JP4969661B2 - Electronic control unit and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic control unit in which an electronic board on which an atmospheric pressure sensor is mounted is housed in a housing and provided with a vent hole communicating with outside air, and to an improvement of the manufacturing method thereof.

In a conventional in-vehicle engine control device, an atmospheric pressure sensor is built in the engine control device to measure the atmospheric pressure required for engine control, and it is waterproof to install the engine control device in the engine room. It is done to structure.
For example, according to the engine control device of Patent Document 1, in the engine control control unit disposed in the engine room, the control unit includes a filter that allows only air that does not allow various liquids such as oil and water to enter the control unit. Disclosed is a waterproof engine control device with a built-in sensor, characterized by having a structure and a built-in atmospheric pressure sensor inside the control unit. Located near the hole, the inlet of the air introduction hole of the waterproof control unit is equipped with at least two or more, thereby reducing the influence of various liquids on the control unit and detecting pressure The response can be further improved.

In addition, according to the electronic control device in which the atmospheric pressure sensor of Patent Document 2 is assembled, the atmospheric pressure sensor is provided in the connector mounting portion outside the housing, so that the housing containing the electronic substrate is hermetically sealed and the air introduction filter An electronic control device that eliminates the need is disclosed.
Further, according to the conventional example shown in Patent Document 2, the electronic control device mounts the atmospheric pressure sensor and the electronic component on the same board and accommodates them in the casing, and the opening of the casing has an interior of the casing. An air introduction filter is provided for introducing air into the housing while preventing foreign matter from entering the air and protecting the atmospheric pressure sensor and electronic components from water and dust.

Japanese Patent Laid-Open No. 2004-1000063 JP 2007-290526 A

In the engine control device according to Patent Document 1, a plurality of electronic boards are housed in a three-piece sealed casing made up of a base, an annular frame, and a cover, an atmospheric pressure sensor is mounted on one small board, and an electronic component is mounted. It is comprised so that it may connect with respect to a board | substrate.
In the embodiment of this Patent Document 1, there is a problem that a plurality of substrates and assembly operations and mutual connection operations of the respective substrates are required, resulting in a large and expensive problem, and a waterproof filter is provided for the air introduction hole. However, there is a risk that migration (conductive crystals) and whiskers (conductive whiskers) may occur between the electrodes of high-density mounting components mounted on the electronic substrate due to high humidity air entering the housing. . In order to prevent this, if it is intended to apply a moisture-proof coating to the electronic substrate, it is necessary to perform a weathering process so that the moisture-proof material does not enter the vent hole provided in the atmospheric pressure sensor, and workability is deteriorated. In addition, if forgetting to remove the coating after the coating process, the atmospheric pressure sensor will not function and the quality will deteriorate.

On the other hand, the electronic control device according to Patent Document 2 is a one-piece sealed housing in which one electronic board is inserted from the opening surface of a case of a flat hollow pentahedron and the opening surface is sealed by a pair of connectors. In this case, only electronic components are mounted on the electronic board, and the atmospheric pressure sensor is built in a connector outside the housing.
In the example of this Patent Document 2, since it is necessary to attach an atmospheric pressure sensor in a connector in which a large number of connector pins are densely packed, work efficiency is deteriorated. Further, even if the atmospheric pressure sensor is disposed in the connector, it is necessary to prevent water from entering from the outside and ensure ventilation, and the structure is complicated compared to the conventional example, so there is a concern that the quality may be lowered.

The first object of the present invention is to mount a high-density electronic component and an atmospheric pressure sensor on the same electronic substrate, and to apply a moisture-proof coating to the high-density electronic component, and the atmospheric pressure sensor has a moisture-proof material. To provide an electronic control unit that improves work efficiency and quality without mixing.
A second object of the present invention is to provide an electronic control unit arranged so that an electronic substrate is not enlarged by mounting an atmospheric pressure sensor.

An electronic control unit according to the present invention comprises:
An electronic control unit in which an electronic board on which an atmospheric pressure sensor is mounted is housed in a housing, and an external air vent is provided in the housing, and a plurality of connection pin groups are inserted into an edge of the electronic board The electronic board has a first surface on which the connector housing is mounted, and a second surface that is the opposite surface of the first surface, and the first surface and the second surface are respectively It is divided into a first region and a second region, and in the first region, a surface-mounted component that is soldered and connected to one or both of the first surface side and the second surface side is mounted, and the surface The mounting component is coated with a moisture-proof material, and in the second region, the connection pins of the plurality of connection pin groups are inserted through the locator from the first surface to the second surface and soldered on the second surface side. And the locator is connected to the plurality of locators. The connecting pin group has a connecting pin through-hole, and the locator corrects and aligns the tips of the plurality of connecting pins, and the aligned connecting pins are provided in the second region of the electronic substrate through-hole plating. The element vent hole provided in the atmospheric pressure sensor is inserted into the hole, and is a second region of the electronic substrate, and is an inter-group position formed by a space of the plurality of connection pin groups Alternatively, the second regions on the first and second surfaces of the electronic substrate are provided as side regions and are classified as regions where high-density components are not mounted and coating treatment with the moisture-proof material is not required.

The manufacturing method of the electronic control unit according to the present invention is as follows:
An electronic control unit manufacturing method comprising an electronic board on which an atmospheric pressure sensor is mounted, and an outside air vent hole is provided in a housing for housing the electronic board. A component assembly process in which a plurality of connection pin groups are inserted in advance with respect to the connector housing, and a first surface side of the first surface or the first surface and the second surface of the electronic substrate, A soldering process in which a surface mounting component or a surface mounting component on the second surface side is mounted and reflow soldering is performed, and the surface mounting component is immersed in a solution obtained by diluting a moisture-proof material with a solvent or heated by spraying. Alternatively, in the second region that is the edge position of the electronic substrate and the moisture-proof treatment step that is dried at room temperature, the plurality of connection pin groups are inserted through the first surface to the second surface through a locator, and the second surface side Equipped with a post-soldering process to perform soldering connection at the front An element vent provided in the atmospheric pressure sensor is a second region of the electronic substrate, and is provided at an intergroup position or a side end position of the locator, and the second of the first and second surfaces of the electronic substrate. The area is classified as an area where a high density component is not mounted and a coating treatment with the moisture-proof material is not required.

An electronic control unit according to the present invention divides an electronic substrate housed in a housing into first and second regions, and mounting components are mounted on the first region to perform moisture-proof coating, and no moisture-proof coating is performed. In the two regions, a connection pin group inserted into the connector housing and an atmospheric pressure sensor are provided at the position between the groups of the plurality of connection pin groups or at the side end position.
Therefore, since the atmospheric pressure sensor is not mounted in the first area, it is not necessary to attach or detach the masking tape for the element ventilation hole leading to the detection element provided in the atmospheric pressure sensor before and after performing the moisture-proof coating process. This improves the quality because there is no concern about the detection performance deterioration due to penetration of the moisture-proof material into the atmospheric pressure sensor detection part due to defective masking tape sticking or the quality deterioration due to forgetting to remove the masking tape. In addition, since a large number of connector connection pins are divided into a plurality of groups, an excessive insertion / extraction force does not act on the attachment / detachment of the connector, and the space generated between the groups of the plurality of connector housings or at the side end positions is utilized. Since the atmospheric pressure sensor is mounted, there is an effect of preventing an increase in the size of the apparatus.

It is a sectional side view which shows the electronic control unit in Embodiment 1 of this invention. It is a top view which shows the electronic control unit in Embodiment 1 of this invention. It is a figure which shows the locator used in FIG. 1, (a) is a top view, (b) is a side view. It is sectional drawing which expands and shows a part of electronic control unit in Embodiment 1 of this invention. It is a figure which shows the atmospheric pressure sensor which is the surface mounted component used in FIG. 1, (a) is a top view, (b) is a side view. It is a flowchart which shows the assembly of an electronic control unit in each embodiment of this invention, and a manufacturing process. It is a sectional side view which shows the electronic control unit in Embodiment 2 of this invention. It is a top view which shows the electronic control unit in Embodiment 2 of this invention. It is a figure which shows the locator used in FIG. 7, (a) is a top view, (b) is a side view. It is a figure which shows the atmospheric pressure sensor which is a lead component used in FIG. 7, (a) is a top view, (b) is a side view. It is a top view which shows a part of electronic control unit in Embodiment 3 of this invention. It is a side view which shows the electronic control unit in Embodiment 3 of this invention. It is a side view which shows the electronic control unit in Embodiment 4 of this invention. FIG. 10 is a plan view showing a part of an electronic control unit according to Embodiment 4 of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In addition, the same code | symbol shows the same or an equivalent part between each figure.

Embodiment 1 FIG.
A first embodiment of the present invention will be described below with reference to FIGS. 1 and 2 with reference to FIGS.
1 and 2, the electronic control unit 100 has a housing 100A composed of a base 110 and a cover 120, and one end edge portion of the housing 100A is opposed to connector housing portions 121A and 121B for introducing connection pins described later. The electronic board 130 is housed in an air pressure sensor, and the atmospheric pressure sensor 140 is mounted on the electronic board.
The base 110 is made of, for example, an aluminum die-cast or a highly heat-conductive material made of sheet metal to dissipate heat generated by the heat generating component 134 (FIG. 4) mounted on the electronic board 130. For example, it is attached and fixed to a vehicle via a foot. The base 110 is provided with an outside air vent 116 having a diameter of 2 mm or more, for example, at a position closer to the atmospheric pressure sensor 140 than the central portion of the base 110. The outside air vent 116 prevents passage of water or oil. It is sealed off by a breathable (breathable) waterproof filter 115. The waterproof filter 115 is generally commercially available as a water repellent filter. For example, a filter having a diameter of 6 mm, a film thickness of 100 μm, and a particle hole diameter of 1 μm thermally bonded to a resin guide plate is bonded to the base 110 with silicon. It is designed to be fixed by bonding with a bond.

For example, a resin molded product is used for the cover 120, and first and second connector housings 121A and 121B for introducing connection pins are integrally formed on the end surface of the cover 120 (left side in FIGS. 1 and 2). The first and second connection pin groups 122A and 122B are press-fitted and fixed to the pair of connector housings.
The first and second connection pin groups 122A and 122B are bent at a right angle, one end of which is contact-connected to a connection pin group mounted on a mating connector (not shown), and the other end is an end portion of the electronic board 130. It is designed to be soldered to the second region described later.

  The electronic board 130 includes a first surface 130A that faces the cover 120 and a second surface 130B that faces the base 110. The first surface 130A and the second surface 130B are connected to the connector housing portion 121A as shown in FIG. The second region and the first region are formed by dividing (dividing) into a side close to 121B and a side far from 121B.

