JP4952172B2 - Electrical connection device and electrical connection method - Google Patents
Electrical connection device and electrical connection method Download PDFInfo
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Description
本発明は、球状もしくは円筒形状の電気的な機能部品を保持し、電気的接続を行うことができる電気的接続装置及び電気的接続方法に関する。 The present invention relates to an electrical connection device and an electrical connection method capable of holding a spherical or cylindrical electrical functional component and performing electrical connection.
近年、球状表面弾性波素子などの球形状の電気的な機能部品が知られている（例えば、特許文献１参照）。 In recent years, spherical electrical functional components such as spherical surface acoustic wave elements are known (see, for example, Patent Document 1).
この球状表面弾性波素子は、駆動信号として高周波バースト信号がすだれ状電極に印加されると、すだれ状電極から表面弾性波(Surface Acoustic Wave)が励起され、表面弾性波が基材表面の円環状領域を多重に周回する。 In this spherical surface acoustic wave device, when a high-frequency burst signal is applied to the interdigital electrode as a drive signal, the surface acoustic wave is excited from the interdigital electrode, and the surface acoustic wave is formed in an annular shape on the substrate surface. Cycle around the area multiple times.
ここで、表面弾性波は、基材表面の状態に応じて多重周回する速度が変化する。同様に、表面弾性波は、基材表面への分子の付着等により、円環状領域の周長が表面弾性波の波長の整数倍となるとき、共鳴周波数が変化する。 Here, the speed at which the surface acoustic wave multi-circulates changes according to the state of the substrate surface. Similarly, the resonance frequency of the surface acoustic wave changes when the circumference of the annular region becomes an integral multiple of the wavelength of the surface acoustic wave due to adhesion of molecules to the surface of the substrate.
このため、球状表面弾性波素子は、基材表面の円環状領域に付着した分子や、円環状領域に成膜された反応膜と環境ガス等との反応を検出する等の用途が提案されている。
ところで、球状表面弾性波素子の基材表面上に多重周回する表面弾性波振動を発生させるために、駆動系回路から該素子のすだれ状電極に高周波バースト信号を印加するが、高周波バースト信号が印加されていないタイミングでは、該すだれ状電極には多重周回する表面弾性波振動が微弱ながらも電気信号として発生している。そして、該基材表面の状態や、該基材表面への分子の付着等により、表面弾性波振動が変化するので、これに応じて電気信号も変化する。
よって、高周波バースト信号が印加されていない時に、該すだれ状電極から微弱な電気信号を取り出し、増幅・信号処理を行うことによって、球状表面弾性波素子の基材表面状態を推測することが可能となる。そして、この結果と周囲状況との関係が予め分かっていれば、各種センサとしての応用分野が期待される。
By the way, in order to generate surface acoustic wave vibration that circulates on the substrate surface of the spherical surface acoustic wave device, a high frequency burst signal is applied from the drive system circuit to the interdigital electrode of the device. At a timing not performed, the interdigital electrode generates a surface acoustic wave vibration that circulates multiple times as an electric signal although it is weak. Since the surface acoustic wave vibration changes due to the state of the base material surface, the adhesion of molecules to the base material surface, and the like, the electric signal also changes accordingly.
Therefore, when a high frequency burst signal is not applied, it is possible to estimate the substrate surface state of the spherical surface acoustic wave device by extracting a weak electric signal from the interdigital electrode and performing amplification and signal processing. Become. If the relationship between this result and the surrounding situation is known in advance, application fields as various sensors are expected.
しかしながら該球状表面弾性波素子は形状が球体であるため電気的接続および保持が容易ではない。特に、直径１ｍｍの球状表面弾性波素子は小さいため該球状表面弾性波素子を保持しつつ電気的接続を実現することが容易ではない。たとえば、相対する二本一組の先端を凹面もしくはクラウン形状のコンタクトプローブで挟む方法が考えられるが、直径１ｍｍの球を掴み電極の位置を認識した上でコンタクトプローブに挟み込むのは大変困難である。 However, since the spherical surface acoustic wave element has a spherical shape, electrical connection and holding are not easy. In particular, since the spherical surface acoustic wave element having a diameter of 1 mm is small, it is not easy to realize electrical connection while holding the spherical surface acoustic wave element. For example, a method of sandwiching two pairs of opposite ends with a concave or crown-shaped contact probe is conceivable, but it is very difficult to grasp a ball having a diameter of 1 mm and recognize the position of the electrode and then sandwich the contact probe. .
