, chickenpox, herpes zoster, encephalitis, meningitis, etc. in patients with impaired immune function (malignant tumor, autoimmune disease, etc.) A compound. Acyclovir has low solubility in water at room temperature (approximately 0.001 w / v% to 0.01 w / v%), but the solubility increases by heating to 70 ° C. or higher, and it can be dissolved to approximately 8 w / v%. It becomes possible.

  This reaction is forcibly mixed uniformly between the processing surfaces 1 and 2 of the apparatus shown in FIG. 1 (A), which are arranged so as to be able to approach and separate from each other and at least one rotates relative to the other. It happens while.

  First, a cooling fluid containing an aqueous solvent having a temperature lower than that of the following second fluid as a first fluid is disposed to face each other so as to be able to approach and separate from the first introduction part d1 which is one flow path, and at least One is introduced between the processing surfaces 1 and 2 rotating with respect to the other, and a first fluid film, which is a thin film fluid composed of the first fluid, is formed between the processing surfaces.

  Next, a fluid containing at least one solution of acyclovir dissolved in water heated to 85 ° C. is made between the processing surfaces 1 and 2 as a second fluid from the second introduction part d2 which is a separate flow path. Directly into the first fluid film.

  As described above, the first fluid in the thin film fluid formed between the processing surfaces 1 and 2 whose distance is controlled by the pressure balance between the supply pressure of the fluid to be processed and the pressure applied between the rotating processing surfaces. The second fluid merges. The first fluid and the second fluid are mixed in the thin film fluid, and the temperature of the liquid mixture of the first fluid and the second fluid is less than 70 ° C., so that the liquid mixture is originally included in the second fluid. Acyclovir that had been deposited is precipitated. More specifically, when the temperature of the acyclovir solution decreases between the processing surfaces 1 and 2, the solubility of acyclovir in water decreases, and acyclovir fine particles can be precipitated. Since the thin film fluid between the processing surfaces 1 and 2 is forcibly uniformly mixed by the processing surfaces 1 and 2 that rotate at least one relative to the other, an interface is formed between the first fluid and the second fluid. Without being able to mix well, the change in solubility due to the temperature drop is made quickly.

  In addition, since it is sufficient that the above reaction (precipitation reaction) can be performed between the processing surfaces 1 and 2, the second fluid is introduced from the first introduction part d1 and the second introduction part d2 contrary to the above. The first fluid may be introduced more. In other words, the expressions “first” and “second” in each fluid have only an implication for identification that they are the nth of a plurality of fluids, and a third or higher fluid may exist.

  Moreover, the same fine particle raw material may be contained in both the first fluid and the second fluid.

  Control of the particle size, monodispersity, or crystal type of the fine particles obtained is controlled by the number of rotations of the processing surfaces 1 and 2, the distance between the processing surfaces 1 and 2, the flow rate, temperature, or raw material concentration of the thin film fluid Can be adjusted by changing.

There are no particular limitations on the particulate raw material used other than acyclovir as long as the solubility in the solution varies with temperature. At this time, even if the solubility curve with respect to temperature (solubility curve) increases when the temperature increases, the solubility increases with increasing temperature, such as calcium hydroxide or cesium sulfate in water. Can be implemented even if it falls. Furthermore, it can be carried out even when the solubility is maximized at a specific temperature (34.38 ° C. in this case), such as sodium sulfate. In the case of acyclovir, the cooling fluid is introduced as the first fluid . However, in the case of calcium hydroxide or cesium sulfate, the heating fluid may be introduced as the first fluid . In the case of sodium sulfate, for example, a cooling fluid and a heating fluid may be properly used at a specific temperature.

  Further, the solvent to be used is not particularly limited as in the case of the fine particle raw material. It can also be carried out using water, ion-exchanged water, ultrapure water, acidic or alkaline aqueous solvents, or organic solvents such as methanol, ethanol, and toluene. It can also be carried out using oils such as silicon oil, fats and oils containing unsaturated fatty acids, sunflower oil or industrial gear oil.

