JP4983394B2 - Imprint device - Google Patents

Description

  The present invention relates to an imprint apparatus for transferring a fine pattern formed on a mold surface to a molded object, and more specifically, an imprint apparatus capable of continuously releasing a molded object to which a pattern is transferred. About.

  In recent years, nanoimprint technology has been attracting attention because it has developed press working technology used for mass production technology such as optical discs and has further improved its resolution. Nanoimprint technology uses an electron beam lithography system to pattern a desired fine shape on the surface of a substrate such as Si, and then etch it to create a mold and transfer the fine shape on the mold surface to the workpiece. Therefore, even nanostructures of the 10 nm level can be produced at low cost, and high aspect pattern transfer is possible, so that application development to the formation of semiconductor elements, optical elements, or nanostructure materials has been attempted.

  In such nanoimprint technology, a thermoplastic resin is used as a molding object, a thermal nanoimprint that transfers the pattern of the mold surface by raising the temperature during transfer, a photocurable resin is used as the molding object, and the mold surface is photocurable resin An optical nanoimprint or the like has been proposed in which a pattern is transferred by irradiating an ultraviolet ray to deform and then curing the resin by irradiating ultraviolet rays.

  Incidentally, one of the problems in the nanoimprint technology is an improvement in throughput. This is because it is required to produce a large number of molded objects on which the fine shape of the mold surface is transferred. In particular, in order to improve this throughput, it is necessary to quickly release the molding object onto which the fine shape has been transferred from the mold surface in the releasing step after the transfer is completed.

  Conventionally, Patent Document 1 proposes a technique for facilitating release of a molded body by applying fine vibrations to a mold by high frequency, ultrasonic waves, or the like at the time of mold release.

Further, in Patent Document 2, in the manufacture of a semiconductor integrated circuit in which an ultraviolet curable resin on a wafer is patterned by nanoimprint, an actuator is provided inside the mold, and the actuator is operated at the time of mold release, thereby deliberately setting the mold release start point. There has been proposed a technique for speeding up the mold release operation.
JP 2007-19451 A JP 2007-81048 A

  When a thin plate-like resin molded product such as a wave plate using structural birefringence, which is an optical element, is manufactured as a molded body, the molded body resin is patterned on a wafer as disclosed in Patent Document 2. Unlike the case of manufacturing a semiconductor integrated circuit, there may be no means for fixing the object to be molded.

  In this case, even if the mold is moved from the molded body at the time of mold release, the molded body remains attached to the mold surface and cannot be released naturally. For this reason, the process of forcibly peeling the to-be-molded body from the mold surface is required.

  However, as disclosed in Patent Document 1, there is a problem that the object to be molded cannot be quickly peeled off from the mold surface to the extent that slight vibration is applied to the mold. This is because when the fine shape to be transferred is a large number of deep groove-like patterns, a large frictional force and adhesion force act between the mold and the molded body, making it more difficult to peel off the molded body.

  Further, in the technique disclosed in Patent Document 2, a mold release start point can be formed at the time of mold release, but the molded body is not fixed at all even if the mold is lifted away from the molded body. In this case, the molded object is still attached to the mold surface, and the molded object cannot be quickly peeled off from the mold surface, and the throughput cannot be improved.

  Therefore, the present invention provides an imprint apparatus that can easily and quickly peel off a thin plate-shaped object that remains attached to the mold surface at the time of mold release, and can improve throughput. This is the issue.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

  According to the first aspect of the present invention, the mold is pressed against the surface of the molded body by relatively moving a mold having a pattern formed on the surface and a thin plate-shaped molded body made of resin, and the mold surface An imprint apparatus comprising: transfer means for transferring the pattern of the mold to the surface of the molded body; and mold release means for releasing the molded body that remains attached to the mold surface after transfer, The mold release means includes a long tape having an adhesive region on the surface and a support member that supports the back surface of the long tape, and the mold and the mold release means are relative to each other when the molded body is released. The adhesive area on the surface of the long tape is brought into contact with the back surface of the object to be molded attached to the surface of the mold so that the object to be molded is adhered to the adhesive area on the surface of the long tape. After the holding, the mold and the release means are combined. By to be moved away, a imprint apparatus for causing peeling the molded body from the mold surface.

