JP2002289767A - Mounting device of electric circuit element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the mounting device of an electric circuit element capable of reducing the number of parts, miniaturizing equipment and reducing the weight of the equipment. SOLUTION: Spherical elements 2-3 to 2-11 forming an electric circuit comprising the electric circuit element or a plurality of the electric circuit elements are used to interpose the spherical elements 2-3 to 2-11 between two substrates 2-1, 2-2, and the electric circuit comprising the electric circuit element or the plurality of the electric circuit elements is mounted between the substrates 2-1, 2-2 by electrically connecting both the substrates 2-1, 2-2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electric circuit element or an electric circuit using a spherical element.

[0002]

2. Description of the Related Art In recent years, with the progress of technology, the circuit scale of various electric devices has been increasing, while the demand for small size, light weight, and low cost has also increased. In order to respond to such a demand, the ball grid array (BGA) package, in which the input / output pads are arranged on the entire back surface of the IC instead of the form in which the lead is provided around the package, has been developed.
In printed circuit boards, mounting methods such as solder bumps for fixing a ball-shaped solder or the like to input / output pads arranged two-dimensionally on a predetermined surface of the board have been widely put into practical use, and are highly integrated. This contributes to reducing the mounting area of ICs and printed circuit boards.

FIG. 14 is a schematic diagram showing an example of such a mounting form. In FIG. 14, reference numeral 14-1 denotes a printed circuit board (hereinafter, referred to as PCB) or an element such as an IC (IC board). 14-2 is a PCB 14-1
And the PCB to connect to. Solder pastes 14-7 to 14-10 are applied to the solder connection electrodes of the PCB 14-2. 14-3 to 14-6 are solders having a spherical outer shape (hereinafter referred to as solder balls), which are integrated with the PCB 14-1 by soldering. This is PCB1
The PCB 14-1 and the PCB 14-1 are heated by placing on the 4-2.
Each electrode of 4-2 is connected by solder.

[0004]

By the way, there is no end to the demand for small size, light weight, or low cost, while on the other hand, the frequency and digitization of devices have been increasing, and transmission waveforms due to noise and reflection in circuit boards have been increasing. Deterioration or unnecessary radiation is a major problem. As a countermeasure, a damping resistor, a bypass capacitor, or an EMI (Electromagnetic Inte
(Reference) There is a tendency that components such as a removal filter increase.

[0005] Further, when a multi-functional device is used in a device of a new genre such as a television receiver compatible with digital broadcasting or a device of an existing genre, the circuit scale increases and the number of components increases. Such an increase in the number of components increases the cost of the device, increases the mounting area, and lengthens the wiring on the substrate. Furthermore, it is difficult to arrange bypass capacitors and terminating resistors at the optimum positions, which makes it difficult to take countermeasures against noise and the like.On the other hand, the above-described conventional connection method uses a solder ball to connect the substrates. Therefore, it was not possible to sufficiently cope with an increase in the mounting area and noise countermeasures due to the increase in components as described above.

The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a method of mounting an electric circuit element capable of reducing the number of parts and reducing the size and weight of the device. .

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to use a spherical element on which an electric circuit element or an electric circuit composed of a plurality of electric circuit elements is formed, and to interpose the spherical element between two substrates. This is achieved by a method of mounting an electric circuit element, wherein an electric circuit element or an electric circuit including a plurality of electric circuit elements is mounted between the substrates by electrically connecting the substrates.

Another object of the present invention is to form an electric circuit comprising at least one electric circuit element or a plurality of electric circuit elements, and to provide an electrode at a connection portion with a substrate and a connection portion with another spherical element. Using a plurality of spherical elements formed with
The plurality of spherical elements are interposed between two substrates in a state of being close to each other, electrically connecting the electrodes of the two substrates and the plurality of spherical elements, and electrically connecting the electrodes formed on the sides of the spherical element. This is achieved by a method for mounting an electric circuit element, wherein an electric circuit element or an electric circuit including a plurality of electric circuit elements is mounted between the substrates.