Further, since the cooling and heating are performed between the processing surfaces 1 and 2 as described above, the present invention can be carried out without using the temperature adjusting fluid such as the cooling fluid or the heating fluid. In that case, at least one of the first processing unit 10 and the second processing unit 20 is provided with temperature control mechanisms (temperature control mechanisms) J1 and J2, and a fine particle raw material solution whose solubility changes with temperature change is provided. The fine particles may be deposited between the processing surfaces 1 and 2 by directly adjusting the temperature between the processing surfaces using the temperature control mechanism.
The temperature control mechanism is not particularly limited, but when cooling is intended, the processing units 10 and 20 are provided with a cooling unit. Specifically, a cooling element capable of electrically or chemically cooling action such as piping for passing ice water or various refrigerants as a temperature control medium or a Peltier element is attached to the processing units 10 and 20.
When heating is intended, the processing parts 10 and 20 are provided with heating parts. Specifically, a heating element that can generate heat electrically or chemically, such as steam as a temperature control medium, piping for passing various heating media, or an electric heater is attached to the processing units 10 and 20. .
Moreover, you may provide the accommodating part for new temperature control media which can be in direct contact with the process part in a ring accommodating part. Accordingly, the temperature of the processing surface can be controlled using the heat conduction of the processing portion. In addition, by embedding a cooling element or a heating element in the processing parts 10 and 20 and energizing it, or by embedding a passage for passing a cooling / heating medium and passing a temperature adjusting medium (cooling / heating medium) through the passage, it is used for processing from the inside. The surface can also be temperature controlled. Note that the temperature control mechanisms J1 and J2 shown in FIG. 25 are an example thereof, and are pipes (jackets) through which the temperature control medium provided in the processing units 10 and 20 is passed.
Further, the present invention can be carried out by immersing the entire processing units 10 and 20 in a temperature control fluid. For example, the processing parts 10 and 20 are accommodated in a container, and the temperature between the processing part and the processing surface is directly controlled by introducing a temperature adjusting fluid into the container.
Further, such a mechanism can be used in combination even when a temperature adjusting fluid is used as the second fluid.

  Moreover, even if it contains surfactant in at least any one of the to-be-processed fluids to mix, such as said 1st fluid and 2nd fluid, it can implement.

The surfactant to be used is not particularly limited, whether it is a known surfactant or a newly synthesized surfactant, but it has good solubility in the solution, and the precipitated fine particles are dissolved in the solution. Various surfactants that can be well dispersed in the resin can be used. Various cationic surfactants, anionic surfactants and nonionic surfactants, sodium dodecylbenzenesulfonate, sodium dodecyl sulfate, sodium tetradecyl sulfate, sodium pentadecyl sulfate, sodium octyl sulfate, sodium oleate, lauryl Sodium acid, sodium stearate, calcium stearate, sucrose fatty acid ester, Tween 20 and Tween 80 (these are polyoxyethylene sorbitan fatty acid esters available from ICI Specialty Chemicals), polyvinylpyrrolidone, tyloxapol, Pluronic F68 And F108 (these are block copolymers of ethylene oxide and propylene oxide available from BASF Tetronic 908 (T908) (which is a tetrafunctional block copolymer derived from the continuous addition of ethylene oxide and propylene oxide to ethylenediamine, available from BASF), dextran, lecithin, aerosol ( Aerosol) OT (which is a dioctyl ester of sodium sulfosuccinate, available from American Cyanamid), Duponol P (which is sodium lauryl sulfate, available from DuPont), Triton X- 200 (this is an alkylaryl polyether sulfonate available from Rohm and Haas), Carbowax 3350 and 93 (These are polyethylene glycols available from Union Carbide), Crodesta F-110 (which is a mixture of sucrose stearate and sucrose distearate available from Croda Inc.) , (which can be obtained from Croda Inc.) Kurodesuta 5L-40, and SA90HCO _{[This, C 18 H 37 CH 2 -} (CON (CH 3) CH 2 (CHOH) 4 CH 2 OH) is a _2] and the like Is mentioned. What is necessary is just to use properly according to the target fine particle.

