JP4951265B2 - Metal plate having dissimilar metal arrangement pattern on plate surface and manufacturing method thereof - Google Patents

Description

  The present invention has a dissimilar metal arrangement pattern formed by arranging different kinds of metals adjacent to each other in an arbitrary pattern on the plate surface, and further has an uneven relief formed by forging on the plate surface. It relates to a metal plate. Moreover, this invention relates to the manufacturing method of the said metal plate.

Metal products such as coins and medals, ornaments (including decorative parts of appliances), relief plates, etc. are arranged with different metals next to each other, and each metal's unique appearance (color, luster, metal structure, etc.) ) May be used to form a pattern on the product surface.
For example, in 1 euro known as bimetal money (as of October 1, 2004), as shown in FIG. 8 (a), 75Cu-25Ni (silver white) is used as the material for the center circle 110. In addition, 75Cu-20Zn-5Ni (brass color) is used for the outer peripheral annular portion 120 as a material, whereby concentric two-color patterns are given to the money surface.
A pattern in which a plurality of such metal regions having different appearances are arranged in close contact with each other in the plate surface is called a “foreign metal arrangement pattern” in the present invention. In the following description, “different metal arrangement pattern” is also simply abbreviated as “pattern”.

The typical structure for constructing the dissimilar metal arrangement pattern is roughly divided into the following.
(A) A structure in which different metals are arranged adjacent to each other as shown in FIGS. 8 (a) and 8 (b). As such a structural example and its manufacturing method, the following modes are exemplified.
(A-1) A mode in which separately refined metal plates 110 and 120 are arranged so as to be adjacent to each other as shown in FIG. For example, the manufacturing method of the bimetal structure found in the above 1 euro money is described in Patent Document 1 and the like.
(A-2) As shown in FIG. 8B, by using a plating method or various film forming methods / deposition methods, different metals 130 and 140 are placed adjacent to each other on a base metal substrate 150. How to place.

(B) As shown in FIG. 8C, a laminated structure in which a pattern is constituted by a lower layer 160 and a surface layer 170 partially covering the lower layer 160. In the example shown in the figure, a plurality of circular openings 180 are provided on the surface layer 170 to form a pattern, and the metal surface of the lower layer 160 is exposed at the bottom in the openings. The exposed portion of the lower layer 160 and the surface of the surface layer 170 are not strictly adjacent to each other, but when the plate surface is viewed, it seems that different metals are adjacent to form a pattern. Further, as will be described later, the plate surface may be further pressurized if only the step is eliminated. As such a structural example and its manufacturing method, the following modes are exemplified.
(B-1) After a separately formed metal plate is pressed on the entire upper surface of the lower layer 160 by a cold rolling method or the like, or a metal layer is deposited by plating or various deposition methods to form an overall laminate, A subtractive method in which the surface layer is partially removed to expose the lower layer.
(B-2) An additive method in which the surface layer 170 is partially formed on the upper surface of the lower layer 160 by plating or various deposition methods and a pattern is directly drawn.

However, when the present inventors examined giving different metal arrangement patterns more freely, finely and without deformation to various metal products, the following problems existed in the conventional pattern structure and manufacturing method. Was found to exist.
In the above-mentioned aspect (a-1) (structure seen in 1 euro), since the bonding pattern itself is a pattern of the pattern, the pattern is subjected to restrictions on the bonding structure and bonding strength, and the design of the pattern is free. Subdivision is practically difficult. Although it is possible to form a more complex pattern on the plate surface than the example of FIG. 8A by applying elaborate and fine fitting like a craft, such expensive work is manufactured in large quantities It is not suitable for money, medals and inexpensive decorations.
Moreover, in the aspect which joins the metal plate formed separately by the cold rolling method among the aspects of said (B-1), since the surface layer becomes thick, the level | step difference with a lower layer is conspicuous, and the beauty | look is impaired. Arise. In the cold rolling method, a metal plate having a thickness of about 35 μm or less cannot be joined because the surfaces to be joined of both layers to be joined must be brush-polished. Moreover, since a rolling reduction of 15 to 40% is necessary during cold rolling, it is difficult to control the thicknesses of the two layers. Moreover, since the interface between the two layers after contact is rough and an alloy layer is formed, the surface of the lower layer exposed by removing the surface layer is not clean.
If surface pressing is applied to the plate surface to eliminate such a step, the lower layer swells in the opening, and a structure as shown in FIG. 8 (d) is obtained, but the surface layer joined by the cold rolling method is For example, since it is so thick that it greatly exceeds 100 μm, there is a problem that the meat flows, the opening is deformed, and the original pattern is destroyed.

If the above-mentioned problem (b-2) shown in FIG. 8B (formation using the film-forming method) is used, the surface layer is a thin film. It is possible to draw a fine pattern on the substrate surface. Even in the case of (b-1) above, if a sufficiently thin foil is pressed against the upper layer, or if a thin upper layer is formed as in (b2) above, the step will be conspicuous even after etching. There is no. Moreover, if the upper layer is thin, even if surface pressing is performed on the plate surface, the deformation of the opening is suppressed because the flow of meat is small.
The aspect using the thin upper layer as described above will not cause a problem as long as it is a product that only finishes the plate surface flat (an aspect in which there is no unevenness on a flat or curved surface).