  In the first region of the electronic substrate 130, the surface mount component 131A, which is a high-density component on the first surface 130A side, and the surface mount component 131B on the second surface 130B side are soldered and connected. It is coated with moisture-proof materials 132A and 132B using a soft polymer resin that does not liquefy and flow in a high temperature use environment. The surface-mounted component may be provided only on the first surface side. In this case, the coating process may be performed only on the first surface side.

In the second region which is one end edge (left side in FIG. 1) of the electronic substrate 130, the first and second connection pin groups 122A and 122B penetrate from the first surface 130A to the second surface 130B, Solder connection is made on the surface side.
The electronic substrate 130 is provided with a substrate vent hole 133 that connects the space A on the first surface 130 A side facing the cover 120 and the space B on the second surface 130 B side facing the base 110. Is provided in the second region of the electronic substrate 130, or provided in a position close to the atmospheric pressure sensor 140 in the first region. The vent hole has a diameter larger than the thickness of the substrate 130 and is not blocked by the moisture-proof material coating process. As an example of the size of the substrate vent 133, it is appropriate that the diameter of the substrate vent is 2.0 mm or more with respect to the electronic substrate 130 having a thickness of 1.0 mm to 1.6 mm.
In the case where the substrate vent 133 is provided at a position close to the atmospheric pressure sensor 140 in the second region, when the electronic substrate is immersed vertically in the moisture-proof coating process (see the moisture-proof process described later), It is provided at a position that is not affected by the liquid level fluctuation.

  The atmospheric pressure sensor 140 is a second region of the first surface 130A of the electronic substrate 130, and as shown in FIG. 2, the inter-group position 152A between the first connection pin group 122A and the second connection pin 122B. This region, that is, the second region of the first and second surfaces of the electronic substrate 130 is not mounted with a high-density component, and therefore does not require a coating treatment with a moisture-proof material like the first region. The area is divided (see FIG. 5 described later for the configuration of the atmospheric pressure sensor 140).

A guide member (hereinafter referred to as “locator”) 150 shown in FIG. 3 is provided at the tip of the first and second connection pin groups 122A and 122B, and the positions of a large number of connection pins are corrected and aligned by the locator 150. The electronic substrate 130 is inserted into a large number of through-hole plating holes 130 </ b> C provided in the second region.

2, FIG. 3A and FIG. 3B, the locator 150 includes a first portion 151A, a second portion 151B, an inter-group portion 152A, and a side end portion 152B, and the first portion 151A includes a first portion 151A. A large number of connection pin through holes 153A into which one connection pin group 122A is inserted are provided, and a plurality of connection pin through holes 153B into which the second connection pin group 122B is inserted are provided in the second portion 151B. .
The first portion 151A and the second portion 151B of the locator 150 are adjacent to and opposed to the first surface of the electronic substrate 130. However, the first portion 151A and the second portion 151B are connected to each other. In order to bypass the atmospheric pressure sensor 140, at least a part of the inter-group portion 152A for integration is formed as a separated portion having a large gap with the first surface of the electronic substrate 130, and the separated portion is a plurality of orthogonal portions. It has a three-dimensional structure with a bridge that combines surfaces.
Therefore, the atmospheric pressure sensor 140 is mounted in the space of the first surface portion formed by this separated portion.
Further, the side end portion 152B of the locator 150 is engaged with an engaging portion (not shown) provided on the inner surface of the cover 120 to correct the assembly position of the entire locator 150.

  As described above, the locator 150 is adjacent to the electronic substrate 130 to facilitate the insertion of connection pins, while the inter-group portion 152A or the side end portion 152B is formed in a bridge shape from the first surface 130A of the electronic substrate. There is a feature that allows the atmospheric pressure sensor to be arranged apart.

The housing 100A in which the electronic substrate 130 is housed includes a base 110 and a cover 120 whose outer periphery is sealed and fixed with a waterproof sealing material 112.
In FIG. 4 showing the mounting structure of the base 110 and the cover 120, the four corners of the base 110 and the cover 120 are fixed by fixing screws 113. The base 110 includes an annular protrusion 111, and the annular protrusion 111. Is fitted with an annular recess 120A provided on the cover 120 side, and a waterproof sealing material 112 is applied to the annular recess 120A.

  Further, the heat generating component 134 mounted on the electronic board 130 transfers heat to the base 110 through the surface pattern provided on both surfaces of the electronic board 130, a number of through-hole plating holes connecting the same and the heat transfer bond 114. To dissipate heat.

5A and 5B, the atmospheric pressure sensor 140, which is a surface-mounted component, is connected to a detection element 143, which is a piezoelectric element built in a resin storage package 140A, and a power supply terminal and a signal terminal. The surface connection terminals 141A and 141B are provided, and the storage package 140A is provided with element vent holes 142A and 142B that allow the outside air to communicate with the detection element 143.
Note that the surface connection terminals 141A and 141B of the atmospheric pressure sensor 140 may be lead terminals which will be described later with reference to FIG. 10, and the attachment position of the atmospheric pressure sensor 140 may be a side end position of the locator 150.

Next, a method for manufacturing the electronic control unit 100 described above will be described.
Hereinafter, the assembly and manufacturing process of the electronic control unit 100 will be described with reference to the flowchart shown in FIG.
In FIG.
(1) Process 600 is a start step of assembly work.
(2) Parts assembly process 601
(2-1) In the subsequent step 601A, the waterproof filter 115 is bonded and fixed to the base 110.
(2-2) In the subsequent step 601B, the first and second connector housings 121A of the cover 120 are displayed.
, 121B, the first and second connection pin groups 122A, 122B are press-fitted and fixed, and the locator 150 is attached.
(3) Soldering process 610A for the first surface of the electronic substrate
(3-1) The subsequent step 602A is a start step of the surface mounting reflow soldering step 610A for the first surface 130A of the electronic substrate, and is installed in the reflow soldering line with the first surface 130A as the upper surface.
(3-2) In the subsequent step 603A, a metal mask is set on the first surface 130A of the electronic substrate, and cream solder is applied to the solder connection portion.
(3-3) In the subsequent step 604A, the surface mount component 131 is applied to the first surface 130A of the electronic substrate.
A, the atmospheric pressure sensor 140 and the heat generating component 134 are mounted.
(3-4) In subsequent step 605A, the cream solder applied in step 603A is heated and melted to perform reflow soldering, and then blower cooling is performed. (The soldering process 610A is completed)

(4) Soldering process 610B for the second surface of the electronic substrate
(When the surface-mounted component is soldered to the second surface of the electronic substrate 130, reflow soldering is performed in the same manner as the soldering step 610A of the first surface 130A. However, the reflow soldering is performed on the second surface 130B. In the case of an electronic substrate that is not performed, the process block 610B is omitted)
(4-1) In step 602B, the electronic substrate 130 is installed upside down.
(4-2) In step 603B, solder printing on the second surface is performed.
(4-3) In step 604B, the surface mounting component 131B is mounted.
(4-4) In step 605B, heating and cooling are performed.
(5) Moisture-proof treatment step 611
(5-1) In the subsequent step 611, the first region of the electronic substrate 130 on which the surface mounting components are soldered is mounted on both sides of the immersion bath filled with the moisture-proof material solution in which the moisture-proof material and the diluent are mixed. Pickle (dipping). However, in the case of single-sided mounting, the moisture-proof material solution can be applied by spraying.
In addition, as a moisture-proof material, it is suitable to mix a silicone resin, which is a soft polymer resin, and a petroleum solvent as a primary diluent, and to use a mixed liquid having a viscosity of 7 to 14 Pa at a room temperature environment of 25 ° C. as a raw material. The moisture-proof material solution is managed so that normal hexane is mixed as a secondary diluent with respect to the mixed solution, and the specific gravity as the solution becomes a predetermined value.
(5-2) The applied moisture-proof material solution is heat-dried or naturally dried at room temperature, whereby the primary diluent and the secondary diluent are vaporized, and a coating film is formed by the remaining silicone resin.
(6) Post soldering process 612
(6-1) The subsequent step 606 is a post-soldering step for soldering the first and second connection pin groups 122A and 122B mounted on the first surface 130A of the electronic substrate 130 on the second surface 130B side. In step 612, the first surface 130A of the electronic substrate 130 is placed on the jet solder line with the first surface 130A as the upper surface.
(6-2) In the subsequent step 607, the first and second connection pin groups 122A and 122B integrated with the cover 120 and fitted with the locator 150 in step 601B are attached to the first surface 130A of the electronic board 130. Insert.
(6-3) In the subsequent step 608, molten solder is brought into jet contact from the second surface 130B side of the electronic substrate 130 to connect the front ends of the first and second connection pin groups 122A and 122B and the connection land of the electronic substrate 130. After the solder connection, blower cooling is performed. (The post soldering process 612 is completed)

(7) Overall assembly process 613
In subsequent step 613, the second surface 130B of the electronic substrate integrated with the cover 120 is set as an upper surface on the jig, and a waterproof seal is provided on the annular recess 120A provided on the outer peripheral end surface of the cover 120 as shown in FIG. The material 112 is applied, the heat transfer bond 114 is applied to the back side of the heat generating component 134, and then the cover 120 and the base 110 are integrated by the fixing screw 113. Instead of attaching the waterproof filter 115 in step 601A, the waterproof filter 115 may be attached in step 613.
(8) Adjustment and inspection process 614
In the subsequent step 614, the mating connector is connected to the first and second connection pin groups 122A and 122B and the electronic control unit 100 is energized to perform performance inspection, initial adjustment, and appearance inspection.
If the inspection and adjustment are performed satisfactorily, the process proceeds to a work end process 609. If the inspection is defective, the process proceeds to an analysis process (not shown).
(9) Work completion step 609

  The housing 100A of the electronic control unit 100 shown in FIG. 1 has a two-piece structure composed of a base 110 and a cover 120. However, the cover 120 is attached to the outer periphery of the contour and the ceiling wall surface. It is also possible to adopt a configuration in which the three-piece structure is divided and the ceiling wall surface is sealed and fixed after the non-defective product is confirmed. In this case, there is a feature that it is possible to inspect the conduction state of each part using the needle-like probe in the analysis processing step after the inspection failure.

Next, the main points and effects of the electronic control unit in the first embodiment will be described.
As is clear from the above description, in the electronic control unit 100 according to Embodiment 1 of the present invention, the electronic board 130 on which the atmospheric pressure sensor 140 is mounted is housed in the housing 100A, and the outside air vent 116 is provided in the housing. The electronic control unit is provided with a plurality of connector housings 121A and 121B in which a plurality of connection pin groups 122A and 122B are inserted at one end edge of the electronic board 130, and the electronic board 130 is mounted with a connector housing. The first surface 130 </ b> A and the second surface 130 </ b> B opposite to the first surface are divided into a first region and a second region, respectively.