In the present invention, the spherical element serves to connect the substrates to be connected, and mounts, for example, a circuit element such as a resistor, a coil, a capacitor or a transistor, or an electric circuit combining them between the substrates. can do.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. In the following embodiments, a circuit element such as a resistor, a capacitor, a coil, and a diode is formed using a semiconductor process on the surface of a minute spherical semiconductor, and further, electrodes are formed by solder plating. Used as a general solder ball, a first element (for example, an IC board) or a printed circuit board (hereinafter referred to as P
A first element and a second element by electrically connecting the two elements (substrates) with a spherical element interposed between the CB) and a second element (for example, an IC substrate) or a PCB; An electric circuit element and an electric circuit are mounted between them.

FIGS. 1A and 1B are diagrams for explaining a method for connecting two substrates using spherical elements in the following embodiments. In FIG. 1A, 1
-1 is a PCB, 1-2 is a PCB connected to PCB1-1
It is. 1-3 to 1-8 are wiring patterns drawn out of the circuit, and solder paste 1 is used for connecting spherical elements.
-9 to 1-16 are applied. In addition, 1-2 in a figure
Reference numerals 3 and 1-24 denote through holes, and a hatched portion indicated by 1-22 denotes a photoresist layer. The spherical elements 1-17 to 1-20 are arranged on the solder paste portion of the PCB1-2, and are heated to heat the PCB1-2 and the spherical elements 1-17 to 1-17.
-20 is integrated. By mounting the PCB 1-1 on this and heating again, the electrodes of the PCBs 1-1 and 1-2 are connected by soldering through the spherical elements 1-17 to 1-20. At this time, soldering of the side surfaces can be realized by bringing the spherical elements into contact with each other on the side surfaces 1-21 as in 1-19 and 1-20.

FIG. 1B shows an IC 1-25 having a package for connecting a ball grid array (hereinafter referred to as BGA) and a PC.
An example is shown in which B1-26 is connected to spherical elements 1-31 to 1-34. 1-27 to 1-30 are wiring patterns drawn out of the circuit, and 1-36 to 1-43 are solder pastes. The spherical elements 1-33 and 1-34 are in contact at the side surface 1-35. IC1-25 as in the case of FIG.
The spherical elements 1-31 to 1-34 are placed on the solder paste portion of the above, and by heating them, the IC1-25 and the spherical elements 1-31 to 1-34 are integrated. At this time, the spherical elements 1-33 and 1-34 are connected by solder. This is placed on PCB 1-26 and heated again to obtain I
Each electrode of C1-25 and PCB1-26 is a spherical element 1-3.
It is connected by soldering via 1-34.

In the following embodiments, the above connection method is used to form an electric circuit element such as a resistor, a capacitor, a coil, a diode or an electric circuit combining these circuit elements with a spherical element, and to form a circuit board such as a PCB or an IC substrate. The two substrates are electrically connected to each other with a spherical element interposed therebetween, and an electric circuit element or an electric circuit is mounted between the substrates, thereby realizing a reduction in size and weight of the device.

(First Embodiment) FIG. 2 is a diagram showing a first embodiment of the present invention. In FIG. 2, reference numeral 2-1 denotes a BGA I in which solder paste is applied to electrodes of a package.
C and 2-2 are PCBs on which the IC 2-1 is mounted. Also, 2-3 to 2-11 are two kinds of spherical elements as shown in FIGS. 4 (a) and 4 (b). Of these, 2-3 to 2-
Reference numeral 6 denotes a spherical element shown in FIG. 4 (a), which forms a resistor 4-2 (for example, 100Ω) on the surface of the spherical semiconductor 4-1 and further performs solder plating on the resistor at both ends of the sphere. The electrodes 4-3 and 4-4 are formed.

Reference numerals 2-7 to 2-11 denote spherical elements shown in FIG. 4B, which are obtained by applying solder plating 4-6 to the surface of a spherical semiconductor 4-5. The diameter of the sphere obtained by adding 4-5 and 4-6 in FIG. 4B is equal to the diameter obtained by adding the spherical semiconductor 4-1 and the resistor 4-2 in FIG. The length is equal to the sum of the thicknesses 3 and 4-4. Instead of the spherical elements 2-7 to 2-11, solder balls having the same diameter as these may be used. I
Each electrode of C2-1 and each electrode (2
-14) is coated with a solder paste as shown by 2-12 and 2-13.