However, in the case of money, medals, etc., an uneven relief (pole) is further formed on the plate surface by forging. In the embodiment in which only a thin upper layer is used for the forging of the uneven relief, another problem arises.
The problem is that when a concave / convex relief mold is pressed against a plate surface on which a pattern is formed using a thin upper layer, forging is performed, the thin upper layer is stretched along the concave / convex portions of the relief mold, and the upper layer is broken depending on the location of the concave / convex portions The problem is that the underlying metal skin is visible.
Japanese Patent Application Laid-Open No. 8-205912 "Coins using two kinds of metals"

  It is an object of the present invention to provide a metal plate having a structure of a dissimilar metal arrangement pattern that allows formation of a more free and fine pattern, and is less likely to be deformed or damaged even when a forging process is performed to form an uneven relief. And providing a manufacturing method thereof.

In order to solve the above-mentioned problems, the present inventors have conducted intensive research. As a result, a thin metal foil having a thickness within a specific range is laminated on a lower metal plate by surface activated bonding. We found that it was possible to freely draw fine dissimilar metal arrangement patterns, and that the deformation and breakage of the dissimilar metal arrangement patterns did not occur even when surface pressing or forging of uneven relief was added, and the present invention was completed. It was. That is, the present invention has the following characteristics.
(1) At least a second layer made of the second metal is bonded to a part of the upper surface of the first layer made of the first metal,
The second layer is a layer in which a metal plate formed in a separate process from the first layer is laminated on the upper surface of the first layer by surface activation bonding and subjected to surface pressing, The layer thickness is 5 μm to 50 μm, and the bonding interface between the first layer and the second layer is a bonding interface achieved by surface activated bonding,
The upper surface of the first layer and the upper surface of the second layer are one plate surface that has been subjected to a surface pressing process and has substantially no level difference, whereby the upper surface of the first layer is included in the plate surface. A metal plate having a dissimilar metal arrangement pattern on a plate surface, wherein different metal arrangement patterns comprising different metal surfaces including the upper surface of the second layer are formed.
(2) One or more layers are further laminated by surface activated bonding on the upper surface of the second layer, and surface pressing is performed.
Each layer is bonded to a region of the upper surface of the layer immediately below itself, thereby exposing at least a portion of the upper surface of all layers,
The upper surfaces of all the exposed layers are subjected to a surface pressing process to form a single plate surface that is substantially free of a step, whereby all the exposed surfaces are exposed to the plate surface. The metal plate having the dissimilar metal arrangement pattern described in (1) above on the plate surface, wherein the dissimilar metal arrangement pattern comprising different metal surfaces including the upper surface of the layer is formed.
(3) The metal plate which has the dissimilar-metal arrangement | positioning pattern of the said (1) or (2) description in which the uneven | corrugated relief is further formed in the said plate surface by forge processing.
(4) The metal plate which has the dissimilar metal arrangement | positioning pattern of the said (3) description on the plate surface where the forge processing of the said uneven | corrugated relief also serves as the said surface pressing process.
(5) A metal plate having the dissimilar metal arrangement pattern according to (3) or (4) on the plate surface, wherein the dissimilar metal arrangement pattern is present on the surface of the uneven relief.
(6) The metal plate having the dissimilar metal arrangement pattern according to any one of (3) to (5), wherein the metal plate having the dissimilar metal arrangement pattern on the plate surface is a coin-like object having an uneven relief on the plate surface. A metal plate on the surface.
(7) The metal plate having the dissimilar metal arrangement pattern on the plate surface is further drawn, and the whole form is a container having the dissimilar metal arrangement pattern on the inside or outside, (1) or (2) A metal plate having the dissimilar metal arrangement pattern described on the plate surface.
(8) On the metal plate having at least the first layer made of the first metal as a surface layer, a metal plate made of the second metal and having a thickness of 5 μm to 50 μm is laminated by surface activation bonding to form the second layer. Lamination process;
Etching from the upper surface of the second layer, removing the region corresponding to the intended pattern of the second layer, and exposing the upper surface of the first layer in the region;
After the etching step, surface pressing is performed so that the upper surface of the second layer and the upper surface of the first layer exposed in the region become one plate surface having substantially no step, thereby Forming a dissimilar metal arrangement pattern constituted by different metal surfaces including the upper surface of the first layer and the upper surface of the second layer on the plate surface,
A method for producing a metal plate having at least a dissimilar metal arrangement pattern on a plate surface, comprising:
(9) In the laminating step, one or more layers are further laminated on the upper surface of the second layer by surface activated bonding,
In the etching step, etching is performed from the upper surface of the uppermost layer, the region corresponding to the intended pattern of the uppermost layer is removed, the upper surface of the next lower layer is exposed in the region, and the upper layer of the exposed next layer is exposed. The region corresponding to the intended pattern is removed by etching, and the process of exposing the upper surface of the next lower layer in the region is repeated sequentially, and a part of the upper surface of the layer from the uppermost layer to the first layer is stepwise. To expose
In the surface pressing step, the top surface of all the layers exposed in stages is subjected to a surface pressing process so as to become a single plate surface having substantially no step, whereby the plate surface is subjected to the first layer from the top layer. It forms a dissimilar metal arrangement pattern constituted by a metal surface including the upper surface of the layer up to,
The production method according to (8) above.
(10) The manufacturing method according to (8) or (9), wherein, after the surface pressing step, the uneven relief mold is further pressed against the plate surface to forge the uneven relief.
(11) The manufacturing method according to (8) or (9) above, wherein in the surface pressing step, an uneven relief mold is used as a die used for the surface pressing process, and the surface pressing process is performed while forging the uneven relief.
(12) The manufacturing method according to (10) or (11), wherein the uneven relief is forged in a region where the different metal arrangement pattern exists, thereby causing the different metal arrangement pattern to exist on the surface of the uneven relief. .
(13) The manufacturing method according to any one of (10) to (12), wherein the metal plate having the dissimilar metal arrangement pattern on the plate surface is a coin-like object having an uneven relief on the plate surface.
(14) The above (8) or (9), wherein the metal plate having the dissimilar metal arrangement pattern on the plate surface is further drawn to form a vessel having the dissimilar metal arrangement pattern inside or outside. The manufacturing method as described.