  One or both of the surface mounting component 131A on the first surface side and the surface mounting component 131B on the second surface side are soldered and connected to the first region, and the surface mounting component does not liquefy and flow in a high temperature use environment. It is coated with moisture-proof materials 132A and 132B using resin, and in the second region, the connection pins 122A and 122B of the plurality of connection pin groups penetrate from the first surface 130A to the second surface 130B via the locator 150. After being inserted, soldering connection is performed on the second surface 130B side.

  The locator 150 includes connection pin through-holes 153A and 153B through which a plurality of connection pin groups pass. The locator corrects and aligns the front end portions of the plurality of connection pins, and the aligned connection pins are the second of the electronic substrate. The element vent holes 142A and 142B provided in the atmospheric pressure sensor 140 are the second area of the electronic board, and are inserted into the through hole plating holes 130C provided in the area. The second area of the first surface 130A and the second surface 130B of the electronic board provided at the inter-group position 152A (or the side edge position) of the group does not require high-density components and does not require a coating treatment with a moisture-proof material. It is classified as an area.

The atmospheric pressure sensor 140 includes a detection element 143 incorporated in the storage package 140A, and connection terminals 141A and 141B which are surface connection terminals or lead terminals to which a power supply terminal and a signal terminal are connected. Element locating holes 142A and 142B that communicate with the detecting element 143 are provided, and the locator 150 is positioned between the inter-group part 152A that interconnects the divided parts corresponding to the plurality of connection pin groups, and at both ends of the locator. Side end portion 152B.
At least one portion of the inter-group portion 152A or the side end portion 152B is the atmospheric pressure sensor 1
In order to bypass 40, the gap between the electronic substrate 130 and the first surface is increased.

As described above, in connection with the second aspect of the present invention, the connection pins of the plurality of connection pin groups 122A and 122B are corrected and aligned by the locator 150 and mounted on the electronic board 130, and the divided portions of the locator 150 are divided. The intergroup portion 152A or the side end portion 152B to be connected has a structure that bypasses the atmospheric pressure sensor 140.
Therefore, the locator 150 can easily insert the connection pin by facing the electronic substrate 130 adjacently, while separating the inter-group portion 152A or the side end portion 152B from the first surface 130A of the electronic substrate, and thus the atmospheric pressure. There is a feature that allows placement of the sensor 140.

  The housing 100A in which the electronic board 130 is housed is composed of a base 110 and a cover 120 whose outer periphery is sealed and fixed with a waterproof sealing material 112. The base 110 generates heat generated by the heat generating component 134 mounted on the electronic board 130. The base 110 is provided with an outside air vent 116.

  The outside air vent 116 is provided at a position closer to the atmospheric pressure sensor 140 than the central portion of the base 110, and the outside air vent 116 is sealed by a waterproof filter 115 that can ventilate but prevents liquid from entering. The electronic board 130 is provided with a board air vent 133 that connects the space A on the first surface 130A side facing the cover 120 and the space B on the second face 130B side facing the base 110.

  The substrate vent 133 is provided in the second region of the electronic substrate 130, or when provided in a position close to the atmospheric pressure sensor 140 in the first region, the moisture-proof material has a diameter larger than the thickness of the electronic substrate 130. The vent holes have a size that is not blocked by the coating process of 132A and 132B (see paragraph 0017).

As described above, in relation to the fifth aspect of the present invention, the housing 100A for housing the electronic substrate 130 is constituted by the base 110 having the cover 120 and the outside air vent 116, and the outside air vent 116 is a waterproof filter. The electronic substrate 130 is provided with a substrate vent hole 133.
Accordingly, the space B formed by the base 110 and the second surface 130B of the electronic board 130 becomes a high temperature due to the heat generated by the heat-generating components mounted on the electronic board 130, and eventually becomes a temperature cycle that is cooled by the outside air when the operation is stopped. Correspondingly, a breathing action is performed by the outside air vent, and the atmospheric pressure sensor environment is characterized in that an atmospheric pressure state is secured through the substrate vent 133.

Next, the main points and effects of the manufacturing method in the first embodiment will be described.
A method of manufacturing an electronic control unit 100 that includes an electronic board 130 on which an atmospheric pressure sensor 140 is mounted, and is provided with an outside air vent 116 in a housing 100A for housing the electronic board.
A component assembling step 601 in which a plurality of connection pin groups 122A and 122B are inserted in advance into a plurality of connector housings 121A and 121B provided in a part of the housing 100A;
Reflow soldering is performed by mounting the first surface side surface mounted component 131A or the second surface side surface mounted component 131B on the first surface 130A of the electronic substrate 130 or each first region of the first surface and the second surface 130B. Soldering process 610A, 610B for performing the moisture proofing treatment process 611 for immersing the moisture-proofing material 132A, 132B in a solution diluted with a solvent with respect to the surface mount component, or spraying and heating or drying at room temperature, and the electronic substrate 130 In the second region, which is the edge position of the solder, post-connecting solder that inserts a plurality of connection pin groups from the first surface 130A to the second surface 130B through the locator 150 and performs soldering connection on the second surface 130B side The element vent holes 142A and 142B provided in the atmospheric pressure sensor 140 are the second region of the electronic substrate 130 and the inter-group position 152A or locator 150 of the locator 150. Provided 152B side end position, the first electronic substrate 130, the second surface 130A, the second region of 130B is partitioned as a region that does not require a coating process by moisture-proof material is not densely component mounting.

As described above, in the method for manufacturing an electronic control unit according to the present invention, the electronic substrate 130 housed in the housing 100A is divided into the first and second regions, and the high-density surface mount component is mounted on the first region. In the second region where the moisture-proof coating is performed and the moisture-proof coating is not performed, the plurality of connection pin groups inserted into the plurality of connector housings, and the atmospheric pressure at the inter-group position 152A or the side end position 152B of the plurality of connection pin groups A sensor 140 is provided.
Accordingly, since the atmospheric pressure sensor 140 is not mounted in the first region, the masking tape of the element vent holes 142A and 142B communicating with the detection element 143 provided in the atmospheric pressure sensor 140 is attached and detached before and after performing the moisture-proof coating process. There is no need to improve workability. In addition, since the atmospheric pressure sensor 140 is mounted using the space generated at the inter-group position 152A or the side end position 152B of the plurality of connector housings, there is an effect of preventing an increase in size of the apparatus.

  The first region of the electronic board 130 on which the first and second surface-mounted components 131A and 131B are soldered and mounted has both sides facing the immersion bath filled with a moisture-proof material solution in which a moisture-proof material and a diluent are mixed. The moisture-proof material is applied by dipping or spraying a moisture-proof material solution on one side, and the diluent is vaporized by leaving the applied moisture-proof material solution heated or dried at room temperature. A coating film is produced by the moisture-proof material.

  Moisture-proof materials 132A and 132B that serve as moisture-proof coating films are soft polymer resins that limit liquefaction outflow in a high-temperature use environment after the diluent is vaporized. Things are being used.

As described above, in connection with the ninth aspect of the present invention, the first region of the electronic substrate 130 is subjected to a coating treatment for moisture prevention using a soft polymer resin that does not liquefy and flow out in a high temperature environment.
Accordingly, migration and whisker generation between the electrodes of the high-density electronic component due to the high-humidity air flowing from the outside air vent 116 is prevented, and excessive stress is applied to the soldered portion due to the drying and hardening of the moisture-proof materials 132A and 132B. The moisture-proof material does not enter the element vent holes 142A and 142B of the atmospheric pressure sensor 140 due to liquefaction flow.

  The atmospheric pressure sensor 140 includes surface connection terminals 141 </ b> A and 141 </ b> B connected to the detection element 143 and element ventilation holes 142 </ b> A and 142 </ b> B provided in the storage package 140 </ b> A. The atmospheric pressure sensor 140 is a first surface of the electronic substrate 130. Mounting and reflow soldering are performed in the same process as mounting and reflow soldering of the surface mount component 131A mounted on 130A, but dipping or spraying processing with respect to the moistureproof material solution is not performed in the moistureproof coating process.

As described above, in relation to claim 10 of the present invention, the atmospheric pressure sensor 140 is a surface mounting component, and is mounted in the same process as mounting and soldering of the surface mounting component to the first surface 130A of the electronic substrate. Soldering is performed, and the coating process is excluded.
Accordingly, the atmospheric pressure sensor 140 does not require a single mounting and soldering process, and only the coating process needs to be excluded, so that the assembly process is not complicated.
Note that the second region of the electronic substrate 130 into which the first and second connection pin groups 122A and 122B are inserted is a region where the coating process should not be performed, so that a special process for the atmospheric pressure sensor 140 is unnecessary. It will be.

Embodiment 2. FIG.
Hereinafter, Embodiment 2 of the present invention will be described with reference to FIGS. 9 and 10 based on FIGS. 7 and 8 while focusing on the differences from Embodiment 1 described in FIGS.
In each figure, the reference numerals in the first embodiment in which the codes in the 100s are replaced with codes in the 200s indicate the same or corresponding parts.

7 and 8, the electronic control unit 200 includes a casing 200A composed of a base 210 and a cover 220, and one end edge portion facing the connector housing sections 221A, 221B, and 221C for introducing connection pins in the casing. The electronic board 230 is housed, and an atmospheric pressure sensor 240 mounted on the electronic board.
For example, the cover 220, which is a resin molded product, is provided with an outside air vent 226 having a diameter of 2 mm or more, for example, and the outside air vent 226 is sealed by a breathable waterproof filter 225 that prevents passage of water or oil. . The waterproof filter 225 is fixed by being bonded to the cover 220 with a silicon bond via a resin guide plate.

The first, second, and third connector housings 221A, 221B, and 221C are integrally formed on the end surface of the cover 220 (left side in FIGS. 7 and 8). Three connection pin groups 222A, 222B, and 222C are press-fitted and fixed.
The first, second, and third connection pin groups 222A, 222B, and 222C are bent at right angles, one end of which is contact-connected to a connection pin group that is mounted on a mating connector (not shown), and the other end is an electronic board. 230 is soldered to the second region, which is the edge of 230.
The electronic board 230 includes a first surface 230A that faces the cover 220 and a second surface 230B that faces the base 210, and the first surface 230A and the second surface 230B each have a first region as shown in FIG. And the second area.

  The first surface side surface mount component 231A and the second surface side surface mount component 231B are soldered and connected to the first region which is one end edge of the electronic substrate 230. These surface mount components are used at high temperatures. It is coated with moistureproof materials 232A and 232B using a soft polymer resin that does not liquefy and flow in the environment. The surface-mounted component may be provided only on the first surface side. In this case, the coating process may be performed only on the first surface side.

  In the second region, which is the other end edge of the electronic substrate 230, the first, second, and third connection pin groups 222A, 222B, and 222C penetrate the second surface 230B from the first surface 230A and pass through the second surface. Solder connection is made on the 230B side.