  According to a second aspect of the present invention, in the imprinting apparatus according to the first aspect, the mold releasing unit makes the adhesive region on the surface of the long tape contact the back surface outside the transfer region of the molding target. It is.

  A third aspect of the present invention is the imprint apparatus according to the first or second aspect, wherein the width of the long tape is larger than the outer dimension of the molded body.

  The invention according to claim 4 is characterized in that the adhesive regions of the long tape are provided at regular intervals longer than the outer dimension of the molded body along the length direction of the long tape. The imprint apparatus according to claim 1, 2 or 3.

  The invention according to claim 5 is characterized in that the adhesive region of the long tape is provided in a narrow shape along the length direction of the long tape. It is an imprint apparatus.

  According to a sixth aspect of the present invention, the support member supports the back surface of the long tape so that the adhesive region on the surface of the long tape protrudes upward in a mountain shape, and the molded object is formed at the apex of the mountain shape. The imprint apparatus according to claim 1, wherein a contact portion with the body is formed.

  The invention according to claim 7 is characterized in that the support member includes a buffering means for buffering an impact when the surface of the long tape is brought into contact with the back surface of the molded body. It is an imprint apparatus.

  The invention according to claim 8 is characterized in that the releasing means includes a tape roll obtained by winding the long tape into a roll shape, and a feeding means for feeding the long tape from the tape roll. The imprint apparatus according to any one of claims 1 to 7, wherein after the peeling from the mold surface, the feeding means is operated to feed the long tape a predetermined distance.

  The invention according to claim 9 is characterized in that the releasing means comprises tension applying means for applying a predetermined tension to the long tape located between the tape roll and the feeding means. 8. The imprint apparatus according to 8.

  The invention according to claim 10 is the imprint according to any one of claims 1 to 9, wherein the releasing means includes a cutting means for cutting the long tape holding the molded body. Device.

  The invention according to claim 11 is characterized in that the mold release means is provided so as to be movable between a mold release operation position below the mold and a retracted position removed from the mold below. It is an imprint apparatus in any one of Claims 1-10.

  According to the present invention, it is possible to easily and quickly peel off a thin plate-shaped object that remains attached to the mold surface at the time of mold release, thereby improving the throughput.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic view showing an example of an imprint apparatus according to the present invention. In the figure, reference numeral 1 denotes a mold, and 2 denotes a workpiece to be pressed by the mold 1.

  The mold 1 is attached to the lower end of a press machine 5 that can be moved up and down along support pillars 4 and 4 erected from a base 3 by driving of a press motor (not shown).

On the surface (the lower surface in the drawing) of the mold 1, a fine pattern of nm order to be transferred to the molded body 2 is formed. As a material used for the mold 1, for example, Si, SiO ₂ , SiC, Ni, NiP, Al alloy, stainless steel, or the like can be used. Among these, Si, SiO ₂ , Ni, and NiP are preferable from the viewpoint of ease of application of a microfabrication method such as a semiconductor manufacturing method and electroforming.

  The molded object 2 is placed on the upper surface of a placing table 61 on a stage 6 provided on the base 3. The stage 6 is provided so as to be horizontally movable in the horizontal direction in the drawing along the guide rail 7 laid on the base 3 by driving a stage motor (not shown).

  Here, a thermal nanoimprint method is illustrated in which a thermoplastic resin is used as the molded body 2 and a fine pattern in the order of nm formed on the surface of the mold 1 is transferred by raising the temperature during transfer. Therefore, a heater (not shown) is provided inside or near the mold 1 so that the mold 1 can be heated to a predetermined temperature.

