JP4983081B2 - Film forming method, electro-optical substrate manufacturing method, electro-optical device manufacturing method, functional film, electro-optical substrate, and electro-optical device - Google Patents

Description

  The present invention relates to a film forming method for forming a functional film such as a light emitting film of an organic electroluminescence (hereinafter referred to as “organic EL”) device, a method for manufacturing an electro-optic substrate having the functional film, and The present invention relates to a method for manufacturing an electro-optical device having the functional film. The present invention also relates to a functional film, an electro-optical substrate, and an electro-optical device.

  Conventionally, as a technique for forming a functional film such as a light emitting film of an organic EL device or a color filter film of a color liquid crystal device, a liquid material containing a functional film material is applied and the liquid material is dried to form a functional film. The technology to do is known. Since the functional film has different characteristics depending on the thickness, a plurality of functional films formed in an organic EL device or the like that need to have the same function (characteristics) are required to have uniform thickness. . For the same reason, each functional film is required to have a uniform thickness in each part of the functional film. However, the functional film formed by drying the liquid material has a thick convex shape at the central portion and a thin concave shape at the central portion, so that the film thickness in the same functional film is not uniform, Due to variations in the concave shape, the film thickness may not be uniform between the functional films.

  For example, in a color filter film of a color liquid crystal device, a color filter film with a non-uniform film thickness differs in transmitted light amount from a color filter film with a uniform film thickness. However, it is different from the luminance of the pixel assuming a color filter film having a uniform film thickness. If the brightness of multiple pixels that make up the minimum unit of an image (hereinafter referred to as “picture element”) deviates from the assumed brightness, the brightness and color of the picture element differ from the brightness and color to be displayed. . When the film thickness is not uniform among a plurality of color filter films formed in one color liquid crystal device, luminance unevenness and color unevenness occur.

  In Patent Document 1, it is noted that the shape of the functional film depends on the drying speed when the functional film is formed by drying the liquid material, and the temperature of the liquid material (functional layer forming coating liquid) A method is disclosed in which the film thickness in the same functional film (functional layer) is made uniform by controlling the drying speed by adjusting.

JP 2004-327357 A

  However, since the drying speed is affected by the atmosphere during drying, it varies depending on the atmosphere in which the liquid material being dried is placed. In an organic EL substrate or the like on which a large number of functional films are formed on a single substrate, the concentration of the evaporated liquid material in the solvent atmosphere differs between the vicinity of the center of the substrate and the vicinity of the periphery. The drying speed of the functional film is different between the vicinity and the vicinity. As a result, the shape in the thickness direction of the functional film depending on the drying speed differs between the vicinity of the center of the substrate and the vicinity of the periphery, so that the film thickness varies between the functional films formed on one substrate. there were.

  In addition, when the functional film in the vicinity of the center of the substrate or in the vicinity of the periphery is adjusted so that the film thickness in the same functional film is uniform, the functional film in the other side has a convex shape or a concave shape. There was also a problem that a desirable functional film could not be formed. The method disclosed in Japanese Patent Application Laid-Open No. 2004-327357 uniformly controls the drying speed of a large number of liquid materials arranged on a substrate regardless of the atmosphere in which the substrate being dried is placed. The occurrence of variations in film thickness between functional films formed on one substrate cannot be solved, and the film thicknesses of a large number of functional films formed on a substrate cannot be made uniform.

  The present invention solves the above-described problems, suppresses variations in film thickness between functional films formed on one substrate, and reduces the thickness of each functional film formed on the substrate. It is an object of the present invention to realize a film forming method, an electro-optical substrate manufacturing method, and an electro-optical device manufacturing method capable of suppressing nonuniformity, and a functional film, an electro-optical substrate, and an electro-optical device.

  In the film forming method according to the present invention, a liquid material containing a material constituting the functional film is arranged in one or more functional film forming regions, which are regions to constitute the functional film on the substrate, and the liquid material is placed under a reduced pressure environment. A film forming method for forming a functional film by drying, comprising: a liquid material arranging step for filling a functional film forming region with a liquid material; and a dry mask having a mask hole formed at a position corresponding to the functional film forming region A mask installation step in which the mask hole is installed at a position facing the substrate with a gap therebetween, and a functional film is formed by drying the liquid material in a reduced pressure environment; and It is characterized by having.

  Since the functional film has different characteristics depending on the thickness, a plurality of functional films that are formed in the same device and need to have the same function (characteristic) are required to have the same film thickness. For the same reason, each functional film is required to have a uniform thickness in each part of the functional film.

  According to the film forming method of the present invention, the substrate is covered with a dry mask disposed at a position facing the substrate with a gap therebetween, and a mask hole is opened at a position facing the functional film forming region. . In vacuum drying, most of the atmosphere is a solvent evaporated from a liquid material. In the drying process in which reduced-pressure drying is performed, the atmosphere in the functional film formation region is a solvent evaporated from the liquid material filled in the functional film formation region, and the atmosphere almost composed of the solvent is diffused through the mask hole. . Since the positional relationship between the functional film forming region and the corresponding mask hole is substantially uniform in each functional film forming region on the substrate, the atmosphere of the liquid material that is filled in the functional film forming region and dried is on the substrate. Are substantially uniform in each functional film formation region. Thereby, the drying speed affected by the atmosphere during drying can be made substantially uniform in each functional film formation region. Accordingly, variation in film thickness between functional films formed on one substrate can be suppressed. Furthermore, by performing uniformization of the film thickness in one functional film, uniformization of the film thickness in all functional films formed on the substrate can be performed.

  In the present invention, in the film forming method, the dry mask is a central dry mask or a peripheral dry mask having different mask hole shapes, and the dry mask is not used without performing the mask installation process. Depending on the thickness of the functional film obtained when the drying process is performed, it is preferable to install a central dry mask or a peripheral dry mask in the mask installation process.

  According to this film formation method, since the central dry mask and the peripheral dry mask have different mask hole shapes, the drying process using the central dry mask and the dry process using the peripheral dry mask are different. The atmospheres of the liquid materials filled in the functional film forming region and dried are different from each other. As a result, the drying process using the central drying mask and the drying process using the peripheral drying mask differ in the drying speed of the liquid material filled in the functional film formation region, so the filled liquid material is the same. However, the shape in the film thickness direction of the formed functional film is different. As described above, the functional film preferably has a uniform thickness in each part of the functional film. The shape in the film thickness direction of the functional film formed by using the central dry mask or the peripheral dry mask according to the film thickness state of the functional film obtained when the drying process is performed without using the dry mask. Can be brought closer to a more uniform state.

  In the present invention, in the film forming method, the central dry mask has a central mask hole whose opening area is smaller than the area of the functional film formation region. It is preferable to install at a position where the center of the mask hole substantially overlaps.

  The liquid filled in the container moves so that the liquid level is kept horizontal. Similarly, the liquid material filled in one functional film formation region moves so that the liquid level remains horizontal during drying. In the part where the solvent is quickly dried, the liquid level is lowered because the amount of liquid is reduced rapidly, so that the liquid material flows into the fast part from the part where the drying is slow. In the portion where the drying is fast, the amount of solute increases because the liquid material is supplied where the concentration of the solvent is increased by evaporation. Thereby, in the functional film formed by drying, the portion where the solvent is quickly dried becomes thick.

  According to this film forming method, since the center of the functional film forming region and the center of the central mask hole are substantially overlapped, the central mask hole is disposed to face the substantially center of the functional film forming region. The solvent evaporated from the liquid material filled in the functional film formation region is diffused from the vicinity of the center of the functional film formation region through the central mask hole. In addition, since the opening area of the central mask hole is smaller than the area of the functional film formation region, the liquid material filled near the periphery of the functional film formation region is smaller than the liquid material filled near the center. The distance from becomes far. As a result, the solvent evaporated from the liquid material filled near the periphery is less likely to diffuse than the solvent evaporated from the liquid material filled near the center. Concentration increases. Therefore, the drying speed of the liquid material filled in the vicinity of the center of the functional film formation region can be made faster than that of the liquid material filled in the vicinity of the periphery. Thereby, the film thickness near the center can be adjusted in the direction of increasing the film thickness near the periphery.

  In the present invention, the film forming method is such that the planar shape of the central mask hole is substantially the same as the distance from the edge of the central mask hole to the planar external shape of the functional film forming region when the central dry mask is placed on the substrate. A uniform shape is preferable.

  According to this film formation method, the distance from the edge of the central mask hole to the outer periphery of the functional film formation region is substantially uniform, and the solvent evaporated from the liquid material filled near the periphery of the functional film formation region Is substantially uniform over the entire periphery of the functional film formation region. Thereby, the atmosphere can be made substantially uniform over the entire periphery of the functional film forming region, and the dried state can be made substantially uniform.

  In the present invention, in the film forming method, the peripheral dry mask has a peripheral mask hole composed of a plurality of small holes formed in the hole arrangement region. In the mask installation step, the peripheral dry mask forms the functional film in the hole arrangement region. It is preferable that the center of the hole arrangement region and the center of the functional film formation region are disposed at substantially overlapping positions.