The atmospheric pressure sensor 240 is a second region of the first surface 230 </ b> A of the electronic substrate 230 and is provided at one end position of the first and third connection pin groups 222 </ b> A and 222 </ b> C. The second regions of the first and second surfaces 230A and 230B are classified as regions where high-density components are not mounted and coating with a moisture-proof material is not required.
The electronic substrate 230 is provided with a substrate vent hole 233 that connects the space A on the first surface 230A side facing the cover 220 and the space B on the second surface 230B side facing the base 210. When the 233 is provided in the second region of the electronic substrate 230 or provided at a position close to the atmospheric pressure sensor 240 in the first region, the 233 has a diameter larger than the thickness of the substrate and is not blocked by the moisture-proof material coating process. It is a large vent.

A locator 250 shown in FIG. 9 is provided at the tip of the first, second, and third connection pin groups 222A, 222B, and 222C. After the locator 250 corrects and aligns the positions of a large number of connection pins, the electronic board 230 is provided. This is inserted into a large number of through-hole plating holes 230C provided in the second region.
9A and 9B, the locator 250 includes a first portion 251A, a second portion 251B, a third portion 251C, an intergroup portion 252A, and a side end portion 252B. A plurality of connection pin through holes 253A into which the first connection pin group 222A is inserted are provided, and a plurality of connection pin through holes 253B into which the second connection pin group 222B is inserted are provided in the second portion 251B. The third portion 251C is provided with a plurality of connection pin through holes 253C into which the third connection pin group 222C is inserted.

The first portion 251A, the second portion 251B, and the third portion 251C of the locator 250 are adjacently opposed to the first surface 230A of the electronic substrate 230, but the side end portion 252B is as shown in FIG. In addition, at least a part of the electronic substrate 230 is separated from the first surface 230 </ b> A in order to bypass the atmospheric pressure sensor 240. In FIG. 8, the atmospheric pressure sensor 240 is disposed on the lower side end portion 252B. Further, the side end portion 252B of the locator 250 is engaged with an engaging portion (not shown) provided on the inner surface of the cover 220 to correct the assembly position of the entire locator 250.

The mounting structure of the base 210 and the cover 220 is the same as the mounting structure of the base 110 and the cover 120 described above with reference to FIG. 4, and will be described with reference to FIG.
The cover 220 is fixed by fixing screws 213 at four corners. That is, an unillustrated annular protrusion (111 in FIG. 4) of the base 210 is fitted into an unillustrated annular recess (120A in FIG. 4) provided on the cover 220 side, and a waterproof sealing material (in FIG. 112) is applied. Further, a heat generating component (not shown) (134 in FIG. 4) mounted on the electronic board 230 includes a planar pattern provided on both surfaces of the electronic board 230, a large number of through-hole plating holes 130C connecting the pattern, and a heat transfer (not shown). Heat is transferred to the base 210 through the bond to dissipate heat.

  10 (a) and 10 (b), an atmospheric pressure sensor 240, which is a lead component, includes a detection element 243 built in a resin storage package 240A, and a lead terminal 241A in which a power supply terminal and a signal terminal are connected. 241B, and the storage package 240A is provided with element vent holes 242A and 242B that allow the outside air to communicate with the detection element 243. The lead terminals 241A and 241B of the atmospheric pressure sensor 240 may be surface connection terminals as described above with reference to FIG.

Next, the manufacturing method of the electronic control unit 200 described above will be described with a focus on differences from the first embodiment with reference to the flowchart of FIG.
In FIG.
(1) Process 600 is a start step of assembly work.
(2) Parts assembly process 601,
(2-1) In the subsequent step 601A, the waterproof filter 225 is bonded and fixed to the cover 220.
(2-2) In the subsequent step 601B, the first, second, and third connection pin groups 222A, 222B, and 222C are connected to the first, second, and third connector housings 221A, 221B, and 221C of the cover 220. Is press-fitted and the locator 250 is mounted.
(3) Soldering process 610A for the first surface of the electronic substrate
(3-1) The subsequent step 602A is a start step of the surface mounting reflow soldering step 610A for the first surface 230A of the electronic substrate, and is installed in the reflow soldering line with the first surface 230A of the electronic substrate as the upper surface.
(3-2) In the subsequent step 603A, a metal mask is set on the first surface 230A of the electronic substrate, and cream solder is applied to the solder connection portion.
(3-3) In the subsequent step 604A, the surface mount component 23 is applied to the first surface 230A of the electronic substrate.
1A or a heat generating component (not shown) is mounted.
(3-4) In subsequent step 605A, the cream solder applied in step 603A is heated and melted to perform reflow soldering, and then blower cooling is performed. (The soldering process 610A for the first surface is completed)
(4) Soldering process 610B for the second surface of the electronic substrate
(Process when soldering a surface-mounted component to the second surface 230B of the electronic substrate)
(4-1) In step 602B, the electronic board 230 is installed upside down.
(4-2) In step 603B, solder printing on the second surface is performed.
(4-3) In step 604B, the surface mounting component 231B is mounted.
(4-4) In step 605B, heating and cooling are performed.
However, in the case of an electronic board that does not perform reflow soldering on the second surface, the process block 610B is omitted.
(5) Moisture-proof treatment step 611
The first area of the electronic substrate 230 on which the surface mounting components are soldered and mounted is soaked on both sides in a dipping tank filled with a moisture-proof material solution in which a moisture-proof material and a diluent are mixed, as in FIG. The

(6) Post soldering process 612,
(6-1) The subsequent step 606 is the first, second, and second mounting on the first surface 230A of the electronic substrate 230.
This is a start step of a post soldering process 612 for soldering the third connection pin groups 222A, 222B, and 222C on the second surface side, and is installed in the jet solder line with the first surface 230A of the electronic board as the upper surface. .
(6-2) In the subsequent step 607, the lead terminals 241A and 241B of the atmospheric pressure sensor 240 are inserted into the first surface 230A of the electronic substrate 230, and the locator 250 is attached by being integrated with the cover 220 in the step 601B. The formed first, second, and third connection pin groups 222A, 222B, and 222C are inserted into the first surface 230A of the electronic board 230.
(6-3) In the following step 608, molten solder is brought into jet contact from the second surface side of the electronic substrate 230, and the leading ends of the first, second, and third connection pin groups 222A, 222B, and 222C are After the lead terminals 241A and 241B of the atmospheric pressure sensor 240 are solder-connected to the connection lands of the electronic substrate 230, blower cooling is performed. (The post soldering process 612 is completed).
(7) Overall assembly process 613
In the subsequent step 613, the second surface 230B of the electronic substrate integrated with the cover 220 is placed on the jig as an upper surface, and a waterproof sealant is provided in the annular recess provided on the outer peripheral end surface of the cover 220 as shown in FIG. 112 is applied, a heat transfer bond is applied to the back side of the heat generating component, and then the cover 220 and the base 210 are integrated by the fixing screw 213.
(8) Adjustment and inspection process 614
In the subsequent step 614, the mating connector is connected to the first, second, and third connection pin groups 222A, 222B, and 222C, and the electronic control unit 200 is energized to perform performance inspection, initial adjustment, and appearance inspection.
If the inspection and adjustment are performed satisfactorily, the process proceeds to a work end process 609. If the inspection is defective, the process proceeds to an analysis process (not shown).
When performing a performance test in this step 614, intake or supply is performed from the outside of the waterproof filter 225, the inside of the electronic control unit 200 is depressurized or pressurized, and quality determination and initial calibration of the atmospheric pressure sensor 240 are performed. Whether or not the waterproofing process in the outer periphery of the outline of the base 210 and the case 220 is functioning normally is determined based on the detection output of the atmospheric pressure sensor 240.

  The housing 200A of the electronic control unit 200 shown in FIG. 7 has a two-piece structure composed of a base 210 and a cover 220, but the cover 220 is divided into a contour outer peripheral portion and a ceiling wall surface portion. It is also possible to use a three-piece structure in which the ceiling wall surface is sealed and fixed after the non-defective product is confirmed.

Next, the main points and effects of the electronic control unit in the second embodiment will be described.
As is apparent from the above description, in the electronic control unit 200 according to Embodiment 2 of the present invention, the electronic board 230 on which the atmospheric pressure sensor 240 is mounted is housed in the housing 200A, and the outside air vent 226 is provided in the housing. In the electronic control unit, a plurality of connector housings 221A, 221B, and 221C into which a plurality of connection pin groups 222A, 222B, and 222C are inserted are provided at one end edge of the electronic substrate 230, and the electronic substrate 230 is a connector. A first surface 230A on which the housing is mounted and a second surface 230B opposite to the first surface are provided, and the first surface and the second surface are divided into a first region and a second region, respectively.

  One or both of the surface mounting component 231A on the first surface side and the surface mounting component 231B on the second surface side are soldered and connected to the first region, and the surface mounting component does not liquefy and flow in a high temperature use environment. It is coated with moisture proof materials 232A and 232B using resin, and in the second region, each connection pin of a plurality of connection pin groups is inserted through the locator 250 from the first surface 230A to the second surface 230B. The soldering connection is performed on the second surface side.

  The locator 250 includes connection pin through-holes 253A, 253B, and 253C through which a plurality of connection pin groups pass. The locator corrects and aligns the tips of the plurality of connection pins, and the aligned connection pins are connected to the first of the electronic substrate. The element vent holes 242A and 242B provided in the atmospheric pressure sensor 240 are the second areas of the electronic board, and are inserted into the through-hole plating holes 230C provided in the two areas. Provided at the side end position 252B of the pin group, the second area of the first surface 230A and the second surface 230B of the electronic board is divided as an area where a high-density component is not mounted and a coating treatment with a moisture-proof material is not required. .

  The housing 200A in which the electronic substrate 230 is housed is composed of a base 210 and a cover 220 whose outer periphery is sealed and fixed with a waterproof seal material 112. The outside air vent hole 226 is provided at a position close to the outside, and the outside air vent hole is sealed by a waterproof filter 225 that can ventilate but prevents liquid from entering, and the electronic substrate 230 is opposed to the cover 220. Is a substrate vent 233 connecting the space A on the one side 230 </ b> A side and the space B on the second side 230 </ b> B facing the base 210, and is the substrate vent 233 provided in the second region of the electronic substrate 230? Or in the first area, the diameter is larger than the thickness of the substrate and is not blocked by the moisture-proof material coating process. And it has a ventilation hole.