In the present invention, a metal plate (metal foil) having a thickness of 5 μm to 50 μm is prepared as a material, and this is laminated on a lower metal plate (for example, a metal substrate as a first layer) by surface activation bonding. The basic feature is that surface pressing is performed to form an upper layer (for example, the second layer).
Due to the limitation of the thickness of the upper layer material and the limitation of the joining method, a dissimilar metal arrangement pattern having the following two features that cannot be achieved at the same time is obtained.
(I) There is no level difference, and a fine and complicated pattern can be freely drawn.
(Ii) Even if this dissimilar metal arrangement pattern is forged and processed into a relief pattern, it is difficult to break even a thin surface layer due to good adhesion of surface activated bonding. That is, the pattern is not easily damaged.
If the surface layer is only thin, it can be achieved by depositing a metal thin film by plating or the like, but such dissimilar metal arrangement pattern cannot withstand forging by an uneven relief mold, and depending on the location of the relief, the surface layer may be It tears and the lower layer is exposed, and the pattern cannot be maintained.
On the other hand, if a metal foil having a thickness of 5 μm to 50 μm is laminated on a metal substrate by surface activation bonding to form a dissimilar metal arrangement pattern, even if the uneven relief mold is pressed against the pattern part, Although the expansion and contraction of the metal foil is observed locally, the contact state with the lower layer, the bonding strength, and the thickness of the surface layer are sufficient, so that damage to the surface layer is suppressed and peeling does not occur.
The superiority of surface activated bonding over plating is explained in more detail as follows.
First, since it is difficult to uniformly apply the thickness of plating, there is a variation in thickness such that a thick portion and a thin portion of the plating layer are mixed depending on the location. This is a phenomenon that appears more conspicuously as the area increases. This means that when plastic deformation is caused locally by strong stress, as in the case of medal molding, the plating thickness becomes extremely thin, and in the worst case, the plating layer is peeled off (exposed substrate). Suggests that there is a risk This risk increases with the complexity of the medal pattern. In order to avoid this, a measure to sufficiently increase the plating thickness is conceivable, but if the plating thickness is to be increased, there is a disadvantage that the time required for plating becomes extremely long, which is not practical.
On the other hand, the layer structure by surface activation bonding enables bonding of metal foils having a large area with a uniform thickness. Furthermore, the surface metal foil and the base metal are strongly bonded by surface activation bonding, and there is almost no variation in the partial foil thickness (in other words, there is no thin portion of the foil thickness). Therefore, even when plastic deformation is caused by a strong stress as in the case of medal molding, there is very little risk of partial peeling (exposed substrate) as in the case of plating.
The above phenomenon is made up of two types of samples: [Silver plate with copper plating] and [Silver plate with copper foil laminated by surface activated bonding]. This can be confirmed by measuring the variation of the. However, since the original thickness of the plated sample varies depending on the location, it cannot be proved by a quantitative method such as comparing numerical values.

Hereinafter, the manufacturing method according to the present invention will be mainly described, and the structure of the metal plate according to the present invention will be described along with the manufacturing method.
In the present invention, words indicating the vertical direction such as “upper surface of layer” and “directly below layer” are used, but these are used when the next layer is superimposed on the first layer that becomes the substrate (base material). The purpose is to clearly explain the positional relationship of each layer, the direction of etching, and the like.