  According to this film forming method, by forming a small hole of the peripheral mask hole in the hole arrangement region facing the functional film forming region, the solvent evaporated from the liquid material filled in the functional film forming region is removed from the peripheral mask hole. Diffused through a small hole. Thereby, the drying speed of the liquid material with which the position facing a small hole is filled can be made faster compared with the liquid material with which it filled other than the position facing a small hole. Thereby, the film thickness at the position facing the small hole can be adjusted in the direction of increasing the film thickness at the position other than the position facing the small hole.

  In the present invention, in the film forming method, it is preferable that the planar shape of the hole arrangement region is substantially the same as the planar shape of the functional film forming region.

  According to this film forming method, by forming a small hole in the peripheral mask hole at a position opposite to an arbitrary position in the functional film forming area, drying at an arbitrary position in the functional film forming area is faster than other positions. Can be adjusted. Thereby, the film thickness of the arbitrary position of a functional film formation area can be adjusted to the direction made thicker with respect to the film thickness of another position.

  In the present invention, in the film forming method, each of the plurality of small holes is preferably formed at a position inscribed in the outer shape line of the hole arrangement region. The outer shape line is an imaginary line and is a boundary between the hole arrangement area and an area other than the hole arrangement area.

  According to this film forming method, the small hole formed so as to be inscribed in the outer shape line faces the peripheral portion of the functional film forming region. By forming a small hole of the peripheral mask hole at a position opposite to the peripheral part of the functional film forming region, the solvent evaporated from the liquid material filled in the functional film forming region is removed from the peripheral part of the functional film forming region from the peripheral part. Diffused through the hole. The liquid material filled near the periphery of the functional film formation region is closer to the peripheral mask hole than the liquid material filled near the center. As a result, the solvent evaporated from the liquid material filled near the periphery is more easily diffused than the solvent evaporated from the liquid material filled near the center. The concentration becomes lighter. Therefore, drying of the liquid material filled near the periphery of the functional film formation region can be made faster than the liquid material filled near the center. As a result, the film thickness in the vicinity of the periphery can be adjusted to be thicker than the film thickness in the vicinity of the center.

  In the present invention, the film forming method is a function in which the film thickness on the peripheral side is larger than the film thickness on the central side when the drying process is performed without performing the mask setting process and without using the dry mask. In the case of a film, it is preferable to install a central dry mask in the mask installation step.

  The liquid filled in the container moves so that the liquid level is kept horizontal. Similarly, the liquid material filled in one functional film formation region moves so that the liquid level remains horizontal during drying. In the part where the solvent is quickly dried, the liquid level is lowered because the amount of liquid is reduced rapidly, so that the liquid material flows into the fast part from the part where the drying is slow. In the portion where the drying is fast, the amount of solute increases because the liquid material is supplied where the concentration of the solvent is increased by evaporation. Thereby, in the functional film formed by drying, the portion where the solvent is quickly dried becomes thick. According to this film forming method, when the functional film obtained when the drying process is performed without using a drying mask is a functional film in which the film thickness on the peripheral side is larger than the film thickness on the peripheral side, that is, on the peripheral side When the drying speed is faster than the central side, the central drying mask in which the central mask hole is formed in the central side is used in the drying process, so that the central side drying speed is adjusted to be faster than the peripheral side. Thus, the tendency that the film thickness on the peripheral side is thicker than the film thickness on the central side can be corrected, and the film thickness can be made closer to a uniform film thickness.

  In the present invention, the film formation method is a function in which the functional film obtained when the drying process is performed without performing the mask installation process and without using the dry mask is such that the film thickness on the peripheral side is thinner than the film thickness on the central side. In the case of a film, it is preferable to install a peripheral dry mask in the mask installation step.

  According to this film forming method, when the functional film obtained when the drying process is performed without using a drying mask is a functional film in which the film thickness on the peripheral side is thinner than the film thickness on the peripheral side, that is, on the peripheral side When the drying speed is slower than the central side, the peripheral drying mask having peripheral mask holes formed on the peripheral side is used in the drying process, so that the peripheral side drying speed is adjusted to be higher than the central side. Thus, it is possible to correct the tendency that the film thickness on the central side is thicker than the film thickness on the peripheral side, and to bring it closer to a uniform film thickness.

  The film forming method according to the present invention includes a liquid material disposed on a substrate by filling a liquid material containing a material constituting the functional film into one or more functional film forming regions which are regions to constitute the functional film on the substrate. The placement step and a dry mask having a plurality of mask holes formed at positions corresponding to the functional film formation region are placed at positions facing the substrate with a gap therebetween so that the mask holes face the functional film formation region. A drying step in which a liquid material is dried in a reduced pressure environment to form a functional film, and the drying mask is a mixed drying mask in which a plurality of types of mask holes having different shapes are formed. The type of mask hole corresponding to each functional film formation region is the same for each functional film formation region obtained when the drying process is executed without performing the mask installation process and without using the drying mask. Depending on the thickness of the state of the functional film, and determining.

  According to the film forming method of the present invention, the atmospheres of the liquid materials filled in the functional film forming region and dried are different from each other depending on the shape of the mask hole formed at the opposite position of the installed drying mask. ing. As a result, the drying speed of the liquid material filled in the functional film forming region is different, so that the shape in the film thickness direction of the formed functional film is different even if the filled liquid material is the same. Since functional films have different characteristics depending on their thickness, a plurality of functional films that are required to have the same functions (characteristics) formed in the same device are required to have uniform film thicknesses. . For the same reason, each functional film is required to have a uniform thickness in each part of the functional film. For each functional film formation region, the functional film film is formed by changing the shape of the mask hole according to the film thickness state of the functional film obtained when the drying process is performed without using the drying mask. The shape in the thickness direction can be brought closer to a more uniform state.

  In the present invention, the film forming method is a first method in which the mixed drying mask has one mask hole corresponding to one functional film forming region, and the opening area of the mask hole is smaller than the area of the functional film forming region. A mask hole and a second mask hole formed of a plurality of small holes formed in the hole arrangement region, and in the mask installation step, the mixed dry mask is formed between the center of the functional film formation region and the first mask hole. It is preferable that the center is substantially overlapped and the center of the functional film formation region and the center of the hole arrangement region are approximately overlapped.

  According to this film forming method, since the center of the functional film formation region and the center of the first mask hole substantially overlap each other, the first mask hole is disposed to face the substantially center of the functional film formation region. The The solvent evaporated from the liquid material filled in the functional film formation region is diffused from the vicinity of the center of the functional film formation region through the first mask hole. In addition, since the opening area of the first mask hole is smaller than the area of the functional film formation region, the liquid material filled near the periphery of the functional film formation region is less than the liquid material filled near the center. The distance from one mask hole is increased. As a result, the solvent evaporated from the liquid material filled near the periphery is less likely to diffuse than the solvent evaporated from the liquid material filled near the center. Concentration increases. Therefore, the drying speed of the liquid material filled in the vicinity of the center of the functional film formation region can be made faster than that of the liquid material filled in the vicinity of the periphery. Thereby, in the functional film formation region where the first mask hole is opposed, the film thickness in the vicinity of the center can be adjusted in the direction of increasing the film thickness in the vicinity of the periphery. On the other hand, by forming a small hole of the second mask hole in the hole arrangement region facing the functional film forming region, the solvent evaporated from the liquid material filled in the functional film forming region is changed to the small hole of the second mask hole. Diffused through. Thereby, the drying speed of the liquid material with which the position facing a small hole is filled can be made faster compared with the liquid material with which it filled other than the position facing a small hole. Thereby, in the functional film formation region where the first mask hole is opposed, the film thickness at the position facing the small hole can be adjusted in the direction of increasing the film thickness at the position other than the position facing the small hole.

  In the present invention, in the film forming method, in the mixed drying mask, the shape of the functional film obtained when the drying process is executed without performing the mask installation process and without using the mask is the center of the film thickness on the peripheral side. The first mask hole is arranged at a position corresponding to the functional film formation region for forming the functional film having a shape thicker than the side film thickness, and the dry mask is not used without performing the mask installation process. The functional film obtained when the drying process is performed has a second shape at a position corresponding to the functional film forming region where the functional film is formed such that the film thickness on the peripheral side is thinner than the film thickness on the central side. It is preferable to arrange a mask hole.

  According to this film forming method, a mask hole is formed at a position corresponding to a functional film forming region where a functional film having a thicker peripheral film thickness than a central film thickness is formed without using a dry mask. By forming the first mask hole that can increase the drying speed of the liquid material filled near the center of the functional film formation region compared to the liquid material filled near the periphery, the film on the peripheral side is formed. It can be eased that the thickness is larger than the film thickness on the center side. Fill in the position corresponding to the functional film formation area where the functional film is formed with a thinner film thickness on the peripheral side than the central film thickness without using a dry mask. By forming a second mask hole that can make the drying speed of the liquid material dried faster than the liquid material filled in the portion where the small holes are not formed, the central film thickness is the peripheral film thickness. Thicker can be relieved.

  In the present invention, the film forming method is such that the planar shape of the first mask hole is from the edge of the first mask hole to the planar contour of the functional film forming region in a state where the mixed dry mask is placed on the substrate. It is preferable that the distance is substantially uniform.

  According to this film forming method, the distance from the edge of the first mask hole to the outer periphery of the functional film forming region is substantially uniform, and the solvent evaporated from the liquid material filled near the periphery of the functional film forming region is the first. The distance to one mask hole is substantially uniform over the entire periphery of the functional film formation region. Thereby, the atmosphere can be made substantially uniform over the entire periphery of the functional film forming region, and the dried state can be made substantially uniform.