As described above, in relation to the sixth aspect of the present invention, the housing 200 </ b> A for housing the electronic substrate is configured by the cover 220 having the base 210 and the outside air vent hole 226, and the outside air vent hole is sealed with the waterproof filter 225. In addition, a substrate vent 233 is provided in the electronic substrate 230.
Therefore, the atmospheric pressure environment of the atmospheric pressure sensor 240 provided on the first surface 230A of the electronic substrate is characterized by being close to the atmospheric environment of the outside air and accurately measuring the atmospheric pressure.
The space B formed by the base 210 and the second surface 230 </ b> B of the electronic board communicates with the outside air through the board air hole 233 and the outside air hole 226, and the generated heat of the heat generating component mounted on the electronic board 230. In accordance with the temperature cycle accompanying the above, there is a feature that the common waterproof filter 225 and the outside air vent 226 can perform a breathing action.

Next, the main points and effects of the manufacturing method in the second embodiment will be described.
A method of manufacturing an electronic control unit 200 that includes an electronic board 230 on which an atmospheric pressure sensor 240 is mounted, and has an outside air vent 226 provided in a housing 200A for housing the electronic board. A component assembly step 601 in which a plurality of connection pin groups 222A, 222B, and 222C are inserted in advance into the plurality of connector housings 221A, 221B, and 221C provided, and the first surface 230A of the electronic board 230, or the first Soldering steps 610A and 610B for performing reflow soldering by mounting the surface mounting component 231A on the first surface side or the surface mounting component 231B on the second surface side in each first region of the surface and the second surface 230B, and the surface mounting component Against moisture-proof material 2
A dampproof treatment step 611 in which 32A and 232B are immersed in a solution diluted with a solvent, or spray spraying to heat or dry at room temperature, and a second region which is an edge position of the electronic substrate 230, and a plurality of them are provided via a locator 250. And a post soldering step 612 for performing soldering connection on the second surface 230B side through the first surface 230A from the first surface 230A to the second surface 230B, and an element vent hole provided in the atmospheric pressure sensor 240 242A and 242B are second regions of the electronic substrate 230, which are provided at the inter-group position 252A or the side end position 252B of the locator 250, and the second regions of the first and second surfaces 230A and 230B of the electronic substrate 230 are In other words, it is classified as an area where a high-density component is not mounted and a coating treatment with a moisture-proof material is not required.

  In the case of the atmospheric pressure sensor 240 including the lead terminals 241A and 241B connected to the detection element 243 and the element ventilation holes 242A and 242B provided in the storage package, the atmospheric pressure sensor 240 corresponds to the first surface 230A of the electronic substrate 230. A plurality of connection pin groups 222A, 222B, and 222C mounted on the electronic substrate 230 are inserted and soldered in the same process as the insertion and soldering, and in the moisture-proof coating treatment step 611, dipping or spraying with respect to the moisture-proof material solution is performed. Is not done. That is, when the atmospheric pressure sensor 240 is a lead component, mounting and soldering are performed in the same process as mounting and soldering of the plurality of connection pin groups on the first surface 230A of the electronic substrate, and the coating process is excluded. It has become so.

As described above, in relation to the eleventh aspect of the present invention, the atmospheric pressure sensor 240 is a lead component, and in the same process as mounting and soldering of a plurality of connection pin groups to the first surface 230A of the electronic substrate. Mounting and soldering are performed, and coating processing is excluded.
Therefore, the atmospheric pressure sensor 240 does not require a single mounting and soldering process, and only the coating process needs to be excluded, so that the assembly process is not complicated.
Note that the second region of the electronic substrate 230 into which the plurality of connection pin groups are inserted is a region where the coating process should not be performed, and thus special processing for the atmospheric pressure sensor 240 is not necessary.

  The housing 200 </ b> A that houses the electronic substrate 230 is configured by a base 210 and a cover 220 whose outer periphery is sealed and fixed with a waterproof sealing material 112. A waterproof filter 215 is provided in the outside air vent 226 of the electronic control unit 200. In the entire assembly process 613 that is provided immediately before the final assembly process of the electronic control unit, a waterproof sealant is applied to the outer periphery of the cover 220 and the base 210 assembled with the electronic board 230 and fixed by the fixing screws 213. In the adjustment and inspection step 614 that are integrated and subsequent to the overall assembly step 613, a decompression or pressurization pump is connected to the outside air vent 226 by piping, and the output signal of the atmospheric pressure sensor 240 is monitored so Whether the detected atmospheric pressure of the sensor 240 is normal, or the prevention between the cover 220 and the base 210. Seal is adapted to check whether the reliably performed.

As described above, in relation to the twelfth aspect of the present invention, the electronic control unit includes the waterproof sealing material 112 provided between the base 210 and the cover 220 and the waterproof filter 225 for the outside air vent 226, and the final assembly process. In the adjustment / inspection step 613, the output signal of the atmospheric pressure sensor is monitored while reducing or increasing the pressure in the electronic control unit.
Therefore, it is possible to easily check whether the atmospheric pressure sensor 240 is operating normally and whether the waterproof seal mechanism is functioning normally using the atmospheric pressure sensor 240 built in the product. There is.

Embodiment 3 FIG.
Hereinafter, Embodiment 3 of the present invention will be described based on FIGS. 11 and 12 with reference to FIGS.
In addition, what replaced the code | symbol of the 100th series and the 200th series with the code | symbol of the 300th series in each figure has shown the same part or an equivalent part.

11 and 12, the electronic control unit 300 is housed in a housing 300A composed of a base 310 and a cover 320, and one end edge of the electronic control unit 300 is opposed to the connector housing portions 321A and 321B for introducing connection pins. The electronic substrate 330 and the atmospheric pressure sensor 340 mounted on the electronic substrate are used.
For example, the first and second connector housings 321A and 321B are integrally formed on the end surface of the cover 320 which is a resin molded product, and the intermediate portion of the first and second connector housings has a diameter of, for example, 2 mm or more. An outside air vent 326 is provided, and the outside air vent 326 is sealed with a breathable waterproof filter 325 that prevents passage of water or oil.
The waterproof filter 325 is bonded and fixed to the cover 320 with a silicon bond via a resin guide plate.

First and second connection pin groups 322A and 322B are press-fitted and fixed to the first and second connector housings 321A and 321B, and the first and second connection pin groups 322A are bent at right angles. One end of 322B is individually contact-connected to a connection pin group mounted on a mating connector (not shown), and the other end is solder-connected to a second region which is an end portion of the electronic substrate 330.
Similar to the first and second embodiments described above, the electronic board 330 includes a first surface 330A that faces the cover 320 and a second surface 330B that faces the base 310. It is divided into a first area and a second area.
In the first area of the electronic substrate 330, a surface-mounted component 331A on the first surface side and a surface-mounted component 331B on the second surface side are soldered and connected, and these surface-mounted components are liquefied and flowed in a high-temperature use environment. It is coated with moisture-proof materials 332A and 332B using a soft polymer resin that does not.
The surface-mounted component may be provided only on the first surface side 330A. In this case, the coating process may be performed only on the first surface side.

In the second region, which is the edge of the electronic substrate 330, the first and second connection pin groups 322A and 322B penetrate from the first surface 330A to the second surface 330B and are soldered and connected on the second surface 330B side. Is to be done.
The atmospheric pressure sensor 340 employs a surface connection terminal and is disposed between the first region and the second region in order to maintain the strength of the locator. That is, a part of the atmospheric pressure sensor 340 is a second region of the first surface 330A of the electronic substrate 330 and is provided between the first and second connection pin groups 322A and 322B. The second region of the first surface 330A and the second surface 330B of 330 is divided as a region where a high-density component is not mounted and a coating treatment with a moisture-proof material is not required.
The electronic substrate 330 is provided with a substrate vent hole 333 that connects the space A on the first surface 330A side facing the cover 320 and the space B on the second surface 330B side facing the base 310, and this substrate vent hole 333. Is provided in the second region of the electronic substrate 330, or when provided at a position close to the atmospheric pressure sensor 340 in the first region, the size is larger than the thickness of the substrate and is not blocked by the moisture-proof material coating process. (Refer to paragraph 0017).
Note that a locator 350 is provided at the tip of the first and second connection pin groups 322A and 322B, and the positions of a large number of connection pins are corrected and aligned by the locator 350 and then provided in the second region of the electronic substrate 330. It is designed to be inserted into a large number of through-hole plating holes.

The locator 350 includes a first portion 351A, a second portion 351B, an intergroup portion 352A, and a side end portion 352B, and the first portion 351A has a plurality of connection pin through holes into which the first connection pin group 322A is inserted. 353A is provided, and the second portion 351B is provided with a large number of connection pin through holes 353B into which the second connection pin group 322B is inserted.
The first portion 351A and the second portion 351B of the locator 350 are adjacent to and opposed to the first surface 330A of the electronic substrate 330, but the first portion 351A and the second portion 351B are connected to each other. The end edge portion of the inter-group portion 352A or the side end portion 352B to be integrated with each other is notched, and includes a notch portion K that is an incision portion so as to bypass the atmospheric pressure sensor 340. . Note that this inter-group portion 352A does not have a three-dimensional structure in which a plurality of orthogonal surfaces are combined, unlike the inter-group portion 152A in FIG. 3 and the side end portion 252B in FIG.
Further, the side end portion 352B of the locator 350 is engaged with an engaging portion (not shown) provided on the inner surface of the cover 320 to correct the assembly position of the entire locator 350.

The mounting structure of the base 310 and the cover 320 is the same as the mounting structure of the base 110 and the cover 120 described above with reference to FIG. 4, and will be described with reference to FIG.
The cover 320 is fixed to the base 310 by fixing screws 313 at four corners. That is, the base 310 is fitted with an unillustrated annular recess (120A in FIG. 4) provided on the cover 320 side with an unillustrated annular protrusion (111 in FIG. 4). 112) is applied.

Further, a heat generating component (not shown) mounted on the electronic substrate 330 is transferred to the base 310 via a planar pattern provided on both surfaces of the electronic substrate 330, a plurality of through-hole plating holes connecting the same, and a heat transfer bond (not shown). Heat is transferred to dissipate heat.
The atmospheric pressure sensor 340 includes a detection element 343 incorporated in a resin-made storage package 340A and surface connection terminals 341A and 341B to which a power supply terminal and a signal terminal are connected. The storage package 340A includes the outside air and the detection element 343. Element vent holes 342A and 342B are provided to communicate with each other.

The end surface of the storage package 340 </ b> A provided with the element vent holes 342 </ b> A and 342 </ b> B is a surface orthogonal to the electronic substrate 330 and is an end surface far from the first region of the electronic substrate 330.
Therefore, when the electronic substrate 330 is subjected to moisture-proofing treatment, the first region of the electronic substrate 330 is immersed in the moisture-proof material solution, and the immersion depth does not reach the end face of the atmospheric pressure sensor 340 provided with the element vent holes 342A and 342B. Accordingly, there is no possibility that the moisture-proof material may enter the element vent holes 342A and 342B, and a part of the atmospheric pressure sensor 340 may be immersed in the moisture-proof material solution. However, when a part of the atmospheric pressure sensor 340 is in the first region and is immersed in the moisture-proof material solution, the atmospheric pressure sensor 340 needs to be a surface mount type connection terminal.
The attachment position of atmospheric pressure sensor 340 may be the position of cutout portion K at the side end of locator 350.