FIG. 1 is a schematic diagram showing a processing state in each step of the manufacturing method according to the present invention.
The manufacturing method by this invention has a lamination process, an etching process, and a surface pressing process at least as a structure was shown to said (8).
In the laminating step, as shown in FIG. 1 (a), a metal plate having at least a first layer made of a first metal as a surface layer (in the example of FIG. 1, the entire metal plate is a first layer made of a single metal. A metal plate made of the second metal is laminated by surface activation bonding to form a laminated body made of the first layer 1 and the second layer 2.
Here, the thickness of the 2nd layer 2 as a raw material before surface activation joining is 5 micrometers-50 micrometers. Moreover, although there is no limitation in the thickness of the metal plate used as a 1st layer, in this example, the thickness of the 1st layer 1 as a raw material is 1 mm-5 mm.

The first metal and the second metal may be different types of metals, but it is preferable that the color, texture, luster, etc. of the metals are clearly different from each other so that they can be recognized as a pattern. . Further, in the present invention, not only a pattern of two types of metal but also a pattern of three or more types of metals can be formed by increasing the number of layers as will be described later.
There are many characteristic metal materials (including alloys) used in such a combination, and the material is not limited, but typical materials are silver white, Ag, Ni, Cu-Ni. Cu, Cu-Zn, Au, etc. are illustrated as a thing of a brass color.
An appropriate combination of materials that can form the pattern may be selected from these metal materials. For example, in the case of a two-color pattern, [Ag (silver color) and Cu (copper color)], [Ni (silver white) and Cu—Zn (brass color)] and the like can be mentioned.
If the pattern is a three-color pattern, [Ag (silver), Cu (copper), Cu-Zn (brass)), [Au (gold), Ag (silver), Cu (copper))], [Cu (Copper color), Ni (silver white), Cu-Zn (brass color)] and the like.

  In the case of forming a laminate of three or more layers, it is not always necessary to use different materials for all layers, and the same material may be used for layers that are not adjacent to each other.

Each metal plate used for laminating is subjected to glow discharge in an inert gas atmosphere, and each surface to be bonded is activated by sputter etching. Are preferably formed by rolling from the viewpoint of laminating and laminating and joining so as to face each other.
When the first layer is a single-layer metal substrate as shown in FIG. 1, the thickness of the metal substrate is preferably 0.5 mm or more, particularly 1.0 mm or more at the stage of the material before surface activation bonding. Dimensions. The upper limit of the thickness of the metal plate (material) that is the first layer is not particularly limited, but if the first layer is a single-layer metal substrate, monetary items (money, coins, medals, badges, medals, etc.) If manufactured, the thickness of the first layer is preferably 1.0 mm to 5.0 mm, particularly 1.5 mm to 3.0 mm in the raw material stage.
The first layer may have a multilayer structure including a surface layer related to the pattern and a lower layer not related to the pattern.

  The thicknesses of the second layer and the metal plate laminated thereon in the case of further multicolor are 5 μm to 50 μm, preferably 10 μm to 35 μm, respectively, at the stage of the material before surface activation bonding.

The surface activated bonding is, for example, a bonding state between metal plates achieved by the following steps, or a bonding method having the steps.
(A) Two metal plates to be joined are introduced into a vacuum chamber, the inside of the chamber is set to an inert gas atmosphere of ¹ × 10 to ¹ × 10 ⁻¹ [Pa], and the two metal plates are joined to each other. A step of activating each of the surfaces to be joined by applying an alternating voltage to the surfaces and performing glow discharge and performing a sputter etching process. As the inert gas, argon gas is preferably used.
(Ii) After the step of activating, a step of performing cold rolling joining by superimposing surfaces to be joined of both metal plates. Preferred conditions for cold rolling joining are a temperature of 0 to 300 ° C. and a rolling rate of 0.1 to 30%. Cold rolling joining is preferably performed in the vacuum chamber.
The temperature at the time of rolling joining is desirably 300 ° C. or less so that an alloy is not formed at the joining interface. If it is less than 0 ° C., it is not preferable because a new cooling facility is required and the production cost becomes high.
The surface activation bonding technique itself is a technique known in the technical field such as an electrode of a semiconductor element, for example, and is described in detail in, for example, JP-A-1-224184.