FIG. 3 is a block diagram showing a schematic circuit of the embodiment of FIG. Reference numeral 3-1 denotes an IC 2-1 in FIG. 2, which is a 10-bit A / D having a conversion rate of 100 MHz.
A converter. Reference numeral 3-2 denotes a PCB 2-2 in FIG. 2, which includes a power supply line 3-3, a ground line 3-4, reference voltage sources 3-5 and 3-6 required for A / D conversion, a chip selection signal 3-7, and A A / D conversion reference clock 3-8 is supplied to A / D converter 3-1 and receives ten A / D converted signals 3-9 to 3-11 from A / D converter 3-1. It includes circuits and the like.
Reference numerals 3-8 to 3-11 denote spherical elements shown in FIG.
Reference numerals 3-7 (2-7) denote solder balls having the same diameter as the spherical element shown in FIG. 4B or the spherical element shown in FIG. 4B.

The A / D converted signals 3-9 to 3-11 are input to the IC 3-12 on the PCB 3-2. IC3-
Reference numeral 12 denotes an IC that performs signal processing such as weighting,
This is an IC that performs parallel-serial conversion. In this embodiment, the spherical elements 3-13 to 3-16 are IC3-
In addition to playing a role of a solder ball connecting the PCB 1 and the PCB 3-2, the resistor also restricts the current of the circuit, thereby lowering the slew rate of the signal waveform, thereby acting as a damping resistor for reducing radiation noise. 2 and 3
Although the resistance is formed on the spherical element in the above, a plurality of circuit elements may be formed on the spherical element. Thereby, an electric circuit including a plurality of circuit elements can be mounted between the substrates.

(Second Embodiment) FIG. 5 is a view showing a second embodiment of the present invention. 5-1 is an IC, 5-3, 5-
4 is a power supply, a ground terminal, and 5-2 of the IC 5-1.
Is a PCB to which the IC 5-1 is soldered. The power supply terminal 5-3 and the ground terminal 5-4 are respectively drawn out to the surface opposite to the IC 5-1 through the through holes 5-2 by the printed wirings 5-5 and 5-6 on the substrate. 5-7
Is a PCB connected to the through-hole 5-2 and a spherical element 5
The terminals 5-3 and 5-4 of the IC 5-1 are connected to the PCB 5-7 by -8 and 5-9.

FIG. 4C shows a cross section of the spherical element 5-8. Al layer 4-8, Si on the surface of spherical semiconductor 4-7
An O ₂ layer 4-9 and a solder plating layer 4-10 are sequentially formed. The inner Al layer 4-8 is drawn out to the surface of the spherical element at a part on the equator of the spherical element as shown in FIG.
The electrode 4-11 is formed by applying solder plating thereon. In this case, the SiO ₂ layer 4 around the electrode 4-11
-9, so that the solder plating layer 4
-10 and the electrode 4-11 are prevented from short-circuiting.

5-5 is the spherical element (or solder ball) of FIG. 4 (b), the diameter of which is equal to that of the spherical element 5-8.
Solder paste 5-1 for connecting spherical elements on PCB
The distance between 0 and 5-13 is slightly shorter than the diameter of the spherical element, so that the spherical elements 5-8 and 5-9 are surely in contact with each other. Thus, after heating, the spherical elements 5-8 and 5-9 are connected by soldering, and a condenser is formed in the spherical element 5-8.
Of the power supply terminal 5-3 and the ground terminal 5-4.

(Third Embodiment) FIG. 6 is a diagram showing a third embodiment of the present invention. In this embodiment, two spherical elements are used.
This is an example in which a terminating resistor is used individually. Spherical element 6-1
In FIG. 4D, both electrodes of the spherical semiconductor are short-circuited by solder plating 4-12 on the surface. Solder plating 4-14 for connection with other spherical elements on a part of the equator
Is given. A resistor 4-13 of 50Ω is formed between the solder platings 4-12 and 4-14. The spherical element 6-2 is the one shown in FIG. 4B (or a solder ball) and has a diameter equal to that of the spherical element 6-1.