  In the present invention, in the film forming method, the planar shape of the hole arrangement region is preferably substantially the same as the planar shape of the functional film forming region.

  According to this film forming method, the small hole of the second mask hole is formed at a position opposite to an arbitrary position of the functional film forming region, so that drying at an arbitrary position of the functional film forming region is faster than other positions. Can be adjusted. Thereby, the film thickness of the arbitrary position of a functional film formation area can be adjusted to the direction made thicker with respect to the film thickness of another position.

  In the present invention, the film forming method is preferably such that each of the plurality of small holes is formed at a position inscribed in the outer shape line of the hole arrangement region.

  According to this film forming method, the small hole formed so as to be inscribed in the outer shape line faces the peripheral portion of the functional film forming region. By forming a small hole in the second mask hole at a position opposite to the peripheral part of the functional film forming region, the solvent evaporated from the liquid material filled in the functional film forming region can be obtained from the vicinity of the peripheral part of the functional film forming region. Diffused through the second mask hole. The liquid material filled near the periphery of the functional film formation region is closer to the second mask hole than the liquid material filled near the center. As a result, the solvent evaporated from the liquid material filled near the periphery is more easily diffused than the solvent evaporated from the liquid material filled near the center. The concentration becomes lighter. Therefore, drying of the liquid material filled near the periphery of the functional film formation region can be made faster than the liquid material filled near the center. As a result, the film thickness in the vicinity of the periphery can be adjusted to be thicker than the film thickness in the vicinity of the center.

  In the present invention, in the film forming method, each of the plurality of small holes constituting the peripheral mask hole or the second mask hole, the central mask hole, and the first mask hole are a set of a plurality of small holes. Also good.

  The method for manufacturing an electro-optical substrate according to the present invention is a method for manufacturing an electro-optical substrate having a functional film, wherein at least one type of functional film is formed using the film forming method according to any one of the preceding claims. It is characterized by doing.

  According to the method for manufacturing an electro-optic substrate according to the present invention, variation in film thickness between functional films formed on one substrate can be suppressed, and the film thickness in the functional film can be made uniform. Since the functional film is formed by using the film forming method that can be used, it is possible to manufacture a suitable electro-optic substrate in which the variation in the film thickness between the functional films is small and the variation in the film thickness in one functional film is small. it can. For example, in the case of a color filter substrate, a high-performance electro-optic substrate can be manufactured such that color unevenness and luminance unevenness are small and it is easy to accurately display the color and brightness to be displayed.

  The method for manufacturing an electro-optical device according to the present invention is a method for manufacturing an electro-optical device having a functional film, wherein at least one type of functional film is formed by using the film forming method according to claim 1. It is characterized by doing.

  According to the method for manufacturing an electro-optical device according to the present invention, it is possible to suppress variations in film thickness between functional films formed on one electro-optical device and to make the film thickness uniform in the functional film. Since a functional film is formed using a film forming method that can be executed, a suitable electro-optical device is manufactured in which the variation in film thickness between the functional films is small and the variation in film thickness in one functional film is small. be able to. For example, in the case of an organic EL display device, a high-performance electro-optical device can be manufactured such that there is little unevenness in color and brightness, and it is easy to accurately display the color and brightness to be displayed.

  In the functional film according to the present invention, a liquid material containing a material constituting the functional film is disposed in one or more functional film forming regions, which are regions to constitute the functional film on the substrate, and the liquid material is dried in a reduced pressure environment. The functional film is formed on the substrate and has a predetermined function, and the planar shape is substantially circular.

  When a functional film is formed by drying a liquid material containing a functional film material, the dry state of the liquid material near the edge varies depending on the shape of the edge of the functional film to be formed. For this reason, the thickness of the functional film is partially different depending on the shape of the edge, and the entire thickness is not uniform. For example, since the dry state is different between the side portion and the corner portion of the polygonal functional film, the thickness of the functional film is not uniform between the side portion and the corner portion. According to the configuration of the functional film according to the present invention, since the edges of the functional film are all part of the arc, the shape of the edge is uniform over the entire circumference. Thereby, the dry state is substantially the same over the entire circumference, and the film thickness can be made substantially uniform over the entire circumference. Therefore, since there is little possibility that the shape of the functional film varies, it is possible to realize a functional film that easily realizes a desired function of the functional film.

  In the electro-optic substrate according to the present invention, a liquid material containing a material constituting the functional film is arranged in one or more functional film forming regions, which are regions to constitute the functional film on the substrate, and the liquid material is placed under a reduced pressure environment. An electro-optic substrate formed on a substrate by drying and having a functional film having a predetermined function, wherein the functional film has a substantially circular planar shape.

  According to the electro-optical substrate of the present invention, since the shape of the functional film is less likely to vary, an electro-optical device that easily achieves a desired function by including a functional film that easily realizes a desired function of the functional film. A substrate can be realized. In addition, since there is little possibility that the shape of each functional film varies, an electro-optical substrate in which variations among a plurality of functional films on the electro-optical substrate are small can be realized. For example, in the case of a color filter substrate, a high-performance electro-optic substrate can be realized so that color unevenness and luminance unevenness are small and it is easy to accurately display the color and luminance to be displayed.

  In the electro-optical device according to the present invention, a liquid material containing a material constituting the functional film is arranged in one or more functional film forming regions, which are regions to constitute the functional film on the substrate, and the liquid material is placed under a reduced pressure environment. An electro-optical device that is formed on a substrate by drying and has a functional film having a predetermined function, wherein the functional film has a substantially circular planar shape.

  According to the electro-optical device according to the present invention, since the shape of the functional film is less likely to vary, the electro-optical device that easily achieves the desired function by including the functional film that easily realizes the desired function of the functional film. An apparatus can be realized. In addition, since there is little possibility that the shape of each functional film varies, it is possible to realize an electro-optical device in which variations among a plurality of functional films on the electro-optical device are small. For example, in the case of an organic EL display device, it is possible to realize a high-performance electro-optical device such that color unevenness and luminance unevenness are small and colors and luminance to be displayed can be easily displayed accurately.

  Hereinafter, an embodiment of a film forming method, an electro-optical substrate manufacturing method, and an electro-optical device manufacturing method according to the present invention will be described with reference to the drawings. Embodiments of the present invention include a step of manufacturing a color filter substrate of a liquid crystal display panel constituting a liquid crystal display device that is an example of an electro-optical device, and a step of manufacturing an organic EL display device that is an example of an electro-optical device. A film forming method used in the process of forming a functional film will be described as an example.

(First embodiment)
The first embodiment is a process of forming a color element film as a filter film, which is an example of a functional film, in the process of manufacturing a color filter substrate of a liquid crystal display panel constituting a liquid crystal display device, which is an example of an electro-optical device. The film forming method used in the above will be described as an example.

(Configuration of LCD panel)
First, a liquid crystal display panel will be described. FIG. 1 is a schematic view showing the structure of a liquid crystal display panel. FIG. 1A is a plan view of a liquid crystal display panel as viewed from the filter substrate side together with each component, and FIG. 1B shows a cross-sectional shape in the cross section indicated by AA in FIG. It is a schematic sectional drawing shown. In each drawing used in the following description, each layer or member has a different scale so that each layer or member can be recognized on the drawing.

  As shown in FIGS. 1A and 1B, a liquid crystal display panel 10 includes an element substrate 1 having a TFT (Thin Film Transistor) element 3 and a pixel electrode 6b, and a filter substrate having a counter electrode 6a and a color filter 5. 2 and a liquid crystal 8 filled in a gap between the element substrate 1 and the filter substrate 2 bonded by the sealing material 4. The element substrate 1 protrudes in a frame shape slightly larger than the filter substrate 2.

  The element substrate 1 uses a quartz glass substrate having a thickness of about 1.2 mm. The surface of the element substrate 1 includes a pixel electrode 6b constituting a pixel and a TFT element 3 in which one of the three terminals is connected to the pixel electrode 6b. Is formed. The remaining two terminals of the TFT element 3 are connected to a data line (not shown) and a scanning line (not shown) which are arranged in a grid pattern so as to surround the pixel electrode 6b and are insulated from each other. The data line is drawn out in the Y-axis direction and connected to the data line driving circuit unit 9a at the terminal unit 16. The scanning lines are drawn out in the X-axis direction and are individually connected to two scanning line driving circuit units 9b and 9b formed in the left and right frame regions. The input side wirings of each data line driving circuit unit 9 a and scanning line driving circuit unit 9 b are connected to mounting terminals 11 arranged along the terminal unit 16, respectively. In the frame region opposite to the terminal portion 16, a wiring 12 that connects the two scanning line drive circuit portions 9b and 9b is provided.

  The filter substrate 2 uses a glass substrate 2a made of transparent quartz glass having a thickness of approximately 1.0 mm, and is provided with a counter electrode 6a as a common electrode. The counter electrode 6a is electrically connected to the wiring provided on the element substrate 1 side via the vertical conduction parts 14 provided at the four corners of the glass substrate 2a. The wiring is also connected to the mounting terminal 11 provided in the terminal part 16. It is connected. The filter substrate 2 is provided with a color filter 5 in which a color element film 53 is formed at a position facing the pixel electrode 6b.