The bonding interface achieved by surface activated bonding is a unique surface activated bonding interface that is flat, free of oxide residue, no formation of an alloy layer, and sufficiently large bonding strength. This is a unique state of surface activated bonding, in which both layers are bonded.
On the other hand, when the same metal plate is joined by, for example, simple cold rolling, the joining interface becomes a rough surface. Further, an alloy layer is formed by joining by a combination of cold rolling and heat treatment, or joining by hot rolling.
“Surface activation-bonded interface is flat” means that the surface of the material is substantially the same as the surface before bonding. When two metal plates are superposed and only cold rolling is applied, if the degree of rolling is large, the joint interface generally changes roughly. On the other hand, in the surface activated bonding, the bonding interface is maintained as flat as the surface roughness of the original plate surface while exhibiting extremely strong bonding strength.
As a method of testing the roughness of the bonding interface achieved by surface activated bonding, after joining two metals, one metal is melted and removed so that the bonding interface is exposed, and the remaining metal of the other metal is removed. The method of measuring the surface with a stylus type surface roughness meter is mentioned.
As a method for inspecting whether there is an oxide residue at the bonding interface, after joining two metals, one metal is removed by chemical etching to the vicinity of the bonding interface (however, the metal is completely removed). The surface of the remaining thin metal is etched with argon using a Glow Discharge Spectrometer (abbreviated as GDS) with argon. There is a method of analysis. From the vicinity of the bonding interface achieved by the surface activated bonding, oxygen due to the oxide is hardly detected.
In addition, when the above-mentioned GDS measurement is performed, the form of elemental analysis corresponding to the alloy is not observed at the bonding interface, so that no alloy is formed at the bonding interface achieved by surface activated bonding. Prove.
The bond strength at the bonding interface achieved by surface activated bonding can be known by bonding two metals, performing a peel test in which they are pulled apart in a 180 ° opposite direction by a tensile tester, and measuring the peel strength. it can. The bonding interface by surface activated bonding has a peel strength of about 1 kg (ie, 1 [kg / cm]) per 1 cm sample width.

The graph of FIG. 7 shows the relationship between the etching removal amount and peel strength in the surface activated bonding process when steel and Al are bonded by surface activation bonding, and the etching removal amount and the bonding interface on the Al side. The relationship with the amount of the elements (Al, O, C) present in FIG. The horizontal axis represents the amount (removal depth [nm]) of the surface of the Al layer removed by etching during surface activation bonding. The vertical axis on the left side shows the abundance ratio [%] of elements when elemental analysis is performed on the interface of each joined sample by GDS. The vertical axis on the right side shows the peel strength [N / 0.01 m] per 1 cm sample width.
As can be seen from the graph, the more the surface layer is removed in the surface activated bonding process (that is, the longer the etching time during bonding), the higher the peel strength (bonding strength), and the bonding interface. In this case, the oxygen element and the carbon element are hardly detected, and the surface is made of only the aluminum element.

In the etching step, for example, as shown in FIG. 1B, the upper surface of the second layer other than the region 2a is covered with a resist pattern so that the region 2a corresponding to the pattern to be formed can be removed (not shown). ) Etching is performed to remove the region 2a, and the upper surface 1S of the first layer is exposed at the bottom of the formed opening. The pattern is determined by the shape of the region 2a to be etched and the arrangement pattern of the region. The resist pattern may be removed by an appropriate process.
The etching solution erodes the exposed lower layer (the layer that should not be etched) if the material of each layer, such as the first layer and the second layer, has a different etching property. Can be suppressed, which is preferable.

As a resist material used for etching, a patterning technique thereof, and a removing method thereof, a technique included in a known etching method may be used. For example, a resist is applied, exposed and developed, and then patterned by a spray method. For example, the resist can be removed by dipping or spraying using an alkaline solution.
As the etching method, a preferable method may be appropriately selected according to the type of metal material and the pattern forming ability. For example, in the case of a two-layer laminate of a Cu layer (first layer) and an Ag layer (second layer), only the Cu layer can be obtained by allowing a ferric chloride aqueous solution to act on the Cu layer by dipping or spraying. It is possible to form a fine pattern by etching.

In the surface pressing step, the surface pressing process is performed so that the upper surface 2S of the second layer and the upper surface 1S of the first layer exposed by the removal of the region 2a are substantially one plate surface having no step. (Processing for pressing and pressing an arbitrary curved surface mold including a flat mold or a relief mold) is performed to obtain a metal plate having a dissimilar metal arrangement pattern on the plate surface. As shown in FIG. 1C, the upper surface 1S of the first layer exposed in the opening by the surface pressing process becomes a raised surface and constitutes one plate surface together with the upper surface 2S of the second layer. To do.
“One plate surface” is a flat surface or curved surface according to the shape of the product. Even if there is a step surface or relief unevenness formed intentionally by the surface pressing itself, the uneven surface is one It is the surface which comprises a board surface. That is, it is important that the different metal surfaces adjacent to each other to form the pattern form the uneven surface of the product in a state where there is substantially no step due to the different layers.
The phrase “substantially no step” may be a state where no step is recognized visually or by touch with a fingertip (except for a step intentionally formed by surface pressing). More specifically, it is preferable that dissimilar metal surfaces adjacent to each other to form a pattern fall within a step of 2 μm or less, particularly, a step of 1 μm or less. In particular, it is a preferable aspect that the level difference is so small that it cannot be detected even by the surface shape measuring device (in terms of measurement, the level difference is zero).

FIG. 3A is a perspective view schematically showing a state after etching when a two-color checkered pattern is formed by the first layer 1 and the second layer 2. By subjecting this laminate to surface pressing, the exposed upper surface 1S of the first layer 1 rises (or the second layer 2 sinks), and the whole becomes one plate surface. As shown in 3 (b), a dissimilar metal arrangement pattern such as parquet is completed. At this time, since the second layer 2 is thin, a delicate and beautiful checkered pattern in which the flow of meat is small and the straight lines of the lattice are maintained without being disturbed is obtained.
According to the present invention, for example, if it is a checkered pattern, a fine pattern in which one side of the square of the minimum structural unit reaches 30 μm to 50 μm is formed without feeling the disorder of the pattern while being a rolled metal. Is possible.