Reference numeral 6-3 denotes an IC having a BGA connection package, and reference numeral 6-4 denotes a PCB connected to the IC 6-3.
6-5 is a solder paste applied to the electrode portion of the signal line having a characteristic impedance of 50Ω, 6-6 is a solder paste applied to the electrode portion of the ground line, 6-7, 6-8.
Are signal line electrodes on the IC 6-3 side connected to the solder pastes 6-5 and 6-6, respectively, on which solder pastes 6-9 and 6-10 are applied. By heating these, the side surfaces of the spherical elements 6-1 and 6-2 are connected to the spherical elements 6-1 and 6-2, the IC 6-3 and the PCB 6-4 by soldering. 1, a resistor 4 is formed at a position very close to the IC 6-3 between the signal lines of the IC 6-3 and the PCB 6-4.
Terminated by -13.

(Fourth Embodiment) FIG. 7 is a diagram showing a fourth embodiment of the present invention. The spherical element 7-1 is shown in FIG.
(E) is an external view, and (f) is a sectional view. Reference numeral 4-20 denotes a spherical semiconductor, which has spiral Al patterns 4-21 and 4-21 from both poles on its surface toward the equator.
22 are formed, and both have a broad Al near the equator.
They are connected by a pattern 4-23. In this example, two coils are connected in series through an Al pattern 4-23. A capacitor is formed by laminating an SiO ₂ layer 4-24 and a solder plating layer 2-25 on the Al pattern 4-23. On both electrodes of the spherical element, solder plating is applied on the Al patterns 4-26 and 4-28 to form electrodes 4-27 and 4-29.

Reference numeral 7-2 denotes the spherical element shown in FIG. 4B, and the diameter is equal to that of the spherical element 7-1. Instead of the spherical element 7-2, a solder hole having the same diameter as the spherical element 7-1 may be used. PCB 7-3 signal line 7-4, ground line 7
-5, PCB 7-6 signal line 7-7, ground line 7-8
And spherical elements 7-1 and 7-2 are interposed therebetween. In this case, the solder paste 7-9 is applied to the electrodes.
7-12 are applied.

Also, the interval between the solder pastes for connecting the spherical elements on the PCB is made slightly smaller than the diameter of the spherical elements, so that the spherical elements 7-1 and 7-2 are reliably brought into contact. By heating these, each electrode is soldered, and an LC filter is formed between the signal line 7-4 and the ground line 7-5 as shown in FIG. 5 to 7.
Then, only one spherical element formed a circuit element or circuit,
Circuit elements and circuits may be formed on the other spherical element.
For example, a circuit element such as a resistor is formed on the spherical element 5-9 in FIG. 5, and another circuit is mounted between the signal lines of the two substrates by connecting the sides of the spherical elements 5-8 and 5-9. can do.

(Fifth Embodiment) FIG. 8 is a diagram showing a fifth embodiment of the present invention. The spherical element 8-2 is composed of two diodes 8-6 and 8- connected in series to the surface of the spherical semiconductor.
7, the midpoint of which is connected to the bipolar electrodes. The anode of the diode 8-6 and the cathode of the diode 8-7 are respectively connected to the electrodes on the equator of the spherical element. One of the bipolar semiconductor electrodes is connected to an input terminal of a CMOS IC (not shown) on the PCB 8-8. The anode of the diode 8-6 and the cathode of the diode 8-7 are connected to the spherical elements (or solder balls having the same diameter as 8-2) 8-1 and 8 in FIG. -3.

The spherical element 8-1 supplies the power in the PCB 8-9 to the PCB 8-8, and the spherical element 8-3 supplies the power to the PCB 8-8.
9 is connected to the PCB 8-8. P
On the electrodes of CB8-8 and 8-9, solder paste 8-
10 to 8-15 are applied, and the portions of the solder paste and the solder plating are connected by heating to form a protection diode for an input terminal of the CMOS IC as shown in FIG. In the present embodiment, when an abnormal voltage is applied to the input terminal of the CMOS IC, the resulting current does not enter the IC but flows through the spherical element to the power supply or the ground, so that the internal circuit can be protected.