  An alignment film 7b and an alignment film 7a are formed on the surface of the element substrate 1 facing the liquid crystal 8 and the surface of the filter substrate 2, respectively.

  In the liquid crystal display panel 10, a relay substrate that is electrically connected to an external drive circuit is connected to the mounting terminal 11. An input signal from the external drive circuit is input to each data line drive circuit unit 9a and scan line drive circuit unit 9b, whereby the TFT element 3 is switched for each pixel electrode, and the pixel electrode 6b and the counter electrode 6a During this period, a drive voltage is applied and display is performed.

  Although not shown in FIG. 1, polarizing plates are provided on the front and back surfaces of the liquid crystal display panel 10 to deflect light incident / exited.

(Color filter)
Next, the arrangement of the color filter 5 formed on the filter substrate 2 and the color element film 53 in the color filter 5 will be described. FIG. 2A is a plan view schematically showing a planar structure of an embodiment of a color filter, and FIGS. 2B and 2C are schematic plan views showing an arrangement example of a three-color color filter. .

  As described above, the filter substrate 2 is formed using the glass substrate 2a made of transparent quartz glass having a thickness of approximately 1.0 mm. As shown in FIG. 2A, the color filter 5 has a plurality of color element regions 52 formed in a dot pattern, in the present embodiment in the form of a dot matrix, on the surface of a rectangular glass substrate 2a. It is formed by forming a color element film 53 in the region 52. Alignment marks 51a and 51b are formed at positions not covering the area where the color filter 5 is formed on the glass substrate 2a. The alignment marks 51a and 51b are used as positioning reference marks when the glass substrate 2a is attached to the manufacturing apparatus in order to execute various processes for forming the color filter 5 and the like.

  As shown in FIGS. 2B and 2C, the color element film 53 is divided by a plurality of partition walls 56 formed in a lattice pattern by a non-translucent resin material and arranged in a dot matrix. For example, the rectangular color element region 52 is filled with a color material. For example, a liquid material containing a color material constituting the color element film 53 is filled in the color element region 52, and the liquid material is evaporated by evaporating the solvent of the liquid material to dry the liquid material, thereby filling the color element region 52. A color element film 53 is formed. The color element film 53 corresponds to a functional film, and the color element region 52 corresponds to a functional film formation region. The filter substrate 2 corresponds to an electro-optical substrate having a functional film.

  As the arrangement of the color element films 53, for example, a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like are known. As shown in FIG. 2B, the stripe arrangement is an arrangement in which the matrix columns all become the color element films 53 of the same color. The mosaic arrangement is an arrangement in which the color is shifted by one color element film 53 for each horizontal row as shown in FIG. 2C. The three color element films 53 are arranged in three colors. In the delta arrangement, the arrangement of the color element films 53 is different, and in the case of a three-color filter, any three adjacent color element films 53 have different colors.

  In the three-color filter shown in FIGS. 2B and 2C, each of the color element films 53 is a color material of any one of R (red), G (green), and B (blue). Is formed by. A set of color element films 53 each including R (red), G (green), and B (blue) color element films 53R, 53G, and 53B, which are formed adjacent to each other, and is the smallest unit that constitutes an image. A filter of a certain pixel (hereinafter referred to as “picture element filter 54”) is formed. Full color display is performed by selectively allowing light to pass through one or a combination of the color element films 53R, 53G, and 53B in one picture element filter 54. At this time, the partition 56 formed of a resin material having no translucency functions as a black matrix.

(Droplet ejection method and droplet ejection head)
Next, a droplet discharge method used when filling the color element region 52 with a liquid material will be described. Examples of the discharge technique of the droplet discharge method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. In the charge control method, a charge is applied to a material with a charging electrode, and the flight direction of the material is controlled with a deflection electrode to be discharged from a discharge nozzle. In addition, the pressure vibration method is a method in which an ultra-high pressure of about 30 kg / cm ² is applied to the material to discharge the material to the tip side of the discharge nozzle. When no control voltage is applied, the material moves straight and the discharge nozzle When a control voltage is applied, electrostatic repulsion occurs between the materials, and the materials are scattered and are not discharged from the discharge nozzle. The electromechanical conversion method utilizes the property that a piezoelectric element (piezoelectric element) is deformed by receiving a pulse-like electric signal. The piezoelectric element is deformed through a flexible substance in a space where material is stored. Pressure is applied, and the material is extruded from this space and discharged from the discharge nozzle.

  In the electrothermal conversion method, a material is rapidly vaporized by a heater provided in a space in which the material is stored to generate bubbles, and the material in the space is discharged by the pressure of the bubbles. In the electrostatic attraction method, a minute pressure is applied to a space in which a material is stored, a meniscus of material is formed on the discharge nozzle, and an electrostatic attractive force is applied in this state before the material is drawn out. In addition to this, techniques such as a system that uses a change in the viscosity of a fluid due to an electric field and a system that uses a discharge spark are also applicable. The droplet discharge method has an advantage that the use of the material is less wasteful and a desired amount of the material can be accurately disposed at a desired position. Among these, the piezo method has an advantage that it does not affect the composition of the material because it does not apply heat to the liquid material. In the present embodiment, the above piezo method is used from the viewpoint of the high degree of freedom in selecting the liquid material and the good controllability of the droplets.

  Next, a droplet discharge head of a device manufacturing apparatus used when manufacturing a device according to the present invention by a droplet discharge method will be described. This device manufacturing apparatus is a droplet discharge apparatus (inkjet apparatus) that manufactures a device by discharging (dropping) droplets from a droplet discharge head onto a substrate. FIG. 3 is a diagram showing an outline of the appearance of the droplet discharge head. FIG. 3A is a perspective view showing an outline of the appearance of the droplet discharge head, and FIG. 3B is a diagram showing an arrangement of nozzles. As shown in FIG. 3A, the droplet discharge head 62 has, for example, a nozzle row 68 in which a plurality of discharge nozzles 67 are arranged. The number of the discharge nozzles 67 is, for example, 180, the hole diameter of the discharge nozzles 67 is, for example, 28 μm, and the pitch of the discharge nozzles 67 is, for example, 141 μm (see FIG. 3B). A reference direction S shown in FIG. 3A indicates a main scanning direction when the droplet discharge head 62 moves relative to the substrate in order to land the droplet on an arbitrary position on the substrate. Indicates the arrangement direction of the discharge nozzles 67 in the nozzle row 68.

  FIG. 4A is a perspective view showing the structure of the droplet discharge head, and FIG. 4B is a cross-sectional view showing the detailed structure of the discharge nozzle portion of the droplet discharge head. As shown in FIGS. 4A and 4B, each droplet discharge head 62 includes a vibration plate 73 and a nozzle plate 74. Between the vibration plate 73 and the nozzle plate 74, a liquid pool 75 in which a material liquid supplied from a liquid material tank (not shown) through a supply hole 77 is always filled is located. In addition, a plurality of head partitions 71 are located between the diaphragm 73 and the nozzle plate 74. A space surrounded by the diaphragm 73, the nozzle plate 74, and the pair of head partition walls 71 is a cavity 70. Since the cavities 70 are provided corresponding to the discharge nozzles 67, the number of the cavities 70 and the number of the discharge nozzles 67 are the same. The material liquid is supplied from the liquid pool 75 to the cavity 70 via the supply port 76 positioned between the pair of head partition walls 71.

  On the diaphragm 73, the vibrator 72 is positioned corresponding to each cavity 70. The vibrator 72 includes a piezo element 72c and a pair of electrodes 72a and 72b sandwiching the piezo element 72c. By applying a driving voltage to the pair of electrodes 72a and 72b, the liquid material is discharged as droplets from the corresponding discharge nozzle 67. In order to prevent a part of the liquid material discharged from the discharge nozzle 67 from adhering to the nozzle plate 74, a liquid repellent treatment layer 2P having liquid repellency with respect to the liquid material is formed on the outer surface of the nozzle plate 74. Has been.

  The control device (not shown) controls the discharge of the liquid material to each of the plurality of discharge nozzles 67 by controlling the voltage applied to the piezo element 72c, that is, by controlling the drive signal. More specifically, the volume of droplets ejected from the ejection nozzle 67, the number of droplets ejected per unit time, the distance between droplets landed on the substrate, and the like can be changed. For example, by selectively using a discharge nozzle 67 that discharges droplets from among a plurality of discharge nozzles 67 arranged in the nozzle row 68, the length of the nozzle row 68 is within the range in the arrangement direction T. Thus, a plurality of droplets can be discharged simultaneously at the pitch interval of the discharge nozzles 67. In the direction of the reference direction S, the distance between the droplets that have landed on the substrate can be individually changed for each discharge nozzle 67 that discharges the droplet. In addition, the volume of the droplet discharged from each of the discharge nozzles 67 is variable between 1 pl and 300 pl (picoliter).

(Dry mask)
Next, a drying mask used for drying the liquid material filled in the color element region 52 will be described. FIG. 5A is a plan view showing a schematic configuration of the dry mask, FIG. 5B is a partial plan view showing the shape of the mask hole, and FIG. 5C is a sectional shape of the mask hole. 2 is a cross-sectional view showing the shape along with the cross-sectional shape of the color element region 52. FIG.