なぜならば、まず直径１ｍｍの小さな該球状表面弾性波素子を該コンタクトプローブ上に載せることが容易ではないからである。該球状表面弾性波素子をピンセットで掴んだ場合、相手が球体であるためわずかな不注意で弾け飛んでしまうことがあるので、現実的にはバキューム・ピンセットでハンドリングすることになるが、これでも該コンタクトプローブ上にうまく載せるのは難しい。 This is because it is not easy to first place the small spherical surface acoustic wave element having a diameter of 1 mm on the contact probe. When the spherical surface acoustic wave element is grasped with tweezers, the opponent is a sphere, so it may fly off with slight carelessness, so in reality it will be handled with vacuum tweezers. It is difficult to put on the contact probe well.
さらに、仮に該球状表面弾性波素子を該コンタクトプローブ上に載せることが出来たとしても、該球状表面弾性波素子の電極部と該コンタクトプローブ電極部を電気的接続が出来るように正しく位置を合わせなければならない。
直径１ｍｍの球状表面弾性波素子の電極を肉眼で認識するのは困難であるので、実体顕微鏡等の画像拡大手段をもって認識した上で、バキューム・ピンセットを使ってコンタクトプローブ上で球状表面弾性波素子の位置合わせをすることとなるが、現実的には大変難しい作業であった。
Further, even if the spherical surface acoustic wave element can be placed on the contact probe, the electrode portion of the spherical surface acoustic wave element and the contact probe electrode part are aligned correctly so that electrical connection can be made. There must be.
Since it is difficult to recognize the electrodes of a 1 mm diameter spherical surface acoustic wave element with the naked eye, the spherical surface acoustic wave element on the contact probe using vacuum tweezers after being recognized by an image enlarging means such as a stereomicroscope. However, in reality, it was a very difficult task.
また、該球状表面弾性波素子を前記コンタクトプローブで挟むのではなく、平面状の２枚一組の電極間に該球状表面弾性波素子を挟み込み、該球状表面弾性波素子の保持及び電気的接続を得る方法もある。 Also, the spherical surface acoustic wave element is not sandwiched between the contact probes, but the spherical surface acoustic wave element is sandwiched between a pair of planar electrodes, and the spherical surface acoustic wave element is held and electrically connected. There is also a way to get.
上記方法であれば、該球状表面弾性波素子を該平面状電極上に載せるのは容易である。しかしながら、該球状表面弾性波素子が該平面状電極間に隠れてしまい、該球状表面弾性波素子の電極部と該コンタクトプローブ電極部を電気的接続が出来るように球状表面弾性波素子の電極を認識して正しく位置を合わせることができない。 With the above method, it is easy to place the spherical surface acoustic wave element on the planar electrode. However, the spherical surface acoustic wave element is hidden between the planar electrodes, so that the electrode of the spherical surface acoustic wave element can be electrically connected to the contact probe electrode part. Cannot recognize and align correctly.
本発明は、上記課題を解決するためになされたもので、球状、もしくは円筒形状の部品に電極を配置した電気的な機能部品を容易に保持し、電気的接続ができる電気的接続装置及び電気的接続方法を提供することを目的とする。 The present invention has been made to solve the above-described problems. An electrical connection device and an electrical connection device that can easily hold an electrical functional component in which electrodes are arranged on a spherical or cylindrical component and can perform electrical connection. It is an object to provide a connection method.