(Sixth Embodiment) FIG. 9 is a view showing a sixth embodiment of the present invention. The spherical element 9-1 is obtained by forming a circuit known as a Colpitts oscillation circuit on the surface of a spherical semiconductor. Reference numerals 9-2 and 9-3 denote spherical elements (or solder balls having the same diameter as 9-1) in FIG. 4B having the same diameter as the spherical element 9-1. Power is supplied to the oscillation circuit from the PCB 9-4.

The outputs of the oscillation circuit are spherical elements 9-1 and 9-2.
And the spherical element 9-2 is
9-4 or 9-5. Spherical element 9-3
Is for connecting the grounds of the PCBs 9-4 and 9-5, and is insulated with a gap between the spherical elements 9-2. Contact parts 9-7 to 9 of PCBs 9-4 and 9-5 in FIG.
As in the first to fifth embodiments, the solder paste is applied to the electrodes -12 in the same manner as in the first to fifth embodiments, and the respective parts are connected by soldering by heating. As shown in FIG. 9, between the PCBs 9-4 and 9-5. An oscillating circuit is formed.

(Seventh Embodiment) FIG. 10 shows a seventh embodiment of the present invention.
It is a figure showing an embodiment. The spherical element 10-1 is shown in FIG.
Spherical element (or solder ball) shown in (b), 10-2
As shown in FIG. 4 (g), a coil 4-30 having a spiral Al pattern is formed on the surface of a spherical semiconductor, and electrodes 4-31 and 4-32 are formed on both ends of the coil 4-30 by solder plating. The spherical element 10-3 is a spherical element having a resistance as shown in FIG. 4A, and the spherical element 10-4 is a spherical element having a capacitor as shown in FIG. Spherical element 10-1 to 1
The diameters between the 0-4 electrodes are all equal. Also, 10-5
10-6 is a PCB connected by these spherical elements
It is.

As in the first to sixth embodiments, solder paste is applied to the respective contact portions of the PCBs 10-5 and 10-6 in FIG. Spherical elements 10-1 to 10
-4 are spatially insulated, but spherical elements 10-2 to
10-4 is connected in the PCBs 10-5 and 10-6 and is connected in parallel. By connecting the current source 10-7 of the PCB 10-5 to the parallel circuit through the spherical element 10-1, the PCBs 10-5, 10-
As shown in FIG. 10, the resonance frequency ω = 1 / LC (L
Is the inductance of the spherical element 10-2, and C is the spherical element 1
An LCR resonance circuit having a capacity of 0-4) is formed.

(Eighth Embodiment) FIGS. 11 to 13 are views showing an eighth embodiment of the present invention. In this embodiment, a rectifier circuit is formed between PCBs using spherical elements. 11-1 of FIG. 11 is a PCB having an AC power supply circuit,
Reference numeral 11-2 denotes a PCB having a load circuit.
1-6 are diodes formed on separate spherical semiconductors, respectively. By configuring the diode bridge in this way, it is possible to perform full-wave rectification on the AC power of the PCB 11-1 and supply it to the load circuit of the PCB 11-2. FIG. 12 is a view of a spherical element viewed from a direction perpendicular to the PCB. Diodes 12-5 to 12-8 of each spherical element correspond to PCs.
They are connected to each other in the direction shown in FIG. The contacts 12-1 and 12-3 are connected to the power supply PCB,
The contacts 12-2 and 12-4 are connected to the load-side PCB through the Al pattern on the spherical element and the solder paste on the electrodes of the PCB, respectively.

FIG. 13 is a diagram viewed from a direction parallel to the PCB. For simplicity, the portion A in FIG. 13-13 is a power supply PCB 11-1 in FIG. 11, and 13-6 in FIG. 13 is a load-side PCB 11-2 in FIG. Also, 13-1, 1 in FIG.
3-3 is a power output terminal 1 of the power PCB of FIG.
1-7 and 11-8, and 13-2 and 13-4 of FIG. 13 are input terminals 11-9 and 11-9 of the load-side PCB of FIG.
-10. PCB 13-5,1 in FIG.
As in the first to seventh embodiments, a solder paste is applied to the electrodes of the respective contact portions 3-6, and a rectifier circuit as shown in FIG. 11 is mounted between the PCBs by heating. You.