Next, the manufacturing method of the electronic control unit 300 described above will be described focusing on the differences with the aid of the flowchart of FIG.
In FIG.
(1) Process 600 is a start step of assembly work.
(2) Parts assembly process 601
(2-1) In the subsequent step 601A, the waterproof filter 325 is bonded and fixed to the cover 320.
(2-2) In the subsequent step 601B, the first and second connector housings 321 of the cover 320 are provided.
The first and second connection pin groups 322A and 322B are press-fitted and fixed to A and 321B, and the locator 350 is attached.
(3) Soldering process 610A for the first surface of the electronic substrate
(3-1) The subsequent step 602A is a start step of the surface mounting reflow soldering step 610A for the first surface 330A of the electronic substrate, and is installed in the reflow soldering line with the first surface 330A of the electronic substrate as the upper surface.
(3-2) In the subsequent step 603A, a metal mask is set on the first surface 330A of the electronic substrate, and cream solder is applied to the solder connection portion.
(3-3) The subsequent step 604A is a surface mounting component 331A with respect to the first surface 330A of the electronic substrate.
And a step of mounting a heat generating component (not shown), and the atmospheric pressure sensor 340 having the surface connection terminals 341A and 341B is also mounted in this step 604A.
(3-4) In subsequent step 605A, the cream solder applied in step 603A is heated and melted to perform reflow soldering, and then blower cooling is performed. (The soldering process 610A for the first surface is completed).

(4) Soldering process of surface-mounted components to the second surface of the electronic board (reflow soldering is performed in the same manner as the soldering process 610A on the first surface).
(4-1) In step 602B, the electronic substrate 330 is installed upside down.
(4-2) In step 603B, solder printing on the second surface is performed.
(4-3) In step 604B, the surface mount component 331B is mounted.
(4-4) In step 605B, heating and cooling are performed.
However, in the case of an electronic board that does not perform reflow soldering on the second surface, the process block 610B is omitted.
(5) Moisture-proof treatment step 611
The first region of the electronic board 330 on which the surface mounting components are soldered and mounted is soaked on both sides in a dipping tank filled with a moisture-proof material solution in which a moisture-proof material and a diluent are mixed, as in FIG. The
(6) Post soldering process 612
(6-1) The subsequent step 606 is a post-soldering step 612 for soldering the first and second connection pin groups 322A and 322B mounted on the first surface of the electronic substrate 330 on the second surface side. It is a start process, and is installed in the jet solder line with the first surface of the electronic substrate 330 as the upper surface.
(6-2) In the subsequent step 607, the first and second connection pin groups 322A and 322B integrated with the cover 320 and attached with the locator 350 in step 601B are attached to the first surface of the electronic substrate 330. insert.
(6-3) In the subsequent step 608, molten solder is jetted into contact from the second surface side of the electronic substrate 330, and
After the tip ends of the first and second connection pin groups 322A and 322B are soldered to the connection lands of the electronic substrate 330, blower cooling is performed. (The post soldering process 612 is completed)
(7) Overall assembly process 613
In the subsequent step 613, the second surface 330B of the electronic substrate integrated with the cover 320 is placed on the jig as the upper surface, and a waterproof sealant is provided in the annular recess provided on the outer peripheral end surface of the cover 320 as shown in FIG. 112 is applied, and a heat transfer bond is applied to the back side of the heat-generating component, and then the cover 320 and the base 310 are integrated with a fixing screw.
(8) Adjustment and inspection process 614
In the subsequent step 614, the mating connector is connected to the first and second connection pin groups 322A and 322B, the electronic control unit 300 is energized, and its performance inspection, initial adjustment, and appearance inspection are performed. When the adjustment is performed, the process shifts to a work end process 609, and if the inspection is defective, the process shifts to an analysis process (not shown).

  The housing 300A of the electronic control unit 300 shown in FIGS. 11 and 12 has a two-piece structure composed of a base 310 and a cover 320. The cover 320 has a contour outer peripheral portion and a ceiling wall portion. It is also possible to adopt a configuration in which the ceiling wall surface is sealed and fixed after the non-defective product is confirmed.

Further, the outside air vent 326 and the waterproof filter 325 can be provided on the ceiling surface of the base 310 and the cover 320 as in the case of FIGS. 1 and 7, and preferably the outside air vent 326 and the waterproof filter are provided at a plurality of locations. By providing 325, even if one of the vent holes is clogged, the atmospheric pressure can be detected by the other vent hole.
However, even if a plurality of vent holes are provided, a state in which atmospheric pressure cannot be detected occurs when the muddy water is covered so that clogging cannot be avoided.
Even in such a case, if an altimeter indicating the operating state of the atmospheric pressure sensor 340 is provided, it is possible to prompt maintenance and inspection because the display of the altimeter is abnormal.

When the electronic control unit 300 is an in-vehicle engine control device, the in-vehicle engine is controlled by the atmospheric pressure detected by the atmospheric pressure sensor 340, and the current altitude of the vehicle is determined by the detected atmospheric pressure. It is desirable to display in the car.
As a result, when the current altitude of the vehicle changes due to traveling uphill or downhill of the vehicle, if there is no change in the display of the altimeter, there is a problem with the ventilation failure of the outside air vent due to clogging of the waterproof filter 325 or adhesion of muddy snow. It can be judged that it has occurred, and maintenance inspection can be promoted.

Next, the main points and effects of the electronic control unit according to Embodiment 3 will be described.
As is apparent from the above description, in the electronic control unit 300 according to Embodiment 3 of the present invention, the electronic board 330 on which the atmospheric pressure sensor 340 is mounted is housed in a housing, and the electronic air unit 326 is provided with an outside air vent 326 in the housing. In the control unit, a plurality of connector housings 321A and 321B into which a plurality of connection pin groups 322A and 322B are inserted are provided at one edge of the electronic board 330, and the electronic board 330 is mounted with a connector housing. One surface 330A and a second surface 330B opposite to the first surface are provided, and the first surface 330A and the second surface 330B are divided into a first region and a second region, respectively.

  One or both of the surface mounting component 331A on the first surface side and the surface mounting component 331B on the second surface side are soldered and connected to the first region, and the surface mounting component does not liquefy and flow in a high temperature use environment. It is coated with moisture-proof materials 332A and 332B using a resin, and in the second region, each connection pin of a plurality of connection pin groups is inserted through the locator 350 from the first surface 330A to the second surface 330B. The locator 350 includes connection pin through holes 352A and 353B through which a plurality of connection pin groups pass, and the locator corrects and aligns the tip ends of the plurality of connection pins. Thus, the aligned connection pins are inserted into through-hole plating holes provided in the second region of the electronic substrate 330.

  The element vent holes 342A and 342B provided in the atmospheric pressure sensor 340 are provided in the second region of the electronic board 330 and at the inter-group position 352A (or the side end position 352B) of the plurality of connection pin groups. The second regions of the first surface 330A and the second surface 330B are classified as regions where a high-density component is not mounted and a coating treatment with a moisture-proof material is not required.

  The atmospheric pressure sensor 340 includes a detection element 343 incorporated in the storage package 340A, and surface connection terminals 341A and 341B in which a power supply terminal and a signal terminal are connected, and the storage package 340A communicates outside air with the detection element 343. The storage package 340A provided with the vent holes 342A, 342B and the element vent holes 342A, 342B is a surface orthogonal to the electronic substrate 330 and far from the first region of the electronic substrate 330. It is the end face of the side.

As described above, in relation to the third aspect of the present invention, the element vent holes 340A and 340B provided in the atmospheric pressure sensor 340 are end surfaces orthogonal to the electronic substrate 330, and from the first region of the electronic substrate 330. Is provided on the end face of the atmospheric pressure sensor 340 on the far side.
Therefore, even if a moisture-proof material is applied to a part of the atmospheric pressure sensor 340, the element vent holes 342A and 342B can be prevented from being blocked.
Further, the detour portion provided in the locator inter-group portion 352A or the side end portion 352B is a plane portion having a simple notch portion K to avoid a complicated three-dimensional structure, and simplifies the mold structure for making the locator 350. There are features that can be done.

The electronic control unit 300 is an in-vehicle engine control device that controls the in-vehicle engine based on the atmospheric pressure detected by the atmospheric pressure sensor 340, and the current altitude of the vehicle is determined by the detected atmospheric pressure in the vehicle. It is displayed.
As described above, in relation to claim 7 of the present invention, the electronic control unit 300 is an in-vehicle engine control device, and controls the in-vehicle engine based on the atmospheric pressure detected by the atmospheric pressure sensor 340. The current altitude of the vehicle is displayed.
Therefore, when the current altitude of the vehicle changes due to the vehicle traveling uphill or downhill, if the altimeter display does not change, the waterproof filter 325 is clogged or the outside air vents are poorly ventilated due to muddy snow. It has the characteristic that it can be judged that the maintenance is in progress and maintenance inspections can be promoted.

Embodiment 4 FIG.
Hereinafter, Embodiment 4 of the present invention will be described with reference to FIGS. 13 and 14 with reference to FIGS. 1 to 5, focusing on differences from those of FIGS. 1, 7, and 11.
In addition, what replaced the code | symbol of 100 series, 200 series, and 300 series with the code of 400 series in each figure has shown the same part or an equivalent part.
The atmospheric pressure sensor 440 used in FIGS. 13 and 14 has the same lead terminal structure as that in FIG.

13 and 14, the electronic control unit 400 includes a casing 400A including a base 410 and a cover 420, an electronic board 430 housed in the casing, an atmospheric pressure sensor 440 mounted on the electronic board, and the like. Yes.
For example, first and second connector housings 421A and 421B for introducing connection pins are integrally formed on an end surface of a cover 420 which is a resin molded product.
First and second connection pin groups 422A and 422B are press-fitted and fixed to the first and second connector housings 421A and 421B, and the first and second connection pin groups 422A are bent at right angles. One end of 422B is in contact connection with a group of connection pins mounted on a not-shown mating connector, and the other end is solder-connected to a second region, which is one end edge of the electronic board 430, as in FIGS. It has come to be.

The electronic substrate 430 includes a first surface 430A facing the cover 420 and a second surface 430B facing the base 410, as in FIGS. 1, 7, and 11, and the first surface and the second surface are respectively It is divided into a first area and a second area.
The first surface side surface mount component 431A and the second surface side surface mount component 431B are soldered and connected to the first region of the electronic substrate 430, and these surface mount components are liquefied and flowed in a high temperature use environment. It is coated with moisture-proof materials 432A and 432B using a soft polymer resin that does not. The surface-mounted component may be provided only on the first surface 430A side. In this case, the coating process may be performed only on the first surface side.