  As shown in FIG. 7, the molded body 2 is made of a thin plate-like thermoplastic resin having a larger area than the pattern region 11 formed on the surface of the mold 1. Here, although the to-be-molded body 2 having a circular shape in a plan view is illustrated, it is not necessarily limited to a circular shape. The molded body 2 is placed without being fixed to the upper surface of the placement table 61.

  Similarly, on the stage 6, a mold release device 8 for peeling and forcibly releasing the molded body 2 that remains attached to the surface of the mold 1 after the transfer is next to the mounting table 61. It is installed side by side.

  Details of the release device 8 are shown in FIG. The mold release device 8 has a long tape 81 for contacting and holding the molded body 2 attached to the surface of the mold 1 at the time of mold release. The long tape 81 includes an adhesive layer 81a made of an adhesive on the surface that comes into contact with the molded body 2.

  Examples of the adhesive used for the adhesive layer 81a include acrylic adhesives and urethane adhesives. Especially, an acrylic adhesive is preferable at the point which is excellent in adhesive force.

  Further, the adhesive force of the adhesive layer 81a is a frictional force that acts between the mold 1 and the molded body 2 when the molded body 2 is peeled from the mold 1 after the molded body 2 is held by the adhesive force. The molded body 2 can be peeled off from the mold 1 while being adhered to the surface of the long tape 81, and after being peeled from the mold 1, the molded body 2 can be easily removed from the long tape 81. It must have an adhesive strength that can be peeled off.

  The long tape 81 is wound around the tape roll 82 so that the adhesive layer 81a is on the outer surface side, and the leading end side is sandwiched between a pair of delivery rollers 83, 84, and is directed rightward in the drawing from the tape roll 82. It is to be sent out.

  The long tape 81 may have a release paper layer for protecting the adhesive layer 81a on the surface of the adhesive layer 81a. In this case, from the long tape 81 immediately after being fed out from the tape roll 82, It is preferable to provide a release paper take-up roller (not shown) for peeling off and releasing the release paper layer.

  In the pair of delivery rollers 83 and 84 that sandwich the long tape 81, one delivery roller 83 is a drive roller that is rotated by the drive of a delivery motor (not shown), and the other delivery roller 84 is a driven roller.

  Of the pair of delivery rollers 83, 84, at least the delivery roller 83 located on the adhesive layer 81 a side of the long tape 1 is a pair of rollers 83 a, 83 a arranged at intervals in the width direction of the long tape 81. The roller 83a connects the rollers 83a and 83a.

  As shown in FIG. 3, the width L1 of the long tape 81 is formed larger than the outer diameter L2 of the molded body 2, and the rollers 83 a and 83 a are held on the surface of the long tape 81. The side edges 81b and 81b located on both sides of the molded body 2 are in contact with each other. Accordingly, the delivery roller 83 is shaped so as to straddle the workpiece 2 held on the surface of the long tape 81 when the long tape 81 is delivered.

  Between the tape roll 82 and the delivery rollers 83 and 84, a support member 85 that supports the back surface of the long tape 81 located between the tape roll 82 and the delivery rollers 83 and 84 pushes the long tape 81 upward so as to protrude in a mountain shape. Projected. As a result, the long tape 81 is spanned from the tape roll 82 via the tip of the support member 85 so as to be formed in a chevron shape with the support member 85 as the apex between the feed rollers 83 and 84. ing.

  The support member 85 has the same width as or longer than the long tape 81, and can be formed of synthetic resin, metal, rubber, or the like. In particular, it is preferable that at least the tip side is formed of an elastic body such as a soft rubber in order to reduce an impact at the time of contact with the molded body 2. The front end forms a gentle arc surface along the feed direction of the long tape 81, and the adhesive region on the surface of the long tape 81 pushed up by the front end of the support member 85 is molded at the time of mold release. The contact portion 81c is in contact with the body 2.