  As shown in FIG. 5A, the dry mask 80 is formed by forming a square mask hole 83 in a dot matrix form on a square stainless steel plate. Alignment marks 81a and 81b are formed at positions that do not cover the region where the rectangular mask hole 83 of the stainless steel plate is formed. The alignment marks 81a and 81b are used as reference marks for positioning when the drying mask 80 is placed facing the filter substrate 2 in the middle of manufacture. By aligning the alignment marks 81a and 81b with the alignment marks 51a and 51b (see FIG. 2) formed on the filter substrate 2 described above, the center of the mask hole 83 substantially coincides with the center of the color element region 52 (see FIG. 2). To do.

  The size of the mask hole 83 is smaller than the planar shape of the color element region 52. The planar shape of the color element region 52 here is the shape of the partition skirt 56 a of the partition 56 that is substantially equal to the effective size of the color element film 53 to be formed. Then, as shown in FIGS. 5B and 5C, in the state where the center of the mask hole 83 is substantially coincident with the center of the color element region 52 (see FIG. 2), the edge of the partition hole extends from the edge of the mask hole 83. The distance in the surface direction of the filter substrate 2 up to 56a is substantially the same a on all sides. The mask hole 83 corresponds to the central mask hole, and the dry mask 80 corresponds to the central dry mask. The color element film 53 corresponds to a functional film, and the color element region 52 corresponds to a functional film formation region.

<Manufacture of filter substrate>
Next, the color element film forming process of the filter substrate 2 will be described with reference to FIGS. FIG. 6 is a flowchart showing the color element film forming process of the filter substrate, and FIGS. 7A to 7D are schematic cross-sectional views showing the color element film forming process of the filter substrate.

  In step S1 of FIG. 6, as shown in FIG. 7A, a partition wall 56 is formed on the surface of the glass substrate 2a. The partition wall 56 is formed by, for example, applying a liquid material including the material of the partition wall 56 to the surface of the glass substrate 2a and drying to form a partition film, and removing portions such as the color element region 52 by photoetching or the like. To do. Next, in step S2, the glass substrate 2a on which the partition walls 56 are formed is cleaned. The glass substrate 2a corresponds to a substrate on which a functional film is formed.

  Next, in step S3, the glass substrate 2a on which the partition walls 56 are formed and cleaned is subjected to a surface treatment so that the liquid material can be easily filled. The color element region bottom 52 a surrounded by the partition skirt 56 a and the partition side surface 56 b are treated so as to be lyophilic with respect to the liquid material 530 containing the material of the color element film 53, and the partition top 56 c is the liquid material 530. To be liquid repellent. By this processing, the liquid material 530 disposed in the color element region 52 becomes easy to become familiar with the color element region 52 and does not easily overflow from the color element region 52.

  Next, in step S4, a color element material liquid is applied. As shown in FIG. 7B, a liquid material 530 containing a color element forming material in each of the plurality of color element regions 52 formed by the partition walls 56 is ejected from the droplet ejection head 62 as droplets 530a, and the color elements The region 52 is filled with the liquid material 530. Of course, the liquid material 530 containing a different color element material is discharged to each color element region 52 where the color element films 53 of different colors are formed. For example, in the above-described three-color filter (see FIGS. 2B and 2C), different color elements corresponding to the color element regions 52 in which the color element films 53R, 53G, and 53B of different colors are formed. Three liquid materials 530 containing the material are sequentially filled in the droplet discharge head 62 and discharged. Alternatively, a plurality of droplet discharge heads 62 may be prepared, and liquid materials 530 containing different color element materials may be filled and discharged. The step of filling the color material region 52 in step S4 with the liquid material 530 corresponds to the liquid material arrangement step.

  Next, in step S5, the dry mask 80 (see FIG. 5) is placed on the glass substrate 2a in which the color element region 52 is filled with the liquid material 530 so that the alignment marks 81a and 81b overlap the alignment marks 51a and 51b. Align with and install. As shown in FIG. 7C, the color element region 52 filled with the liquid material 530 is covered with the dry mask 80, and the mask is positioned so that the center of the color element region 52 and the center of the mask hole 83 substantially overlap. A hole 83 is located. The process of installing the drying mask 80 on the glass substrate 2a in step S5 corresponds to the mask installation process.

  Next, in step S <b> 6, the glass substrate 2 a on which the drying mask 80 is installed is put into a reduced pressure environment, and the liquid material 530 is dried to form the color element film 53. Strictly speaking, the liquid material 530 starts drying from the moment when it is discharged as the droplet 530a from the droplet discharge head 62, but it is almost normal at normal pressure by adjusting the boiling point of the solvent of the liquid material 530 and the like. It can be made to dry in a pressure-reduced state without drying. In order to perform almost all drying in the drying process with the drying mask 80 installed, it is preferable that the liquid material 530 has a high ratio of the high-boiling solvent whose drying progresses slowly.

  As shown in FIG. 7D, a color element film 53 having a substantially flat color element film surface 531 and a substantially uniform film thickness is formed. When the liquid material 530 of the present embodiment is dried without using the drying mask 80, the drying speed of the peripheral portion is faster than that of the central portion. It has a concave shape like a surface 532 indicated by a dotted line. Using the drying mask 80, the mask hole 83 is installed so as to be positioned near the center of the color element region 52, and the drying process is performed, so that the drying speed of the peripheral portion is delayed. Accordingly, the color element film 53 is formed so that the color element film surface 531 is substantially flat and the film thickness is substantially uniform by harmonizing the drying speed of the central part and the drying speed of the peripheral part. The degree of adjustment of the speed difference between the central portion drying speed and the peripheral portion drying speed can be appropriately adjusted by changing the size of the mask hole 83 and the distance between the drying mask 80 and the glass substrate 2a.

  As shown in FIG. 7D, the color element film 53 is formed, and the color element film forming process of the filter substrate 2 is completed. Further, the process of forming the counter electrode 6a and the alignment film 7a is executed to form the filter substrate 2.

Hereinafter, effects of the first embodiment will be described. According to the first embodiment, the following effects can be obtained.
(1) By disposing the mask hole 83 in the vicinity of the center of the color element region 52 filled with the liquid material 530, the solvent evaporated from the liquid material 530 diffuses through the mask hole 83. Becomes easy to diffuse. Evaporation from the liquid material 530 easily occurs because the evaporated solvent is easily diffused. Thereby, the drying speed of the liquid material 530 filled in the color element region 52 can be adjusted in a direction in which the central portion is faster than the peripheral portion.

  (2) In the state where the center of the mask hole 83 is substantially coincident with the center of the color element region 52, the distance in the surface direction of the filter substrate 2 from the edge of the mask hole 83 to the partition skirt 56a is substantially the same a on all four sides. Therefore, the influence of the mask hole 83 on the drying speed of the liquid material 530 can be made substantially uniform in each peripheral portion of the color element region 52. That is, it is possible to make the drying conditions substantially uniform in each peripheral part of the color element region 52 so that the film thickness of the peripheral part of the color element film 53 is substantially the same on all four sides.

  (3) When the liquid material 530 is dried without using the drying mask 80, the surface of the liquid material 530 has a concave shape because the drying speed is higher in the peripheral portion than in the central portion. When the liquid material 530 is dried, by using the drying mask 80 in which the mask hole 83 is disposed near the center of the color element region 52, the drying speed of the peripheral portion can be delayed with respect to the center portion. This reconciles the drying speed of the central part with the drying speed of the peripheral part, thereby relaxing the concave shape of the surface caused by the peripheral part being faster than the central part, and the color element film surface The color element film 53 having a substantially flat film thickness 531 and a substantially uniform film thickness can be formed.

(Second embodiment)
Next, a second embodiment, which is an embodiment of a film forming method, an electro-optical substrate manufacturing method, and an electro-optical device manufacturing method according to the present invention, will be described with reference to the drawings. In this embodiment, a film forming method used in a process of forming a light emitting layer and a hole transport layer, which are examples of functional films, in the process of manufacturing an organic EL display device, which is an example of an electro-optical device, will be described as an example. . Since the droplet discharge device of the present embodiment is substantially the same as the droplet discharge device described in the first embodiment, the description of the droplet discharge device is omitted.

(Configuration of organic EL display device)
First, the configuration of the organic EL display device will be described. FIG. 8 is a schematic front view showing the organic EL display device. As shown in FIG. 8A, the organic EL display device 100 of this embodiment includes an element substrate 101 having a plurality of organic EL elements 107 that are light emitting elements, and a sealing substrate 109. The organic EL element 107 is a so-called color element, and the organic EL display device 100 includes an organic EL element 107 of three colors, a red element 107R (red), a green element 107G (green), and a blue element 107B (blue). Have. The organic EL element 107 is disposed in the display area 106 and an image is displayed in the display area 106.

  For example, as shown in FIG. 8B, the three-color organic EL elements 107 on the element substrate 101 are arranged in a stripe arrangement in which the same-color organic EL elements 107 are arranged in the vertical direction in the drawing. The planar shape of each organic EL element 107 is substantially circular. The arrangement density of the organic EL elements 107 is increased by shifting the organic EL elements 107 arranged in the vertical direction in the figure in the horizontal direction in the figure.