本発明に於いて上記問題を解決するために、まず請求項１においては、球状もしくは円筒形状の電気的な機能部品を保持し、電気的接続を行うための電気的接続装置であって、
前記機能部品に接する透明な平面状支持体の面に透明導電層を形成してなる平面電極（１０）と、
前記平面電極（１０）に電気的に絶縁されて、上下方向で対向配置されてなる平面電極（２０）とを備え、
前記平面電極（１０）には、それを駆動する電極位置調整機構（３０），電極開閉機構（４０）および電極取り外し機構（５０）が接続されており、
前記平面電極（２０）には、それを駆動する電極取り外し機構（６０）が接続されており、
前記平面電極（１０）と前記平面電極（２０）とで前記機能部品を平行に挟んだ状態で、前記電極位置調整機構（３０）を用いて平面電極（１０）を前後左右に動かすことにより、前記機能部品を摩擦で回転させる機構を有することを特徴とする電気的接続装置としたものである。
In order to solve the above-mentioned problem in the present invention, first, in claim 1, an electrical connection device for holding a spherical or cylindrical electrical functional component and performing electrical connection,
A planar electrode (10) formed by forming a transparent conductive layer on the surface of a transparent planar support in contact with the functional component;
A planar electrode (20) that is electrically insulated from the planar electrode (10) and arranged oppositely in the vertical direction;
The planar electrode (10) is connected to an electrode position adjusting mechanism (30), an electrode opening / closing mechanism (40) and an electrode removing mechanism (50) for driving the planar electrode (10),
The planar electrode (20) is connected to an electrode removal mechanism (60) for driving it,
By moving the planar electrode (10) back and forth and left and right using the electrode position adjusting mechanism (30) with the functional component sandwiched in parallel between the planar electrode (10) and the planar electrode (20), The electrical connection device is characterized by having a mechanism for rotating the functional component by friction.
また、請求項２においては、前記平面電極（１０）もしくは前記平面電極（２０）のいずれか一方の平面電極が垂直（上下）方向に可動できるようになっていることを特徴とする請求項１記載の電気的接続装置としたものである。 Further, in the present invention, any one of the planar electrode (10) and the planar electrode (20) is movable in a vertical (up and down) direction. The electrical connection device is described.
請求項３においては、
請求項１または２に記載の電気的な機能部品を保持する電気的接続装置を用いて、球状であってかつ球の中心軸の両端部に電極を配置した電気的な機能部品、もしくは円筒形状であってかつ転がる面上に対向して電極を配置した電気的な機能部品の電気的接続を、透明な前記平面電極（１０）を通して視覚的に確認しながら行うことを特徴とする電気的な機能部品の電気的接続方法としたものである。
In claim 3,
An electrical functional component having a spherical shape and electrodes arranged at both ends of the central axis of the sphere, or a cylindrical shape, using the electrical connection device that holds the electrical functional component according to claim 1 The electrical connection of the electrical functional components having electrodes arranged on the rolling surface is performed while visually confirming through the transparent planar electrode (10). This is an electrical connection method for functional parts.
本発明によれば、球状、もしくは円筒形状の部品に電極を配置した電気的な機能部品の電極位置合わせを行って容易に保持することができ、確実に電気的接続を行うことが可能
となる。
According to the present invention, it is possible to easily hold the electrode by aligning the electrode of the electrical functional component in which the electrode is arranged on the spherical or cylindrical component, and it is possible to reliably perform the electrical connection. .
以下、本発明の実施形態につき図面を参照しながら説明する。
図１は、本発明の請求項１乃至５のいずれか一項に係る電気的接続装置の構成を示す模式構成図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing a configuration of an electrical connection device according to any one of claims 1 to 5 of the present invention.
本発明の電気的接続装置１００は、平面電極１０と、平面電極２０と、電極位置調整機構３０と、電極開閉機構４０と、電極取り外し機構５０と、電極取り外し機構６０とで構成されている。 The electrical connection device 100 according to the present invention includes a planar electrode 10, a planar electrode 20, an electrode position adjusting mechanism 30, an electrode opening / closing mechanism 40, an electrode removing mechanism 50, and an electrode removing mechanism 60.
平面電極１０は透明なガラス、プラスチック等の平面状支持体の球状、もしくは円筒形状からなる電気的な機能部品に接する面に透明導電層を形成した平面状電極からなり、電極開閉機構４０および電極取り外し機構５０を備え、配線により電気的に接続されている。 The planar electrode 10 is composed of a planar electrode in which a transparent conductive layer is formed on a surface in contact with an electrical functional component having a spherical or cylindrical shape of a planar support such as transparent glass or plastic. A detaching mechanism 50 is provided and electrically connected by wiring.
平面電極２０はガラス、プラスチック等の平面状支持体に透明導電層を形成した平面状電極、もしくは金属等の導電体部材を平面状に加工した平面電極からなり、電極取り外し機構６０を備え、配線により電気的に接続されているが、平面電極１０とは電気的に絶縁されている。 The planar electrode 20 is composed of a planar electrode in which a transparent conductive layer is formed on a planar support such as glass or plastic, or a planar electrode obtained by processing a conductor member such as metal into a planar shape. , But electrically insulated from the planar electrode 10.