  Further, the processing surfaces may be heated (heated), ultraviolet light (UV) may be irradiated between the processing surfaces, or ultrasonic energy may be applied between the processing surfaces. In particular, when a temperature difference is provided between the first processing surface 1 and the second processing surface 2, convection can be generated in the thin film fluid, which has the advantage that the reaction can be promoted. is there.

  More specifically, with regard to heating (heating), as already described above, for example, a thin film fluid is heated (for example, by providing a jacket through which a heater or a heating medium is passed to at least one of the processing units 10 and 20 ( Heating). In addition, for irradiating ultraviolet rays (UV), for example, an element such as a lamp for irradiating ultraviolet rays is provided on at least one of the processing units 10 and 20, and ultraviolet rays (UV) are applied to the thin film fluid from the corresponding processing surfaces. Be able to irradiate. In addition, regarding the application of ultrasonic energy, for example, an ultrasonic oscillator can be provided in at least one of the processing units 10 and 20.

  Further, the precipitation reaction for precipitating the fine particles is carried out in a container capable of securing a reduced pressure or a vacuum state, and at least the secondary side from which the fluid to be treated is discharged after the reaction is set to a reduced pressure or a vacuum state. The gas to be treated and the gas contained in the fluid to be treated can be degassed or the solvent to be treated can be removed. As a result, even when the solvent removal treatment is performed almost simultaneously with the precipitation treatment, the fluid containing the fine particles precipitated between the treatment surfaces is discharged in a sprayed state from the treatment surfaces. There is an advantage that the solvent removal efficiency is very high. Therefore, it is possible to carry out the fine particle preparation process and the solvent removal process in substantially one step more easily than before.

  Thus, a suspension in which fine particles having an average particle diameter of 0.5 to 10,000 nm, preferably 1 to 500 nm, more preferably 10 to 200 nm are dispersed can be prepared. Further, when the above-mentioned surfactant is added to a solution containing the raw material for fine particles, a suspension in which fine particles having a dispersant coordinated on the surface can be prepared. Dispersibility is very good. In addition, there is little contamination with foreign matter in the manufacturing process, and the crystallinity can be controlled to be high when crystals are precipitated.

  In addition to the first introduction part d1 and the second introduction part d2, as described above, the third introduction part d3 can be provided in the processing apparatus. In this case, for example, from each introduction part, temperature control The fluid, the solution containing the fine particle raw material, and the surfactant can be separately introduced into the processing apparatus. If it does so, the density | concentration and pressure of each fluid can be managed separately, and the reaction which microparticles | fine-particles produce | generate can be controlled more precisely. The same applies to the case where the fourth or more introduction portions are provided, and the fluid to be introduced into the processing apparatus can be subdivided in this way.

  EXAMPLES Hereinafter, although an Example is hung up and demonstrated in more detail, this invention is not limited only to these Examples.

  In the following embodiments, “from the center” means “from the first introduction part d1” of the processing apparatus shown in FIG. 1A, and the first fluid is the above-mentioned first fluid. 1 refers to the fluid to be treated, and the second fluid refers to the above-described second fluid to be treated that is introduced from the second introduction portion d2 of the treatment apparatus illustrated in FIG.

  As shown in FIG. 1 (A), in a thin film fluid formed between processing surfaces 1 and 2 that have approaching and separating processing surfaces arranged opposite to each other and at least one of which rotates relative to the other. Then, the acyclovir aqueous solution at 85 ° C. is cooled in a thin film fluid by using a reactor that uniformly diffuses, agitates, and mixes to precipitate acyclovir.

Example 1
A 5% Tween 80 aqueous solution is fed from the center as a first fluid at a supply pressure / back pressure = 0.15 MPa / 0.01 MPa, a rotation speed of 500 rpm, a liquid feed temperature of 15 ° C., and a 85% 3% acyclovir aqueous solution is second. The fluid was introduced between the processing surfaces at 10 mL / min. The first fluid and the second fluid were mixed in the thin film fluid, and the acyclovir fine particle dispersion solution was discharged from the processing surface. The temperature of the discharged liquid was 48 ° C.