In the case of a product that does not form an uneven relief on the plate surface and is a flat plate surface, the surface pressing process may be a simple pressing process that simply presses a flat die.
The second layer, and the layer laminated on it for further multicolor patterns, are joined by surface-activated bonding and surface pressing even in the state of a metal plate (foil) at the material stage Even in the state, the average thickness of the main portion does not substantially change and remains 5 μm to 50 μm. However, the thickness of the part where the outer peripheral edge is deformed or the part which is thinly extended locally by the steep unevenness of the relief is excluded.

  In surface activated joining, since joining is possible even by rolling with a small compressive force, the change in the metal structure before and after rolling is small. Therefore, an annealing process before the surface pressing process is not necessary, or annealing can be performed at a low temperature for a short time.

The metal plate having the pattern obtained by the above production method on at least one surface is the metal plate of (1) according to the present invention.
As shown in FIG. 1 (c), the cross-sectional structure is very similar to the structure of the metal plate of FIG. 8 (d) obtained by the prior art, but the metal plates according to the present invention are formed separately from each other. It is formed by laminating plates, the thickness of the second layer (and the layer added as necessary) is a specific value (5 μm to 50 μm), and the interface between each layer is the surface The structure is different from the conventional one in that it is a bonding interface achieved by activated bonding.
With such a structure, the surface layer follows the unevenness of the relief while maintaining a close contact state with the lower layer even if forging for processing the unevenness relief is added while having a thin rolled metal foil on the surface layer. Therefore, the pattern is hard to break.

  In the case of forming a pattern on the back surface of the metal plate, the back surface of the first substrate is regarded as the top surface of the first layer. Further, a layer thereon may be sequentially laminated by surface activation bonding, and a pattern may be formed through an etching process and a surface pressing process.

In the production method of the present invention, it is also possible to form a multicolor pattern by laminating one or more layers on the upper surface of the second layer by surface activation bonding.
For example, when forming a pattern of three colors, as shown in FIG. 2A, in the stacking step, the third layer 3 is further stacked on the upper surface of the second layer 2 by surface activation bonding. The thickness of the third layer after the lamination is preferably 5 μm to 50 μm like the second layer.
The number of layers may be increased according to the number of colors. However, if the number of layers is too large, a step from the uppermost surface to the upper surface of the first layer becomes large, so that flattening becomes difficult and the pattern is disturbed. From these points, the appropriate number of layers is about 2 to 4.

  In the etching process in the case of forming a multicolor pattern, as shown in FIG. 2B, etching is performed from the upper surface 3S of the uppermost layer (third layer) 3, and the region corresponding to the intended pattern is removed. The upper surface 2S of the next layer (second layer) 2 immediately below is exposed in the region. A part of the exposed second layer upper surface 2S (region corresponding to the intended pattern) is removed by etching, and the upper surface 1S of the layer (first layer) 1 immediately below is exposed in the region. When the number of layers is further increased, this processing is sequentially repeated and dug down, and the upper surface of the layer from the uppermost layer (the third layer in the figure) to the first layer is exposed stepwise (stepwise) in the first region.

In the surface pressing step when forming a multicolor pattern, as shown in FIG. 2C, the upper surface 3S of the uppermost layer (third layer) 3 and the upper surfaces of all the layers exposed in the first region. Surface pressing is performed so that 2S and 1S become one plate surface having substantially no step to obtain a dissimilar metal arrangement pattern.
FIG. 4A is a perspective view schematically showing a state after etching when a three-color checkered pattern is formed by the first layer 1, the second layer 2, and the third layer 3. As in the case of FIG. 3 (a), the laminated body is subjected to a surface pressing process so as to have a single plate surface without a step, and as shown in FIG. A delicate and beautiful dissimilar metal arrangement pattern like work is completed. In FIG. 4, reference numeral 1S is attached to the upper surface of the first layer to make it easy to understand the change of the surface before and after the surface pressing process.

In the present invention, in addition to the formation of the dissimilar metal arrangement pattern on the plate surface, an uneven relief can be forged on the same plate surface.
When trying to make a different metal arrangement pattern and an uneven relief simultaneously exist on one plate surface, particularly in the same region of the plate surface (that is, when trying to give a different metal arrangement pattern to the uneven surface of a relief), The utility of the present invention is most noticeable. Because, as described in the explanation of the background art, conventionally, if the surface layer is thinned, the surface layer is torn during forging of the uneven relief, and if the surface layer is thickened, the pattern is disturbed by the flow of meat during the forging of the uneven relief, This is because the dissimilar metal arrangement pattern and the concave / convex relief with no damage to the surface layer and pattern disturbance could not be simultaneously present on one plate surface.