  The support member 85 is housed in a housing chamber 86 formed in the upper part of the mold release device 8 so as to be vertically movable, and is always urged upward by a spring 87. For this reason, when the contact portion 81c of the long tape 81 formed by the support member 85 comes into contact with the molded body 2 attached to the surface of the mold 1, the spring 87 functions as a buffer, and the molded body. The impact given to 2 is relieved.

  When the feeding is stopped, the tape roll 82 is applied with a predetermined rotational torque by a tape roll motor (not shown) so as to be in a direction opposite to the feeding direction of the long tape 81 (counterclockwise in the figure). It has become. The delivery rollers 83 and 84 are provided so as not to rotate in the direction opposite to the delivery direction of the long tape 81 while a delivery motor (not shown) is stopped. For this reason, when the feed rollers 83 and 84 are stopped, the tape roll motor applies a predetermined rotational torque to the tape roll 82, thereby applying a predetermined tension to the long tape 81. Yes.

  A cutter 88 for cutting the long tape 81 is provided on the outlet side of the feed rollers 83 and 84. When the cutting motor (not shown) is driven, the fed long tape 81 has a predetermined length. It comes to cut into.

  Next, operations of the transfer process and the release process in the imprint apparatus will be described with reference to FIGS.

  In the transfer process, the stage 6 on which the molding target 2 is placed on the upper surface of the mounting table 61 moves so that the molding target 2 is positioned directly below the mold 1 attached to the lower end of the press machine 5. Arranged. At this time, the mold release device 8 on the stage 6 is in the retracted position removed from the lower side of the mold 1 (FIG. 4A).

  Next, the press machine 5 is lowered by driving the press motor to lower the mold 1, and the fine pattern formed on the surface thereof is pressed against the molding body 2 with a predetermined pressing force.

  The mold 1 at this time is heated by driving and controlling the heater, and presses the molded body 2 and heats the molded body 2 so as to have a temperature equal to or higher than the glass transition temperature. By maintaining this state for a predetermined time, the molded body 2 is softened and melted, and the surface of the molded body 2 is deformed according to the pattern formed on the mold 1.

  Thereafter, with the pressed state maintained, the energization to the heater is stopped to cool and harden the molded body 2, and the pattern of the mold 1 is transferred to the molded body 2 (FIG. 4B). .

  After the transfer, when the press machine 5 is moved up to raise the mold 1, the molded body 2 is merely placed on the mounting table 61 and is not fixed at all. Due to the frictional force acting between the molded body 2 and the molded body 2, the molded body 2 remains attached to the surface of the raised mold 1 (FIG. 4C).

  In the mold release process, the stage motor is driven and controlled to move the stage 6 in the horizontal direction, and the mounting table 61 is moved to a position away from directly below the mold 1. 8 is moved so that it may be located just under the metal mold | die 1, and is arrange | positioned in a mold release operation | movement position (FIG. 5 (a)).

  The release operation position is a position where the contact portion 81c of the long tape 81 in the release device 8 is directly below the molding object 2 attached to the surface of the mold 1, and in particular, the long tape. The contact portion 81c of 81 is preferably at a position directly below the outside of the transfer region 21 of the molding 2.

  As shown in FIGS. 6 and 7, the molded body 2 is formed with a larger diameter than the pattern area 11 formed on the mold 1. 7 is a region that does not contact the pattern region 11 of the mold 1 and contacts the surface of the mold 1 outside the pattern region 11, and is formed on the outer edge side of the molded object 2 as indicated by the oblique lines in FIG. It has a donut shape so as to surround the pattern region 11 of the mold 1.

  The contact portion 81c of the long tape 81 is disposed directly below the outside of the transfer area 21 of the molded body 2, and is brought into contact with the back surface of the outside of the transfer area 21 as shown in FIG. Thus, it is possible to protect the pattern transferred to the molded body 2. The contact portion 81c of the long tape 81 may be brought into contact with a part of the back surface of the outside of the transfer region 21 of the molded body 2.