In the second region which is the edge of the electronic substrate 430, the first and second connection pin groups 422A and 422B penetrate from the first surface 430A to the second surface 430B, and solder connection is made on the second surface side. To be done.
Note that a locator 450 is provided at the tip of the first and second connection pin groups 422A and 422B, and the positions of a large number of connection pins are corrected and aligned by the locator 450 and then provided in the second region of the electronic substrate 430. It is designed to be inserted into a number of through-hole plating holes.
The locator 450 includes a first part 451A, a second part 451B, an inter-group part 452A and a side end part 452B that interconnect the two, and the first connection pin group 422A is inserted into the first part 451A. A large number of connection pin through-holes 453A are provided, and the second portion 4
51B is provided with a plurality of connection pin through holes 453B into which the second connection pin group 422B is inserted, and lead terminals 441A and 441B of the atmospheric pressure sensor 440 pass through the inter-group portion 452A or the side end portion 452B. A lead terminal insertion hole 454 is provided.
Accordingly, the atmospheric pressure sensor 440 is provided at the inter-group position 452A, which is the second region of the first surface of the electronic substrate 430 in FIG.
The second region of the first surface 430A and the second surface 430B of the electronic substrate 430 is classified as a region where a high-density component is not mounted and a coating treatment with a moisture-proof material is not required.

  The electronic substrate 430 is provided with a substrate vent hole 433 that connects the space A on the first surface facing the cover 420 and the space on the second surface facing the base 410, and the substrate vent 433 is an electronic substrate. In the second region of 430, or in the case where the first region is provided at a position close to the atmospheric pressure sensor 440, the vent hole has a diameter larger than the thickness of the substrate and is not blocked by the moisture-proof material coating process. (See paragraph 0017).

  Although the outdoor air vent hole 426 and the waterproof filter 425 are provided on the ceiling surface of the cover 420, the waterproof filter 425 and the atmospheric pressure sensor 440 can be integrated, and when this is integrated, The cover 420 is provided with a filter mounting hole on the ceiling surface, and the prevention filter integrated with the atmospheric pressure sensor is fixed by an elastic seal such as an elastic packing or a seal bond.

The mounting structure of the base 410 and the cover 420 is the same as the mounting structure of the base 110 and the cover 120 described above with reference to FIG. 4, and will be described with reference to FIG.
The cover 420 is fixed to the base 410 with fixing screws 413 at four corners. That is, the base 410 is fitted with an annular recess (not shown) (120A in FIG. 4) provided on the cover 420 side with an annular projection (not shown) (111 in FIG. 4). 112) is applied.
Further, a heat generating component (not shown) mounted on the electronic substrate 430 is transferred to the base 410 via a planar pattern provided on both surfaces of the electronic substrate 430, a plurality of through-hole plating holes connecting the same, and a heat transfer bond (not shown). Heat is transferred to dissipate heat.

Next, a manufacturing method of the electronic control unit 400 described above will be described with a focus on differences in manufacturing method with reference to the flowchart of FIG.
In FIG.
(1) Process 600 is a start step of assembly work.
(2) Parts assembly process 601,
(2-1) In the subsequent step 601A, the waterproof filter 425 is bonded and fixed to the cover 420.
(2-2) The subsequent step 601B is the first and second connector housings 421A of the cover 420.
, 421B, the first and second connection pin groups 422A, 422B are press-fitted and fixed, and the atmospheric pressure sensor 440 and the locator 450 are attached.
(3) Soldering process 610A for the first surface of the electronic substrate
(3-1) A subsequent step 602A is a start step of the surface mounting reflow soldering step 610A for the first surface 430A of the electronic substrate, and is installed in the reflow soldering line with the first surface 430A of the electronic substrate as the upper surface.
(3-2) In the subsequent step 603A, a metal mask is set on the first surface 430A of the electronic substrate, and cream solder is applied to the solder connection portion.
(3-3) In the subsequent step 604A, the surface mounting component 431 is applied to the first surface 430A of the electronic substrate.
A or a heat generating component (not shown) is mounted.
(3-4) In subsequent step 605A, the cream solder applied in step 603A is heated and melted to perform reflow soldering, and then blower cooling is performed. (The soldering process 610A for the first plane is completed).
(4) Soldering process 610B for the second surface of the electronic substrate
(When soldering a surface-mounted component to the second surface 430B of the electronic substrate in the process of soldering the surface-mounted component to the second surface 430B of the electronic substrate, the soldering process of the first surface 430A Similarly to 610A, reflow soldering is performed by the soldering process 610B of the second surface 430B).
(4-1) In step 602B, the electronic substrate 430 is installed upside down.
(4-2) In step 603B, solder printing on the second surface is performed.
(4-3) In step 604B, the surface mount component 431B is mounted.
(4-4) In step 605B, heating and cooling are performed.
However, in the case of an electronic board that does not perform reflow soldering on the second surface 430B, the process block 610B is omitted.
(5) Moisture-proof treatment step 611
The first region of the electronic substrate 430 on which the surface mounting components are soldered and mounted is soaked on both sides in a dipping tank filled with a moisture-proof material solution in which a moisture-proof material and a diluent are mixed, as in FIG. The

(6) Post soldering process 612
(6-1) In the subsequent step 606, the first and second connection pin groups 322A and 322B mounted on the first surface of the electronic substrate 430 and the lead terminals 441A and 441B of the atmospheric pressure sensor 440 are arranged on the second surface side. This is a start process of a post soldering process 612 for soldering, and the electronic circuit board 430 is installed on the jet solder line with the first surface of the electronic board 430 as the upper surface.
(6-2) In the subsequent step 607, the first and second connection pin groups 422A and 422B integrated with the cover 420 and fitted with the locator 450 in step 601B are attached to the first surface of the electronic substrate 430. insert.
At this time, the lead terminals 441A and 441B of the atmospheric pressure sensor 440 are also inserted into the through-hole plating holes provided on the first surface of the electronic substrate 430.
(6-3) In the subsequent step 608, molten solder is jetted into contact from the second surface 430B side of the electronic substrate, and the leading ends of the first and second connection pin groups 422A and 422B and the leading ends of the lead terminals 441A and 441B are contacted. After the part is soldered to the connection land of the electronic substrate 430, blower cooling is performed. (The post soldering process 612 is completed).
(7) Total assembly process 613
In the subsequent step 613, the electronic substrate 430 integrated with the cover 420 is placed on the jig with the second surface of the electronic substrate 430 as the upper surface, and a waterproof sealant is provided in the annular recess provided on the outer peripheral end surface of the cover 420 as shown in FIG. 112 is applied, a heat transfer bond is applied to the back side of the heat-generating component, and then the cover 420 and the base 410 are integrated by a fixing screw.
(8) Adjustment and inspection process 614
In the subsequent step 614, the mating connector is connected to the first and second connection pin groups 422A and 422B, the electronic control unit 400 is energized, and the performance inspection, initial adjustment, and appearance inspection are performed. When the adjustment is performed, the process shifts to a work end process 609, and if the inspection is defective, the process shifts to an analysis process (not shown).

  The casing 400A of the electronic control unit 400 shown in FIGS. 13 and 14 has a two-piece structure constituted by a base 410 and a cover 420. The cover 420 includes a contour outer peripheral part and a ceiling wall part. It is also possible to adopt a configuration in which the ceiling wall surface is sealed and fixed after the non-defective product is confirmed.

In the above description, the electronic control units 100, 200, 300, and 400 have been described as having a waterproof structure. However, when the electronic control unit is installed in, for example, a vehicle cabin, it is provided between the cover and the base. Further, the waterproof seal material 112 (see FIG. 4) is unnecessary, and the waterproof filters 115, 225, 325, and 425 provided in the outside air vent holes 116, 226, 326, and 426 are also unnecessary. However, in order to prevent migration of high-density parts and generation of whiskers due to high-humidity air flowing into the housing through the outside air vents, it is necessary to perform moisture-proof treatment.
The housing for storing the electronic board has a two-piece structure with a base and a cover, a three-piece structure with an annular frame, a cover and a base, or an electronic board inserted from the open end of a flat hollow hexahedron case. Such a one-piece structure may be used.

Next, the main points and effects of the electronic control unit according to the fourth embodiment will be described.
As is apparent from the above description, in the electronic control unit 400 according to the fourth embodiment of the present invention, the electronic board 430 on which the atmospheric pressure sensor 440 is mounted is housed in the housing 400A, and the outside air vent 426 is provided in the housing. The electronic control unit is provided with a plurality of connector housings 421A and 421B into which a plurality of connection pin groups 422A and 422B are inserted at one end edge of the electronic board 430, and the electronic board 430 is mounted with a connector housing. A first surface 430A and a second surface 430B opposite to the first surface are provided, and the first surface and the second surface are divided into a first region and a second region, respectively.

  One or both of the surface mounting component 431A on the first surface side and the surface mounting component 431B on the second surface side are soldered and connected to the first region, and the surface mounting component does not liquefy and flow in a high temperature use environment. It is coated with moisture-proof materials 432A and 432B using resin, and in the second region, each connection pin of a plurality of connection pin groups is inserted through the first surface 430A to the second surface 430B via the locator 450. The locator 450 includes connection pin through holes 453A and 453B through which a plurality of connection pin groups pass, and the locator corrects and aligns the tip portions of the plurality of connection pins. The aligned connection pins are inserted into through-hole plating holes provided in the second region of the electronic substrate.

The element vent holes 442A and 442B provided in the atmospheric pressure sensor 440 are provided in the second region of the electronic substrate 430 and at the inter-group position 452A (or the side end position 452B) of the plurality of connection pin groups. The second region of the first surface 430A and the second surface 430B is classified as a region where a high-density component is not mounted and a coating treatment with a moisture-proof material is not required.

  The atmospheric pressure sensor 440 includes a detection element 443 incorporated in the storage package 440A, and lead terminals 441A and 441B in which a power supply terminal and a signal terminal are connected, and the storage package 440A has an element communication for communicating outside air with the detection element 443. The air holes 442A and 442B are provided, and the locator 450 includes an inter-group portion 452A for connecting divided portions corresponding to a plurality of connection pin groups to each other, and side end portions 452B located at both ends of the locator 450. At least one portion of the inter-group portion 452A or the side end portion 452B penetrates the lead terminals 441A and 441B of the atmospheric pressure sensor 440 and is inserted into a through-hole plating hole provided in the second region of the electronic substrate 430. Lead terminal insertion holes 454 are provided.