Examples of the processing method for causing the dissimilar metal arrangement pattern and the concavo-convex relief to simultaneously exist on one plate surface include the following.
(I) A method of forging a metal plate with a pattern that has already been subjected to surface pressing and has been completed as one plate surface having substantially no level difference by pressing a concave-convex relief mold on the plate surface.
(II) In the surface pressing step, a concave / convex relief mold is used as a mold used for the surface pressing process, and the surface pressing process is simultaneously performed while forging the concave / convex relief.
(III) An intermediate method between the above (I) and (II), which is first flattened to a certain level by a first-stage surface pressing process, and then is subjected to an uneven relief process by an uneven relief process. A method of simultaneously applying surface pressing in the finishing stage while forging the steel.

The pattern formed on the plate surface may be a pattern that can be expressed by two or more different metals. Not only the geometric pattern exemplified above, but also an irregular pattern, painting, character, symbol, mark, or these A combination of these is exemplified.
The uneven relief formed on the plate surface may be arbitrarily designed.
On the plate surface, the pattern and the uneven relief may overlap the same region or may be in different regions. FIG. 5A shows an example in which the pattern and the uneven relief coexist in the same region. As shown in FIG. 5A, a dissimilar metal arrangement pattern having a checkered pattern is formed on the entire surface of one surface, and as shown in FIG. , R2 is forged, and the second layer 2 forms a pattern along the uneven surface of the relief.
The pattern and the concavo-convex relief may be irrelevant to each other in terms of the contents of the pattern as shown in FIG. 5A (the checkerboard pattern and the circular relief are simply overlapped in position, (For example, the pattern is formed as an uneven relief on a silver background of a nickel alloy and only the pattern is a red color of the copper alloy and is color-coded with the surroundings). You may do it.

In the present invention, in addition to the formation of the dissimilar metal arrangement pattern on the plate surface, by drawing the metal plate, a vessel having an arbitrary shape can be formed as shown in FIG.
There is no limitation on the design of the dissimilar metal arrangement pattern. Further, the dissimilar metal arrangement pattern may be on the inner side (concave surface) of the vessel as shown in FIG. 6A or on the outer side (convex surface) as shown in FIG. 6B. In the example of the figure, the main body of the vessel is the first layer 1, and the hatched portion is the thin second layer 2.
Furthermore, you may form arbitrary uneven | corrugated patterns in the part of a dissimilar metal arrangement | positioning pattern, etc.
There is no limitation on the type and size of the vessel, and a vessel with any curvature, such as a cup, a small plate, a large plate, a bowl, a small bowl, a large bowl, a bowl, etc.

The metal plate according to the present invention may be a product for any use, such as money, medals, ornaments (including decorative parts of tableware and furniture), relief plates, bowls, tableware, plates, cups, and further processed shapes. It may be a container and various members.
Among these products, monetary items (money, coins, medals, badges, medals, brooches processed by these, tie pins, etc.) are fine and non-damaged dissimilar metal arrangement patterns and uneven reliefs achieved by the present invention. Can be provided at the same time, which increases artistic value and is preferable as an article for manufacturing purposes.
In addition, in the case of money, not only is the value in terms of art increased, but the improvement in distinctiveness that is required only for money, such as the following (a) to (c), maintains mass productivity. But I can expect it.
(A) The discriminability by visual inspection or measuring instrument increases.
(B) Since a surface activated bonding technique is required, mass production is impossible but it cannot be easily manufactured, and discrimination is further enhanced.
(C) If a special alloy is used as the surface layer, it may be impossible to reproduce by plating.

  According to the present invention, it is possible to form a metal plate having a dissimilar metal arrangement pattern which can form a more free and fine dissimilar metal arrangement pattern, and is difficult to be deformed or damaged even when an uneven relief is formed. It became possible.

It is the schematic diagram which showed the processing state in each process of the manufacturing method by this invention. It is the schematic diagram which showed the processing state in each process in the case of forming a multicolor pattern in this invention. In the present invention, a perspective view schematically showing a state after etching (FIG. 3A) and a state after surface pressing (FIG. 3B) when a two-color checkered pattern is formed as the dissimilar metal arrangement pattern. FIG. In the present invention, a perspective view schematically showing a state after etching (FIG. 4A) and a state after surface pressing (FIG. 4B) when a three-color checkered pattern is formed as the dissimilar metal arrangement pattern. FIG. It is the schematic diagram which showed one embodiment of the metal plate by this invention, Comprising: It is the figure which showed the example in case a pattern and an uneven | corrugated relief coexist in the same area | region. FIG. 5A shows a plate surface of the experimental trial coin, and FIG. 5B shows an XX cross section of FIG. It is sectional drawing which showed typically the aspect which gave further the drawing processing to the metal plate by this invention, and was set as the vessel. In the case of joining steel and Al by surface activation bonding, the relationship between the etching removal amount and peel strength in the surface activation bonding process, and the elements present at the bonding interface on the side of the etching removal amount and Al (Al, It is a graph which shows the relationship with the quantity of O and C). It is sectional drawing which shows typically the internal structure of the conventional dissimilar metal arrangement pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st layer 1S Upper surface of 1st layer 2 2nd layer 2S Upper surface of 2nd layer 2a Area | region according to the pattern which should be formed among the upper surfaces of 2nd layer