  After placing the release device 8 at the release operation position, when the press machine 5 is lowered and the mold 1 and the release device 8 are moved relatively close to each other, as shown in FIG. The contact portion 81c of 81 comes into contact with the back surface of the outside of the transfer region 21 of the molded body 2 and adheres the molded body 2 to the adhesive layer 81a. In this state, when the press machine 5 is moved up to raise the mold 1, the object 2 to be molded attached to the mold 1 is longer than the friction force between the mold 1 and the long tape 81. The adhesive layer 81a is peeled from the mold 1 due to the superior adhesive strength, and is held on the surface of the long tape 81 by the adhesive layer 81a (FIG. 5B).

  It is preferable that the mold release speed (here, the ascending speed of the mold 1) when the molded body 2 attached to the mold 1 is peeled is constant. When the mold release speed is disturbed, the thin plate-shaped body 2 may be wrinkled or distorted. Such a problem can be avoided by making the mold release speed constant.

  After the molded body 2 is peeled from the mold 1, the feed roller 83 is driven to feed the long tape 81 for a predetermined distance, and the adhesive layer 81 a of the new long tape 81 is disposed on the support member 85. In the mold release step (FIG. 5C). The feeding distance of the long tape 81 is a distance that is at least equal to or greater than the outer diameter of the molded body 2.

  Thereafter, the stage 6 is moved to move the mold release device 8 to the retracted position removed from the lower side of the mold 1 to prepare for the next transfer step (FIG. 4A).

  In this way, by using the mold release device 8 having the long tape 81 having the adhesive region on the surface, the mold 1 and the mold release device 8 are moved relatively close to each other and moved away from each other, so that the mold after transfer. The to-be-molded body 2 that remains attached to the surface of 1 can be easily and quickly released. Since the molded body 2 after being released is still held by the adhesive layer 81a of the long tape 81, the molded body 2 is not separated and can be stored and managed easily.

  Moreover, since the width | variety of the long tape 81 is larger than the outer diameter dimension of the to-be-molded body 2, the back surface of the to-be-molded body 2 after mold release can be protected.

  Furthermore, since the mold release device 8 can form the contact portion 81c with a new adhesive region by feeding the long tape 81 by a predetermined distance after the mold release, the mold release 2 can be continuously released. Each time one molded body 2 is released, there is no need for troublesome work such as taking out the molded body 2 from the mold release device 8 in order to prepare for the next mold release.

  The fed long tape 81 is cut by operating the cutter 88. Although the long tape 81 can be cut individually for each molded body 2, it is also preferable that the long tape 81 is cut for each of a plurality of release processes. By cutting the long tape 81 for each of the plurality of molded bodies 2, the plurality of molded bodies 2 can be held on one long tape 81. Can be handled in a lump, and storage and management can be further facilitated.

  In the transfer process and the release process shown in FIGS. 4 and 5, the mold 6 is moved up and down on the press machine 5 side while the stage 6 provided with the mounting table 61 and the release device 8 is not moved during each process. 1 is moved up and down, but the contacting and separating operation between the mold 1 at the time of transfer and the mounting table 61 on which the workpiece 2 is mounted and the length of the mold 1 and the mold release device 8 at the time of releasing are as follows. The contact / separation operation with the tape 81 may be any relative, and the transfer step and the release step may be performed by moving the stage 6 side up and down without moving the mold 1.

  Further, in the mold release step, the molded body 2 is peeled from the mold 1 in a state in which the feeding operation of the long tape 81 is stopped. However, as shown in FIG. When the rear end portion 22 in the direction along the feeding direction of the long tape 81 in the molding target 2 is held in contact with the workpiece 81 c and the molding target 2 is peeled off from the mold 1, the separating operation with respect to the mold 1 is performed. Linking and controlling the operation to feed the long tape 81 by operating the feed roller 83 and / or horizontally moving the stage 6 in the same direction as the direction along which the long tape 81 is fed. It is also preferable to control the operation.