[0034]

As described above, according to the present invention, the number of components can be reduced and the cost can be reduced by connecting the substrates using the electric circuit element and the spherical element having the electric circuit. Further, since the mounting area can be reduced, the size and weight of the device can be reduced. Further, for example, since components such as a bypass capacitor and a terminating resistor can be arranged very close to the substrate, it can contribute to measures against noise and the like.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method for connecting spherical elements according to the present invention.

FIG. 2 is a diagram showing a first embodiment of the present invention.

FIG. 3 is a schematic circuit configuration diagram of the embodiment of FIG. 1;

FIG. 4 is a diagram showing a structure of a spherical element used in each embodiment of the present invention.

FIG. 5 is a diagram showing a second embodiment of the present invention.

FIG. 6 is a diagram showing a third embodiment of the present invention.

FIG. 7 is a diagram showing a fourth embodiment of the present invention.

FIG. 8 is a diagram showing a fifth embodiment of the present invention.

FIG. 9 is a diagram showing a sixth embodiment of the present invention.

FIG. 10 is a diagram showing a seventh embodiment of the present invention.

FIG. 11 is a diagram showing an eighth embodiment of the present invention.

FIG. 12 is a schematic configuration diagram of a spherical element viewed from a direction perpendicular to a PCB in an eighth embodiment.

FIG. 13 is a schematic configuration diagram of an eighth embodiment viewed from a direction parallel to a PCB.

FIG. 14 is a diagram showing a conventional mounting mode.

[Explanation of symbols]

1-1 to 1-2 PCB 1-9 to 1-16 Solder paste 1-17 to 1-20 Spherical element 1-25 IC 1-26 PCB 1-31 to 1-34 Spherical element 2-1 BGA IC 2 -2 PCB 2-3 to 2-11 Spherical element 2-12 to 2-13 Solder paste 3-1 IC 3-2 PCB 3-8 to 3-11 Spherical element 3-12 IC 4-1 Spherical semiconductor 4-2 resistance 4-3 and 4-4 electrode 4-5 spherical semiconductor 4-6 solder plating 4-7 spherical semiconductor 4-8 Al layer 4-9 SiO ₂ layer 4-10 solder plating 4-11 electrode 4-12,4- 14 Solder plating 4-13 Resistor 4-21, 4-22, 4-23 Al pattern 4-24 SiO ₂ layer 4-25 Solder plating layer 5-1 IC 5-2,5-7 PCB 5-8,5 -9 Spherical element 5-10-5-13 Han Paste 6-1, 6-2 Spherical element 6-3 IC 6-4 PCB 7-1 to 7-2 Spherical element 7-3, 7-6 PCB 7-1 to 8-3 Spherical element 8-8, 8- 9 PCB 9-1 to 9-3 Spherical element 9-4 to 9-5 PCB 10-1 to 10-4 Spherical element 10-5, 10-6 PCB

Claims (6)

[Claims] An electric circuit element or a spherical element on which an electric circuit including a plurality of electric circuit elements is formed, and the two substrates are electrically connected to each other with the spherical element interposed between two substrates. An electric circuit element mounting method, comprising: mounting an electric circuit element or an electric circuit including a plurality of electric circuit elements between the substrates. 2. The substrate is a printed circuit board or an IC.
The method for mounting an electric circuit element according to claim 1, wherein the method is a substrate. 3. The electric device according to claim 1, wherein the spherical element is connected to one of the two substrates, and is connected to the other substrate via the spherical element. How to mount circuit elements. 4. A plurality of electric circuits each having at least one electric circuit element or an electric circuit composed of a plurality of electric circuit elements, and having an electrode formed at a connection portion with a substrate and a connection portion with another spherical element. A spherical element is used to electrically connect the electrodes of the two substrates and the plurality of spherical elements by interposing the plurality of spherical elements in close proximity between two substrates, and formed on the side of the spherical element. A method for mounting an electric circuit element or an electric circuit comprising a plurality of electric circuit elements between the substrates by electrically connecting the electrodes. 5. The printed circuit board or an IC according to claim 1, wherein
The method for mounting an electric circuit element according to claim 4, wherein the method is a substrate. 6. The electric device according to claim 4, wherein the spherical element is connected to one of the two substrates, and is connected to the other substrate via the spherical element. How to mount circuit elements.