  The element substrate 101 includes a plurality of switching elements 112 (see FIG. 9) as drive elements at positions corresponding to the respective organic EL elements 107. The switching element 112 is, for example, a TFT (Thin Film Transistor) element. In addition, two scanning line driving circuit units 103 and 103 for driving the switching element 112 and one data line driving circuit unit 104 are provided in a portion that is slightly larger than the sealing substrate 109 and extends in a frame shape. Yes. A flexible relay substrate 108 for connecting the drive circuit portions 103 and 104 and an external drive circuit is mounted on the terminal portion 101 a of the element substrate 101. These drive circuit portions 103 and 104 are configured by, for example, forming a low-temperature polysilicon semiconductor layer on the surface of the element substrate 101 in advance.

  FIG. 9 is a cross-sectional view of a main part including the organic EL element of the organic EL display device. The element substrate 101 is formed on the glass substrate 110, the plurality of switching elements 112 formed on one surface of the glass substrate 110, the insulating layer 111 formed so as to cover the switching elements 112, and the insulating layer 111. The plurality of pixel electrodes 114 that are electrically connected to the switching element 112 through the conductive layer 114 a and the bank 115 that is formed between the plurality of pixel electrodes 114. Further, a hole transport layer 116 formed on the pixel electrode 114 in a region partitioned by the bank 115 (hereinafter referred to as “pixel region 121”) and a layer stacked on the hole transport layer 116 are formed. The light emitting layer 117 and the counter electrode 118 provided so as to cover the light emitting layer 117 and the bank 115. In the organic EL display device 100, a sealing substrate 109 is disposed facing the counter electrode 118 of the element substrate 101, and an inert gas 120 is sealed between the counter electrode 118 and the sealing substrate 109. A portion formed by the hole transport layer 116, the light emitting layer 117, and the counter electrode 118 formed on the pixel electrode 114 in a region partitioned by the bank 115 corresponds to the organic EL element 107.

  A red light emitting layer 117R (red system), a green light emitting layer 117G (green system), and a blue light emitting layer 117B (blue system) are formed in the pixel region 121 to emit red, green, and blue light, respectively. Element 107R, green element 107G, and blue element 107B are formed. A set of organic EL elements 107 each including one red element 107R, one green element 107G, and one blue element 107B forms a picture element, which is the minimum unit constituting an image. Full color display is performed by selectively emitting light to any one or combination of the red element 107R, the green element 107G, and the blue element 107B in one pixel.

(Dry mask)
Next, a drying mask used for drying the liquid material filled in the pixel region 121 will be described. FIG. 10A is a plan view showing a schematic configuration of a dry mask, FIG. 10B is a partial plan view showing the shape of a mask hole, and FIG. 10C is a cross-sectional shape of the mask hole. 2 is a cross-sectional view showing the pixel area 121 together with the cross-sectional shape of the pixel region 121. FIG.

  As shown in FIG. 10A, the dry mask 180 is formed by forming a mask hole 183 having a shape shown in FIG. 10B in a dot matrix form on a rectangular stainless steel plate. As shown in FIG. 10B, the mask hole 183 formed in the dry mask 180 includes eight mask small holes 183a, b, c, d, e, f, g, and h. The eight mask small holes 183a to 183h are imaginary lines indicated by two-dot chain lines in FIG. 10B and are formed at substantially equal intervals at positions inscribed in the substantially circular arrangement position line 182. As illustrated in FIG. 10C, the shape of the arrangement position line 182 is substantially the same as the planar shape of the pixel region 121. More specifically, the shape of the arrangement position line 182 is substantially the same as the shape of the bank bottom 115 a that is the rising position of the bank 115. The region surrounded by the bank skirt 115a is substantially equivalent to the effective region of the functional film to be formed.

  As shown in FIG. 10A, alignment marks 181a and 181b are formed at positions that do not cover the region where the mask hole 183 of the stainless steel plate is formed. The alignment marks 181a and 181b are used as reference marks for positioning when the dry mask 180 is placed facing the element substrate 101 during manufacture. By aligning the alignment marks 181 a and 181 b with the alignment mark formed on the glass substrate 110 of the element substrate 101, the arrangement position line 182 and the bank bottom 115 a substantially overlap in the thickness direction of the glass substrate 110. Of course, the center of the region surrounded by the arrangement position line 182 and the region surrounded by the bank bottom 115a, that is, the center of the effective shape of the functional film to be formed substantially overlap in the thickness direction of the glass substrate 110. The mask hole 183 corresponds to a peripheral mask hole, the dry mask 180 corresponds to a peripheral dry mask, and the mask small holes 183a, b, c, d, e, f, g, and h correspond to small holes. The arrangement position line 182 corresponds to the outer shape line of the hole arrangement area, and the area surrounded by the arrangement position line 182 corresponds to the hole arrangement area.

<Manufacture of organic EL elements>
Next, a process of forming the hole transport layer 116 and the light emitting layer 117 constituting the organic EL element 107 in the element substrate 101 of the organic EL display device 100 will be described with reference to FIGS. FIG. 11 is a flowchart showing a process for forming a hole transport layer and a light emitting layer of the element substrate, and FIGS. 12A to 12E are schematic cross-sectional views showing a process for forming the hole transport layer and the light emitting layer of the element substrate. It is.

  In step S21 of FIG. 11, as shown in FIG. 12A, the bank 115 is formed on the surface of the glass substrate 110 on which the switching element 112, the insulating layer 111, the conductive layer 114a, and the pixel electrode 114 are formed. Form. The bank 115 is formed by, for example, applying a liquid material containing the material of the bank 115 to the surface of the glass substrate 110 and drying to form a bank film, and removing portions such as the pixel region 121 by photoetching or the like. . Next, in step S22, the glass substrate 110 on which the bank 115 is formed is cleaned. The glass substrate 110 corresponds to a substrate on which a functional film is formed. The element substrate 101 corresponds to an electro-optical substrate having a functional film.

  Next, in step S23, the glass substrate 110 on which the bank 115 is formed and cleaned is subjected to a surface treatment so that the liquid material can be easily filled. The bottom of the pixel region 121 surrounded by the bank 115 and the side surface of the bank 115 are processed so as to be lyophilic with respect to the liquid material 560 including the material of the hole transport layer 116, and the top of the bank 115 is The liquid material 560 is treated so as to be liquid repellent. By this processing, the liquid material 560 arranged to be filled in the pixel area 121 becomes easy to become familiar with the pixel area 121 and does not easily overflow from the pixel area 121.

  Next, in step S24, a hole transport layer material liquid is applied. As shown in FIG. 12B, a liquid material 560 containing the material of the hole transport layer 116 in each of the plurality of pixel regions 121 formed by the bank 115 is ejected as droplets 560a from the droplet ejection head 62. The pixel region 121 is filled with a liquid material 560. The pixel region 121 corresponds to a functional film formation region.

  Next, in step S25, the dry mask 180 (see FIG. 10) is placed on the glass substrate 110 in which the pixel region 121 is filled with the liquid material 560, and the alignment marks 181a and 181b are formed on the glass substrate 110. Align and install so as to overlap. As shown in FIG. 12C, the pixel region 121 filled with the liquid material 560 is covered with a dry mask 180 and surrounded by the center of the substantially circular arrangement position line 182 and the substantially circular bank skirt 115a. The area, that is, the center of the pixel area 121 substantially overlaps in the thickness direction of the glass substrate 110. Eight mask small holes 183a, b, c, d, e, f, g, and h constituting the mask hole 183 formed in the dry mask 180 are formed at positions inscribed in the arrangement position line 182, respectively. For this reason, it is set at a position that is a peripheral portion of the pixel region 121 and overlaps the pixel region 121.

  Next, in step S <b> 26, the glass substrate 110 provided with the drying mask 180 is put into a reduced pressure environment, and the liquid material 560 is dried to form the hole transport layer 116. Strictly speaking, the liquid material 560 starts drying from the moment when it is ejected as the droplet 560a from the droplet ejection head 62. However, by adjusting the boiling point of the solvent of the liquid material 560, the liquid material 560 is almost at normal pressure. It can be made to dry in a pressure-reduced state without drying. In order to perform almost all drying in the drying process in which the drying mask 180 is installed, it is preferable to increase the ratio of the high boiling point solvent in which the liquid material 560 is slowly dried.

  As shown in FIG. 12D, a hole transport layer 116 having a substantially flat hole transport layer surface 561 and a substantially uniform film thickness is formed. When the liquid material 560 of the present embodiment is dried without using the drying mask 180, the drying speed of the peripheral portion is slower than that of the central portion. A convex shape is formed like a surface 562 indicated by a chain line. By using the drying mask 180, the mask small holes 183a to 183h are installed so as to be positioned in the peripheral portion of the pixel region 121, and the drying process is performed, so that the drying speed of the central portion is delayed. Accordingly, the hole-transporting layer 116 is formed so that the hole-transporting layer surface 561 is substantially flat and the film thickness is approximately uniform by harmonizing the drying speed of the central part and the drying speed of the peripheral part. . The degree of adjustment of the speed difference between the central portion drying speed and the peripheral portion drying speed can be appropriately adjusted by changing the size and number of the mask small holes 183a to 183h and the distance between the drying mask 180 and the glass substrate 110. . The hole transport layer 116 corresponds to a functional film.