  When the particle size distribution of the acyclovir fine particles was measured using a particle size distribution measuring apparatus (trade name: Microtrac UPA150 manufactured by Nikkiso Co., Ltd.) applying the laser Doppler method, the average particle diameter was 88.6 nm.

  Furthermore, the powdery acyclovir fine particles obtained by freeze-drying the acyclovir dispersion solution are again poured into ion-exchanged water and stirred with a high-speed stirring type disperser (trade name: Claremix, manufactured by M Technique). As a result, an acyclovir fine particle dispersion was obtained again, and the average particle size was the same as that before vacuum freeze-drying, and the average particle size was 88.1 nm. It was confirmed that the obtained acyclovir fine particle powder had good redispersibility.

  For Examples 2 to 4, an acyclovir fine particle dispersion and an acyclovir powder were obtained using the same Tween 80 aqueous solution and acyclovir aqueous solution as in Example 1 and changing the rotational speed, supply pressure, and back pressure.

(Comparative example)
A 4% Tween 80/2% acyclovir aqueous solution was heated to 85 ° C. with stirring to dissolve acyclovir. Next, the solution was cooled to 48 ° C. while stirring using Claremix (M Technique Co., Ltd.) to form an acyclovir fine particle dispersion. At this time, the number of rotations of CLEARMIX was 20000 rpm. An acyclovir fine particle dispersion having an average particle size of 1340 nm was obtained. Further, the redispersibility was confirmed in the same manner as in the Examples, but after redispersion, the particle diameter became 3800 nm, and the particles were aggregated more strongly than before vacuum lyophilization.

  The results are shown in Table 1.

  The energy drop rate required to produce the acyclovir fine particles is about 1/200 in Example 1 of the present invention, about 1/24 in Examples 2 and 3 and 3 in Example 4 compared to the comparative example. It became 1 / min. From this, it was found that although the preparation method of the example can produce finer particles than the comparative example, it is excellent in energy efficiency.

  The results are shown in Table 2.