  The natural peeling operation when the molded object 2 attached to the mold 1 is separated from the rear end part 22 is that the rear end part 22 of the molded object 2 is separated from the molded object 2 and the mold 1. The peeling operation of the molded body 2 in the case where the mold 1 is simply raised directly above the mold release device 8 is gradually peeled off so as to draw an arc centering on the peeling start point at which the mold starts. Since the rear end portion 22 of the molded body 2 is linearly separated from the mold 1 directly below, their operations do not necessarily match. However, the operation control is performed so that the long tape 81 is fed out by being linked to the separation operation with respect to the mold 1 in this way, and / or the stage 6 is horizontally moved in the same direction as the direction along which the long tape 81 is fed. By controlling the operation in such a manner, the peeling operation of the molded body 2 can be brought close to a natural peeling operation, and can be peeled without applying an excessive force to the molded body 2 at the time of mold release.

  The adhesive region on the surface of the long tape 81 in the release device 8 is not necessarily formed on the entire surface, and may be partially provided on the surface of the long tape 81. In this case, at the time of mold release, the part where the adhesive region is formed is positioned at the tip of the support member 85 to be the contact portion 81c.

  Thus, when providing an adhesion area | region partially, it can provide at fixed intervals along the length direction of the long tape 81. FIG. FIG. 8 shows an example of a mode in which the long tape 81 is provided at regular intervals along the length direction, and narrow adhesive layers 81d extending in the width direction of the long tape 81 are provided at intervals of L3. ing. This interval L3 is longer than the outer diameter L2 of the molded body 2.

  According to such a long tape 81, when the adhesive layer 81d is positioned at the tip of the support member 85 to form the contact portion 81c and the object to be molded 2 is adhered and held at the time of releasing, the long tape 81 is attached. Since the plurality of molded bodies 2 can be held and the molded body 2 is only partially held by the narrow adhesive layer 81d, the molded body 2 is removed from the long tape 81. The peeling work in the case of peeling becomes easy.

  In order to control the delivery of the long tape 81 so that each adhesive layer 81d is positioned at the front end of the support member 85, the driving amount (rotation amount or rotation time) of the delivery roller 83 is set so as to correspond to the interval between the adhesive layers 81d. In addition to the method for controlling (), a method for controlling the driving of the feed roller 83 by detecting the adhesive layer 81d using a detection sensor (not shown) can be employed.

  Moreover, when providing an adhesion area | region partially, it can also provide along the length direction of the long tape 81. FIG. FIG. 9 shows an example of a mode in which the adhesive layer 81 e is provided in a narrow width along the length direction of the long tape 81, and the adhesive layer 81 e that is sufficiently narrower than the width of the long tape 81. Is provided over the length direction of the long tape 81.

  One adhesive layer 81e is sufficient, and the one adhesive layer 81e is provided so as to be offset toward one end in the width direction of the long tape 81 so as to correspond to the outside of the transfer region 21 of the molded body 2. ing.

  Such a long tape 81 can also hold a plurality of molded bodies 2 on the long tape 81, and the molded body 2 is only held by a narrow adhesive layer 81d. The peeling work when peeling the molded body 2 from the long tape 81 is also easy.

  In the case of the long tape 81 shown in FIG. 9, the molded body 2 is held at a position near the end of the long tape 81 in the width direction. In order to increase the contact area between the layer 81e and the molded body 2, the contact portion 81c of the long tape 81 at the time of mold release is formed on the molded body 2 attached to the mold 1 as shown in FIG. It is preferable to contact the vicinity of the center X.