  Next, in step S27, a light emitting layer material liquid is applied. Similarly to step S24 shown in FIG. 12B, the liquid material 570 containing the material of the light emitting layer 117 is dropped from the droplet discharge head 62 into each of the plurality of pixel regions 121 where the hole transport layer 116 is formed. And the liquid material 570 is filled in the pixel region 121. Of course, the liquid material 570 containing a different light emitting layer material is discharged to each pixel region 121 where the light emitting layers 117 of different colors are formed. For example, in the above-described color display using the three light emitting layers (see FIG. 8), the red light emitting layer 117R (red) and the green light emitting layer 117G (green) emit red, green, and blue light, respectively. The liquid material 570 containing the material of each light emitting layer 117 is sequentially filled in the droplet discharge head 62 and discharged into the pixel regions 121 where the blue light emitting layer 117B (blue system) is to be formed. Alternatively, a plurality of droplet discharge heads 62 may be prepared, and the liquid materials 570 of the light emitting layer 117 having different colors may be filled and discharged.

  If the surface treatment performed in step S23 is not effective for the liquid material 570 so that the liquid material 560 becomes easy to become familiar with the pixel region 121 and does not easily overflow from the pixel region 121, before the step S27 is performed. In addition, the same surface treatment as that executed in step S23 is executed. Of course, the processing executed in this case is a surface treatment that makes it easy for the liquid material 570 to become familiar with the pixel region 121 and not to overflow from the pixel region 121.

  Next, in step S28, a dry mask 180 (see FIG. 10) is placed on the glass substrate 110 in which the pixel region 121 is filled with the liquid material 570, and alignment marks 181a and 181b are formed on the glass substrate 110. Align and install so as to overlap. Similar to the positional relationship between the mask small holes 183a to 183h and the pixel region 121 shown in FIG. 12C, the mask small holes 183a to 183h are set at the peripheral portion of the pixel region 121 and overlapping the pixel region 121. ing.

  Next, in step S29, the glass substrate 110 provided with the drying mask 180 is placed in a reduced pressure environment, and the liquid material 570 is dried to form the light emitting layer 117. Like the liquid material 560 described above, the liquid material 570 starts to dry from the moment when it is discharged as droplets from the droplet discharge head 62, but the boiling point of the solvent of the liquid material 570 is adjusted. Therefore, it can be made to dry in a pressure-reduced state with almost no drying at normal pressure. In order to perform almost all drying in the drying process in which the drying mask 180 is installed, it is preferable that the liquid material 570 has a high ratio of the high-boiling solvent whose drying progresses slowly.

  As shown in FIG. 12E, a light emitting layer 117 having a light emitting layer surface 571 that is substantially flat and a substantially uniform thickness is formed. When the liquid material 570 of the present embodiment is dried without using the drying mask 180, the peripheral portion has a lower drying speed than the central portion. It has a convex shape like a surface 572 indicated by a chain line. By using the drying mask 180, the mask small holes 183a to 183h are installed so as to be positioned in the peripheral portion of the pixel region 121, and the drying process is performed, so that the drying speed of the central portion is delayed. Thereby, the drying speed of the central portion and the drying speed of the peripheral portion are harmonized so that the light emitting layer 117 having a substantially flat light emitting layer surface 571 and a substantially uniform film thickness is formed. The degree of adjustment of the speed difference between the central portion drying speed and the peripheral portion drying speed can be appropriately adjusted by changing the size and number of the mask small holes 183a to 183h and the distance between the drying mask 180 and the glass substrate 110. . The light emitting layer 117 corresponds to a functional film.

  As shown in FIG. 12E, the light emitting layer 117 is formed, and the formation process of the hole transport layer 116 and the light emitting layer 117 is completed. Further, the step of forming the counter electrode 118 is executed to form the element substrate 101. Furthermore, the sealing substrate 109 is attached, and the above-described relay substrate 108 and the like are mounted to form the organic EL display device 100.

Hereinafter, effects of the second embodiment will be described. According to the second embodiment, the following effects can be obtained.
(1) By disposing the mask small holes 183a-h near the periphery of the pixel region 121 filled with the liquid material 560 or 570, the solvent evaporated from the liquid material 560 and the like diffuses through the mask small holes 183a-h. Therefore, the vicinity of the periphery is more likely to diffuse. Since the evaporated solvent is easily diffused, evaporation from the liquid material 560 or the like is likely to occur. Thereby, the drying speed of the liquid material 560 or 570 filled in the pixel region 121 can be adjusted in a direction in which the peripheral portion is faster than the central portion.

  (2) The mask small holes 183a to 183h are formed at substantially equal intervals in a state inscribed in the arrangement position line 182. By placing the drying mask 180 so that the center of the pixel area 121 having substantially the same plane shape as the substantially circular arrangement position line 182 is arranged, the mask small holes 183a to 183h are arranged substantially evenly with respect to the pixel area 121. Thus, the influence on the drying rate of the liquid material 560 or 570 filled in the pixel region 121 can be made substantially uniform in each peripheral portion of the pixel region 121.

  (3) When dried, the peripheral portion has a slower drying speed than the central portion, and therefore when the liquid material 560 or 570 having a convex shape is dried, the mask small holes 183a to 183a are formed near the periphery of the pixel region 121. By using the drying mask 180 in which h is arranged, the drying speed of the central part can be delayed with respect to the peripheral part. Thereby, the hole-transporting layer 116 or the light-emitting layer having a uniform hole thickness and a substantially uniform hole transport layer surface 561 or a light-emitting layer surface 571 with the drying speed in the central portion and the drying speed in the peripheral portion being harmonized. 117 can be formed.

  (4) The planar shape of the pixel region 121 is circular, and the planar shape of the hole transport layer 116 or the light emitting layer 117 to be formed is circular. Since the edges of the hole transport layer surface 561 or the light emitting layer surface 571 are all part of an arc, the shape of the edge becomes uniform over the entire circumference. This suppresses variations in shape in the thickness direction due to different edge shapes, so that the dry state is substantially the same over the entire circumference, and the film thickness of the hole transport layer 116 or the light emitting layer 117 over the entire circumference. Can be made substantially uniform. In addition, since the variation due to the difference in the shape of the edge of the influence of using the dry mask 180 on the film thickness is suppressed, the control of the film thickness by using the dry mask 180 can be easily performed. Can do. Therefore, since the hole transport layer 116 or the light emitting layer 117 is less likely to vary in the thickness direction, the hole transport layer 116 or the light emitting layer that easily achieves the desired function of the hole transport layer 116 or the light emitting layer 117 is obtained. Layer 117 can be realized.

  As mentioned above, although preferred embodiment which concerns on this invention was described referring an accompanying drawing, embodiment of this invention is not restricted to the said embodiment. The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention, and can be implemented as follows.

  (Modification 1) In the above-described embodiment, the mask holes formed in the single dry mask have been described with respect to the dry mask 80 and the dry mask 180 which are mask holes having the same shape. However, the mask holes are formed in the dry mask. It is not essential that all the mask holes have the same shape. You may provide the mask hole of a different shape in the same dry mask. A different dry mask may be used for each liquid material corresponding to the size of the mask hole 83 formed in the same dry mask, or a different dry mask may be used for each liquid material corresponding to the size and number of the mask small holes 183a to 183h. A dry mask having a configuration in which the mask hole 83 and the mask small holes 183a to 183a (mask holes 183) are mixed corresponding to each liquid material may be used for the same dry mask. A dry mask having a plurality of mask holes having different shapes and sizes corresponds to a mixed dry mask. The mask hole 83 formed in the mixed dry mask corresponds to the first mask hole, the mask hole 183 corresponds to the second mask hole, and the mask small holes 183a to 183h correspond to small holes.

  For example, the liquid materials 530R, 530G, and 530B of the color element films 53R, 53G, and 53B described in the first embodiment may have different drying characteristics. In this case, by setting the size of the mask hole 83 individually for each of the liquid materials 530R, 530G, and 530B, the film hole is flatter and has a film thickness as compared with the case where the mask holes 83 having a constant size are uniformly applied. Can achieve uniform color element films 53R, 53G, and 53B. In addition, when one of the liquid materials 530R, 530G, and 530B is likely to have a thick convex shape at the center and the other is likely to have a thin concave shape at the center, the liquid material that is likely to have a convex shape has a mask hole. By making the mask holes 83 correspond to the liquid material that tends to have a concave shape, the color element films 53R, 53G, and 53B that are flat and have a uniform film thickness corresponding to any liquid material are realized. Can do.

  (Modification 2) In the above-described embodiment, the mask hole 83 and the mask small holes 183a to 183h are each one opening hole, but it is not essential that the mask hole is a hole formed by a single opening. The mask hole may be formed by a set of a plurality of minute holes. In this case, by forming a set of minute holes in the shapes and positions of the mask holes 83 and the mask small holes 183a to 183h described in the above embodiment, the same functions and effects as those described in the above embodiments can be obtained. can get.

  (Modification 3) In the above-described embodiment, the ink jet type droplet discharge head 62 is used to dispose the liquid material. However, it is not essential to use the ink jet type droplet discharge head. For example, any method can be used as long as a minute amount of liquid material can be arranged at a target arrangement position such as using a microdispenser.

  (Modification 4) In the above-described embodiment, the surface treatment of the glass substrate 2a or the glass substrate 110 is performed after the partition wall 56 or the bank 115 is formed. Not limited to after forming. The lyophilicity or liquid repellency of each part demonstrated by the said embodiment should just be formed.