平面電極１０と平面電極２０に形成された透明導電層は、インジウム、錫、亜鉛、チタン、ニオブ、セリウム、アンチモン等の酸化物、および２種類以上の元素からなる複合酸化物が好適である。また、銀および銀合金を透明酸化物で狭支した多層膜も使用可能である。形成方法としては、ドライ法として真空蒸着法、イオンプレーティング法、プラズマ活性化蒸着法、スパッタリング法、ＣＶＤ法などがあり、Ｗｅｔ法としてゾルゲルや導電性を有する粒子を分散させ塗液を塗布乾燥する方法などがある。
平面電極２０の電極は、十分な導電性があれば、必ずしも透明導電層である必要はない。
The transparent conductive layer formed on the planar electrode 10 and the planar electrode 20 is preferably an oxide such as indium, tin, zinc, titanium, niobium, cerium, antimony, or a composite oxide composed of two or more elements. A multilayer film in which silver and a silver alloy are narrowly supported with a transparent oxide can also be used. Forming methods include vacuum deposition methods, ion plating methods, plasma activated deposition methods, sputtering methods, CVD methods, etc. as dry methods, and sol-gel or conductive particles are dispersed as a wet method, and a coating solution is applied and dried. There are ways to do it.
The electrode of the planar electrode 20 is not necessarily a transparent conductive layer as long as it has sufficient conductivity.
平面電極１０と平面電極２０は、球状もしくは円筒形状の電気的な機能部品を保持・固定するに十分な大きさを有する平面形状であればよいが、電極周囲に土手形状のふちなどの球状もしくは円筒形状の電気的な機能部品が脱落するのを防止する機構を設けても良い。 The planar electrode 10 and the planar electrode 20 may be a planar shape having a size sufficient to hold and fix a spherical or cylindrical electrical functional component. However, the planar electrode 10 and the planar electrode 20 may have a spherical shape such as a bank-shaped edge or the like around the electrode. A mechanism for preventing the cylindrical electrical functional component from falling off may be provided.
電極位置調整機構３０は平面電極１０を３次元（ＸＹＺ各軸）で自由に位置を調整させることのできる位置調整機構である。 The electrode position adjusting mechanism 30 is a position adjusting mechanism that can freely adjust the position of the planar electrode 10 in three dimensions (XYZ axes).
電極開閉機構４０は平面電極１０を上方または左右に移動することにより、平面電極１０と平面電極２０とによって保持されている球状もしくは円筒形状の電気的な機能部品を取り外しできるようにしたものである。 The electrode opening / closing mechanism 40 is configured to be able to remove a spherical or cylindrical electrical functional component held by the planar electrode 10 and the planar electrode 20 by moving the planar electrode 10 upward or left and right. .
電極取り外し機構５０は平面電極１０を取り外すことによって平面電極１０と平面電極２０とによって保持されている球状もしくは円筒形状の電気的な機能部品を取り外しできるようにしたものである。 The electrode removing mechanism 50 is configured to be able to remove a spherical or cylindrical electrical functional component held by the planar electrode 10 and the planar electrode 20 by removing the planar electrode 10.
電極取り外し機構６０は平面電極２０を取り外すことによって平面電極１０と平面電極２０とによって保持されている球状もしくは円筒形状の電気的な機能部品を取り外しできるようにしたものである。 The electrode removing mechanism 60 is configured to be able to remove a spherical or cylindrical electrical functional component held by the planar electrode 10 and the planar electrode 20 by removing the planar electrode 20.
以下、本発明の電気的接続装置１００を用いて、球状もしくは円筒形状に電極を配置し
た電気的な機能部品の電気的接続方法について説明する。
Hereinafter, the electrical connection method of the electrical functional component which has arrange | positioned the electrode in spherical shape or cylindrical shape using the electrical connection apparatus 100 of this invention is demonstrated.
図２は、電気的接続装置１００を用いた電気的接続方法に使用する電気的な機能部品の一例であって、球状であってかつ球の中心軸の両端部に電極を配置した球状表面波素子７０の模式図である。 FIG. 2 is an example of an electrical functional component used in the electrical connection method using the electrical connection device 100, and is a spherical surface wave having a spherical shape and electrodes arranged at both ends of the central axis of the sphere. 3 is a schematic diagram of an element 70. FIG.