(A) is a substantially longitudinal cross-sectional view which shows the concept of the apparatus used for implementation of this invention, (B) is a general | schematic longitudinal cross-sectional view which shows the concept of other embodiment of the said apparatus, (C) is the said It is a schematic longitudinal cross-sectional view which shows the concept of other embodiment of an apparatus, (D) is a general | schematic longitudinal cross-sectional view which shows the concept of further another embodiment of the said apparatus. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A) is the principal part schematic bottom view of the apparatus shown in FIG.2 (C), (B) is the principal part schematic bottom view of other embodiment of the said apparatus, (C) is another implementation. FIG. 4D is a schematic bottom view showing the concept of still another embodiment of the apparatus, and FIG. 4E is a concept of still another embodiment of the apparatus. (F) is a schematic bottom view showing the concept of still another embodiment of the above apparatus. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A)-(C) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A)-(D) are the substantially longitudinal cross-sectional views which respectively show the concept of other embodiment of the apparatus shown in FIG. (A) And (B) is a substantially longitudinal cross-sectional view which respectively shows the concept of other embodiment of the apparatus shown in FIG. 1, (C) is a principal part outline of the apparatus shown in FIG. 1 (A). It is a bottom view. (A) is a principal part schematic longitudinal cross-sectional view which shows other embodiment about the pressure receiving surface of the apparatus shown to FIG. 1 (A), (B) is a principal part abbreviation of other embodiment of the said apparatus. It is a longitudinal cross-sectional view. It is a principal part general | schematic longitudinal cross-section of other embodiment about the contact surface pressure provision mechanism 4 of the apparatus shown to FIG. 12 (A). It is a principal part general | schematic longitudinal cross-sectional view of other embodiment which provided the jacket for temperature adjustment in the apparatus shown to FIG. 12 (A). It is a principal part general | schematic longitudinal cross-sectional view of further another embodiment about the contact surface pressure provision mechanism 4 of the apparatus shown to FIG. 12 (A). FIG. 12A is a schematic cross-sectional view of an essential part of still another embodiment of the apparatus shown in FIG. 12A, and FIGS. 12B, 12C, and 12E are other embodiments of the apparatus. It is a principal part general | schematic cross-sectional view of a form, (D) is a partially notch principal part schematic longitudinal cross-sectional view of other embodiment of the said apparatus. It is a principal part schematic longitudinal cross-sectional view of further another embodiment of the apparatus shown to FIG. 12 (A). (A) is a general | schematic longitudinal cross-sectional view which shows the concept of other embodiment of the apparatus used for implementation of this invention, (B) is a partial notch principal part explanatory drawing of the said apparatus. (A) is a top view of the 1st process part of the apparatus shown to FIG. 18 (A), (B) is the principal part longitudinal cross-sectional view. (A) is a longitudinal cross-sectional view of the main part of the first and second processing parts of the apparatus shown in FIG. 18 (A), and (B) is a view of the first and second processing parts with a minute gap therebetween. It is a principal part longitudinal cross-sectional view. (A) is a top view of other embodiment of the said 1st process part, (B) is the principal part general | schematic longitudinal cross-sectional view. (A) is a top view of further another embodiment of the said 1st process part, (B) is the principal part general | schematic longitudinal cross-sectional view. (A) is a top view of other embodiment of the 1st processing part, (B) is a top view of other embodiment of the 1st processing part. (A) (B) (C) is explanatory drawing which shows embodiment other than the above about the separation method of the to-be-processed object after a process, respectively. It is the schematic of the longitudinal cross-section for demonstrating the outline | summary of the apparatus of this invention. (A) is a schematic plan view of a first processing surface of the apparatus shown in FIG. 25, and (B) is an enlarged view of a main part of the first processing surface of the apparatus shown in FIG. (A) is sectional drawing of a 2nd introduction part, (B) is a principal part enlarged view of the processing surface for demonstrating a 2nd introduction part. (A) And (B) is a principal part expanded sectional view for demonstrating the inclined surface (pressure receiving surface) provided in the part for processing, respectively. It is a figure for demonstrating the pressure receiving surface provided in the process part, (A) is a bottom view of the 2nd process part, (B) is the principal part expanded sectional view of the 1st and 2nd process part. is there.

DESCRIPTION OF SYMBOLS 1 1st processing surface 2 2nd processing surface 10 1st processing part 11 1st holder 20 2nd processing part 21 2nd holder J1, J2 Temperature control mechanism

Claims (7)