  (Modification 5) In the embodiment described above, the surface treatment of the glass substrate 2a or the glass substrate 110 is performed to form the lyophilicity or liquid repellency of each part described in the embodiment. It is not essential to execute the process. The lyophilicity or liquid repellency of each part described in the above embodiment may be realized by forming a substrate, a partition wall, or a bank using a material having lyophilicity or liquid repellency with respect to a liquid material. .

  (Modification 6) In the above embodiment, the scanning line driving circuit unit 103 and the data line driving circuit unit 104 are configured by previously forming a low-temperature polysilicon semiconductor layer on the surface of the element substrate 101. However, the present invention is not limited to this, and a driver IC capable of driving the light emitting element may be mounted on the glass substrate in a plane.

  (Modification 7) In the above-described embodiment, the partition wall 56 and the bank 115 are formed by previously forming a partition film and a bank film, and by removing portions such as the color element region 52 and the pixel region 121 from the partition film and the bank film. Although the formation method has been described, the partition wall 56 and the bank 115 can be formed by a direct formation method. For example, a liquid material containing the material of the partition wall 56 and the bank 115 is discharged using the droplet discharge head 62 described in the above embodiment, and the liquid material including the material of the partition wall 56 and the bank 115 is selectively disposed at a position where the partition wall 56 and the bank 115 are formed. Can also be formed. According to this method, since the material to be removed is not generated, it is possible to suppress the wasteful consumption of the material.

  In the above-described embodiments, the color element film of the color filter of the liquid crystal display device and the hole transport layer and the light emitting layer of the organic EL display device have been described as examples of the functional film, but there are various film forming methods according to the present invention. It can be used as a method for forming a functional film. For example, it can be used as a film forming method in which one large functional film is formed on one substrate like an alignment film of a liquid crystal display device. It can also be used as a method for forming a film such as a partition film for forming a partition wall or a bank film for forming a bank.

(A) The top view which shows the structure of a liquid crystal display panel. (B) The schematic sectional drawing in the cross section shown by AA. (A) The top view which shows typically the planar structure of a color filter. (B), (c) The schematic plan view which shows the example of an arrangement | sequence of a 3 color filter. (A) The perspective view which shows the outline | summary of the external appearance of a droplet discharge head. (B) The schematic diagram which shows the arrangement | sequence of a nozzle. (A) The perspective view which shows the structure of a droplet discharge head. (B) Sectional drawing which shows the detailed structure of the discharge nozzle part of a droplet discharge head. (A) The top view which shows schematic structure of a dry mask. (B) The partial top view which shows the shape of a mask hole. (C) Sectional drawing which shows the cross-sectional shape of a mask hole with the cross-sectional shape of a color element area | region. The flowchart which shows the color element film formation process of a filter substrate. The schematic cross section which shows the color element film formation process of the filter substrate. 1 is a schematic front view showing an organic EL display device. Sectional drawing of the principal part containing the organic EL element of an organic EL display apparatus. (A) The top view which shows schematic structure of a dry mask. (B) The partial top view which shows the shape of a mask hole. (C) Sectional drawing which shows the cross-sectional shape of a mask hole with the cross-sectional shape of a pixel area. The flowchart which shows the formation process of the positive hole transport layer and light emitting layer of an element substrate. The schematic cross section which shows the formation process of the positive hole transport layer and light emitting layer of an element substrate.

Explanation of symbols

2a ... glass substrate, 5 ... color filter, 10 ... liquid crystal display panel, 51a, 51b ... alignment mark, 52 ... color element region, 53 ... color element film, 56 ... partition, 56a ... partition skirt, 56b ... partition side, 56c DESCRIPTION OF SYMBOLS ... Partition top part, 80 ... Dry mask, 81a, 81b ... Alignment mark, 83 ... Mask hole, 100 ... Organic EL display device, 110 ... Glass substrate, 115 ... Bank, 115a ... Bank skirt, 116 ... Hole transport layer, 117 ... Emission layer, 121... Pixel region, 180... Dry mask, 181 a, 181 b. Alignment mark, 182 .. arrangement position line, 183... Mask hole, 183 a, b, c, d, e, f, g, h. 530, 560, 570 ... Liquid material, 531 ... Color element film surface, 532 ... Surface, 561 ... Hole transport layer surface, 562 ... Surface, 571 ... Light emitting layer , 572 ... surface.

Claims (18)

By disposing a liquid material containing a material constituting the functional film on a substrate having a plurality of functional film forming regions which are regions to constitute individual functional films, and drying the liquid material in a reduced pressure environment A film forming method for forming the functional film,
A liquid material arrangement step for filling the liquid material into the functional film forming region;
The hole placement area at a position corresponding to each of said functional film forming area is provided, the dry mask mask holes are formed in said hole placement area, in a position to face each other with the substrate and gaps, the hole arrangement region each A mask installation step of installing the functional film so as to face the functional film formation region;
A drying step of drying the liquid material under the reduced pressure environment to form the functional film. The dry mask is a central dry mask or a peripheral dry mask in which the shapes of the formed mask holes are different from each other,
Depending on the state of film thickness of the functional film obtained when the drying step is performed without performing the mask installation step without using the dry mask, the central dry mask or The film forming method according to claim 1, wherein the peripheral dry mask is installed. The central dry mask has a central mask hole whose opening area is smaller than the area of the functional film formation region,
3. The film forming method according to claim 2, wherein, in the mask placing step, the center dry mask is placed at a position where a center of the functional film forming region and a center of the center mask hole substantially overlap each other.   The planar shape of the central mask hole is such that the distance from the edge of the central mask hole to the planar outer shape of the functional film forming region is substantially uniform in a state where the central dry mask is placed on the substrate. The film forming method according to claim 3, wherein: The peripheral dry mask has a peripheral mask hole composed of a plurality of small holes formed in the hole arrangement region,
In the mask installation step, the peripheral dry mask is installed at a position where the hole arrangement region faces the functional film formation region and the center of the hole arrangement region and the center of the functional film formation region substantially overlap. The film forming method according to claim 2, wherein:   The film forming method according to claim 5, wherein a planar shape of the hole arrangement region is substantially the same as a planar shape of the functional film forming region.   The film forming method according to claim 5, wherein each of the plurality of small holes is formed at a position inscribed in an outer shape line of the hole arrangement region.   When the functional film obtained when the drying process is executed without performing the mask installation process and without using the dry mask is a functional film in which the film thickness on the peripheral side is thicker than the film thickness on the central side 5. The film forming method according to claim 2, wherein the central dry mask is installed in the mask installation step. 6.   When the functional film obtained when the drying process is performed without performing the mask installation process and without using the dry mask is a functional film whose peripheral film thickness is thinner than the central film thickness The film forming method according to claim 2, wherein the peripheral dry mask is installed in the mask installing step. A functional film forming region which is a region where individual functional films are to be formed on the substrate, and a plurality of the functional film forming regions are filled with a liquid material containing a material constituting the functional film on the substrate. A liquid material arranging step to arrange;
A hole placement region is provided at a position corresponding to each functional film formation region, and a dry mask having a plurality of mask holes formed in the hole placement region is placed at a position facing the substrate with a gap therebetween. A mask installation step of installing so as to face each functional film formation region,
Drying the liquid material under reduced pressure to form the functional film,
The dry mask is a mixed dry mask in which a plurality of types of mask holes having different shapes are formed. The mixed dry mask has one mask hole corresponding to one functional film forming region, and a first mask hole in which an opening area of the mask hole is smaller than an area of the functional film forming region;
A second mask hole composed of a plurality of small holes formed in the hole arrangement region,
In the mask installation step, the mixed dry mask is substantially overlapped with the center of the functional film formation region and the center of the first mask hole,
The film formation method according to claim 10, wherein the center of the functional film formation region and the center of the hole arrangement region are disposed at substantially overlapping positions. The mixed drying mask is
The shape of the functional film obtained when the drying process is executed without performing the mask installation process and without using the drying mask is such that the film thickness on the peripheral side is thicker than the film thickness on the central side The first mask hole is arranged at a position corresponding to the functional film forming region for forming the functional film.
The shape of the functional film obtained when the drying step is performed without performing the mask installation step and without using the drying mask is such that the film thickness on the peripheral side is thinner than the film thickness on the central side The film forming method according to claim 11, wherein the second mask hole is disposed at a position corresponding to the functional film forming region where the functional film is formed.   The planar shape of the first mask hole is substantially the same as the distance from the edge of the first mask hole to the planar outer shape of the functional film formation region in a state where the mixed dry mask is placed on the substrate. The film forming method according to claim 11 or 12, wherein the film has a uniform shape.   The film forming method according to claim 11, wherein a planar shape of the hole arrangement region is substantially the same as a planar shape of the functional film forming region.   The film forming method according to claim 11, wherein each of the plurality of small holes is formed at a position inscribed in an outer shape line of the hole arrangement region.   Each of the plurality of small holes constituting the peripheral mask hole or the second mask hole, the central mask hole, and the first mask hole are a set of a plurality of minute holes. The film formation method of any one of Claims 1 thru | or 15. A method of manufacturing an electro-optic substrate having a functional film,
17. A method for manufacturing an electro-optic substrate, wherein at least one type of the functional film is formed by using the film forming method according to any one of claims 1 to 16. A method of manufacturing an electro-optical device having a functional film,
17. A method for manufacturing an electro-optical device, wherein at least one type of the functional film is formed by using the film forming method according to any one of claims 1 to 16.

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