球状表面弾性波素子７０は、伝搬面７１を有する球状部材７２およびすだれ状電極７３、接点パッド７４、接点パッド７５を備えている。伝搬面７１は、連続した曲面からなる円環状の表面を有し、この円環状の表面の少なくとも一部に、すだれ状電極７３により励起される互いに逆方向に伝搬する表面弾性波ＳＡＷ１、ＳＡＷ２を周回させるための周回経路を備えている。球状部材７２は、一旦励起された表面弾性波が多重周回可能な伝搬面７１を有する三次元基体である。 The spherical surface acoustic wave element 70 includes a spherical member 72 having a propagation surface 71, an interdigital electrode 73, a contact pad 74, and a contact pad 75. The propagation surface 71 has an annular surface made of a continuous curved surface, and surface acoustic waves SAW1 and SAW2 propagating in opposite directions excited by the interdigital electrode 73 are formed on at least a part of the annular surface. There is a circulation path for circulation. The spherical member 72 is a three-dimensional substrate having a propagation surface 71 that can make multiple rounds of surface acoustic waves once excited.
球状表面弾性波素子７０を用いた電気的接続方法の事例について説明する。
図3は、本発明の電気的接続装置１００を用いて球状表面弾性波素子７０を保持し、電気的接続を行っている状態を示す模式構成図である。
まず、平面電極１０を電極開閉機構４０によってはね上げておき、球状表面弾性波素子７０をバキューム・ピンセット等を用いて、平面電極２０上のできれば中央部に近い任意の場所に置き、電極開閉機構４０によって平面電極１０を閉じ、電極位置調整機構３０を用いて平面電極１０を上下方向に位置を調整し、球状表面弾性波素子７０を平面電極１０と平面電極２０とで平行に挟み保持する。
An example of an electrical connection method using the spherical surface acoustic wave element 70 will be described.
FIG. 3 is a schematic configuration diagram showing a state in which the spherical surface acoustic wave element 70 is held and electrical connection is performed using the electrical connection device 100 of the present invention.
First, the planar electrode 10 is flipped up by the electrode opening / closing mechanism 40, and the spherical surface acoustic wave element 70 is placed on the planar electrode 20 at an arbitrary position as close as possible to the center using vacuum tweezers or the like. Thus, the planar electrode 10 is closed, the position of the planar electrode 10 is adjusted in the vertical direction using the electrode position adjusting mechanism 30, and the spherical surface acoustic wave element 70 is sandwiched and held in parallel between the planar electrode 10 and the planar electrode 20.
次に、球状表面弾性波素子７０を平面電極１０と平面電極２０で保持した状態で、電極位置調整機構３０を用いて球状表面弾性波素子７０上の接点パッド７４及び７５がそれぞれ平面電極１０または２０と接触するように調整する。 Next, with the spherical surface acoustic wave element 70 held by the planar electrode 10 and the planar electrode 20, the contact pads 74 and 75 on the spherical surface acoustic wave element 70 are respectively connected to the planar electrode 10 or the planar electrode 10 using the electrode position adjusting mechanism 30. Adjust to contact 20.
この動作を図４および図５を用いて詳しく説明する。
まず、球状表面弾性波素子７０を平面電極１０と平面電極２０とで平行に挟んだ直後の状態を図４に示す。。
この状態では、球状表面弾性波素子７０上の接点パッド７４及び７５は平面電極１０と平面電極２０とは電気的接続は行われていない。
ここで、電極位置調整機構３０を用いて平面電極１０を前後左右に動かすと、平面電極１０と平面電極２０とに挟まれた球状表面弾性波素子７０は摩擦で平面電極１０を動かした方向に回転する。
This operation will be described in detail with reference to FIGS.
First, FIG. 4 shows a state immediately after the spherical surface acoustic wave element 70 is sandwiched between the planar electrode 10 and the planar electrode 20 in parallel. .
In this state, the contact pads 74 and 75 on the spherical surface acoustic wave element 70 are not electrically connected to the planar electrode 10 and the planar electrode 20.
Here, when the planar electrode 10 is moved back and forth and left and right using the electrode position adjusting mechanism 30, the spherical surface acoustic wave element 70 sandwiched between the planar electrode 10 and the planar electrode 20 moves in the direction in which the planar electrode 10 is moved by friction. Rotate.