Claims (14)

At least a second layer made of the second metal is bonded to a part of the upper surface of the first layer made of the first metal,
The second layer is a layer in which a metal plate formed in a separate process from the first layer is laminated on the upper surface of the first layer by surface activation bonding and subjected to surface pressing, The layer thickness is 5 μm to 50 μm, and the bonding interface between the first layer and the second layer is a bonding interface achieved by surface activated bonding,
The upper surface of the first layer and the upper surface of the second layer are one plate surface that has been subjected to a surface pressing process and has substantially no level difference, whereby the upper surface of the first layer is included in the plate surface. A metal plate having a dissimilar metal arrangement pattern on a plate surface, wherein different metal arrangement patterns comprising different metal surfaces including the upper surface of the second layer are formed. One or more layers are further laminated by surface activated bonding on the upper surface of the second layer, and surface pressing is performed,
Each layer is bonded to a region of the upper surface of the layer immediately below itself, thereby exposing at least a portion of the upper surface of all layers,
The upper surfaces of all the exposed layers are subjected to a surface pressing process to form a single plate surface that is substantially free of a step, whereby all the exposed surfaces are exposed to the plate surface. 2. The metal plate having a dissimilar metal arrangement pattern on a plate surface according to claim 1, wherein the dissimilar metal arrangement pattern is formed of different metal surfaces including the upper surface of the layer.   The metal plate which has the dissimilar metal arrangement | positioning pattern of Claim 1 or 2 on the said plate surface, and the uneven | corrugated relief is further formed by the forge process.   The metal plate having a dissimilar metal arrangement pattern on a plate surface according to claim 3, wherein the forging process of the uneven relief also serves as the surface pressing process.   The metal plate which has a different metal arrangement | positioning pattern in the plate | board surface of Claim 3 or 4 with which the said different metal arrangement | positioning pattern exists in the surface of an uneven | corrugated relief.   The metal plate which has a different metal arrangement pattern in any one of Claims 3-5 in which the metal plate which has the said different metal arrangement pattern in a plate surface is a money-like thing which has an uneven | corrugated relief on a plate surface.   The metal plate having the dissimilar metal arrangement pattern on the plate surface is further drawn, and the whole form is a container having the dissimilar metal arrangement pattern inside or outside. Metal plate having a metal arrangement pattern on the plate surface. A laminating step of laminating a metal plate having a thickness of 5 μm to 50 μm made of a second metal by surface activated bonding on a metal plate having at least a first layer made of the first metal as a surface layer; ,
Etching from the upper surface of the second layer, removing the region corresponding to the intended pattern of the second layer, and exposing the upper surface of the first layer in the region;
After the etching step, surface pressing is performed so that the upper surface of the second layer and the upper surface of the first layer exposed in the region become one plate surface having substantially no step, thereby Forming a dissimilar metal arrangement pattern constituted by different metal surfaces including the upper surface of the first layer and the upper surface of the second layer on the plate surface,
A method for producing a metal plate having at least a dissimilar metal arrangement pattern on a plate surface, comprising: In the laminating step, one or more layers are further laminated on the upper surface of the second layer by surface activated bonding,
In the etching step, etching is performed from the upper surface of the uppermost layer, the region corresponding to the intended pattern of the uppermost layer is removed, the upper surface of the next lower layer is exposed in the region, and the upper layer of the exposed next layer is exposed. The region corresponding to the intended pattern is removed by etching, and the process of exposing the upper surface of the next lower layer in the region is repeated sequentially, and a part of the upper surface of the layer from the uppermost layer to the first layer is stepwise. To expose
In the surface pressing step, the top surface of all the layers exposed in stages is subjected to a surface pressing process so as to become a single plate surface having substantially no step, whereby the plate surface is subjected to the first layer from the top layer. It forms a dissimilar metal arrangement pattern constituted by a metal surface including the upper surface of the layer up to,
The manufacturing method of Claim 8.   The manufacturing method of Claim 8 or 9 which presses an uneven | corrugated relief type | mold with respect to the said plate | board surface after the said surface pressing process, and forges an uneven | corrugated relief.   The manufacturing method according to claim 8 or 9, wherein in the surface pressing step, an uneven relief mold is used as a die used for the surface pressing process, and the surface pressing process is performed while forging the uneven relief.   The manufacturing method of Claim 10 or 11 which forges an uneven | corrugated relief to the area | region where the said different metal arrangement | positioning pattern exists, and thereby makes a different metal arrangement | positioning pattern exist on the surface of an uneven | corrugated relief.   The manufacturing method according to any one of claims 10 to 12, wherein the metal plate having the dissimilar metal arrangement pattern on the plate surface is a money-like product having an uneven relief on the plate surface.   The manufacturing method according to claim 8 or 9, wherein the metal plate having the dissimilar metal arrangement pattern on the plate surface is further drawn to form a vessel having the dissimilar metal arrangement pattern inside or outside.

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