As described above, in relation to the fourth aspect of the present invention, the atmospheric pressure sensor 440 includes the lead terminals 441A and 441B, and the lead terminal insertion hole 454 provided in the inter-group portion 452A or the side end portion 452B of the locator. Is inserted into the through hole plating hole of the electronic board.
Therefore, there is a feature that an atmospheric pressure sensor can be arranged in an idle space using a flat plate-like simple locator 450 that can be manufactured by a simple mold.

100 200 300 400 Electronic control unit 100A, 200A, 300A, 400A Housing 110 210 310 410 Base 111 Annular projection 112 Waterproof sealant 113 213 313 413 Fixing screw 114 Heat transfer bond 115 225 325 425 Waterproof filter 116 226 326 426 Outside air Pore 120 220 320 420 Cover 120A Annular recess 121A, 221A, 321A, 421A First connector housing 121B, 221B, 321B, 421B Second connector housing
221C Third connector housing 122A, 222A, 322A, 422A First connection pin group 122B, 222B, 322B, 422B Second connection pin group
222C Third connection pin group 130 230 330 430 Electronic substrate 130A, 230A, 330A, 430A First surface of electronic substrate 130B, 230B, 330B, 430B Second surface of electronic substrate 131A, 231A, 331A, 431A Surface mount component ( First side)
131B, 231B, 331B, 431B Surface mount component (second surface)
132A, 232A, 332A, 432A Moisture-proof material 132B, 232B, 332B, 432B Moisture-proof material 133 233 333 433 Substrate vent 134 Heating component 140 240 340 440 Atmospheric pressure sensor 140A, 240A, 340A, 440A Storage package 141A, 141B Connection terminal ( Surface connection terminal)
241A, 241B Connection terminal (lead terminal)
341A, 341B Surface connection terminal 441A, 441B Lead terminal 142A, 242A, 342A, 442A Element ventilation hole 142B, 242B, 342B, 442B Element ventilation hole 143 243 343 443 Detection element 150 250 350 450 450 Locator 151A, 251A, 351A Partial locator 151B, 251B, 351B, 451B Second partial locator
251C Third part locator 152A, 252A, 352A, 452A Locator group part 152B, 252B, 352B, 452B Locator side end part 153A, 253A, 353A, 453A Connection pin through hole 153B, 253B, 353B, 453B Connection pin through hole
253C Connection pin through hole
454 Lead terminal insertion hole 601 Component assembly process 610A Solder process (first surface)
611B Soldering process (second side)
611 Moisture-proofing process 612 Post soldering process 613 Overall assembly process 614 Adjustment and inspection process.

Claims (12)

  An electronic control unit in which an electronic board on which an atmospheric pressure sensor is mounted is housed in a housing, and an external air vent is provided in the housing, and a plurality of connection pin groups are inserted into an edge of the electronic board The electronic board has a first surface on which the connector housing is mounted, and a second surface that is the opposite surface of the first surface, and the first surface and the second surface are respectively It is divided into a first region and a second region, and in the first region, a surface-mounted component that is soldered and connected to one or both of the first surface side and the second surface side is mounted, and the surface The mounting component is coated with a moisture-proof material, and in the second region, the connection pins of the plurality of connection pin groups are inserted through the locator from the first surface to the second surface and soldered on the second surface side. The locator is connected to the plurality of locators. The connecting pin group has a connecting pin through-hole, and the locator corrects and aligns the tips of the plurality of connecting pins, and the aligned connecting pins are provided in the second region of the electronic substrate through-hole plating. The element vent hole provided in the atmospheric pressure sensor is a second region of the electronic board, and is formed between the plurality of connecting pin groups. The second region of the first and second surfaces of the electronic substrate is divided as a region that is not mounted with a high-density component and does not require a coating treatment with the moisture-proof material. Electronic control unit.   The atmospheric pressure sensor includes a detection element built in the storage package, and a connection terminal which is a surface connection terminal or a lead terminal to which a power supply terminal and a signal terminal are connected, and the storage package communicates the outside air with the detection element. The element locator is provided, and the locator includes an inter-group portion that interconnects divided portions corresponding to the plurality of connection pin groups, and side end portions that are located at both ends of the locator, At least one part of the inter-group part or the side end part is provided with an open part having a large gap with the first surface of the electronic substrate in order to bypass the atmospheric pressure sensor, or an edge part of the one part The electronic control unit according to claim 1, wherein a cutout portion formed with a cutout is provided, and the atmospheric pressure sensor is disposed at the position.   The atmospheric pressure sensor includes a detection element built in the storage package and a surface connection terminal to which a power supply terminal and a signal terminal are connected, and the storage package is provided with an element ventilation hole for communicating outside air and the detection element. In addition, an end surface of the storage package provided with the element vent hole is a surface orthogonal to the electronic substrate and an end surface far from the first region of the electronic substrate. The electronic control unit according to claim 1 or 2.   The atmospheric pressure sensor includes a detection element built in the storage package, and a lead terminal to which a power supply terminal and a signal terminal are connected, and the storage package is provided with an element ventilation hole for communicating outside air and the detection element. And the locator includes an inter-group portion that interconnects divided portions corresponding to the plurality of connection pin groups, and side end portions that are located at both ends of the locator, and the inter-group portion or the side end portion The atmospheric pressure sensor is arranged in at least one part, and the lead terminal of the atmospheric pressure sensor penetrates into the part and is inserted into a through-hole plating hole provided in the second region of the electronic substrate. The electronic control unit according to claim 1, wherein an insertion hole is provided. The housing containing the electronic board is composed of a base and a cover whose outer periphery is sealed and fixed with a waterproof sealing material, and the base dissipates the heat generated by the heat-generating component mounted on the electronic board. The base is provided with the outside air vent, and the outside air vent is provided at a position closer to the atmospheric pressure sensor than the central portion of the base. The pores are ventilated but sealed by a waterproof filter that prevents liquid from entering, and the electronic board connects the space on the first surface facing the cover and the space on the second surface facing the base. Board vents are provided,
The substrate vent is provided in the second region of the electronic substrate, or when provided in a position close to the atmospheric pressure sensor in the first region, the moisture-proof material having a diameter larger than the thickness of the electronic substrate. The electronic control unit according to any one of claims 1 to 4, wherein the electronic control unit is a vent hole having a size that is not blocked by a coating process.   The housing containing the electronic substrate is configured by a base and a cover whose outer periphery is hermetically sealed with a waterproof sealing material, and the cover is closer to the atmospheric pressure sensor than the center position of the cover. An outside air vent is provided, and the outside air vent is ventilated but sealed by a waterproof filter that prevents liquid from entering, and the electronic board has a space on the first surface facing the cover, and the base. Board air holes are provided to connect the space on the second surface opposite to the electronic board, and the board air holes are provided in the second region of the electronic substrate, or when provided in the first region, 5. The electronic control unit according to claim 1, wherein the electronic control unit has a diameter larger than a thickness and is not sealed by the moisture-proof material coating process. Door.   The electronic control unit is an in-vehicle engine control device that controls the in-vehicle engine based on the atmospheric pressure detected by the atmospheric pressure sensor, and the current altitude of the vehicle is displayed in the vehicle by the detected atmospheric pressure. The electronic control unit according to claim 5, wherein the electronic control unit is provided.   An electronic control unit manufacturing method comprising an electronic board on which an atmospheric pressure sensor is mounted, and an outside air vent hole is provided in a housing for housing the electronic board. A component assembly process in which a plurality of connection pin groups are inserted in advance with respect to the connector housing, and a first surface side of the first surface or the first surface and the second surface of the electronic substrate, A soldering process in which a surface mounting component or a surface mounting component on the second surface side is mounted and reflow soldering is performed, and the surface mounting component is immersed in a solution obtained by diluting a moisture-proof material with a solvent or heated by spraying. Alternatively, in the second region that is the edge position of the electronic substrate and the moisture-proof treatment step that is dried at room temperature, the plurality of connection pin groups are inserted through the first surface to the second surface through a locator, and the second surface side Equipped with a post-soldering process to perform soldering connection at the front An element vent provided in the atmospheric pressure sensor is a second region of the electronic substrate, and is provided at an intergroup position or a side end position of the locator, and the second of the first and second surfaces of the electronic substrate. A method for manufacturing an electronic control unit, wherein the area is divided as an area where a high-density component is not mounted and a coating treatment with the moisture-proof material is not required.   The first area of the electronic substrate on which the first and second surface mount components are soldered and mounted is soaked on both sides of a dipping tank filled with a moisture-proof material solution in which a moisture-proof material and a diluent are mixed. Or the moisture-proof material is applied by spraying the moisture-proof material solution on one side, and the diluent is left by evaporation of the applied moisture-proof material solution by heating or natural drying at room temperature. A moisture-proof material is a coating film produced by the moisture-proof coating film, and the moisture-proof material used as the moisture-proof coating film is a soft polymer resin that is limited in that it does not liquefy and flow out in a high-temperature use environment after the diluent is vaporized. 9. The method of manufacturing an electronic control unit according to claim 8, wherein an electrical insulator for moisture-proofing the member is used. The atmospheric pressure sensor has a detection element built in the storage package, a surface connection terminal connected to the detection element, and an element ventilation hole provided in the storage package,
The mounting of the atmospheric pressure sensor and the reflow soldering are performed in the same process as the mounting of the surface mounting component mounted on the first surface of the electronic board and the reflow soldering process,
The method for manufacturing an electronic control unit according to claim 8 or 9, wherein dipping or spraying of the moisture-proof material solution is not performed in the moisture-proof coating treatment step. The atmospheric pressure sensor has a detection element built in the storage package, a lead terminal connected to the detection element, and an element ventilation hole provided in the storage package,
The lead terminal insertion and soldering of the atmospheric pressure sensor are performed in the same process as the insertion and soldering process of the plurality of connection pin groups mounted on the first surface of the electronic board,
The method for manufacturing an electronic control unit according to claim 8 or 9, wherein dipping or spraying of the moisture-proof material solution is not performed in the moisture-proof coating treatment step.   The housing containing the electronic substrate is composed of a base and a cover whose outer periphery is sealed and fixed with a waterproof sealing material, and a waterproof filter is provided in the outside air vent of the electronic control unit. In the overall assembly process, which is the process immediately before the final assembly process of the unit, a waterproof sealing material is applied to the outer peripheral portion of the cover and the base that are assembled with the electronic board and integrated, and adjustment following the overall assembly process is performed. In the inspection step, whether or not the detected atmospheric pressure of the atmospheric pressure sensor is normal by connecting a decompression or pressurizing pump to the outside air vent and monitoring the output signal of the atmospheric pressure sensor, The electronic control unit according to claim 8 or 9, wherein it is checked whether a waterproof seal between the cover and the base is securely provided. Method of manufacturing a door.

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