  In addition, as shown in FIG. 11, the tip shape of the support member 85 in this case supports the back surface of the adhesive layer 81 e of the long tape 81, but avoids the transfer area of the molded body 2. It is preferable that a recess 85a is formed in the corresponding central portion. As a result, even if the support member 85 is brought into contact with the substantially central portion of the molded body 2, the portion corresponding to the pattern transferred to the molded body 2 can be avoided by the concave portion 85 a, and thus transferred. Pattern can be protected.

Schematic showing an example of an imprint apparatus according to the present invention Schematic showing an example of a mold release device The perspective view which shows schematic structure of a delivery roller (A)-(c) is a figure which shows the transfer process of an imprint apparatus. (A)-(c) is a figure which shows the mold release process of an imprint apparatus. Side view showing a state in which a long tape is in contact with a molded object Plan view of the mold surface with the object to be molded attached The top view which shows the other aspect of the adhesion area | region of a long tape The top view which shows the other aspect of the adhesion area | region of a long tape. Side view showing a state in which the long tape is in contact with the vicinity of the center of the molded body The perspective view which shows the other aspect of a supporting member.

Explanation of symbols

1: Mold 11: Pattern area 2: Molded object 21: Outside transfer area 22: Rear end portion 3: Base 4: Support column 5: Press machine 6: Stage 61: Mounting table 7: Guide rail 8: Mold release Device 81: Long tape 81a: Adhesive layer 81b: Side edge portion 81c: Contact portion 81d: Adhesive layer 81e: Adhesive layer 82: Tape roll 83: Feed roller 83a: Roller 83b: Roller shaft 84: Feed roller 85: Support member 85a: Recess 86: Storage chamber 87: Spring 88: Cutter

Claims (11)

The mold is pressed against the surface of the molded body by relatively moving the mold with the pattern formed on the surface and the thin plate-shaped molded body made of resin, and the pattern on the surface of the molded body is An imprint apparatus comprising: transfer means for transferring to a surface; and mold release means for releasing the molding object that remains attached to the mold surface after transfer,
The mold release means includes a long tape having an adhesive region on the surface, and a support member that supports the back surface of the long tape,
At the time of releasing the molding object, the mold and the releasing means are moved relatively close to each other so that the adhesive region on the surface of the long tape adheres to the mold surface. The mold body is held in the adhesive area on the surface of the long tape by contacting the back surface, and then the mold and the release means are moved relatively apart to move the mold body to the mold surface. An imprint apparatus, wherein the imprint apparatus is peeled off.   The imprint apparatus according to claim 1, wherein the releasing means makes the adhesive region on the surface of the long tape contact the back surface outside the transfer region of the molding target.   The imprint apparatus according to claim 1 or 2, wherein a width of the long tape is larger than an outer dimension of the molded body.   The adhesive region of the long tape is provided at regular intervals longer than the outer dimension of the molded body along the length direction of the long tape. The imprint apparatus described.   The imprint apparatus according to claim 1, 2, or 3, wherein the adhesive region of the long tape is provided in a narrow shape along a length direction of the long tape.   The support member supports the back surface of the long tape so that the adhesive region on the surface of the long tape protrudes upward in a mountain shape, and forms a contact portion with the workpiece at the apex of the mountain shape. The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus.   The imprint apparatus according to claim 6, wherein the support member includes a buffer unit that cushions an impact when the surface of the long tape is brought into contact with the back surface of the molding target.   The release means includes a tape roll obtained by winding the long tape into a roll shape, and a feeding means for sending out the long tape from the tape roll, and after peeling the molding object from the mold surface, The imprint apparatus according to claim 1, wherein the feeding unit is operated to feed the long tape a predetermined distance.   9. The imprint apparatus according to claim 8, wherein the releasing means includes tension applying means for applying a predetermined tension to the long tape located between the tape roll and the feeding means.   The imprint apparatus according to claim 1, wherein the mold release unit includes a cutting unit that cuts the long tape holding the object to be molded.   The mold release means is provided so as to be movable between a mold release operation position below the mold and a retracted position removed from below the mold. The imprint apparatus described in 1.

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