ここで、平面電極１０は透明であるので、平面電極１０と平面電極２０とに挟まれた球状表面弾性波素子７０の接点パッド７４及び７５の位置を視覚的に確認することができる。
したがって、電極位置調整機構３０を用いて平面電極１０を前後左右に動かしながら、摩擦で球状表面弾性波素子７０を転がし、接点パッド７４及び７５の位置を調整し位置合わせすることにより、平面電極１０と平面電極２０との電気的接続状態を得ることができる。
図５は、平面電極１０と平面電極２０と球状表面弾性波素子７０の接点パッド７４及び７５との電気的接続状態が得られた状態示す説明図である。
Here, since the planar electrode 10 is transparent, the positions of the contact pads 74 and 75 of the spherical surface acoustic wave element 70 sandwiched between the planar electrode 10 and the planar electrode 20 can be visually confirmed.
Accordingly, the spherical surface acoustic wave element 70 is rolled by friction while the planar electrode 10 is moved back and forth and right and left using the electrode position adjusting mechanism 30, and the positions of the contact pads 74 and 75 are adjusted and aligned. And the planar electrode 20 can be electrically connected.
FIG. 5 is an explanatory diagram showing a state in which the electrical connection state between the planar electrode 10, the planar electrode 20, and the contact pads 74 and 75 of the spherical surface acoustic wave element 70 is obtained.
電極取り外し機構５０は、平面電極１０を取り外すことによって平面電極１０と平面電極２０によって保持されていた球状表面弾性波素子７０の配置および取り外しを可能とし、また平面電極１０を容易に洗浄および交換することが可能となる。 The electrode removal mechanism 50 enables the placement and removal of the spherical surface acoustic wave element 70 held by the planar electrode 10 and the planar electrode 20 by removing the planar electrode 10, and easily cleans and replaces the planar electrode 10. It becomes possible.
電極取り外し機構６０は平面電極２０を取り外すことによって平面電極１０と平面電極
２０によって保持されていた球状表面弾性波素子７０の配置および取り外しを可能とし、また平面電極２０を容易に洗浄および交換することが可能となる。
The electrode removing mechanism 60 enables the placement and removal of the planar electrode 10 and the spherical surface acoustic wave element 70 held by the planar electrode 20 by removing the planar electrode 20, and can easily clean and replace the planar electrode 20. Is possible.
以下に、本発明の具体的実施例について説明する。 Specific examples of the present invention will be described below.
本実施例では、球状の電気的な機能部品としては、直径１ｍｍの水晶球状表面弾性波素子７０を使用した。中心軸の両端部の丁度北極と南極に相当する部分に接点パッド７４及び７５が形成されている。
まず、ガラス基材上にＩＴＯ膜を蒸着して透明導電層を形成した平面電極１０を作製した。さらに、真鍮材にニッケルメッキ加工を行った電極からなる平面電極２０を作製した。平面電極１０は電極開閉機構４０によって、一辺をヒンジ機構にしてあり、はね上げることができる。
In this embodiment, the spherical spherical surface acoustic wave element 70 having a diameter of 1 mm is used as the spherical electrical functional component. Contact pads 74 and 75 are formed at portions corresponding to the north and south poles at both ends of the central axis.
First, the planar electrode 10 in which an ITO film was deposited on a glass substrate to form a transparent conductive layer was produced. Furthermore, the planar electrode 20 made of an electrode obtained by performing nickel plating on a brass material was produced. The planar electrode 10 has a hinge mechanism on one side by the electrode opening / closing mechanism 40 and can be flipped up.
次に、平面電極２０及び平面電極３０の洗浄を行った。このとき、電極取り外し機構５０及び電極取り外し機構６０により平面電極１０および平面電極２０を簡単に装置より取り外すことができるため、容易に洗浄を行うことができた。 Next, the planar electrode 20 and the planar electrode 30 were cleaned. At this time, since the planar electrode 10 and the planar electrode 20 can be easily detached from the apparatus by the electrode removing mechanism 50 and the electrode removing mechanism 60, the cleaning can be easily performed.