Two or more kinds of fluids to be processed containing at least one of the particulate raw materials are disposed so as to face each other so as to be able to approach and separate, and at least one of the fluids is rotated between at least two processing surfaces rotating with respect to the other. Introduced into a thin film fluid, the thin film fluid is cooled or heated (heated) to change the saturation solubility, thereby precipitating fine particles.
At least any one of the two or more types of fluids to be processed passes between the processing surfaces while forming the thin film fluid,
A separate introduction path independent of the flow path through which at least one of the fluids to be treated flows is provided;
At least one of the at least two processing surfaces includes at least one opening leading to the introduction path,
At least one kind of fluid to be treated, which is different from at least one kind of fluid to be treated, is introduced between the processing surfaces through the opening and joined with the thin film fluid. ,
The two or more kinds of fluids to be treated are uniformly mixed in the thin film fluid, and the fine particle material contained in at least one of the fluids to be treated is different from the fluid to be treated. A method for producing fine particles, characterized in that the fine particles are precipitated by being uniformly mixed with the fluid in the thin film fluid . At least two kinds of fluids are used as the fluid to be treated.
Among them, at least one type of fluid contains at least one type of particulate raw material,
Among the fluids to be treated other than the above, at least one type of fluid has a temperature difference with respect to the fluid containing the fine particle raw material,
In the thin film fluid, the fluids to be treated are joined in a thin film fluid that is disposed so as to be able to approach and separate from each other and at least one of the processing surfaces rotates with respect to the other. The method for producing fine particles, characterized in that the fine particles are precipitated by utilizing a change in saturation solubility due to a temperature change of the fluid containing the fine particle raw material. A fluid pressure application mechanism for applying pressure to the fluid to be treated;
At least two processing parts of the first processing part and the second processing part that is relatively close to and away from the first processing part; and
A rotation drive mechanism that relatively rotates the first processing unit and the second processing unit,
In each of the above processing portions, at least two processing surfaces of a first processing surface and a second processing surface are provided at positions facing each other,
Each of the processing surfaces constitutes a part of a sealed flow path through which the fluid to be processed to which the pressure is applied flows.
At between the processing surfaces of the, including particulate material to at least one, two or more processed fluids are uniformly mixed is intended to reaction,
Of the first processing portion and the second processing portion, at least the second processing portion includes a pressure receiving surface, and at least a part of the pressure receiving surface is configured by the second processing surface. ,
The pressure receiving surface receives a pressure applied to the fluid to be processed by the fluid pressure applying mechanism and generates a force to move the second processing surface away from the first processing surface.
The fluid to be treated is passed between the first processing surface and the second processing surface that are capable of approaching / separating and rotating relatively, so that the fluid to be treated is Passing between both processing surfaces while forming a thin film fluid with a thickness equal to or less than the distance between the processing surfaces,
Furthermore, it has a separate introduction path independent of the flow path through which the fluid to be treated to which the pressure is applied flows.
At least one of the first processing surface and the second processing surface includes at least one opening leading to the introduction path,
At least one fluid to be treated sent from the introduction path is introduced between the processing surfaces, and at least the fine particle raw material contained in each of the fluids to be treated, and the material to be treated. 3. The method for producing fine particles according to claim 2 , wherein the treated fluid different from the treated fluid is uniformly mixed in the thin film fluid to cause the fine particles to precipitate . A fluid pressure application mechanism for applying pressure to the fluid to be treated;
At least two processing parts of the first processing part and the second processing part that is relatively close to and away from the first processing part; and
A rotation drive mechanism that relatively rotates the first processing unit and the second processing unit,
In each of the above processing portions, at least two processing surfaces of a first processing surface and a second processing surface are provided at positions facing each other,
Each of the processing surfaces constitutes a part of a sealed flow path through which the fluid to be processed to which the pressure is applied flows.
Of the first processing portion and the second processing portion, at least the second processing portion includes a pressure receiving surface, and at least a part of the pressure receiving surface is configured by the second processing surface. ,
The pressure receiving surface receives a pressure applied to the fluid to be processed by the fluid pressure applying mechanism and generates a force to move the second processing surface away from the first processing surface.
The fluid to be treated is passed between the first processing surface and the second processing surface that are capable of approaching / separating and rotating relatively, so that the fluid to be treated is 2. The method for producing fine particles according to claim 1, wherein a thin film fluid having a thickness equal to or smaller than a distance between the processing surfaces is passed between the processing surfaces. The method for producing fine particles according to any one of claims 1 to 4 , wherein a surfactant is contained in at least one kind of fluid among the fluids to be treated. In the method for producing fine particles, the space between the processing surfaces is heated (heated), the ultraviolet rays (UV) are irradiated between the processing surfaces, or ultrasonic energy is applied between the processing surfaces. The manufacturing method of the microparticles | fine-particles in any one of Claims 1-5 . The above reaction is performed by performing a precipitation reaction for depositing the fine particles in a container that can ensure a reduced pressure or a vacuum state, and at least a secondary side from which the fluid to be treated is discharged after the reaction is set to a reduced pressure or a vacuum state. The fine particles according to any one of claims 1 to 6 , wherein the gas generated therein and the gas contained in the fluid to be treated can be degassed or the solvent can be removed from the fluid to be treated. Production method.