次に、電極開閉機構４０を動作させて平面電極１０をはね上げておき、球状表面弾性波素子７０をバキューム・ピンセットを用いて平面電極２０上の中心付近に載置した。
さらに、電極開閉機構４０にて平面電極１０を閉じ、電極位置調整機構３０を用いて平面電極１０を上下方向に位置を調整し、球状表面弾性波素子７０を平面電極１０と平面電極２０とで平行に挟み保持した。
Next, the electrode opening / closing mechanism 40 was operated to raise the planar electrode 10, and the spherical surface acoustic wave device 70 was placed near the center on the planar electrode 20 using vacuum tweezers.
Further, the planar electrode 10 is closed by the electrode opening / closing mechanism 40, the position of the planar electrode 10 is adjusted in the vertical direction by using the electrode position adjusting mechanism 30, and the spherical surface acoustic wave element 70 is formed by the planar electrode 10 and the planar electrode 20. Hold in parallel.
ここで、本実施例で使用した球状表面弾性波素子７０は、直径が１ｍｍであるため北極および南極に相当する部分に形成された接点パッド７４及び７５は肉眼での観察が困難であるので、透明な平面電極２０越しに実体顕微鏡を配置して拡大、観察した。
この状態で、電極位置調整機構３０を用いて平面電極１０を前後左右に動かしながら、摩擦で球状表面弾性波素子７０を転がし、接点パッド７４及び７５の位置を調整して平面電極１０と平面電極２０を球状表面弾性波素子７０の接点パッド７４及び７５にそれぞれ接触させ、駆動計測装置と接続し動作させたところ良好な動作結果を得ることができた。
Here, since the spherical surface acoustic wave element 70 used in this example has a diameter of 1 mm, the contact pads 74 and 75 formed in the portions corresponding to the north pole and the south pole are difficult to observe with the naked eye. A stereomicroscope was placed over the transparent planar electrode 20 and enlarged and observed.
In this state, the spherical surface acoustic wave element 70 is rolled by friction while moving the planar electrode 10 back and forth and left and right using the electrode position adjusting mechanism 30, and the positions of the contact pads 74 and 75 are adjusted to adjust the planar electrode 10 and the planar electrode. When 20 was brought into contact with the contact pads 74 and 75 of the spherical surface acoustic wave element 70 and connected to the drive measurement device, the operation result was satisfactory.
１０、２０……平面電極
３０……電極位置調整機構
４０……電極開閉機構
５０、６０……電極取り外し機構
７０……球状表面弾性波素子
７１……伝搬面
７２……球状部材
７３……すだれ状電極
７４、７５……接点パッド
１００……電気的接続装置
DESCRIPTION OF SYMBOLS 10, 20 ... Planar electrode 30 ... Electrode position adjustment mechanism 40 ... Electrode opening / closing mechanism 50, 60 ... Electrode removal mechanism 70 ... Spherical surface acoustic wave element 71 ... Propagation surface 72 ... Spherical member 73 ... Snake Electrode 74, 75 ... contact pad 100 ... electrical connection device
Claims (3)
前記機能部品に接する透明な平面状支持体の面に透明導電層を形成してなる平面電極（１０）と、
前記平面電極（１０）と電気的に絶縁されて、上下方向で対向配置されてなる平面電極（２０）とを備え、
前記平面電極（１０）には、それを駆動する電極位置調整機構（３０），電極開閉機構（４０）および電極取り外し機構（５０）が接続されており、
前記平面電極（２０）には、それを駆動する電極取り外し機構（６０）が接続されており、
前記平面電極（１０）と前記平面電極（２０）とで前記機能部品を平行に挟んだ状態で、前記電極位置調整機構（３０）を用いて平面電極（１０）を前後左右に動かすことにより、前記機能部品を摩擦で回転させる機構を有することを特徴とする電気的接続装置。 An electrical connection device for holding a spherical or cylindrical electrical functional component and making an electrical connection,
A planar electrode (10) formed by forming a transparent conductive layer on the surface of a transparent planar support in contact with the functional component;
A planar electrode (20) that is electrically insulated from the planar electrode (10) and arranged to be opposed in the vertical direction;
The planar electrode (10) is connected to an electrode position adjusting mechanism (30), an electrode opening / closing mechanism (40) and an electrode removing mechanism (50) for driving the planar electrode (10),
The planar electrode (20) is connected to an electrode removal mechanism (60) for driving it,
By moving the planar electrode (10) back and forth and left and right using the electrode position adjusting mechanism (30) with the functional component sandwiched in parallel between the planar electrode (10) and the planar electrode (20), An electrical connection device comprising a mechanism for rotating the functional component by friction .
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